Electronic device and control method thereof

Abstract

This application provides an electronic device and its control method. The electronic device includes an antenna assembly, a frame, and a motherboard. The antenna assembly includes a first radiator, a first feed source, and a sensing chip. The first radiator is disposed inside the frame and at least partially opposite to the motherboard. The first radiator has a first feed point. The first feed source is electrically connected to the first feed point and is used to excite the first radiator to transmit and receive at least one of the following frequency bands: LB band, MHB band, UHB band, Wi-Fi band, and GNSS band. The sensing chip is electrically connected to the first radiator and is used to receive at least the sensing signal generated by the first radiator when a subject under test approaches, and to determine whether the subject under test is approaching or moving away from the first radiator based on the sensing signal. The electronic device provided by this application can improve the detection accuracy of whether a subject under test is approaching or moving away from the electronic device and promote the miniaturization of electronic devices.

Description

Technical Field

[0001] This application relates to the field of communication technology, specifically to an electronic device and a control method for the electronic device. Background Technology

[0002] With the development of mobile communication technology and the widespread use of mobile terminals and other electronic devices, the distance between the mobile terminal and the human body (the subject being tested) plays a crucial role in regulating the working state of the electronic device. As electronic devices become increasingly miniaturized, improving the accuracy of detecting whether the subject is close to or far from the electronic device while simultaneously promoting further miniaturization has become a key technical challenge. Summary of the Invention

[0003] This application provides an electronic device and a control method for the electronic device that improves the detection accuracy of whether the subject under test is close to or far from the electronic device and promotes the miniaturization of the electronic device.

[0004] In a first aspect, this application provides an electronic device, including a frame, a motherboard, and an antenna assembly, wherein the antenna assembly:

[0005] A first radiator is disposed inside the frame and at least partially opposite to the motherboard, and the first radiator has a first power feeding point.

[0006] A first feed source, electrically connected to the first feed point, is used to excite the first radiator to transmit and receive at least one of the following frequency bands: LB band, MHB band, UHB band, Wi-Fi band, and GNSS band; and

[0007] A sensing chip is electrically connected to the first radiator. The sensing chip is used to receive at least the sensing signal generated by the first radiator when the subject under test approaches, and to determine whether the subject under test is approaching or moving away from the first radiator based on the sensing signal.

[0008] The electronic device provided in this application, by placing a first radiator in the antenna assembly inside the frame of the electronic device, not only transmits and receives at least one of the LB band, MHB band, UHB band, Wi-Fi band, and GNSS band under the excitation of a first feed source, but also, by electrically connecting the first radiator to the sensing chip, makes the first radiator also a sensing conductor for sensing whether the subject under test is approaching, thus realizing the multi-purpose function of the first radiator, increasing the functionality of the antenna assembly while reducing its size. Since the first radiator is placed inside the frame of the electronic device and is at least partially opposite to the motherboard of the electronic device, and since there is a large amount of space inside the frame, it is not limited by the shape of the frame. Thus, the shape and structure of the first radiator can be flexibly set to expand its sensing area for sensing whether the subject under test is approaching, thereby increasing the sensing distance of the antenna assembly for sensing whether the subject under test is approaching, improving the detection accuracy of whether the subject under test is near or far from the electronic device, and promoting the miniaturization of the electronic device.

[0009] Secondly, this application provides a control method for an electronic device, the method being applied to the electronic device, the method comprising:

[0010] Receives sensing signals from the sensing chip;

[0011] The control method provided in this application determines whether the subject under test is close to the electronic device based on the sensing signal, and reduces the radiated power of the antenna assembly by at least a portion when the subject under test approaches the electronic device. This method receives a sensing signal from a sensing chip, determines whether the subject under test is close to the electronic device based on the sensing signal, and reduces the radiated power of the antenna assembly by at least a portion when the subject under test approaches the electronic device, thereby reducing the radiated power of the electronic device when the subject under test is close to it, and intelligently reducing the specific absorption rate of the subject under test to electromagnetic wave signals. Attached Figure Description

[0012] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0014] Figure 2 yes Figure 1 The provided structural breakdown diagram of the electronic device;

[0015] Figure 3yes Figure 2 A partially enlarged schematic diagram of the provided electronic device;

[0016] Figure 4 This is a schematic diagram of the structure of the first antenna assembly provided in the embodiments of this application;

[0017] Figure 5 This is a detailed structural schematic diagram of the first antenna assembly provided in the embodiments of this application;

[0018] Figure 6 yes Figure 5 A schematic diagram of the feeding path for the first type of antenna assembly provided;

[0019] Figure 7 This is a schematic diagram of the structure of the first type of first radiator provided in the embodiments of this application;

[0020] Figure 8 This is a schematic diagram of the structure of the second type of first radiator provided in the embodiments of this application;

[0021] Figure 9 This is a schematic diagram of the structure of the first matching circuit in the antenna assembly provided in the embodiments of this application, which includes a second isolation device;

[0022] Figure 10 yes Figure 5 A schematic diagram of the sensing signal detection path of the first type of antenna assembly provided;

[0023] Figure 11 This is a schematic diagram of the electrical connection method of the first conductive detection element in the second type of antenna assembly provided in this application embodiment;

[0024] Figure 12 This is a schematic diagram of the electrical connection method of the second type of first conductive detection element in the second type of antenna assembly provided in the embodiments of this application;

[0025] Figure 13 This is a schematic diagram of the electrical connection method of the third first conductive detection element in the second antenna assembly provided in this application embodiment;

[0026] Figure 14 This is a schematic diagram of the electrical connection method of the fourth first conductive detection element in the second type of antenna assembly provided in this application embodiment;

[0027] Figure 15 This is a schematic diagram of the structure of the first conductive detection device provided in the embodiments of this application;

[0028] Figure 16 This is a schematic diagram of the structure of the second type of first conductive detection device provided in the embodiments of this application;

[0029] Figure 17 This is a schematic diagram of the structure of the third type of first conductive detection device provided in the embodiments of this application;

[0030] Figure 18 This is a schematic diagram of the electrical connection method between the first radiator, the second radiator, and the sensing chip in the third type of antenna assembly provided in this application embodiment;

[0031] Figure 19 This is a schematic diagram of the electrical connection method between the second first radiator, the second radiator, and the sensing chip in the third type of antenna assembly provided in this application embodiment;

[0032] Figure 20 This is a schematic diagram of the electrical connection method between the third first radiator, the second radiator, and the sensing chip in the third antenna assembly provided in this application embodiment;

[0033] Figure 21 This is a schematic diagram of the structure of the third type of antenna assembly provided in this application, in which both the first radiator and the second radiator are electrically connected to the first feed source;

[0034] Figure 22 yes Figure 20 A schematic diagram of the structure in the third type of antenna assembly provided, in which the first radiator is also electrically connected to the fifth isolation device;

[0035] Figure 23 This is a schematic diagram of the structure of the first radiator, the second conductive detection element, the first electrical connection method between the second radiator and the sensing chip in the fourth antenna assembly provided in this application embodiment;

[0036] Figure 24 This is a schematic diagram of the structure of the first radiator, the second conductive detection element, and the second electrical connection method between the second radiator and the sensing chip in the fourth antenna assembly provided in this application embodiment;

[0037] Figure 25 This is a schematic diagram of the structure of the first type of second conductive detection element in the fourth type of antenna assembly provided in this application embodiment;

[0038] Figure 26 This is a schematic diagram of the structure of the second type of second conductive detection element in the fourth type of antenna assembly provided in this application embodiment;

[0039] Figure 27 This is a schematic diagram of the structure of the third type of second conductive detection element in the fourth type of antenna assembly provided in this application embodiment;

[0040] Figure 28 yes Figure 27 A schematic diagram of the specific structure of the fourth type of antenna assembly is provided;

[0041] Figure 29yes Figure 28 A partial schematic diagram of the fourth type of antenna assembly provided;

[0042] Figure 30 This is a schematic diagram of the structure of the fifth antenna assembly provided in the embodiments of this application;

[0043] Figure 31 yes Figure 30 The equivalent circuit diagram of the fifth type of antenna assembly is provided;

[0044] Figure 32 yes Figure 31 The return loss curves of the first feed, the first radiator, and the third radiator in the fifth type of antenna assembly provided;

[0045] Figure 33 yes Figure 31 A schematic diagram of the first type of tuning circuit is provided;

[0046] Figure 34 yes Figure 31 A schematic diagram of the second type of tuning circuit is provided;

[0047] Figure 35 yes Figure 31 The return loss curves of the second feed and the second radiator in the fifth type of antenna assembly provided;

[0048] Figure 36 This is a flowchart of a first control method for an electronic device provided in an embodiment of this application;

[0049] Figure 37 This is a flowchart of a second control method for an electronic device provided in an embodiment of this application.

[0050] The attached icons are numbered as follows:

[0051] Electronic device - 1000; Antenna assembly - 100; Display screen - 200; Housing - 300; Frame - 310; Back cover - 320; Support plate - 330; Mid-frame - 340; Circuit board - 500; Battery - 600; Main board - 510; Main board bracket - 520; First radiator - 10; First feed - 20; Sensor chip - 30; First feed point - A1; Second isolation device - 41; First isolation device - 42; First matching circuit - M1; First conductive detection device - 51; First conductive trace - 511; First conductive sheet - 512; Second radiator - 60; Second feed point - A2; Second feed - 80; Fourth isolation device - 43; Third isolation device - 44; Second matching circuit Path-M2; Fifth Isolation Device-45; Second Conductive Detector-52; Second Conductive Trace-521; Second Conductive Sheet-522; First Segment-511a; Second Segment-511b; Third Segment-511c; Fourth Segment-511d; Fifth Segment-511e; Third Radiator-70; Third Feed Point-A3; First Sub-Radiator-71; Second Sub-Radiator-72; Coupling Gap-73; First Ground Terminal-711; Third Feed Point-A3; First Coupling Terminal-712; Second Coupling Terminal-721; Second Ground Terminal-722; Third Matching Circuit-M3; Tuning Circuit-T1; Switching Circuit-731; Tuning Branch-732; Adjustable Capacitor-733; Reference Ground-GND. Detailed Implementation

[0052] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. In addition, the reference to "embodiment" or "implementation method" in this application means that a specific feature, structure or characteristic described in connection with the embodiment or implementation method can be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0053] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the structure of an electronic device 1000 provided in an embodiment of this application. The electronic device 1000 includes an antenna assembly. The antenna assembly is used to transmit and receive radio frequency signals, wherein the radio frequency signals are transmitted as electromagnetic wave signals in the air medium to realize the communication function of the electronic device 1000. This application does not specifically limit the position of the antenna assembly on the electronic device 1000. Figure 1This is just one example. The electronic device 1000 also includes a display screen 200 and a housing 300 that are interconnected. The antenna assembly may be located inside the housing 300 of the electronic device 1000, partially integrated with the housing 300, or partially located outside the housing 300. Figure 1 The radiator of the antenna assembly described herein is integrated with the housing 300.

[0054] The electronic device 1000 includes, but is not limited to, devices capable of transmitting and receiving electromagnetic wave signals such as mobile phones, telephones, tablet computers, personal computers, laptops, in-vehicle devices, smart headsets, smartwatches, smart wearable devices, vehicle radar, and customer premises equipment (CPE). In this application, a mobile phone is used as an example of the electronic device 1000; other devices can be referred to the specific descriptions in this application.

[0055] For ease of description, the electronic device 1000 is in the position of Figure 1 Using the perspective shown in the image as a reference, the width direction of the electronic device 1000 is defined as the X-axis direction, the length direction of the electronic device 1000 is defined as the Y-axis direction, and the thickness direction of the electronic device 1000 is defined as the Z-axis direction. The X-axis, Y-axis, and Z-axis directions are all perpendicular to each other. The direction indicated by the arrow is positive.

[0056] Please see Figure 2 The housing 300 includes a frame 310 and a back cover 320. A support plate 330 is formed within the frame 310 by injection molding, and the support plate 330 has multiple mounting slots for mounting various electronic components. The support plate 330 and the frame 310 together form the middle frame 340 of the electronic device 1000. After the display screen 200, the middle frame 340, and the back cover 320 are closed, receiving spaces are formed on both sides of the middle frame 340. One side (e.g., the rear side) of the frame 310 surrounds the periphery of the back cover 320, and the other side (e.g., the front side) of the frame 310 surrounds the periphery of the display screen 200. The electronic device 1000 also includes circuit boards 500 (including motherboards, sub-boards, flexible circuit boards, etc.), a battery 600, a camera module, a microphone, a receiver, a speaker, a face recognition module, a fingerprint recognition module, and other devices capable of realizing the basic functions of a mobile phone, which will not be described in detail in this embodiment. It is understood that the above description of the electronic device 1000 is only an illustration of one environment in which the antenna assembly is applied, and the specific structure of the electronic device 1000 should not be construed as a limitation on the antenna assembly provided in this application.

[0057] The specific structure of the antenna assembly provided in this application will be illustrated below with reference to the accompanying drawings. Of course, the antenna assembly provided in this application includes, but is not limited to, the following embodiments.

[0058] Please see Figure 3 The antenna assembly 100 is used in the electronic device 1000. The circuit board 500 of the electronic device 1000 includes a motherboard 510, on which the main circuit system constituting the electronic device 1000 is installed, including: a processor, cellular mobile radio frequency, Bluetooth, GPS and Wi-Fi chips, a memory chip, a power management chip, an audio and video processing chip, input and output interfaces, etc.

[0059] In this application, please refer to Figure 3 The portion of the support plate 330 used to support the motherboard 510 becomes the motherboard bracket 520, meaning the motherboard 510 is fixed to the motherboard bracket 520 by screws or other means. Both the motherboard 510 and the motherboard bracket 520 are located within the frame 310. The motherboard 510 is mounted on the motherboard bracket 520.

[0060] Please see Figure 4 , Figure 4 The first antenna assembly 100 provided in this application includes at least a first radiator 10, a first feed 20, and a sensing chip 30.

[0061] The first radiator 10 is disposed inside the frame 310 of the electronic device 1000, and at least a portion of the first radiator 10 is disposed opposite to the motherboard 510 of the electronic device 1000. Specifically, the relative arrangement of the at least portion of the first radiator 10 with the motherboard 510 of the electronic device 1000 is in the Z-axis direction (which is also the thickness direction of the electronic device 1000 or the motherboard 510). In other words, at least a portion of the first radiator 10 is disposed opposite to the bearing surface of the motherboard 510 used to support the device. Optionally, both the motherboard 510 and the first radiator 10 are disposed on the motherboard bracket 520. The motherboard bracket 520, the motherboard 510, and the first radiator 10 are arranged along the Z-axis direction (see reference...). Figure 2The components (in the Z-axis direction, which is also the thickness direction of the electronic device 1000) are stacked sequentially. The motherboard bracket 520 is part of the support plate 330 in the middle frame 340, and the motherboard 510 is fixed to the motherboard bracket 520 in the Z-axis direction. The first radiator 10 is at least partially disposed on the motherboard 510 in the Z-axis direction. The orthographic projection of the first radiator 10 in the Z-axis direction at least partially covers the motherboard 510. Optionally, a portion of the orthographic projection of the first radiator 10 in the Z-axis direction covers a portion of the motherboard 510, while another portion of the orthographic projection of the first radiator 10 in the Z-axis direction may be located outside the motherboard 510, for example, in the gap between the motherboard 510 and the frame 310. Of course, in other embodiments, the orthographic projection of the first radiator 10 in the Z-axis direction may be completely located within the area where the motherboard 510 is located.

[0062] The first radiator 10 has a first feed point A1, and the location and function of the first feed point A1 will be described later.

[0063] The first radiator 10 serves as the port for transmitting and receiving radio frequency signals in the antenna assembly 100, wherein the radio frequency signals are transmitted in the form of electromagnetic waves in the air medium. This application does not impose specific limitations on the shape of the first radiator 10. For example, the shape of the first radiator 10 may include, but is not limited to, strip-shaped, sheet-shaped, rod-shaped, coated, or thin-film shapes. Figure 3 The first radiator 10 shown is merely an example and does not limit the shape of the first radiator 10 provided in this application. Optionally, the antenna formed by the first radiator 10 is a support antenna. Support antennas include, but are not limited to, flexible circuit board antennas formed on flexible printed circuit boards (FPCs), laser direct forming antennas (LDS), printed direct forming antennas (PDS), conductive sheet antennas, etc.

[0064] Optionally, the first radiator 10 is made of a conductive material, including but not limited to metals such as copper, gold, and silver, or alloys formed by copper, gold, and silver, or alloys formed by copper, gold, and silver with other materials; graphene, or conductive materials formed by combining graphene with other materials; oxide conductive materials such as indium tin oxide; and mixed materials formed by carbon nanotubes and polymers, etc.

[0065] Optionally, the first radiator 10 is in the form of a sheet or a thin layer. The surface of the first radiator 10 is approximately parallel to the XY plane. This application does not limit the location of the first radiator 10 to the side of the motherboard 510 facing the display screen 200 or the side of the motherboard 510 facing the rear cover 320.

[0066] The first feed source 20 is electrically connected to the first feed point A1. The first feed source 20 includes, but is not limited to, an RF transceiver chip and an RF front-end circuit. The first feed source 20 is disposed on the motherboard 510 of the electronic device 1000. The electrical connection method between the first feed source 20 and the first feed point A1 includes, but is not limited to, direct soldering, or indirect electrical connection via coaxial cable, microstrip line, conductive spring, conductive adhesive, etc. In this embodiment, the first feed point A1 is electrically connected to the RF port of the first feed source 20 via a conductive component (e.g., a conductive spring).

[0067] The radio frequency (RF) signal emitted by the first feed source 20 is fed into the first radiator 10 through the first feed point A1. The RF signal can excite the first radiator 10 to generate a resonant current, forming a resonance to support the frequency band corresponding to the resonant current. Of course, the first feed source 20 can also receive RF signals through the first radiator 10 via the first feed point A1.

[0068] The first feed source 20 is used to excite the first radiator 10 to transmit and receive at least one of the following frequency bands: LB band, MHB band, UHB band, N41 band, N78 band, N79 band, Wi-Fi band, and GNSS band. The LB band refers to a frequency band below 1000MHz (excluding 1000MHz). The MHB band refers to a frequency band between 1000MHz and 3000MHz (including 1000MHz, excluding 3000MHz). The UHB band refers to a frequency band between 3000MHz and 10000MHz (including 3000MHz). The Wi-Fi band includes, but is not limited to, at least one of Wi-Fi 2.4G, Wi-Fi 5G, and Wi-Fi 6E. GNSS stands for Global Navigation Satellite System. It includes global systems such as the Global Positioning System (GPS), BeiDou, GLONASS, and Galileo, as well as regional navigation systems.

[0069] The sensing chip 30 is electrically connected to the first radiator 10. The sensing chip 30 is used to receive at least the sensing signal generated by the first radiator 10 when the subject under test approaches, and to determine whether the subject under test is approaching or moving away from the first radiator 10 based on the sensing signal. When the first radiator 10 approaches the housing of the electronic device 1000, the sensing chip 30 can determine whether the subject under test is approaching or moving away from the electronic device 1000.

[0070] The subject to be tested is a living organism, including but not limited to the head, hands, abdomen, legs, and other parts of the human body, or other living organisms.

[0071] The electronic device 1000 provided in this application, by placing the first radiator 10 in the antenna assembly 100 inside the frame 310 of the electronic device 1000, not only transmits and receives at least one of the LB band, MHB band, UHB band, N41 band, N78 band, N79 band, Wi-Fi band, and GNSS band under the excitation of the first feed 20, but also by electrically connecting the first radiator 10 to the sensing chip 30, so that the first radiator 10 also serves as a sensing conductor to sense whether the subject under test is close, realizes the multi-purpose function of the first radiator 10, thereby increasing the functionality of the antenna assembly 100 while also making the size of the antenna assembly 100 smaller. Since the first radiator 10 is located inside the frame 310 of the electronic device 100 and is at least partially opposite to the motherboard 510 of the electronic device 100, and since there is a large amount of space inside the frame 310, it is not limited by the shape of the frame 310. Thus, the shape and structure of the first radiator 10 can be flexibly set to expand its sensing area for sensing whether the subject under test is approaching, thereby increasing the sensing distance of the antenna assembly 100 for sensing whether the subject under test is approaching, improving the detection accuracy of whether the subject under test is close to or far from the electronic device 1000, and promoting the miniaturization of the electronic device 1000.

[0072] In one application scenario, compliance with specific absorption power (SAR) for human bodies in mobile phones is extremely important. SAR primarily measures the Specific Absorption Rate (SAR) at distances of 0mm, 5mm (or other distances depending on regulations) from the limbs. The SAR value at these distances must not exceed the limit. SAR refers to the ratio of electromagnetic wave energy absorbed by an electronic device, representing the electromagnetic power absorbed or consumed per unit mass of human tissue. Simultaneously, to ensure communication performance, the board-level power of the antenna assembly 100 cannot be constantly in a fallback state, as this would significantly degrade the phone's communication performance. Therefore, the sensing chip 30 is used to detect whether the phone is close to a limb. When close, it controls the board-level power of the antenna assembly 100 to fall back; when far from the limb, it does not fall back. Thus, the sensing chip 30 is particularly critical for detecting human proximity.

[0073] In this embodiment, the first radiator 10 can serve as a sensing element for the sensing chip 30 to detect the approach of a human body. The first radiator 10 and the sensing chip 30 together form a SAR sensor. The SAR sensor receives the sensing signal generated by the sensing element when a human body approaches, and determines the distance between the human body and the sensing element, or whether the human body is approaching or moving away from the sensing element, based on the magnitude of the sensing signal. This allows the controller to back off the antenna power within a preset distance range when the human body approaches the sensing element, thereby reducing the radiated energy of the antenna. Consequently, the electromagnetic wave energy absorption ratio when a human body approaches the electronic device 100 is reduced, thus meeting the SAR compliance requirements of the electronic device 1000.

[0074] Optionally, the detection principle of the SAR sensor is as follows: When a human body approaches the sensing element (e.g., the first radiator 10 in this embodiment), since the human body is equivalent to a capacitor connected to the ground, an induced capacitance is formed between the sensing element and the ground. This induced capacitance typically ranges from a few pF to tens of pF. Because the induced capacitance between the sensing element and the human body corresponds one-to-one with the distance between them, the sensing chip 30 detects the change in the induced capacitance between the sensing element and the human body to detect the distance between them, and further detects the distance between the human body and the electronic device 1000, thereby determining whether the human body is in contact with or near the electronic device 1000; or whether the human body is in a state of being close to the electronic device 1000.

[0075] Generally, in order to meet safety regulations, electronic devices 1000 need to back off their antenna transmission power within a certain distance range (a relatively short distance range) when a human body (important organs, such as the head) approaches electronic devices 1000, so as to intelligently reduce the radiation energy of electronic devices 1000. As a result, the absorption ratio of electromagnetic wave energy absorbed or consumed by human tissue is also reduced accordingly, that is, the SAR value is reduced.

[0076] The sensing chip 30 is used to detect changes in the induced capacitance formed between the first radiator 10 and the human body. The sensing chip 30 may be mounted on the motherboard 510.

[0077] Optionally, the sensing chip 30 is electrically connected to the controller (not shown) of the electronic device 1000. The memory (not shown) of the electronic device 1000 contains a mapping table between the sensing capacitance and the distance and facing area between the sensing element (first radiator 10) and the human body. The sensing chip 30 sends the detected sensing capacitance to the controller of the electronic device 1000 in the form of an electrical signal. The controller of the electronic device 1000 determines the change in distance between the human body and the electronic device 1000 based on the change in sensing capacitance, and performs a corresponding antenna power back-off when the human body approaches the electronic device 1000. This application does not specifically limit the preset distance range that the sensing element can detect, such as 5mm, 7mm, 8mm, 10mm, etc.

[0078] With increasing requirements for SAR compliance, the sensing distance required for the electronic device 1000 to detect human proximity in practical applications also increases. In technical solutions using a frame antenna as the sensing element for detecting human proximity, the length of the frame antenna cannot be arbitrarily extended because its design must match the supported frequency band. This limits the sensing area of ​​the frame antenna; for example, antennas supporting the UHB band are relatively short, resulting in a relatively small sensing area. A smaller frame antenna can only detect human proximity at a shorter distance, such as less than 5mm. If the required sensing distance for human proximity in practical applications is 7mm or more, the sensing element cannot detect capacitance changes or its detection is inaccurate above 5mm. This means that when a human is within 5mm to 7mm of the electronic device 1000, the device does not perform power back-off, preventing the electronic device 1000 from meeting the specific absorption rate (SAR) requirements. Furthermore, when a frame antenna is used as a sensor to detect the distance of a person approaching, the relatively complex structure of the frame antenna, such as the presence of grounding points and switching tuning circuits, makes it difficult to effectively support the desired frequency band while also serving as a sensor to detect the distance of a person approaching.

[0079] The electronic device 1000 provided in this application has a first radiator 10, which serves as the sensing element for detecting the proximity of a human body, located inside the frame 310 of the electronic device 1000 and at least partially opposite the mainboard 510 of the electronic device 1000. Since the mainboard 510 inside the frame 310 has ample space, the first radiator 10 does not need to rely on the frame 310 as a carrier and is not limited by the shape of the frame 310. For example, it can be supported by the mainboard 510 or the entire support plate 330. Thus, the shape and structure of the first radiator 10 can be flexibly configured to expand the sensing area of ​​the sensing element for detecting the proximity of a human body, thereby increasing the detection distance of the antenna assembly 100 for detecting the proximity of a human body. This ensures the compliance of the specific absorption rate index of the electronic device 100 while also ensuring communication performance. Furthermore, since the first radiator 10 is located inside the frame 310, it does not occupy space on the frame 310.

[0080] Optional, please refer to Figure 5 The antenna assembly 100 further includes a first isolation device 42 and a first matching circuit M1.

[0081] One end of the first isolation device 42 is electrically connected to the first feed point A1, and the other end of the first isolation device 42 is electrically connected to one end of the first matching circuit M1. The other end of the first matching circuit M1 is electrically connected to the first feed source 20. The first matching circuit M1 is used to tune the frequency band supported by the first radiator 10. The first matching circuit M1 includes, but is not limited to, capacitors, inductors, capacitor-inductor combinations, switching tuning devices, etc.

[0082] Please see Figure 6 The first isolation device 42 is used to open the circuit for the sensed signal.

[0083] Optionally, the first isolation device 42 is a device that blocks low frequencies or allows high frequencies to pass through DC, such as a capacitor. The first isolation device 42 is a capacitor, which is in a conducting state for relatively high-frequency AC signals (RF signals) and in an open-circuit state for DC signals and extremely low-frequency AC signals. Thus, the first isolation device 42 can block the flow of the induced signal through the first radiator 10 to the first matching circuit M1, or block the DC signal on the first matching circuit M1 from affecting the induced signal detected by the first radiator 10. Therefore, the first radiator 10 is in a floating state relative to the first matching circuit M1 when transmitting the induced signal.

[0084] This application does not impose a specific limit on the capacitance value of the first isolation device 42, such as 22pF, but is not limited to this value.

[0085] This application does not specifically limit the form of the first radiator 10, which may include, but is not limited to, a monopole antenna, a planar inverted-F antenna (PIFA antenna), etc.

[0086] In an embodiment of the first type of structure of the first radiator 10, please refer to... Figure 7 The first radiator 10 is a monopole antenna. The shape of the first radiator 10 includes, but is not limited to, the following: Figure 7 The first radiator 10 can be rhomboid in shape, but it can also be square, circular, etc. The first feed point A1 is located near one end of the first radiator 10, and the other ends of the first radiator 10 are free ends. A first isolation device 42 (DC blocking capacitor) is provided at the first feed point A1 so that the first radiator 10 is suspended relative to the first feed source 20, thereby preventing the induced signal on the first radiator 10 from being affected by the first feed source 20.

[0087] In this embodiment, the first radiator 10 is a monopole antenna, which only has a first feed point A1 electrically connected to the first feed source 20, and no grounding terminal electrically connected to the reference ground. Thus, only the first isolation device 42 needs to be set at the first feed point A1, and there is no need to set the first isolation device 42 in other locations, which simplifies the number and layout of the first antenna assembly 100.

[0088] In an embodiment of the second type of first radiator 10 structure, please refer to... Figure 8 The first radiator 10 is a planar inverted-F antenna. The shape of the first radiator 10 includes, but is not limited to, the following: Figure 8 The first radiator 10 can be square, circular, or other shapes, but it is not rhomboid in shape. The first feed point A1 is located near the end of the first radiator 10. The first radiator 10 also has a first grounding point (or grounding terminal) electrically connected to the reference ground. In this embodiment, a first isolation device 42 (DC blocking capacitor) is provided between the first feed point A1 of the first radiator 10 and the first matching circuit M1, and another first isolation device 42 (DC blocking capacitor) is provided between the first grounding point and the reference ground, so that the first radiator 10 is suspended relative to the first feed source 20 and the reference ground, thereby preventing the induced signal on the first radiator 10 from being affected by the signals on the first feed source 20 and the reference ground.

[0089] The above are merely two examples of the structure of the first radiator 10. To enable the first radiator 10 to function as a sensor for detecting the proximity of a human body, DC blocking capacitors (large capacitors, isolating DC or small AC) are placed on the feed path and ground return path. This prevents the first radiator 10 from directly returning to ground, making it appear to float relative to the first feed source 20 and the reference ground. An example value for the DC blocking capacitor is 22pF, but other values ​​are also possible. In the first embodiment of the first radiator 10 structure, the first radiator 10 is a monopole antenna, which itself has no ground return path; only a DC blocking capacitor needs to be added directly to the feed path.

[0090] When the first radiator 10 has a ground return path, for example, when the first radiator 10 is a planar inverted F antenna, by setting a DC blocking capacitor on the ground return path of the first radiator 10, the induced signal on the first radiator 10 will not return directly to the ground, but will be in a floating state relative to the reference ground.

[0091] Of course, the first radiator 10 can also be a T-shaped antenna, a loop antenna, etc. Referring to the above description, a first isolation device 42 (e.g., a DC blocking capacitor) is provided at the first feed point A1 of the first radiator 10, between the first radiator 10 and the reference ground, between the first radiator 10 and the tuning switch, and between the first radiator 10 and the matching circuit, so that the first radiator 10 is in a floating state relative to the first feed source 20, the reference ground, the tuning switch, the matching circuit, etc., so as to reduce the influence of signals in other circuits on the induced signal in the first radiator 10.

[0092] Further, please refer to Figure 9 The first matching circuit M1 is electrically connected between the first feed source 20 and the first feed point A1. When the device electrically connected to the first feed point A1 in the first matching circuit M1 is a capacitor, and the capacitance value of the capacitor can isolate the induced signal, the capacitor in the first matching circuit M1 can be used as a DC blocking capacitor. There is no need to set an additional DC blocking capacitor at the first feed point A1. In this way, by using the original capacitor in the first matching circuit M1 to reuse the first isolation device 42, there is no need to make many circuit improvements to the first antenna assembly 100 to realize the human body approach distance function of the first radiator 10, and the structure of the first antenna assembly 100 is also simplified.

[0093] The second isolation device 41 is electrically connected between the first radiator 10 and the sensing chip 30. Optionally, the second isolation device 41 can be electrically connected to any position on the first radiator 10.

[0094] When the subject under test approaches the first radiator 10, a coupling capacitance is formed between the first radiator 10 and the surface of the subject under test, causing a change in the surface charge of the first radiator 10 and generating an induced signal. This induced signal is a DC signal or a small AC signal. The induced signal includes, but is not limited to, a current signal, a voltage signal converted from a current signal, or an inductance signal converted from a current signal. Optionally, the sensing chip 30 includes, but is not limited to, a device for detecting current signals, voltage signals, or inductance signals, such as a miniature galvanometer, a miniature current transformer, etc.

[0095] Please see Figure 10 The second isolation device 41 is used to conduct the sensing signal generated by the first radiator 10 when the subject under test approaches, and to open the radio frequency signal of the first radiator 10.

[0096] Optionally, the second isolation device 41 is a device that blocks high frequencies but passes low frequencies or DC signals, such as an inductor. Since the induced signal is a DC signal or an extremely low-frequency AC signal, the radio frequency signal transmitted and received by the first radiator 10 is a relatively high-frequency AC signal relative to the induced signal. The second isolation device 41 is an inductor, which can conduct DC signals and extremely low-frequency AC signals, while remaining open for relatively high-frequency AC signals (radio frequency signals). Thus, the second isolation device 41 can block the flow of the radio frequency signal from the first radiator 10 to the sensing chip 30, thereby not affecting the detection result of the sensing chip 30 for the induced signal, and ensuring the detection of an accurate SAR value.

[0097] This application does not impose a specific limitation on the inductance value of the second isolation device 41, such as 82nH, but is not limited to this value.

[0098] This application establishes a second isolation device 41 and a first isolation device 42, making the circuit channel for detecting the sensing signal when the subject approaches and the circuit channel for transmitting and receiving radio frequency signals independent and non-interfering with each other. In one circuit channel, the first isolation device 42 causes the first radiator 10 to float relative to the first matching circuit M1 (and reference ground, etc.) when transmitting the sensing signal, and the sensing signal on the first radiator 10 flows to the sensing chip 30 via the second isolation device 41. In the other circuit channel, the second isolation device 41 keeps the first radiator 10 in an open-circuit state with the sensing chip 30 when transmitting the radio frequency signal. Thus, the radio frequency signal on the first radiator 10 is transmitted between the first matching circuit M1 (and reference ground, etc.), reducing the impact on the detection results of the sensing chip 30. This enables the first radiator 10 to simultaneously detect the sensing signal when the subject approaches and transmit and receive radio frequency signals.

[0099] Optionally, the first radiator 10, under the excitation of the first feed source 20 and the tuning of the first matching circuit M1, generates a first resonant mode to support the N79 frequency band. The resonant mode is characterized by the first radiator 10 exhibiting high electromagnetic wave transmission and reception efficiency at and near the resonant frequency under the excitation of the first feed source 20. The frequency band corresponding to and near the resonant frequency of the first resonant mode covers the N79 frequency band, thus enabling the first radiator 10 to support the N79 frequency band. The first resonant mode includes a 1 / 4 wavelength mode, a 1 / 2 wavelength mode, a 3 / 4 wavelength mode, or a 1x wavelength mode.

[0100] To illustrate this more clearly, the first resonant mode being a 1 / 4 wavelength mode can be understood as meaning that the length of the resonant current path (i.e., the effective electrical length) on the first radiator 10 is approximately 1 / 4 of the wavelength of the medium (the wavelength in the medium) corresponding to the center frequency of the resonant mode. This description is for ease of understanding of the terminology but should not be taken as a limitation on the size of the first radiator 10. The description of a 1 / 2 wavelength mode, a 3 / 4 wavelength mode, or a 1 / 4 wavelength mode can also be referenced, and will not be repeated here.

[0101] For example, when the first radiator 10 is elongated, the effective electrical length between the first feed point A1 of the first radiator 10 and the free end or ground end is approximately 1 / 4 times the dielectric wavelength corresponding to the resonant frequency (e.g., N79 band). This can excite a 1 / 4 wavelength mode at the resonant frequency (e.g., N79 band). The 1 / 4 wavelength mode is the fundamental mode and also a highly efficient resonant mode. Therefore, even with a relatively small size, the first radiator 10 can still excite a highly efficient resonant mode at the resonant frequency (e.g., N79 band), resulting in relatively high radiation efficiency in the supported frequency band (e.g., N79 band). In other words, the electronic device 1000 (e.g., N79 band) has good signal transmission and reception quality.

[0102] Of course, this application is not limited to the first radiator 10 being elongated. Optionally, the first radiator 10 may also be sheet-like, wherein the physical length of the first radiator 10 along a certain direction and the area of ​​the first radiator 10 both affect the equivalent electrical length of the first radiator 10 along the first direction. Herein, the first direction is the length direction of the first radiator 10.

[0103] Optionally, by designing the shape and area of ​​the first radiator 10, its higher-order modes (such as 1 / 2 wavelength mode, 3 / 4 wavelength mode, or 1 times wavelength mode) can be excited to achieve relatively high radiation efficiency for the supported frequency band (such as the N79 band) and make the size of the first radiator 10 relatively large. In this way, the sensing area of ​​the first radiator 10 for SAR value is relatively large, and the sensing distance of the first radiator 10 for human body proximity is also relatively large.

[0104] Since the N79 band has a lower usage rate compared to the MHB, UHB, N41, and N78 bands, this application designs the first radiator 10 to support the N79 band. Specifically, the radiator supporting the N79 band is designed as a support antenna and used as a sensor to detect the proximity of the subject under test. This reduces modifications to the antenna circuitry used at higher frequencies and avoids noise interference from adding a proximity sensing signal for the subject under test. When the N79 band becomes a high-frequency band, the first radiator 10 can be replaced with an antenna supporting other relatively lower-frequency bands, using the antenna of the relatively lower-frequency band as the sensor to detect the proximity of the subject under test.

[0105] Please see Figure 11 , Figure 11 The second antenna assembly 100 provided in this application. The second antenna assembly 100 is similar to the first antenna assembly 100 (see [link to application]). Figure 5 The difference is that the antenna assembly 100 provided in this embodiment also includes a first conductive detection element 51. The first conductive detection element 51 is made of a conductive material. Optionally, the material of the first conductive detection element 51 may be the same as or different from the material of the first radiator 10.

[0106] The connection methods between the first conductive detection element 51, the sensing chip 30, and the first radiator 10 include, but are not limited to, the following implementation methods:

[0107] In the first embodiment where the first conductive detection element 51, the sensing chip 30, and the first radiator 10 are connected, please refer to... Figure 11 The first conductive detection element 51 is electrically connected to the first radiator 10. The first conductive detection element 51 is used to generate a sensing signal when the subject approaches. By setting the first conductive detection element 51 and the first radiator 10 to be mutually conductive to form a relatively large whole, that is, to form a relatively large sensing sheet, the detection distance can be increased when a human body approaches.

[0108] When the first radiator 10 supports the N79 frequency band, the area of ​​the first radiator 10 is relatively small because the frequency of the N79 frequency band is relatively high. When the first radiator 10 is used as a sensing element to sense whether the subject under test is close, the sensing distance of the first radiator 10 is relatively small. The detection distance can be further increased by setting the first conductive detection element 51 so that the SAR value can be sensitively detected within the required distance.

[0109] The electrical connection between the first conductive detection element 51 and the first radiator 10 includes, but is not limited to, the following implementation methods: the first conductive detection element 51 and the first radiator 10 are integrally formed; the first conductive detection element 51 and the first radiator 10 are in direct contact and electrically connected; the first conductive detection element 51 and the first radiator 10 are electrically connected through intermediate connecting parts such as connecting wires and conductive springs.

[0110] This application does not specifically limit the shape of the first conductive detection element 51. The shape of the first conductive detection element 51 includes, but is not limited to, sheet-like, wire-like, etc.

[0111] In the second embodiment where the first conductive detection element 51, the sensing chip 30, and the first radiator 10 are connected, please refer to [the following text is missing from the original] Figure 12 The first conductive detection element 51 is electrically connected to the sensing chip 30, but not electrically connected to the first radiator 10. The sensing chip 30 is also used to receive the sensing signal from the first conductive detection element 51 when it is electrically connected, and to determine whether the subject under test is approaching or moving away from the first conductive detection element 51 based on the sensing signal. When the first conductive detection element 51 is close to the housing of the electronic device 1000, the sensing chip 30 can determine whether the subject under test is approaching or moving away from the electronic device 1000.

[0112] Optionally, when the subject under test (e.g., a human body) approaches, the first conductive detection element 51 forms a capacitive structure with the subject under test, and the capacitance of the capacitive structure changes as the distance between the subject under test and the first conductive detection element 51 changes. The first conductive detection element 51 is electrically connected to the sensing chip 30, so that the sensing chip 30 can detect the proximity of the subject under test to the electronic device 1000 and the distance between the subject under test and the electronic device 1000 by detecting the sensing signal on the first conductive detection element 51, thereby obtaining the SAR value.

[0113] The first conductive detection element 51 serves as a sensing element for detecting the proximity of the subject. The detection channel formed between the first conductive detection element 51 and the sensing chip 30 is independent of the detection channel formed between the first radiator 10 and the sensing chip 30. Thus, there are two independent channels for detecting the proximity of the subject. If the chip or device in one detection channel is damaged and cannot function, the other detection channel can still operate normally, thereby improving the reliability of the proximity detection.

[0114] By setting the first conductive detection element 51 as a sensing element for detecting the proximity of the subject under test, the sensing area for detecting the proximity of the subject under test can be increased, thereby increasing the sensing distance and laying the foundation for accurate power back-off in the future. In addition, the first conductive detection element 51 is not electrically connected to the first radiator 10. Thus, the first conductive detection element 51 will not have any noise influence on the first radiator 10, thereby reducing the impact on the transmit and receive frequency band of the first radiator 10.

[0115] In the third embodiment where the first conductive detection element 51, the sensing chip 30, and the first radiator 10 are connected, please refer to [the relevant documentation]. Figure 13 The first conductive detection element 51 is electrically connected to the sensing chip 30 and the first radiator 10. The sensing chip 30 is also used to receive the sensing signal of the first conductive detection element 51 when the first conductive detection element 51 is electrically connected to the sensing chip 30, and to determine whether the subject under test is approaching or moving away from the first conductive detection element 51 based on the sensing signal.

[0116] Optionally, this embodiment is a combination of the first and second embodiments described above. In other words, the first conductive detection element 51 serves as a sensing element for detecting the approach of the subject. The first conductive detection element 51 and the first radiator 10 are interconnected to form a relatively large integral unit, i.e., a relatively large sensing element, which increases the detection distance when measuring the approach of a human body. Moreover, the detection channels between the first conductive detection element 51 and the sensing chip 30, and between the first radiator 10 and the sensing chip 30, are independent of each other. Thus, there are two independent channels for detecting the approach of the subject. If the device or chip in one detection channel is damaged and cannot work, the other detection channel can still work normally, thereby improving the reliability of the human body approach distance.

[0117] This application does not specifically limit the position of the first conductive detection element 51. Optionally, the first conductive detection element 51 is disposed on the motherboard bracket 520, at least partially opposite the motherboard 510, and the first conductive detection element 51 is disposed adjacent to the first radiator 10. In this way, the area where the first conductive detection element 51 is located and the area where the first radiator 10 is located form a continuous whole area, thereby forming a continuous sensing area for detecting the proximity of a human body.

[0118] This application does not specify the exact location where the first conductive detection element 51 is electrically connected to the first radiator 10. Optionally, please refer to [link to relevant documentation]. Figure 14 The first conductive detection element 51 is electrically connected to the first feed point A1. The first feed point A1 is the point on the first radiator 10 where the resonant current is strongest. When the first conductive detection element 51 is electrically connected to the first feed point A1, it does not change its boundary conditions, and has little impact on the transmit / receive frequency band of the first radiator 10. This facilitates the tuning of the first radiator 10 to the desired frequency band, for example, the N79 band. It also facilitates the adjustment of the clutter generated by the first conductive detection element 51 through its area, length, etc., thus making the clutter generated by the first conductive detection element 51 controllable and reducing its impact on the frequency band supported by the antenna assembly 100.

[0119] This application does not specify the specific structure of the first conductive detection element 51.

[0120] In the first embodiment of the first conductive detection element 51, please refer to... Figure 15 The first conductive detection element 51 includes a first conductive trace 511. One end of the first conductive trace 511 is electrically connected to the first radiator 10. Optionally, one end of the first conductive trace 511 is electrically connected to a first feed point A1 of the first radiator 10 to reduce the influence of the first conductive trace 511 on the transmit / receive frequency band of the first radiator 10. The extension trajectory of the first conductive trace 511 includes at least one of a straight line, a bend, and a curve.

[0121] The first conductive trace 511 forms a sensing block after being bent and extended. That is, the first conductive trace 511 is relatively evenly distributed in this sensing block to reduce blank areas and thus reduce detection blind spots.

[0122] The first conductive trace 511 may or may not be electrically connected to the sensing chip 30.

[0123] This application does not specify the length or width of the first conductive trace 511. It is understood that the width of the first conductive trace 511 is much smaller than the width of the first radiator 10. By adjusting the length and width of the first conductive trace 511, the noise generated by the first conductive trace 511 will not affect the frequency bands transmitted and received by the first radiator 10.

[0124] For example, the first radiator 10 is used to support the N79 frequency band. The length and width of the first conductive trace 511 can be adjusted to keep the clutter of the first conductive trace 511 away from the N79 frequency band, as well as away from other frequency bands that need to be supported.

[0125] Optionally, the length of the first conductive trace 511 is relatively long and the width is relatively small. On the one hand, this makes the area of ​​the sensing block formed by the first conductive trace 511 relatively large, thereby increasing its detection distance. On the other hand, it reduces the noise of the first conductive trace 511 or adjusts the noise generated by the first conductive trace 511 to a low frequency position, so as to reduce the impact on the frequency band supported by the first radiator 10.

[0126] For an embodiment of the second type of first conductive detection element 51, please refer to [link / reference needed]. Figure 16 The first conductive detection element 51 includes a first conductive sheet 512. The first conductive sheet 512 is electrically connected to the first radiator 10. Optionally, the first conductive sheet 512 is directly electrically connected to the first feed point A1; or, the first conductive sheet 512 is electrically connected to one end of a conductive trace, and the other end of the conductive trace is electrically connected to the first feed point A1 of the first radiator 10, so as to reduce the influence of the first conductive sheet 512 on the transmit and receive frequency band of the first radiator 10 and to make the clutter generated by the first conductive sheet 512 controllable.

[0127] The first conductive sheet 512 may or may not be electrically connected to the sensing chip 30.

[0128] Optionally, the first conductive sheet 512 may be solid or mesh-like.

[0129] The first conductive sheet 512 is sheet-shaped and has a relatively large detection area. The first conductive sheet 512 and the first radiator 10 can be arranged adjacent to each other to form a continuous overall sensing area. The first conductive sheet 512 provided in this embodiment not only makes the area of ​​the formed sensing block relatively large, thus making its detection distance larger, but it is also easier to process and shape than the first conductive trace 511, and the area of ​​the formed sensing area is larger.

[0130] For an embodiment of the third type of first conductive detection element 51, please refer to [link / reference needed]. Figure 17 The first conductive detection element 51 includes a first conductive sheet 512 and a first conductive trace 511. The first conductive sheet 512 and the first conductive trace 511 are electrically connected to the first radiator 10. The first conductive trace 511 is electrically connected to the first radiator 10. The first conductive sheet 512 can be electrically connected to the end of the first conductive trace 511 that is not connected to the first radiator 10, or it can be electrically connected to the middle of the first conductive trace 511.

[0131] The difference between the first conductive trace 511 in this embodiment and the conductive trace electrically connecting the first conductive piece 512 in the second embodiment is that, in this embodiment, the first conductive trace 511 forms a sensing block through wiring as described in the first embodiment. In other words, the sensing area formed in this embodiment includes the area where the first conductive piece 512 is located, the sensing block formed by the first conductive trace 511, and the area where the first radiator 10 is located. This further increases the sensing area at the distance of the human body approaching, thereby further increasing the sensing distance.

[0132] Please see Figure 18 , Figure 18 The third type of antenna assembly 100 provided in this application differs from the first type of antenna assembly 100 in that:

[0133] Optional, please refer to Figure 18 The antenna assembly 100 further includes at least one second radiator 60. Taking one second radiator 60 as an example, in other embodiments, the number of second radiators 60 may be two or more.

[0134] The second radiator 60 is disposed inside the frame 310 of the electronic device 1000 and is at least partially opposite to the motherboard 510 of the electronic device 1000. In other words, the second radiator 60 can be disposed on the same surface as the first radiator 10. The second radiator 60 is a support antenna.

[0135] This application does not limit the frequency band supported by the second radiator 60. The second radiator 60 is used to transmit and receive at least one of the following frequency bands: LB band, MHB band, UHB band, N41 band, N78 band, N79 band, Wi-Fi band, and GNSS band.

[0136] The second radiator 60 is electrically connected to the sensing chip 30 and / or the first radiator 10.

[0137] In the embodiment where the second radiator 60, the sensing chip 30, and the first radiator 10 are electrically connected, please refer to... Figure 18 The second radiator 60 is electrically connected to the first radiator 10 but not to the sensing chip 30. The second radiator 60 is used to generate a sensing signal when the subject approaches.

[0138] By setting the second radiator 60 to be interconnected with the first radiator 10 to form a relatively large whole, that is, to form a relatively large sensing sheet, the detection distance can be increased when a human body approaches.

[0139] When the first radiator 10 supports the N79 band, the area of ​​the first radiator 10 is relatively small because the frequency of the N79 band is relatively high. When the first radiator 10 is used as a sensor to sense whether the subject under test is close, the sensing distance of the first radiator 10 is relatively small. By setting the second radiator 60 as a sensor to sense whether the subject under test is close, the detection distance can be further increased so that the SAR value can be sensitively detected within the required distance.

[0140] In the second embodiment where the second radiator 60, the sensing chip 30, and the first radiator 10 are electrically connected, please refer to [the following text is missing from the original] Figure 19 The second radiator 60 is electrically connected to the sensing chip 30 but not to the first radiator 10. The sensing chip 30 is also used to receive the sensing signal from the second radiator 60 when it is electrically connected, and to determine whether the subject under test is approaching or moving away from the second radiator 60 based on the sensing signal. When the second radiator 60 approaches the housing of the electronic device 1000, the sensing chip 30 can determine whether the subject under test is approaching or moving away from the electronic device 1000. The wiring between the second radiator 60 and the sensing chip 30, and the wiring between the first radiator 10 and the sensing chip 30, can form independent detection channels.

[0141] By setting the second radiator 60 as a sensing element for detecting the approach of the subject, the sensing area for detecting the approach of the subject can be increased, thereby increasing the sensing distance and laying the foundation for accurate power back-off in the future. In addition, the detection of the approach of the subject has two independent channels. If the chip or device in one detection channel is damaged and cannot work, the other detection channel can still work normally, thereby improving the reliability of the distance of the human body approaching.

[0142] In the third embodiment where the second radiator 60, the sensing chip 30, and the first radiator 10 are electrically connected, please refer to [the following text is missing from the original] Figure 20 The second radiator 60 is electrically connected to the sensing chip 30 and also electrically connected to the first radiator 10. The sensing chip 30 is further configured to receive the sensing signal from the second radiator 60 when the second radiator 60 is electrically connected to the sensing chip 30, and to determine whether the subject under test is approaching or moving away from the second radiator 60 based on the sensing signal. The wiring between the second radiator 60 and the sensing chip 30, and the wiring between the first radiator 10 and the sensing chip 30, can form independent detection channels.

[0143] Optionally, this embodiment is a combination of the first and second embodiments described above. In other words, the second radiator 60 serves as a sensing element for detecting the approach of the subject. The second radiator 60 and the first radiator 10 are interconnected to form a relatively large integral unit, i.e., a relatively large sensing element, which increases the detection distance when measuring the approach of a human body. Moreover, the detection channels between the second radiator 60 and the sensing chip 30, and between the first radiator 10 and the sensing chip 30, are independent of each other. Thus, there are two independent channels for detecting the approach of the subject. If the chip or device in one detection channel is damaged and cannot function, the other detection channel can still function normally, thereby improving the reliability of the human body approach distance.

[0144] This application does not specifically limit the position of the second radiator 60. Optionally, the second radiator 60 is disposed on the motherboard bracket 520, at least partially opposite the motherboard 510, and the second radiator 60 is disposed adjacent to the first radiator 10. In this way, the area where the second radiator 60 is located and the area where the first radiator 10 is located form a continuous whole area, thereby forming a continuous sensing area for detecting the proximity of a human body.

[0145] Optional, please refer to Figure 20 The second radiator 60 has a second feed point A2. This application does not specifically limit the structure of the second radiator 60; the second radiator 60 may include, but is not limited to, a planar inverted-F antenna, a monopole antenna, a T-shaped antenna, etc. Specific embodiments of the structure of the second radiator 60 can be found in the embodiments of the structure of the first radiator 10, and will not be repeated here.

[0146] Optional, please refer to Figure 20 The antenna assembly 100 further includes a second feed source 80. The second feed source 80 is electrically connected to the second feed point A2. In other words, the first radiator 10 and the second radiator 60 are different feed sources.

[0147] Alternatively, please refer to Figure 21 The second radiator 60 has a second feed point A2. The second feed point A2 is electrically connected to the first feed source 20. In other words, the first radiator 10 and the second radiator 60 are the same feed source, so as to reduce the number of feed sources and radio frequency ports and simplify the structure of the antenna assembly 100.

[0148] Optionally, the second radiator 60 is used to generate a second resonant mode to support the N79 frequency band. The second resonant mode includes a 1 / 4 wavelength mode, a 1 / 2 wavelength mode, a 3 / 4 wavelength mode, or a mode equal to one wavelength. For a detailed description of the resonant mode and wavelength mode, please refer to the description of the first resonant mode and wavelength mode in the first radiator 10; it will not be repeated here.

[0149] In this embodiment, both the second radiator 60 and the first radiator 10 can be used to support the relatively low-usage N79 frequency band. The radiator supporting the N79 frequency band is designed as a support antenna, and multiple radiators originally required to support the N79 frequency band are reused as a sensing element for detecting the proximity of the subject under test. This reduces the need for improvements to the high-frequency antenna circuitry and avoids the interference of noise from adding proximity sensing signals to the high-frequency band. When the N79 frequency band becomes a high-frequency band, the first radiator 10 can be replaced with an antenna supporting other relatively low-frequency bands, and the antenna for those lower-frequency bands can be used as a sensing element for detecting the proximity of the subject under test.

[0150] Optional, please refer to Figure 20 and Figure 21 The antenna assembly 100 further includes a fourth isolator 43, a third isolator 44, and a second matching circuit M3. One end of the third isolator 44 is electrically connected to the second feed point A2. The other end of the third isolator 44 is electrically connected to one end of the second matching circuit M3. The other end of the second matching circuit M3 is electrically connected to the second feed source 80. The second matching circuit M3 is used to tune the frequency band supported by the second radiator 60. The third isolator 44 is used to be in an open-circuit state for the induced signal.

[0151] The fourth isolation device 43 is electrically connected between the second radiator 60 and the sensing chip 30. The fourth isolation device 43 is used to conduct the sensing signal generated by the second radiator 60 when the subject under test approaches, and to open the radio frequency signal of the second radiator 60.

[0152] The third isolation device 44 has the same structure and function as the first isolation device 42, therefore, the specific implementation of the third isolation device 44 can refer to the specific implementation of the first isolation device 42. The fourth isolation device 43 has the same structure and function as the second isolation device 41, therefore, the specific implementation of the fourth isolation device 43 can refer to the specific implementation of the second isolation device 41.

[0153] The first radiator 10 and / or the second radiator 60 have a grounding point. The grounding point is used for electrical connection to a reference ground. For example, the first radiator 10 and / or the second radiator 60 are planar inverted-F antennas.

[0154] Please see Figure 22 , Figure 22Taking the first radiator 10 as a planar inverted-F antenna as an example, the antenna assembly 100 further includes a fifth isolation device 45. One end of the fifth isolation device 45 is electrically connected to the grounding point, and the other end of the fifth isolation device 45 is grounded. The fifth isolation device 45 is used to be in an open-circuit state for the induced signal. The structure and function of the fifth isolation device 45 are the same as those of the first isolation device 42, so the specific implementation of the structure of the fifth isolation device 45 can refer to the specific implementation of the structure of the first isolation device 42.

[0155] As previously explained, when the first radiator 10 is a planar inverted F antenna, a first isolation device 42 (referred to as the fifth isolation device 45 in this embodiment) needs to be provided at both the first feed point A1 and the ground point of the first radiator 10 so that the first radiator 10 is in a floating state relative to the first feed source 20 and the reference ground.

[0156] For the second radiator 60, the second radiator 60 also has a second grounding point for electrically connecting to a reference ground, one of the third isolation devices 44 (i.e., the fifth isolation device 45) is electrically connected between the second grounding point and the reference ground, and another of the third isolation devices 44 is electrically connected between the second feed point A2 and the end of the second matching circuit M3 that is not connected to the second feed source 80.

[0157] The fifth isolation device 45 and the third isolation device 44 make the second radiator 60 float relative to the second feed source 80 and the reference ground when transmitting the induction signal, so that the induction signal on the second radiator 60 is not affected by the signal on the second feed source 80 and the reference ground.

[0158] Please see Figure 23 , Figure 23 This application provides a fourth type of antenna assembly 100. The fourth type of antenna assembly 100 differs from the third type of antenna assembly 100 in that:

[0159] The antenna assembly 100 further includes at least one second conductive detection element 52. The second conductive detection element 52 is used to sense whether the subject under test is close to the second conductive detection element 52.

[0160] Optionally, the second conductive detection element 52 in this embodiment can be the first conductive detection element 51 in the second type of antenna assembly 100. That is, the first conductive detection element 51 in the second type of antenna assembly 100 is combined with the first radiator 10 and the second radiator 60 in the third type of antenna assembly 100. After combination, the following implementation methods are included but are not limited to: First, the first conductive detection element 51, the first radiator 10 and the second radiator 60 are not connected to each other, and each is independently electrically connected to the sensing chip 30; Second, two of the three elements are electrically connected and electrically connected to the sensing chip 30, while the other is independently electrically connected to the sensing chip 30; or the three elements are electrically connected and electrically connected to the sensing chip 30.

[0161] This application does not specify the arrangement of the first radiator 10, the first conductive detection element 51 (second conductive detection element 52), and the second radiator 60. As long as the first radiator 10, the first conductive detection element 51 (second conductive detection element 52), and the second radiator 60 form a continuous overall sensing area.

[0162] The arrangement of the first radiator 10, the first conductive detection element 51 (second conductive detection element 52), and the second radiator 60 includes, but is not limited to, the following embodiments: the first radiator 10, the first conductive detection element 51 (second conductive detection element 52), and the second radiator 60 are arranged sequentially and electrically connected; or, the first conductive detection element 51 (second conductive detection element 52), the first radiator 10, and the second radiator 60 are arranged sequentially and electrically connected; or, the first radiator 10, the second radiator 60, and the first conductive detection element 51 (second conductive detection element 52) ​​are arranged sequentially and electrically connected.

[0163] Alternatively, the second conductive detection element 52 in this embodiment may be a different conductive detection element from the first conductive detection element 51 in the second antenna assembly 100.

[0164] The second conductive detection element 52 is made of a conductive material. Optionally, the material of the second conductive detection element 52 may be the same as or different from the material of the first radiator 10.

[0165] The connection methods between the second conductive detection element 52 and the first radiator 10 and the second radiator 60 include, but are not limited to, the following embodiments:

[0166] In the first embodiment of the connection between the second conductive detection element 52 and the first radiator 10 and the second radiator 60, please refer to Figure 23 The second conductive detection element 52 is electrically connected between the first radiator 10 and the second radiator 60.

[0167] By setting the second conductive detection element 52 to be interconnected with the first radiator 10 and the second radiator 60 to form a relatively large whole, that is, to form a relatively large sensing sheet, the detection distance can be increased when the human body approaches.

[0168] When both the first radiator 10 and the second radiator 60 support the N79 frequency band, the area of ​​the first radiator 10 and the second radiator 60 is relatively small due to the relatively high frequency of the N79 frequency band. When the first radiator 10 and the second radiator 60 are used as sensing elements to detect whether the subject under test is close, the sensing distance of the first radiator 10 and the second radiator 60 is relatively small. By adding a second conductive detection element 52 to sense whether the subject under test is close, the detection distance can be further increased so that the SAR value can be sensitively detected within the required distance.

[0169] In the second embodiment of the connection between the second conductive detection element 52 and the first radiator 10 and the second radiator 60, please refer to Figure 24 The second conductive detection element 52 is electrically connected to the second radiator 60, and the second conductive detection element 52 is not electrically connected to the first radiator 10.

[0170] When the first radiator 10 and the second radiator 60 are not electrically connected, the second conductive detection element 52 and the second radiator 60 serve as a sensing element for one detection channel, while the first radiator 10 serves as a sensing element for another detection channel.

[0171] When the first radiator 10 and the second radiator 60 are electrically connected, the second conductive detection element 52 is electrically connected to the first radiator 10 and the second radiator 60 as a whole.

[0172] This application does not impose specific limitations on the positional design of the first radiator 10, the second conductive detection element 52, and the second radiator 60. Optionally, the first radiator 10, the second conductive detection element 52, and the second radiator 60 are arranged sequentially adjacent to each other, that is, the area where the first radiator 10, the area where the second conductive detection element 52, and the area where the second radiator 60 are located form a continuous overall detection area, thereby obtaining a relatively large detection area and improving the detection distance.

[0173] The electrical connection between the second conductive detection element 52 and the first radiator 10 and the second radiator 60 includes, but is not limited to, the following implementation methods: the second conductive detection element 52 is integrally formed with the first radiator 10 and the second radiator 60; the second conductive detection element 52 is in direct contact with and electrically connected to the first radiator 10 and the second radiator 60; the second conductive detection element 52 is electrically connected to the first radiator 10 and the second radiator 60 through intermediate connecting parts such as connecting wires and conductive springs.

[0174] This application does not specifically limit the shape of the second conductive detection element 52. The shape of the second conductive detection element 52 includes, but is not limited to, sheet-like, wire-like, etc.

[0175] The following explanation uses the example of the first radiator 10, the second conductive detection element 52, and the second radiator 60 being electrically connected in sequence.

[0176] This application does not specify the exact location where the second conductive detection element 52 is electrically connected to the first radiator 10 and the second radiator 60. Optionally, the second conductive detection element 52 is electrically connected to the first feed point A1, and the second conductive detection element 52 is electrically connected to the second feed point A2. The first feed point A1 is the point on the first radiator 10 where the resonant current is strongest. The second feed point A2 is the point on the second radiator 60 where the resonant current is strongest. When the second conductive detection element 52 is electrically connected to the first feed point A1 and the second feed point A2, it will not change its boundary conditions. It has little impact on the transmit and receive frequency bands of the first radiator 10 and the second radiator 60, making it easier for the first radiator 10 and the second radiator 60 to tune to the frequency bands they want to support. For example, it is easy to tune the N79 frequency band on the first radiator 10 and the second radiator 60. At the same time, it is also easy to adjust the clutter generated by the second conductive detection element 52 by adjusting its area, length, etc., so that the clutter generated by the second conductive detection element 52 can be controlled, thereby reducing the impact of the clutter generated by the second conductive detection element 52 on the frequency bands supported by the antenna assembly 100.

[0177] This application does not specify the specific structure of the second conductive detection element 52.

[0178] In the embodiment of the first type of second conductive detection element 52, please refer to Figure 25 The second conductive detection element 52 includes a second conductive trace 521. The second conductive trace 521 is electrically connected between the first radiator 10 and the second radiator 60.

[0179] Optionally, the second conductive trace 521 is electrically connected to the first feed point A1 of the first radiator 10 and the second feed point A2 of the second radiator 60 to reduce the impact of the second conductive trace 521 on the transmit / receive frequency bands of the first radiator 10 and the second radiator 60. The extension trajectory of the second conductive trace 521 includes at least one of a straight line, a bend, and a curve.

[0180] The second conductive trace 521 forms a sensing block after being bent and extended. That is, the second conductive trace 521 is relatively evenly distributed in this sensing block to reduce blank areas and thus reduce detection blind spots.

[0181] This application does not specify the length or width of the second conductive trace 521. It is understood that the width of the second conductive trace 521 is much smaller than the width of the first radiator 10. By adjusting the length and width of the second conductive trace 521, the noise generated by the second conductive trace 521 will not affect the frequency bands transmitted and received by the first radiator 10 and the second radiator 60.

[0182] For example, the first radiator 10 and the second radiator 60 are used to support the N79 frequency band. The length and width of the second conductive trace 521 can be adjusted to keep the clutter of the second conductive trace 521 away from the N79 frequency band, as well as away from other frequency bands that need to be supported.

[0183] Optionally, the second conductive trace 521 has a relatively long length and a relatively small width. On the one hand, this makes the area of ​​the sensing block formed by the second conductive trace 521 relatively large, thereby increasing its detection distance. On the other hand, it reduces the noise of the second conductive trace 521 or adjusts the noise generated by the second conductive trace 521 to a low frequency position, so as to reduce the impact on the frequency band supported by the first radiator 10 and the second radiator 60.

[0184] In the second embodiment of the second conductive detection element 52, please refer to Figure 26 The second conductive detection element 52 further includes a second conductive sheet 522. The second conductive sheet 522 is electrically connected between the first radiator 10 and the second radiator 60. Optionally, the second conductive sheet 522 is directly electrically connected between the first feed point A1 of the first radiator 10 and the second feed point A2 of the second radiator 60; or, the second conductive sheet 522 is electrically connected to the first feed point A1 of the first radiator 10 via a conductive trace, and the second conductive sheet 522 is electrically connected to the second feed point A2 of the second radiator 60 via another conductive trace, to reduce the influence of the second conductive sheet 522 on the transmit / receive frequency bands of the first radiator 10 and the second radiator 60, and to achieve controllable clutter generated by the second conductive sheet 522. The second conductive sheet 522 is solid or mesh-like.

[0185] The second conductive sheet 522 is sheet-shaped and has a relatively large detection area. The second conductive sheet 522, the first radiator 10, and the second radiator 60 can be arranged adjacent to each other to form a continuous, integrated sensing area. The second conductive sheet 522 provided in this embodiment not only makes the area of ​​the formed sensing block relatively large, thus increasing its detection distance, but is also easier to process and shape compared to the second conductive trace 521, and forms a larger sensing area.

[0186] For an embodiment of the third type of second conductive detection element 52, please refer to [link / reference needed]. Figure 27 The second conductive detection element 52 includes a second conductive sheet 522 and a second conductive trace 521. The second conductive sheet 522 and the second conductive trace 521 are electrically connected to the first radiator 10 and the second radiator 60. Optionally, the opposite ends of the second conductive trace 521 are electrically connected to the first radiator 10 and the second radiator 60, respectively. The second conductive sheet 522 can be electrically connected at the middle position of the second conductive trace 521.

[0187] The difference between the second conductive line 521 in this embodiment and the conductive line electrically connecting the second conductive piece 522 in the second embodiment is that the second conductive line 521 in this embodiment forms a sensing block through wiring as described in the first embodiment. In other words, the sensing area formed in this embodiment includes the area where the second conductive piece 522 is located, the sensing block formed by the second conductive line 521, the area where the first radiator 10 is located, and the area where the second radiator 60 is located. This further increases the sensing area at the distance of the human body approaching, thereby further increasing the sensing distance.

[0188] This application does not impose specific limitations on the arrangement of the first radiator 10, the first conductive detection element 51, the second conductive detection element 52, and the second radiator 60, as long as the first radiator 10, the first conductive detection element 51, the second conductive detection element 52, and the second radiator 60 form a continuous overall sensing area.

[0189] The arrangement of the first radiator 10, the first conductive detection element 51, the second conductive detection element 52, and the second radiator 60 includes, but is not limited to, the following embodiments: the first radiator 10, the first conductive detection element 51, the second conductive detection element 52, and the second radiator 60 are arranged sequentially and electrically connected; or, the first conductive detection element 51, the first radiator 10, the second conductive detection element 52, and the second radiator 60 are arranged sequentially and electrically connected; or, the first conductive detection element 51, the first radiator 10, the second radiator 60, and the second conductive detection element 52 are arranged sequentially and electrically connected, etc.

[0190] For example, please see Figure 28 The following example illustrates the situation: the first conductive detection element 51 is electrically connected between the first radiator 10 and the second radiator 60, and the second conductive detection element 52 is directly electrically connected to the second radiator 60.

[0191] The first radiator 10 and the second radiator 60 are arranged along a first direction (x-axis direction) and spaced apart. A first conductive detection element 51 and a second conductive detection element 52 are disposed between the first radiator 10 and the second radiator 60. A first feed point A1 is located near the second radiator 60, and a second feed point A2 is located near the first radiator 10. The first conductive detection element 51 includes a first conductive trace 511 and a first conductive sheet 512. The second conductive detection element 52 includes a second conductive sheet 522. The first conductive trace 511 is electrically connected between the first feed point A1 and the second feed point A2. The first conductive sheet 512 is electrically connected to the first conductive trace 511. The second conductive sheet 522 is electrically connected to the second feed point A2. The first radiator 10, the first conductive sheet 512, the second conductive sheet 522, and the second radiator 60 are arranged sequentially along the x-axis direction.

[0192] Please see Figure 29 The first conductive trace 511 includes a first segment 511a, a second segment 511b, a third segment 511c, a fourth segment 511d, and a fifth segment 511e connected in sequence. The first segment 511a is located in the gap between the first radiator 10 and the first conductive sheet 512. One end of the first segment 511a is electrically connected to the first feed point A1. The other end of the first segment 511a first extends in the reverse direction along the Y-axis, then folds back and extends in the positive direction along the Y-axis, connecting to one end of the second segment 511b. The second segment 511b and the first conductive sheet 512 are arranged in the opposite direction along the Y-axis. The other end of the second segment 511b extends in the reverse direction along the X-axis to connect to one end of the third segment 511c. The third segment 511c is located between the first conductive sheet 512 and the second conductive sheet 522. The third segment 511c first extends in the reverse direction along the Y-axis, then folds back and extends in the forward direction along the Y-axis, and connects to one end of the fourth segment 511d. The fourth segment 511d and the second conductive sheet 522 are arranged in the opposite direction along the Y-axis. The other end of the fourth segment 511d extends in the reverse direction along the X-axis to one end connected to the fifth segment 511e. The fifth segment 511e is located between the second radiator 60 and the second conductive sheet 522. The other end of the fifth segment 511e is electrically connected to the second feed point A2.

[0193] This application does not specifically limit the structure of the first radiator 10 and the second radiator 60. Optionally, the first radiator 10 is generally rectangular and extends along the X-axis. When the first radiator 10 is mounted on the motherboard bracket 520, avoidance holes or the like can be provided on the first radiator 10 to avoid screw holes or other obstructions on the motherboard bracket 520. It is understood that... Figure 28Both the first radiator 10 and the second radiator 60 shown have avoidance notches. One edge of the second radiator 60 is also arc-shaped.

[0194] This application eliminates the need to reserve a regular area on the motherboard 510 or motherboard bracket 520 to set up the first radiator 10 and the second radiator 60. That is, the first radiator 10 and the second radiator 60 can utilize the irregular space on the motherboard 510 or motherboard bracket 520, thereby reducing manufacturing difficulty and improving the space utilization rate of the first radiator 10 and the second radiator 60 on the motherboard 510 or motherboard bracket 520.

[0195] Please refer to Figure 29 The first radiator 10 can operate in a 1 / 4 wavelength mode from the first feed point A1 to the free end (point C) of the first radiator 10. The second radiator 60 can operate in a 1 / 4 wavelength mode from the second feed point A2 to the free end (point E).

[0196] The first radiator 10 and the second radiator 60 provided in this application are connected by a conductive detection element. The conductive detection element is not limited to... Figure 28 The conductive detection element includes conductive traces and conductive sheets. The conductive traces can be of any shape and length. The conductive sheets do not participate in radiation, can be of any shape, and can be attached to the conductive traces or not. If the conductive sheet is attached to the conductive trace, it becomes an integral part of the conductive trace and the first radiator 10, serving as a sensing sheet for detecting the proximity of a human body. This increases the overall sensing area, which is larger than that of a single-support antenna. The first radiator 10, the second radiator 60, the conductive traces, and the conductive sheet as a whole can serve as a sensing sheet for detecting the proximity of a human body. When a human body approaches its vicinity, the sensing sheet can detect the approach and trigger board-level power backoff, thereby reducing the amount of radiated energy entering the human body and lowering the SAR value. When a human body moves away from its vicinity, the sensing sheet can detect the movement away, thus not triggering board-level power backoff, ensuring communication performance and improving user experience. A capacitance is formed between the human body and the sensing sheet. When the distance between the human body and the sensing sheet changes, the capacitance value also changes. Figure 28As can be seen, the first radiator 10 and the second radiator 60 are connected as a single unit via conductive traces and conductor sheets, and then connected to the sensing chip 30 through two detection channels (the detection channel formed between the first radiator 10 and the sensing chip 30, and the detection channel formed between the second radiator 60 and the sensing chip 30). When the sensing chip 30 detects different changes in capacitance, it can determine whether a human body is moving away from or close to the sensing chip. Simultaneous detection through two channels not only increases the detection area and distance of the sensing chip 30, making detection more sensitive, but also ensures that even if one channel fails, the other channel can still detect, adding an extra layer of detection defense and greatly enhancing reliability.

[0197] This application also provides a fifth type of antenna assembly 100, which can be combined with the embodiments of the first to fourth types of antenna assemblies 100 described above.

[0198] Please see Figure 30 The antenna assembly 100 further includes a third radiator 70. The third radiator 70 is disposed on the frame 310 of the electronic device 1000. Optionally, when the frame 310 of the electronic device 1000 is made of metal, the third radiator 70 can be integrated with the frame 310, i.e., the third radiator 70 is a frame antenna (or mid-frame antenna). Optionally, when the electronic device 1000 is made of non-conductive material, the third radiator 70 can be formed on the inner surface of the frame 310 using processes such as Laser Direct Structuring (LDS) or Print Direct Structuring (PDS). Optionally, the third radiator 70 can be formed on a flexible circuit board, and then the flexible circuit board can be attached to the frame 310.

[0199] This embodiment uses the third radiator 70 as a frame antenna as an example. This application does not specifically limit the frequency bands supported by the third radiator 70. Optionally, the third radiator 70 can be used to support at least one of the following frequency bands: LB band, MHB band, UHB band, N41 band, N78 band, N79 band, Wi-Fi band, and GNSS band.

[0200] The third radiator 70 has a third feed point A3.

[0201] Optional, please refer to Figure 30The third feed point A3 is electrically connected to the first feed source 20, i.e., the first radiator 10 and the third radiator 70 are co-fed, thereby reducing the number of feed sources and simplifying the structure of the antenna assembly 100. The third feed point A3 is arranged adjacent to the first feed point A1. Both the third feed point A3 and the first feed point A1 are electrically connected to the first feed source 20. By arranging the third feed point A3 adjacent to the first feed point A1, transmission loss is reduced.

[0202] Of course, in other embodiments, the third feed point A3 and the first feed point A1 are electrically connected to two different feed sources, so that the positions of the first feed point A1 of the first radiator 10 and the third feed point A3 of the third radiator 70 can be freely set.

[0203] This embodiment uses the example of first feed point A1 and third feed point A3 being electrically connected to first feed source 20, and second feed point A2 being electrically connected to second feed source 80 for illustration.

[0204] This application does not impose specific limitations on the structure of the third radiator 70. Optionally, the third radiator 70 can be an inverted F-antenna, a loop antenna, an L-shaped antenna, a T-shaped antenna, etc. The structure of the third radiator 70 provided in this embodiment is illustrated below with reference to the accompanying drawings.

[0205] Optional, please refer to Figure 31 The third radiator 70 includes a first sub-radiator 71 and a second sub-radiator 72.

[0206] For example, the shapes of the first sub-radiator 71 and the second sub-radiator 72 include, but are not limited to, strip-shaped, sheet-shaped, rod-shaped, coating-shaped, and film-shaped. Figure 31 The first sub-radiator 71 and the second sub-radiator 72 shown are merely examples and do not limit the shape of the first sub-radiator 71 and the second sub-radiator 72 provided in this application. In this embodiment, both the first sub-radiator 71 and the second sub-radiator 72 are strip-shaped. This application does not limit the extension trajectory of the first sub-radiator 71 and the second sub-radiator 72. In this embodiment, the first sub-radiator 71 and the second sub-radiator 72 are straight lines. In other embodiments, the first sub-radiator 71 and the second sub-radiator 72 may also extend in a bent, curved, or other trajectory. The aforementioned first sub-radiator 71 and the second sub-radiator 72 may be lines of uniform width on their extension trajectory, or they may be stripes of varying widths, such as those with gradually changing widths or widened areas.

[0207] Please see Figure 31A coupling gap 73 exists between the first sub-radiator 71 and the second sub-radiator 72. The first sub-radiator 71 has a first grounding terminal 711, the third feed point A3, and a first coupling terminal 712 arranged sequentially. The second sub-radiator 72 has a second coupling terminal 721 and a second grounding terminal 722. The coupling gap 73 is located between the first coupling terminal 712 and the second coupling terminal 721.

[0208] The first grounding terminal 711 and the first coupling terminal 712 are the two ends of the first sub-radiator 71, respectively. The second coupling terminal 721 and the second grounding terminal 722 are the two ends of the second sub-radiator 72, respectively.

[0209] In other words, the first sub-radiator 71 and the second sub-radiator 72 are capacitively coupled through the coupling gap 73. "Capacitive coupling" means that an electric field is generated between the first sub-radiator 71 and the second sub-radiator 72, allowing electrical signals on the second sub-radiator 72 to be transmitted to the first sub-radiator 71 through the electric field, thus enabling electrical signal conduction even when the first sub-radiator 71 and the second sub-radiator 72 are not in direct contact or connection. Optionally, the first sub-radiator 71 and the second sub-radiator 72 can be arranged in a straight line or approximately in a straight line (i.e., with small tolerances during design). Of course, in other embodiments, the first sub-radiator 71 and the second sub-radiator 72 can also be staggered in the extending direction to form a clearance space.

[0210] Specifically, the first grounding terminal 711 and the second grounding terminal 722 are electrically connected to the reference ground GND. The electrical connection method includes, but is not limited to, direct soldering, or indirect electrical connection through coaxial lines, microstrip lines, conductive springs, conductive adhesives, etc. The reference ground GND can be an independent integral structure, or it can be multiple independent but electrically connected structures.

[0211] The reference ground GND provided in this application can be located inside the antenna assembly 100 or outside the antenna assembly 100 (e.g., inside the electronic device 1000 or within the electronic components of the electronic device 1000). Optionally, the antenna assembly 100 itself has a reference ground GND. Specific forms of this reference ground GND include, but are not limited to, a metal conductive plate, a metal conductive layer formed inside a flexible circuit board, or a rigid circuit board. When the antenna assembly 100 is located inside the electronic device 1000, the reference ground GND of the antenna assembly 100 is electrically connected to the reference ground of the electronic device 1000. Alternatively, the antenna assembly 100 itself may not have a reference ground GND, and the first ground terminal 711 and the second ground terminal 722 of the antenna assembly 100 may be directly electrically connected or indirectly electrically connected to the reference ground of the electronic device 1000 or the reference ground of the electronic components within the electronic device 1000 through conductive components. In this embodiment, the antenna assembly 100 is disposed on the electronic device 1000, which is a mobile phone. The reference ground of the electronic device 1000 is the magnesium-aluminum alloy plate of the support plate 330 of the mobile phone. The first ground terminal 711 and the second ground terminal 722 of the antenna assembly 100 are electrically connected to the magnesium-aluminum alloy plate. Subsequent electrical connections of other structures of the antenna assembly 100 to the reference ground GND can refer to any of the above-described embodiments of electrical connection to the reference ground GND.

[0212] Optional, please refer to Figure 31 The antenna assembly 100 further includes a third matching circuit M3. One end of the third matching circuit M3 is electrically connected to the third feed point A3, and the other end of the third matching circuit M3 is electrically connected to the first feed source 20. The third matching circuit M3 includes, but is not limited to, a capacitor, an inductor, a capacitor-inductor combination, a switching tuning device, etc. The third matching circuit M3 is used to tune the frequency band supported by the third radiator 70, so as to tune multiple resonant modes on the third radiator 70.

[0213] Optionally, the third radiator 70 provided in this embodiment is provided with the coupling slot 73. The third radiator 70 generates multiple resonant modes under the excitation of the first feed source 20. Optionally, the third radiator 70 supports at least 3 resonant modes to support more frequency bands.

[0214] Please see Figure 32The third radiator 70, under the excitation of the first feed source 20, generates at least a third resonant mode, a fourth resonant mode, and a fifth resonant mode to simultaneously support at least the MHB band, the UHB band, and the N78 band. The third, fourth, and fifth resonant modes each include at least one of a 1 / 4 wavelength mode, a 1 / 2 wavelength mode, a 3 / 4 wavelength mode, and a double wavelength mode.

[0215] Optionally, the third resonant mode (corresponding to) Figure 32 Mode 1) includes the 1 / 4 wavelength mode of the first sub-radiator 71 between the first ground terminal 711 and the first coupling terminal 712.

[0216] The first sub-radiator 71 between the first grounding terminal 711 and the first coupling terminal 712 generates a third resonant mode supporting the MHB frequency band (taking the B3 frequency band as an example) under the excitation of the first feed source 20. The resonant current corresponding to the third resonant mode operates in a 1 / 4 wavelength mode. The sum of the equivalent electrical length of the first matching circuit M1 and the electrical length of the first sub-radiator 71 between the first grounding terminal 711 and the first coupling terminal 712 is approximately 1 / 4 of the dielectric wavelength corresponding to the B3 frequency band, so as to generate the third resonant mode at the resonant frequency of the B3 frequency band.

[0217] Specifically, the resonant current distribution in the third resonant mode includes: the resonant current flows from the first grounding terminal 711 to the first coupling terminal 712. The direction of the resonant current flow can also be reversed, i.e., the resonant current flows from the first coupling terminal 712 to the first grounding terminal 711.

[0218] Optionally, the fourth resonant mode (corresponding to) Figure 32 Mode 2) includes the 1 / 4 wavelength mode of the first sub-radiator 71 between the third feed point A3 and the first coupling terminal 712, and the 1 / 4 wavelength mode of the second sub-radiator 72 between the second coupling terminal 721 and the second ground terminal 722.

[0219] The first sub-radiator 71 between the third feed point A3 and the first coupling terminal 712, and the second sub-radiator 72 between the second coupling terminal 721 and the second ground terminal 722, generate a fourth resonant mode supporting the MHB frequency band (taking the N41 frequency band as an example) under the excitation of the first feed source 20. The resonant current corresponding to the fourth resonant mode operates in a 1 / 4 wavelength mode. The electrical length of the first sub-radiator 71 between the first ground terminal 711 and the first coupling terminal 712 is approximately 1 / 4 times the dielectric wavelength corresponding to the N41 frequency band, and the electrical length of the second sub-radiator 72 between the second coupling terminal 721 and the second ground terminal 722 is approximately 1 / 4 times the dielectric wavelength corresponding to the N41 frequency band, so as to generate the fourth resonant mode at the resonant frequency of the N41 frequency band.

[0220] Specifically, the resonant current distribution of the fourth resonant mode includes: the resonant current flowing from the third feed point A3 to the first coupling terminal 712, and from the second coupling terminal 721 to the second ground terminal 722. The direction of the resonant current flow can also be reversed, i.e., the resonant current flows from the second ground terminal 722 to the second coupling terminal 721, and from the first coupling terminal 712 to the third feed point A3.

[0221] Optionally, the fifth resonant mode (corresponding to) Figure 32 Mode 3) includes the 1 / 4 wavelength mode of the first sub-radiator 71 between the third feed point A3 and the first coupling terminal 712 and the 1 / 4 wavelength mode of the second sub-radiator 72 between the second ground terminal 722 and the second coupling terminal 721.

[0222] The first sub-radiator 71 between the third feed point A3 and the first coupling terminal 712, and the second sub-radiator 72 between the second coupling terminal 721 and the second ground terminal 722, generate a fourth resonant mode supporting the UHB frequency band (taking the N78 frequency band as an example) under the excitation of the first feed source 20. The resonant current corresponding to the fourth resonant mode operates in a 1 / 4 wavelength mode. The electrical length of the first sub-radiator 71 between the first ground terminal 711 and the first coupling terminal 712 is approximately 1 / 4 times the dielectric wavelength corresponding to the N78 frequency band, and the electrical length of the second sub-radiator 72 between the second coupling terminal 721 and the second ground terminal 722 is approximately 1 / 4 times the dielectric wavelength corresponding to the N78 frequency band, so as to generate the fourth resonant mode at the resonant frequency of the N78 frequency band.

[0223] Specifically, the resonant current distribution in the fourth resonant mode includes: the resonant current flowing from the third feed point A3 to the first coupling terminal 712, and from the second ground terminal 722 to the second coupling terminal 721. The direction of the resonant current flow can also be reversed, i.e., the resonant current flows from the first coupling terminal 712 to the third feed point A3, and from the second coupling terminal 721 to the second ground terminal 722.

[0224] Optional, please refer to Figure 31 The antenna assembly 100 further includes a tuning circuit T1. One end of the tuning circuit T1 is electrically connected to the third matching circuit M3 or the third radiator 70, and the other end of the tuning circuit T1 is grounded. The tuning circuit T1 includes an antenna switch or an adjustable capacitor.

[0225] In the first embodiment of the tuning circuit T1, please refer to... Figure 33 The tuning circuit T1 further includes a switching circuit 731 and multiple tuning branches 732. One end of the switching circuit 731 is electrically connected to the third matching circuit M3 or the third radiator 70, and one end of each of the multiple tuning branches 732 is electrically connected to the other end of the switching circuit 731. That is, the switching circuit 731 is a single-pole multi-throw switch. The other ends of each of the multiple tuning branches 732 are grounded, and the multiple tuning branches 732 are used to tune the frequency band of the third radiator 70.

[0226] Each of the tuning branches 732 has a different impedance value. For example, the multiple tuning branches 732 may be multiple capacitors with different capacitance values; or, the multiple tuning branches 732 may be multiple inductors with different inductance values. By adjusting the electrical connection of the switching circuit 731 to different tuning branches 732, the impedance value of the tuning circuit T1 is adjusted, thereby adjusting the equivalent electrical length of the tuning branches 732, further adjusting the sum of the equivalent electrical length of the tuning branches 732 and the electrical length of the third radiator 70, and thus adjusting the size of the frequency band supported by the third radiator 70.

[0227] Optionally, the tuning branch 732 may include a capacitor or an inductor, may be a series connection of a capacitor and an inductor, may be a parallel connection of a capacitor and an inductor, may be a series connection of the above-mentioned device in parallel with a capacitor, may be a series connection of the above-mentioned device in parallel with an inductor, may be two of the above-mentioned series devices in parallel, may be two of the above-mentioned parallel devices in series, and so on.

[0228] In the second implementation of the tuning circuit T1, please refer to... Figure 34The tuning circuit T1 includes an adjustable capacitor 733, which is used to tune the frequency band supported by the third radiator 70. The adjustable capacitor 733 is a capacitor with an adjustable capacitance value. Thus, by adjusting the capacitance value of the capacitor, the impedance value of the tuning circuit T1 can be adjusted, thereby adjusting the equivalent electrical length of the tuning circuit T1. Furthermore, the sum of the equivalent electrical length of the tuning branch 732 and the electrical length of the third radiator 70 is adjusted, thereby adjusting the frequency band supported by the third radiator 70.

[0229] Of course, the tuning circuit T1 can also be a combination of the first and second embodiments described above. For example, the tuning branch 732 includes the adjustable capacitor 733.

[0230] Optionally, the MHB band includes, but is not limited to, the B3 band and N41 band listed above, and may also be other bands, such as at least one of the following: N1 band, N2 band, N3 band, N7 ​​band, N38 band, B1 band, B2 band, B3 band, B4 band, B7 band, B9 band, B10 band, B11 band, B21 band, B24 band, B25 band, B33-B43 band, etc.

[0231] Specifically, the equivalent impedance of the tuning circuit T1 can be changed by adjusting the switching circuit 731 of the tuning circuit T1 to switch to different tuning branches 732, thereby adjusting the equivalent electrical length on the third radiator 70 of the tuning circuit T1, and thus the tuning third radiator 70 can support any frequency band in the MHB band and any frequency band in the UHB band.

[0232] Please see Figure 32 and Figure 35 , Figure 32 yes Figure 31 The return loss curves of the antenna portions of the first feed 20, the first radiator 10, and the third radiator 70 in the antenna assembly shown are displayed. Figure 35 yes Figure 31 The return loss curves of the antenna portions of the second feed 80 and the second radiator 60 in the antenna assembly shown.

[0233] Antenna assembly 100 comprises a first sub-radiator 71, a coupling slot 73, a second sub-radiator 72, a first matching circuit M1, a tuning circuit T1, and a first feed 20. By tuning the first matching circuit M1 and the tuning circuit T1, it can generate the MHB+N78 frequency band (e.g., Figure 32 (Mid-wave return loss curve). Wherein, the 1 / 4 wavelength fundamental mode from the first ground terminal 711 to the coupling slot 73 (corresponding to...) Figure 31Mode 1) in the middle can generate the MB band (e.g., the B3 band). The 1 / 4 wavelength mode from the third feed point to the coupling slot 73 and the 1 / 4 wavelength mode from the coupling slot 73 to the second ground terminal 722 (corresponding to Figure 32 Mode 2) can generate the HB band (e.g., the N41 band). The 1 / 4 wavelength mode from the first ground terminal 711 to the coupling slot 73 and the balanced mode formed by the second ground terminal 722 to the coupling slot 73 (corresponding to) Figure 32 Mode 3 in the above-mentioned mode generates the N78 frequency band. The tuning circuit T1 can switch the position of the resonant frequency of the above-mentioned modes 1 to 3 by switching different logics to cover the entire MHB+UHB frequency band. The first radiator 10 can generate any frequency band by adjusting its length, area, and the first matching circuit M1 (such as adjusting its frequency band to the N79 frequency band in this embodiment). Figure 32 Mode 4 in the mid-return loss curve is a 1 / 4 wavelength mode from the first feed point A1 to point C in the first radiator 10 (corresponding to...). Figure 32 Mode 4 in the return loss curve. Since the first radiator 10 and the third radiator 70 use the first feed 20, the above four modes can be excited simultaneously, thus supporting the MHB+UHB+N79 frequency band simultaneously, for example, the MHB+N41+N78+N79 frequency band. The second radiator 60 can generate any frequency band by adjusting its length, area, and the second matching circuit M3 (e.g., in this embodiment, its frequency band is adjusted to the N79 frequency band, such as...). Figure 35 Mode 5 in the mid-return loss curve is a 1 / 4 wavelength mode from the second feed point A2 to E in the second radiator 60. Thus, this antenna assembly 100 is designed to cover a wide frequency band, simultaneously supporting LB+MHB+N41+N78+N79 (or other frequency bands), and multi-carrier aggregation (CA) mode, resulting in excellent performance. This can effectively improve the user experience.

[0234] This application provides an antenna assembly 100, including a frame antenna that supports the MHB+N78 frequency band, one or more bracket antennas that support the N79 frequency band, and a sensing chip 30 for detecting the detection distance of a human body approaching. The one or more antennas that support the N79 frequency band can also be FPC or LDS antennas, which serve as sensing chips for detecting the detection distance of a human body approaching.

[0235] The sensing area of ​​a single bracket antenna supporting the N79 band is relatively small, resulting in a short detection distance for detecting human proximity. This prevents the full utilization of the human proximity detection range, thus hindering the compliance of the specific absorption rate index of the electronic device 1000 while ensuring good communication performance. This application provides an antenna assembly 100 that supports the MHB+N78 band, consisting of a frame antenna, a dual bracket antenna (N79 band, LB, or any other band), conductive traces, a conductor sheet, and a sensing chip 30. The conductor sheet can be made using FPC, LDS, or PDS technology, does not participate in radiation, can be of any shape, and can be mounted on the conductive traces or not. If mounted on a conductive trace, it becomes an integral part of the conductive trace and the first radiator 10, serving as a sensing element for detecting the proximity of a human body. This increases the overall area compared to a single-support antenna, effectively increasing the sensing area and detection distance for detecting proximity of a human body. This fully utilizes the function of detecting proximity of a human body, allowing for effective power reduction at the board level. This significantly ensures compliance with the specific absorption rate (SRR) of the electronic device 100, greatly enhancing reliability. The dual-channel approach to human body detection is more sensitive, and even if one channel fails, the other can still detect, adding an extra layer of protection and further enhancing reliability. Furthermore, the antenna assembly 100 is designed to cover a wide frequency band, supporting LB / MHB+N41+N78+N79 (or other bands) and multiple CA states. This ensures that the antenna assembly 100, while effectively guaranteeing compliance with the SRR of the electronic device 100, also provides excellent communication performance, greatly improving the user experience and enhancing the brand image.

[0236] This application also provides a control method for an electronic device 1000, which is applied to the electronic device 1000 described in any of the above embodiments. Please refer to [link to relevant documentation]. Figure 36 and in conjunction with reference Figures 1 to 35 The method includes at least the following steps:

[0237] 110. Receive the sensing signal from the sensing chip 30.

[0238] Specifically, the processor of the electronic device 1000 (the processor being the controller described above or including the controller described above) is electrically connected to the sensing chip 30. The processor of the electronic device 1000 receives sensing signals from the sensing chip 30. The sensing signals include, but are not limited to, sensing capacitance.

[0239] 120. Determine whether the subject under test is close to the electronic device 1000 based on the sensing signal.

[0240] Taking the human body as an example, the sensing chip 30 sends the detected capacitance to the processor of the electronic device 1000 in the form of an electrical signal. The processor of the electronic device 1000 determines the change in distance between the human body and the sensing chip based on the change in capacitance. Specifically, it determines whether the human body is close to the electronic device 1000.

[0241] 130. When the subject under test approaches the electronic device 1000, reduce at least a portion of the radiated power of the antenna assembly 100.

[0242] Taking the human body as an example, when the processor of the electronic device 1000 determines that a human body is approaching the electronic device 1000 based on changes in the sensed signal, the processor of the electronic device 1000 controls at least a portion of the radiated power of the antenna assembly 100 to decrease. This application does not specify the exact amount of power reduction for the antenna assembly 100; the specific reduction amount can be set according to actual requirements, so that the electronic device 1000 can intelligently adjust its radiated power when the subject approaches, thereby intelligently reducing the specific absorption rate of the subject to electromagnetic signals to meet the SAR compliance requirements of the electronic device 1000.

[0243] This application is not limited to reducing the radiation power of the first radiator 10. Optionally, the radiation power of the third radiator 70 near the first radiator 10 can also be reduced to reduce the radiation power of the electronic device 1000 when the human body is near it, thereby reducing the specific absorption rate of the human body to electromagnetic waves.

[0244] Further, please refer to Figure 37 The method provided in this application embodiment further includes:

[0245] 140. Determine whether the subject under test is far away from the electronic device 1000 based on the sensing signal.

[0246] This step can be performed before, after, or simultaneously with step 120. Figure 37 This is just an example; if the result of step 120 is negative, then proceed to step 140.

[0247] 150. When the subject under test is far away from the electronic device 1000, the radiated power of at least a portion of the antenna assembly 100 remains unchanged or the radiated power of at least a portion of the antenna assembly 100 increases.

[0248] Taking the human body as an example, when the processor of the electronic device 1000 determines that the human body is moving away from the electronic device 1000 based on the change in the sensing signal, the processor of the electronic device 1000 controls at least a portion of the radiated power of the antenna assembly 100 to remain unchanged or increase. This application does not specifically limit the amount of increase in the radiated power of the antenna assembly 100; the specific increase can be set according to actual requirements, so that the electronic device 1000 can intelligently adjust its radiated power when the subject is moving away from the electronic device 1000, thereby meeting the SAR compliance requirements of the electronic device 1000 while also determining the antenna performance of the electronic device 1000.

[0249] Accordingly, this application is not limited to adjusting the radiation power of the first radiator 10; optionally, the radiation power of the third radiator 70 located near the first radiator 10 can also be adjusted.

[0250] The control method provided in this application receives a sensing signal from a sensing chip 30, determines whether the subject under test is close to the electronic device 1000 based on the sensing signal, and reduces at least a portion of the radiation power of the antenna assembly 100 when the subject under test is close to the electronic device 1000, so as to intelligently reduce the radiation power of the electronic device 1000 when the subject under test is close to the electronic device 1000, thereby intelligently reducing the specific absorption rate of the subject under test for electromagnetic wave signals; furthermore, it determines whether the subject under test is far away from the electronic device 1000 based on the sensing signal, and maintains or increases at least a portion of the radiation power of the antenna assembly 100 when the subject under test is far away from the electronic device 1000, so as to intelligently adjust the radiation power when the subject under test is far away from the electronic device 1000, thereby ensuring the communication performance of the electronic device 1000.

[0251] Because the electronic device 1000 in this application increases the sensing distance threshold of the antenna assembly 100 for sensing whether the subject under test is approaching by expanding its sensing area of ​​the subject under test, thereby improving the detection accuracy of whether the subject under test is close to or far from the electronic device 1000, it has higher sensitivity in intelligently reducing the specific absorption rate of the subject under test to electromagnetic wave signals, so as to meet the higher SAR compliance requirements of the electronic device 1000.

[0252] The above description represents some embodiments of this application. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of this application, and these improvements and modifications are also considered to be within the scope of protection of this application.

Claims

1. An electronic device, characterized in that, Includes a frame, a motherboard, and an antenna assembly, wherein the antenna assembly includes: A first radiator is disposed inside the frame and at least partially opposite the motherboard. The first radiator is located on the side of the motherboard facing the display screen or on the side of the motherboard facing the back cover. The first radiator has a first power feeding point. A first feed source, disposed on the motherboard, is electrically connected to the first feed point. The first feed source is used to excite the first radiator to transmit and receive at least one of the following frequency bands: LB band, MHB band, UHB band, Wi-Fi band, and GNSS band. A sensing chip is electrically connected to the first radiator. The sensing chip is used to receive at least the sensing signal generated by the first radiator when the subject under test approaches, and to determine whether the subject under test is approaching or moving away from the first radiator based on the sensing signal. The first conductive detection element is electrically connected to the first feed point. The first conductive detection element is used to generate an induction signal when the subject under test approaches. The clutter frequency band generated by the first conductive detection element is located at a low frequency position to reduce the impact on the frequency band supported by the first radiator.

2. The electronic device as claimed in claim 1, characterized in that, The sensing chip is also used to receive the sensing signal of the first conductive detection device when the first conductive detection device is electrically connected to the sensing chip, and to determine whether the subject under test is close to or far away from the first conductive detection device based on the sensing signal.

3. The electronic device as described in claim 1 or 2, characterized in that, The first conductive detection element includes a first conductive trace, one end of which is electrically connected to the first radiator, and the extension trajectory of the first conductive trace includes at least one of a straight line, a bend, and a curve. And / or, the first conductive detection element includes a first conductive sheet, which is electrically connected to the first radiator, and the first conductive sheet is solid or mesh-shaped.

4. The electronic device as claimed in claim 1, characterized in that, The antenna assembly further includes at least one first isolation device and a first matching circuit. The first isolation device is used to be in an open-circuit state for the induced signal, and one end of the first matching circuit is electrically connected to the first feed source. The first isolation device is electrically connected between the first feed point and the other end of the first matching circuit; Alternatively, the first radiator may also have a first grounding point for electrically connecting to a reference ground, one of the first isolation devices electrically connected between the first grounding point and the reference ground, and another of the first isolation devices electrically connected between the first feed point and the other end of the first matching circuit.

5. The electronic device as claimed in claim 4, characterized in that, The antenna assembly further includes a second isolation device, which is electrically connected between the first radiator and the sensing chip. The second isolation device is used to conduct the sensing signal generated by the first radiator when the subject under test approaches, and to open the radio frequency signal of the first radiator.

6. The electronic device as claimed in claim 1, characterized in that, The first radiator, under the excitation of the first feed source, is used to generate a first resonant mode to support the N79 band, wherein the first resonant mode includes a 1 / 4 wavelength mode, or a 1 / 2 wavelength mode, or a 3 / 4 wavelength mode, or a 1-times wavelength mode.

7. The electronic device as claimed in claim 1, characterized in that, The antenna assembly further includes at least one second radiator, which is disposed inside the frame and at least partially opposite to the motherboard. The second radiator is used to transmit and receive at least one of the LB band, MHB band, UHB band, Wi-Fi band, and GNSS band. The second radiator is electrically connected to the sensing chip and / or the first radiator. The second radiator is also used to generate a sensing signal when the subject under test approaches. The sensing chip is also used to receive the sensing signal of the second radiator when the second radiator is electrically connected to the sensing chip, and to determine whether the subject under test is approaching or moving away from the second radiator based on the sensing signal.

8. The electronic device as claimed in claim 7, characterized in that, The antenna assembly further includes at least one second conductive detection element, which is electrically connected between the first radiator and the second radiator; or, the second conductive detection element is electrically connected to the second radiator, and the second conductive detection element is not electrically connected to the first radiator.

9. The electronic device as claimed in claim 8, characterized in that, The first radiator, the second conductive detection element, and the second radiator are arranged adjacent to each other in sequence.

10. The electronic device as claimed in claim 8, characterized in that, The second conductive detection element includes a second conductive trace, which is electrically connected between the first radiator and the second radiator. The extension trajectory of the second conductive trace includes at least one of a straight line, a bend, and a curve. And / or, the second conductive detection element further includes a second conductive sheet, which is electrically connected between the first radiator and the second radiator, and the second conductive sheet is solid or mesh-shaped.

11. The electronic device as claimed in claim 8, characterized in that, The second radiator has a second feed point, and the antenna assembly further includes a second feed source, which is disposed on the main board and electrically connected to the second feed point.

12. The electronic device as claimed in claim 11, characterized in that, One end of the second conductive detection element is electrically connected to the first feed point, and the second conductive detection element is electrically connected to the second feed point.

13. The electronic device as claimed in claim 11, characterized in that, The antenna assembly further includes at least one third isolation device and a second matching circuit. The third isolation device is used to be in an open-circuit state for the induced signal, and one end of the second matching circuit is electrically connected to the second feed source. The third isolation device is electrically connected between the second feed point and the other end of the second matching circuit; Alternatively, the second radiator may also have a second grounding point for electrically connecting to a reference ground, one of the third isolation devices electrically connected between the second grounding point and the reference ground, and another of the third isolation devices electrically connected between the second feed point and the other end of the second matching circuit.

14. The electronic device as claimed in claim 13, characterized in that, The antenna assembly further includes a fourth isolation device, which is electrically connected between the second radiator and the sensing chip. The fourth isolation device is used to conduct the sensing signal generated by the second radiator when the subject under test approaches, and to open the radio frequency signal of the second radiator.

15. The electronic device as claimed in claim 7, characterized in that, The second radiator has a second feed point, which is electrically connected to the first feed source.

16. The electronic device as claimed in claim 7, characterized in that, The second radiator is used to generate a second resonant mode to support the N79 band, wherein the second resonant mode includes a 1 / 4 wavelength mode, or a 1 / 2 wavelength mode, or a 3 / 4 wavelength mode, or a 1-times wavelength mode.

17. The electronic device as described in any one of claims 1-2 and 4-16, characterized in that, The antenna assembly further includes a third radiator disposed on the frame, the third radiator being used to support at least one of the LB band, MHB band, UHB band, Wi-Fi band, and GNSS band.

18. The electronic device as claimed in claim 17, characterized in that, The third radiator has a third feed point, which is located adjacent to the first feed point and is electrically connected to the first feed source.

19. The electronic device as claimed in claim 18, characterized in that, The third radiator includes a first sub-radiator and a second sub-radiator. There is a coupling gap between the first sub-radiator and the second sub-radiator. The first sub-radiator has a first grounding terminal, the third feed point and a first coupling terminal arranged in sequence. The second sub-radiator has a second coupling terminal and a second grounding terminal. The coupling gap is between the first coupling terminal and the second coupling terminal.

20. The electronic device as claimed in claim 19, characterized in that, The third radiator generates at least a third resonant mode, a fourth resonant mode, and a fifth resonant mode under the excitation of the first feed source, so as to simultaneously support at least the MHB band, the UHB band, and the N78 band. The third resonant mode, the fourth resonant mode, and the fifth resonant mode each include at least one of a 1 / 4 wavelength mode, a 1 / 2 wavelength mode, a 3 / 4 wavelength mode, and a 1x wavelength mode.

21. The electronic device as claimed in claim 20, characterized in that, The third resonant mode includes the 1 / 4 wavelength mode of the first sub-radiator between the first ground terminal and the first coupling terminal; And / or, the fourth resonant mode includes a 1 / 4 wavelength mode of the first sub-radiator between the third feed point and the first coupling end, and a 1 / 4 wavelength mode of the second sub-radiator between the second coupling end and the second ground end; And / or, the fifth resonant mode includes a 1 / 4 wavelength mode of the first sub-radiator between the third feed point and the first coupling end, and a 1 / 4 wavelength mode of the second sub-radiator between the second ground end and the second coupling end.

22. The electronic device according to any one of claims 18-21, characterized in that, The antenna assembly further includes a third matching circuit and a tuning circuit. One end of the third matching circuit is electrically connected to the third feed point, and the other end of the third matching circuit is electrically connected to the first feed source. One end of the tuning circuit is electrically connected to the third matching circuit or the third radiator, and the other end of the tuning circuit is grounded. The tuning circuit includes an antenna switch or an adjustable capacitor.

23. A control method for an electronic device, characterized in that, The method is applied to the electronic device according to any one of claims 1-22, and the method includes: Receives sensing signals from the sensing chip; The system determines whether the subject under test is close to the electronic device based on the sensing signal, and reduces the radiated power of the antenna assembly by at least a portion when the subject under test is close to the electronic device.

24. The method as described in claim 23, characterized in that, The method further includes: The system determines whether the subject under test is far from the electronic device based on the sensing signal, and maintains at least a portion of the radiated power of the antenna assembly unchanged or increases at least a portion of the radiated power of the antenna assembly when the subject under test is far from the electronic device.

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