Electronic device with aluminum foil heat sink and aluminum foil heat sink

Abstract

An electronic device with an aluminum foil heat sink includes a housing, an electronic structure disposed within the housing, and an aluminum foil heat sink. The electronic structure has one or more heat source elements on its surface. The aluminum foil heat sink is a three-dimensional aluminum foil structure formed by stamping, and includes a bottom, a peripheral side, and a three-dimensional space formed between the bottom and the peripheral side. The bottom is thermally conductively connected to the heat source element, and at least a portion of the surface of the aluminum foil heat sink is thermally conductively connected to the inner surface of the housing. The present invention utilizes the characteristic that aluminum foil is easily extended into a three-dimensional shape during processing, and dissipates heat generated by the heat source element to the surrounding area through the three-dimensional aluminum foil that can closely adhere to the inner surface of the housing with a larger contact area, thereby achieving a better heat dissipation effect.

Description

Technical Field

[0001] The present invention relates to a structure of an electronic device, and in particular to an electronic device with an aluminum foil radiator and the aluminum foil radiator. Background Art

[0002] The heat sources of existing electronic devices are concentrated in chips such as the central processing unit, memory and signal processing unit. These chips have a maximum operating temperature. If the temperature of the chip exceeds the limit, it will fail or errors will occur when processing signals.

[0003] To address the aforementioned issues, a heat sink is typically installed on the chip to direct the heat source of the chip to the air for heat convection, or to a copper column or housing for heat conduction. However, these heat conduction heat sinks are flat metal sheets that can only conduct heat through a limited area of contact with the tortuous shape of the housing via a thermal pad. Consequently, the heat dissipation performance is poor and needs to be improved. Summary of the Invention

[0004] In view of this, an object of the present invention is to provide an electronic device with a three-dimensional aluminum foil heat sink, wherein the aluminum foil heat sink is stamped and has a three-dimensional structure, thereby achieving better heat dissipation efficiency.

[0005] To achieve the above-mentioned objectives, the present invention provides an electronic device having an aluminum foil heat sink, comprising a housing, an electronic structure, and an aluminum foil heat sink. The electronic structure is disposed within the housing and has one or more heat source elements on its surface. The aluminum foil heat sink is a three-dimensional aluminum foil structure formed by stamping, comprising a bottom and a peripheral side portion connected to the bottom, forming a three-dimensional space between the bottom and the peripheral side portion. The bottom is thermally conductively connected to the heat source element, and at least a portion of the surface of the aluminum foil heat sink is thermally conductively connected to the inner surface of the housing.

[0006] The effect of the present invention is that, since the aluminum foil heat sink is a stamped aluminum foil, the aluminum foil heat sink can be processed into a shape that can adapt to the shape of the shell, thereby expanding the area of the aluminum foil heat sink used to connect to the shell or contact with the air, having a better heat convection or heat conduction effect, improving the heat dissipation efficiency of the electronic device and reducing the temperature of the heat source element, so that the heat source element can also operate well in a higher room temperature environment.

[0007] A further advantage of the present invention is that the aluminum foil heat sink has a three-dimensional shape with a bottom and surrounding sides, and the three-dimensional space within it can accommodate electronic components. When the electronic components are accommodated within the three-dimensional space of the aluminum foil heat sink, the available space between the housing and the electronic components is effectively utilized, making the arrangement of the electronic components and the aluminum foil heat sink within the housing more compact while also achieving excellent heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a three-dimensional diagram of a preferred embodiment of the present invention.

[0009] Figure 2 It is a three-dimensional exploded view of the above preferred embodiment of the present invention.

[0010] Figure 3 This is a three-dimensional exploded view from another angle of the preferred embodiment of the present invention.

[0011] Figure 4 It is a side view of the above preferred embodiment of the present invention.

[0012] Figure 5 for Figure 4 Cross-sectional view in the 5-5 direction.

[0013] Figure 6 for Figure 4 Cross-sectional view in the 6-6 direction.

[0014] Figure 7 for Figure 4 Cross-sectional view in the direction 7-7.

[0015] Figure 8 This is a rear view of the preferred embodiment of the present invention with the rear housing and aluminum foil heat sink removed.

[0016] Figure 9 for Figure 3 Exploded view of the aluminum foil heat sink being replaced with a flat plate heat sink. DETAILED DESCRIPTION

[0017] In order to explain the present invention more clearly, preferred embodiments are given and described in detail with reference to the accompanying drawings. Figures 1 to 7 FIG. 1 shows an electronic device 100 with an aluminum foil heat sink according to a preferred embodiment of the present invention, which includes a housing 10 , an electronic structure 20 , and an aluminum foil heat sink 30 .

[0018] The shell 10 can be a shell made of metal such as aluminum-magnesium alloy, plastic or composite materials, and the form of the shell composition can be changed according to design requirements. In the preferred embodiment, the shell 10 is a plastic shell, and the shell 10 has a rear shell 12 and a front cover 14. The rear side of the rear shell 12 has a back plate 121 and the front side has an opening 122. The interior of the rear shell 12 has an installation space 123. The front cover 14 is combined with the opening 122 of the rear shell 12 and closes the installation space 123.

[0019] The electronic structure 20 is arranged in the shell 10, and the surface of the electronic structure 20 has more than one heat source element 22. In this preferred embodiment, the electronic structure 20 is arranged in the shell 10 and connected to the front cover 14, and the back of the electronic structure 20 has three-chip heat source elements 22.

[0020] The aluminum foil heat sink 30 is a three-dimensional aluminum foil structure made by stamping. The aluminum foil heat sink 30 is arranged in the installation space 123 and includes a bottom 32 and a peripheral side portion 34 connected to the bottom 32. A three-dimensional space 36 is formed between the bottom 32 and the peripheral side portion 34. In this preferred embodiment, the rear side of the electronic structure 20 is accommodated in the three-dimensional space 36. The bottom 32 is thermally conductively connected to the multiple heat source elements 22. At least a portion of the surface of the aluminum foil heat sink 30 is coated with thermally conductive adhesive and is thermally conductively connected to the inner surface of the shell 10. In this preferred embodiment, the entire surface of the aluminum foil heat sink 30 is coated with thermally conductive adhesive and is thermally conductively connected to the inner surface of the shell 10.

[0021] The present invention benefits from the stamped aluminum foil structure of the aluminum foil radiator 30. The shape of the aluminum foil radiator 30 can be designed to conform to the undulating shape of the inner surface of the outer shell 10, so that the surface of the aluminum foil radiator 30 can be partially or even completely connected to the inner surface of the outer shell 10 through heat conduction, thereby achieving a better heat dissipation effect. In addition, the three-dimensional structure of the aluminum foil radiator 30 extending from the bottom 32 to the surrounding area to the peripheral side 34 can cover a larger range than a plane, which can increase the heat dissipation area of air convection or heat conduction, improve the heat dissipation efficiency of the aluminum foil radiator 30, and effectively reduce the temperature of the multiple heat source elements 22.

[0022] In addition, the aluminum foil heat sink 30 is a three-dimensional structure having the bottom 32 and the peripheral side 34. Therefore, compared with a flat heat sink, it can make good use of the installation space 123 in the housing 10. When part of the electronic structure 20 is accommodated in the three-dimensional space 36, it is particularly highlighted that the aluminum foil heat sink 30, which is light, thin, easily changeable in shape and has good thermal conductivity, can make full use of the available space between the housing 10 and the electronic structure 20. The three-dimensional aluminum foil heat sink 30 can be set in the housing 10 without increasing the volume of the housing 10.

[0023] In addition to the preferred embodiment described above, in which a portion of the electronic structure 20 is accommodated in the three-dimensional space 36 of the aluminum foil heat sink 30, in other preferred embodiments, the aluminum foil heat sink 30 can also be installed in reverse. In this case, the aluminum foil heat sink 30 is thermally conductively connected to the multiple heat source elements 22 with the bottom 32, and the peripheral side portion 34 is exposed to the air for convection heat dissipation, or the surface of the peripheral side portion 34 is thermally conductively connected to an object, for example, thermally conductively connected to the inner surface of the housing 10, to achieve the effect of outward heat conduction and heat dissipation.

[0024] Further explanation of other structures of the above preferred embodiments of the present invention. Figures 2 to 7 As shown, the left and right sides of the electronic structure 20 are provided with two pillars 26 respectively connected to the front cover 14 by screws, and a plurality of component openings 16 are provided on the back plate 121 of the rear shell 12. The electronic structure 20 is provided with a plurality of electronic components 24 respectively extending backward to each of the component openings 16. In accordance with the position and number of the plurality of pillars 26 and the electronic components 24, corresponding through-holes 38 are provided on the aluminum foil heat sink 30. Each of the through-holes 38 is used for each of the pillars 26 or each of the electronic components 24 to pass through. The plurality of through-holes 38 are formed by the aluminum foil heat sink 30 after being stamped and then cut by a tool.

[0025] The multiple heat source elements 22 of the electronic structure 20 are spaced a certain distance from the back plate 121 of the housing 10. When the bottom 32 of the aluminum foil heat sink 30 is coated with thermally conductive adhesive and thermally connected to the inner surface of the housing 10, considering that a flat surface of the bottom 32 would not contact the multiple heat source elements 22, or that in other preferred embodiments, the multiple heat source elements 22 may have different heights (thicknesses), when stamping the aluminum foil heat sink 30, one or more convex shell portions 321 are stamped on the bottom 32 at positions corresponding to the multiple heat source elements 22 and corresponding to the spacing between the bottom 32 and each of the heat source elements 22 when the aluminum foil heat sink 30 is installed. As described in this preferred embodiment, the bottom 32 has three columnar convex shell portions 321, each of which protrudes toward the direction of each heat source element 22, and a contact surface 322 is formed on the top side of each convex shell portion 321. A thermal pad 221 is adhered to each contact surface 322 to be thermally connected to each heat source element 22.

[0026] In order to provide additional support for the multiple convex shell portions 321 and enable the aluminum foil heat sink 30 to be attached to the inner surface of the outer shell 10, the outer shell 10 forms one or more support columns 124 on the inner surface of the back plate 121. In this preferred embodiment, the back plate 121 has three support columns 124, each of which is embedded in each of the convex shell portions 321 to support the convex shell portions 321. The surface of each convex shell portion 321 facing away from the contact surface 322 is used for each of the 124 support columns to be embedded. The surface of each convex shell portion 321 facing away from the contact surface 322 is coated with thermal conductive glue and is thermally conductively connected to each of the support columns 124. To further enhance the heat dissipation performance of the aluminum foil heat sink 30, a copper post hole 125 is provided in the rear housing 12 of the outer casing 10. Connected to the periphery of the copper post hole 125 is a copper post tube 126 protruding toward the front cover 14. A copper post 127 with a screw hole is embedded and fixed within the copper post tube 126. The bottom 32 of the aluminum foil heat sink 30 features a stamped copper post cover 323. This cover 323 fits over the copper post tube 126 and forms a copper post contact surface 324 adjacent to the copper post 127. This copper post contact surface 324 is coated with thermally conductive adhesive and thermally conductively connected to the copper post 127, enabling the aluminum foil heat sink 30 to transfer heat from the multiple heat source components 22 outward through the copper post 127.

[0027] When the electronic device 100 with the aluminum foil heat sink is in operation, the following measurements are made: Figure 8 The temperatures of the three heat source elements 22 at the measuring points A, B and C are measured. The aluminum foil heat sink 30 of the electronic device 100 having the aluminum foil heat sink is as shown. Figure 9 The heat sink 30A was replaced with a conventional flat plate heat sink and then operated. Measurements were then taken at the same measurement points A, B, and C. These points A, B, and C measure the CPU, memory, and signal chip, respectively. The temperature limits for these three heat source components 22 are 125°C, 110°C, and 110°C, respectively.

[0028] The temperatures measured at measurement points A, B, and C when using the flat plate heat sink 30A and the aluminum foil heat sink 30, their specification margins from the limit temperatures, and the result judgments are shown in Table 1 below:

[0029] Table 1. Temperatures measured at measurement points A, B, and C, specification margins, and result judgments

[0030]

[0031] As can be seen from the above table, when the aluminum foil heat sink 30 is used in the above preferred embodiment of the present invention, the temperatures of the plurality of heat source elements 22 measured at measurement points A, B, and C all have a specification margin of more than tens of degrees Celsius, which is better than when the flat plate heat sink 30A is used for heat dissipation.

[0032] The above description is only a preferred embodiment of the present invention. Any equivalent changes made by applying the description of the present invention and the scope of the patent application should be included in the patent scope of the present invention.

[0033] Description of Reference Numerals

[0034] [The present invention]

[0035] 100: Electronic device with aluminum foil heat sink

[0036] 10: Shell

[0037] 12: Back shell

[0038] 121: Back panel

[0039] 122: Opening

[0040] 123: Installation space

[0041] 124: Support column

[0042] 125: Copper pillar hole

[0043] 126: Copper column tube

[0044] 127: Copper Pillar

[0045] 14: Front cover

[0046] 16: Component opening

[0047] 20: Electronic structure

[0048] 22: Heat source element

[0049] 221: Thermal pad

[0050] 24: Electronic components

[0051] 26: Pillar

[0052] 30: Aluminum foil radiator

[0053] 30A: Flat plate radiator

[0054] 32: bottom

[0055] 321: convex shell

[0056] 322: Contact surface

[0057] 323: Copper column cover

[0058] 324: Copper pillar contact surface

[0059] 34: Side of the body

[0060] 36: Three-dimensional space

[0061] 38: Through the mouth

Claims

1. An electronic device having an aluminum foil heat sink, comprising: A housing having an installation space therein; The inner surface of the housing has one or more support columns; an electronic structure disposed in the housing and having one or more heat source elements on a surface of the electronic structure; as well as An aluminum foil radiator is arranged in the installation space. The aluminum foil radiator is a three-dimensional aluminum foil structure made by stamping and includes a bottom and a peripheral side portion connected to the bottom, forming a three-dimensional space between the bottom and the peripheral side portion. The bottom has one or more convex shell portions, which protrude toward the heat source element and form a contact surface on the top side. A thermal pad is adhered to the contact surface to thermally connect to the heat source element. The support column is embedded in the convex shell portion. The surface of the convex shell portion is coated with thermally conductive glue and is thermally connected to the support column. At least a portion of the surface of the aluminum foil radiator is thermally connected to the inner surface of the outer shell.

2. The electronic device having an aluminum foil heat sink according to claim 1, wherein: The surfaces of the aluminum foil heat sink adjacent to the shell are coated with thermal conductive adhesive and are connected to the inner surface of the shell in a thermally conductive manner.

3. The electronic device with an aluminum foil heat sink according to claim 1 or 2, wherein: At least a portion of the electronic structure is accommodated in the three-dimensional space.

4. The electronic device with an aluminum foil heat sink according to claim 1 or 2, wherein: The shell has a copper column hole, a copper column tube is connected to the periphery of the copper column hole, a copper column is embedded and fixed in the copper column tube, and the bottom has a copper column cover, which covers the copper column tube and forms a copper column contact surface on the surface adjacent to the copper column. The copper column contact surface is coated with thermal conductive glue and is thermally conductively connected to the copper column.

5. The electronic device having an aluminum foil heat sink as claimed in claim 3, wherein: The shell has a copper column hole, a copper column tube is connected to the periphery of the copper column hole, a copper column is embedded and fixed in the copper column tube, and the bottom has a copper column cover, which covers the copper column tube and forms a copper column contact surface on the surface adjacent to the copper column. The copper column contact surface is coated with thermal conductive glue and is thermally conductively connected to the copper column.

6. The electronic device having an aluminum foil heat sink according to claim 5, wherein: The aluminum foil heat sink has one or more through-holes, and the through-holes are used for allowing a part of the housing or the electronic structure to pass through.

7. An aluminum foil heat sink for an electronic device, which is a three-dimensional aluminum foil structure made by stamping and includes a bottom and a peripheral side portion connected to the bottom, forming a three-dimensional space between the bottom and the peripheral side portion, and the bottom is used to thermally connect to the heat source element of the electronic device; the bottom has one or more convex shell portions, and the top side of the convex shell portion forms a contact surface, and the contact surface is used to thermally connect to the heat source element of the electronic device; the surface of the convex shell portion facing away from the contact surface is used for the support column of the housing of the electronic device to be embedded, and the surface of the convex shell portion facing away from the contact surface is coated with thermal conductive glue and is thermally connected to the support column.

8. The aluminum foil heat sink for electronic devices according to claim 7, wherein: The aluminum foil radiator has more than one through-hole, and the through-hole is formed by stamping the aluminum foil radiator and then cutting it with a tool.

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