Photosensitive resin composition, photosensitive material containing the same, black matrix and electronic component

Abstract

The present disclosure relates to a photosensitive resin composition, a photosensitive material including the same, a black matrix including the same, and an electronic device including the same.

Description

Technical Field

[0001] This disclosure claims priority to and the benefit of Korean Patent Application No. 10-2020-0148439, filed on November 9, 2020, in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference.

[0002] The present disclosure relates to a photosensitive resin composition, a photosensitive material including the same, a black matrix including the same, and an electronic device including the same. Background Art

[0003] For the purpose of enhancing contrast, a grid black pattern called a black matrix is ​​usually provided between the colored pixels of the color filter. In the existing black matrix, a method of depositing and etching chromium (Cr) as a pigment to form a pattern can be used on the entire glass substrate, but, in the process, high cost is required, and the problem of the high reflectivity of chromium, the problem of environmental pollution caused by chromium waste liquid, etc. have occurred. Due to this reason, research on the black matrix using a pigment dispersion method capable of micro-processing has been actively carried out, and research on preparing a black composition with a coloring pigment other than carbon black has also been carried out. However, the coloring pigment other than carbon black has weak light-shielding properties, so it is necessary to increase its mixing amount to a very large amount, and therefore, the following problem has occurred: the viscosity of the composition increases and is difficult to handle, or significantly reduces the strength of the film formed, or the adhesion to the substrate.

[0004] Therefore, research on a photosensitive resin composition having excellent pattern adhesion, processing characteristics, etc. is required.

[0005] Furthermore, interlayer insulating films and surface protective films for semiconductor devices require excellent mechanical properties and high heat resistance, and polyimide-based binder resins, which offer these properties, have been used. Negative-type photosensitive polyimides have relatively excellent mechanical properties, but have difficulty achieving high resolution. Positive-type photosensitive polyimides can achieve relatively high resolution, but have difficulty achieving satisfactory mechanical properties.

[0006] Therefore, there is a need to develop photosensitive materials that satisfy both high resolution and mechanical properties.

[0007] Prior art literature

[0008] (Patent Document 1) Korean Patent Application Publication No. 10-2014-0096423 Summary of the Invention

[0009] Technical issues

[0010] The present disclosure relates to providing a photosensitive resin composition, a photosensitive material including the same, a black matrix including the same, and an electronic device including the same.

[0011] Technical Solution

[0012] One embodiment of the present disclosure provides a photosensitive resin composition including: an alkali-soluble polyimide resin including repeating units represented by the following Chemical Formulas 1 to 3; and a solvent.

[0013] [Chemical Formula 1]

[0014]

[0015] [Chemical Formula 2]

[0016]

[0017] [Chemical Formula 3]

[0018]

[0019] In Chemical Formulas 1 to 3,

[0020] X1 to X3 are the same as or different from each other and are each independently a tetravalent organic group,

[0021] Y1 to Y3 are the same as or different from each other and are each independently a divalent organic group, and

[0022] Y2 includes a group represented by the following chemical formula A,

[0023] [Chemical Formula A]

[0024]

[0025] In chemical formula A,

[0026] R7 is hydrogen; deuterium; a hydroxyl group; a halogen group; a nitro group; a nitrile group; a substituted or unsubstituted alkyl group; a substituted or unsubstituted alkenyl group; a substituted or unsubstituted alkynyl group; a substituted or unsubstituted alkoxy group; a substituted or unsubstituted aryloxy group; a substituted or unsubstituted cycloalkyl group; a substituted or unsubstituted aryl group; a substituted or unsubstituted heterocyclic group; or a photopolymerizable unsaturated group,

[0027] means a site bonding to Y2 of Chemical Formula 2, and

[0028] m to p are each independently an integer of 1 to 500.

[0029] In the photosensitive resin composition provided in one embodiment of the present disclosure, with respect to m to p of Chemical Formulas 1 to 3, p / (m+n+p) is 0.03 to 0.15.

[0030] One embodiment of the present disclosure provides a black matrix including the above-mentioned photosensitive resin composition.

[0031] One embodiment of the present disclosure provides an electronic device including a black matrix.

[0032] Beneficial effects

[0033] The photosensitive resin composition according to one embodiment of the present disclosure and a black matrix including the same have enhanced heat resistance characteristics.

[0034] The photosensitive resin composition according to one embodiment of the present disclosure and the black matrix including the same generate reduced amounts of outgassing during a process such as development.

[0035] According to one embodiment of the present disclosure, an electronic device including a black matrix having excellent heat resistance or a small amount of outgassing generated in a process such as development may be provided. DETAILED DESCRIPTION

[0036] Hereinafter, the present disclosure will be described in detail.

[0037] One embodiment of the present disclosure provides a photosensitive resin composition including: an alkali-soluble polyimide resin including repeating units represented by the following Chemical Formulas 1 to 3; and a solvent.

[0038] [Chemical Formula 1]

[0039]

[0040] [Chemical Formula 2]

[0041]

[0042] [Chemical Formula 3]

[0043]

[0044] In Chemical Formulas 1 to 3,

[0045] X1 to X3 are the same as or different from each other and are each independently a tetravalent organic group,

[0046] Y1 to Y3 are the same as or different from each other and are each independently a divalent organic group, and

[0047] Y2 includes a group represented by the following chemical formula A,

[0048] [Chemical Formula A]

[0049]

[0050] In chemical formula A,

[0051] R7 is hydrogen; deuterium; a hydroxyl group; a halogen group; a nitro group; a nitrile group; a substituted or unsubstituted alkyl group; a substituted or unsubstituted alkenyl group; a substituted or unsubstituted alkynyl group; a substituted or unsubstituted alkoxy group; a substituted or unsubstituted aryloxy group; a substituted or unsubstituted cycloalkyl group; a substituted or unsubstituted aryl group; a substituted or unsubstituted heterocyclic group; or a photopolymerizable unsaturated group,

[0052] means a site bonding to Y2 of Chemical Formula 2, and

[0053] m to p are each independently an integer of 1 to 500.

[0054] The photosensitive resin composition including an alkali-soluble polyimide resin according to one embodiment of the present disclosure has excellent adhesion to a substrate used in a display device such as an organic light emitting diode.

[0055] In addition, the photosensitive resin composition including the alkali-soluble polyimide resin according to one embodiment of the present disclosure has excellent mechanical properties such as heat resistance or chemical resistance. Therefore, side reactions during the process are reduced, which reduces the amount of outgassing generated during processes such as development.

[0056] The photosensitive resin composition including an alkali-soluble polyimide resin having a closed ring structure (imide structure) and a non-closed ring structure at a specific ratio according to one embodiment of the present disclosure prevents solubility reduction or swelling caused by ring closure of a side chain during development.

[0057] In the present disclosure, description that a certain member is placed “on” another member includes not only a case where the certain member is in contact with another member but also a case where another member exists between the two members.

[0058] In the present disclosure, unless otherwise specified, a description that a part “includes” a certain constituent element means that other constituent elements can also be included, and does not exclude other constituent elements.

[0059] In the present disclosure, unless otherwise defined, all technical terms and scientific terms used in the present disclosure have the same implication as the terms generally understood by those skilled in the art. Although methods and materials similar or equivalent to the methods and materials described in the present disclosure can be used when implementing or testing the embodiments of the present disclosure, suitable methods and materials are described later. All publications, patent applications, patents and other references mentioned in the present disclosure are incorporated into the present disclosure by reference as a whole, and unless specific paragraphs are mentioned, when conflict, the present disclosure including definition has priority. In addition, materials, methods and examples are only for illustrative purposes, and do not limit the present disclosure.

[0060] Examples of the substituent in the present disclosure are described below, however, the substituent is not limited thereto.

[0061] In this disclosure, It refers to the site of attachment.

[0062] In the present disclosure, the term "substituted" means that a hydrogen atom bonded to a carbon atom of a compound is changed to another substituent, and the position of substitution is not limited as long as it is a position where the hydrogen atom is substituted (i.e., a position where a substituent can replace), and when two or more substituents are substituted, the two or more substituents may be the same as or different from each other.

[0063] In the present disclosure, the term "substituted or unsubstituted" means substituted with one or more substituents selected from the group consisting of deuterium, a halogen group, a cyano group, an alkyl group, a cycloalkyl group, an alkoxy group, an aryloxy group, an aryl group, and a heterocyclic group, or substituted with a substituent in which two or more of the substituents exemplified above are linked, or having no substituent.

[0064] In the present disclosure, the halogen group is a fluoro group (—F), a chloro group (—Cl), a bromo group (—Br), or an iodo group (—I).

[0065] In the present disclosure, the alkyl group may be linear or branched, and although not particularly limited thereto, the number of carbon atoms may be 1 to 20. According to another embodiment, the number of carbon atoms of the alkyl group is 1 to 10. Specific examples of the alkyl group may include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, tert-butyl, n-pentyl, n-hexyl, n-heptyl, and the like, but are not limited thereto.

[0066] In the present disclosure, alkenyl includes linear or branched groups having 2 to 60 carbon atoms, and may be further substituted with another substituent. The number of carbon atoms in the alkenyl group may be 2 to 60, specifically 2 to 40, more specifically 2 to 20. Specific examples thereof may include vinyl, 1-propenyl, isopropenyl, 1-butenyl, 2-butenyl, 3-butenyl, etc., but are not limited thereto.

[0067] In the present disclosure, the alkynyl group includes linear or branched groups having 2 to 60 carbon atoms, and may be further substituted with another substituent. The number of carbon atoms in the alkynyl group may be 2 to 60, specifically 2 to 40, more specifically 2 to 20.

[0068] In the present disclosure, cycloalkyl can include monocyclic or polycyclic rings with 3 to 60 carbon atoms, and can be further substituted with another substituent. In this article, polycyclic means a group in which the cycloalkyl is directly connected or fused to other cyclic groups. In this article, other cyclic groups can be cycloalkyl, but can also be different types of cyclic groups, such as heterocycloalkyl, aryl, heteroaryl, etc. The number of carbon atoms in the cycloalkyl can be 3 to 60, specifically, 3 to 40, more specifically, 5 to 20. Specific examples thereof can include cyclopropyl, cyclobutyl, cyclopentyl, 3-methylcyclopentyl, etc., but are not limited thereto.

[0069] In the present disclosure, the alkoxy group may be linear or branched. The number of carbon atoms in the alkoxy group is not particularly limited, but may be 1 to 20. Specific examples of the alkoxy group may include methoxy, ethoxy, n-propoxy, n-butoxy, tert-butoxy, n-pentoxy, n-hexyloxy, n-octyloxy, n-nonyloxy, n-decyloxy, etc., but are not limited thereto.

[0070] In the present disclosure, aryloxy means -ORaryloxy, and Raryloxy means aryl.

[0071] In the present disclosure, the aryl group is not particularly limited, but may have 6 to 60 carbon atoms and may be a monocyclic aryl group or a polycyclic aryl group. According to one embodiment, the number of carbon atoms of the aryl group is 6 to 30. According to one embodiment, the number of carbon atoms of the aryl group is 6 to 20. When the aryl group is a monocyclic aryl group, examples thereof may include phenyl, biphenyl, terphenyl, etc., but are not limited thereto. Examples of polycyclic aryl groups may include naphthyl, anthracenyl, phenanthrenyl, pyrenyl, phenylene, triphenylene, fluorenyl, etc., but not limited thereto.

[0072] In the present disclosure, the fluorenyl group may be substituted, and two substituents may be bonded to each other to form a spirocyclic structure. When the fluorenyl group is substituted, a spirofluorenyl group such as Substituted fluorenyl groups such as (9,9-Dimethylfluorenyl) (9,9-diphenylfluorenyl), etc. However, the structure is not limited thereto.

[0073] In the present disclosure, the heteroaryl group is an aromatic cyclic group containing one or more of N, O, P, S, Si and Se as a heteroatom, and although not particularly limited thereto, the number of carbon atoms may be 2 to 60. According to one embodiment, the number of carbon atoms of the heteroaryl group is 2 to 30. Examples of the heteroaryl group may include pyridyl, pyrrolyl, pyrimidinyl, pyridazinyl, furyl, thienyl, benzothienyl, benzofuranyl, dibenzothienyl, dibenzofuranyl and the like, but are not limited thereto.

[0074] In the present disclosure, "monomer" refers to a unit compound that can be converted into a polymer compound through a polymerization reaction, and can be a repeating unit in a polymer or copolymer. Specifically, this means that the corresponding compound is polymerized and bonded to the polymer, and all or part of two or more substituents are removed from the structure of the corresponding compound, and a group for bonding to other units of the polymer is positioned in its place. In this article, the corresponding compounds can be polymerized in any order and included in the polymer in a bonded state.

[0075] In the present disclosure, unless specifically defined otherwise, the description of molecular weight means weight average molecular weight.

[0076] The weight average molecular weight is one of average molecular weights in which the molecular weight is not uniform and uses the molecular weight of a certain polymer material as a reference, and is a value obtained by averaging the molecular weights of component molecular species of a polymer compound having a molecular weight distribution by weight fraction.

[0077] The weight average molecular weight can be measured using gel permeation chromatography (GPC). In the process of using the GPC method to measure the weight average molecular weight, known analyzers, detectors such as refractive index detectors and analytical columns can be used, and the temperature conditions, solvents, solvent rates, etc. commonly used can be applied. As a specific example of measurement conditions, using Polymer Laboratories PLgel MIX-B 300mm length column and Waters PL-GPC220 device, the evaluation temperature is 160 ° C, using 1,2,4-trichlorobenzene as solvent, flow rate is 1mL / minute, the sample is prepared to have a concentration of 10mg / 10mL and supplied in an amount of 200μL, and the Mw value can be obtained using the calibration curve formed using polystyrene standards. As molecular weights of polystyrene standards, nine types of 2,000 / 10,000 / 30,000 / 70,000 / 200,000 / 700,000 / 2,000,000 / 4,000,000 / 10,000,000 were used.

[0078] In the present disclosure, the acryloyl group is not particularly limited, but preferably has 3 to 40 carbon atoms, and the description of the acryloyl group can be applied to the acrylate group. In addition, examples of the acryloyl group or acrylate group can include methyl acrylate, ethyl acrylate, methacrylate, 3-(acryloyloxy)propyl methacrylate, etc., but are not limited thereto.

[0079] In the present disclosure, the unsaturated group in the photopolymerizable unsaturated group means a functional group, substituent or organic group comprising an unsaturated bond. An unsaturated bond refers to a state in which another element can be bonded to carbon in addition, and can specifically mean a double bond or a triple bond. Specific examples of the functional group, substituent or organic group with an unsaturated bond can include an unsaturated double bond functional group or an unsaturated triple bond functional group, such as propargyl, wherein conjugated vinyl, acryloyl, methacryloyl etc. can be included. In addition, in terms of stability, the number of functional groups included can be 1 to 4, and the functional groups can each be the same or different from each other. In addition, the photopolymerizable in the photopolymerizable unsaturated group can mean the characteristic of polymerization by the action of a photopolymerization initiator or light.

[0080] In the present disclosure, alkali solubility refers to the property of increasing solubility in alkaline materials (developer solution, etc.) by being dissociated by acid. For example, an alkali-soluble resin and an alkali-soluble group refer to a resin and a substituent, respectively, that have increased solubility in alkaline developer solution by being dissociated by acid. Alkali-soluble groups include alkali-soluble hydroxyl groups. Examples of such alkali-soluble hydroxyl groups may include, but are not limited to, phenolic hydroxyl groups.

[0081] In the present disclosure, the content of A1 relative to A may be expressed such that "the content of A1 is 1 to 10 parts by weight relative to A", "A1 is contained in 1 to 10 parts by weight relative to A", etc., however, the expression is not limited thereto.

[0082] According to one embodiment of the present disclosure, the photosensitive resin composition includes at least one of a binder resin and a colorant.

[0083] According to one embodiment of the present disclosure, the photosensitive resin composition includes a binder resin.

[0084] According to one embodiment of the present disclosure, the photosensitive resin composition includes a colorant.

[0085] According to one embodiment of the present disclosure, at least one of the binder resin and the colorant includes an alkali-soluble polyimide resin.

[0086] According to one embodiment of the present disclosure, the binder resin includes an alkali-soluble polyimide resin.

[0087] According to one embodiment of the present disclosure, the binder resin is the alkali-soluble polyimide resin according to one embodiment of the present disclosure.

[0088] According to one embodiment of the present disclosure, the binder resin may be contained in an amount of 15 to 50 parts by weight, or 20 to 45 parts by weight, relative to 100 parts by weight of the solid content of the photosensitive resin composition (solid content excluding the solvent in the photosensitive resin composition). As a preferred example, the binder resin may be contained in an amount of 35 to 45 parts by weight, relative to 100 parts by weight of the solid content of the photosensitive resin composition (solid content excluding the solvent in the photosensitive resin composition), however, the content is not limited to this example.

[0089] In the present disclosure, the binder resin may further include a binder resin generally used in the art in addition to the alkali-soluble polyimide resin including the repeating units represented by Chemical Formulas 1 to 3.

[0090] According to one embodiment of the present disclosure, the colorant includes an alkali-soluble polyimide resin.

[0091] According to one embodiment of the present disclosure, the colorant is the alkali-soluble polyimide resin according to one embodiment of the present disclosure.

[0092] According to one embodiment of the present disclosure, the colorant may be contained in an amount of 14 to 50 parts by weight, or 20 to 45 parts by weight, relative to 100 parts by weight of the solid content of the photosensitive resin composition (solid content excluding the solvent in the photosensitive resin composition). As a preferred example, the colorant may be contained in an amount of 25 to 35 parts by weight relative to 100 parts by weight of the solid content of the photosensitive resin composition (solid content excluding the solvent in the photosensitive resin composition), however, the content is not limited to this example.

[0093] According to one embodiment of the present disclosure, the content of the binder resin is 15 to 50 parts by weight, and the content of the colorant is 14 to 50 parts by weight, relative to 100 parts by weight of the solid content of the photosensitive resin composition (solid content excluding the solvent in the photosensitive resin composition).

[0094] According to one embodiment of the present disclosure, the content of the binder resin is 35 to 45 parts by weight, and the content of the colorant is 25 to 35 parts by weight, relative to 100 parts by weight of the solid content of the photosensitive resin composition (solid content excluding the solvent in the photosensitive resin composition).

[0095] According to one embodiment of the present disclosure, a photosensitive resin composition includes at least one of a binder resin and a colorant, and at least one of the binder resin and the colorant includes an alkali-soluble polyimide resin.

[0096] According to one embodiment of the present disclosure, a photosensitive resin composition includes a binder resin and a colorant, and the binder resin and the colorant include an alkali-soluble polyimide resin.

[0097] According to one embodiment of the present disclosure, the photosensitive resin composition includes a binder resin and a colorant, and the binder resin and the colorant are the alkali-soluble polyimide resin according to one embodiment of the present disclosure.

[0098] The heat resistance of the photosensitive resin composition according to one embodiment of the present disclosure can be greatly improved by including both the binder resin and the colorant in the photosensitive resin composition including an alkali-soluble polyimide resin (including repeating units represented by Chemical Formulas 1 to 3). Specifically, the binder resin includes a polyimide resin (a resin with high heat resistance having insolubility and infusibility) to improve the heat resistance of the adhesion strength with the substrate, and the polyimide resin included in the colorant improves the heat resistance of the deposited material itself that remains after development and etching.

[0099] According to one embodiment of the present disclosure, a colorant includes at least one of a dispersant and a binder for dispersion; and a pigment.

[0100] According to one embodiment of the present disclosure, the colorant comprises a pigment and a dispersant.

[0101] According to one embodiment of the present disclosure, the colorant includes a pigment and a binder for dispersion.

[0102] According to one embodiment of the present disclosure, the colorant includes a pigment, a dispersant, and a binder for dispersion.

[0103] According to one embodiment of the present disclosure, at least one of the dispersant and the binder for dispersion includes an alkali-soluble polyimide resin.

[0104] According to one embodiment of the present disclosure, the dispersant includes an alkali-soluble polyimide resin.

[0105] According to one embodiment of the present disclosure, the dispersant is an alkali-soluble polyimide resin according to one embodiment of the present disclosure.

[0106] According to one embodiment of the present disclosure, the binder for dispersion includes an alkali-soluble polyimide resin.

[0107] According to one embodiment of the present disclosure, the binder for dispersion is the alkali-soluble polyimide resin according to one embodiment of the present disclosure.

[0108] According to one embodiment of the present disclosure, the colorant includes a dispersant (including an alkali-soluble polyimide resin including repeating units represented by Chemical Formulas 1 to 3) and a binder for dispersion (including an alkali-soluble polyimide resin including repeating units represented by Chemical Formulas 1 to 3).

[0109] According to a preferred embodiment of the present disclosure, the colorant includes a pigment; a dispersant (including an alkali-soluble polyimide resin containing repeating units represented by Chemical Formulas 1 to 3); and a binder for dispersion (including an alkali-soluble polyimide resin containing repeating units represented by Chemical Formulas 1 to 3).

[0110] According to one embodiment of the present disclosure, the content of the pigment is 10 to 50 parts by weight, or 15 to 40 parts by weight, relative to 100 parts by weight of the solid content of the photosensitive resin composition. As a preferred example, the content of the pigment is 20 to 30 parts by weight, relative to 100 parts by weight of the solid content of the photosensitive resin composition.

[0111] According to one embodiment of the present disclosure, the content of the dispersant is 2 to 15 parts by weight, or 2 to 10 parts by weight, relative to 100 parts by weight of the solid content of the photosensitive resin composition. As a preferred example, the content of the dispersant is 3 to 6 parts by weight, relative to 100 parts by weight of the solid content of the photosensitive resin composition.

[0112] According to one embodiment of the present disclosure, the content of the binder for dispersion is 2 to 15 parts by weight, or 2 to 10 parts by weight, relative to 100 parts by weight of the solid content of the photosensitive resin composition. As a preferred example, the content of the binder for dispersion is 3 to 6 parts by weight, relative to 100 parts by weight of the solid content of the photosensitive resin composition.

[0113] According to one embodiment of the present disclosure, the content of the pigment is 10 to 50 parts by weight, the content of the dispersant is 2 to 15 parts by weight, and the content of the binder for dispersion is 2 to 15 parts by weight, relative to 100 parts by weight of the colorant. As a preferred example, the pigment, the dispersant, and the binder for dispersion may be included in an amount of 24 parts by weight, 4.8 parts by weight, and 4.8 parts by weight, respectively, relative to 100 parts by weight of the solid content of the photosensitive resin composition. However, the content is not limited thereto.

[0114] As described above, when the pigment is included in the above range, high color reproduction is obtained, and improved brightness is obtained. When the dispersant and the binder for dispersion are included in the above range, excellent developability is obtained, or surface smoothness can be improved by improving crosslinking characteristics.

[0115] The pigment exhibits visibility or hiding power, and as the pigment, red pigment, blue pigment, green pigment, yellow pigment, black pigment, etc. can be used. Specific examples of such pigments may include carmine 6B (CI12490), phthalocyanine green (CI74260), phthalocyanine blue (CI74160), Mitsubishi carbon black MA100, Black (BASF K0084.K0086), cyanine black, linol yellow (CI21090), linol yellow GRO (CI21090), benzidine yellow 4T-564D, Mitsubishi carbon black MA-40, Victoria pure blue (CI42595), CI pigment red 97, 122, 149, 168, 177, 180, 192, 215, CI pigment green 7, 36, CI pigment 15:1, 15:4, 15:6, 22, 60, 64, CI pigment 83, 139, CI pigment violet 23, etc., and, in addition, white pigments, fluorescent pigments, etc. can also be used. However, the pigment is not limited thereto.

[0116] According to one embodiment of the present disclosure, the pigment comprises carbon black alone or a mixture of carbon black and two or more coloring pigments. Specific examples of carbon black may include Sisto 5HIISAF-HS, Sisto KH, Sisto 3HHAF-HS, Sisto NH, Sisto 3M, Sisto 300HAF-LS, Sisto 116HMMAF-HS, Sisto 116MAF, Sisto FMFEF-HS, Sisto SOFEF, Sisto VGPF, Sisto SVHSRF-HS, and SistoSSRF of Tokai Carbon Co., Ltd.; Diagram black II, Diagram black N339, Diagram black SH, Diagram black H, Diagram LH, Diagram HA, Diagram SF, Diagram N550M, Diagram M, Diagram E, Diagram G, Diagram R, Diagram N760M, Diagram LR, #2700, #2600, #2400, #2350, #2300, #2200, #1000, #980, #900, MCF88, #52, #50, #47, #45, #45L, #25, #CF9, #95, #3030, #3050, MA7, MA77, MA8, MA11, OIL7B, OIL9B, OIL11B, OIL30B, and OIL31B; Evonik Industries (formerly Degussa AG)'s PRINTEX-U, PRINTEXV, PRINTEX-140U, PRINTEX-140V, PRINTEX-95, PRINTEX-85, PRINTEX-75, PRINTEX-55, PRINTE X-45, PRINTEX300, PRINTEX-35, PRINTEX-25, PRINTEX-200, PRINTEX-40, PRINTEX-30, PRINTEX-3, PRINTEX-A, SPECIAL BLACK550, SPECIAL BLACK-350, SPECIAL BLACK-250, SPECIAL BLACK-100 and LAMP BLACK-101;Columbia Carbon's RAVEN-1100ULTRA, RAVEN-1080ULTRA, RAVEN-1060ULTRA, RAVEN-1040, RAVEN-1035, RAVEN-1020, RAVEN-1000 , RAVEN-890H, RAVEN-890, RAVEN-880ULTRA, RAVEN-860ULTRA, RAVEN-850, RAVEN-820, RAVEN-790ULTRA, RAVEN780ULTR A. RAVEN-760ULTRA, RAVEN-520, RAVEN-500, RAVEN-460, RAVEN-450, RAVEN-430ULTRA, RAVEN-420, RAVEN-410, RAVEN-2 500ULTRA, RAVEN-2000, RAVEN-1500, RAVEN-1255, RAVEN-1250, RAVEN-1200, RAVEN1190ULTRA and RAVEN-1170; etc., but not limited thereto. ;

[0117] According to another embodiment of the present disclosure, as a dispersant, any one or more selected from the following may be additionally used or may be substituted: BYK LP N-22956, BYK LP N-22822, BYK LP N-23490, BYK LP N-22329, BYK LP N-23597, BYK LP N-23499, BYK LP N-22956, BYK LP N-22101, BYK LP N-23532, BYK LP N-23554, BYK LP N-22329, BYK LP N-23499, etc.

[0118] According to another embodiment of the present disclosure, as the binder for dispersion, any one or more selected from the following may be additionally used or may be substituted: BYK LP N-22956, BYK LP N-22822, BYK LP N-23490, BYK LP N-22329, BYK LP N-23597, BYK LP N-23499, BYK LPN-22956, BYK LP N-22101, BYK LP N-23532, BYK LP N-23554, BYK LP N-22329, BYK LP N-23499, etc.

[0119] According to one embodiment of the present disclosure, the alkali-soluble polyimide resin containing the repeating units represented by Chemical Formulas 1 to 3 may be included in an amount of 15 to 65 parts by weight, or 25 to 60 parts by weight, relative to 100 parts by weight of the solid content of the photosensitive resin composition. As a preferred example, the alkali-soluble polyimide resin containing the repeating units represented by Chemical Formulas 1 to 3 may be included in an amount of 45 to 55 parts by weight, relative to 100 parts by weight of the solid content of the photosensitive resin composition, however, the content is not limited thereto.

[0120] The alkali-soluble polyimide resin according to one embodiment of the present disclosure includes a repeating unit represented by Chemical Formulas 1 to 3. The alkali-soluble polyimide resin may include a form in which Chemical Formulas 1 to 3 are repeated and bonded in any order. In other words, the repeating units in the brackets of m to p of Chemical Formulas 1 to 3 in the alkali-soluble polyimide resin according to one embodiment of the present disclosure may be bonded continuously or discontinuously. For example, when m is 3, the alkali-soluble polyimide resin according to one embodiment of the present disclosure may include a form polymerized in the form of "-[Chemical Formula 1]-[Chemical Formula 1]-[Chemical Formula 2]n-[Chemical Formula 3]p-", and may include a form polymerized in the form of "-[Chemical Formula 3]-[Chemical Formula 1]-[Chemical Formula 2]-[Chemical Formula 1]n-[Chemical Formula 1]p-", however, the order is not limited to the above order, and may include repeating units in the form of polymerized and bonded in any order.

[0121] According to one embodiment of the present disclosure, X1 to X3 are the same as or different from each other, and are each independently a tetravalent organic group.

[0122] According to one embodiment of the present disclosure, X1 to X3 are each independently a tetravalent organic group derived from an acid anhydride or a derivative thereof.

[0123] According to one embodiment of the present disclosure, X1 to X3 are each independently a tetravalent organic group derived from an acid dianhydride or a derivative thereof.

[0124] The tetravalent organic groups of X1 to X3 of Chemical Formula 1 may be, for example, a tetravalent aromatic organic group, a tetravalent aliphatic organic group, or a tetravalent organic group in which an aromatic group and an aliphatic group are linked to each other, and at least one carbon may be replaced by C(═O), SO 2 , NR x , S, or O, and R x is an aryl group or an alkyl group.

[0125] According to one embodiment of the present disclosure, X1 to X3 are each independently a tetravalent organic group derived from tetracarboxylic anhydride or a derivative thereof.

[0126] According to one embodiment of the present disclosure, X1 to X3 are each independently a tetravalent organic group derived from tetracarboxylic dianhydride or a derivative thereof.

[0127] According to one embodiment of the present disclosure, X1 to X3 are each independently a tetravalent organic group derived from oxydiphthalic anhydride or a derivative thereof.

[0128] According to one embodiment of the present disclosure, X1 to X3 are each independently a tetravalent organic group derived from oxydiphthalic dianhydride or a derivative thereof.

[0129] According to one embodiment of the present disclosure, X1 to X3 are any one selected from the following Chemical Formulae X-1 to X-5.

[0130] [Chemical Formula X-1]

[0131]

[0132] [Chemical Formula X-2]

[0133]

[0134] [Chemical Formula X-3]

[0135]

[0136] [Chemical Formula X-4]

[0137]

[0138] [Chemical Formula X-5]

[0139]

[0140] In Chemical Formulas X-1 to X-5,

[0141] The C1 ring to the C3 ring are the same as or different from each other and are each independently an aromatic hydrocarbon ring,

[0142] The C4 ring to the C6 ring are the same as or different from each other and are each independently an aliphatic hydrocarbon ring,

[0143] Lcx is any one selected from the following: direct bond, -O-, -CO-, -COO-, -S-, -SO-, -SO2-, -CRC1RC2-, -(CH2) CZ -、-O(CH2) CZ O-, -COO(CH2) CZ OCO-, -O(C6H6) CZ O CZ -, -CONH-, or phenylene,

[0144] RC1 and RC2 are the same as or different from each other and are each independently an alkyl group having 1 to 10 carbon atoms or a halogenated alkyl group having 1 to 10 carbon atoms, and

[0145] cz is an integer from 1 to 10.

[0146] According to one embodiment of the present disclosure, the C1 to C6 rings may be substituted with a halogen group or an alkyl group having 1 to 10 carbon atoms.

[0147] According to one embodiment of the present disclosure, the C1 to C3 rings are the same as or different from each other, and are each independently an aromatic hydrocarbon ring having 6 to 18 carbon atoms.

[0148] According to one embodiment of the present disclosure, the C4 to C6 rings are the same as or different from each other, and are each independently an aliphatic hydrocarbon ring having 4 to 18 carbon atoms.

[0149] According to one embodiment of the present disclosure, Chemical Formula X-1 is any one selected from the following structures.

[0150]

[0151] In the structures, * indicates the attachment site.

[0152] According to one embodiment of the present disclosure, Chemical Formula X-2 is any one selected from the following structures.

[0153]

[0154] In the structures, * indicates the attachment site.

[0155] According to one embodiment of the present disclosure, Chemical Formula X-3 is any one selected from the following structures.

[0156]

[0157] In the structures, * indicates the attachment site.

[0158] According to one embodiment of the present disclosure, Chemical Formula X-4 is the following structure.

[0159]

[0160] In the structures, * indicates the attachment site.

[0161] According to one embodiment of the present disclosure, X1 to X3 are any one selected from the following structures.

[0162]

[0163] According to a preferred embodiment of the present disclosure, X1 to X3 are any one selected from the following structures.

[0164]

[0165] According to one embodiment of the present disclosure, Y1 to Y3 are the same as or different from each other, and are each independently a divalent organic group.

[0166] According to one embodiment of the present disclosure, Y1 to Y3 are the same as or different from each other, and are each independently an organic group derived from a diamine or a derivative thereof.

[0167] According to one embodiment of the present disclosure, Y1 to Y3 are the same as or different from each other, and are each independently a divalent organic group derived from a diamine or a derivative thereof.

[0168] According to one embodiment of the present disclosure, Y1 to Y3 are the same as or different from each other, and are each independently a divalent organic group including a hydroxyl group; a phenolic hydroxyl group; or a substituted or unsubstituted halogenated alkyl group.

[0169] According to one embodiment of the present disclosure, Y1 to Y3 are the same as or different from each other, and are each independently a divalent organic group including a hydroxyl group; a phenolic hydroxyl group; or a substituted or unsubstituted halogenated alkyl group having 1 to 10 carbon atoms.

[0170] According to one embodiment of the present disclosure, Y1 to Y3 are the same as or different from each other, and are each independently a divalent organic group including a hydroxyl group; a phenolic hydroxyl group; or a halogenated alkyl group.

[0171] According to one embodiment of the present disclosure, Y1 to Y3 are the same as or different from each other, and are each independently a divalent organic group including a hydroxyl group; a phenolic hydroxyl group; or a halogenated alkyl group having 1 to 10 carbon atoms.

[0172] According to one embodiment of the present disclosure, Y1 to Y3 are the same as or different from each other, and are each independently a divalent organic group including a hydroxyl group; a phenolic hydroxyl group; or a trifluoromethyl group.

[0173] According to one embodiment of the present disclosure, Y1 to Y3 are the same as or different from each other, and are each independently a divalent organic group containing a hydroxyl group; a phenolic hydroxyl group; or a trifluoromethyl group and derived from a diamine or a derivative thereof.

[0174] The divalent organic group may be a divalent aliphatic organic group, a divalent aromatic organic group, or a divalent organic group in which an aliphatic group and an aromatic group are linked to each other, and at least one carbon may be replaced by C(═O), SO 2 , NR x , S or O, and R x is an aryl group or an alkyl group and may be substituted by a halogen group, a hydroxyl group, a carboxyl group, a thiol group, a sulfonic acid group or an alkyl group.

[0175] According to one embodiment of the present disclosure, Y1 to Y3 are any one selected from the following Chemical Formulae Y-1 to Y-4.

[0176] [Chemical Formula Y-1]

[0177]

[0178] [Chemical Formula Y-2]

[0179]

[0180] [Chemical formula Y-3]

[0181]

[0182] [Chemical formula Y-4]

[0183]

[0184] In Chemical Formulas Y-1 to Y-4,

[0185] Lcy is any one selected from the group consisting of a single bond, -O-, -CO-, -COO-, -S-, -SO-, -SO2-, -CRC1RC2-, -C(C6H6)-, -C(C6H6)-, and -NRC3-,

[0186] RC3 is aryl, and

[0187] The C1 ring to the C6 ring, RC1 and RC2 have the same definitions as in Chemical Formulae X-1 to X-5.

[0188] According to one embodiment of the present disclosure, RC3 is phenyl.

[0189] According to one embodiment of the present disclosure, the C1 to C6 rings and Lcy may each independently be substituted with a substituent including a hydroxyl group.

[0190] According to one embodiment of the present disclosure, the C1 to C6 rings and Lcy may each independently be substituted with a hydroxyl group or a carboxyl group.

[0191] According to one embodiment of the present disclosure, Chemical Formula Y-1 is any one selected from the following structures.

[0192]

[0193] In the structures, * indicates the attachment site.

[0194] According to one embodiment of the present disclosure, Chemical Formula Y-2 is any one selected from the following structures.

[0195]

[0196] In the structures, * indicates the attachment site.

[0197] According to one embodiment of the present disclosure, Chemical Formula Y-3 is the following structure.

[0198]

[0199] In the structures, * indicates the attachment site.

[0200] According to one embodiment of the present disclosure, Y1 to Y3 are any one selected from the following structural formulae.

[0201]

[0202] According to one embodiment of the present disclosure, R7 is hydrogen; deuterium; a hydroxyl group; a halogen group; a nitro group; a nitrile group; a substituted or unsubstituted alkyl group; a substituted or unsubstituted alkenyl group; a substituted or unsubstituted alkynyl group; a substituted or unsubstituted alkoxy group; a substituted or unsubstituted aryloxy group; a substituted or unsubstituted cycloalkyl group; a substituted or unsubstituted aryl group; a substituted or unsubstituted heterocyclic group; or a photopolymerizable unsaturated group.

[0203] The photosensitive resin composition according to one embodiment of the present disclosure may increase adhesion to a substrate used in a display device such as an organic light emitting diode through bonding strength obtained by a photopolymerizable unsaturated group.

[0204] According to one embodiment of the present disclosure, R7 is hydrogen; deuterium; a hydroxyl group; a halogen group; a nitro group; a nitrile group; a substituted or unsubstituted alkyl group having 1 to 30 carbon atoms; a substituted or unsubstituted alkenyl group having 1 to 30 carbon atoms; a substituted or unsubstituted alkynyl group having 1 to 30 carbon atoms; a substituted or unsubstituted alkoxy group having 1 to 30 carbon atoms; a substituted or unsubstituted aryloxy group having 6 to 30 carbon atoms; a substituted or unsubstituted cycloalkyl group having 3 to 30 carbon atoms; a substituted or unsubstituted aryl group having 6 to 30 carbon atoms; a substituted or unsubstituted heterocyclic group having 2 to 30 carbon atoms; or a photopolymerizable unsaturated group.

[0205] According to one embodiment of the present disclosure, R7 is hydrogen; deuterium; hydroxyl; a halogen group; a substituted or unsubstituted alkenyl group; a substituted or unsubstituted alkynyl group; a substituted or unsubstituted alkoxy group; a substituted or unsubstituted aryloxy group; or a photopolymerizable unsaturated group.

[0206] According to one embodiment of the present disclosure, R7 is hydrogen; deuterium; a hydroxyl group; a halogen group; a substituted or unsubstituted alkenyl group having 1 to 30 carbon atoms; a substituted or unsubstituted alkynyl group having 1 to 30 carbon atoms; a substituted or unsubstituted alkoxy group having 1 to 30 carbon atoms; a substituted or unsubstituted aryloxy group having 6 to 30 carbon atoms; or a photopolymerizable unsaturated group.

[0207] According to one embodiment of the present disclosure, R7 is a photopolymerizable unsaturated group.

[0208] According to one embodiment of the present disclosure, the photopolymerizable unsaturated group may be a substituted or unsubstituted acryloyl group; a substituted or unsubstituted acrylate group, etc. Specifically, the (meth)acrylate group may be one type selected from the following: a propyl acrylate group, a propylene glycol methacrylate group, a dipentaerythritol hexaacrylate group, a dipentaerythritol acrylate group, a neopentyl glycol diacrylate group, a 6-hexanediol diacrylate group, a 1,6-hexanediol acrylate group, a tetraethylene glycol methacrylate group, a bisphenoxyethanol diacrylate group, a trihydroxyethyl isocyanurate trimethacrylate group, a trimethylpropane trimethacrylate group, a diphenylpentaerythritol hexaacrylate group, a pentaerythritol trimethacrylate group, a pentaerythritol tetramethacrylate group, and a dipentaerythritol hexamethacrylate group, or a mixture of two or more types thereof, but is not limited thereto.

[0209] According to one embodiment of the present disclosure, R7 is a substituted or unsubstituted acryloyl group; or a substituted or unsubstituted acrylate group.

[0210] According to one embodiment of the present disclosure, R7 is a substituted or unsubstituted propyl acrylate group.

[0211] According to one embodiment of the present disclosure, R7 is represented by the following Chemical Formula B.

[0212] [Chemical Formula B]

[0213]

[0214] In the chemical formula B, Rb is hydrogen; or an alkyl group having 1 to 4 carbon atoms,

[0215] b is an integer from 1 to 10, and

[0216] It means the site of bonding to N of chemical formula A.

[0217] According to a preferred embodiment of the present disclosure, Rb of Chemical Formula B is hydrogen.

[0218] According to one embodiment of the present disclosure, b is an integer of 1. According to another embodiment of the present disclosure, b is an integer of 2. According to yet another embodiment of the present disclosure, b is an integer of 3. According to yet another embodiment of the present disclosure, b is an integer of 4. According to yet another embodiment of the present disclosure, b is an integer of 5. According to yet another embodiment of the present disclosure, b is an integer of 6. According to yet another embodiment of the present disclosure, b is an integer of 7. According to yet another embodiment of the present disclosure, b is an integer of 8. According to yet another embodiment of the present disclosure, b is an integer of 9. According to yet another embodiment of the present disclosure, b is an integer of 10.

[0219] According to one embodiment of the present disclosure, for m to p in Chemical Formulas 1 to 3, p / (m+n+p) may be 0.03 to 0.15. According to another embodiment, for m to p in Chemical Formulas 1 to 3, p / (m+n+p) may be 0.08 to 0.15 or less. According to yet another embodiment, for m to p in Chemical Formulas 1 to 3, p / (m+n+p) may be 0.1 to 0.15 or less.

[0220] For m to p in Chemical Formulas 1 to 3, the ratios of m, n, and p refer to the ratios of ring closure or non-ring closure relative to the sum of m+n+p. Specifically, the structure in the brackets of m or n is imidized and is closed-loop. Therefore, relative to the sum of m+n+p, the sum of the ratio of m and the ratio of n refers to the closed-loop ratio of the alkali-soluble polyimide resin. On the other hand, the structure in the brackets of p is not imidized and is therefore not closed-loop. Therefore, relative to the sum of m+n+p, the ratio of p refers to the ratio of non-ring closure in the alkali-soluble polyimide resin.

[0221] The photosensitive resin composition according to one embodiment of the present disclosure may have a ring closure rate of 85% to 97%. According to another embodiment, the ring closure rate of the photosensitive resin composition may be 85% to 95%. According to yet another embodiment, the ring closure rate of the photosensitive resin composition may be 85% to 90%. According to yet another embodiment, the ring closure rate of the photosensitive resin composition may be 90% to 95%. However, the range of the ring closure rate of the photosensitive resin composition is not limited to the above specific numerical range.

[0222] As described above, the photosensitive resin composition containing an alkali-soluble polyimide resin having a ring closure rate of 85% to 95% according to one embodiment of the present disclosure prevents a decrease in solubility or swelling caused by ring closure of side chains during development. Specifically, it prevents a decrease in solubility or swelling caused by an increase in the ring closure rate due to imidization during a process such as development.

[0223] According to one embodiment of the present disclosure, the weight average molecular weight of the alkali-soluble polyimide resin of the photosensitive resin composition is 1,000 g / mol to 35,000 g / mol; 2,000 g / mol to 33,000 g / mol; or 2,500 g / mol to 33,000 g / mol. When the weight average molecular weight is within the above range, the photosensitive resin composition including the alkali-soluble polyimide resin has excellent physical and chemical properties, has appropriate viscosity, and has excellent adhesion to a substrate.

[0224] According to one embodiment of the present disclosure, a colorant may be used as a dispersion liquid together with a pigment, a dispersant, and a binder for dispersion. As a solvent for preparing the dispersion liquid, the description of the solvent for preparing the photosensitive resin composition according to one embodiment of the present disclosure, which will be described below, may be applied in the same manner.

[0225] According to one embodiment of the present disclosure, as the solvent, compounds known in the art that allow the formation of a photosensitive resin composition can be used without particular limitation. For example, the solvent can be one or more types of compounds selected from esters, ethers, ketones, aromatic hydrocarbons, and sulfoxides.

[0226] The ester-based solvent may be ethyl acetate, n-butyl acetate, isobutyl acetate, amyl formate, isoamyl acetate, isobutyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, methyl lactate, ethyl lactate, γ-butyrolactone, ε-caprolactone, δ-valerolactone, alkyl oxyacetates (examples: methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate (e.g., methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl methoxyacetate, etc.)), alkyl 3-oxypropionates (examples: methyl 3-oxypropionate, ethyl 3-oxypropionate, etc. (e.g., methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, etc.) 2-ethoxypropionate), methyl 2-oxy-2-methylpropionate and ethyl 2-oxy-2-methylpropionate (e.g., methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate, etc.), methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, methyl 2-oxybutyrate, ethyl 2-oxybutyrate, etc.

[0227] The ether-based solvent can be diethylene glycol dimethyl ether, tetrahydrofuran, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, and the like.

[0228] The ketone-based solvent may be methyl ethyl ketone, cyclohexanone, cyclopentanone, 2-heptanone, 3-heptanone, N-methyl-2-pyrrolidone, or the like.

[0229] The aromatic hydrocarbon-based solvent may be toluene, xylene, anisole, limonene, or the like.

[0230] The sulfoxide-based solvent may be dimethyl sulfoxide or the like.

[0231] In one embodiment of the present disclosure, the solvent may be propylene glycol monomethyl ether acetate.

[0232] In one embodiment of the present disclosure, the solvent may preferably be a mixture solution of propylene glycol monomethyl ether acetate, diethylene glycol methyl ethyl ether, and γ-butyrolactone.

[0233] In the solvent, propylene glycol monomethyl ether acetate, diethylene glycol methyl ethyl ether, and γ-butyrolactone may be mixed in a weight ratio of 50:20:2 to 70:50:10. In the solvent, propylene glycol monomethyl ether acetate, diethylene glycol methyl ethyl ether, and γ-butyrolactone may preferably be mixed in a weight ratio of 60:35:5.

[0234] According to one embodiment of the present disclosure, the solvent may be included in an amount of 10 to 85 parts by weight; or 15 to 80 parts by weight, relative to 100 parts by weight of the photosensitive resin composition.

[0235] When the solvent is included in the above range, or when a mixture solution is used as the solvent and the mixing ratio is within the above range, the coatability of the photosensitive resin composition is excellent, or a film having excellent flatness may be obtained.

[0236] According to one embodiment of the present disclosure, the photosensitive resin composition may further include additives required by those skilled in the art.

[0237] As the additive, a multifunctional monomer, a cross-linking agent, a photopolymerization initiator, a surfactant, a silane coupling agent, etc. may be included, however, the additive is not limited thereto.

[0238] According to one embodiment of the present disclosure, the photosensitive resin composition further includes at least one of a multifunctional monomer, a cross-linking agent, a photopolymerization initiator, a surfactant, and a silane coupling agent.

[0239] According to one embodiment of the present disclosure, the photosensitive resin composition further includes a multifunctional monomer, a cross-linking agent, a photopolymerization initiator, a surfactant, and a silane coupling agent.

[0240] According to one embodiment of the present disclosure, the polyfunctional monomer may be any one or more of unsaturated carboxylic acid ester; aromatic vinyl; unsaturated ether; unsaturated imide; and acid anhydride, and may further include other polyfunctional monomers known in the art.

[0241] The multifunctional monomer may be included in an amount of 1 to 40 parts by weight, or 15 to 35 parts by weight, relative to 100 parts by weight of the solid content of the photosensitive resin composition. As a preferred example, the multifunctional monomer may be included in an amount of 20 to 30 parts by weight, relative to 100 parts by weight of the solid content of the photosensitive resin composition. However, the content is not limited thereto.

[0242] As a specific example, the unsaturated carboxylic acid ester can be selected from the group consisting of benzyl (meth)acrylate, methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, cyclohexyl (meth)acrylate, isobornyl (meth)acrylate, ethylhexyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxy-3-chloropropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, octyloxy-2-hydroxypropyl (meth)acrylate, glycerol (meth)acrylate, 2-methoxyethyl (meth)acrylate, 3-chloro-2-hydroxypropyl (meth)acrylate, 1,2-dimethoxyethyl ... Methoxybutyl, ethoxydiethylene glycol (meth)acrylate, methoxytriethylene glycol (meth)acrylate, methoxytripropylene glycol (meth)acrylate, poly(ethylene glycol) methyl ether (meth)acrylate, phenoxydiethylene glycol (meth)acrylate, p-nonylphenoxypolyethylene glycol (meth)acrylate, p-nonylphenoxypolypropylene glycol (meth)acrylate, glycidyl (meth)acrylate, tetrafluoropropyl (meth)acrylate, 1,1,1,3,3,3-hexafluoroisopropyl (meth)acrylate, octafluoropentyl (meth)acrylate, heptadecafluorodecyl (meth)acrylate, tribromophenyl (meth)acrylate, methyl α-hydroxymethacrylate, ethyl α-hydroxymethacrylate, propyl α-hydroxymethacrylate and butyl α-hydroxymethacrylate, but are not limited thereto.

[0243] As another example of the multifunctional monomer, one or more types of pentaerythritol tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, etc. may be used, however, the multifunctional monomer is not limited thereto.

[0244] According to one embodiment of the present disclosure, the content of the alkali-soluble hydroxyl group is 30 parts by weight or greater relative to 100 parts by weight of the multifunctional monomer.

[0245] According to one embodiment of the present disclosure, the content of alkali-soluble hydroxyl groups is 30 to 85 parts by weight relative to 100 parts by weight of the multifunctional monomer. As above, the alkali-soluble polyimide resin containing 30 parts by weight or more of alkali-soluble hydroxyl groups based on 100 parts by weight of the multifunctional monomer can have excellent developability. The content of alkali-soluble hydroxyl groups can be derived by the ratio of the weight parts of hydroxyl groups relative to 100 parts by weight of the compound containing alkali-soluble hydroxyl groups. For example, in a single phenol molecule, the content of one hydroxyl group present in the single phenol molecule can be obtained by the ratio of the weight parts of one hydroxyl group present in the single phenol molecule relative to 100 parts by weight of phenol. Specifically, the molecular weight of phenol is 94 g / mol, and the molecular weight of one hydroxyl group present in phenol is 17 g / mol. Therefore, the hydroxyl group is included at a ratio of about 18.09 parts by weight relative to 100 parts by weight of phenol.

[0246] According to one embodiment of the present disclosure, the content of the alkali-soluble hydroxyl group is 50 parts by weight or greater relative to 100 parts by weight of the multifunctional monomer.

[0247] According to one embodiment of the present disclosure, the content of the alkali-soluble hydroxyl group is 50 parts by weight to 70 parts by weight relative to 100 parts by weight of the multifunctional monomer.

[0248] According to one embodiment of the present disclosure, when the content of the alkali-soluble hydroxyl group is 50 to 70 parts by weight relative to 100 parts by weight of the multifunctional monomer, the alkali-soluble polyimide resin may have excellent developability even within a weight average molecular weight range of 1,000 to 20,000 g / mol.

[0249] According to another embodiment of the present disclosure, the content of the alkali-soluble hydroxyl group is 70 parts by weight or greater relative to 100 parts by weight of the multifunctional monomer.

[0250] According to another embodiment of the present disclosure, the content of the alkali-soluble hydroxyl group is 70 parts by weight to 85 parts by weight relative to 100 parts by weight of the multifunctional monomer.

[0251] According to another embodiment of the present disclosure, when the content of the alkali-soluble hydroxyl group is 70 to 85 parts by weight relative to 100 parts by weight of the multifunctional monomer, the alkali-soluble polyimide resin may have excellent developability even within a weight average molecular weight range of 20,000 g / mol or more.

[0252] When the weight average molecular weight of the alkali-soluble polyimide resin satisfies the above range and the content of the alkali-soluble hydroxyl group satisfies the above range based on 100 parts by weight of the multifunctional monomer, effects of improving developability to a developing solution or enhancing sensitivity or improving mechanical properties can be obtained.

[0253] The crosslinking agent initiates a crosslinking reaction between the alkali-soluble polyimide resin or other additive components to improve the heat resistance and chemical resistance of the produced film. In this article, a compound containing a functional group such as an acrylic group or an isocyanate group can be used as a crosslinking agent. In addition, the crosslinking agent can be, for example, a thermal crosslinking agent. As such a thermal crosslinking agent, a compound containing a thermally reactive functional group such as a hydroxymethyl or epoxy group can be used. As a specific example, crosslinking agents commonly used in the art can be used, such as DML-PC, DML-PEP, DML-OC, DML-OEP, DML-34X, DML-PTBP, DML-PCHP, DML-OCHP, DML-PFP, DML-PSBP, DML-POP, DML-MBOC, DML-MBPC, DML-MTrisPC, DML-BisOC-Z, DML-BisOCHP-Z, DML-BPC, DML-BisOC-P, DMOM-PC, DM OM-PTBP, DMOM-MBPC, TriML-P, TriML-35XL, TML-HQ, TML-BP, TML-pp-BPF, TML-BPE, TML-BPA, TML-BPAF, TML-BPAP, TMOM-BP, TMOM-BPE, TMOM-BPA, TMOM-BPAF, TMOM-BPAP, HML-TPPHBA, HML-TPHAP, HMOM-TPPHBA, HMOM-TPHAP (in the above, trade names, manufactured by Honshu Chemical Industry Co., Ltd.), “NIKALAC” (registered trademark) MX-290, “NIKALAC” (registered trademark) MX-280, “NIKALAC” (registered trademark) MX-270, “NIKALAC” (registered trademark) MX-279, “NIKALAC” (registered trademark) MW-100LM and “NIKALAC” (registered trademark) MX-750LM (in the above, trade names, manufactured by Sanwa Chemical Co., Ltd.).

[0254] According to one embodiment of the present disclosure, the crosslinking agent may be included in an amount of 0.1 to 40 parts by weight relative to 100 parts by weight of the solid content of the photosensitive resin composition. As a preferred example, the crosslinking agent may be included in an amount of 20 to 25 parts by weight relative to 100 parts by weight of the solid content of the photosensitive resin composition, however, the content is not limited thereto.

[0255] The photopolymerization initiator is a material that initiates crosslinking by generating radicals by light, and one or more types of compounds selected from acetophenone-based compounds, biimidazole-based compounds, triazine-based compounds, and oxime-based compounds are preferably mixed and used.

[0256] According to one embodiment of the present disclosure, the photopolymerization initiator may be included in an amount of 0.1 to 10 parts by weight relative to 100 parts by weight of the solid content of the photosensitive resin composition. As a preferred example, the crosslinking agent may be included in an amount of 4 to 5 parts by weight relative to 100 parts by weight of the solid content of the photosensitive resin composition, however, the content is not limited thereto.

[0257] The surfactant is a silicone-based surfactant or a fluorine-based surfactant. Specifically, BYK-077, BYK-085, BYK-300, BYK-301, BYK-302, BYK-306, BYK-307, BYK-310, BYK-320, BYK-322, BYK-323, BYK-325, BYK-330, BYK-331, BYK-333, BYK-335, BYK- BYK-341v344, BYK-345v346, BYK-348, BYK-354, BYK-355, BYK-356, BYK-358, BYK-361, BYK-370, BYK-371, BYK-375, BYK-380, BYK-390, etc. As fluorine-based surfactants, DIC (DaiNippon Ink & Chemicals) F-114, F-177, F-410, F-411, F-450, F-493, F-494, F-443, F-444, F-445, F-446, F-4 70. F-471, F-472SF, F-474, F-475, F-477, F-478, F-479, F-480SF, F-482, F-483, F-484, F-486, F-487 , F-172D, MCF-350SF, TF-1025SF, TF-1117SF, TF-1026SF, TF-1128, TF-1127, TF-1129, TF-1126, TF-1130, TF-1116SF, TF-1131, TF1132, TF1027SF, TF-1441, TF-1442, etc. However, the silicone-based surfactant and the fluorine-based surfactant are not limited thereto. For example, BYK-307 can be used.

[0258] According to one embodiment of the present disclosure, the surfactant may be included in an amount of 0.1 to 5 parts by weight relative to 100 parts by weight of the solid content of the photosensitive resin composition. As another example, the surfactant may be included in an amount of 0.2 to 0.4 parts by weight relative to 100 parts by weight of the solid content of the photosensitive resin composition. As a preferred example, the surfactant may be included in an amount of 0.25 to 0.35 parts by weight relative to 100 parts by weight of the solid content of the photosensitive resin composition, however, the content is not limited thereto.

[0259] Silane coupling agents can be used, for example, to improve the dispersibility of thermally conductive fillers such as aluminum oxide, and as long as they have the above functions, various types of silane coupling agents known in the art can be used without restriction. Silane coupling agents refer to compounds containing hydrolyzable silyl or silanol groups. In addition, silane coupling agents can increase the mutual adhesion between the film produced by curing and a specific surface of the substrate, thereby improving heat resistance and chemical resistance. As examples of silane coupling agents, one or more types selected from octyltrimethoxysilane, dodecyltrimethoxysilane, octadecyltrimethoxysilane, etc. can be used, however, silane coupling agents are not limited thereto.

[0260] According to one embodiment of the present disclosure, the silane coupling agent may be included in an amount of 0.1 to 2 parts by weight relative to 100 parts by weight of the solid content of the photosensitive resin composition. As a preferred example, the silane coupling agent may be included in an amount of 0.2 to 1 part by weight relative to 100 parts by weight of the solid content of the photosensitive resin composition, however, the content is not limited thereto.

[0261] According to one embodiment of the present disclosure, the photosensitive resin composition may further include additional additives, such as antioxidants, thermal polymerization inhibitors, etc. However, the additional additives are not limited thereto.

[0262] Antioxidant can play the role of preventing the chain reaction of free radicals from being produced during polymer film formation.Herein, as antioxidant, antioxidant based on phenol etc. can be included, and 2,2-thiobis (4-methyl-6-tert-butylphenol), 2,6-g, t-butylphenol etc. as the antioxidant commonly used in this area can be used, as ultraviolet light absorber, 2-(3-tert-butyl-5-methyl-2-hydroxyphenyl)-5-chloro-benzotriazole, alkoxy benzophenone etc. can be used, however, antioxidant and ultraviolet light absorber are not limited thereto.

[0263] According to one embodiment of the present disclosure, when the antioxidant is included, the antioxidant may be included in an amount of 0.1 to 10 parts by weight; or 0.2 to 1 part by weight, relative to 100 parts by weight of the solid content of the photosensitive resin composition.

[0264] As thermal polymerization inhibitors, hydroquinone, p-methoxyphenol, di-tert-butyl-p-cresol, pyrogallol, tert-butylcatechol, benzoquinone, 4,4-thiobis(3-methyl-6-tert-butylphenol), 2,2-methylenebis(4-methyl-6-tert-butylphenol), 2-mercaptoimidazole, and the like can be used.

[0265] According to one embodiment of the present disclosure, when the thermal polymerization inhibitor is included, the thermal polymerization inhibitor may be included at 0.1 to 10 parts by weight; or 0.2 to 1 part by weight, relative to 100 parts by weight of the solid content of the photosensitive resin composition.

[0266] One embodiment of the present disclosure provides a photosensitive material including a photosensitive resin composition.

[0267] One embodiment of the present disclosure provides a photosensitive material prepared using a photosensitive resin composition. More specifically, the photosensitive resin composition of the present disclosure is coated on a substrate using an appropriate method to form a photosensitive material in the form of a thin film or pattern.

[0268] The coating method is not particularly limited, however, spraying, roll coating, spin coating, etc. can be used, and spin coating is generally widely used. In addition, after the coating film is formed, the residual solvent may be partially removed under vacuum in some cases.

[0269] The photopolymerizable unsaturated group included in the photosensitive resin composition or photosensitive material according to one embodiment of the present disclosure may be cured by a light source such as Xe arc, carbon arc, or mercury vapor arc emitting light having a wavelength of 250 nm to 450 nm, however, the method is not limited thereto.

[0270] The photosensitive resin composition according to one embodiment of the present disclosure can be used in a pigment-dispersed photosensitive material for manufacturing a thin film transistor liquid crystal display (TFT LCD) color filter, a photosensitive material for a black matrix of a thin film transistor liquid crystal display (TFT LCD) or an organic light emitting diode, a photosensitive material for forming an overcoat layer, a columnar spacer photosensitive material, a photocurable coating, a photocurable ink, a photocurable adhesive, a printing plate, a photosensitive material for a printed circuit board, a photosensitive material for a plasma display panel (PDP), and the like, and the application is not particularly limited.

[0271] One embodiment of the present disclosure provides a photosensitive resin composition for a color filter or a photosensitive material for a color filter.

[0272] According to one embodiment of the present disclosure, a color filter can be manufactured using the above-mentioned photosensitive resin composition or the above-mentioned photosensitive material. The photosensitive resin composition can be coated on a substrate to form a coating film, and the coating film can be exposed, developed, and cured to form a color filter.

[0273] According to one embodiment of the present disclosure, the substrate may be a glass plate, a silicon wafer, a plastic substrate such as a plate of polyethersulfone (PES) or polycarbonate (PC), etc., and the type is not particularly limited.

[0274] According to one embodiment of the present disclosure, the color filter may include a red pattern, a green pattern, a blue pattern, or a black matrix.

[0275] According to another embodiment, the color filter may further include an overcoat layer.

[0276] For the purpose of enhancing contrast, a grid black pattern called a black matrix can be set between the colored pixels of the color filter. Chromium can be used as the material of the black matrix. In this case, the method of forming a pattern by etching by depositing chromium on the entire glass substrate can be used. However, considering the high cost of the process, the high reflectivity of chromium and the environmental pollution caused by chromium waste liquid, the resin black matrix utilizing the pigment dispersion method capable of micro-processing can be used.

[0277] In addition to the colorant included in the above-mentioned colorant, the black matrix according to one embodiment of the present disclosure may further include a black pigment or a black dye as another colorant. For example, carbon black may be used alone, or carbon black and a coloring pigment may be mixed and used. Since a coloring pigment lacking light-shielding properties is mixed, there is an advantage that even when the amount of colorant is relatively increased, the film strength or adhesion to the substrate does not decrease.

[0278] The black matrix according to one embodiment of the present disclosure may include a black pigment or a black dye as an additional colorant instead of the colorant included in the above-mentioned colorants.

[0279] A preferred embodiment of the present disclosure provides a photosensitive resin composition for a black matrix or a photosensitive material for a black matrix.

[0280] Use for a black matrix includes all meanings such as use for forming a black matrix, use included in a black matrix, and the like.

[0281] One embodiment of the present disclosure provides a black matrix including the above-mentioned photosensitive resin composition.

[0282] One embodiment of the present disclosure provides a display device including a color filter.

[0283] The display device may be any one of a plasma display panel (PDP), a light emitting diode (LED), an organic light emitting diode (OLED), a liquid crystal display (LCD), a thin film transistor-liquid crystal display (LCD-TFT), and a cathode ray tube (CRT).

[0284] One embodiment of the present disclosure provides an electronic device including the above-mentioned black matrix.

[0285] The electronic device may include all of the following: an interlayer insulating film of a semiconductor device, the above-mentioned color filter, the above-mentioned black matrix, an outer coating, a columnar spacer, a passivation film, a buffer coating film, an insulating film for a multi-layer printed substrate, an outer coating of a flexible copper clad laminate, a buffer coating film, an insulating film solder resist for a multi-layer printed substrate, an insulating film of an OLED, a protective film for a thin film transistor of a liquid crystal display device, an electrode protective film and a semiconductor protective film of an organic EL device, an OLED insulating film, an LCD insulating film, a semiconductor insulating film, the above-mentioned display device, etc., but is not limited to these.

[0286] Embodiments of the invention

[0287] Hereinafter, the present disclosure will be described in detail with reference to embodiments to specifically describe the present disclosure. However, the embodiments according to the present disclosure can be modified into various different forms, and the scope of the present disclosure should not be interpreted as being limited to the embodiments described below. The embodiments of the present disclosure are provided to more fully describe the present disclosure to those of ordinary skill in the art.

[0288] Preparation Example

[0289] <Preparation Example of Resin A>

[0290] In a round-bottom flask, 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (Bis-AP-AF) (14.4 g, 0.31 mol) was introduced into propylene glycol monomethyl ether acetate (PGMEA) (500 g) and dissolved therein at 60°C. Bis(3,4-dicarboxyphenyl)ether dianhydride (ODPA) (91.1 g, 0.29 mol) was added thereto, and after the resultant was stirred for 2 hours, phthalic anhydride (7.2 g, 0.03 mol) was added thereto as a capping agent, and the resultant was further stirred for 2 hours. Then, the temperature was raised to 170°C, and the resultant was further stirred for 6 hours. Thereafter, the temperature was lowered to room temperature. The weight average molecular weight (Mw) of the polymerized resin A measured by gel permeation chromatography (GPC) was 15,000 g / mol, and as a result of infrared spectrometer (IR) measurement of the resin A, the degree of imidization (DOI) was 92%. The weight average molecular weight of the polymerized resin A was measured by gel permeation chromatography in tetrahydrofuran (THF) solvent.

[0291] <Preparation Example of Resins A1 and A2>

[0292] The polymerized resin A solution was stirred at room temperature. Based on the total equivalent of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (Bis-AP-AF) of 100 mol% of resin A, acryloyloxyethyl isocyanate (2-isocyanatoethyl acrylate, AOI, CAS 13641-96-8) was added at 20 mol% and 60 mol%. The reactor temperature was raised to 60°C and the resultant was stirred for 12 hours to polymerize resins A1 and A2, respectively. The weight average molecular weight (Mw) of the polymerized resins A1 and A2 measured by gel permeation chromatography (GPC) was 9,730 g / mol and 9,840 g / mol, and as a result of infrared spectrometer (IR) measurement of resins A1 and A2, the degree of imidization (DOI) was 93.90% and 93.80%.

[0293] <Preparation of Resins B and C>

[0294] Resins B and C were prepared in the same manner as in the preparation example of Resin A, except that the reaction materials were prepared as shown in Table 1 below.

[0295] [Table 1]

[0296]

[0297] In Table 1, Bis-APAF is 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane, ODPA is bis(3,4-dicarboxyphenyl)ether dianhydride, 6FDA is 4,4'-(hexafluoroisopropylidene)diphthalic anhydride, PA is phthalic anhydride, PGMEA is propylene glycol monomethyl ether acetate, TFMB is 2,2'-bis(trifluoromethyl)benzidine, Mw is weight average molecular weight, and PDI means molecular weight distribution.

[0298] <Preparation of Resins B1 and B2>

[0299] The polymerized Resin B solution was stirred at room temperature. Acryloyloxyethyl isocyanate (2-isocyanatoethyl acrylate, AOI, CAS 13641-96-8) was added at 20 mol% and 40 mol% based on 100 mol% of the total equivalent of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (Bis-AP-AF) in Resin B. The reactor temperature was raised to 60°C, and the resultant was stirred for 12 hours to polymerize Resins B1 and B2, respectively.

[0300] The weight average molecular weight (Mw) of the polymerized resins B1 and B2 measured by gel permeation chromatography (GPC) was 8,150 g / mol and 8,320 g / mol, and as a result of infrared spectrometer (IR) measurement of the resins B1 and B2, the degree of imidization (DOI) was 94.40% and 94.30%.

[0301] <Examples 1 to 4 and Comparative Examples 1 to 3>

[0302] As shown in Table 2 below, using binder resins A, B, C, A1, A2, B1, and B2 prepared by the preparation examples, photosensitive resin compositions containing an alkali-soluble polyimide resin were prepared as Examples 1 to 4, and photosensitive resin compositions not containing an alkali-soluble polyimide resin were prepared as Comparative Examples 1 to 3.

[0303] [Table 2]

[0304]

[0305] In Table 2, the colorant includes a pigment, a dispersant, and a binder for dispersion. Relative to 100 parts by weight of the colorant, the weight ratios of the pigment, the dispersant, and the binder for dispersion in the colorant are 15 parts by weight, 3 parts by weight, and 3 parts by weight, respectively. As a pigment, OBP-1 from BASF Corporation was used, and as a solvent for preparing the colorant, propylene glycol monomethyl ether acetate (PGMEA) was used. As the dispersant and the binder for dispersion included in the colorant, the same resin as the binder resin used in each of Examples 1 to 4 and Comparative Examples 1 to 3 was used. Specifically, as the dispersant and the binder for dispersion of Example 1, the binder resin used in Example 1 (a polymer compound obtained by mixing Resin A and Resin A1 at 15.78 parts by weight and 23.68 parts by weight) was used, and relative to 100 parts by weight of the solid content of the photosensitive resin composition, the dispersant and the binder for dispersion were used at 4.80 parts by weight and 4.80 parts by weight, respectively. As another example, the binder resin used in Example 2 (a polymer compound obtained by mixing Resin B and Resin A1 at 7.89 parts by weight and 31.57 parts by weight, respectively) was used as the dispersant and binder for dispersion in Example 2. The dispersant and binder for dispersion were used in amounts of 4.80 parts by weight and 4.80 parts by weight, respectively, relative to 100 parts by weight of the solid content of the photosensitive resin composition. The dispersants and binders for dispersion in Examples 3 and 4 were also selected and used in a manner similar to the dispersants and binders for dispersion in Examples 1 and 2. The binder resin used in Comparative Example 1 (a polymer compound obtained by mixing Resin A and ACRYL A at 31.57 parts by weight and 7.89 parts by weight, respectively) was used as the dispersant and binder for dispersion in Comparative Example 1. The dispersant and binder were used in amounts of 4.80 parts by weight and 4.80 parts by weight, respectively, relative to 100 parts by weight of the solid content of the photosensitive resin composition. As another example, as the dispersant and the binder for dispersion of Comparative Example 2, the binder resin used in Comparative Example 2 (a polymer compound obtained by mixing ACRYL A and PHS A at 7.89 parts by weight and 31.57 parts by weight, respectively) was used, and the dispersant and the binder for dispersion were used in an amount of 4.80 parts by weight and 4.80 parts by weight, respectively, relative to 100 parts by weight of the solid content of the photosensitive resin composition. The dispersant and the binder for dispersion of Comparative Example 3 were also selected and used in a manner similar to the dispersants and the binders for dispersion of Comparative Examples 1 and 2.

[0306] ACRYL A of Table 2 is an acrylic resin including repeating units represented by the following structural formulas A-1 to A-3.

[0307] [Structural Formula A-1]

[0308]

[0309] [Structural Formula A-2]

[0310]

[0311] [Structural Formula A-3]

[0312]

[0313] In structural formulas A-1 to A-3 included in ACRYL A in Table 2, a:b:c is 0.55:0.25:0.20.

[0314] The molecular weight of ACRYLA is 13,000 g / mol.

[0315] PHS A of Table 2 is an acrylic resin including repeating units represented by the following structural formulas A-4 and A-5.

[0316] [Structural Formula A-4]

[0317]

[0318] [Structural Formula A-5]

[0319]

[0320] In structural formulas A-4 and A-5 included in PHS A in Table 2, d:e is 0.4:0.6.

[0321] The molecular weight of PHS A is 8,000 g / mol.

[0322] In Table 2, DPHA is diphenyl pentaerythritol hexaacrylate, BYK-331 is a dispersant (surfactant) from BYK-Chemie GmbH, OXE02 is a photopolymerization initiator from BASF Corporation, MEDG is diethylene glycol methyl ethyl ether, and GBL is γ-butyrolactone.

[0323] <Experimental Example>

[0324] Evaluation of outgassing and heat resistance

[0325] For the photosensitive resin compositions of Examples 1 to 4 and the photosensitive resin compositions of Comparative Examples 1 to 3 not including an alkali-soluble polyimide resin, outgassing and heat resistance were measured using the following methods, and the results are shown in Table 3 below.

[0326] -Exhaust gas measurement

[0327] 1. Method for preparing samples for exhaust gas measurement

[0328] The composition was coated on a 100 mm × 100 mm × 0.5 T glass substrate and spin-coated, with the RPM rate set to a thickness of 1.0 μm after the final curing process. The coated substrate was placed in a vacuum chamber dryer (VCD) at 45 Pa under vacuum to remove the solvent. The substrate was heated on a 100 ° C hot plate for 120 seconds to remove the solvent. The negative composition was exposed to 50 mJ using an exposure device. The exposed surface was exposed to a developer solution for 120 seconds. The substrate was cured in a 230 ° C convection oven for 30 minutes.

[0329] 2. Methods for measuring exhaust

[0330] The prepared sample was cut into 10 mm x 70 mm dimensions and introduced into a PAT tube. Substances generated by heating the sample at 230°C for 30 minutes were purged and trapped using a purge-and-trap sampler and analyzed using P&T GC / MS. The resulting value was calculated as ng / cm by area relative to a toluene standard solution. 2 , and are expressed as absolute values, however, relative comparisons are made because the values ​​may vary depending on the sample or instrument conditions. The amounts of exhaust gas obtained by the analysis are described in Table 3 below.

[0331] -Heat resistance measurement

[0332] The coated surface of the prepared sample was scraped off with a knife and analyzed using a thermogravimetric analysis (TGA) method. The inflection point was measured when the temperature was increased from 25°C (room temperature) to 450°C at a heating rate of 10°C under a nitrogen atmosphere. The measured inflection point values ​​are described in Table 3 below.

[0333] [Table 3]

[0334]

[0335] As can be seen from Table 3, the amount of outgassing generated by the photosensitive resin composition according to one embodiment of the present disclosure is reduced compared to the photosensitive resin composition not according to the present disclosure. Specifically, the amount of outgassing generated according to Examples 1 to 4 is 23 ng / cm 2 Up to 33ng / cm 2 , which is less than the amount of exhaust gas generated according to Comparative Examples 1 to 3, 94 ng / cm 2 to 221ng / cm 2 In particular, according to Example 1 and Comparative Example 3, the amount of generated outgas of the photosensitive resin composition including the alkali-soluble polyimide resin according to one embodiment of the present disclosure was reduced by as much as about 89.59%, as compared with the amount of generated outgas of the photosensitive resin composition not including the alkali-soluble polyimide resin, and the effect of significantly reducing the amount of generated outgas was confirmed.

[0336] As can be seen from Table 3, the photosensitive resin composition according to one embodiment of the present disclosure has excellent heat resistance compared to the photosensitive resin composition not according to the present disclosure. Specifically, the heat resistance values ​​measured according to Examples 1 to 4 were 362° C. to 368° C., which were higher than the heat resistance values ​​of 324° C., 296° C., or 275° C. measured according to Comparative Examples 1 to 3. In particular, according to Example 4 and Comparative Example 3, the heat resistance of the photosensitive resin composition including the alkali-soluble polyimide resin according to one embodiment of the present disclosure was improved by as much as about 33.82% compared to the heat resistance of the photosensitive resin composition not including the alkali-soluble polyimide resin, and was confirmed to have excellent heat resistance.

Claims

1. A photosensitive resin composition comprising: an alkali-soluble polyimide resin comprising repeating units represented by the following Chemical Formulas 1 to 3; and Solvent: [Chemical Formula 1] [Chemical Formula 2] [Chemical Formula 3] in, In Chemical Formulas 1 to 3, X1 to X3 are the same as or different from each other and are each independently a tetravalent organic group; Y1 to Y3 are the same as or different from each other and are each independently a divalent organic group; and Y2 includes a group represented by the following chemical formula A, [Chemical Formula A] In chemical formula A, R7 is hydrogen; deuterium; hydroxyl; halogen; nitro; nitrile; substituted or unsubstituted alkyl; substituted or unsubstituted alkenyl; substituted or unsubstituted alkynyl; substituted or unsubstituted alkoxy; substituted or unsubstituted aryloxy; substituted or unsubstituted cycloalkyl; substituted or unsubstituted aryl; substituted or unsubstituted heterocyclic; or a photopolymerizable unsaturated group; It means the site of bonding with Y2 of Chemical Formula 2; m to p are each independently an integer from 1 to 500, and For m to p in Chemical Formulas 1 to 3, p / (m+n+p) is 0.03 to 0.

15.

2. The photosensitive resin composition according to claim 1, comprising at least one of a binder resin; and a colorant, wherein at least one of the binder resin and the colorant contains the alkali-soluble polyimide resin. 3 . The photosensitive resin composition according to claim 2 , wherein the colorant comprises at least one of a dispersant and a binder for dispersion; and a pigment. 4 . The photosensitive resin composition according to claim 3 , wherein at least one of the dispersant and the binder for dispersion comprises the alkali-soluble polyimide resin.

5. The photosensitive resin composition according to claim 1, comprising: binder resin; and colorants, wherein the binder resin and the colorant include the alkali-soluble polyimide resin.

6. The photosensitive resin composition according to claim 5, comprising: relative to 100 parts by weight of the solid content of the photosensitive resin composition, 15 to 50 parts by weight of the binder resin; and 14 to 50 parts by weight of the colorant. 7 . The photosensitive resin composition according to claim 5 , wherein the colorant comprises a pigment, a dispersant, and a binder for dispersion, and the dispersant and the binder for dispersion comprise the alkali-soluble polyimide resin.

8. The photosensitive resin composition according to claim 7, wherein Relative to 100 parts by weight of the solid content of the photosensitive resin composition, The content of the pigment is 10 to 40 parts by weight; The content of the dispersant is 2 parts by weight to 15 parts by weight; and The content of the binder for dispersion is 2 parts by weight to 15 parts by weight. 9 . The photosensitive resin composition according to claim 1 , wherein X 1 to X 3 are the same as or different from each other and are each independently a tetravalent organic group derived from oxydiphthalic anhydride or a derivative thereof. 10 . The photosensitive resin composition according to claim 1 , wherein Y1 to Y3 are the same as or different from each other, and are each independently a divalent organic group including a hydroxyl group, a phenolic hydroxyl group, or a halogenated alkyl group. The photosensitive resin composition according to claim 1 , wherein R 7 is a photopolymerizable unsaturated group. 12 . The photosensitive resin composition according to claim 1 , wherein the alkali-soluble polyimide resin of the photosensitive resin composition has a weight average molecular weight of 1,000 g / mol to 35,000 g / mol.

13. The photosensitive resin composition according to claim 1, further comprising: Multifunctional monomers; cross-linking agent; Photopolymerization initiator; surfactants; and Silane coupling agent.

14. The photosensitive resin composition according to claim 13, comprising: relative to 100 parts by weight of the solid content of the photosensitive resin composition, 1 to 40 parts by weight of the multifunctional monomer; 0.1 to 40 parts by weight of the cross-linking agent; 0.1 to 10 parts by weight of the photopolymerization initiator; 0.1 parts by weight to 5 parts by weight of the surfactant; and 0.1 to 2 parts by weight of the silane coupling agent. 15 . The photosensitive resin composition according to claim 13 , wherein the content of the alkali-soluble hydroxyl group is 30 to 85 parts by weight relative to 100 parts by weight of the multifunctional monomer. 16 . A photosensitive material comprising the photosensitive resin composition according to claim 1 . 17 . A black matrix comprising the photosensitive resin composition according to claim 1 . 18 . An electronic device comprising the photosensitive resin composition according to claim 1 .

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