Pressure sensor device

Abstract

A pressure sensor device is of a type that detects a change in electrostatic capacitance between electrodes, and includes a base unit (10) that contains engaging portions (11a to 11d) for engaging with a mounting substrate, and a swing unit (30) that is swingable with respect to the base unit (10). A capacitor is provided in the swing unit (30), and the capacitor contains a diaphragm (21) that is deformable in accordance with a surrounding pressure difference as a sensor electrode, and an opposing electrode (22) that is disposed separately from the diaphragm (21). In a plan view as viewed in a normal direction of the diaphragm (21), the diaphragm (21) is disposed in a manner not overlapping with the base unit (10). With such a structure, deformation, breakage, and characteristic change of the diaphragm caused by an impact from the outside can be suppressed.

Description

Technical Field

[0001] This invention relates to a pressure sensor device for measuring pressures such as air pressure and water pressure, as well as pressure changes. Background Technology

[0002] Pressure sensors can be manufactured using MEMS (Micro-Electro-Mechanical Systems) technology, which applies semiconductor manufacturing techniques, enabling the creation of ultra-miniature sensors ranging from approximately 0.5 mm to 2 mm square. A typical pressure sensor has a capacitor structure with two electrodes, allowing pressure measurement by detecting changes in electrostatic capacitance caused by variations in ambient pressure.

[0003] Patent Document 1 discloses a surface-mount pressure sensor using solder balls. This pressure sensor has a structure designed to isolate the diaphragm portion of the pressure sensor from the stress applied during mounting with solder balls. It features an integrated circuit and diaphragm structure, with a gap between the bonding substrate carrying the solder balls and the support substrate carrying the diaphragm for stress isolation. The support substrate is supported on the bonding substrate using a cantilever beam structure.

[0004] Patent document 2 discloses a pressure sensor in which multiple piezoelectric resistor elements are arranged in a spacer. A through groove is formed around the spacer with a connection portion, and it is supported by a cantilever beam structure.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: European Patent Publication No. 2871456A1 ( Figure 1 )

[0008] Patent Document 2: Japanese Patent Application Publication No. 2017-156241 ( Figure 2 ) Summary of the Invention

[0009] The problem the invention aims to solve

[0010] In the manufacturing process of electronic devices such as smartwatches and smartphones, when pressure sensors are mounted onto a substrate, it is envisioned that the sensor body will be subjected to impacts generated by the chip mounting machine. Furthermore, it is also envisioned that when using such electronic devices, significant impacts on the sensor body may occur due to user handling, drops, or other factors.

[0011] In Patent Document 1, the support substrate for the diaphragm is supported by a cantilever beam structure. Therefore, if an impact is applied to the sensor body, the support substrate will vibrate up and down. If the amplitude of the vibration is greater than the gap, the support substrate may sometimes collide with the bonding substrate, causing deformation or damage to the diaphragm. Furthermore, when vibration is applied during use, the change in gap causes a change in the pressure on the upper part of the diaphragm, thus altering the diaphragm characteristics. Therefore, it is assumed that the error in the air pressure value caused by vibration will be larger than usual.

[0012] The purpose of this invention is to provide a pressure sensor device capable of suppressing deformation, damage, and characteristic changes of the diaphragm caused by external impacts.

[0013] Solution for solving the problem

[0014] One technical solution of the present invention is a pressure sensor device for detecting changes in electrostatic capacitance between electrodes. The pressure sensor device includes: a base unit having a joint for engaging with a mounting substrate; and a swing unit capable of swinging relative to the base unit. The swing unit is provided with a capacitor, which includes a diaphragm as a sensor electrode capable of deforming according to an ambient pressure difference and opposing electrodes disposed separately from the diaphragm. In a top view viewed along the normal direction of the diaphragm, the diaphragm is disposed in a manner that does not overlap with the base unit.

[0015] The effects of the invention

[0016] According to the present invention, it is possible to suppress the deformation, damage, and property changes of the diaphragm caused by external impacts. Attached Figure Description

[0017] Figure 1 (A) is a top view showing an example of the construction of a pressure sensor device according to Embodiment 1 of the present invention. Figure 1 (B) Figure 1 (D) is along Figure 1 A sectional view of lines X1-X1, X2-X2, and X3-X3 in (A).

[0018] Figure 2 (A) is a top view showing an example of the construction of the pressure sensor device according to Embodiment 2 of the present invention. Figure 2 (B) Figure 2 (C) is along Figure 2 A sectional view of lines X1-X1 and X2-X2 in (A).

[0019] Figure 3 (A) is a top view showing an example of the construction of the pressure sensor device according to Embodiment 3 of the present invention. Figure 3(B) Figure 3 (C) is along Figure 3 A sectional view of lines X1-X1 and X2-X2 in (A).

[0020] Figure 4 (A) is a top view illustrating an example of the construction of a pressure sensor device according to Embodiment 4 of the present invention. Figure 4 (B) Figure 4 (C) is along Figure 4 A sectional view of lines X1-X1 and X2-X2 in (A).

[0021] Figure 5 (A) is a top view illustrating an example of the construction of the pressure sensor device according to Embodiment 5 of the present invention. Figure 5 (B) is along Figure 5 A sectional view of line X1-X1 in (A).

[0022] Figure 6 This is a top view showing an example of the construction of a pressure sensor device according to Embodiment 6 of the present invention.

[0023] Figure 7 This is a top view showing an example of the construction of a pressure sensor device according to Embodiment 7 of the present invention.

[0024] Figure 8 This is a top view showing an example of the construction of a pressure sensor device according to Embodiment 8 of the present invention.

[0025] Figure 9 This is a top view showing an example of the construction of a pressure sensor device according to Embodiment 9 of the present invention. Detailed Implementation

[0026] One technical solution of the present invention is a pressure sensor device, wherein the pressure sensor device includes: a base unit having a joint for engaging with a mounting substrate; and a swing unit capable of swinging relative to the base unit, wherein the swing unit is provided with a diaphragm that serves as a sensor electrode and is deformable according to an ambient pressure difference, and in a top view viewed along the normal direction of the diaphragm, the diaphragm is configured in a manner that does not overlap with the base unit.

[0027] According to this structure, in a top view observed along the normal direction of the diaphragm, the diaphragm is configured in a manner that does not overlap with the base unit. Therefore, even if an external impact is applied to the sensor body, causing the oscillating unit to vibrate up and down, the diaphragm will not collide with the base unit. As a result, deformation, damage, and property changes of the diaphragm caused by external impacts can be suppressed.

[0028] Preferably, in this invention, a separation groove is provided between the base unit and the swing unit to separate the base unit and the swing unit, and an elastic connecting part is provided to elastically connect the base unit and the swing unit.

[0029] According to this structure, the presence of the separation groove reduces the moment of inertia of the cross section, thereby increasing the elastic deformation of the elastic connection. This allows for a simple construction where the swinging unit can swing relative to the base unit.

[0030] Preferably, in this invention, the base unit is disposed on the outside of the swing unit.

[0031] This structure allows for an increase in the distance from the joint used to bond with the mounting substrate to the diaphragm. For example, when using solder balls as the joint, the influence of foreign matter caused by flux diffusion can be reduced.

[0032] Preferably, in this invention, the swing unit is disposed on the outside of the base unit.

[0033] This structure allows for an increase in the distance from the joint used to bond with the mounting substrate to the diaphragm. For example, when using solder balls as the joint, the influence of foreign matter caused by flux diffusion can be reduced.

[0034] Preferably, in this invention, the swing unit comprises: a first layer located in the same plane as the base unit; a second layer fixed relative to the first layer with a gap between it and the first layer, wherein the diaphragm is provided in the second layer; and a third layer disposed opposite to the second layer.

[0035] According to this structure, by adopting such a stacked construction, the overall installation area of ​​the sensor can be reduced.

[0036] In this invention, it is preferred that the swing unit has a plurality of diaphragms connected in parallel.

[0037] According to this structure, since the signals obtained from multiple diaphragms are averaged, the deviations in diaphragm characteristics are also averaged, which can reduce measurement errors.

[0038] Preferably, in this invention, the swing unit is provided with an integrated circuit that processes the electrical signals generated by the deformation of the diaphragm.

[0039] According to this structure, since the output of the diaphragm is high impedance, the effect of noise can be reduced by placing the integrated circuit close to the diaphragm.

[0040] In this invention, preferably, the swing unit is provided with a plurality of through-hole terminals, which are used to supply power to the integrated circuit and transmit output signals from the integrated circuit. The base unit is provided with the same number of joints as the through-hole terminals, and the through-hole terminals and the joints are electrically connected by a plurality of conductors.

[0041] According to this structure, since the output of the integrated circuit is low impedance, it is not easily affected by noise even if the signal line becomes longer.

[0042] Preferably, in this invention, the swing unit is provided with a capacitor containing opposing electrodes disposed away from the diaphragm, and the pressure sensor device detects changes in the electrostatic capacitance of the capacitor.

[0043] Based on this structure, changes in ambient pressure can be measured by detecting changes in the electrostatic capacitance of the capacitor.

[0044] In this invention, it is preferred that a counter electrode is provided in the third layer.

[0045] Based on this structure, the relative electrodes of the capacitor can be configured efficiently.

[0046] (Implementation Method 1)

[0047] Figure 1 (A) is a top view showing an example of the construction of a pressure sensor device according to Embodiment 1 of the present invention. Figure 1 (B) Figure 1 (D) is along Figure 1 A sectional view of lines X1-X1, X2-X2, and X3-X3 in (A).

[0048] The pressure sensor device includes a base unit 10 and a swing unit 30 disposed inside the base unit 10. The base unit 10 has an electrically insulating substrate on which multiple (e.g., four) joints 11a to 11d are provided for engaging with a mounting substrate assembled into a product. The joints 11a to 11d are made of, for example, solder balls, conductive adhesive, etc., and serve as electrical and mechanical connections.

[0049] The swing unit 30 is supported to swing relative to the base unit 10, and a cantilever beam structure is illustrated here. To achieve such a swing support structure, a letter-C shaped separation groove 5 that largely separates the two and an elastic connection portion 6 that elastically connects the two are provided between the base unit 10 and the swing unit 30. By adjusting the Young's modulus, cross-sectional shape, moment of inertia, etc. of the material, the elastic modulus of the elastic connection portion 6 can be set to a desired value.

[0050] like Figure 1As shown in (B), the oscillation unit 30 includes an oscillation substrate 31 configured as a first layer, a diaphragm substrate 32 configured as a second layer, and an integrated circuit 33 and a chip 34 configured as a third layer. By adopting such a stacked structure, the overall installation area of ​​the sensor can be reduced.

[0051] A capacitor is provided in the swing unit 30, which includes a diaphragm 21 that can deform according to the ambient pressure difference, serving as a sensor electrode, and a counter electrode 22 disposed separately from the diaphragm 21. The electrostatic capacitance Cs between the electrodes is represented by Cs = ε × S / d, using the dielectric constant ε of the gap, the electrode area S, and the distance d between the electrodes. When the diaphragm 21 elastically deforms according to the pressure difference between the outside and the gap, the distance d between the diaphragm 21 and the counter electrode 22 changes, and the electrostatic capacitance Cs changes accordingly. By measuring the change in this electrostatic capacitance Cs, the change in external pressure can be measured.

[0052] like Figure 1 As shown in (B), the swing unit 30 includes an integrated circuit 33 for processing electrical signals from the capacitor. The integrated circuit 33 is composed of, for example, an ASIC, FPGA, PLD, CPLD, etc., and incorporates analog circuitry and programmable digital circuitry. The integrated circuit 33 is mounted on the chip 34. Since the capacitor's output is high impedance, by placing the integrated circuit 33 close to the capacitor, the effects of noise can be reduced.

[0053] The opposing electrodes 22 of the capacitor are formed directly on the upper surface of the integrated circuit 33. Furthermore, an electrically insulating spacer 32a is provided on the upper surface of the integrated circuit 33 to maintain the gap between the capacitors. A conductive, flexible diaphragm substrate 32 is provided above the spacer 32a, and the area of ​​the diaphragm substrate 32 that does not contact the spacer 32a functions as a deformable diaphragm 21.

[0054] The diaphragm substrate 32 and the spacer portion 32a are provided with through-holes 24 and conductors 25 for electrical connection with the terminals 23 of the integrated circuit 33, and an electrically insulating layer (not shown) is provided between the through-holes 24, conductors 25 and the diaphragm substrate 32. Furthermore, as... Figure 1 (A) and Figure 1As shown in (C), conductive spacers 26 are provided on the upper surface of the diaphragm substrate 32, and through-holes 27a to 27d are provided on the oscillating substrate 31. Through-holes 27a to 27d are electrically connected to junctions 11a to 11d via a plurality of (e.g., four) conductors 28 formed on the upper surface of the oscillating substrate 31. Power can be supplied from the product's mounting substrate to the integrated circuit 33, or output signals from the integrated circuit 33 can be transmitted to the mounting substrate via these terminals 23, through-holes 24, conductors 25, spacers 26, through-holes 27a to 27d, conductors 28, and junctions 11a to 11d.

[0055] As a circuit used in integrated circuit 33, it typically has four lines: a power line, a ground line, and two signal lines.

[0056] In this embodiment, a top view (see reference) is taken along the normal direction of the diaphragm 21. Figure 1 In (A), the diaphragm 21 is configured not to overlap with the base unit 10. Therefore, even if an external impact is applied to the sensor body causing the oscillating unit 30 to vibrate up and down, the diaphragm 21 will not collide with the base unit 10. As a result, deformation, damage, and changes in properties of the diaphragm caused by external impacts can be suppressed.

[0057] Furthermore, the base unit 10 is disposed on the outside of the swing unit 30 across the separation groove 5. This increases the distance from the joints 11a to 11d used for joining with the mounting substrate to the diaphragm 21. For example, when solder balls are used as the joints 11a to 11d, the influence of foreign matter caused by flux diffusion, etc., can be reduced.

[0058] (Implementation Method 2)

[0059] Figure 2 (A) is a top view showing an example of the construction of the pressure sensor device according to Embodiment 2 of the present invention. Figure 2 (B) Figure 2 (C) is along Figure 2 A cross-sectional view along lines X1-X1 and X2-X2 in (A). The basic structure and operation of this embodiment are similar to those of Embodiment 1, except that the swing unit 30 is positioned outside the base unit 10.

[0060] The pressure sensor device includes a base unit 10 and a swing unit 30 disposed outside the base unit 10. The base unit 10 has an electrically insulating substrate on which a plurality of (e.g., four) joints 11a to 11d are provided.

[0061] The swing unit 30 is supported so that it can swing relative to the base unit 10, and a cantilever beam structure is illustrated here. In order to achieve such a swing support structure, a letter C-shaped separation groove 5 that separates most of the two and an elastic connection part 6 that elastically connects the two are provided between the base unit 10 and the swing unit 30.

[0062] like Figure 2 As shown in (B), the oscillating unit 30 includes an oscillating substrate 31 configured as a first layer, a diaphragm substrate 32 configured as a second layer, and an integrated circuit 33 and a wafer 34 configured as a third layer.

[0063] The oscillating unit 30 is provided with a plurality of (e.g., three) capacitors, each comprising a plurality of (e.g., three) diaphragms 21a-21c that deform according to the ambient pressure difference, serving as sensor electrodes, and a plurality of (e.g., three) opposing electrodes 22a-22c (opposite electrodes 22c not shown) arranged separately from the diaphragms 21a-21c. These capacitors are connected in parallel via internal wiring (not shown). By providing a plurality of capacitors, the total area of ​​the capacitors is increased, thereby improving the sensitivity to pressure changes. Furthermore, since the signals obtained from the plurality of capacitors are averaged, deviations in the capacitor characteristics are also averaged, resulting in a reduction in measurement error.

[0064] like Figure 2 As shown in (B), the swing unit 30 is provided with an integrated circuit 33 for processing electrical signals from the capacitor.

[0065] The opposing electrodes 22a to 22c of the capacitor are formed directly on the upper surface of the integrated circuit 33. Furthermore, an electrically insulating spacer 32a is provided on the upper surface of the integrated circuit 33 to maintain the gap between the capacitors. A conductive, flexible diaphragm substrate 32 is provided above the spacer 32a, and the area of ​​the diaphragm substrate 32 that does not contact the spacer 32a functions as deformable diaphragms 21a to 21c.

[0066] The diaphragm substrate 32 and the spacer portion 32a are provided with through-holes 24 and conductors 25 for electrical connection with the terminals 23 of the integrated circuit 33, and an electrically insulating layer (not shown) is provided between the through-holes 24, conductors 25 and the diaphragm substrate 32. Furthermore, as... Figure 2 (A) and Figure 2As shown in (C), conductive spacers 26 are provided on the upper surface of the diaphragm substrate 32, and through-holes 27a to 27d are provided on the oscillating substrate 31. Through-holes 27a to 27d are electrically connected to junctions 11a to 11d via a plurality of (e.g., four) conductors 28 formed on the upper surface of the oscillating substrate 31. Power can be supplied from the product's mounting substrate to the integrated circuit 33, or output signals from the integrated circuit 33 can be transmitted to the mounting substrate via these terminals 23, through-holes 24, conductors 25, spacers 26, through-holes 27a to 27d, conductors 28, and junctions 11a to 11d.

[0067] In this embodiment, the top view is also observed along the normal direction of the diaphragms 21a to 21c (see reference). Figure 2 In (A), the diaphragms 21a to 21c are arranged in a manner that does not overlap with the base unit 10. Therefore, even if an external impact is applied to the sensor body causing the oscillating unit 30 to vibrate up and down, the diaphragms 21a to 21c will not collide with the base unit 10. As a result, deformation, damage, and changes in properties of the diaphragms caused by external impacts can be suppressed.

[0068] Furthermore, the base unit 10 is disposed inside the swing unit 30 across the separation groove 5. This increases the distance from the joints 11a-11d used for bonding with the mounting substrate to the diaphragms 21a-21c. For example, when solder balls are used as the joints 11a-11d, the influence of foreign matter caused by flux diffusion can be reduced.

[0069] (Implementation Method 3)

[0070] Figure 3 (A) is a top view showing an example of the construction of the pressure sensor device according to Embodiment 3 of the present invention. Figure 3 (B) Figure 3 (C) is along Figure 3 A cross-sectional view along lines X1-X1 and X2-X2 in (A). The basic structure and operation of this embodiment are similar to those of Embodiment 1, except that the swing unit 30 is arranged to the side of the base unit 10.

[0071] The pressure sensor device includes a base unit 10 and a swing unit 30 disposed to the side of the base unit 10. The base unit 10 has an electrically insulating substrate on which a plurality of (e.g., four) joints 11a to 11d are provided.

[0072] The swing unit 30 is supported so that it can swing relative to the base unit 10, and a cantilever beam structure is illustrated here. In order to achieve such a swing support structure, a pair of straight separation grooves 5 that separate most of the two and an elastic connecting part 6 that elastically connects the two are respectively provided between the base unit 10 and the swing unit 30.

[0073] like Figure 3 As shown in (B), the oscillating unit 30 includes an oscillating substrate 31 configured as a first layer, a diaphragm substrate 32 configured as a second layer, and an integrated circuit 33 and a wafer 34 configured as a third layer.

[0074] The swing unit 30 is provided with a capacitor, which includes a diaphragm 21 that serves as a sensor electrode and is deformable according to the ambient pressure difference, and opposing electrodes 22 that are respectively arranged separately from the diaphragm 21.

[0075] like Figure 3 As shown in (B), the swing unit 30 is provided with an integrated circuit 33 for processing electrical signals from the capacitor.

[0076] The opposing electrodes 22 of the capacitor are formed directly on the upper surface of the integrated circuit 33. Furthermore, an electrically insulating spacer 32a is provided on the upper surface of the integrated circuit 33 to maintain the gap between the capacitors. A conductive, flexible diaphragm substrate 32 is provided above the spacer 32a, and the area of ​​the diaphragm substrate 32 that does not contact the spacer 32a functions as a deformable diaphragm 21.

[0077] The diaphragm substrate 32 and the spacer portion 32a are provided with through-holes 24 and conductors 25 for electrical connection with the terminals 23 of the integrated circuit 33, and an electrically insulating layer (not shown) is provided between the through-holes 24, conductors 25 and the diaphragm substrate 32. Furthermore, as... Figure 3 (A) and Figure 3 As shown in (B), conductive spacers 26 are provided on the upper surface of the diaphragm substrate 32, and through-holes 27a to 27d are provided on the oscillating substrate 31. Through-holes 27a to 27d are electrically connected to junctions 11a to 11d via a plurality of (e.g., four) conductors 28 formed on the upper surface of the oscillating substrate 31. Power can be supplied from the product's mounting substrate to the integrated circuit 33, or output signals from the integrated circuit 33 can be transmitted to the mounting substrate via these terminals 23, through-holes 24, conductors 25, spacers 26, through-holes 27a to 27d, conductors 28, and junctions 11a to 11d.

[0078] In this embodiment, the top view (see reference) is also taken along the normal direction of the diaphragm 21. Figure 3In (A), the diaphragm 21 is arranged so as not to overlap with the base unit 10. Therefore, even if an external impact is applied to the sensor body causing the oscillating unit 30 to vibrate up and down, the diaphragm 21 will not collide with the base unit 10. As a result, deformation, damage, and changes in properties of the diaphragm caused by external impacts can be suppressed.

[0079] Furthermore, the base unit 10 is disposed to the side of the swing unit 30 across the separation groove 5. This increases the distance from the joints 11a to 11d used for bonding with the mounting substrate to the diaphragm 21. For example, when solder balls are used as the joints 11a to 11d, the influence of foreign matter caused by flux diffusion, etc., can be reduced.

[0080] (Implementation Method 4)

[0081] Figure 4 (A) is a top view illustrating an example of the construction of a pressure sensor device according to Embodiment 4 of the present invention. Figure 4 (B) Figure 4 (C) is along Figure 4 The cross-sectional view along lines X1-X1 and X2-X2 in (A). The basic structure and operation of this embodiment are similar to those of embodiment 1, except that the base unit 10 is arranged in two separate locations on the diagonal of the swing unit 30.

[0082] The pressure sensor device includes a base unit 10 and a swing unit 30 disposed between two base units 10. The base unit 10 has an electrically insulating substrate on which a plurality of (e.g., four) joints 11a to 11d are provided.

[0083] The swing unit 30 is supported so that it can swing relative to the base unit 10, and the structure of the two end support beams is shown here. In order to realize such a swing support structure, a pair of L-shaped separation grooves 5 that separate most of the two and an elastic connection part 6 that elastically connects the two are provided between the base unit 10 and the swing unit 30.

[0084] like Figure 4 As shown in (B), the oscillating unit 30 includes an oscillating substrate 31 configured as a first layer, a diaphragm substrate 32 configured as a second layer, and an integrated circuit 33 and a wafer 34 configured as a third layer.

[0085] The swing unit 30 is provided with a capacitor, which includes a diaphragm 21 that serves as a sensor electrode and is deformable according to the ambient pressure difference, and opposing electrodes 22 that are respectively arranged separately from the diaphragm 21.

[0086] like Figure 4As shown in (B), the swing unit 30 is provided with an integrated circuit 33 for processing electrical signals from the capacitor.

[0087] The opposing electrodes 22 of the capacitor are formed directly on the upper surface of the integrated circuit 33. Furthermore, an electrically insulating spacer 32a is provided on the upper surface of the integrated circuit 33 to maintain the gap between the capacitors. A conductive, flexible diaphragm substrate 32 is provided above the spacer 32a, and the area of ​​the diaphragm substrate 32 that does not contact the spacer 32a functions as a deformable diaphragm 21.

[0088] The diaphragm substrate 32 and the spacer portion 32a are provided with through holes 24 and conductors 25 for electrical connection to the terminals 23 of the integrated circuit 33. An electrically insulating layer (not shown) is provided between the through holes 24, conductors 25 and the diaphragm substrate 32. In addition, conductive spacers 26 are provided on the upper surface of the diaphragm substrate 32, and through holes 27a to 27d are provided on the swing substrate 31. The through holes 27a to 27d are electrically connected to the junction portions 11a to 11d respectively by means of a plurality (e.g., four) conductors 28 formed on the upper surface of the swing substrate 31. Power can be supplied from the product mounting substrate to the integrated circuit 33, or output signals from the integrated circuit 33 can be transmitted to the mounting substrate via these terminals 23, through holes 24, conductors 25, spacers 26, through holes 27a to 27d, conductors 28 and junction portions 11a to 11d.

[0089] In this embodiment, the top view (see reference) is also taken along the normal direction of the diaphragm 21. Figure 4 In (A), the diaphragm 21 is configured not to overlap with the base unit 10. Therefore, even if an external impact is applied to the sensor body causing the oscillating unit 30 to vibrate up and down, the diaphragm 21 will not collide with the base unit 10. As a result, deformation, damage, and changes in properties of the diaphragm caused by external impacts can be suppressed.

[0090] Furthermore, the base unit 10 is arranged diagonally across the oscillating unit 30 at two locations, separated by the separation groove 5. This increases the distance from the joints 11a to 11d used for bonding with the mounting substrate to the diaphragm 21. For example, when solder balls are used as the joints 11a to 11d, the influence of foreign matter caused by flux diffusion can be reduced.

[0091] (Implementation Method 5)

[0092] Figure 5 (A) is a top view illustrating an example of the construction of the pressure sensor device according to Embodiment 5 of the present invention. Figure 5 (B) is along Figure 5A cross-sectional view along line X1-X1 in (A). The basic structure and operation of this embodiment are similar to those of Embodiment 1, but differ in this respect: multiple capacitors are arranged in the swing unit 30.

[0093] The pressure sensor device includes a base unit 10 and a swing unit 30 disposed inside the base unit 10. The base unit 10 has an electrically insulating substrate on which a plurality of (e.g., four) joints 11a to 11d are provided.

[0094] The swing unit 30 is supported so that it can swing relative to the base unit 10, and a cantilever beam structure is illustrated here. In order to achieve such a swing support structure, a letter C-shaped separation groove 5 that separates most of the two and an elastic connection part 6 that elastically connects the two are provided between the base unit 10 and the swing unit 30.

[0095] like Figure 5 As shown in (B), the oscillating unit 30 includes an oscillating substrate 31 configured as a first layer, a diaphragm substrate 32 configured as a second layer, and an integrated circuit 33 and a wafer 34 configured as a third layer.

[0096] The oscillating unit 30 is provided with a plurality of (e.g., four) capacitors, each comprising a plurality of (e.g., four) diaphragms 21a-21d that deform according to the ambient pressure difference, serving as sensor electrodes, and a plurality of (e.g., four) opposing electrodes 22a-22d (opposite electrodes 22c-22d are not shown) arranged separately from the diaphragms 21a-21d. These capacitors are connected in parallel via internal wiring (not shown). By providing a plurality of capacitors, the total area of ​​the capacitors is increased, thereby improving the sensitivity to pressure changes. Furthermore, since the signals obtained from the plurality of capacitors are averaged, deviations in the capacitor characteristics are also averaged, resulting in a reduction in measurement error.

[0097] like Figure 5 As shown in (B), the swing unit 30 is provided with an integrated circuit 33 for processing electrical signals from the capacitor.

[0098] The opposing electrodes 22a to 22d of the capacitor are formed directly on the upper surface of the integrated circuit 33. Furthermore, an electrically insulating spacer 32a is provided on the upper surface of the integrated circuit 33 to maintain the gap between the capacitors. A conductive, flexible diaphragm substrate 32 is provided above the spacer 32a, and the area of ​​the diaphragm substrate 32 that does not contact the spacer 32a functions as deformable diaphragms 21a to 21d.

[0099] The diaphragm substrate 32 and the spacer portion 32a are provided with through holes 24 and conductors 25 for electrical connection to the terminals 23 of the integrated circuit 33. An electrically insulating layer (not shown) is provided between the through holes 24, conductors 25 and the diaphragm substrate 32. In addition, conductive spacers 26 are provided on the upper surface of the diaphragm substrate 32, and through holes 27a to 27d are provided on the swing substrate 31. The through holes 27a to 27d are electrically connected to the junction portions 11a to 11d respectively by means of a plurality (e.g., four) conductors 28 formed on the upper surface of the swing substrate 31. Power can be supplied from the product mounting substrate to the integrated circuit 33, or output signals from the integrated circuit 33 can be transmitted to the mounting substrate via these terminals 23, through holes 24, conductors 25, spacers 26, through holes 27a to 27d, conductors 28 and junction portions 11a to 11d.

[0100] In this embodiment, the top view (see reference) is also taken along the normal direction of the diaphragms 21a to 21d. Figure 5 In (A), the diaphragms 21a to 21d are arranged in a manner that does not overlap with the base unit 10. Therefore, even if an external impact is applied to the sensor body causing the oscillating unit 30 to vibrate up and down, the diaphragms 21a to 21d will not collide with the base unit 10. As a result, deformation, damage, and changes in properties of the diaphragms caused by external impacts can be suppressed.

[0101] Furthermore, the base unit 10 is disposed on the outside of the swing unit 30 across the separation groove 5. This allows for an increase in the distance from the joints 11a-11d used for joining with the mounting substrate to the diaphragms 21a-21d. For example, when solder balls are used as the joints 11a-11d, the influence of foreign matter caused by flux diffusion, etc., can be reduced.

[0102] (Implementation Method 6)

[0103] Figure 6 This is a top view showing an example of the structure of the pressure sensor device according to Embodiment 6 of the present invention. Since the cross-sectional view showing the internal structure is the same as the view described in Embodiments 1 to 5, repeated descriptions are omitted. The basic structure and operation of this embodiment are similar to those of Embodiment 1, but the difference lies in that the base unit 10 is separately arranged in two locations on the left and right sides of the swing unit 30.

[0104] The pressure sensor device includes a base unit 10 and a swing unit 30 disposed between two base units 10. The base unit 10 has an electrically insulating substrate on which a plurality of (e.g., four) joints 11a to 11d are provided.

[0105] The swing unit 30 is supported so that it can swing relative to the base unit 10, and the structure of the two end support beams is shown here. In order to achieve such a swing support structure, two pairs of L-shaped separation grooves 5 that separate most of the two and elastic connecting parts 6 that elastically connect the two are provided between the base unit 10 and the swing unit 30.

[0106] The swing unit 30 is provided with a capacitor, which includes a diaphragm 21 that serves as a sensor electrode and is deformable according to the ambient pressure difference, and opposing electrodes (not shown) that are respectively arranged separately from the diaphragm 21.

[0107] The oscillating unit 30 is also provided with an integrated circuit (not shown) for processing electrical signals from the capacitor. The oscillating substrate of the oscillating unit 30 is provided with vias 27a to 27d that are electrically connected to the integrated circuit. The vias 27a to 27d are electrically connected to the joints 11a to 11d respectively by means of a plurality of (e.g., four) conductors 28 formed on the upper surface of the oscillating substrate.

[0108] In this embodiment, the top view (see reference) is also taken along the normal direction of the diaphragm 21. Figure 6 In this configuration, the diaphragm 21 is arranged so as not to overlap with the base unit 10. Therefore, even if an external impact is applied to the sensor body causing the oscillating unit 30 to vibrate up and down, the diaphragm 21 will not collide with the base unit 10. As a result, deformation, damage, and changes in properties of the diaphragm caused by external impacts can be suppressed.

[0109] (Implementation Method 7)

[0110] Figure 7 This is a top view showing an example of the structure of the pressure sensor device according to Embodiment 7 of the present invention. Since the cross-sectional view showing the internal structure is the same as the view described in Embodiments 1 to 5, repeated descriptions are omitted. The basic structure and operation of this embodiment are similar to those of Embodiment 1, but the difference lies in that the swing unit 30 is separately arranged in two parts on the left and right sides of the base unit 10.

[0111] The pressure sensor device includes a base unit 10 and swing units 30 disposed on the left and right sides of the base unit 10. The base unit 10 has an electrically insulating substrate on which a plurality of (e.g., four) joints 11a to 11d are provided.

[0112] The swing unit 30 is supported so that it can swing relative to the base unit 10, and a cantilever beam structure is illustrated here. In order to achieve such a swing support structure, two pairs of L-shaped separation grooves 5 that separate most of the two and an elastic connecting part 6 that elastically connects the two are provided between the base unit 10 and the swing unit 30.

[0113] The oscillating unit 30 is provided with a capacitor comprising multiple (e.g., two) diaphragms 21a, 21b that are deformable according to the ambient pressure difference, serving as sensor electrodes, and multiple (e.g., two) opposing electrodes (not shown) respectively arranged separately from the diaphragms 21a, 21b. These capacitors are connected in parallel via internal wiring (not shown).

[0114] The oscillating unit 30 also includes an integrated circuit (not shown) for processing electrical signals from the capacitor. The oscillating substrate of the oscillating unit 30 has vias 27a to 27d that are electrically connected to the integrated circuit. The vias 27a to 27d are electrically connected to the junctions 11a to 11d via a plurality of conductors 28 formed on the upper surface of the oscillating substrate.

[0115] In this embodiment, the top view (see reference) is also taken along the normal direction of the diaphragms 21a and 21b. Figure 7 In this configuration, diaphragms 21a and 21b are arranged so as not to overlap with the base unit 10. Therefore, even if an external impact is applied to the sensor body causing the oscillating unit 30 to vibrate up and down, diaphragms 21a and 21b will not collide with the base unit 10. As a result, deformation, damage, and changes in properties of the diaphragms caused by external impacts can be suppressed.

[0116] (Implementation Method 8)

[0117] Figure 8 This is a top view showing an example of the structure of the pressure sensor device according to Embodiment 8 of the present invention. Since the cross-sectional view showing the internal structure is the same as the view described in Embodiments 1 to 5, repeated descriptions are omitted. The basic structure and operation of this embodiment are similar to those of Embodiment 1, except that the base unit 10 is disposed inside the swing unit 30.

[0118] The pressure sensor device includes a base unit 10 and a swing unit 30 disposed inside the base unit 10. The base unit 10 has an electrically insulating substrate on which a plurality of (e.g., four) joints 11a to 11d are provided.

[0119] The swing unit 30 is supported so that it can swing relative to the base unit 10, and a four-corner support structure is shown here. In order to achieve such a swing support structure, four straight separation grooves 5 that separate most of the two and elastic connecting parts 6 that elastically connect the two are provided between the base unit 10 and the swing unit 30.

[0120] The swing unit 30 is provided with a capacitor, which includes a diaphragm 21 that serves as a sensor electrode and is deformable according to the ambient pressure difference, and opposing electrodes (not shown) that are respectively arranged separately from the diaphragm 21.

[0121] The oscillating unit 30 also includes an integrated circuit (not shown) for processing electrical signals from the capacitor. The oscillating substrate of the oscillating unit 30 has vias 27a to 27d that are electrically connected to the integrated circuit. The vias 27a to 27d are electrically connected to the junctions 11a to 11d via a plurality of conductors 28 formed on the upper surface of the oscillating substrate.

[0122] In this embodiment, the top view (see reference) is also taken along the normal direction of the diaphragm 21. Figure 8 In this configuration, the diaphragm 21 is arranged so as not to overlap with the base unit 10. Therefore, even if an external impact is applied to the sensor body causing the oscillating unit 30 to vibrate up and down, the diaphragm 21 will not collide with the base unit 10. As a result, deformation, damage, and changes in properties of the diaphragm caused by external impacts can be suppressed.

[0123] (Implementation Method 9)

[0124] Figure 9 This is a top view showing an example of the structure of the pressure sensor device according to Embodiment 9 of the present invention. Since the cross-sectional view showing the internal structure is the same as the view described in Embodiments 1 to 5, repeated descriptions are omitted. The basic structure and operation of this embodiment are similar to those of Embodiment 1, but the difference lies in the fact that the swing unit 30 is arranged on the upper, lower, left, and right sides of the base unit 10.

[0125] The pressure sensor device includes a base unit 10 and a swing unit 30 disposed outside the base unit 10. The base unit 10 has an electrically insulating substrate on which a plurality of (e.g., four) joints 11a to 11d are provided.

[0126] The swing unit 30 is supported so that it can swing relative to the base unit 10, and a four-corner support structure is shown here. In order to achieve such a swing support structure, four straight separation grooves 5 that separate most of the two are provided between the base unit 10 and the swing unit 30, and an elastic connecting part 6 that elastically connects the two.

[0127] The swing unit 30 is provided with a capacitor comprising multiple (e.g., four) diaphragms 21a-21d that are deformable according to the ambient pressure difference and serve as sensor electrodes, and opposing electrodes (not shown) arranged separately from the diaphragms 21a-21d. These capacitors are connected in parallel via internal wiring (not shown).

[0128] The oscillating unit 30 also includes an integrated circuit (not shown) for processing electrical signals from the capacitor. The oscillating substrate of the oscillating unit 30 has vias 27a to 27d that are electrically connected to the integrated circuit. The vias 27a to 27d are electrically connected to the junctions 11a to 11d via a plurality of conductors 28 formed on the upper surface of the oscillating substrate.

[0129] In this embodiment, the top view (see reference) is also taken along the normal direction of the diaphragms 21a to 21d. Figure 9 In this configuration, diaphragms 21a to 21d are arranged in a manner that does not overlap with the base unit 10. Therefore, even if an external impact is applied to the sensor body causing the oscillating unit 30 to vibrate up and down, the diaphragm 21 will not collide with the base unit 10. As a result, deformation, damage, and changes in properties of the diaphragm caused by external impacts can be suppressed.

[0130] Furthermore, the present invention is not limited to the embodiments described above and can be implemented with various other technical solutions. For example, although the pressure applied to the diaphragm 21 is calculated based on the electrostatic capacitance between the diaphragm 21 and the fixed electrode, the present invention is not limited thereto. For example, the diaphragm 21 may be provided with a circuit having multiple piezoelectric resistor elements, and the pressure applied to the diaphragm 21 may be calculated based on the electrical signal output from the circuit according to the flexural deformation of the diaphragm 21.

[0131] The invention has been fully described with reference to the accompanying drawings and in connection with preferred embodiments, but various modifications and variations will be apparent to those skilled in the art. Such modifications and variations are to be understood as included in the invention as long as they do not depart from the scope of the invention as defined by the claims.

[0132] Industrial availability

[0133] This invention can suppress the deformation, damage, and property changes of the diaphragm caused by external impacts, and is therefore extremely useful in industry.

[0134] Explanation of reference numerals in the attached figures

[0135] 5. Separation groove; 6. Elastic connection part; 10. Base unit; 11a-11d. Joint part; 21, 21a-21d. Diaphragm; 22, 22a-22d. Counter electrode; 23, 25, 28. Conductor; 24, 27a-27d. Through hole; 26. Spacer; 30. Swing unit; 31. Swing substrate; 32. Diaphragm substrate; 32a. Spacer part; 33. Integrated circuit; 34. Wafer.

Claims

1. A pressure sensor device, wherein, The pressure sensor device includes: A base unit, comprising a joint for engaging with a mounting substrate; and A swinging unit that can swing relative to the base unit. The swing unit is equipped with a diaphragm, which acts as a sensor electrode and can deform according to the surrounding pressure difference. In a top view observed along the normal direction of the diaphragm, the diaphragm is configured in a manner that does not overlap with the base unit. The swing unit includes: The first layer is located on the same plane as the base unit; The second layer is fixed relative to the first layer with a gap between it and the first layer, and the diaphragm is provided in the second layer; The third layer is configured opposite to the second layer. A counter electrode is provided in the third layer.

2. The pressure sensor device according to claim 1, wherein, A separation groove is provided between the base unit and the swing unit to separate the base unit and the swing unit, and an elastic connecting part is provided to elastically connect the base unit and the swing unit.

3. The pressure sensor device according to claim 1 or 2, wherein, The base unit is disposed on the outside of the swing unit.

4. The pressure sensor device according to claim 1 or 2, wherein, The swing unit is disposed on the outside of the base unit.

5. The pressure sensor device according to claim 1 or 2, wherein, The swing unit is provided with multiple diaphragms connected in parallel.

6. The pressure sensor device according to claim 1 or 2, wherein, The swing unit is equipped with an integrated circuit that processes electrical signals generated by the deformation of the diaphragm.

7. The pressure sensor device according to claim 6, wherein, The swing unit is provided with multiple through-hole terminals, which are used to supply power to the integrated circuit and transmit output signals from the integrated circuit. The base unit has the same number of engagement portions as the through-hole terminal. The through-hole terminal and the junction are electrically connected using multiple conductors.

8. The pressure sensor device according to claim 1, wherein, The swing unit is provided with a capacitor, which includes opposing electrodes disposed away from the diaphragm. The pressure sensor device detects changes in the electrostatic capacitance of the capacitor.

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