Array antenna and method of manufacturing the same, electronic device

Abstract

An array antenna, a preparation method thereof and an electronic device, the array antenna comprising: a first dielectric substrate (100) and a plurality of antenna units (200) arranged on the first dielectric substrate (100), wherein: a plurality of isolation columns (102) are arranged in the first dielectric substrate (100); the plurality of antenna units (200) are divided into multiple groups, and at least one isolation column (102) is arranged between two adjacent groups of antenna units (200).

Description

TECHNICAL FIELD

[0001] The present document relates to, but is not limited to, the technical field of communication, and in particular to an array antenna and a preparation method thereof, and an electronic device. BACKGROUND

[0002] In modern communication devices, an antenna system often uses multiple antenna units for signal receiving and transmitting at the same time. However, energy mutual coupling occurs between the multiple antenna units, and the coupling energy between the antenna units causes crosstalk, which leads to a decrease in antenna radiation efficiency, deterioration of large-angle scanning performance, and a decrease in communication capacity of the entire communication system. Meanwhile, the mutual coupling also directly affects the electrical performance of the antenna, such as distortion of a radiation pattern, changes in surface current distribution of a radiation unit, impedance mismatching, and a decrease in overall transmitting and receiving gain and efficiency of the antenna. SUMMARY

[0003] The following is a summary of the subject matter of the detailed description herein. This summary is not intended to limit the scope of the claims.

[0004] An array antenna is provided, including: a first dielectric substrate and a plurality of antenna units disposed on the first dielectric substrate, wherein: a plurality of isolation columns are disposed in the first dielectric substrate; the plurality of antenna units are divided into a plurality of groups, and at least one isolation column is disposed between adjacent two groups of the antenna units.

[0005] In some example embodiments, the first dielectric substrate further includes a spacing region surrounding the antenna units, and a projection of the spacing region on the first dielectric substrate contains a projection of the isolation columns on the first dielectric substrate.

[0006] In some example embodiments, the isolation columns are arranged in multiple rows and multiple columns, and at least one row of isolation columns is disposed between adjacent two groups of antenna units in a first direction.

[0007] At least one column of isolation columns is disposed between adjacent two groups of antenna units in a second direction.

[0008] In some example embodiments, the plurality of antenna units include m rows and n columns, m and n are natural numbers, each group of antenna units includes one antenna unit, and the plurality of isolation columns are arranged in (m+1) rows and (n+1) columns.

[0009] One row of isolation columns is disposed on both sides of the first row of antenna units to both sides of the mth row of antenna units.

[0010] One column of isolation columns is disposed on both sides of the first column of antenna units to both sides of the nth column of antenna units.

[0011] In some example embodiments, the plurality of antenna units comprises m rows and n columns, m and n are natural numbers, each group of antenna units comprises one antenna unit, and the arrangement of the plurality of isolation columns forms (m-1) rows and (n-1) columns.

[0012] A row of isolation columns is arranged on both sides of the antenna units in the 2nd row to the antenna units in the (m-1)th row.

[0013] A column of isolation columns is arranged on both sides of the antenna units in the 2nd column to the antenna units in the (n-1)th column.

[0014] In some example embodiments, the arrangement of the isolation columns forms a plurality of closed patterns, and at least one of the closed patterns is arranged around a group of antenna units.

[0015] In some example embodiments, the plurality of antenna units comprises m rows and n columns, m and n are natural numbers, each group of antenna units comprises a*b, 1≤a≤m, 1≤b≤n.

[0016] The arrangement of the isolation columns forms (m / a)*(n / b) of the closed patterns, and each of the closed patterns is arranged around a group of antenna units.

[0017] In some example embodiments, the first dielectric substrate comprises a first surface and a second surface arranged oppositely, and the antenna units are arranged on the first surface; and the isolation columns satisfy at least one of the following conditions:

[0018] The isolation columns penetrate at least one of the first surface and the second surface.

[0019] The isolation columns are arranged inside the first dielectric substrate, and the isolation columns do not penetrate the first surface or the second surface.

[0020] In some example embodiments, the distance between two adjacent isolation columns corresponding to the same group of antenna units is less than or equal to 0.25*center wavelength, * is a multiplication sign, and the center wavelength is the wavelength corresponding to the center frequency of the electromagnetic wave transmitted and received by the array antenna.

[0021] In some example embodiments, the distance between the antenna units and the isolation columns corresponding to the antenna units is less than or equal to 0.25*center wavelength, * is a multiplication sign, and the center wavelength is the wavelength corresponding to the center frequency of the electromagnetic wave transmitted and received by the array antenna.

[0022] In some example embodiments, the shape of the isolation columns is a cylindrical column, a polygonal prism, or an irregular column.

[0023] In some example embodiments, the isolation columns are solid columns or hollow columns.

[0024] In some example embodiments, the material of the isolation column is metal.

[0025] In some example embodiments, the first dielectric substrate is a glass or a printed circuit board dielectric substrate.

[0026] In some example embodiments, the array antenna is a transmissive liquid crystal array antenna, a reflective liquid crystal array antenna or a glass-based array antenna.

[0027] The embodiments of the present disclosure further provide an electronic device comprising at least one array antenna as described above.

[0028] The embodiments of the present disclosure further provide a preparation method of an array antenna, for preparing an array antenna as described above, the preparation method comprising:

[0029] forming a plurality of isolation columns in the first dielectric substrate;

[0030] forming a plurality of antenna units on the first dielectric substrate, the plurality of antenna units being divided into a plurality of groups, and at least one isolation column being arranged between adjacent two groups of the antenna units.

[0031] Other aspects can become apparent from a consideration of the drawings and detailed description. BRIEF DESCRIPTION OF DRAWINGS

[0032] The accompanying drawings are included to provide a further understanding of the technical solutions of the present disclosure, and constitute a part of the specification, and are used to explain the technical solutions of the present disclosure together with the embodiments of the present disclosure, and do not constitute a limitation on the technical solutions of the present disclosure. The shape and size of one or more components in the drawings do not reflect the true proportion, and the purpose is only to schematically illustrate the present disclosure.

[0033] Figure 1 FIG. 1 is a top view of a schematic structure of an array antenna according to an example embodiment of the present disclosure;

[0034] Figures 2 to 4 FIG. 3 is a schematic view of three cross-sectional structures of an AA region according to an example embodiment of the present disclosure; Figure 1

[0035] Figures 5 to 8 FIG. 7 is a schematic view of a distribution structure of four isolation columns and antenna units according to an example embodiment of the present disclosure;

[0036] Figures 9a to 9d FIG. 8 is a schematic view of a distribution structure of four isolation columns and a first dielectric substrate according to an example embodiment of the present disclosure;

[0037] Figures 10a to 10e FIG. 9 is a schematic view of a structure of five isolation columns according to an example embodiment of the present disclosure;

[0038] Figures 11a to 11b ​Structure diagram of another two isolation columns for exemplary embodiments of the present disclosure

[0039] Figure 12 Structure diagram of isolation degree between front and back antenna units of an array antenna plus isolation column for exemplary embodiments of the present disclosure

[0040] Figure 13 Structure diagram of an electronic device for exemplary embodiments of the present disclosure. DETAILED DESCRIPTION

[0041] Embodiments of the present disclosure will be described below with reference to the accompanying drawings. The embodiments can be implemented in various forms. It should be readily understood by those skilled in the art that the embodiments and features thereof can be changed or substituted without departing from the spirit of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited to the embodiments described below. The embodiments in the present disclosure and the features thereof can be combined each other without conflict.

[0042] In the drawings, the size, the thickness, or the region of one or more constituent elements may, in some cases, be exaggerated for the purpose of explanation and thus is not necessarily to scale with the actual size, thickness, or region. Therefore, the present disclosure should not be construed as being limited to the shape, the relative size, and the like as illustrated in the drawings. The exemplary embodiments of the present disclosure are schematically illustrated in the drawings, and the present disclosure is not limited to the shapes or values illustrated in the drawings.

[0043] In the present disclosure, ordinal numbers such as "first", "second", and "third" are used to avoid confusion among constituent elements, and are not used to describe the number of the constituent elements. In the present disclosure, "a plurality of" means two or more.

[0044] In the present disclosure, for the purpose of convenience in explanation, words indicating the orientation or the positional relation such as "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like are used to describe the positional relation of the constituent elements with reference to the drawings, and are used only for the purpose of convenience in description and simplification of the description, and thus should not be construed to indicate or imply that the device or the element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present disclosure. The positional relation of the constituent elements is appropriately changed according to the direction in which the constituent elements are described. Therefore, the words described in the specification are not limited, and can be appropriately changed according to the situation.

[0045] In the present disclosure, unless specifically defined and limited otherwise, the terms "mount", "connected", "connection" should be interpreted broadly. For example, it can be fixedly connected, or detachably connected, or integrally connected; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate piece, or internal communication of two elements. For those skilled in the art, the meaning of the above terms in the present disclosure can be understood according to the circumstances.

[0046] In the present disclosure, "electrically connected" includes the case where the constituent elements are connected together through an element having a certain electrical effect. The "element having a certain electrical effect" is not particularly limited as long as it can perform the transmission and reception of electrical signals between the connected constituent elements. Examples of the "element having a certain electrical effect" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, other elements having one or more functions, and the like.

[0047] In the present disclosure, "parallel" means a state in which the angle formed by two straight lines is -10° or more and 10° or less, and thus can include a state in which the angle is -5° or more and 5° or less. In addition, "perpendicular" means a state in which the angle formed by two straight lines is 80° or more and 100° or less, and thus can include a state in which the angle is 85° or more and 95° or less.

[0048] In the present disclosure, "about", "approximately", means not strictly limited to the limit, allowing for the range of process and measurement error.

[0049] At least one embodiment of the present disclosure provides an array antenna, comprising: a first dielectric substrate and a plurality of antenna elements disposed on the first dielectric substrate; a plurality of isolation columns are disposed in the first dielectric substrate; the plurality of antenna elements are divided into a plurality of groups, and at least one isolation column is disposed between adjacent two groups of antenna elements.

[0050] The array antenna provided by the embodiment of the present disclosure can effectively suppress the dielectric coupling between the antenna elements, reduce the coupling energy, and guarantee the high isolation performance between the antennas and the antennas, thereby improving the large-angle scanning performance of the array antenna and optimizing the antenna parameters. The array antenna provided by the embodiment of the present disclosure can improve the design freedom by improving the antenna structure from a two-dimensional plane to a three-dimensional structure.

[0051] Figure 1 A top view structure schematic diagram of an array antenna according to an exemplary embodiment of the present disclosure is shown in FIG. 1. Figures 2 to 4 A top view structure schematic diagram of an array antenna according to an exemplary embodiment of the present disclosure is shown in FIG. 1. Figure 1 A schematic diagram of several cross-sectional structures of the AA region in the present disclosure is shown in FIG. 2. Figures 1 to 4As shown, the array antenna provided by the embodiments of the present disclosure includes a first dielectric substrate 100 and a plurality of antenna units 200 disposed on the first dielectric substrate 100, wherein: the first dielectric substrate 100 is provided with a plurality of isolation columns 102; the plurality of antenna units 200 are divided into a plurality of groups, and at least one isolation column 102 is disposed between adjacent two groups of antenna units 200.

[0052] In some example embodiments, the array antenna can be a transmissive liquid crystal array antenna, a reflective liquid crystal array antenna or a glass-based array antenna. However, the embodiments of the present disclosure are not limited thereto.

[0053] As shown, the array antenna includes a first dielectric substrate 100, the first dielectric substrate 100 includes oppositely disposed first and second surfaces 1001 and 1002, a plurality of antenna units 200 are disposed on the first surface 1001, a ground plate 300 is disposed on the second surface 1002, and the first dielectric substrate 100 is provided with a plurality of isolation columns 102; the plurality of antenna units 200 are divided into a plurality of groups, and at least one isolation column 102 is disposed between adjacent two groups of antenna units 200. Figure 2 As shown, the array antenna includes oppositely disposed first and second dielectric substrates 100 and 301, the first dielectric substrate 100 includes oppositely disposed first and second surfaces 1001 and 1002, a plurality of antenna units 200 are disposed on the first surface 1001, a first conductive layer 401 is disposed on the second surface 1002, and the first dielectric substrate 100 is provided with a plurality of isolation columns 102; the plurality of antenna units 200 are divided into a plurality of groups, and at least one isolation column 102 is disposed between adjacent two groups of antenna units 200. The second dielectric substrate 301 includes oppositely disposed third and fourth surfaces 3011 and 3012, a second conductive layer 402 is disposed on the third surface 3011, a ground plate 300 is disposed on the fourth surface 3012, and the second dielectric substrate 301 is provided with a plurality of isolation columns 102. The second conductive layer 402 is partially overlapped with the first conductive layer 401 in the orthographic projection of the first dielectric substrate 100. The first conductive layer 401, the second conductive layer 402 and a third dielectric layer 403 disposed between the first and second conductive layers 401 and 402 form a phase shift structure 400, and in some example embodiments, the third dielectric layer 403 includes a liquid crystal material. However, the embodiments of the present disclosure are not limited thereto. In some example embodiments, the third dielectric layer can adopt other materials similar to the liquid crystal material which can change the dielectric constant based on the change of electric field. For example, the third dielectric layer 403 can include a ferroelectric material.

[0054] Figure 3 In some example embodiments, as shown, the array antenna includes oppositely disposed first and second dielectric substrates 100 and 301, the first dielectric substrate 100 includes oppositely disposed first and second surfaces 1001 and 1002, a plurality of antenna units 200 are disposed on the first surface 1001, a first conductive layer 401 is disposed on the second surface 1002, and the first dielectric substrate 100 is provided with a plurality of isolation columns 102; the plurality of antenna units 200 are divided into a plurality of groups, and at least one isolation column 102 is disposed between adjacent two groups of antenna units 200. The second dielectric substrate 301 includes oppositely disposed third and fourth surfaces 3011 and 3012, a second conductive layer 402 is disposed on the third surface 3011, a ground plate 300 is disposed on the fourth surface 3012, and the second dielectric substrate 301 is provided with a plurality of isolation columns 102. The second conductive layer 402 is partially overlapped with the first conductive layer 401 in the orthographic projection of the first dielectric substrate 100. The first conductive layer 401, the second conductive layer 402 and a third dielectric layer 403 disposed between the first and second conductive layers 401 and 402 form a phase shift structure 400, and in some example embodiments, the third dielectric layer 403 includes a liquid crystal material. However, the embodiments of the present disclosure are not limited thereto. In some example embodiments, the third dielectric layer can adopt other materials similar to the liquid crystal material which can change the dielectric constant based on the change of electric field. For example, the third dielectric layer 403 can include a ferroelectric material.

[0055] In some example embodiments, as shown, the array antenna includes oppositely disposed first and second dielectric substrates 100 and 301, the first dielectric substrate 100 includes oppositely disposed first and second surfaces 1001 and 1002, a plurality of antenna units 200 are disposed on the first surface 1001, a first conductive layer 401 is disposed on the second surface 1002, and the first dielectric substrate 100 is provided with a plurality of isolation columns 102; the plurality of antenna units 200 are divided into a plurality of groups, and at least one isolation column 102 is disposed between adjacent two groups of antenna units 200. The second dielectric substrate 301 includes oppositely disposed third and fourth surfaces 3011 and 3012, a second conductive layer 402 is disposed on the third surface 3011, a ground plate 300 is disposed on the fourth surface 3012, and the second dielectric substrate 301 is provided with a plurality of isolation columns 102. The second conductive layer 402 is partially overlapped with the first conductive layer 401 in the orthographic projection of the first dielectric substrate 100. The first conductive layer 401, the second conductive layer 402 and a third dielectric layer 403 disposed between the first and second conductive layers 401 and 402 form a phase shift structure 400, and in some example embodiments, the third dielectric layer 403 includes a liquid crystal material. However, the embodiments of the present disclosure are not limited thereto. In some example embodiments, the third dielectric layer can adopt other materials similar to the liquid crystal material which can change the dielectric constant based on the change of electric field. For example, the third dielectric layer 403 can include a ferroelectric material. Figure 3 ​In the reflective array antenna shown, the isolation column 102 can be arranged only in the first dielectric substrate 100, and not arranged in the second dielectric substrate 301; or the isolation column 102 can be arranged only in the second dielectric substrate 301, and not arranged in the first dielectric substrate 100; or the isolation column 102 can be arranged in both the first dielectric substrate 100 and the second dielectric substrate 301, and the present disclosure does not limit this.

[0056] In the present embodiment, when the isolation column 102 is arranged in both the first dielectric substrate 100 and the second dielectric substrate 301, the isolation column 102 in the first dielectric substrate 100 is arranged according to the positions of the plurality of antenna elements on the first dielectric substrate, for suppressing the dielectric coupling between the plurality of antenna elements on the first dielectric substrate, for example, the isolation column 102 in the first dielectric substrate 100 can be arranged in the interval region around the antenna element. The isolation column 102 in the second dielectric substrate 301 is arranged according to the electric field distribution on the ground plate 300, for limiting the current flow on the ground plate 300, to reduce the dielectric coupling on the ground plate 300, for example, the ground plate 300 can be a Defected Ground Structure (DGS), that is, a periodic or non-periodic grid structure is etched on the ground plate 300, to change the distributed inductance and distributed capacitance of the transmission line, to obtain the band-stop characteristic and slow-wave characteristic, etc., at this time, the isolation column 102 in the second dielectric substrate 301 can be arranged in the gap of the grid structure. The present embodiment does not limit the positional relationship between the isolation column 102 in the first dielectric substrate 100 and the isolation column 102 in the second dielectric substrate 301.

[0057] As shown in FIG. 1, the reflective array antenna includes a first dielectric substrate 100, a second dielectric substrate 301, a plurality of antenna elements 200, a ground plate 300, and an isolation column 102. Figure 4As shown, the array antenna comprises oppositely arranged first dielectric substrate 100 and second dielectric substrate 301, the antenna unit 200 comprises first antenna unit 201 and second antenna unit 202, the first dielectric substrate 100 comprises oppositely arranged first surface 1001 and second surface 1002, a plurality of first antenna units 201 are arranged on the first surface 1001, a first conductive layer 401 is arranged on the second surface 1002, and a plurality of isolation columns 102 are arranged in the first dielectric substrate 100; the plurality of first antenna units 201 are divided into multiple groups, and at least one isolation column 102 is arranged between adjacent two groups of first antenna units 201. The second dielectric substrate 301 comprises oppositely arranged third surface 3011 and fourth surface 3012, the third surface 3011 is provided with a second conductive layer 402, the fourth surface 3012 is provided with a plurality of second antenna units 202, and a plurality of isolation columns 102 are arranged in the second dielectric substrate 301; the plurality of second antenna units 202 are divided into multiple groups, and at least one isolation column 102 is arranged between adjacent two groups of second antenna units 202. The orthographic projection of the second conductive layer 402 on the first dielectric substrate 100 partially overlaps the orthographic projection of the first conductive layer 401 on the first dielectric substrate 100. The first conductive layer 401, the second conductive layer 402 and the third dielectric layer 403 arranged between the first conductive layer 401 and the second conductive layer 402 form a phase shift structure 400, and in some exemplary embodiments, the third dielectric layer 403 comprises a liquid crystal material. However, the embodiments of the present disclosure are not limited thereto. In some exemplary embodiments, the third dielectric layer can adopt other materials similar to the liquid crystal material which can change the dielectric constant based on the change of electric field. For example, the third dielectric layer 403 can comprise a ferroelectric material.

[0058] In some exemplary embodiments, in the transmissive array antenna as shown, Figure 4 In the transmissive array antenna as shown, isolation columns 102 can be arranged only in the first dielectric substrate 100, and no isolation column 102 is arranged in the second dielectric substrate 301; or, isolation columns 102 can be arranged only in the second dielectric substrate 301, and no isolation column 102 is arranged in the first dielectric substrate 100; or, isolation columns 102 can be arranged in both the first dielectric substrate 100 and the second dielectric substrate 301, and the present disclosure does not limit this.

[0059] The embodiments of the present disclosure do not limit the positional relationship between the first antenna unit 201 and the second antenna unit 202. When the array antenna is a symmetrical antenna, the orthographic projection of the first antenna unit 201 on the first dielectric substrate 100 coincides with the orthographic projection of the second antenna unit 202 on the first dielectric substrate 100; when the array antenna is an asymmetrical antenna, the orthographic projection of the first antenna unit 201 on the first dielectric substrate 100 does not coincide with the orthographic projection of the second antenna unit 202 on the first dielectric substrate 100.

[0060] In this embodiment, when isolation columns 102 are provided in both the first dielectric substrate 100 and the second dielectric substrate 301, the isolation columns 102 in the first dielectric substrate 100 are arranged according to the positions of the plurality of first antenna elements 201 on the first dielectric substrate, to suppress dielectric coupling between the plurality of first antenna elements 201 on the first dielectric substrate. For example, the isolation columns 102 in the first dielectric substrate 100 may be provided in a spacing region surrounding the first antenna element 201. The isolation columns 102 in the second dielectric substrate 301 are arranged according to the positions of the plurality of second antenna elements 202 on the second dielectric substrate 301, to suppress dielectric coupling between the plurality of second antenna elements 202 on the second dielectric substrate 301. For example, the isolation columns 102 in the second dielectric substrate 301 may be provided in a spacing region surrounding the second antenna element 202. Since the embodiment of the present disclosure does not limit the positional relationship between the first antenna unit 201 and the second antenna unit 202, the embodiment of the present disclosure also does not limit the positional relationship between the isolation pillars 102 in the first dielectric substrate 100 and the isolation pillars 102 in the second dielectric substrate 301. The isolation pillars 102 in the first dielectric substrate 100 and the isolation pillars 102 in the second dielectric substrate 301 can be arranged according to the positions of the antenna units on the first dielectric substrate and the second dielectric substrate, respectively.

[0061] The array antenna of the embodiment of the present disclosure can have various structures and stacking methods. The isolation column 102 can be flexibly used in various types of array antennas such as reflective, transmissive, and glass-based antennas to improve the isolation of the array antenna.

[0062] In some exemplary embodiments, Figures 1 to 4 As shown, the first dielectric substrate 100 further includes a spacing region 203 surrounding the antenna unit 200 , and the orthographic projection of the spacing region 203 on the first dielectric substrate 100 includes the orthographic projection of the isolation column 102 on the first dielectric substrate 100 .

[0063] In the embodiment of the present disclosure, the arrangement of the isolation column 102 based on the antenna unit 200 can be in various forms, and its distribution path can be but is not limited to the following: Figures 5 to 8 Four options in .

[0064] In some exemplary embodiments, Figure 5 and Figure 7 As shown, the isolation columns 102 are arranged in multiple rows and columns. At least one row of isolation columns 102 is set between two adjacent groups of antenna units 200 in the first direction X; at least one column of isolation columns 102 is set between two adjacent groups of antenna units 200 in the second direction Y.

[0065] In some exemplary embodiments, the first direction X and the second direction Y intersect. Exemplarily, the first direction X and the second direction Y are perpendicular to each other.

[0066] In some exemplary embodiments, Figure 5 As shown, the plurality of antenna units 200 include m rows and n columns, where m and n are natural numbers, each group of antenna units 200 includes one antenna unit 200, and the plurality of isolation columns 102 are arranged in (m+1) rows and (n+1) columns;

[0067] A row of isolation columns 102 is provided on both sides of the first row of antenna units 200 to both sides of the mth row of antenna units 200;

[0068] A row of isolation columns 102 is provided on both sides of the first row of antenna units 200 to both sides of the nth row of antenna units 200 .

[0069] In some exemplary embodiments, Figure 7 As shown, the plurality of antenna units 200 include m rows and n columns, where m and n are natural numbers, each group of antenna units 200 includes one antenna unit 200, and the plurality of isolation columns 102 are arranged in (m-1) rows and (n-1) columns;

[0070] A row of isolation columns 102 is provided on both sides of the 2nd row of antenna units 200 to both sides of the (m-1)th row of antenna units 200;

[0071] A row of isolation columns 102 is provided on both sides of the second row of antenna units 200 to both sides of the (n−1)th row of antenna units 200 .

[0072] In some exemplary embodiments, Figure 5 、 Figure 6 and Figure 8 As shown, the isolation columns 102 are arranged to form a plurality of closed figures, and at least one closed figure is disposed around a group of antenna units 200 .

[0073] In some exemplary embodiments, the plurality of antenna units 200 include m rows and n columns, where m and n are natural numbers, and each group of antenna units 200 includes a*b units, 1≤a≤m, 1≤b≤n;

[0074] The isolation columns 102 are arranged to form (m / a)*(n / b) closed figures, each of which surrounds a group of antenna units 200 .

[0075] For example, Figure 6 As shown, a=1, b=1, each group of antenna units 200 includes one antenna unit 200, and the arrangement of the isolation columns 102 forms m*n closed figures, each of which surrounds one antenna unit 200; Figure 8As shown, a = 2, b = 2, each group of antenna units 200 includes 4 antenna units 200, and the arrangement of the isolation pillars 102 forms (m / 2)*(n / 2) closed patterns, each of which surrounds 4 antenna units 200.

[0076] In the embodiments of the present disclosure, the distribution mode of the isolation pillars 102 is generally periodic, and can be flexibly adjusted to a single antenna unit corresponding to a group of isolation pillars (as shown in Figures 5 to 7 ), a double antenna unit corresponding to a group of isolation pillars (not shown in the figure), four antenna units corresponding to a group of isolation pillars (as shown in Figure 8 ), and the like. The isolation pillars 102 can be arranged in a periodic edge-shared mode (as shown in Figure 5 and Figure 7 ), or a periodic edge-unshared mode (as shown in Figure 6 and Figure 8 ).

[0077] In some example embodiments, the shape of the closed pattern formed by the arrangement of the isolation pillars 102 includes a straight line polygon (such as a triangle, a rectangle, a square, a parallelogram, a regular pentagon, a regular hexagon, etc.), a curved polygon (such as a circle, an ellipse, etc.), or a closed pattern composed of a straight line and a curve (such as a rounded rectangle, etc.).

[0078] In some example embodiments, the first dielectric substrate 100 includes oppositely arranged first and second surfaces 1001 and 1002, and the antenna units 200 are arranged on the first surface 1001. The isolation pillars 102 satisfy at least one of the following conditions:

[0079] The isolation pillars 102 penetrate at least one of the first and second surfaces 1001 and 1002;

[0080] The isolation pillars 102 are arranged inside the first dielectric substrate 100, and the isolation pillars 102 do not penetrate the first surface 1001 or the second surface 1002.

[0081] In the embodiments of the present disclosure, the punching position of the isolation pillars 102 in the first dielectric substrate 100 can have various forms, and the punching mode can be, but is not limited to, the four schemes listed in Figures 9a to 9d . The isolation pillars 102 can be in the form of penetrating from top to bottom (as shown in Figure 9a ), or only penetrating from the top layer or only penetrating from the bottom layer, and stopping at the inside of the glass medium (as shown in Figure 9b and Figure 9c ), or not penetrating from both the top and bottom layers, but stopping at the inside of the glass medium (as shown in Figure 9d ). In actual use, the use of which scheme can be determined according to the process conditions and the distribution of the upper and lower metal layers.

[0082] In some example embodiments, the spacing between two adjacent isolation columns 102 corresponding to the same group of antenna units 200 is less than or equal to 0.25*center wavelength, the center wavelength being the wavelength corresponding to the center frequency of the electromagnetic wave transmitted and received by the array antenna. For example, the spacing between two adjacent isolation columns 102 corresponding to the same group of antenna units 200 is less than or equal to 0.125*center wavelength.

[0083] In the embodiments of the present disclosure, the spacing between the isolation column 102 and the group of antenna units should be set to a reasonable value within the process accuracy range, while ensuring effective coupling energy shielding effect.

[0084] In some example embodiments, the spacing between the antenna unit 200 and the isolation column 102 corresponding to the antenna unit 200 is less than or equal to 0.25*center wavelength, the center wavelength being the wavelength corresponding to the center frequency of the electromagnetic wave transmitted and received by the array antenna. For example, the spacing between the antenna unit 200 and the isolation column 102 corresponding to the antenna unit 200 is less than or equal to 0.125*center wavelength.

[0085] In the embodiments of the present disclosure, the spacing between the isolation column 102 and the antenna unit 200 should be reasonably set while considering the weakening effect of coupling energy and the influence of the isolation column 102 on the performance of the antenna unit 200 itself.

[0086] In some example embodiments, when the spacing of the isolation column 102 is <0.125*center wavelength (for example, the working center frequency in the embodiments of the present disclosure can be but is not limited to 78GHz, and the corresponding center wavelength is 38.46mm), and the isolation column 102 is at the edge of the unit, the shielding effect is best.

[0087] In the embodiments of the present disclosure, the specific physical size is calculated in electrical length, wherein the center wavelength corresponds to the working center frequency, and the corresponding specific physical size is calculated. For example, the working center frequency in the embodiments of the present disclosure can be but is not limited to 78GHz, and the corresponding center wavelength is 38.46mm.

[0088] In some example embodiments, the shape of the isolation column 102 can be a cylinder, a polygonal prism, or an irregular column, etc.

[0089] In the embodiments of the present disclosure, the isolation column 102 is formed based on a dielectric hole punching and via metallization process. The shape of the isolation column 102 can be but is not limited to a cylinder, a polygonal prism, or an irregular column, etc., as shown in FIG. 1B. Figures 10a to 10e When the shape of the isolation column 102 is as shown in FIG. 1B, the plurality of isolation columns 102 are dispersedly arranged; when the shape of the isolation column 102 is as shown in FIG. 1C, the plurality of isolation columns 102 are arranged in a row. Figures 10a to 10d When the shape of the isolation column 102 is as shown in FIG. 1B, the plurality of isolation columns 102 are dispersedly arranged; when the shape of the isolation column 102 is as shown in FIG. 1C, the plurality of isolation columns 102 are arranged in a row. Figure 10eIn the cuboid metal wall shape shown, the isolation columns 102 arranged between the two adjacent groups of antenna units 200 can be a continuous structure, or can also be a dispersed structure composed of multiple cuboid metal walls, and the present disclosure does not limit this. In actual use, the shape of the isolation column 102 can be determined comprehensively according to the array spacing, the processing technology, and the design cost. In some example embodiments, the shape of the isolation column 102 adopts a cylindrical hole design, which is relatively simple in process and easy to perform subsequent processes, and at the same time has a better coupling energy shielding effect. In other example embodiments, the shape of the isolation column 102 adopts a cuboid metal wall design, in which case the signal shielding effect of the isolation column 102 is stronger and can achieve a better isolation effect, but the processing difficulty is greater.

[0090] In the embodiments of the present disclosure, the isolation column 102 can be a continuous structure (for example, as shown in Figure 10e In the embodiments of the present disclosure, the isolation column 102 can be a continuous structure (for example, as shown in Figures 10a to 10d Since the isolation column 102 is usually made of metal, when the cuboid metal wall structure as shown in Figure 10e is adopted, the isolation column 102 is usually continuously distributed in a certain area, and a gap is left between adjacent cuboid metal wall structures to provide a metal trace distribution on the surface of the first dielectric substrate 100.

[0091] In some example embodiments, the isolation column 102 can be a solid column or a hollow column.

[0092] As shown in Figure 11a and Figure 11b In the embodiments of the present disclosure, the preparation process of the isolation column 102 can be, but is not limited to, metal filling, metal adhesion, and the like. When the metal filling process is adopted, the isolation column 102 is a solid column filled in the isolation cavity. When the metal adhesion process is adopted, the isolation column 102 is a hollow column adhered in the isolation cavity.

[0093] In some example embodiments, the material of the isolation column 102 is metal. For example, the material of the isolation column 102 can be, but is not limited to, common conductive metals such as copper and aluminum.

[0094] In some example embodiments, the first dielectric substrate 100 can be glass or other materials such as a printed circuit board (PCB).

[0095] Figure 12 This is a comparison diagram of the isolation degree between the array antenna and the front and rear antenna units of the array antenna according to an example embodiment of the present disclosure. Figure 12 The horizontal coordinate represents the frequency (unit: GHz), and the vertical coordinate represents the isolation degree (unit: dB). As shown inFigure 12 As shown, although the isolation between the antenna units is reduced after adding the isolation columns when the frequency is greater than or equal to 79 GHz, the isolation between adjacent antenna units is less than -18 dB between 72 GHz and 86 GHz, that is, the isolation between adjacent antenna units is reduced to below -15 dB, and the isolation effect is good.

[0096] At least one embodiment of the present disclosure further provides a preparation method of the array antenna, for preparing the array antenna as described above.

[0097] In some exemplary embodiments, the preparation method comprises:

[0098] forming a plurality of isolation columns in the first dielectric substrate;

[0099] forming a plurality of antenna units on the first dielectric substrate, the plurality of antenna units being divided into a plurality of groups, and at least one isolation column being arranged between adjacent two groups of antenna units.

[0100] The preparation method of the present embodiment can refer to the description of the foregoing embodiments, and thus will not be described here again.

[0101] At least one embodiment of the present disclosure further provides an electronic device, Figure 13 is a schematic view of the electronic device of at least one embodiment of the present disclosure. As shown, Figure 13 As shown, the present embodiment provides an electronic device 91 comprising the array antenna 910 as described in any of the foregoing. The electronic device 91 can be a smart phone, a navigation device, a game machine, a television (TV), a car audio, a tablet computer, a personal multimedia player (PMP), a personal digital assistant (PDA), or any product or component having a communication function. However, the present embodiment is not limited thereto.

[0102] The drawings in the present disclosure only involve the structures involved in the present disclosure, and other structures can refer to the general design. In the case of no conflict, the embodiments of the present disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0103] Those skilled in the art should understand that the technical solutions of the present disclosure can be modified or replaced equivalently without departing from the spirit and scope of the technical solutions of the present disclosure, and all should be covered in the scope of the claims of the present disclosure.

Claims

1. An array antenna comprising: A first dielectric substrate and a second dielectric substrate are oppositely arranged, and a third dielectric layer is arranged between the first dielectric substrate and the second dielectric substrate, the first dielectric substrate comprises a first surface and a second surface arranged oppositely, a plurality of antenna units are arranged on the first surface, and a first conductive layer is arranged on the second surface; the second dielectric substrate comprises a third surface and a fourth surface arranged oppositely, a second conductive layer is arranged on the third surface, and a ground plate is arranged on the fourth surface, wherein: A plurality of isolation columns are arranged in the first dielectric substrate; the plurality of antenna units are divided into a plurality of groups, and at least one isolation column is arranged between adjacent two groups of antenna units; The first conductive layer, the second conductive layer and the third dielectric layer form a phase shift structure; The ground plate is etched with a grid structure, and a plurality of isolation columns are arranged in the second dielectric substrate; the isolation columns in the second dielectric substrate are arranged in the gaps of the grid structure.

2. The array antenna of claim 1, wherein, The first dielectric substrate further comprises a spacing region surrounding the antenna units, and a normal projection of the spacing region on the first dielectric substrate contains a normal projection of the isolation column on the first dielectric substrate.

3. The array antenna of claim 1, wherein, The arrangement of the isolation columns forms a plurality of rows and a plurality of columns, and at least one row of isolation columns is arranged between adjacent two groups of antenna units in a first direction; At least one column of isolation columns is arranged between adjacent two groups of antenna units in a second direction.

4. The array antenna of claim 3, wherein, The plurality of antenna units comprise m rows and n columns, m and n are natural numbers, each group of antenna units comprises one antenna unit, and the arrangement of the plurality of isolation columns forms (m+1) rows and (n+1) columns; One row of isolation columns is arranged on both sides of the first row of antenna units to both sides of the mth row of antenna units; One column of isolation columns is arranged on both sides of the first column of antenna units to both sides of the nth column of antenna units.

5. The array antenna of claim 3, wherein, The plurality of antenna units comprise m rows and n columns, m and n are natural numbers, each group of antenna units comprises one antenna unit, and the arrangement of the plurality of isolation columns forms (m-1) rows and (n-1) columns; One row of isolation columns is arranged on both sides of the second row of antenna units to both sides of the (m-1)th row of antenna units; One column of isolation columns is arranged on both sides of the second column of antenna units to both sides of the (n-1)th column of antenna units.

6. The array antenna according to claim 1, wherein: The arrangement of the isolation columns forms a plurality of closed patterns, and at least one closed pattern is arranged around a group of antenna units.

7. The array antenna of claim 6, wherein, The plurality of antenna units comprise m rows and n columns, m and n are natural numbers, and each group of antenna units comprises a*b, 1≤a≤m, 1≤b≤n; The arrangement of the isolation columns forms (m / a)*(n / b) closed patterns, and each closed pattern surrounds a group of antenna units.

8. The array antenna of claim 1, wherein, The first dielectric substrate comprises a first surface and a second surface arranged oppositely, and the antenna units are arranged on the first surface; the isolation columns satisfy at least one of the following conditions: The isolation columns penetrate at least one of the first surface and the second surface; The isolation columns are arranged inside the first dielectric substrate, and the isolation columns do not penetrate the first surface or the second surface.

9. The array antenna of claim 1, wherein, A distance between two adjacent isolation columns corresponding to the same group of the antenna units is less than or equal to 0.25* a center wavelength, * being a multiplication sign, the center wavelength being a wavelength corresponding to a center frequency of electromagnetic waves transmitted and received by the array antenna.

10. The array antenna of claim 1, wherein, A distance between the antenna units and the isolation columns corresponding to the antenna units is less than or equal to 0.25* a center wavelength, * being a multiplication sign, the center wavelength being a wavelength corresponding to a center frequency of electromagnetic waves transmitted and received by the array antenna.

11. The array antenna of claim 1, wherein, The isolation columns are in a shape of a cylinder, a polygonal prism, or an irregular column.

12. The array antenna of claim 1, wherein, The isolation columns are solid columns or hollow columns.

13. The array antenna of claim 1, wherein, The isolation columns are made of metal.

14. The array antenna of claim 1, wherein, The first dielectric substrate is a glass or a printed circuit board dielectric substrate.

15. An array antenna comprising: The first dielectric substrate and the second dielectric substrate are oppositely arranged, and a third dielectric layer is arranged between the first dielectric substrate and the second dielectric substrate, the first dielectric substrate comprising a first surface and a second surface oppositely arranged, a plurality of first antenna units being arranged on the first surface, and a first conductive layer being arranged on the second surface, the second dielectric substrate comprising a third surface and a fourth surface oppositely arranged, a second conductive layer being arranged on the third surface, and a plurality of second antenna units being arranged on the fourth surface, wherein: A plurality of isolation columns are arranged in the first dielectric substrate, and the plurality of first antenna units are divided into a plurality of groups, at least one isolation column being arranged between two adjacent groups of the first antenna units. The first conductive layer, the second conductive layer, and the third dielectric layer form a phase shift structure. A plurality of isolation columns are arranged in the second dielectric substrate, and the plurality of second antenna units are divided into a plurality of groups, at least one isolation column being arranged between two adjacent groups of the second antenna units.

16. An electronic device comprising: At least one array antenna as claimed in any one of claims 1 to 15.

17. A preparation method of an array antenna, for preparing the array antenna as claimed in any one of claims 1 to 15, the preparation method comprising: forming a plurality of isolation columns in a first dielectric substrate; forming a plurality of antenna units on the first dielectric substrate, the plurality of antenna units being divided into a plurality of groups, and at least one isolation column being arranged between two adjacent groups of the antenna units.

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