Method for processing spatter products of femtosecond laser ablation of metals

Abstract

Disclosed is a method for processing the splash product of femtosecond laser ablation of metal, which comprises the following steps: spraying a metal on a glass sheet to form a metal spraying surface i The test is carried out under different conditions of the distance between the sample surface, and the splashes are collected; the morphology and distribution of the collected splashes on the three glass sheets are observed under a high-resolution SEM, and the number and distribution of Si elements and Mi metal main elements are analyzed by using an EDS element area scanning method; the number and distribution information of the laser ablation splashes of the Mi sample collected on the glass sheet are obtained; the divergence angle β of the laser ablation spray beam is determined; the number SUM of the collected metal splashes is determined; and the particle size distribution N(μ,σ) of the collected metal splashes is determined. The method can effectively collect the splashes generated in the process of femtosecond laser ablation of refractory metal, analyze the distribution characteristics, is simple to collect, can obtain much information, and has high analysis precision.

Description

Technical Field

[0001] This invention relates to the field of laser ablation technology, and in particular to a method for processing sputtering products from femtosecond laser ablation of metal. Background Technology

[0002] Laser ablation is an important method of removing materials using lasers. It involves a laser beam irradiating an opaque target. As laser energy is deposited, the target surface undergoes physical stages such as localized heating, melting, vaporization, high-speed ejection of vaporized material, and plasma generation, resulting in the migration of material surface quality.

[0003] Femtosecond lasers are ultrashort pulse lasers. Due to their extremely short pulse width and extremely high peak energy, they can process almost all materials and have wide applications in micromachining at the micron and nanometer scale. During femtosecond laser ablation, material is inevitably removed in the form of sputtering particles. The ablation of these sputtering particles directly reflects the material's phase changes during ablation. Simultaneously, the scattering and absorption effects of these sputtering particles on the laser affect the target material's absorption of the laser, directly impacting the quality of the laser processing. Therefore, collecting and analyzing femtosecond laser ablation sputtering particles is significant for understanding the femtosecond laser processing process.

[0004] Currently, researchers rely solely on analyzing metal particles near the femtosecond laser ablation zone to study spatter particles from femtosecond laser ablation. However, the quartz glass plate method used in low-energy-density, long-pulse lasers to collect spatter particles is not suitable for femtosecond lasers. This is because the focal point in femtosecond laser ablation processing must be located on the surface of the metal target. The high-power-density femtosecond laser will directly act on the surface of the quartz glass. Since the ablation threshold of quartz glass is much lower than that of metal, it will ablate before the metal, and therefore cannot be used to collect spatter particles from metal ablation.

[0005] The information disclosed in the background section is only intended to enhance the understanding of the background of the present invention, and therefore may contain information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0006] To address the shortcomings or defects of existing technologies, a method for processing spatter products from femtosecond laser ablation of metals is provided. This method allows for the in-situ acquisition and analysis of metal spatter particles. It is simple to operate, provides more information about refractory metal spatter, and offers precise analysis of the spatter, facilitating accurate analysis of the materials removed during femtosecond laser processing by industry professionals.

[0007] The objective of this invention is achieved through the following technical solutions.

[0008] A method for processing sputtering products from femtosecond laser ablation of metal includes,

[0009] Step 1: One side of each of three quartz glass plates is sputtered with gold to obtain a gold-sputtered glass plate surface, which serves as a spatter collection plate. A femtosecond laser is used to ablate a uniformly rough metal material M supported on the gold-sputtered glass plate surface using predetermined laser ablation parameters. i The samples were ablated, with the laser beam axis perpendicular to the gold-sprayed surface of the glass slide and the upper surface of the Mi sample, respectively. The gold-sprayed surface of the glass slide faced downwards. The distance from the upper surface of the Mi sample to the plane of the laser focusing lens was L, and the distance from the upper surface of the Mi sample to the gold-sprayed surface of the glass slide was H. The distance from the gold-sprayed surface of the three quartz glass slides to the M sample was... i The surface distances h of the samples are H, H+ΔH, and H+2ΔH, respectively. The Mi sample to be ablated is moved away from under the femtosecond laser, while the gold-sprayed glass plate and the femtosecond laser remain stationary. The predetermined laser ablation parameter PARA is used to continuously increase the number of pulses to burn through the gold-sprayed glass plate with the femtosecond laser. After the glass plate is critically burned through, an additional 1000 pulses are added to ensure that the glass plate is fully burned through, the perforation morphology is stable, and the distribution of SiO2 sputtering on the glass plate surface is stable. The positions of the perforated glass plate and the femtosecond laser remain stationary. The Mi sample to be ablated is then placed back under the femtosecond laser, and the upper surface of the Mi sample is ablated using the predetermined laser ablation parameter PARA.

[0010] Step 2: The morphology and distribution of spatter collected on three glass slides were measured using SEM, and the quantity and distribution of Si and Mi metals were analyzed using EDS elemental surface scanning. Based on the Si elemental surface scanning results on the three glass slides, SiO2 spatter was identified and removed, obtaining the quantity and distribution information of Mi sample laser ablation spatter collected on the three glass slides at different heights (H, H+ΔH, and H+2ΔH planes). Based on the quantity and distribution information of Mi sample laser ablation spatter, the diameter Dh of the minimum circular region containing a predetermined percentage of spatter under the H, H+ΔH, and H+2ΔH planes was determined. The spraying was then analyzed based on the diameter Dh and h values. Linear fitting of the beam profile was performed to determine the divergence angle β of the jet beam for femtosecond laser ablation. Based on the EDS surface scan results of the laser ablation spatter of the Mi sample collected from three glass slides, the number of metal spatters SUM was obtained through image processing. The number of metal spatters SUM of the three glass slides was compared, and the largest number of metal spatters SUM was selected. Based on the EDS surface scan results of the laser ablation spatter of the Mi sample collected from three glass slides, the particle size distribution N(μ, σ) of the metal spatter was obtained through image processing. The statistical results of the particle size distribution of the spatters on the three glass slides were compared, and the particle size distribution N(μ, σ) of the spatter with the smallest average particle size was selected.

[0011] Step 3: Repeat steps 1-2 under different laser ablation parameters PARAj to obtain the divergence angle β, the number of metal sputterings SUM, and the particle size distribution of metal sputterings N(μ, σ) under different laser ablation parameters.

[0012] In the method, the predetermined laser ablation parameters include predetermined single-pulse energy, predetermined wavelength, predetermined focal size, predetermined pulse width, and predetermined laser action time.

[0013] In the method, the predetermined single pulse energy is 10-50 μJ, the predetermined wavelength is 450 nm-1030 nm, the predetermined focal size is 10 μm-50 μm, the predetermined pulse width is 230 fs, and the predetermined laser action time is 8 s.

[0014] In the method described, the metallic material M i The upper surface of the sample was successively subjected to grinding, polishing, rinsing with distilled water, immersion in acetone, ultrasonic cleaning, and drying to ensure that its surface roughness was uniform and consistent, with a surface roughness of Ra0.4 to Ra1.6.

[0015] In the method, ΔH is the thickness of the quartz glass sheet, which is 0.1 mm to 0.5 mm.

[0016] In the method, the gold-sprayed surface of the glass slide is applied to the sample M. i The distance H between the upper surfaces is 0.1 mm to 0.3 mm.

[0017] In the method described, the metallic material M i The samples included pure tungsten, pure molybdenum, pure niobium, tungsten alloys, and molybdenum alloys.

[0018] In the method, the quartz glass sheet is a square quartz glass sheet with a side length of 20-30 mm.

[0019] In the method, gold is sputtered onto one side of a glass sheet using a current of 10mA for 60s to obtain a gold-sputtered surface on the glass sheet.

[0020] In the method, the laser ablation parameters also include the defocusing amount.

[0021] Beneficial effects

[0022] This invention collects a large number of sputtering products. This invention uses the same parameters as the metal laser ablation process to prefabricate micron-sized perforations on a glass slide, ensuring that the metal laser ablation experiment itself is not interfered with, and minimizing the size of the prefabricated holes. This results in fewer missed sputtering products and a larger collection volume, making the experimental results closer to reality. The analysis results of the sputtering products are more comprehensive. Using the method of this invention, under different metal materials and different process conditions, we can obtain: (1) the divergence angle β of the laser ablation jet beam; (2) the number of metal sputterings SUM; and (3) the particle size distribution N(μ, σ) of the metal sputterings, solving the problem of difficulty in analyzing the ablation-removed sputterings during the ablation process using femtosecond lasers with high instantaneous energy density. It can achieve comprehensive analysis of the composition, morphology, size, distribution, and sputtering angle of femtosecond laser ablation sputterings, with high measurement accuracy, convenience, and efficiency.

[0023] The description provided is merely an overview of the technical solution of this invention. In order to make the technical means of this invention clearer and more understandable, so that those skilled in the art can implement it according to the contents of the specification, and to make the described and other objects, features and advantages of this invention more obvious and understandable, specific embodiments of this invention are described below. Attached Figure Description

[0024] Various other advantages and benefits of the present invention will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. It is obvious that the drawings described below are merely some embodiments of the invention, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort. Furthermore, the same reference numerals denote the same parts throughout the drawings.

[0025] In the attached diagram:

[0026] Figure 1 A schematic diagram of metal sputtering particle collection in a method for processing sputtering products from femtosecond laser ablation of metal provided in an embodiment of this disclosure;

[0027] Figure 2 This is a schematic diagram illustrating the operation of a method for processing sputtering products from femtosecond laser ablation of metal according to an embodiment of this disclosure;

[0028] Figure 3 A macroscopic morphology image of a SiO2 sheet containing metal sputtering particles collected in a method for processing sputtering products from femtosecond laser ablation of metal provided in an embodiment of this disclosure.

[0029] Figure 4The image shows the microstructure of metal sputtering particles collected in a method for processing sputtering products from femtosecond laser ablation of metal provided in one embodiment of this disclosure.

[0030] The present invention will be further explained below with reference to the accompanying drawings and embodiments. Detailed Implementation

[0031] Specific embodiments of the invention will now be described in more detail with reference to the accompanying drawings. While specific embodiments of the invention are shown in the drawings, it should be understood that the invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the invention and to fully convey the scope of the invention to those skilled in the art.

[0032] It should be noted that certain terms are used in the specification and claims to refer to specific components. Those skilled in the art will understand that different terms may be used to refer to the same component. This specification and claims do not distinguish components based on differences in terminology, but rather on differences in function. The terms "comprising" or "including" used throughout the specification and claims are open-ended and should be interpreted as "comprising but not limited to." The following descriptions are preferred embodiments for carrying out the invention; however, these descriptions are for the purpose of understanding the general principles of the specification and are not intended to limit the scope of the invention. The scope of protection of this invention is determined by the appended claims.

[0033] To facilitate understanding of the embodiments of the present invention, the following will provide further explanation and description with reference to the accompanying drawings and several specific embodiments, and the accompanying drawings do not constitute a limitation on the embodiments of the present invention.

[0034] like Figures 1 to 4 As shown, the method for processing the sputtering products of femtosecond laser ablation of metal includes,

[0035] 1. The single pulse energy of the femtosecond laser is 10-50 μJ, the wavelength is 450 nm-1030 nm, the focal size of the femtosecond laser is 10 μm-50 μm, and the pulse width is 230 fs.

[0036] 2. The metal material to be ablated is M. i (Refractory metals of W, Mo, and Nb, and W alloys and Mo alloys, such as W-Mo, W-Cu, TZM and other refractory alloys).

[0037] 3. M to be ablated i The upper surface of the sample was polished and tested to ensure that its surface roughness value was uniform.

[0038] 4. Use square quartz glass plates with a thickness of TH (0.1~0.2mm) as spatter collection plates. The side length of the glass plates is 20~30mm. Spray gold on one side of the glass plate with a current of 10mA for 60s. Prepare a total of 3 gold-sprayed glass plates.

[0039] 5. Spray gold onto the M-shaped surface of the glass slide. i The experiment was conducted under the condition that the distance h from the upper surface of the sample was h = H, and the splashes were collected.

[0040] like Figure 2 As shown, the M to be ablated i Sample 4 and the glass slide are placed on the worktable below the laser head. The axis of laser beam 1 is perpendicular to the gold-sprayed surface 2 of the glass slide and the surface to be ablated, respectively. i The upper surface of sample 4. The gold-plated glass slide 2 faces downwards, M... i The distance from the upper surface of the sample to the plane where the laser focusing lens is located is L, M i The distance from the upper surface of the sample to the gold-sprayed surface of the glass slide is H.

[0041] 1) The M to be ablated i The sample was moved away from under the laser head, while the gold-sprayed glass plate and the laser head remained stationary, and the sample was then used for M. i The laser ablation parameters PARA (defocusing amount, pulse energy, frequency, and laser action time) of the sample were determined by continuously increasing the number of pulses to burn through the gold-sprayed glass sheet using a femtosecond laser. After the glass sheet reached critical ablation, an additional 1000 pulses were added to ensure that the glass sheet was fully burned through, the morphology of the perforation 5 was stable, and the distribution of SiO2 sputterings 6 on the glass sheet's ingress surface was stable.

[0042] 2) Keeping the perforated glass plate and laser head in place, place the M to be ablated i The sample was repositioned under the laser head, and the M sample was subjected to laser ablation using the predetermined PARA parameters (defocusing amount, pulse energy, frequency, and laser action time). i The upper surface of the sample was ablated.

[0043] 3) Remove the glass slide, place it with the gold-plated side facing up, and store it properly for high-resolution SEM analysis.

[0044] 6. Spray gold onto the M-shaped surface of the glass slide. i The experiment was conducted under the condition that the distance h from the upper surface of the sample was h = H + ΔH, and the splashes were collected.

[0045] 1) The M to be ablated i The sample and glass slide are placed on the worktable below the laser head, with the laser beam axis perpendicular to the gold-sprayed surface of the glass slide and M, respectively. i The upper surface of the sample. The gold-sprayed glass slide faces downwards, M. i The distance from the upper surface of the sample to the plane where the laser focusing lens is located is L, Mi The distance from the upper surface of the sample to the gold-sprayed surface of the glass slide is H+ΔH.

[0046] 2) The M to be ablated i The sample was moved away from under the laser head, while the gold-sprayed glass plate and the laser head remained stationary, and the sample was then used for M. i The laser ablation parameters PARA (defocusing amount, pulse energy, frequency, and laser action time) of the sample were determined by continuously increasing the number of pulses to burn through the gold-sprayed glass sheet using a femtosecond laser. After the glass sheet reached critical ablation, an additional 1000 pulses were applied to ensure that the glass sheet was fully burned through, the perforation morphology was stable, and the distribution of SiO2 sputtering on the glass sheet's ingress surface was stable.

[0047] 3) Keeping the perforated glass plate and laser head in place, place the M to be ablated i The sample was repositioned under the laser head, and the M sample was subjected to laser ablation using the predetermined PARA parameters (defocusing amount, pulse energy, frequency, and laser action time). i The upper surface of the sample was ablated.

[0048] 4) Remove the glass slide, place it with the gold-plated side facing up, and store it properly for high-resolution SEM analysis.

[0049] 7. Apply gold plating to the M-shaped surface of the glass slide. i The experiment was conducted under the condition that the distance h from the upper surface of the sample was h = H + 2ΔH, and the splashes were collected.

[0050] 1) The M to be ablated i The sample and glass slide are placed on the worktable below the laser head, with the laser beam axis perpendicular to the gold-sprayed surface of the glass slide and M, respectively. i The upper surface of the sample. The gold-sprayed glass slide faces downwards, M. i The distance from the upper surface of the sample to the plane where the laser focusing lens is located is L, M i The distance from the upper surface of the sample to the gold-sprayed surface of the glass slide is H+2ΔH.

[0051] 2) The M to be ablated i The sample was moved away from under the laser head, while the gold-sprayed glass plate and the laser head remained stationary, and the sample was then used for M. i The laser ablation parameters PARA (defocusing amount, pulse energy, frequency, and laser action time) of the sample were determined by continuously increasing the number of pulses to burn through the gold-sprayed glass sheet using a femtosecond laser. After the glass sheet reached critical ablation, an additional 1000 pulses were applied to ensure that the glass sheet was fully burned through, the perforation morphology was stable, and the distribution of SiO2 sputtering on the glass sheet's ingress surface was stable.

[0052] 3) Keeping the perforated glass plate and laser head in place, place the M to be ablated iThe sample was repositioned under the laser head, and the M sample was subjected to laser ablation using the predetermined PARA parameters (defocusing amount, pulse energy, frequency, and laser action time). i The upper surface of the sample was ablated.

[0053] 4) Remove the glass slide, place it with the gold-plated side facing up, and store it properly for high-resolution SEM analysis.

[0054] 8. Observe the morphology and distribution of the spatter collected on the three glass slides under high-resolution SEM, and...

[0055] Elemental analysis of Si and M using EDS elemental surface scanning method i The quantity and distribution of major metallic elements.

[0056] 9. Based on the surface scan results of Si elements on the three glass slides, identify and remove the SiO2 sputtering areas to obtain the M collected by the three glass slides at different heights (H, H+ΔH, H+2ΔH). i Information on the quantity and distribution of laser ablation spatter on the sample.

[0057] 10. Determine the divergence angle β of the laser ablation jet beam. Determine the diameter D of the smallest circular region containing 90% of the spatter. h (h=H、H+ΔH、H+2ΔH), according to D h The jet beam profile was linearly fitted using (h=H、H+ΔH、H+2ΔH) and the h value to determine the divergence angle β of the jet beam.

[0058] 11. Determine the amount of collected metal spatter, SUM. Based on the M collected from the three glass slides... i The EDS surface scan results of the laser ablation spatter on the sample were used to obtain the sum of squared fragments (SUM) through image processing. The statistical results of the number of spatters on the three glass slides were compared, and the data of the glass slide with the largest SUM value was selected.

[0059] 12. Determine the particle size distribution N(μ, σ) of the collected metal spatter. Based on the M collected from three glass slides... i The EDS surface scan results of the laser ablation spatter from the sample were used to obtain the spatter particle size distribution N(μ, σ) through image processing. The statistical results of the spatter particle size distributions of the three glass slides were compared, and the data of the glass slide with the smallest average particle size were used.

[0060] 13. Repeat steps 5 to 12 under different laser ablation parameters PARAj to obtain β, SUM and N(μ, σ) under different laser ablation parameters.

[0061] 14. The obtained data such as the divergence angle β, the number of metal sputterings SUM, and the particle size distribution N(μ, σ) of the laser ablation jet beam under different metal materials and different process conditions are compared with the numerical simulation results of the laser ablation process to verify and correct the simulation model.

[0062] One embodiment discloses a method for processing sputtering products from femtosecond laser ablation of metal, including...

[0063] Step 1: The femtosecond laser has a single pulse energy of 10μJ, a wavelength of 1030nm, a focal size of 10μm, a pulse width of 230fs, and a focal length of 170mm for the focusing mirror.

[0064] Furthermore, the metal material to be ablated is the refractory metal pure molybdenum.

[0065] Step 2: The surface of the pure molybdenum sample to be ablated was successively ground, polished, rinsed with distilled water, soaked in acetone for ultrasonic cleaning, and dried. The surface roughness was measured to be Ra0.8, and the entire surface was uniform.

[0066] Step 3: Use a square quartz glass plate with a thickness of 0.15mm as a spatter collection plate. The side length of the glass plate is 20mm. Spray gold on one side of the glass plate with a spray current of 10mA for 60s.

[0067] Step 4: Conduct the test with the distance between the gold-plated glass slide and the surface of the pure molybdenum sample being 0.15 mm, and collect the spatter.

[0068] The sample to be ablated and the glass slide are placed on the worktable below the laser head. The laser beam axis is perpendicular to the gold-sprayed surface of the glass slide and the upper surface of the pure molybdenum sample, respectively. The gold-sprayed surface of the glass slide faces downwards. The distance from the upper surface of the pure molybdenum sample to the plane of the laser focusing lens is 170 mm, and the distance from the upper surface of the pure molybdenum sample to the gold-sprayed surface of the glass slide is 0.15 mm.

[0069] The sample to be ablated was moved away from under the laser head, while the gold-sprayed glass sheet and the galvanometer head remained stationary. Laser ablation parameters intended for pure molybdenum samples were adopted (defocusing distance 0 mm, pulse energy 10 μJ, frequency 500 kHz, laser action time 4 s). By continuously increasing the number of pulses, the femtosecond laser ablated the gold-sprayed glass sheet. After the glass sheet reached critical ablation, an additional 1000 pulses were applied to ensure complete ablation, stable perforation morphology, and stable distribution of SiO2 sputtering on the glass sheet's ingress surface.

[0070] Keeping the perforated glass plate and laser head in place, the pure molybdenum sample to be ablated is placed back under the laser head, and the upper surface of the pure molybdenum sample is ablated using the planned laser ablation parameters (defocusing amount 0 mm, pulse energy 10 μJ, frequency 500 kHz, laser action time 8 s).

[0071] Step 7: Observe the morphology and distribution of the spatters collected on the three glass slides under high-resolution SEM, and analyze the quantity and distribution of Si and Mo, the main metal elements, using EDS elemental surface scanning method.

[0072] Step 8: Identify and remove SiO2 sputterings based on the surface scan results of Si elements on the three glass slides, and obtain information on the quantity and distribution of laser ablation sputterings of pure molybdenum samples collected on the glass slides.

[0073] Step 9: Determine the divergence angle β of the laser ablation jet beam. Determine the diameter Dh = 1 mm of the smallest circular region containing 90% of the spatter. Based on Dh = 1 mm and h = 0.15 mm, perform linear fitting on the jet beam profile to determine the divergence angle β = 54°.

[0074] Step 10: Determine the quantity (SUM) of collected metal spatter. Based on the EDS surface scan results of laser ablation spatter from three glass slides of pure molybdenum samples, the SUM is obtained through image processing. (1μm-2μm) =641, SUM (0.5μm-1μm) =1084, SUM (0μm-0.5μm) = 4383.

[0075] Step 11: Determine the particle size distribution N(μ, σ) of the collected metal spatter. Based on the EDS surface scan results of the laser ablation spatter of the Mi sample collected from three glass slides, the particle size distribution N(μ, σ) of the spatter is obtained through image processing.

[0076] Although embodiments of the present invention have been described above in conjunction with the accompanying drawings, the present invention is not limited to the specific embodiments and application fields described herein. The specific embodiments described are merely illustrative and instructive, and not restrictive. Those skilled in the art can make many other modifications based on the guidance of this specification and without departing from the scope of the claims of the present invention, and all such modifications are within the scope of protection of the present invention.

Claims

1. A method for processing sputtering products from femtosecond laser ablation of metal, characterized in that, It includes, Step 1: One side of each of three quartz glass plates is sputtered with gold to obtain a gold-sputtered glass plate surface, which serves as a spatter collection plate. A femtosecond laser is used to ablate a uniformly rough metal material M supported on the gold-sputtered glass plate surface using predetermined laser ablation parameters. i The samples were ablated, with the laser beam axis perpendicular to the gold-sprayed surface of the glass slide and the upper surface of the Mi sample, respectively. The gold-sprayed surface of the glass slide faced downwards. The distance from the upper surface of the Mi sample to the plane of the laser focusing lens was L, and the distance from the upper surface of the Mi sample to the gold-sprayed surface of the glass slide was H. The distance from the gold-sprayed surface of the three quartz glass slides to the M sample was... i The surface distances h of the samples are H, H+ΔH, and H+2ΔH, respectively. The Mi sample to be ablated is moved away from under the femtosecond laser, while the gold-sprayed glass plate and the femtosecond laser remain stationary. The predetermined laser ablation parameter PARA is used to continuously increase the number of pulses to burn through the gold-sprayed glass plate with the femtosecond laser. After the glass plate is critically burned through, an additional 1000 pulses are added to ensure that the glass plate is fully burned through, the perforation morphology is stable, and the distribution of SiO2 sputtering on the glass plate surface is stable. The positions of the perforated glass plate and the femtosecond laser remain stationary. The Mi sample to be ablated is then placed back under the femtosecond laser, and the upper surface of the Mi sample is ablated using the predetermined laser ablation parameter PARA. Step 2: The morphology and distribution of spatter collected on three glass slides were measured using SEM, and the quantity and distribution of Si and Mi metals were analyzed using EDS elemental surface scanning. Based on the Si element surface scanning results on the three glass slides, SiO2 spatter was identified and removed, obtaining the quantity and distribution information of Mi sample laser ablation spatter collected on the three glass slides at different heights (H, H+ΔH, and H+2ΔH planes). Based on the quantity and distribution information of Mi sample laser ablation spatter, the diameter Dh of the minimum circular region containing a predetermined percentage of spatter under the H, H+ΔH, and H+2ΔH planes was determined. The jet beam profile was linearly fitted based on the diameter Dh and h values ​​to determine the divergence angle of the femtosecond laser ablation jet beam. Based on the EDS surface scan results of the laser ablation spatter from the Mi sample collected from three glass slides, the number of metal spatters (SUM) was obtained through image processing. The SUM of metal spatters from the three glass slides was compared, and the SUM with the largest number of metal spatters was selected. Based on the EDS surface scan results of the laser ablation spatter from the Mi sample collected from the three glass slides, the particle size distribution of the metal spatters was obtained through image processing. By comparing the statistical results of the spatter particle size distributions of the three glass slides, the spatter particle size distribution with the smallest average particle size was selected. ; Step 3: Repeat steps 1-2 under different laser ablation parameters PARAj to obtain the divergence angle under different laser ablation parameters. The number of metal spatters (SUM) and the particle size distribution of metal spatters. ΔH is the thickness of the quartz glass sheet, ranging from 0.1mm to 0.5mm. The distance from the gold-plated surface of the glass sheet to the sample M is... i The distance H between the upper surfaces is 0.1mm to 0.3mm, and the perforations on the glass slide are at the micrometer level.

2. The method according to claim 1, characterized in that, The predetermined laser ablation parameters include predetermined single-pulse energy, predetermined wavelength, predetermined focal size, predetermined pulse width, and predetermined laser action time.

3. The method according to claim 2, characterized in that, The predetermined single pulse energy is 10~50μJ, the predetermined wavelength is 450nm~1030nm, the predetermined focal size is 10μm~50μm, the predetermined pulse width is 230fs, and the predetermined laser action time is 8s.

4. The method according to claim 1, characterized in that, Metallic material M i The upper surface of the sample was successively ground, polished, rinsed with distilled water, soaked in acetone, ultrasonically cleaned, and dried to make its surface roughness uniform and consistent with Ra0.4~Ra1.

6.

5. The method according to claim 1, characterized in that, Metallic material M i The samples included pure tungsten, pure molybdenum, pure niobium, tungsten alloys, and molybdenum alloys.

6. The method according to claim 1, characterized in that, The quartz glass sheet is a square quartz glass sheet with a side length of 20~30mm.

7. The method according to claim 1, characterized in that, A gold-plated surface of the glass slide is obtained by sputtering gold onto one side of the glass slide with a current of 10mA for 60s.

8. The method according to claim 1, characterized in that, Laser ablation parameters also include defocusing.

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