An automatic slicing device for photovoltaic silicon wafers

Abstract

The present application discloses an automatic slicing device for photovoltaic silicon wafers, including a frame, a control unit, a cutting liquid applying unit, a wire-release unit, a first tensioning roller, a plurality of wire rollers, a second tensioning roller, a wire-receiving unit, a silicon rod fixing unit, and a lifting and lowering driving unit for driving the silicon rod fixing unit to rise and fall. The diamond wire extending from the wire-release unit passes through the first tensioning roller, a plurality of wire rollers, and the second tensioning roller in sequence and is retracted by the wire-receiving unit; the plurality of wire rollers include a first wire roller, a second wire roller, a third wire roller, and a fourth wire roller, and the first, second, third, and fourth wire rollers are distributed in a rectangular shape, the first wire roller and the second wire roller are at the same horizontal height, the third wire roller and the fourth wire roller are at the same horizontal height, and the first wire roller is higher than the third wire roller. The slicing device of the present application can monitor the state of multiple strands of diamond wires during slicing, thereby ensuring that the slicing of the silicon rod is more stable.

Description

Technical Field

[0001] The present application relates to the photovoltaic field, and in particular to an automatic slicing device for photovoltaic silicon wafers. Background Art

[0002] With the development of new energy technology, photovoltaic technology has made important breakthroughs and its cost has been greatly reduced. As the most basic component of photovoltaic power generation components, silicon wafers have received more and more attention for breakthroughs in key technologies. Silicon wafer processing mainly includes squaring, slicing, cleaning and other processes. The quality of each step of the process will affect the quality of the final silicon wafer. The slicing process is to cut the already formed silicon rod. The common cutting process is mainly diamond wire multi-wire cutting, which can complete the cutting of the entire silicon rod at one time, with high cutting efficiency. Its cutting accuracy mainly depends on the parallel multi-strand cutting diamond wire formed after the diamond wire is wound on the wire roller many times, and the diamond wire is kept stable in displacement and cutting relative to the silicon rod during cutting. However, in the actual cutting process, due to the long cutting time for a single silicon rod, there are sometimes phenomena such as wire jumpers and wire breaks. When a strand of diamond wire has a position deviation, it cannot be discovered in the first time due to the lack of corresponding monitoring equipment, which brings hidden dangers to the quality of silicon wafer production. Summary of the invention

[0003] Purpose of the invention: This application aims to overcome the defects of the prior art and provide an automated slicing device for photovoltaic silicon wafers.

[0004] Technical solution: A photovoltaic silicon wafer slicing device includes a frame, a control unit, a cutting liquid applying unit, a pay-off unit, a first tensioning roller, a plurality of wire rollers, a second tensioning roller, a take-up unit, a silicon rod fixing unit, and a lifting drive unit for driving the silicon rod fixing unit to rise and fall. The diamond wire extending from the pay-off unit passes through the first tensioning roller, the plurality of wire rollers, and the second tensioning roller in sequence and is taken up by the take-up unit; the plurality of wire rollers include a first wire roller, a second wire roller, a third wire roller, and a fourth wire roller, the first, second, third, and fourth wire rollers are distributed in a rectangular shape, the first wire roller and the second wire roller are at the same horizontal height, the third wire roller and the fourth wire roller are at the same horizontal height, and the first wire roller is higher than the third wire roller.

[0005] Thus, the diamond wire coming out of the wire-releasing unit is repeatedly wound by the four wire rollers to form a plurality of cutting diamond wires, which can be used to slice silicon wafers simultaneously. The cutting liquid applying unit can apply cutting liquid, thereby achieving a cooling effect and ensuring smooth slicing.

[0006] Furthermore, a plurality of diamond wires are formed between the first guide roller and the third guide roller, a detection unit is installed between the first guide roller and the third guide roller, the detection unit includes a first L-shaped plate fixedly connected to the frame and a second L-shaped plate fixedly connected to the frame, the first L-shaped plate includes a first vertical plate and a first horizontal plate fixed to the top of the first vertical plate, the second L-shaped plate includes a second vertical plate and a second horizontal plate fixed to the top of the second vertical plate, a lifting plate is installed at the first vertical plate, a rectangular frame-shaped edging is fixed at the lifting plate, an electric lifting rod is connected between the first horizontal plate and the rectangular frame-shaped edging, the rectangular frame-shaped edging is also connected to a shielding vertical plate through a plurality of connecting frames, a first reflector is fixed at the lifting plate, A laser transmitter is installed at one end of the lifting plate, and a light receiver is installed at the other end; a first hinged seat is fixed to the second vertical plate, and a sensing vertical plate is provided between the second vertical plate and the shielding vertical plate, a second hinged seat hinged to the first hinged seat is fixed to the sensing vertical plate, a spring is connected between the sensing vertical plate and the second vertical plate, a second reflector is fixed to the sensing vertical plate, the shielding vertical plate can abut the surface of the second reflector to partially shield the second reflector, and a plurality of L-shaped sensing rods are fixed to the sensing vertical plate, and one of the L-shaped sensing rods passes between two adjacent diamond wires; the light emitted by the laser transmitter is reflected multiple times by the first reflector and the second reflector and then received by the light receiver.

[0007] Furthermore, the first vertical plate has a strip-shaped slide rail, and the lifting plate has a strip-shaped slide groove matched with the strip-shaped slide rail.

[0008] Thereby making the operation of the lifting plate more stable.

[0009] Furthermore, the first reflector and the second reflector are both rectangular reflectors.

[0010] Therefore, the first and second reflectors run through the entire length of the silicon rod, so that light can pass through the gap between any two adjacent diamond wires.

[0011] Furthermore, the optical receiver is a light intensity detector, a CMOS optical receiver or a CCD optical receiver.

[0012] Furthermore, there are two of each of the first hinge seat, the second hinge seat and the spring.

[0013] Preferably, the first and second hinged seats are located above the sensing plate, and the spring is located below the sensing plate, so that the vibration of the sensing plate caused by the misalignment of the diamond wire is more obvious, thereby making the detection more sensitive.

[0014] Furthermore, there are four connecting frames, and the connecting frames are I-shaped connecting frames.

[0015] Thereby, the connection between the lifting plate and the shielding vertical plate is more stable, so that the lifting of the two can be achieved synchronously.

[0016] Furthermore, a plurality of image acquisition units are installed on the lifting plate.

[0017] Therefore, it is possible to determine in real time whether the second reflecting mirror is contaminated by the cutting fluid based on the images collected in real time by the multiple image collection units.

[0018] Furthermore, the wire roller has an accommodating groove for accommodating the diamond wire.

[0019] Beneficial effect: The slicing device of the present application can monitor the working status of multiple strands of diamond wires while slicing, and the monitoring can simultaneously realize mechanical monitoring and optical monitoring, and the monitoring sensitivity is high, so the stable operation of the slicing device can be monitored. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the slicing device from the first perspective;

[0021] Figure 2 is a schematic diagram of the slicing device from a second viewing angle;

[0022] Figure 3 This is an enlarged view of area A;

[0023] Figure 4 A schematic diagram of the slicing device from the third perspective;

[0024] Figure 5 It is a schematic diagram of the slicing device after the lifting plate is raised a certain distance;

[0025] Figure 6 This is an enlarged view of area B. DETAILED DESCRIPTION

[0026] Reference numerals: 1.1 pay-off unit; 1.2 first tensioning roller; 1.3 first wire roller; 1.4 second wire roller; 1.5 third wire roller; 1.6 fourth wire roller; 1.7 second tensioning roller; 1.8 take-up unit; 1.9 diamond wire;

[0027] 2.1 first vertical plate; 2.2 first horizontal plate; 2.3 strip slide rail; 2.4 electric lifting rod;

[0028] 3.1 lifting plate; 3.2 first reflector; 3.3 rectangular frame with edging; 3.4 connecting frame; 3.5 shielding vertical plate;

[0029] 4.1 second vertical plate; 4.2 second horizontal plate; 4.3 first hinge seat; 4.4 second hinge seat; 4.5 induction plate; 4.6 spring; 4.7 L-shaped induction rod; 4.8 second reflector;

[0030] 5.1 Laser transmitter; 5.2 Optical receiver;

[0031] 6 Silicon rod fixing unit; 6.1 Silicon rod.

[0032] As shown in the figure, an automatic slicing device for photovoltaic silicon wafers includes a machine frame (not shown in the figure), a control unit, a cutting liquid applying unit (not shown in the figure), a wire-releasing unit 1.1, a first tensioning roller 1.2, a plurality of wire rollers, a second tensioning roller 1.7, a wire-receiving unit 1.8, a silicon rod fixing unit 6, and a lifting driving unit (not shown in the figure) for driving the silicon rod fixing unit 6 to rise and fall. The diamond wire extending from the wire-releasing unit 1.1 passes through the first tensioning roller 1.2, a plurality of wire rollers, and the second tensioning roller 1.7 in sequence and is retracted by the wire-receiving unit 1.8; the plurality of wire rollers include a first wire roller 1.3, a second wire roller 1.4, a third wire roller 1.5, and a fourth wire roller 1.6. The first, second, third, and fourth wire rollers are distributed in a rectangular shape. The first wire roller 1.3 and the second wire roller 1.4 are located at the same horizontal height, the third wire roller 1.5 and the fourth wire roller 1.6 are located at the same horizontal height, and the first wire roller 1.3 is higher than the third wire roller 1.5. A plurality of diamond wires 1.9 are formed between the first guide roller 1.3 and the third guide roller 1.5, and a detection unit is installed between the first guide roller 1.3 and the third guide roller 1.5, and the detection unit includes a first L-shaped plate fixedly connected to the frame and a second L-shaped plate fixedly connected to the frame, the first L-shaped plate includes a first vertical plate 2.1 and a first horizontal plate 2.2 fixed to the top of the first vertical plate 2.1, the second L-shaped plate includes a second vertical plate 4.1 and a second horizontal plate 4.2 fixed to the top of the second vertical plate 4.1, a lifting plate 3.1 is installed at the first vertical plate 2.1, a rectangular frame-shaped edging 3.3 is fixed at the lifting plate 3.1, an electric lifting rod 2.4 is connected between the first horizontal plate 2.2 and the rectangular frame-shaped edging 3.3, and the rectangular frame-shaped edging 3.3 is also connected to a shielding vertical plate 3.5 through a plurality of connecting frames 3.4, a first reflector 3.2 is fixed at the lifting plate 3.1, and the lifting plate 3.1 A laser transmitter 5.1 is installed at one end, and a light receiver 5.2 is installed at the other end; a first hinge seat 4.3 is fixed to the second vertical plate 4.1, and a sensing vertical plate 4.5 is provided between the second vertical plate 4.1 and the shielding vertical plate 3.5, a second hinge seat 4.4 hinged to the first hinge seat 4.3 is fixed to the sensing vertical plate 4.5, a spring 4.6 is connected between the sensing vertical plate 4.5 and the second vertical plate 4.1, a second reflector 4.8 is fixed to the sensing vertical plate 4.5, the shielding vertical plate 3.5 can abut against the surface of the second reflector 4.8 to partially shield the second reflector 4.8, and a plurality of L-shaped sensing rods 4.7 are fixed to the sensing vertical plate 4.5, and one of the L-shaped sensing rods 4.7 passes between two adjacent diamond wires 1.9; the light emitted by the laser transmitter 5.1 is reflected multiple times by the first reflector 3.2 and the second reflector 4.8 and then received by the light receiver 5.2.

[0033] The first vertical plate 2.1 has a strip rail 2.3, and the lifting plate 3.1 has a strip groove matched with the strip rail 2.3. The first reflector 3.2 and the second reflector 4.8 are both rectangular reflectors. The light receiver 5.2 is a light intensity detector, a CMOS light receiver or a CCD light receiver. There are two of the first hinge seat 4.3, the second hinge seat 4.4 and the spring 4.6. There are four connecting frames 3.4, and the connecting frames 3.4 are I-shaped connecting frames. A plurality of image acquisition units are also installed on the lifting plate 3.1.

[0034] The slicing device of the present application, as shown in the figure, the diamond wire coming out of the wire-releasing unit passes through multiple wire rollers to form multiple strands of diamond wires arranged side by side. The silicon rod can be sliced ​​under the feeding of the silicon rod fixing unit and the lifting drive unit (which is the prior art and not shown in the figure). And the cutting fluid has a cooling effect during the cutting process. For the sake of clarity, the spacing between adjacent diamond wires in the figure is relatively large, but in fact the spacing between adjacent diamond wires is relatively small.

[0035] In the detection unit of the present application, the light emitted by the laser transmitter can pass through the gap between any two adjacent diamond wires after being reflected by the first and second reflectors, and there is an L-shaped sensing rod between the gaps between any two adjacent diamond wires. Under normal circumstances, the light emitted by the laser transmitter is received by the optical receiver after multiple reflections, and its optical signal is specific. When the position of the diamond wire is misplaced, or the diamond wire is broken, the misplaced diamond wire will block the light path, and the broken diamond wire will hit the L-shaped sensing rod, causing the sensing plate to shake. In either case, the optical signal received by the optical receiver will be abnormal, thereby sensing that the diamond wire cutting is abnormal. In addition, due to the presence of the cutting fluid, the second reflector may be contaminated. Due to the design of the first L-shaped plate and the second L-shaped plate, the first and second reflectors have been protected and are relatively not easy to be contaminated, and the first reflector is better protected due to the presence of the rectangular frame-shaped edging. Therefore, when starting monitoring, such as Figure 1As shown, the shielding vertical plate is in a lower position, exposing only the lower position of the second reflector for reflection, and then the lifting plate can be raised (the laser transmitter, the first reflector, and the light receiver are all raised), so that the shielding vertical plate rises, thereby exposing the higher position of the second reflector for reflecting the light path, and the area of ​​the second reflector just exposed is cleaner, so that the monitoring effect is better. The rise of the lifting plate can be over time, for example, it rises at regular intervals. It is also possible to manually control the rise of the lifting plate after a false alarm occurs (the false alarm is mainly caused by the contamination of the reflective area of ​​the second reflector in use). It is also possible to collect the image of the second reflector in real time according to multiple image acquisition units, and when the second reflector is found to be contaminated, the lifting plate is controlled to rise. Through the setting of the shielding vertical plate, even if the second reflector is contaminated in some cases, by lifting the shielding vertical plate, a new clean area of ​​the second reflector is exposed, and monitoring of multiple diamond wire cutting positions can still be achieved.

[0036] Although the present invention has been illustrated and described with respect to the preferred embodiments, it will be appreciated by those skilled in the art that various changes and modifications may be made to the present invention without departing from the scope of the present invention as defined by the claims.

Claims

1. A photovoltaic silicon wafer automatic slicing device, characterized in that: The invention comprises a frame, a control unit, a cutting liquid applying unit, a wire-releasing unit, a first tensioning roller, a plurality of wire rollers, a second tensioning roller, a wire-receiving unit, a silicon rod fixing unit and a lifting driving unit for driving the silicon rod fixing unit to rise and fall, wherein the diamond wire extending from the wire-releasing unit passes through the first tensioning roller, the plurality of wire rollers and the second tensioning roller in sequence and is retracted by the wire-receiving unit; the plurality of wire rollers comprises a first wire roller, a second wire roller, a third wire roller and a fourth wire roller, the first, second, third and fourth wire rollers are distributed in a rectangular shape, the first wire roller and the second wire roller are located at the same horizontal height, the third wire roller and the fourth wire roller are located at the same horizontal height, and the first wire roller is higher than the third wire roller; a plurality of diamond wires are formed between the first wire roller and the third wire roller, a detection unit is installed between the first wire roller and the third wire roller, the detection unit comprises a first L-shaped plate fixedly connected to the frame and a second L-shaped plate fixedly connected to the frame, the first L-shaped plate comprises a first vertical plate and a first horizontal plate fixed to the top of the first vertical plate, the second L-shaped plate comprises a second vertical plate and a fixed A second horizontal plate is fixed at the top of the second vertical plate, a lifting plate is installed at the first vertical plate, a rectangular frame-shaped edging is fixed at the lifting plate, an electric lifting rod is connected between the first horizontal plate and the rectangular frame-shaped edging, and the rectangular frame-shaped edging is also connected to a shielding vertical plate through a plurality of connecting frames, a first reflector is fixed at the lifting plate, a laser transmitter is installed at one end of the lifting plate, and a light receiver is installed at the other end; a first hinge seat is fixed to the second vertical plate, and a sensing vertical plate is also provided between the second vertical plate and the shielding vertical plate, a second hinge seat hinged to the first hinge seat is fixed at the sensing vertical plate, a spring is also connected between the sensing vertical plate and the second vertical plate, a second reflector is fixed at the sensing vertical plate, the shielding vertical plate can abut the surface of the second reflector to partially shield the second reflector, and a plurality of L-shaped sensing rods are also fixed at the sensing vertical plate, and one of the L-shaped sensing rods passes between two adjacent diamond wires; the light emitted by the laser transmitter is received by the light receiver after being reflected multiple times by the first reflector and the second reflector.

2. The photovoltaic silicon wafer automatic slicing device according to claim 1, characterized in that: The first vertical plate is provided with a strip-shaped slide rail, and the lifting plate is provided with a strip-shaped slide groove matched with the strip-shaped slide rail.

3. The photovoltaic silicon wafer automatic slicing device according to claim 1, characterized in that: The first reflector and the second reflector are both rectangular reflectors.

4. The photovoltaic silicon wafer automatic slicing device according to claim 1, characterized in that: The optical receiver is a light intensity detector, a CMOS optical receiver or a CCD optical receiver.

5. The photovoltaic silicon wafer automatic slicing device according to claim 1, characterized in that: There are two of each of the first hinge seat, the second hinge seat and the spring.

6. The photovoltaic silicon wafer automatic slicing device according to claim 1, characterized in that: There are four connecting frames, and the connecting frames are I-shaped connecting frames.

7. The photovoltaic silicon wafer automatic slicing device according to claim 1, characterized in that: A plurality of image acquisition units are also installed on the lifting plate.

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