A heat pipe lattice satellite temperature averaging plate structure and its design method and manufacturing method

Abstract

The present invention discloses a heat pipe lattice satellite temperature equalizing plate structure and its design method and manufacturing method. The structure is formed by making the cubic lattice structure truss into a hollow tubular structure, pumping negative pressure inside and filling it with phase change medium, thereby forming a heat pipe lattice structure with super heat exchange capacity. The heat pipe lattice sandwich panel is then made into a satellite cabin panel. The liquid phase change medium is used to evaporate and absorb heat on the sun-facing side, and the gaseous phase change medium is used to condense and release heat on the shady side, so that the temperature of all parts of the entire satellite can be kept constant. At the same time, the blank area inside the lattice sandwich panel can be filled with fireproof cotton and other light-weight and high-thermal-conductivity materials to reduce the heat exchange between the inside and outside of the satellite, thereby playing a role in heat preservation. This avoids a series of problems caused by methods such as attaching heat pipes to the outside of the cabin panel or pre-embedded heat pipes in honeycomb panels, and realizes the structural and functional integrated design of the load-bearing and thermal control of the satellite temperature equalizing plate.

Description

Technical Field

[0001] The present invention belongs to the field of satellite thermal control technology and relates to a temperature averaging plate, and in particular to the structure, design and manufacturing method of a heat pipe lattice satellite temperature averaging plate. Background Art

[0002] Artificial satellites operate in the space environment. The side directly exposed to the sun absorbs a large amount of solar radiation, reaching temperatures exceeding 100°C. However, the side facing away from the sun becomes extremely cold due to a lack of solar heat, potentially reaching temperatures below -100°C. This results in significant temperature differences across the satellite. The various electronic components and devices within the satellite, such as sensors and solar cells, cannot operate in such a harsh environment for long periods of time. For example, high temperatures can easily cause aging or even damage to these components, while low temperatures can degrade the satellite's mechanical and electrical performance. Therefore, to ensure the proper functioning of the satellite and guarantee its performance, reliability, and lifespan, temperature control is required to maintain a consistent temperature across the entire satellite, thus meeting the temperature requirements for the long-term operation of the various instruments, equipment, and components onboard.

[0003] At present, satellites generally adopt the method of attaching heat pipes to the outside of the cabin or pre-embedding heat pipes in honeycomb sandwich panels to control the temperature of the satellite. The temperature control technology of attaching heat pipes to the outside of the cabin adopts the method of directly attaching the heat pipes to the surface of the satellite for heat conduction and heat control. Taking the isothermal integrated heat dissipation device suitable for micro-nano satellites disclosed in Chinese invention patent application CN201811279420.2 and the heat dissipation structure, phased array antenna and satellite platform disclosed in another Chinese invention patent application CN202111395119.X as examples, the heat pipes can directly transfer the heat generated inside the satellite to the surface of the satellite, thereby This achieves rapid heat dissipation and improves the system's temperature control capability. Pre-embedded heat pipes in honeycomb sandwich panels are a way of directly embedding heat pipes into the honeycomb sandwich panels. Taking the low thermal resistance honeycomb sandwich panel for satellites and its manufacturing method disclosed in Chinese invention patent application CN201310345339.0 and the large pre-embedded complex small deformation frame honeycomb panel disclosed in another Chinese invention patent application CN201110331915.7 as examples, this technology does not require physical bonding or hanging on the satellite surface, will not damage the integrity of the satellite surface, and can better protect the satellite shell while performing temperature control. However, the above two methods also have their own disadvantages and shortcomings. For example, for the installation method of external heat pipes, since it requires the installation of a large number of heat pipes and radiators on the surface of the satellite, there are problems such as many parts, heavy weight, and long process cycle. In addition, there is thermal resistance on the contact surface between the heat pipe and the mounting plate, and the heat dissipation is not ideal. The pre-buried heat pipe method requires the heat pipe to be directly embedded in the honeycomb sandwich panel. Such a structural setting method will destroy the integrity of the honeycomb sandwich structure and weaken the mechanical strength of the honeycomb sandwich structure. At the same time, the adhesive connecting the honeycomb and the heat pipe will also increase the thermal resistance, resulting in poor heat dissipation capacity. In addition, there are problems such as complex processing technology and high cost. Summary of the Invention

[0004] (1) Purpose of the invention

[0005] To address the aforementioned shortcomings and deficiencies of the prior art, and to address the technical issues of existing externally mounted heat pipe satellite temperature control technologies, such as the large number of parts, heavy weight, long processing cycles, high thermal resistance between the heat pipe and mounting plate, and poor heat dissipation, as well as the technical issues of existing pre-embedded heat pipes in honeycomb sandwich panels, such as damage to the integrity of the honeycomb sandwich structure, weakening the mechanical strength of the honeycomb sandwich structure, poor heat dissipation due to increased thermal resistance due to adhesives, complex processing, and high costs, the present invention proposes a heat pipe lattice satellite temperature control plate structure and its design and manufacturing method. By forming the internal trusses of the cubic lattice sandwich panel into a hollow tubular structure, applying negative pressure and filling it with a phase change medium (such as water or ammonia), a heat pipe lattice structure with superior heat exchange capacity is formed. The heat pipe lattice sandwich panel is then formed into a satellite cabin panel. The liquid phase change medium evaporates on the sunlit side to absorb heat, while the gaseous phase change medium condenses on the shady side to release heat, thereby maintaining a constant temperature throughout the satellite. This avoids a series of problems caused by methods such as attaching heat pipes to the outside of the cabin or pre-embedded heat pipes in the honeycomb panels, and realizes the integrated structural and functional design of load-bearing and thermal control.

[0006] (2) Technical solution

[0007] In order to solve the above technical problems and achieve the purpose of the invention, the technical solution adopted by the present invention is:

[0008] A heat pipe lattice satellite heat evaporating plate structure, wherein the satellite heat evaporating plate comprises at least a front skin and a rear skin arranged opposite to each other and spaced apart, characterized in that:

[0009] A heat pipe three-dimensional lattice topology structure that is in a cubic shape and formed integrally by additive manufacturing is provided in the space between the front skin and the rear skin. The area outside the three-dimensional heat pipe lattice topology structure is a blank area.

[0010] The three-dimensional heat pipe lattice topological structure is composed of tubular structural members arranged in a regular array in three mutually perpendicular directions, wherein the three mutually perpendicular directions correspond to the thickness, length and width directions of the satellite temperature evaporating plate in space, respectively. The first direction corresponds to the thickness direction of the satellite temperature evaporating plate, the second direction corresponds to the length direction of the satellite temperature evaporating plate, and the third direction corresponds to the width direction of the satellite temperature evaporating plate.

[0011] The two surface areas of the three-dimensional heat pipe lattice topological structure in the first direction respectively form its upper surface area and lower surface area, the tube walls of each tubular structural member located in the upper surface area are fixedly connected to the front skin, and the tube walls of each tubular structural member located in the lower surface area are fixedly connected to the rear skin, so that the satellite homogenizing plate is formed as a lattice sandwich plate structure supported by the three-dimensional heat pipe lattice topological structure;

[0012] In the three-dimensional heat pipe lattice topology structure, each tubular structural member extending along the second direction or the third direction is a continuous long tube member, and the remaining tubular structural members are discontinuous short tube members, wherein,

[0013] The long tubes are arranged in parallel with each other in space, and each of the long tubes extends at least along its length from one surface of the three-dimensional heat pipe lattice topological structure to another surface opposite thereto. The inner wall of each long tube is provided with a capillary wick microstructure, both ends are provided with closed plugs, and the interior is filled with a working medium, so that each of the long tubes forms a heat pipe structural member;

[0014] The short tubes are arranged in an array between the long tubes, and the direction of the array arrangement includes two directions that are spatially perpendicular to the length direction of the long tubes. Each of the short tubes is a hollow tubular structure with openings at both ends, and is spatially distributed between two adjacent long tubes, and its two ends are vertically connected to the adjacent long tubes in a structurally intersecting manner.

[0015] In a preferred example of the present invention, the blank area is filled with lightweight and highly thermally conductive materials to reduce the heat exchange between the inside and outside of the satellite, blocking the heat from entering the interior of the satellite when the solar radiation heat is large, and providing thermal insulation for the satellite when the external temperature is low.

[0016] In a further embodiment of the present invention, the lightweight and highly thermally conductive material is fireproof cotton.

[0017] In a preferred example of the present invention, in the three-dimensional heat pipe lattice topological structure, the long tubes are stacked in a layered manner in the first direction of the three-dimensional heat pipe lattice topological structure, the number of stacked heat pipe layers is at least two or more, and the tube wall of the first layer of heat pipes located in the upper surface area of ​​the first direction is close to the front skin, and the tube wall of the last layer of heat pipes located in the lower surface area of ​​the first direction is close to the rear skin, and the middle layers of heat pipes are connected to other layers through hollow short tubes perpendicular to the heat pipes to increase the overall strength of the structure.

[0018] In a preferred embodiment of the present invention, the heat pipe lattice satellite temperature equalizing plate is processed as a whole by an additive manufacturing method, and the front skin, rear skin and three-dimensional heat pipe lattice topological structure are integrally formed by an additive manufacturing method.

[0019] In a preferred embodiment of the present invention, the capillary wick microstructure of the heat pipe structural member is a rectangular channel, an Ω-shaped channel, a trapezoidal channel, a triangular channel or a capillary pore structure.

[0020] In a preferred embodiment of the present invention, the external dimensions of the satellite temperature averaging plate are determined according to the size requirements of the satellite, and the material of the satellite temperature averaging plate and the working medium filled in the heat pipe structure are selected according to the working environment temperature of the satellite.

[0021] In a preferred embodiment of the present invention, in the three-dimensional heat pipe lattice topology structure, the number, cross-sectional dimensions, liquid filling volume, pipe diameter, pipe wall thickness and / or pipe spacing parameters of the heat pipe structural members are determined by comprehensive calculation based on the weight, strength and heat exchange performance requirements of the satellite cabin panel.

[0022] In a preferred embodiment of the present invention, in the three-dimensional heat pipe lattice topology structure, the inner wall of each of the long pipes needs to be polished and cleaned before being sealed to remove various impurities including residual powder.

[0023] In a preferred embodiment of the present invention, in the three-dimensional heat pipe lattice topology structure, each of the short tubes is provided with at least one through hole on the tube wall for removing residual powder in the tube. The position and size of each through hole need to be designed according to the specific situation to prevent adverse effects on the heat pipe lattice topology structure.

[0024] In a further embodiment of the present invention, the outer surface of each tubular structural member is sandblasted or manually polished to remove adhered powder, and the inner wall surface is polished by abrasive flow or electrochemical polishing to remove adhered powder.

[0025] The second object of the present invention is to provide a design method for the heat pipe array satellite temperature averaging plate structure, characterized in that the design method comprises at least the following steps:

[0026] SS1. Determine the shape and structural dimensions of the satellite heat sink according to the satellite size requirements;

[0027] SS2. Select the material of the heat spreader and the working medium of the heat pipe based on the satellite's operating environment temperature;

[0028] SS3. Design the cubic lattice truss into a hollow tubular structure to form a lattice heat pipe sandwich panel.

[0029] SS4. Comprehensively calculate the number, cross-sectional dimensions, liquid volume, diameter, wall thickness, and / or spacing of heat pipes based on the satellite cabin panel's weight, strength, and heat transfer performance requirements.

[0030] SS5. Design capillary wick microstructures based on the ultimate forming capabilities of additive manufacturing.

[0031] SS6. Design through holes on each hollow short tube to remove residual powder inside the tube;

[0032] SS7. Perform strength and heat transfer performance verification analysis on the satellite heat sink. If it does not meet the requirements, repeat steps SS4 to SS6. If it does meet the requirements, the design process ends.

[0033] The third object of the present invention is to provide a method for manufacturing the heat pipe array satellite temperature averaging plate structure, characterized in that the manufacturing method comprises at least the following steps:

[0034] SS1. Adjust the model's posture to minimize added support, then set the support structure, slice the model, set the process path and parameters, and perform selective laser melting (SLM).

[0035] SS2. Heat treat the associated substrate to remove thermal stress. Use wire cutting to separate the heat pipe array satellite vapor chamber from the substrate and remove the support.

[0036] SS3. Remove adherent powder from the outer wall by sandblasting or manual polishing, and remove adherent powder from the inner wall by abrasive flow polishing or electrochemical polishing.

[0037] SS4. Clean the heat pipe to remove all impurities;

[0038] SS5. Vacuum, heat, and degas the satellite heat sink, then fill it with working fluid.

[0039] SS6. Weld and seal the heat pipe and test it with a helium mass spectrometer leak detector. The leak rate must be less than the specified value.

[0040] SS7. Conduct load-bearing and heat dissipation performance tests on the satellite heat pipe array heat sink. Test the heat pipe array's static compression, static bending, dynamic compression, and other load-bearing properties, as well as its temperature distribution, thermal response, heat transfer, and critical heat flux density, to see if they meet design requirements. If not, optimize and redesign and manufacture. If they do, the design and manufacturing process is complete.

[0041] (3) Technical effects

[0042] Compared with the existing technology, the heat pipe array satellite temperature averaging plate structure and its design and manufacturing method of the present invention have significant technical advantages, mainly manifested in:

[0043] (1) The present invention adopts a heat pipe matrix structure to avoid the problems of external heat pipes, such as many parts, heavy weight, long process cycle, large thermal resistance between the contact surface of the heat pipe and the mounting plate, and unsatisfactory heat dissipation; and avoids the problems of pre-buried heat pipes destroying the integrity of the honeycomb sandwich structure, weakening the mechanical strength of the honeycomb sandwich structure, adhesives increasing thermal resistance leading to poor heat dissipation capacity, complex processing technology, and high cost.

[0044] (2) The blank area inside the lattice sandwich panel can be filled with materials such as fireproof cotton that are light in weight and have high thermal conductivity to reduce the heat exchange between the inside and outside of the satellite. When the solar radiation heat is large, it can block the heat from entering the satellite. When the external temperature is low, it can also play a role in thermal insulation for the satellite.

[0045] (3) The present invention adopts the additive manufacturing method to form the heat pipe array temperature equalizing plate in one step, thereby reducing the processing steps, lowering the processing cost, simplifying the processing technology, shortening the manufacturing cycle, and realizing the integrated design and manufacturing of the structural function of load-bearing and thermal control.

[0046] (4) The present invention adopts an additive manufacturing method to process heat pipe cores with complex structures, and the formed microscopic surface can improve wettability and improve the performance of the heat pipe.

[0047] (5) The heat pipe lattice satellite heat plate structure of the present invention combines the lightweight and high-strength characteristics of a lattice structure with high heat exchange performance due to the high density of heat pipes. This not only improves the functional integration of the satellite structure, but also reduces the satellite's mass and size, greatly improving the efficiency of the satellite structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 This is a schematic diagram of the structure of the heat pipe lattice satellite temperature equalizing plate of the present invention.

[0049] Figure 2 It is a schematic diagram of the partial structure of the heat pipe lattice satellite temperature equalizing plate of the present invention.

[0050] Figure 3 Schematic diagram of the heat pipe core structure.

[0051] Figure 4 This is a schematic diagram of the design process of the heat pipe array satellite temperature averaging plate of the present invention.

[0052] Figure 5 The figure is a schematic diagram of the manufacturing process of the heat pipe array satellite temperature averaging plate of the present invention.

[0053] Description of reference numerals:

[0054] 1-front skin, 2-rear skin, 3-heat pipe three-dimensional lattice topological structure, 3-1 long tube, 3-2 short tube, 3-3 capillary wick microstructure, 3-4 through hole. DETAILED DESCRIPTION

[0055] In order to better understand the present invention, the content of the present invention will be further illustrated below in conjunction with the embodiments so that the advantages and features of the present invention can be more easily understood by those skilled in the art. It should be noted that the following are only preferred embodiments of the present invention, but the content of the present invention is not limited to the following embodiments. In fact, various modifications and variations can be made in the present invention without departing from the scope or spirit of the present invention, which will be apparent to those skilled in the art. For example, the features shown or described as part of one embodiment can be used together with another embodiment to produce another embodiment. Therefore, it is intended that the present invention include such modifications and variations within the scope of the appended claims and their equivalents.

[0056] The present invention addresses the problems of the existing satellite temperature-averaging plate external heat pipe installation method, such as many parts, heavy weight, long process cycle, and defects and shortcomings such as thermal resistance at the contact surface between the heat pipe and the installation plate, and unsatisfactory heat dissipation. In addition, the pre-buried heat pipe method will destroy the integrity of the honeycomb sandwich structure, weaken the mechanical strength of the honeycomb sandwich structure, and the adhesive connecting the honeycomb and the heat pipe will also increase the thermal resistance, resulting in poor heat dissipation capacity, and there are complex processing techniques and high costs. The present invention proposes a heat pipe lattice satellite temperature-averaging plate structure, design and manufacturing method, such as Figures 1 to 5 shown.

[0057] like Figure 1 、 2 As shown, the heat pipe lattice satellite temperature equalizing plate structure of the present invention is composed of a front skin 1, a rear skin 2 and a heat pipe lattice topological structure 3 in the middle. The heat pipe lattice topological structure 3 is a regularly arranged tubular structure, in which some tubes are processed with rectangular grooves or grooves of other shapes (such as Ω-shaped, trapezoidal, triangular, etc.) and capillary pore structure tube cores to form a heat pipe structure. The tube wall of the first layer of heat pipes is close to the skin, and the second layer of heat pipes is connected to other layers through hollow tubes perpendicular to the heat pipes (the structure is not limited to 3 layers and can be multi-layered) to increase the strength. The satellite heat pipe lattice temperature equalizing plate with this complex structure is processed by additive manufacturing.

[0058] More specifically, see Figures 1 to 3In the heat pipe lattice satellite heat spreader structure of the present invention, a heat pipe three-dimensional lattice topological structure 3, which is integrally formed using additive manufacturing and is in the space between the front skin 1 and the rear skin 2, is provided. The area outside the three-dimensional heat pipe lattice topological structure 3 is a blank area. The blank area is preferably filled with a lightweight, high-thermal-conductivity material such as fireproof cotton to reduce heat exchange between the inside and outside of the satellite. When solar radiation heat is high, it can block heat from entering the satellite interior. When the external temperature is low, it can also provide thermal insulation for the satellite. The three-dimensional heat pipe lattice topological structure 3 is composed of tubular structural members arranged in a regular array in three mutually perpendicular directions. The three mutually perpendicular directions correspond to the thickness, length, and width of the satellite heat spreader in space, respectively. The first direction corresponds to the thickness direction of the satellite heat spreader, the second direction corresponds to the length direction of the satellite heat spreader, and the third direction corresponds to the width direction of the satellite heat spreader. The two surface areas of the three-dimensional heat pipe lattice topological structure 3 in the first direction form its upper surface area and lower surface area respectively. The tube walls of each tubular structural member located in the upper surface area are fixedly connected to the front skin, and the tube walls of each tubular structural member located in the lower surface area are fixedly connected to the rear skin, so that the satellite temperature homogenizing plate as a whole is formed into a lattice sandwich plate structure supported by the three-dimensional heat pipe lattice topological structure.

[0059] In the three-dimensional heat pipe lattice topological structure 3, each tubular structural member extending along the second direction or the third direction is a continuous long tube member 1-1, and the remaining tubular structural members are discontinuous short tube members 1-2, wherein the long tube members 1-1 are arranged in a manner parallel to each other in space, and each long tube member 1-1 extends from one surface of the three-dimensional heat pipe lattice topological structure to another surface opposite thereto at least along its length direction, and the inner wall of each long tube member 1-1 is provided with a capillary wick microstructure 3-3, and two ends of the capillary wick microstructure 3-3. A closed plug is provided and the interior is filled with a working medium, so that each long tube 1-1 is formed into a heat pipe structure; the short tubes 1-2 are arranged in an array between the long tubes 1-1, and the direction of the array arrangement includes two directions that are spatially perpendicular to the length direction of the long tubes 1-1. Each short tube 1-2 is a hollow tubular structure with two ends open, and is spatially distributed between two adjacent long tubes 1-1, and its two ends are vertically connected to the adjacent long tube 1-1 in a structurally intersecting manner.

[0060] The working principle of the heat pipe lattice satellite temperature equalizing plate structure of the present invention is as follows: the heat pipe lattice satellite temperature equalizing plate structure is composed of front and rear skins and a heat pipe lattice structure in the middle. The heat pipe lattice structure is a regularly arranged tubular structure. By making the inner truss of the cubic lattice sandwich panel into a hollow tubular structure, the internal negative pressure is pumped out and filled with a phase change medium (water or ammonia and other media), a heat pipe lattice structure with super heat exchange capacity is formed. The heat pipe lattice sandwich panel is then made into a satellite cabin panel, and the liquid phase change medium is used to evaporate and absorb heat on the sun-facing side, and the gaseous phase change medium is condensed and releases heat on the shady side, so that the temperature of each part of the entire satellite can be kept constant. This avoids a series of problems caused by methods such as attaching heat pipes to the outside of the cabin panel or pre-embedded heat pipes in honeycomb panels, and realizes a structural and functional integrated design of load-bearing and thermal control.

[0061] In the three-dimensional heat pipe lattice topological structure of the present invention, the long tube members 1-1 are stacked in a layered manner in the first direction of the three-dimensional heat pipe lattice topological structure. The number of stacked heat pipe layers is at least two or more, and the tube wall of the first layer of heat pipes located in the upper surface area of ​​the first direction is close to the front skin, and the tube wall of the last layer of heat pipes located in the lower surface area of ​​the first direction is close to the rear skin. The middle layers of heat pipes are connected to other layers through hollow short tube members 1-2 perpendicular to the heat pipes to increase the overall strength of the structure.

[0062] The heat pipe lattice satellite heat spreader is processed as a whole using additive manufacturing, and the front skin 1, the rear skin 2 and the three-dimensional heat pipe lattice topological structure 3 are integrally formed using additive manufacturing. The heat pipe lattice satellite heat spreader processed by the present invention using additive manufacturing has many advantages, such as the ability to achieve a high-precision manufacturing process. The additive manufacturing technology can stack objects layer by layer, and can accurately control the shape and structure at a very small size, which enables the heat pipe lattice satellite heat spreader to be precisely manufactured, thereby providing better performance and reliability; complex structural design can be achieved, and various complex three-dimensional structures can be achieved through additive manufacturing technology, and more components or parts can be placed in the same or smaller space. This provides more possibilities for the design of the heat pipe lattice satellite heat spreader; reducing the connection of parts, and completing the manufacture of the front skin, the rear skin and the three-dimensional heat pipe lattice topological structure at one time through additive manufacturing can reduce the connection of parts, thereby improving the stability and reliability of the overall structure.

[0063] like Figure 3As shown, the capillary wick microstructure 3 of the heat pipe structural member is a rectangular groove, an Ω-shaped groove, a trapezoidal groove, a triangular groove or a capillary pore structure. In the present invention, a groove or a capillary pore structure wick is processed inside the long tube member 1-1 to form a heat pipe structure. The capillary wick microstructure of the heat pipe structural member is a key component in the heat pipe structure, and the choice of its form will directly affect the heat transfer performance and reliability of the heat pipe. Among the various forms of capillary wick microstructures selected in the present invention, the capillary wick with a rectangular groove structure has the advantages of a simple structure, low manufacturing cost, and good heat transfer performance. However, the disadvantage is that the capillary absorption capacity of the rectangular groove is relatively weak, and liquid reflux and drying up are prone to occur, affecting the reliability of the heat pipe. The Ω-shaped groove is a more complex capillary wick microstructure. Its advantages are strong capillary absorption capacity and heat transfer performance, which can effectively prevent liquid reflux and drying up, thereby improving the reliability of the heat pipe. However, its manufacturing cost is relatively high, and it is easily contaminated and clogged, requiring regular maintenance and cleaning. The advantage of the trapezoidal groove is that it has strong capillary absorption capacity and heat transfer performance, which can effectively prevent liquid reflux and drying up, thereby improving the reliability of the heat pipe. The disadvantage is that it has a high manufacturing cost and is also easily contaminated and clogged, requiring regular maintenance and cleaning. The triangular groove is a capillary wick microstructure with a simple structure. Its advantages are low manufacturing cost and good heat transfer performance. The disadvantage is that its capillary absorption capacity is relatively weak, and it is prone to liquid reflux and drying up, affecting the reliability of the heat pipe. The advantages of a capillary microporous structure are its strong capillary absorption capacity and heat transfer performance, which can effectively prevent liquid backflow and drying, thereby improving the reliability of the heat pipe. However, its disadvantages are high manufacturing costs and its susceptibility to contamination and clogging, requiring regular maintenance and cleaning. In short, the capillary microstructure needs to be evaluated and selected based on the specific application scenario and requirements, taking into account factors such as the heat transfer efficiency, liquid absorption capacity, manufacturing difficulty, and clogging risk of the heat pipe to achieve the optimal design solution.

[0064] In the three-dimensional heat pipe lattice topology structure of the present invention, the inner wall of each long pipe 1-1 needs to be polished and cleaned before sealing to remove various impurities including residual powder. Since the heat pipe lattice topology structure is manufactured by 3D printing, some powder may remain during the manufacturing process. These residual powders may affect the flow of the working medium and the heat transfer efficiency inside the heat pipe, thereby reducing the heat transfer performance of the entire heat pipe lattice. The residual powder is removed by polishing and cleaning, thereby ensuring the flow of the working medium and the heat transfer efficiency inside the heat pipe, and improving the heat transfer performance of the entire heat pipe lattice. At the same time, this can also avoid blockages and the like inside the heat pipe, thereby ensuring the stability and reliability of the heat pipe lattice.

[0065] In the three-dimensional heat pipe lattice topology structure of the present invention, each short tube 1-2 is provided with at least one through hole 1-4 on the tube wall for removing residual powder in the tube. The position and size of each through hole need to be designed according to the specific situation to prevent adverse effects on the heat pipe lattice topology structure.

[0066] In the three-dimensional heat pipe lattice topology of the present invention, the short pipe 1-2 mainly plays the role of support and connection, and does not directly participate in the heat transfer of the heat pipe. Under normal circumstances, some powder or other impurities will remain on the surface of the parts manufactured by the additive manufacturing method. These impurities may enter the interior of the short pipe 1-2 and affect its connection performance and stability. In addition, during use, the heat pipe lattice topology may be affected by external forces such as vibration and friction, which may also cause powder accumulation inside the short pipe 1-2. Therefore, at least one through hole for removing residual powder in the tube is provided on the tube wall of each short pipe 1-2 in order to ensure that the interior of the short pipe 1-2 is clean and not easy to accumulate powder, thereby enhancing its connection performance and stability. By removing the through hole for the residual powder in the tube, the residue in the tube is discharged, thereby keeping the short pipe 1-2 clean and in good condition, and improving the overall performance and stability of the heat pipe lattice topology.

[0067] like Figure 4 As shown, the design steps of the heat pipe array satellite temperature averaging plate of the present invention are as follows:

[0068] 1. Determine the dimensions of the satellite temperature distribution plate according to the satellite size requirements;

[0069] 2. Select appropriate vapor chamber material and working medium according to the satellite operating environment temperature;

[0070] 3. The cubic lattice structure truss is designed into a hollow tubular structure to form a lattice heat pipe sandwich panel;

[0071] 4. According to the weight, strength and heat transfer performance requirements of the satellite cabin, comprehensively calculate the number of heat pipes, cross-sectional dimensions, liquid filling volume, pipe diameter (pipe diameter ranges from 3 to 10 mm), pipe wall thickness (pipe wall thickness ranges from 0.2 to 1 mm), pipe spacing and other parameters;

[0072] 5. According to the ultimate forming capability of additive manufacturing, the capillary wick microstructure is designed. The wick can be designed as a rectangular groove or other shaped grooves (Ω-shaped, trapezoidal, triangular, etc.) and a capillary microporous structure, such as Figure 3 As shown;

[0073] 6. Through holes are designed on the hollow tube to remove residual powder inside the tube;

[0074] 7. Perform strength and heat transfer performance verification analysis on the satellite heat pipe array temperature plate. If it does not meet the requirements, repeat steps 4 to 6; if it meets the requirements, the design process ends.

[0075] like Figure 5 As shown, the manufacturing steps of the heat pipe array satellite temperature averaging plate of the present invention are as follows:

[0076] 1. Adjust the model's posture based on the principle of adding minimal process support, then set the support structure, layer slicing, set the process path and parameters, and perform laser selective melting additive manufacturing;

[0077] 2. Perform heat treatment on the substrate to remove thermal stress, and use wire cutting to separate the heat pipe array satellite temperature averaging plate from the substrate to remove the support;

[0078] 3. The surface is sandblasted or polished manually to remove the adhered powder; the inner wall surface is polished by abrasive flow or electrochemical polishing to remove the adhered powder;

[0079] 4. Clean the heat pipe and remove all impurities;

[0080] 5. Vacuum, heat and degas the heat pipe array satellite temperature averaging plate and fill it with working fluid;

[0081] 6. Weld and seal the heat pipe and use a helium mass spectrometer to detect the leak rate. The leak rate must be less than the specified value.

[0082] 7. Conduct load-bearing and heat dissipation performance tests on the heat pipe array satellite vapor chamber. Test the heat pipe array satellite's load-bearing performance (e.g., static compression, static bending, dynamic compression), thermal performance (e.g., uniform temperature performance), thermal response characteristics, heat transfer performance, and critical heat flux density) to see if they meet design requirements. If not, optimize and redesign and manufacture. If they meet requirements, the design and manufacturing process is complete.

[0083] The above embodiments fully and effectively achieve the purpose of the present invention. Any equivalent or simple changes made based on the structure, features, and principles described in the patent concept of the present invention are included in the scope of protection of the patent of the present invention. Those skilled in the art of the present invention can make various modifications or supplements to the specific embodiments described, or replace them with similar methods. As long as they do not deviate from the structure of the present invention or exceed the scope defined by the claims, they should fall within the scope of protection of the present invention.

Claims

1. A heat pipe array satellite heat evaporating plate structure, wherein the satellite heat evaporating plate comprises at least a front skin and a rear skin arranged opposite to each other and spaced apart, characterized in that: A three-dimensional heat pipe lattice topology structure is provided in the space between the front and rear skins and is formed in a cubic shape and in one piece by additive manufacturing. The area outside the three-dimensional heat pipe lattice topology structure is a blank area. The three-dimensional heat pipe lattice topological structure is composed of tubular structural members arranged in a regular array in three mutually perpendicular directions, wherein the three mutually perpendicular directions correspond to the thickness, length and width directions of the satellite temperature evaporating plate in space, respectively. The first direction corresponds to the thickness direction of the satellite temperature evaporating plate, the second direction corresponds to the length direction of the satellite temperature evaporating plate, and the third direction corresponds to the width direction of the satellite temperature evaporating plate. The two surface areas of the three-dimensional heat pipe lattice topological structure in the first direction respectively form its upper surface area and lower surface area, the tube walls of each tubular structural member located in the upper surface area are fixedly connected to the front skin, and the tube walls of each tubular structural member located in the lower surface area are fixedly connected to the rear skin, so that the satellite homogenizing plate is formed as a lattice sandwich plate structure supported by the three-dimensional heat pipe lattice topological structure; In the three-dimensional heat pipe lattice topology structure, each tubular structural member extending along the second direction or the third direction is a continuous long tube member, and the remaining tubular structural members are discontinuous short tube members, wherein, The long tubes are arranged in parallel with each other in space, and each of the long tubes extends at least along its length from one surface of the three-dimensional heat pipe lattice topological structure to another surface opposite thereto. The inner wall of each long tube is provided with a capillary wick microstructure, both ends are provided with closed plugs, and the interior is filled with a working medium, so that each of the long tubes forms a heat pipe structural member; The short tubes are arranged in an array between the long tubes, and the direction of the array arrangement includes two directions that are spatially perpendicular to the length direction of the long tubes. Each of the short tubes is a hollow tubular structure with openings at both ends, and is spatially distributed between two adjacent long tubes, and its two ends are vertically connected to the adjacent long tubes in a structurally intersecting manner.

2. The heat pipe array satellite temperature plate structure according to claim 1, characterized in that: The blank area is filled with lightweight and highly thermally conductive materials to reduce heat exchange between the inside and outside of the satellite. When the solar radiation heat is large, it blocks the heat from entering the satellite, and when the external temperature is low, it insulates the satellite.

3. The heat pipe array satellite temperature plate structure according to claim 2, characterized in that: The lightweight and highly thermally conductive material is fireproof cotton.

4. The heat pipe array satellite temperature equalizing plate structure according to claim 1, characterized in that: In the three-dimensional heat pipe lattice topological structure, the long tubes are stacked in a layered manner in the first direction of the three-dimensional heat pipe lattice topological structure, the number of stacked heat pipe layers is at least two or more, and the tube wall of the first layer of heat pipes located in the upper surface area of ​​the first direction is close to the front skin, and the tube wall of the last layer of heat pipes located in the lower surface area of ​​the first direction is close to the rear skin, and the middle layers of heat pipes are connected to other layers through hollow short tubes perpendicular to the heat pipes to increase the overall strength of the structure.

5. The heat pipe array satellite temperature equalizing plate structure according to claim 1, characterized in that: The heat pipe lattice satellite temperature equalizing plate is processed as a whole by an additive manufacturing method, and the front skin, rear skin and three-dimensional heat pipe lattice topological structure are integrally formed by an additive manufacturing method.

6. The heat pipe array satellite temperature equalizing plate structure according to claim 1, characterized in that: The capillary wick microstructure of the heat pipe structural component is a rectangular channel, an Ω-shaped channel, a trapezoidal channel, a triangular channel or a capillary pore structure.

7. The heat pipe array satellite temperature equalizing plate structure according to claim 1, characterized in that: The external dimensions of the satellite temperature averaging plate are determined according to the size requirements of the satellite, and the material of the satellite temperature averaging plate and the working medium filled in the heat pipe structure are selected according to the working environment temperature of the satellite.

8. The heat pipe array satellite temperature equalizing plate structure according to claim 1, characterized in that: In the three-dimensional heat pipe lattice topology, the number, cross-sectional dimensions, liquid filling volume, pipe diameter, pipe wall thickness and / or pipe spacing parameters of the heat pipe structural members are determined by comprehensive calculation based on the weight, strength and heat exchange performance requirements of the satellite cabin panel.

9. The heat pipe array satellite temperature equalizing plate structure according to claim 1, characterized in that: In the three-dimensional heat pipe lattice topology structure, the inner wall of each long pipe needs to be polished and cleaned before being sealed to remove various impurities including residual powder.

10. The heat pipe array satellite temperature equalizing plate structure according to claim 9, characterized in that: In the three-dimensional heat pipe lattice topology structure, each short tube is provided with at least one through hole on the tube wall for removing residual powder in the tube. The location and size of each through hole need to be designed according to the specific situation to prevent adverse effects on the heat pipe lattice topology structure.

11. The heat pipe array satellite temperature equalizing plate structure according to claim 10, characterized in that: The outer surface of each tubular structural member is sandblasted or manually polished to remove adhered powder, and the inner wall surface is polished by abrasive flow or electrochemical polishing to remove adhered powder.

12. A design method for a heat pipe array satellite temperature averaging plate structure according to any one of claims 1 to 11, characterized in that: The design method comprises at least the following steps: SS1. Determine the shape and structural dimensions of the satellite heat sink according to the satellite size requirements; SS2. Select the material of the heat spreader and the working medium of the heat pipe based on the satellite's operating environment temperature; SS3. Design the cubic lattice truss into a hollow tubular structure to form a lattice heat pipe sandwich panel. SS4. Comprehensively calculate the number, cross-sectional dimensions, liquid volume, diameter, wall thickness, and / or spacing of heat pipes based on the satellite cabin panel's weight, strength, and heat transfer performance requirements. SS5. Design capillary wick microstructures based on the ultimate forming capabilities of additive manufacturing. SS6. Design through holes on each hollow short tube to remove residual powder inside the tube; SS7. Perform strength and heat transfer performance verification analysis on the satellite heat sink. If it does not meet the requirements, repeat steps SS4 to SS6. If it does meet the requirements, the design process ends.

13. A method for manufacturing a heat pipe array satellite temperature averaging plate structure according to any one of claims 1 to 11, characterized in that: The manufacturing method comprises at least the following steps: SS1. Adjust the model's posture to minimize added support, then set the support structure, slice the model, set the process path and parameters, and perform selective laser melting (SLM). SS2. Heat treat the associated substrate to remove thermal stress. Use wire cutting to separate the heat pipe array satellite vapor chamber from the substrate and remove the support. SS3. Remove adherent powder from the outer wall by sandblasting or manual polishing, and remove adherent powder from the inner wall by abrasive flow polishing or electrochemical polishing. SS4. Clean the heat pipe to remove all impurities; SS5. Vacuum, heat, and degas the satellite heat sink, then fill it with working fluid. SS6. Weld and seal the heat pipe and test it with a helium mass spectrometer leak detector. The leak rate must be less than the specified value. SS7. Conduct load-bearing and heat dissipation performance tests on satellite heat pipe array heat sinks. Test the heat pipe array's static compression, static bending, dynamic compression, and other load-bearing properties, as well as its temperature distribution, thermal response, heat transfer, and critical heat flux density, to ensure they meet design requirements. If not, optimize and redesign the design. If the requirements are met, the design and manufacturing process is completed.

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