Material transport mechanism for optical device testing

By designing a material transport mechanism for optical device testing, we can achieve large-scale dynamic adjustment of chip angles in both forward and reverse directions. Combined with vacuum adsorption technology, we can solve the problems of loose pickup and position offset of optical device chips in the existing technology, improve the chip adsorption success rate and the accuracy of angle adjustment, and ensure stability during long-term use.

CN116374616BActive Publication Date: 2025-09-30STELIGHT INSTR CO LTD
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Patent Information

Application Number
CN202310190606.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-11-04
Publication Date
2025-09-30
Estimated Expiration
2041-11-04

AI Technical Summary

Technical Problem

In the existing technology, optical device chips can only be corrected in a small range when picked up, which easily leads to loose adsorption, chip loss and secondary position deviation, making it difficult to meet the high requirements of the optical communication industry for positioning accuracy and contact pressure.

Method used

A material transport mechanism for optical device testing was designed. It uses components such as a base, a motor, a horizontal slide, an adapter plate, a nozzle rod, and a fixed seat. Through the cooperation of left and right springs and an arc-shaped rack, a large range of positive and negative bidirectional dynamic adjustment of the chip angle can be achieved. Combined with vacuum adsorption technology, the contact pressure and precision between the nozzle rod and the chip are improved.

Benefits of technology

It improves the one-time adsorption success rate of optical device chips, avoids chip loss and secondary position deviation, enhances the accuracy and precision of angle adjustment, reduces friction, and ensures stability during long-term high-frequency use.

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Abstract

The present invention discloses a material transport mechanism for optical device testing, wherein a clamping bar and an arc-shaped rack are provided above a fixed seat, the front end of the clamping bar is clamped and connected to the upper end of a nozzle rod, the rear end of the clamping bar is connected to the arc-shaped rack via a connecting rod, the arc-shaped rack is meshed and connected to the gear on the output shaft of a first motor, and the center of the arc-shaped rack overlaps with the axis of the nozzle rod; a left spring has two ends connected to the clamping bar and the left side of the upper portion of the fixed seat, respectively, and a right spring has two ends connected to the right side of the lower portion of the fixed seat, respectively, one end of the left spring connected to the clamping bar is higher than the other end, one end of the left spring is close to the arc-shaped rack and is located below the arc-shaped rack, and the other end is connected to the end of the clamping bar away from the arc-shaped rack. The present invention can effectively avoid chip loss and secondary position deviation caused by chip adsorption failure, greatly improving the one-time adsorption success rate of optical device chips.
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Description

Technical Field

[0001] The invention relates to a material transport mechanism for optical device testing, belonging to the technical field of optical device testing. Background Art

[0002] Optical devices are provided in the form of optical IC chips, and examples of optical IC chips include optical receiving units that receive optical signals and optical transmitting units that transmit optical signals. Optical IC chips are provided with optical waveguides, optical circuits, optical chip components, and the like. Optical chip components, such as semiconductor optical amplifiers (SOAs), are also provided.

[0003] Optical devices are optoelectronic devices in optical communication systems that can convert electrical signals into optical signals or vice versa. They are the heart of optical transmission systems. After the optical devices are packaged and manufactured, they need to undergo a power-on test to test whether the various optoelectronic indicators of the optical devices meet the requirements. Only qualified optical devices can enter the next process. As the component that directly contacts the chip during the test, the nozzle that picks up the chip plays an important role. In the test process of the optical communication industry, due to the process requirements, there are high requirements for the position accuracy of the chip and the contact pressure between the nozzle and the chip. In the existing technology, when picking up the chip, only a small range of chip angle correction can be performed, and it is easy for the pick-up to be loose. Summary of the Invention

[0004] The purpose of the present invention is to provide a material transport mechanism for optical device testing, which can effectively avoid chip loss and secondary position deviation caused by chip adsorption failure while realizing large-scale and bidirectional dynamic adjustment of the chip angle, thereby greatly improving the one-time adsorption success rate of the optical device chip.

[0005] To achieve the above-mentioned object, the technical solution adopted by the present invention is as follows: a material transport mechanism for optical device testing, comprising: a base, a first motor vertically mounted on the base, a horizontal slide, an adapter plate, a nozzle rod and a fixed base, wherein the horizontal slide is located between the upper end plate of the base and the lower end plate of the adapter plate, the fixed base is mounted on the base and located below the first motor, the adapter plate comprises a vertical plate and a lower end plate perpendicular to each other, the horizontal slide and the first motor are respectively located on both sides of the vertical plate;

[0006] The left and right sides of the front end surface of the fixed seat respectively have a left bevel area and a right bevel area, at least two pairs of bearings are installed on the front end surface of the fixed seat, the left bearing in each pair of bearings is arranged on the left bevel area of ​​the fixed seat at intervals along the vertical direction, and the right bearing in each pair of bearings is arranged on the right bevel area of ​​the fixed seat at intervals along the vertical direction, so that a V-shaped channel is formed between the left bearing and the right bearing in each pair of bearings, and the nozzle rod is located in the V-shaped channel of at least two pairs of bearings;

[0007] A clamping bar and an arc-shaped rack are provided above the fixing seat. The front end of the clamping bar is clamped and connected to the upper end of the nozzle rod, and the rear end of the clamping bar is connected to the arc-shaped rack through a connecting rod. The arc-shaped rack is meshed with the gear on the output shaft of the first motor, and the center of the arc-shaped rack overlaps with the axis of the nozzle rod.

[0008] The two ends of a left spring are respectively connected to the left sides of the clamping bar and the upper part of the fixing seat, and the two ends of a right spring are respectively connected to the right sides of the clamping bar and the lower part of the fixing seat. The lower end of the right spring is connected to the fixing seat through a right hanging piece, and the other end of the left spring is connected to the fixing seat through a left hanging piece. The end of the left spring connected to the clamping bar is higher than the other end. One end of the left spring is close to the arc-shaped rack and is located below the arc-shaped rack, and the other end is connected to the end of the clamping bar away from the arc-shaped rack. This left spring is arranged at an angle to the horizontal direction, and the right spring is arranged vertically. The tension of the left spring is greater than the tension of the right spring.

[0009] The further improved scheme in the above technical scheme is as follows:

[0010] 1. In the above solution, the front end of the clamping bar has a clamping bolt, and one end of each of the left spring and the right spring is connected to the left end and the right end of the clamping bolt respectively.

[0011] 2. In the above solution, the connecting rod is connected to the middle of the arc-shaped rack.

[0012] 3. In the above solution, the right hanging plate has a vertical strip hole, and the right hanging plate is connected to the fixing base by a bolt embedded in the vertical strip hole.

[0013] 4. In the above solution, the left hanging plate has a plurality of through holes, and the other end of the left spring is connected to one of the through holes.

[0014] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0015] 1. The material transport mechanism for optical device testing of the present invention not only realizes large-scale and bidirectional dynamic adjustment of the chip angle and expands the application scenarios, but also improves the accuracy of angle calculation and adjustment and the stability of maintaining accuracy after long-term high-frequency use. It can also gradually increase the contact pressure between the suction nozzle rod and the optical device chip, effectively avoiding chip loss and secondary position deviation caused by chip adsorption failure, greatly improving the one-time adsorption success rate of the optical device chip and further improving the accuracy of angle adjustment, and also avoiding damage to the optical device chip.

[0016] 2. The material transport mechanism for testing optical devices of the present invention has a lower surface of the clamping bar with a raised portion in contact with the upper surface of the fixed seat, which can not only ensure the stability of the surface contact between the clamping bar and the fixed seat under the action of the left and right springs, but also reduce the friction between the clamping bar and the fixed seat during long-term high-frequency use, and further ensure the accuracy of the rotation of the nozzle rod driven by the clamping bar and the arc-shaped rack. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Attachment Figure 1 A schematic structural diagram of a material transport mechanism for optical device testing according to the present invention;

[0018] Attachment Figure 2 for Figure 1 A magnified view of the structure at point A;

[0019] Attachment Figure 3 This is an enlarged view of the local structure of the loading and unloading module for chip testing of the present invention from another perspective;

[0020] Attachment Figure 4 This is an enlarged view of the local structure of the loading and unloading module for chip testing of the present invention when the nozzle rod is not installed.

[0021] In the above drawings: 1. Base; 101. Upper end plate; 2. First motor; 3. Horizontal slide; 4. Adapter plate; 401. Lower end plate; 402. Vertical plate; 5. Clamping bolt; 6. Nozzle rod; 7. Raised portion; 9. Fixed seat; 901. Left inclined area; 902. Right inclined area; 903. Seat body; 904. Fixed block; 10. V-shaped channel; 11. Left bearing; 12. Right bearing; 13. Clamping strip; 14. Arc rack; 15. Connecting rod; 16. Gear; 17. Left spring; 171. Left hanging plate; 172. Through hole; 18. Right spring; 181. Right hanging plate; 182. Vertical strip hole. Implementation Method

[0022] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0023] Example 1: A material transport mechanism for optical device testing, comprising: a base 1, a first motor 2 vertically mounted on the base 1, a nozzle rod 6, and a fixing base 9, wherein the fixing base 9 is mounted on the base 1 and located below the first motor 2;

[0024] The left and right sides of the front end surface of the fixing seat 9 respectively have a left bevel area 901 and a right bevel area 902, at least two pairs of bearings are mounted on the front end surface of the fixing seat 9, the left bearing 11 in each pair of bearings is arranged on the left bevel area 901 of the fixing seat 9 at intervals along the vertical direction, and the right bearing 12 in each pair of bearings is arranged on the right bevel area 902 of the fixing seat 9 at intervals along the vertical direction, so that a V-shaped channel 10 is formed between the left bearing 11 and the right bearing 12 in each pair of bearings, and the nozzle rod 6 is located in the V-shaped channel 10 of at least two pairs of bearings;

[0025] A clamping bar 13 and an arc-shaped rack 14 are provided above the fixing seat 9. The front end of the clamping bar 13 is clamped and connected to the upper end of the nozzle rod 6. The rear end of the clamping bar 13 is connected to the arc-shaped rack 14 through a connecting rod 15. The arc-shaped rack 14 is meshed with the gear 16 on the output shaft of the first motor 2, and the center of the arc-shaped rack 14 overlaps with the axis of the nozzle rod 6.

[0026] The two ends of a left spring 17 are respectively connected to the left sides of the clamping bar 13 and the upper part of the fixing seat 9, and the two ends of a right spring 18 are respectively connected to the right sides of the clamping bar 13 and the lower part of the fixing seat 9. The end of the left spring 17 connected to the clamping bar 13 is higher than the other end. One end of the left spring 17 is close to the arcuate rack 14 and is located below the arcuate rack 14, and the other end is connected to the end of the clamping bar 13 away from the arcuate rack 14. This left spring 17 is arranged at an angle to the horizontal direction, and the right spring 18 is arranged vertically. The tension of the left spring 17 is greater than the tension of the right spring 18.

[0027] The front end of the clamping strip 13 is provided with a clamping bolt 5, and one end of each of the left spring 17 and the right spring 18 is connected to the left and right ends of the clamping bolt 5 respectively;

[0028] The lower surface of the clamping bar 14 has a protrusion 7 that contacts the upper surface of the fixing seat 9; the connecting rod 15 is connected to the middle of the arc-shaped rack 14;

[0029] The fixing seat 9 further includes a seat body 903 and a fixing block 904 . The seat body 903 is connected to the base 1 , and the fixing block 904 is mounted on the seat body 903 . The fixing block 904 and the seat body 903 are connected by bolts.

[0030] Example 2: An automatic pick-and-place mechanism for testing communication devices, comprising: a base 1, a first motor 2 vertically mounted on the base 1, a horizontal slide 3, an adapter plate 4, a nozzle rod 6, and a fixing base 9, wherein the horizontal slide 3 is located between the upper end plate 101 of the base 1 and the lower end plate 401 of the adapter plate 4, and the fixing base 9 is mounted on the base 1 and located below the first motor 2;

[0031] A clamping bar 13 and an arc-shaped rack 14 are provided above the fixing seat 9. The front end of the clamping bar 13 is clamped and connected to the upper end of the nozzle rod 6. The rear end of the clamping bar 13 is connected to the arc-shaped rack 14 through a connecting rod 15. The arc-shaped rack 14 is meshed with the gear 16 on the output shaft of the first motor 2, and the center of the arc-shaped rack 14 overlaps with the axis of the nozzle rod 6.

[0032] The two ends of a left spring 17 are respectively connected to the left sides of the clamping bar 13 and the upper part of the fixing seat 9, and the two ends of a right spring 18 are respectively connected to the right sides of the clamping bar 13 and the lower part of the fixing seat 9. The end of the left spring 17 connected to the clamping bar 13 is higher than the other end. One end of the left spring 17 is close to the arcuate rack 14 and is located below the arcuate rack 14, and the other end is connected to the end of the clamping bar 13 away from the arcuate rack 14. This left spring 17 is arranged at an angle to the horizontal direction, and the right spring 18 is arranged vertically. The tension of the left spring 17 is greater than the tension of the right spring 18.

[0033] The lower end of the right spring 18 is connected to the fixing base 9 via a right hanging piece 181. The right hanging piece 181 has a vertical strip hole 182. The right hanging piece 181 is connected to the fixing base 9 via a bolt embedded in the vertical strip hole 182.

[0034] The other end of the left spring 17 is connected to the fixing base 9 via a left hanging piece 171. The left hanging piece 171 has a plurality of through holes 172. The other end of the left spring 17 is connected to one of the through holes 172.

[0035] The adapter plate 4 further includes a vertical plate 402 and a lower end plate 401 that are perpendicular to each other. The horizontal slide 3 and the first motor 2 are respectively located on both sides of the vertical plate 402 .

[0036] When using the above-mentioned transport mechanism for optical device testing, the nozzle rod picks up the chip through vacuum adsorption. The chip to be picked up generally has a positional deviation of greater or lesser angles. The angle of the chip needs to be adjusted and corrected by rotating the nozzle rod to meet the high precision requirements during optical device chip testing. The overall accuracy can reach ±0.003mm, and the repeatability of a single chip can reach ±0.001mm. Specifically:

[0037] On the basis of realizing the horizontal transportation of chips, the gear located on the output shaft of the first motor rotates forward or reverse to drive the arc-shaped rack to rotate forward or reverse accordingly, expanding the angle adjustment range to ±45°, meeting the angle adjustment requirements in various situations and expanding the application scenarios of placement.

[0038] Furthermore, the arc-shaped rack also causes the connecting rod and the clamping bar to rotate accordingly. Since the center of the arc-shaped rack overlaps with the axis of the nozzle rod, and the nozzle rod is located in the clamping channel of at least two pairs of bearings, the nozzle rod rotates around its own axis under the positioning of the left and right bearings, avoiding lateral pressure on the left and right bearings, thereby preventing positioning deviation after a large number of repeated chip suction operations, and maintaining accuracy stability after long-term high-frequency use;

[0039] Furthermore, the two ends of the left spring are respectively connected to the left sides of the clamping bar and the upper part of the fixing seat, one end of the left spring connected to the clamping bar is higher than the other end, one end of the left spring is close to the arc-shaped rack and is located below the arc-shaped rack, and the other end is connected to the end of the clamping bar away from the arc-shaped rack. The tension of the left spring is partially converted into torsion, ensuring that the gear on the output shaft of the first motor has no gap contact with the teeth of the arc-shaped rack and the gear regardless of whether it is rotating forward or reverse, and eliminating the gap between the teeth. Therefore, the number of pulses given to the first motor can be accurately calculated according to the angle to be adjusted, so that the actual rotation angle of the gear and the nozzle rod is consistent with the rotation angle expected by the pulse, thereby improving the accuracy of angle calculation and adjustment;

[0040] Furthermore, the two ends of the right spring are respectively connected to the clamping bar and the lower part of the fixing seat and are located on the right side of the left spring. The left spring is arranged at an angle to the horizontal direction, and the right spring is arranged vertically. The tension of the left spring is greater than the tension of the right spring. Part of the tension of the left spring is converted into downward pressure on the clamping bar and acts together with the right spring to reduce the lateral pressure on the left and right bearings. At the same time, in the process of the nozzle rod approaching the chip, the pressure of contact with the chip is gradually increased, so that the suction nozzle of the nozzle rod can have good contact with the chip surface, which is conducive to improving the one-time adsorption success rate. Moreover, since the chip is adsorbed by negative pressure formed in the nozzle rod, the airflow around the chip will quickly flow to the suction nozzle of the nozzle rod. The pressure applied by this application avoids the secondary offset of the position and angle of the chip under the action of the airflow, resulting in the difference between the previously calculated angle and the actual angle, affecting the rotation accuracy and then affecting the mounting accuracy, and also avoids damage to the optical device chip;

[0041] In summary, while achieving a wide range of dynamic angle adjustment of the chip in both forward and reverse directions and expanding the application scenarios, it also improves the accuracy of angle calculation and adjustment, and maintains the stability of accuracy after long-term high-frequency use. It can also gradually increase the contact pressure between the nozzle rod and the optical device chip, effectively avoiding chip loss and secondary position deviation caused by chip adsorption failure, greatly improving the one-time adsorption success rate of the optical device chip and further improving the accuracy of angle adjustment, and also avoiding damage to the optical device chip.

[0042] Furthermore, the lower surface of the clamping bar has a raised portion in contact with the upper surface of the fixed seat, which can not only ensure the stability of the surface contact between the clamping bar and the fixed seat under the action of the left and right springs, but also reduce the friction between the clamping bar and the fixed seat during long-term high-frequency use, and further ensure the accuracy of the rotation of the suction nozzle rod driven by the clamping bar and the arc rack.

[0043] The above embodiments are intended only to illustrate the technical concepts and features of the present invention. Their purpose is to enable those skilled in the art to understand the contents of the present invention and implement them accordingly. They are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications made in accordance with the spirit of the present invention are intended to be covered by the scope of protection of the present invention.

Claims

1. A material transport mechanism for optical device testing, characterized by: include: A base (1), a first motor (2) vertically mounted on the base (1), a horizontal slide (3), an adapter plate (4), a nozzle rod (6) and a fixed seat (9), wherein the horizontal slide (3) is located between an upper end plate (101) of the base (1) and a lower end plate (401) of the adapter plate (4), the fixed seat (9) is mounted on the base (1) and located below the first motor (2), the adapter plate (4) includes a vertical plate (402) and a lower end plate (401) perpendicular to each other, and the horizontal slide (3) and the first motor (2) are respectively located on both sides of the vertical plate (402); The left and right sides of the front end surface of the fixed seat (9) respectively have a left bevel area (901) and a right bevel area (902), at least two pairs of bearings are mounted on the front end surface of the fixed seat (9), the left bearing (11) in each pair of bearings is arranged on the left bevel area (901) of the fixed seat (9) at intervals along the vertical direction, and the right bearing (12) in each pair of bearings is arranged on the right bevel area (902) of the fixed seat (9) at intervals along the vertical direction, so that a V-shaped channel (10) is formed between the left bearing (11) and the right bearing (12) in each pair of bearings, and the suction nozzle rod (6) is located in the V-shaped channel (10) of at least two pairs of bearings; A clamping bar (13) and an arc-shaped rack (14) are provided above the fixing seat (9), the front end of the clamping bar (13) is clamped and connected to the upper end of the suction nozzle rod (6), the rear end of the clamping bar (13) is connected to the arc-shaped rack (14) via a connecting rod (15), the arc-shaped rack (14) is meshed and connected to the gear (16) on the output shaft of the first motor (2), and the center of the arc-shaped rack (14) overlaps with the axis of the suction nozzle rod (6); The two ends of a left spring (17) are respectively connected to the left sides of the clamping bar (13) and the upper part of the fixing seat (9), and the two ends of a right spring (18) are respectively connected to the right sides of the lower part of the clamping bar (13) and the fixing seat (9). The lower end of the right spring (18) is connected to the fixing seat (9) through a right hanging piece (181), and the other end of the left spring (17) is connected to the fixing seat (9) through a left hanging piece (171). One end of the left spring (17) connected to the clamping bar (13) is higher than the other end thereof. One end of the left spring (17) is close to the arc-shaped rack (14) and is located below the arc-shaped rack (14), and the other end is connected to the end of the clamping bar (13) away from the arc-shaped rack (14). The left spring (17) is arranged obliquely with respect to the horizontal direction, and the right spring (18) is arranged vertically. The tension of the left spring (17) is greater than the tension of the right spring (18).

2. The material transport mechanism for optical device testing according to claim 1, characterized in that: The front end of the clamping strip (13) is provided with a clamping bolt (5), and one end of each of the left spring (17) and the right spring (18) is connected to the left end and the right end of the clamping bolt (5), respectively.

3. The material transport mechanism for optical device testing according to claim 1, wherein: The connecting rod (15) is connected to the middle of the arc-shaped rack (14).

4. The material transport mechanism for optical device testing according to claim 1, wherein: The right hanging piece (181) has a vertical strip hole (182), and the right hanging piece (181) is connected to the fixing seat (9) via a bolt embedded in the vertical strip hole (182).

5. The material transport mechanism for optical device testing according to claim 1 or 4, characterized in that: The left hanging piece (171) is provided with a plurality of through holes (172), and the other end of the left spring (17) is connected to one of the through holes (172).

Citation Information

Patent Citations

  • Feeding and discharging module for testing optical communication chip

    CN113955490A