Temperature-controlled laser shock peening device with water as a confinement layer and processing method
By using water as a constraint layer in a sealed chamber, a temperature-controlled laser shock strengthening device has been developed, solving the problems of easy cracking of glass constraint layers and processing of non-planar workpieces at high temperatures. This has enabled efficient and low-cost laser shock strengthening and easy cleaning.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- WUHAN UNIV
- Filing Date
- 2023-03-20
- Publication Date
- 2026-05-12
AI Technical Summary
High-strength glass confinement layers are prone to cracking at high temperatures, making them unsuitable for non-planar workpieces. Furthermore, high-temperature water evaporation is not suitable as a confinement layer for laser shock peening, resulting in high experimental costs and difficulties in cleaning the workpieces.
A sealed chamber and a water circulation device are used to provide high-pressure water as a constraint layer. A water constraint layer is formed by a heating platform. Laser shock peening is performed by a moving platform and a laser generation component. The workpiece is processed and cooled in a closed environment.
Stable laser shock peening at high temperatures has been achieved, which is applicable to workpieces of various shapes, reduces experimental costs, and simplifies the workpiece cleaning process.
Smart Images
Figure CN116377203B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of laser shock peening, and more particularly to a temperature-controlled laser shock peening apparatus and processing method using water as a confining layer. Background Technology
[0002] Laser shock peening (LSP) is a novel technology that uses plasma shock waves generated by a powerful laser beam to strengthen metal surfaces. It boasts significant advantages such as non-contact operation, absence of a heat-affected zone, high controllability, and remarkable strengthening effects. The process involves tightly covering the polished and cleaned workpiece surface with a layer of aluminum foil or carbon black as an ablation layer, followed by a constraint layer. A laser pulse is then applied to the workpiece through this constraint layer. The ablation layer instantly absorbs the laser energy, transforming it into plasma and rapidly expanding, generating immense pressure. The shock wave generated by this plasma expansion propagates onto the workpiece, inducing plastic deformation of the material. This process can eliminate surface tension and residual stress on the workpiece, thereby improving its surface strength and fatigue performance. Furthermore, preheating the workpiece before laser shock peening often yields unexpected results, such as the precipitation of reinforcing phases in the metal, creating a pinning effect, and the high temperature softening the metal, making it more susceptible to plastic deformation and further enhancing its strength and fatigue performance.
[0003] However, in practice, high-strength glass is often used as the confinement layer. Due to the effects of high temperatures, the strength and laser transmittance of high-strength glass decrease at high temperatures, often leading to breakage of the confinement glass during impact, which adversely affects the experimental results. Furthermore, the workpiece is difficult to clean after the experiment. Moreover, for workpieces with non-planar surfaces, using high-strength glass as the confinement layer makes laser shock strengthening difficult. While water can avoid these problems as a confinement layer, it evaporates at high temperatures under normal temperature and pressure, making it unsuitable as a confinement layer for high-temperature laser shock strengthening. Therefore, high-temperature laser shock strengthening is often difficult to implement and relatively expensive. Summary of the Invention
[0004] In view of this, this application provides a temperature-controlled laser shock strengthening device and processing method with water as a constraint layer, which can use water as a constraint layer for high-temperature laser shock strengthening, and can not only process workpieces of different shapes, but also facilitate cleaning after processing.
[0005] In a first aspect, this application provides a temperature-controlled laser shock peening device with water as a confining layer, comprising:
[0006] The sealed chamber is equipped with a pressurization device to provide a closed high-pressure environment for the workpiece to be laser-shock processed;
[0007] A water circulation device used to provide circulating water;
[0008] A heating platform for heating at least the workpiece being processed and the circulating water to form a water-constrained layer that can cover the workpiece;
[0009] A mobile platform, wherein a heating platform and a sealed chamber are configured on the mobile platform to at least drive the movement of the heating platform.
[0010] Optionally, the material or construction of the sealed chamber is configured to withstand 0.1 MPa to 600 MPa.
[0011] Optionally, the water circulation device is equipped with a cooling component for cooling the workpiece.
[0012] Optionally, the mobile platform is an XYZ mobile platform, with a travel distance of less than 1000mm in the X direction, less than 1000mm in the Y direction, and less than 1000mm in the Z direction.
[0013] Optionally, the heating platform is connected to a platform controller to control the temperature of the heating platform and test the water temperature of the circulating water. The temperature of the heating platform is controlled to be below 600°C.
[0014] Optionally, the mobile platform is connected to a mobile platform controller for controlling the movement of the mobile platform.
[0015] Optionally, the workpiece is covered with an ablation layer, the material of which is carbon black, graphite, black paint or aluminum foil.
[0016] Optionally, the outer wall of the sealed chamber is provided with a light-transmitting mirror for laser transmission.
[0017] Secondly, this application provides a laser shock strengthening processing method, which uses a temperature-controlled laser shock strengthening device with water as a constraint layer as described above to perform laser shock on the workpiece.
[0018] Optionally, the parameters of the laser shock are: laser wavelength 532-1064nm, pulse width 10fs-100ns, laser frequency 1-20HZ, single pulse laser energy 0.1-10J, and spot diameter 0.01-10mm.
[0019] Compared with the prior art, the above-conceptual technical solution conceived in this application has the following beneficial effects:
[0020] 1. This application places the entire processing in a sealed chamber and raises the boiling point of water by pressurizing the chamber, so that water can be used as a constraint layer for laser shock reinforcement at high temperature, thus saving experimental costs.
[0021] 2. This application avoids the problem of constraint layer rupture when water is used as the constraint layer, and the experimental process is more stable.
[0022] 3. With water as a constraint layer, this application allows for more flexible workpiece shapes that are not limited to polished surfaces, thus broadening its applicability.
[0023] 4. The workpiece processed by using water as a constraint layer is easier to clean, has higher processing efficiency, and is simpler. Attached Figure Description
[0024] The technical solution and other beneficial effects of this application will become apparent from the following detailed description of specific embodiments in conjunction with the accompanying drawings.
[0025] Figure 1 A schematic diagram of the structure of the temperature-controlled laser shock peening device with water as a constraint layer provided in the embodiments of this application.
[0026] Figure 2 A flowchart illustrating the processing flow of the laser shock peening device provided in this application embodiment.
[0027] The components in the diagram are labeled as follows:
[0028] 110-Sealed chamber; 111-Pressure device; 120-Water circulation device; 121-Inlet pipe; 122-Outlet pipe; 130-Heating platform; 130a-Heating platform housing cavity; 131-Heating platform controller; 140-Moving platform; 141-Moving platform controller; 150-Light transmission mirror; 210-Water confinement layer; 220-Ablation layer; 230-Workpiece. Detailed Implementation
[0029] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the embodiments of this application. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0030] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0031] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0032] The following disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.
[0033] Please refer to Figure 1 This application provides a temperature-controlled laser shock peening device with water as a constraint layer, which mainly includes: a water circulation device 120, a moving platform controller 141, a heating platform controller 131, a heating platform 130, a sealed chamber 110, a pressurizing device 111, and a light transmission mirror 150.
[0034] The pressurizing device 111 is installed on the inner wall of the sealed chamber 110 to provide a sealed high-pressure environment for the workpiece 230 to be laser-processed; the water circulation device 120 is used to provide circulating water; the heating platform 130 is used to heat at least the circulating water to form a water-binding layer 210 that can cover the workpiece 230; and the moving platform controller 141 is configured with the heating platform 130 and the sealed chamber 110 to drive at least the movement of the heating platform 130.
[0035] As is conceivable, this laser shock peening apparatus also includes a laser generating component for generating laser light. The laser shock process involves heating the workpiece 230 to a specified temperature and then performing laser shock peening.
[0036] As an example, the laser generating component can be installed outside the sealed chamber 110. In this embodiment, the outer wall of the sealed chamber 110 is provided with a light transmission mirror 150 for the laser to pass through, so that the laser passes through the light transmission mirror 150 into the sealed chamber 110 and is finally loaded onto the surface of the workpiece 230.
[0037] As another exemplifiable implementation, the laser generating component can be installed inside the sealed chamber 110. In this case, the light transmission mirror 150 can be omitted. It is readily apparent that a protective cover made of high-pressure and high-temperature resistant material can be fitted around the laser generating component to prevent damage from the high pressure of the sealed chamber 110.
[0038] It is easy to imagine that the water circulation device 120 is structured to provide circulating water by including a water storage device (e.g., a tank or container) for containing water, an inlet pipe 121 and an outlet pipe 122 connected to the water storage device, and a water pump for driving the water flow. The water pump is connected to the pipe between the water storage device and the inlet pipe 121, or it can be connected to the pipe between the water storage device and the outlet pipe 122.
[0039] Those skilled in the art will understand from the phrase "used to heat at least the above-mentioned workpiece and circulating water to form a water constraint layer 210 that can cover the above-mentioned workpiece 230" that the circulating water is heated to form a constraint layer.
[0040] The material or construction of the sealed chamber 110 is configured to withstand 600 MPa.
[0041] It should be understood that the pressurizing device 111 can generate a pressure of 0.1-600 MPa inside the sealed chamber 110.
[0042] The water circulation device 120 is equipped with a cooling component for cooling the circulating water.
[0043] Understandably, the scenario where circulating water cooling occurs is after the laser shock is performed using this device, when the workpiece 230 is heated by the heat generated by the laser shock, and the heat concentrates on the workpiece 230. Furthermore, with the water confinement layer 210 in place, the heat from the workpiece 230 is difficult to dissipate. When the workpiece 230 needs to be removed, the residual heat could cause burns to the operator. To avoid this, a cooling assembly can be used to cool the workpiece 230 to a safe temperature.
[0044] It is easy to note that the purpose of the aforementioned mobile platform controller 141 is to achieve the necessary movement when the laser acts on the workpiece 230, so as to ensure the uniformity of the laser action on the surface of the workpiece 230 and avoid local areas of the workpiece 230 that have not been impacted by the laser.
[0045] As an exemplary specific example, the mobile platform controller 141 is an XYZ mobile platform controller 141, and its movement range is specifically: 0-1000mm in the X direction, 0-1000mm in the Y direction, and 0-1000mm in the Z direction.
[0046] To better achieve precise control of the movement stroke of the mobile platform controller 141, a mobile platform controller 141 electrically connected to the mobile platform controller 141 can be configured.
[0047] The heating platform 130 may be provided with a heating platform 130 receiving cavity 130a to accommodate the circulating water provided by the water circulation device 120.
[0048] The heating platform controller 131 can control the temperature of the heating platform 130 and test the water temperature. The temperature range of the heating platform 130 is 0-600℃.
[0049] The surface of workpiece 230 is covered with an ablation layer 220, which is located between the constraint layer and workpiece 230.
[0050] As a specific example, the ablation layer 220 is made of carbon black, graphite, black paint, or aluminum foil, and the constraint layer is water.
[0051] This application provides a laser shock strengthening processing method, which uses a temperature-controlled laser shock strengthening device with water as a constraint layer as described above to perform laser shock on the workpiece 230.
[0052] The operation process of laser shock according to this application will now be described in a common application scenario. It should be noted that this common implementation scheme should not be used as the basis for determining the essential features for understanding the technical problem claimed to be solved by this application; it is merely an example.
[0053] Please refer to Figure 2 In the demonstration site setting, the specific process of laser impact is as follows:
[0054] S1. First, clean and mechanically polish the workpiece 230.
[0055] S2. Prepare for high-temperature laser shock strengthening. Coat the workpiece 230 with carbon black and place it in the semi-enclosed cavity of the heating platform 130. Close the sealed chamber 110, turn on the pressurizing device 111, and set the pressure to 200MPa. After pressurization, turn on the water circulation device 120 and set the temperature to 150℃. After the temperature rises to 150℃, set the movement route of the moving platform controller 141.
[0056] S3. Set the laser process parameters and begin laser shock strengthening of workpiece 230.
[0057] S4. The moving platform controller 141 completes the designated route. The movement of the moving platform controller 141 ensures that all positions of the workpiece 230 are uniformly affected by the laser. After the laser impact ends, the heating device and the laser are turned off. The cooling device of the water circulation equipment is turned on. After the water cools to room temperature, the pressurization device 111 is used to restore the pressure inside the sealed chamber 110 to atmospheric pressure. Then, the sealed chamber 110 is opened, and the processed workpiece 230 is removed for cleaning and later use.
[0058] As an example, the process parameters for the laser shock mentioned above can be: laser wavelength 1064nm, pulse width 5ns, laser frequency 10Hz, single pulse laser energy 3J, and spot diameter 3mm.
[0059] The above description is merely a preferred embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application.
Claims
1. A temperature-controlled laser shock peening device with water as a confining layer, characterized in that, include: The sealed chamber is equipped with a pressurization device to provide a closed high-pressure environment for the workpiece to be laser-shock processed; A water circulation device used to provide circulating water; A heating platform for heating at least the workpiece being processed and the circulating water to form a water-constrained layer that can cover the workpiece; A mobile platform, wherein a heating platform and a sealed chamber are configured on the mobile platform to at least drive the movement of the heating platform.
2. The temperature-controlled laser shock peening device with water as a confinement layer according to claim 1, characterized in that, The material or structure of the sealed chamber is configured to withstand 0.1MPa-600MPa.
3. The temperature-controlled laser shock peening device with water as a confinement layer according to claim 1, characterized in that, The water circulation device is equipped with a cooling component for cooling the workpiece.
4. The temperature-controlled laser shock peening device with water as a confinement layer according to claim 1, characterized in that, The mobile platform is an XYZ mobile platform, with a travel distance of less than 1000mm in the X direction, less than 1000mm in the Y direction, and less than 1000mm in the Z direction.
5. The temperature-controlled laser shock peening device with water as a confinement layer according to claim 1, characterized in that, The heating platform is connected to a platform controller to control the temperature of the heating platform and test the temperature of the circulating water. The temperature of the heating platform is controlled to be below 600°C.
6. The temperature-controlled laser shock peening device with water as a confinement layer according to claim 1, characterized in that, The mobile platform is connected to a mobile platform controller for controlling the movement of the mobile platform.
7. The temperature-controlled laser shock peening device with water as a confining layer according to claim 1, characterized in that, The workpiece is covered with an ablation layer, the material of which is carbon black, graphite, black paint or aluminum foil.
8. The temperature-controlled laser shock peening device with water as a confinement layer according to claim 1, characterized in that, The outer wall of the sealed chamber is equipped with a light-transmitting mirror for laser light to pass through.
9. A laser shock peening processing method, characterized in that, The workpiece is subjected to laser shock using the temperature-controlled laser shock strengthening device with water as a constraint layer as described in claim 1.
10. The processing method according to claim 9, characterized in that, The parameters of the laser shock are: laser wavelength 532-1064nm, pulse width 10fs-100ns, laser frequency 1-20HZ, single pulse laser energy 0.1-10J, and spot diameter 0.01-10mm.