Semiconductor device solderability test apparatus and test method

Abstract

The application discloses a semiconductor device solderability test device and a test method, which comprises an experimental box body, an experimental table is arranged in the experimental box body, a solder furnace and a flux furnace are arranged at the top end of the experimental table, and a lifting and rotating mechanism is arranged at the bottom end of the experimental table; an experimental clamp is arranged, a scale column is arranged at the top end of the experimental clamp, the scale column is attracted to the top end of the experimental clamp through an electromagnet, a weighing mechanism is connected to the top end of the scale column, and proximity switches corresponding to the solder furnace are arranged on the two sides of the experimental clamp; wherein a cleaning mechanism is arranged at the top end in the experimental box body. The weighing reading of the weighing mechanism is prevented from changing due to collision, and the accuracy of experimental results is affected; meanwhile, the depth of the semiconductor device immersed in the solder can be observed through the scale column, the lifting height of the solder furnace is adjusted, and the depth of the semiconductor device immersed in the solder is facilitated to be controlled in the experiment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of solderability test, in particular to a semiconductor device solderability test device and test method. BACKGROUND

[0002] The solderability test for semiconductor devices needs to qualitatively and quantitatively evaluate the solderability of semiconductor devices to provide improvement basis for high-quality production. At present, there are two ways for the equipment used for solderability test in domestic production. The solderability test is usually divided into solder bath method and wetting method. The solder bath method is a method of judging whether the sample is qualified by visually testing the test results after the test, and taking the visual condition as the criterion. The wetting method measures whether the sample is qualified by measuring the change of wetting force generated by the sample during the test, so that the test result is more accurate and is more widely used.

[0003] The working principle of the traditional wetting method solderability test box is that the clamp is connected with the lifting moving mechanism; the clamp drives the semiconductor device to move up and down to be immersed into the solder furnace and the flux furnace. However, the weight of the semiconductor device changes during the up and down movement, and the semiconductor device collides with the surrounding objects during the immersion process, which also easily causes the error of the experimental results of the semiconductor device. At the same time, it is difficult to know the immersion depth of the semiconductor device, or a large number of sensors need to be set to detect the immersion depth, so it is difficult to quickly and intuitively know the immersion depth of the semiconductor device during the experiment. SUMMARY

[0004] The purpose of the present application is to provide a semiconductor device solderability test device and test method, which solves the following technical problems:

[0005] The existing wetting method solderability test box, the weight of the semiconductor device changes during the up and down movement, and the semiconductor device collides with the surrounding objects during the immersion process, which also easily causes the error of the experimental results of the semiconductor device. At the same time, a large number of sensors need to be set to detect the immersion depth, so it is difficult to quickly and intuitively know the immersion depth of the semiconductor device during the experiment.

[0006] The purpose of the present application can be achieved by the following technical solutions:

[0007] The semiconductor device solderability test device and test method comprises:

[0008] The experimental box body is internally provided with an experimental table, the top end of the experimental table is provided with a solder furnace and a flux furnace, and the bottom end of the experimental table is provided with a lifting and rotating mechanism.

[0009] The experimental clamp is provided with a scale column at the top end, the bottom end of the scale column is adsorbed to the top end of the experimental clamp through an electromagnet, and the top end of the scale column is connected with a weighing mechanism; the two sides of the experimental clamp are provided with proximity switches corresponding to the solder furnace.

[0010] The inside top end of the experimental box body is provided with a cleaning mechanism, and the cleaning mechanism is provided below the water receiving mechanism.

[0011] As a further scheme of the present application, the cleaning mechanism comprises:

[0012] A cleaning spray head is connected to the water storage box body through a pipeline at the top end of the cleaning spray head.

[0013] A material taking rod is provided with a material taking clamp at one end, an electromagnet is arranged on the inner side of the material taking clamp, and the other end of the material taking rod is connected to the output end of a material taking cylinder.

[0014] As a further scheme of the present application, the water receiving mechanism comprises:

[0015] The water receiving box is provided as a hollow structure, an inner water leakage groove is formed on the inner shell of the water receiving box, and an outer water leakage groove corresponding to the inner water leakage groove is formed on the bottom end of the outer shell of the water receiving box.

[0016] A drainage box is provided with a telescopic rod at the inside bottom end, the top end of the telescopic rod is connected to the bottom end of the water receiving box, and an external plug ball corresponding to the outer water leakage groove is mounted on the top end of the drainage box through a mounting frame.

[0017] As a further scheme of the present application, heating drying rods are connected to the inside of the drainage box, and a drainage pipe leading to the outside of the experimental box body is connected to one side of the drainage box.

[0018] As a further scheme of the present application, the bottom end of the experimental clamp is provided with a clamp plate, and two clamp plates are arranged, and each clamp plate is connected with an electric telescopic rod.

[0019] As a further scheme of the present application, the solder furnace is located below the corresponding position of the proximity switch.

[0020] As a further scheme of the present application, the experimental bench is provided as a ring-shaped plate structure, and the solder furnace and the flux furnace are distributed in a ring array on the top surface of the experimental bench.

[0021] As a further scheme of the present application, the lifting and rotating mechanism comprises a lifting cylinder and a rotating motor, and the bottom end of the lifting cylinder is connected with the rotating motor.

[0022] A semiconductor device solderability test method, characterized in that it comprises the following steps:

[0023] S1: the semiconductor device to be tested is fixed by an experimental fixture;

[0024] S2: the solder furnace at the top of the experimental table is lifted by the lifting cylinder of the lifting and rotating mechanism, so that the solder furnace moves towards the proximity switch;

[0025] S3: the semiconductor device fixed at the bottom of the experimental fixture is immersed in the solder in the solder furnace; after the semiconductor device is immersed in the solder for a preset time, the solder furnace is lowered by the lifting and rotating mechanism, so that the semiconductor device no longer contacts the solder in the solder furnace, and the solder immersion is completed;

[0026] S4: the experimental table is rotated by the rotating motor of the lifting and rotating mechanism, so that the solder furnace moves to align the proximity switch, and after the semiconductor device is immersed in the flux for a preset time, the solder furnace is lowered by the lifting and rotating mechanism, so that the semiconductor device no longer contacts the solder in the solder furnace;

[0027] S5: the weighing mechanism weighs and records the weight change of the semiconductor device in the above process;

[0028] S6: the semiconductor device is cleaned after the experiment is completed.

[0029] As a further scheme of the present application: the step S of cleaning the semiconductor device after the experiment includes the following steps:

[0030] S601: the experimental fixture is clamped by the taking fixture, the electromagnet at the bottom of the scale column is closed, and the electromagnet inside the taking fixture is opened; the taking fixture is adsorbed to the experimental fixture by the electromagnet, and the experimental fixture and the semiconductor device fixed thereunder are moved to above the water receiving box;

[0031] S602: the clamping plate releases the semiconductor device, the semiconductor falls into the water receiving box, and the cleaning nozzle sprays water to wash the semiconductor device;

[0032] S603: the external plug ball plugs the external water drain groove, so that the water in the water receiving box is accumulated, and the semiconductor device is washed and soaked;

[0033] S604: after the cleaning is completed, the telescopic rod lifts the water receiving box, so that the external plug ball no longer plugs the external water drain groove; the water in the water receiving box leaks out of the external water drain groove and the internal water drain groove to the drain box, and is discharged through the drain pipe on one side of the drain box;

[0034] S605: the semiconductor device is drained in the water receiving box, and at the same time, the heating drying rod is heated to accelerate the drying of the semiconductor device.

[0035] The present application has the following beneficial effects:

[0036] The application fixes the semiconductor device to be tested stably by clamping the semiconductor device through the clamping plate of the experimental fixture, opens the lifting rotating mechanism, rotates the experimental table through the rotating motor of the lifting rotating mechanism, aligns the solder furnace at the top of the experimental table with the lower side of the proximity switch, lifts the solder furnace at the top of the experimental table through the lifting cylinder of the lifting rotating mechanism, moves the solder furnace towards the proximity switch, and immerses the semiconductor device fixed at the bottom end of the experimental fixture into the solder in the solder furnace, so that the semiconductor device is immersed into the solder more stably, the weighing reading of the weighing mechanism is prevented from changing due to collision, and the accuracy of the experimental result is affected. BRIEF DESCRIPTION OF DRAWINGS

[0037] The application will be further described below in combination with the drawings.

[0038] Figure 1 is a structural schematic diagram of the application;

[0039] Figure 2 is a structural schematic diagram of the water receiving box of the application;

[0040] Figure 3 is a structural schematic diagram of the experimental fixture of the application;

[0041] Figure 4 is a structural schematic diagram of the material taking rod of the application.

[0042] In the drawings: 1, experimental table; 2, soldering agent furnace; 3, solder furnace; 4, experimental box body; 5, proximity switch; 6, experimental fixture; 7, scale column; 8, weighing mechanism; 9, water storage box body; 10, cleaning spray head; 11, material taking rod; 12, material taking cylinder; 13, water receiving box; 14, inner leakage water tank; 15, external blocking ball; 16, heating drying rod; 17, telescopic rod; 18, drainage box; 19, outer leakage water tank; 20, clamping plate; 21, material taking fixture; 22, lifting rotating mechanism. DETAILED DESCRIPTION

[0043] The technical solutions in the embodiments of the application will be clearly and completely described below in combination with the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the application.

[0044] Please refer to Figure 1 The application is a semiconductor device solderability test device and test method, which comprises:

[0045] The experimental box body 4 is internally provided with an experimental table 1, the top end of the experimental table 1 is provided with a solder furnace 3 and a flux furnace 2, and the bottom end of the experimental table 1 is provided with a lifting and rotating mechanism 22;

[0046] The experimental clamp 6 is provided with a scale column 7 at the top end, the bottom end of the scale column 7 is adsorbed to the top end of the experimental clamp 6 through an electromagnet, the top end of the scale column 7 is connected with a weighing mechanism 8, and the two sides of the experimental clamp 6 are provided with proximity switches 5 corresponding to the solder furnace 3.

[0047] The top end of the inside of the experimental box body 4 is provided with a cleaning mechanism, and the cleaning mechanism is provided below a water receiving mechanism.

[0048] Specifically, the semiconductor device to be experimented is clamped by the clamping plate 20 of the experimental clamp 6, so that the semiconductor device is stably fixed, the lifting and rotating mechanism 22 is started, the rotating motor of the lifting and rotating mechanism 22 drives the experimental table 1 to rotate, so that the solder furnace 3 at the top end of the experimental table 1 is aligned below the proximity switch 5, the lifting cylinder of the lifting and rotating mechanism 22 drives the solder furnace 3 at the top end of the experimental table 1 to rise, so that the solder furnace 3 moves towards the proximity switch 5, and the semiconductor device fixed at the bottom end of the experimental clamp 6 is immersed in the solder in the solder furnace 3, so that the semiconductor device is more stably immersed in the solder, and the weighing reading of the weighing mechanism 8 is prevented from being changed due to collision, so as to affect the accuracy of the experimental result; meanwhile, the depth of the semiconductor device immersed in the solder can be observed through the scale column 7, and the lifting height of the solder furnace 3 is adjusted, so as to control the depth of the semiconductor device immersed in the solder in the experiment; after the semiconductor device is immersed in the solder for a preset time, the lifting cylinder of the lifting and rotating mechanism 22 drives the solder furnace 3 to descend, so that the semiconductor device no longer contacts the solder in the solder furnace 3, and the solder immersion is completed; the rotating motor of the lifting and rotating mechanism 22 drives the experimental table 1 to rotate, so that the flux furnace 2 is aligned below the proximity switch 5, the above immersion process is repeated, so that the semiconductor device is immersed in the flux for a preset time; and the weighing mechanism 8 records the change of the weight of the semiconductor device in the above process.

[0049] In one of the embodiments of the present application, referring to Figure 4 The cleaning mechanism comprises:

[0050] The cleaning nozzle 10 is connected to the water storage box body 9 through a pipeline at the top end;

[0051] The material taking rod 11 is provided with a material taking clamp 21 at one end, the inner side of the material taking clamp 21 is provided with an electromagnet, and the other end of the material taking rod 11 is connected to the output end of the material taking cylinder 12.

[0052] Specifically, the material taking cylinder 12 drives the material taking rod 11 to extend, so that the material taking clamp 21 at one end of the material taking rod 11 clamps the experimental clamp 6, and meanwhile, the electromagnet at the bottom end of the scale column 7 is turned off, and the electromagnet inside the material taking clamp 21 is turned on. Please refer to Figure 4 As shown in the figure, the material taking clamp 21 adsorbs the experimental clamp 6 through the electromagnet, the material taking cylinder 12 drives the material taking rod 11 to shorten, and the material taking rod 11 drives the experimental clamp 6 and the semiconductor device fixed below to move, so that the experimental clamp 6 and the semiconductor device fixed below move above the water receiving box 13.

[0053] Please refer to Figure 2 As shown in the figure, in one embodiment of the present application, the water receiving mechanism comprises:

[0054] The water receiving box 13 is provided as a hollow structure, and the inner shell of the water receiving box 13 is provided with an inner water leakage groove 14, and the bottom end of the outer shell of the water receiving box 13 is provided with an outer water leakage groove 19 corresponding to the inner water leakage groove 14.

[0055] The water receiving box 13 is provided as a hollow structure, and the inner shell of the water receiving box 13 is provided with an inner water leakage groove 14, and the bottom end of the outer shell of the water receiving box 13 is provided with an outer water leakage groove 19 corresponding to the inner water leakage groove 14.

[0056] Specifically, when the experimental clamp 6 and the semiconductor device fixed below move above the water receiving box 13, the electric telescopic rod drives the clamping plates 20 to move away from each other, the semiconductor falls onto the water receiving box 13, the cleaning nozzle 10 sprays water, the sprayed water washes the semiconductor device, at this time, the outer blocking ball 15 blocks the outer water leakage groove 19, so that water accumulates in the water receiving box 13, so that the semiconductor device is washed of the external residual solder and flux, the telescopic rod 17 lifts the water receiving box 13, so that the outer blocking ball 15 no longer blocks the outer water leakage groove 19, the water in the water receiving box 13 leaks out of the outer water leakage groove 19 and the inner water leakage groove 14 into the drainage box 18, and is drained through the drainage pipe on one side of the drainage box 18, the semiconductor device is no longer soaked in water, and at the same time, the cleaning of the device after the experiment is completed is completed, which is convenient for taking the semiconductor device after the experiment and recycling the semiconductor device after the experiment.

[0057] In one embodiment of the present application, the inside of the drainage box 18 is connected with heating drying rods 16 on both sides, and one side of the drainage box 18 is connected with a drainage pipe leading to the outside of the experimental box 4.

[0058] Specifically, the heating drying rods 16 heat up to accelerate the drying of the semiconductor device.

[0059] Please refer to Figure 3As shown, in one of the embodiments of the present application, the bottom end of the experimental clamp 6 is provided with a clamping plate 20, and the clamping plate 20 is provided with two, and the two clamping plates 20 are connected with electric telescopic rods. Specifically, the electric telescopic rods are controlled to extend and shorten to control the clamping plates 20 to approach or move away from each other.

[0060] In one of the embodiments of the present application, the solder furnace 3 is located at a position corresponding to the position below the proximity switch 5.

[0061] Specifically, the solder furnace 3 is moved to the position close to the proximity switch 5, and the semiconductor device is stably immersed in the solder.

[0062] In one of the embodiments of the present application, the experimental bench 1 is provided in a ring-shaped plate structure, and the solder furnace 3 and the flux furnace 2 are distributed in a ring-shaped array on the top surface of the experimental bench 1.

[0063] In one of the embodiments of the present application, the lifting and rotating mechanism 22 includes a lifting cylinder and a rotating motor, and the bottom end of the lifting cylinder is connected with the rotating motor.

[0064] Specifically, the rotating motor can drive the experimental bench 1 to rotate, and the lifting cylinder can drive the experimental bench 1 to lift, so as to drive the solder furnace 3 on the experimental bench 1 to move towards the semiconductor device.

[0065] Embodiment two

[0066] The semiconductor device solderability test method is characterized in that it comprises the following steps:

[0067] S1: fixing the semiconductor device to be tested by the experimental clamp 6;

[0068] S2: driving the solder furnace 3 at the top end of the experimental bench 1 to move towards the proximity switch 5 by the lifting cylinder of the lifting and rotating mechanism 22;

[0069] S3: immersing the semiconductor device fixed at the bottom end of the experimental clamp 6 into the solder in the solder furnace 3; after the semiconductor device is immersed in the solder for a preset time, the lifting and rotating mechanism 22 drives the solder furnace 3 to descend, so that the semiconductor device no longer contacts the solder in the solder furnace 3, and the solder immersion is completed;

[0070] S4: driving the experimental bench 1 to rotate by the rotating motor of the lifting and rotating mechanism 22, so that the flux furnace 2 moves to align with the proximity switch 5, and immersing the semiconductor device in the flux for a preset time, and then driving the flux furnace 2 to descend by the lifting and rotating mechanism 22, so that the semiconductor device no longer contacts the solder in the flux furnace 2;

[0071] S5: weighing and recording the weight change of the semiconductor device by the weighing mechanism 8 during the above process;

[0072] S6: After cleaning the semiconductor device of the experiment, the experiment is completed.

[0073] In one embodiment of the present application, the step S6 of cleaning the semiconductor device of the experiment comprises the following steps:

[0074] S601: The experimental clamp 6 is clamped by the taking clamp 21, and the electromagnet at the bottom end of the scale column 7 is closed, and the electromagnet inside the taking clamp 21 is opened. The taking clamp 21 adsorbs the experimental clamp 6 through the electromagnet, and drives the experimental clamp 6 and the semiconductor device fixed below to move above the water receiving box 13;

[0075] S602: The semiconductor device is released by the clamp plate 20, and falls into the water receiving box 13. The water jet nozzle 10 sprays water to wash the semiconductor device;

[0076] S603: The external plug ball 15 plugs the outer water groove 19, so that the water receiving box 13 inside accumulates water, and the semiconductor device is washed and soaked;

[0077] S604: After the cleaning is completed, the telescopic rod 17 lifts the water receiving box 13, so that the external plug ball 15 no longer plugs the outer water groove 19. The water in the water receiving box 13 leaks out of the outer water groove 19 and the inner water groove 14 to the drainage box 18, and is discharged through the drainage pipe on one side through the drainage box 18;

[0078] S605: The semiconductor device is drained in the water receiving box 13, and at the same time, the heating drying rod 16 is heated to accelerate the drying of the semiconductor device.

[0079] Specifically, the semiconductor device to be tested is clamped by the clamping plate 20 of the experimental fixture 6, so that the semiconductor device is stably fixed, the lifting and rotating mechanism 22 is turned on, the rotating motor of the lifting and rotating mechanism 22 drives the experimental bench 1 to rotate, so that the solder furnace 3 at the top of the experimental bench 1 is aligned below the proximity switch 5, the lifting cylinder of the lifting and rotating mechanism 22 drives the solder furnace 3 at the top of the experimental bench 1 to rise, so that the solder furnace 3 moves towards the proximity switch 5, the semiconductor device fixed at the bottom end of the experimental fixture 6 is immersed in the solder in the solder furnace 3, and the depth of the semiconductor device immersed in the solder is observed through the scale column 7; after the semiconductor device is immersed in the solder for a preset time, the lifting cylinder of the lifting and rotating mechanism 22 drives the solder furnace 3 to descend, so that the semiconductor device no longer contacts the solder in the solder furnace 3, and the solder immersion is completed; the rotating motor of the lifting and rotating mechanism 22 drives the experimental bench 1 to rotate, so that the flux furnace 2 is aligned below the proximity switch 5, and the above immersion process is repeated, so that the semiconductor device is immersed in the flux for a preset time, and then the lifting cylinder of the lifting and rotating mechanism 22 drives the flux furnace 2 to descend, so that the semiconductor device no longer contacts the solder in the flux furnace 2; the weighing mechanism 8 records the change of the weight of the semiconductor device during the above process; after the experimental semiconductor device is cleaned, the experiment is completed. Cleaning: the material taking cylinder 12 drives the material taking rod 11 to elongate, so that the material taking clamp 21 at one end of the material taking rod 11 clamps the experimental fixture 6, and at the same time, the electromagnet at the bottom end of the scale column 7 is turned off, the electromagnet inside the material taking clamp 21 is turned on, the material taking clamp 21 absorbs the experimental fixture 6 through the electromagnet, the material taking cylinder 12 drives the material taking rod 11 to shorten, the material taking rod 11 drives the experimental fixture 6 and the semiconductor device fixed below it to move, so that the experimental fixture 6 and the semiconductor device fixed below it move above the water receiving box 13, the electric telescopic rod drives the clamping plates 20 to move away from each other, and the semiconductor device is loosened, and the semiconductor device falls into the water receiving box 13, the water spray head 10 sprays water, and the sprayed water washes the semiconductor device. At this time, the external plug ball 15 plugs the external water drain groove 19, so that water accumulates in the water receiving box 13, so that the semiconductor device is washed to remove the residual solder and flux outside, the telescopic rod 17 lifts the water receiving box 13, so that the external plug ball 15 no longer plugs the external water drain groove 19, the water in the water receiving box 13 leaks out of the external water drain groove 19 and the internal water drain groove 14 into the drainage box 18, and is discharged through the drainage pipe on one side through the drainage box 18, so that the semiconductor device is no longer soaked in water, and at the same time, the heating drying rod 16 is heated to accelerate the drying of the semiconductor device, so that the cleaning of the device after the experiment is completed, which is convenient for taking the semiconductor device after the experiment and recycling the semiconductor device after the experiment.

[0080] In the description of the present application, it is to be understood that the terms "upper", "lower", "left", "right", and the like refer to the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, and a particular orientation configuration and operation, therefore, cannot be understood as a limitation on the present application. In addition, "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0081] In the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connecting", "connecting" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0082] The above describes one embodiment of the present application in detail, but the content described is only the preferred embodiment of the present application, and cannot be considered as limiting the scope of the present application. Any equivalent changes and improvements made within the scope of the present application shall still belong to the scope of the present application.

Claims

1. A semiconductor device solderability testing apparatus, characterized in that, include: An experimental box (4) is provided inside the experimental box (4), and an experimental platform (1) is provided at the top of the experimental platform (1), with a solder furnace (3) and a flux furnace (2) provided at the top and a lifting and rotating mechanism (22) provided at the bottom of the experimental platform (1); the experimental platform (1) is configured as a ring plate structure, and the solder furnace (3) and the flux furnace (2) are arranged in a ring array on the top surface of the experimental platform (1); The experimental fixture (6) has a scale column (7) at its top, and the bottom of the scale column (7) is attracted to the top of the experimental fixture (6) by an electromagnet. The top of the scale column (7) is connected to a weighing mechanism (8). The lifting and rotating mechanism (22) includes a lifting cylinder and a rotating motor. The bottom of the lifting cylinder is connected to the rotating motor. The experimental fixture (6) has proximity switches (5) on both sides corresponding to the solder furnace (3). The experimental chamber (4) is equipped with a cleaning mechanism at the top of its interior, and a water receiving mechanism is provided below the cleaning mechanism. The water receiving mechanism includes: Water receiving box (13), the water receiving box (13) is configured as a hollow structure, the inner shell of the water receiving box (13) is provided with an inner water leakage groove (14), and the bottom of the outer shell of the water receiving box (13) is provided with an outer water leakage groove (19) corresponding to the inner water leakage groove (14); A drain box (18) is provided with a telescopic rod (17) at the bottom of its interior. The top of the telescopic rod (17) is connected to the bottom of the water receiving box (13). An external plug ball (15) corresponding to the external water leakage groove (19) is installed on the top of the drain box (18) through a mounting bracket.

2. The semiconductor device solderability testing apparatus according to claim 1, characterized in that, The cleaning mechanism includes: A cleaning nozzle (10) is provided, the top of which is connected to a water storage box (9) via a pipe. The material picking rod (11) has a material picking clamp (21) at one end, and an electromagnet is provided on the inner side of the material picking clamp (21). The other end of the material picking rod (11) is connected to the output end of the material picking cylinder (12).

3. The semiconductor device solderability testing apparatus according to claim 1, characterized in that, Heating and drying rods (16) are connected to both sides of the inside of the drainage box (18), and a drainage pipe leading to the outside of the experimental chamber (4) is connected to one side of the drainage box (18).

4. The semiconductor device solderability testing apparatus according to claim 1, characterized in that, The experimental fixture (6) is provided with a clamping plate (20) at its bottom end. There are two clamping plates (20), and each clamping plate (20) is connected to an electric telescopic rod.

5. The semiconductor device solderability testing apparatus according to claim 1, characterized in that, The solder furnace (3) is located below the proximity switch (5).

6. A method for testing the solderability of semiconductor devices, implemented using the testing apparatus as described in any one of claims 1-5, characterized in that, Includes the following steps: S1: Fix the semiconductor device to be tested using the experimental fixture (6); S2: The solder furnace (3) at the top of the experimental platform (1) is raised by the lifting and rotating mechanism (22), and the solder furnace (3) moves toward the proximity switch (5); S3: The semiconductor device fixed at the bottom of the experimental fixture (6) is immersed in the solder in the solder furnace (3); after the semiconductor device has been immersed in the solder for a preset time, the solder furnace (3) descends, and the semiconductor device no longer contacts the solder in the solder furnace (3), and the solder immersion is completed; S4: The experimental platform (1) is rotated by the lifting and rotating mechanism (22), the flux furnace (2) moves in alignment with the proximity switch (5), and after the semiconductor device is immersed in the flux for a preset time, the flux furnace (2) descends and the semiconductor device no longer contacts the solder in the flux furnace (2). S5: During the above process, the weighing mechanism (8) weighs and records the change in the weight of the semiconductor device; S6: The experiment is completed after cleaning the semiconductor devices.

7. The semiconductor device solderability testing method according to claim 6, characterized in that, The semiconductor device cleaning experiment in step S6 includes the following steps: S601: The experimental fixture (6) is clamped by the material picker (21), and the electromagnet at the bottom of the scale column (7) is closed at the same time. The electromagnet inside the material picker (21) is turned on. The material picker (21) attracts the experimental fixture (6) through the electromagnet. The material picker (21) moves the experimental fixture (6) and the semiconductor device fixed below it to the water receiving box (13). S602: The clamp (20) loosens the semiconductor device, and the semiconductor falls into the water receiving box (13). The cleaning nozzle (10) sprays water to rinse the semiconductor device. S603: The external plug ball (15) blocks the external water leakage groove (19), and water accumulates inside the water receiving box (13) to rinse and soak the semiconductor device; S604: After cleaning, the telescopic rod (17) lifts the water collection box (13), the external plug (15) no longer blocks the external water leakage groove (19), and the water in the water collection box (13) leaks out into the drain box (18) through the external water leakage groove (19) and the internal water leakage groove (14), and is discharged through the drain pipe on one side of the drain box (18); S605: The semiconductor device is drained in the water receiving box (13), and at the same time, the heating drying rod (16) is heated to accelerate the drying of the semiconductor device.

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