Low wear radio frequency conduction test device

Abstract

This invention discloses a low-wear radio frequency (RF) conduction testing device. It designs an RF signal acquisition board to replace the RF probe in existing technologies. The RF signal acquisition board has an RF signal acquisition unit corresponding to the antenna excitation spring assembly on the circuit board under test (PCB). The RF signal acquisition unit includes first and second signal acquisition pads and an impedance transformer. The two ends of the impedance transformer are electrically connected to the RF signal acquisition board and the first signal acquisition pad, respectively, and the first and second signal acquisition pads are spaced apart. When testing the PCB, the RF signal acquisition board is stacked on top of the PCB, and the first and second signal acquisition pads contact the antenna excitation spring assembly to acquire RF signals. This invention can eliminate the production consistency variation problem caused by impedance changes due to mechanical displacement and wear, and eliminates the need for a high-frequency test socket on the PCB, reducing the production and design costs of the PCB.

Description

Technical Field

[0001] This invention relates to the field of radio frequency product manufacturing testing, and more particularly to a low-wear radio frequency conduction testing device. Background Technology

[0002] See Figures 1-4 As shown, in current RF production testing, most systems use a combination of a high-frequency test socket 210' and an RF probe 100'. The high-frequency test socket 210' is mounted on the PCB board 200' as a signal acquisition point during testing. (See attached image.) Figure 4 As shown. The existing kit has the following drawbacks when undergoing production testing:

[0003] 1. Because the high-frequency test socket 210' and the RF probe 100' have a nested mating contact method, such as... Figure 2 As shown, with the increase in production cycles, the offset between the nested connection between the high-frequency test socket 210' and the RF probe 100' increases, leading to wear on the probe 100'. The wear location of the probe 100' is its end 110', see [reference]. Figure 3 As shown, this leads to a decrease in testing accuracy and production consistency;

[0004] Second, the high-frequency test socket 210' is located on the PCB board 200', but it is only used during production testing, resulting in a higher cost for the product's PCB board 200'.

[0005] Therefore, it is necessary to provide a low-wear RF conduction testing device that can reduce mechanical wear during RF product manufacturing and testing, reduce the production consistency dispersion caused by impedance deviation due to mechanical displacement, and reduce the PCB board design cost of the product, in order to solve the above problems. Summary of the Invention

[0006] The purpose of this invention is to provide a low-wear RF conduction testing device that can reduce mechanical wear during the production and testing of RF products, reduce the production consistency dispersion caused by impedance deviation due to mechanical displacement, and reduce the PCB board design cost of the product.

[0007] To achieve the above objectives, the technical solution of the present invention is as follows: A low-wear radio frequency conduction testing device is provided for testing a circuit board under test. The circuit board under test is provided with an antenna excitation spring assembly. The device includes a radio frequency signal acquisition board, which is provided with a radio frequency signal acquisition unit corresponding to the antenna excitation spring assembly. The radio frequency signal acquisition unit includes a first signal acquisition pad, a second signal acquisition pad, and an impedance transformer. One end of the impedance transformer is electrically connected to the radio frequency signal acquisition board, and the other end is connected to the first signal acquisition pad. The second signal acquisition pad is spaced apart from the first signal acquisition pad. When the radio frequency signal acquisition board is stacked with the circuit board under test, the first signal acquisition pad and the second signal acquisition pad respectively contact the antenna excitation spring assembly to acquire radio frequency signals.

[0008] Preferably, the impedance transformer has a connecting post protruding from the end furthest from the first signal acquisition pad, and the connecting post is inserted into the radio frequency signal acquisition board.

[0009] Preferably, both the first signal acquisition pad and the second signal acquisition pad have a sheet-like structure.

[0010] Preferably, the circuit board under test is provided with multiple sets of the antenna excitation spring assemblies, and the radio frequency signal acquisition unit has multiple sets and the positions of each set of the antenna excitation spring assemblies correspond to each other, so that when the radio frequency signal acquisition board is stacked with the circuit board under test, the radio frequency signal acquisition unit and the antenna excitation spring assemblies make contact one-to-one.

[0011] Preferably, after the first signal acquisition pad and the second signal acquisition pad contact the antenna excitation spring assembly, the friction direction between the first signal acquisition pad, the second signal acquisition pad and the antenna excitation spring assembly is parallel to the plane of the radio frequency signal acquisition board. Therefore, the production consistency discrepancy problem caused by impedance changes due to mechanical displacement and mechanical wear can be eliminated.

[0012] Preferably, the antenna excitation spring assembly includes two antenna excitation springs spaced apart from each other, and the two antenna excitation springs are respectively used to contact the first signal acquisition pad and the second signal acquisition pad.

[0013] Preferably, the antenna excitation spring includes a fixed part and a protruding part. The fixed part is electrically connected to the circuit board under test, and the protruding part protrudes away from the fixed part and is used to contact the first signal acquisition pad or the second signal acquisition pad.

[0014] Preferably, a mounting portion is formed in the middle of the circuit board under test, and multiple components are protruding from the mounting portion. The antenna excitation spring assembly is located at the edge of the circuit board under test. A through hole corresponding to the shape of the mounting portion is opened in the middle of the radio frequency signal acquisition board. When the radio frequency signal acquisition board is stacked with the circuit board under test, the components on the circuit board under test pass through the through hole so that the first signal acquisition pad and the second signal acquisition pad respectively contact the antenna excitation spring assembly.

[0015] Preferably, the edge shape of the radio frequency signal acquisition board corresponds to the shape of the circuit board under test.

[0016] Preferably, the high-frequency test socket is omitted from the circuit board under test.

[0017] Compared with existing technologies, the low-wear RF conducted signal testing device of the present invention firstly reuses the function of the antenna excitation spring, transferring the test signal acquisition position from the existing high-frequency test socket to the antenna excitation spring. Therefore, the high-frequency test socket can be eliminated for the circuit board under test, thereby reducing the production and design costs of the circuit board under test. Secondly, an RF signal acquisition board is designed to replace the RF probe in the prior art. An RF signal acquisition unit corresponding to the antenna excitation spring assembly is set on the RF signal acquisition board. The RF signal acquisition unit includes a first signal acquisition pad, a second signal acquisition pad, and an impedance transformer. The two ends of the impedance transformer are electrically connected to the first signal acquisition pad. The circuit includes pads and an RF signal acquisition board. The second signal acquisition pad is spaced apart from the first signal acquisition pad. When the RF signal acquisition board is stacked with the circuit board under test, the first and second signal acquisition pads respectively contact the two antenna excitation springs of the antenna excitation spring assembly. Therefore, the friction between the first and second signal acquisition pads and the antenna excitation springs is lateral friction, which replaces the longitudinal friction between the RF probe and the high-frequency test socket in the prior art. The impedance transformer can correct the impedance deviation caused by the first and second signal acquisition pads and the antenna excitation springs, thus eliminating the production consistency dispersion problem caused by impedance changes due to mechanical displacement and mechanical wear. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a high-frequency test socket and an RF probe in the existing technology.

[0019] Figure 2 yes Figure 1 A schematic diagram of the test status of the high-frequency test socket and the radio frequency probe.

[0020] Figure 3 yes Figure 1 A schematic diagram showing the wear location of the radio frequency probe.

[0021] Figure 4 yes Figure 1 The installation diagram of the high-frequency test socket is shown.

[0022] Figure 5 This is a schematic diagram of the circuit board under test in this invention.

[0023] Figure 6 yes Figure 5 An enlarged schematic diagram of a set of antenna excitation spring assemblies.

[0024] Figure 7 This is a schematic diagram of the radio frequency signal acquisition board in this invention.

[0025] Figure 8 yes Figure 7 An enlarged schematic diagram of the radio frequency signal acquisition unit.

[0026] Figure 9 This is a schematic diagram of the structure in which the radio frequency signal acquisition board and the circuit board under test are in contact in this invention.

[0027] Figure 10 yes Figure 9 A sectional view.

[0028] Figure 11 yes Figure 10 A magnified view of a portion of the image. Detailed Implementation

[0029] Embodiments of the present invention will now be described with reference to the accompanying drawings, in which similar element reference numerals represent similar elements. It should be noted that the directional descriptions involved in the present invention, such as up, down, left, right, front, and rear, indicating directions or positional relationships, are based on the directions or positional relationships shown in the drawings and are only for the convenience of describing the technical solutions of this application or / and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "first," "second," etc., described are only used to distinguish technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the sequential relationship of the indicated technical features.

[0030] Combination Figures 5-11 As shown, the low-wear RF conduction test device provided by this invention is used to test the circuit board 200 under test. Furthermore, this invention reuses the function of the antenna excitation spring 211 on the circuit board 200 under test, transferring the test signal acquisition position from the existing high-frequency test socket to the antenna excitation spring 211. Therefore, the high-frequency test socket can be omitted from the circuit board 200 under test. See details below. Figure 5As shown in the figure, the area indicated by position A is the installation location of the high-frequency test socket, which reduces the production and design costs of the circuit board under test 200.

[0031] Continue reading Figure 5 As shown, in this invention, the circuit board under test 200 is provided with at least one set of antenna excitation spring assembly 210. Each set of antenna excitation spring assembly 210 includes two antenna excitation springs 211 arranged at intervals. The two antenna excitation springs 211 can be arranged parallel, perpendicular or at an angle, and no specific limitation is made here.

[0032] In one embodiment of the present invention, the circuit board under test 200 is provided with three sets of antenna excitation spring assemblies 210, which are spaced apart at the edge of the circuit board under test 200. Specifically, two sets of antenna excitation spring assemblies 210 are spaced apart on both sides of the first end of the circuit board under test 200 and are arranged approximately symmetrically, with each set of antenna excitation spring assemblies 210 including two parallel antenna excitation springs 211; the other set of antenna excitation spring assemblies 210 is located at the second end of the circuit board under test 200, with the two antenna excitation springs 211 at this end arranged approximately perpendicularly. Of course, the arrangement is not limited to this embodiment, and the antenna excitation spring assemblies 210 can be flexibly arranged according to product needs. This is a technology well known to those skilled in the art and will not be described in detail here.

[0033] Continue to combine Figures 5-11 As shown, the low-wear radio frequency conductedion test device of the present invention includes a radio frequency signal acquisition board 100. The radio frequency signal acquisition board 100 is provided with a radio frequency signal acquisition unit 110 corresponding to the antenna excitation spring assembly 210. The radio frequency signal acquisition unit 110 includes a first signal acquisition pad 111, a second signal acquisition pad 112, and an impedance transformer 113. One end of the impedance transformer 113 is electrically connected to the radio frequency signal acquisition board 100, and the other end is fixedly connected to the first signal acquisition pad 111. The second signal acquisition pad 112 is spaced apart from the first signal acquisition pad 111. When the radio frequency signal acquisition board 100 is stacked with the circuit board under test 200, the first signal acquisition pad 111 and the second signal acquisition pad 112 respectively contact the two antenna excitation springs 211 of the antenna excitation spring assembly 210 to acquire radio frequency signals.

[0034] See Figure 7As shown, in one embodiment of the present invention, the radio frequency signal acquisition board 100 is provided with three sets of radio frequency signal acquisition units 110, and the positions of the three sets of radio frequency signal acquisition units 110 correspond one-to-one with the positions of the three sets of antenna excitation spring assemblies 210. Specifically, two sets of radio frequency signal acquisition units 110 are located on both sides of the first end of the radio frequency signal acquisition board 100, and the two sets of radio frequency signal acquisition units 110 at this end are arranged approximately symmetrically. The first signal acquisition pad 111 and the second signal acquisition pad 112 of each set of radio frequency signal acquisition units 110 are approximately located on the same straight line, and the interval between their centers corresponds to the interval between the two antenna excitation springs 211 provided at the first end of the circuit board under test 200; the other set of radio frequency signal acquisition units 110 is located on one side of the second end of the radio frequency signal acquisition board 100, and its first signal acquisition pad 111 and the second signal acquisition pad 112 are staggered, and their positions correspond to the two antenna excitation springs 211 that are perpendicular to each other provided at the second end of the circuit board under test 200.

[0035] Combination Figure 9-10 As shown, when the RF signal acquisition board 100 and the circuit board under test 200 are stacked, specifically, one side of the RF signal acquisition board 100 with the RF signal acquisition unit 110 is covered on the circuit board under test 200, so that the two sets of RF signal acquisition units 110 at the first end of the RF signal acquisition board 100 are in one-to-one contact with the antenna excitation spring assembly 210 at the first end of the circuit board under test 200, and the RF signal acquisition unit 110 at the second end of the RF signal acquisition board 100 is in corresponding contact with the antenna excitation spring assembly 210 at the second end of the circuit board under test 200.

[0036] Combination Figures 7-8 , Figure 11 As shown, in one embodiment of the present invention, the impedance transformer 113 has an elongated structure, and one end of the impedance transformer 113 has a protruding connecting post 1131. The impedance transformer 113 is plugged into the radio frequency signal acquisition board 100 through the connecting post 1131. (See figure) Figure 11 As shown, the impedance transformer 113 is positioned parallel to or attached to the radio frequency signal acquisition board 100, and the other end of the impedance transformer 113 is connected to the first signal acquisition pad 111.

[0037] In this invention, both the first signal acquisition pad 111 and the second signal acquisition pad 112 are sheet-like structures. In one embodiment, the first signal acquisition pad 111 and the second signal acquisition pad 112 are generally square structures, but are not limited thereto. By using the sheet-like arrangement of the first signal acquisition pad 111 and the second signal acquisition pad 112, the contact area between them and the antenna excitation spring 211 is increased, and the friction direction between the antenna excitation spring 211 and the first signal acquisition pad 111 and the second signal acquisition pad 112 is parallel to the direction of the RF signal acquisition board 100, that is, the friction direction is transverse, compared to the longitudinal friction between the RF probe 100' and the high-frequency test socket 210' in the prior art (see...). Figure 2 This invention can eliminate the problem of production consistency discrepancies caused by impedance changes due to mechanical displacement and mechanical wear.

[0038] See again Figure 5-6 As shown, in this invention, the antenna excitation spring 211 includes a protrusion 2111 and a fixing portion 2112. The fixing portion 2112 is electrically connected to the circuit board under test 200. The protrusion 2111 protrudes away from the fixing portion 2112 and is used to contact the first signal acquisition pad 111 or the second signal acquisition pad 112. The structure of other parts of the antenna excitation spring 211 is a conventional structure in the art and will not be described in detail.

[0039] The following is combined with Figure 5 , Figure 7 As shown, in this invention, a mounting portion 220 is formed in the middle of the circuit board under test 200. The shape of the mounting portion 220 is not specifically limited. The mounting portion 220 is provided with a plurality of components 230, which are configured according to different product functions, and are also not specifically limited in this invention. In one embodiment of this invention, the antenna excitation spring assembly 210 is located at the edge of the circuit board under test 200, that is, at the periphery of the mounting portion 220.

[0040] Correspondingly, the radio frequency signal acquisition board 100 has a through hole 120 in the middle that corresponds to the shape of the mounting part 220. Therefore, the shape of the through hole 120 is not specifically limited, but can be flexibly set according to the structure of the circuit board 200 under test.

[0041] Combination Figure 9 As shown, when the RF signal acquisition board 100 and the circuit board under test 200 are stacked, the components 230 on the circuit board under test 200 are inserted into the through hole 120, thereby ensuring that the RF signal acquisition unit 110 can contact the antenna excitation spring assembly 210.

[0042] Continue to combine Figure 5 , Figure 7 As shown, in an embodiment of the present invention, the edge shape of the radio frequency signal acquisition board 100 corresponds to the shape of the circuit board under test 200, but the specific shapes of both are not limited and can be flexibly set according to product needs.

[0043] The following is combined with Figure 9-11 As shown, when testing the circuit board 200 under test, the RF signal acquisition board 100 is stacked on top of the circuit board 200 under test, that is, the components 230 on the circuit board 200 under test are inserted into the through holes 120 on the RF signal acquisition board 100, and the positions of each group of RF signal acquisition units 110 and each group of antenna excitation spring assemblies 210 are aligned one-to-one. At this time, the first signal acquisition pad 111 and the second signal acquisition pad 112 of each group of RF signal acquisition units 110 respectively contact the protrusions 2111 of the two antenna excitation springs 211 of each group of antenna excitation spring assemblies 210, as shown. Figure 11 As shown, test signals are acquired through the antenna excitation spring 211, eliminating the need for the high-frequency test socket 210' and RF probe 100' found in existing technologies, thus saving the high-frequency test socket 210'. Furthermore, the arrangement of the first signal acquisition pad 111 and the second signal acquisition pad 112 with a sheet-like structure increases the contact area between the first signal acquisition pad 111, the second signal acquisition pad 112 and the antenna excitation spring 211. Secondly, the friction direction between the first signal acquisition pad 111, the second signal acquisition pad 112 and the antenna excitation spring 211 is parallel to the plane of the RF signal acquisition board 100, i.e., changing the longitudinal friction in existing technologies to transverse friction. This eliminates the production consistency issues caused by impedance changes due to mechanical displacement and wear. The first signal acquisition pad 111 has an impedance transformer 113, which can correct impedance deviations caused by the pads and the antenna excitation spring 211.

[0044] In summary, the low-wear RF conducted signal testing device of the present invention firstly reuses the function of the antenna excitation spring 211, transferring the test signal acquisition position from the existing high-frequency test socket 210' to the antenna excitation spring 211. Therefore, the high-frequency test socket 210' can be omitted for the circuit board under test 200, thereby reducing the production and design costs of the circuit board under test 200. Secondly, an RF signal acquisition board 100 is designed to replace the RF probe 100' in the prior art. An RF signal acquisition unit 110 corresponding to the antenna excitation spring assembly 210 is set on the RF signal acquisition board 100. The RF signal acquisition unit 110 includes a first signal acquisition pad 111, a second signal acquisition pad 112, and an impedance transformer 113. The two ends of the impedance transformer 113 are electrically connected to the first signal acquisition pad 111. 11. RF signal acquisition board 100, wherein the second signal acquisition pad 112 and the first signal acquisition pad 111 are spaced apart. When the RF signal acquisition board 100 is stacked with the circuit board under test 200, the first and second signal acquisition pads 111 and 112 respectively contact the two antenna excitation springs 211 of the antenna excitation spring assembly 210. Therefore, the friction between the first and second signal acquisition pads 111 and 112 and the antenna excitation springs 211 is lateral friction, which replaces the longitudinal friction between the RF probe 100' and the high-frequency test socket 210' in the prior art. The impedance transformer 113 can correct the impedance deviation caused by the first and second signal acquisition pads 111 and 112 and the antenna excitation springs 211, and can eliminate the production consistency dispersion problem caused by impedance changes due to mechanical displacement and mechanical wear.

[0045] The structures of other parts of the radio frequency signal acquisition board 100 involved in this invention are conventional configurations well known to those skilled in the art, and will not be described in detail here.

[0046] The above-disclosed embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. Therefore, any equivalent variations made in accordance with the claims of the present invention are still within the scope of the present invention.

Claims

1. A low-wear radio frequency conduction testing device for testing a circuit board under test, wherein the circuit board under test is provided with an antenna excitation spring assembly, characterized in that, include: The radio frequency (RF) signal acquisition board is provided with an RF signal acquisition unit corresponding to the antenna excitation spring assembly. The RF signal acquisition unit includes a first signal acquisition pad, a second signal acquisition pad, and an impedance transformer. One end of the impedance transformer has a connecting post protruding from it, which is inserted into the RF signal acquisition board, so that the impedance transformer is parallel to or attached to the RF signal acquisition board. The other end of the impedance transformer is connected to the first signal acquisition pad, and the second signal acquisition pad is spaced apart from the first signal acquisition pad. A mounting portion is formed in the middle of the circuit board under test, and multiple components are protruding from the mounting portion. The antenna excitation spring assembly is located at the edge of the circuit board under test. A through hole corresponding to the shape of the mounting portion is opened in the middle of the radio frequency signal acquisition board. When the radio frequency signal acquisition board is stacked with the circuit board under test, the components on the circuit board under test are inserted through the through holes so that the first signal acquisition pad and the second signal acquisition pad respectively contact the antenna excitation spring assembly to acquire radio frequency signals.

2. The low-wear radio frequency conduction testing device as described in claim 1, characterized in that, Both the first signal acquisition pad and the second signal acquisition pad have a sheet-like structure.

3. The low-wear radio frequency conduction testing apparatus as described in any one of claims 1-2, characterized in that, The circuit board under test is provided with multiple sets of antenna excitation spring assemblies, and the radio frequency signal acquisition unit has multiple sets and the positions of each set of antenna excitation spring assemblies are corresponding, so that when the radio frequency signal acquisition board is stacked with the circuit board under test, the radio frequency signal acquisition unit and the antenna excitation spring assemblies are in one-to-one contact.

4. The low-wear radio frequency conduction testing apparatus as described in any one of claims 1-2, characterized in that, After the first signal acquisition pad and the second signal acquisition pad come into contact with the antenna excitation spring assembly, the friction direction between the first signal acquisition pad, the second signal acquisition pad and the antenna excitation spring assembly is parallel to the plane of the radio frequency signal acquisition board.

5. The low-wear radio frequency conduction testing apparatus as described in any one of claims 1-2, characterized in that, The antenna excitation spring assembly includes two antenna excitation springs spaced apart from each other, and the two antenna excitation springs are respectively used to contact the first signal acquisition pad and the second signal acquisition pad.

6. The low-wear radio frequency conduction testing device as described in claim 5, characterized in that, The antenna excitation spring includes a fixed part and a protruding part. The fixed part is electrically connected to the circuit board under test. The protruding part protrudes away from the fixed part and is used to contact the first signal acquisition pad or the second signal acquisition pad.

7. The low-wear radio frequency conduction testing device as described in claim 1, characterized in that, The edge shape of the radio frequency signal acquisition board corresponds to the shape of the circuit board under test.

8. The low-wear radio frequency conduction testing apparatus as described in any one of claims 1-2, characterized in that, The high-frequency test socket is omitted from the circuit board under test.

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