Mass transfer device, mass transfer system and mass transfer method

Abstract

The application provides a mass transfer device, which comprises at least one transfer cavity, each of the transfer cavities is used for accommodating a plurality of micro light emitting diodes, the transfer cavity comprises a cavity wall and a bottom plate connected with the cavity wall, a plurality of transfer through holes arranged in an array are arranged on the bottom plate, and the transfer cavity is used for transferring the plurality of micro light emitting diodes to an array substrate of a display panel through the plurality of transfer through holes. The application also provides a mass transfer system and a mass transfer method.

Description

Technical Field

[0001] This application relates to the field of display, and more particularly to a mass transfer device, a mass transfer system, and a mass transfer method. Background Technology

[0002] Currently, LCD monitors dominate the market. However, with the development of display technology, the requirements for monitor resolution and contrast are becoming increasingly stringent. Micro-Light Emitting Diode (MicroLED) display technology, as a new technology with higher brightness, better luminous efficiency, and lower power consumption, has promising development prospects. However, since MicroLED shrinks the size of LEDs from hundreds of micrometers to tens or even a few micrometers, how to assemble these small-sized MicroLEDs onto display substrates with high efficiency and low cost is a pressing issue that needs to be addressed. Summary of the Invention

[0003] The first aspect of this application provides a mass transfer device, comprising:

[0004] At least one transfer cavity, each of which is used to accommodate multiple micro light-emitting diodes, the transfer cavity includes a cavity wall and a base plate connected to the cavity wall, the base plate has multiple transfer through holes arranged in an array, the transfer cavity is used to transfer the multiple micro light-emitting diodes through the multiple transfer through holes onto an array substrate of a display panel.

[0005] In one embodiment, the transfer cavity further includes a baffle, and an opening is provided on the cavity wall. The baffle is detachably disposed in the opening for controlling the plurality of micro light-emitting diodes to pass through the plurality of transfer through holes.

[0006] In one embodiment, the mass transfer device includes three transfer cavities, wherein the plurality of micro LEDs in the same transfer cavity are used to emit light of the same color, and the micro LEDs located in different transfer cavities are used to emit light of different colors.

[0007] The mass transfer device provided in this application embodiment, by setting a transfer cavity including a base plate with multiple transfer through holes, enables multiple micro light-emitting diodes disposed in the transfer cavity to be transferred to the capture holes of the array substrate through the multiple transfer through holes, thereby realizing the mass transfer of multiple micro light-emitting diodes to the array substrate with high efficiency and low cost.

[0008] A second aspect of this application provides a mass transfer system, comprising:

[0009] At least one transfer cavity, each of which is used to accommodate multiple miniature light-emitting diodes, the transfer cavity including a cavity wall and a base plate connected to the cavity wall, the base plate having multiple transfer through holes arranged in an array; and

[0010] An array substrate is provided with a plurality of collection holes arranged in an array, and the array substrate is movably disposed on the side of the base plate away from the cavity wall.

[0011] When each of the transfer vias is aligned with a capture hole, a micro LED can fall into a capture hole through a transfer via; by moving the array substrate, each capture hole on the array substrate can be filled with a micro LED.

[0012] In one embodiment, the mass transfer system includes three transfer cavities, wherein the plurality of micro LEDs in the same transfer cavity are used to emit light of the same color, and the micro LEDs located in different transfer cavities are used to emit light of different colors; the plurality of trapping apertures are filled by the plurality of micro LEDs in the three transfer cavities.

[0013] In one embodiment, each of the micro-LEDs has a first magnetic pole, and the mass transfer system further includes a magnetic generator disposed on the side of the array substrate away from the base plate, for generating a magnetic field so that the plurality of micro-LEDs having the first magnetic pole fall into the plurality of collection holes through the plurality of transfer vias under the action of the magnetic field.

[0014] The mass transfer system provided in this application, by setting a transfer cavity including a base plate with multiple transfer vias, allows multiple micro-LEDs disposed within the transfer cavity to be transferred through the multiple transfer vias to capture apertures on an array substrate, thereby achieving high-efficiency and low-cost batch transfer of multiple micro-LEDs onto the array substrate. By setting multiple transfer cavities, micro-LEDs of different colors can be transferred to the same array substrate, thus realizing image display. By setting each transfer via to align with a capture aperture, multiple micro-LEDs can simultaneously fall into the capture aperture, improving transfer efficiency.

[0015] A third aspect of this application provides a mass transfer method, comprising:

[0016] At least one transfer cavity is provided, each of the transfer cavities including a cavity wall and a bottom plate connected to the cavity wall, wherein a plurality of transfer through holes are arranged in an array on the bottom plate;

[0017] An array substrate is provided, wherein the array substrate has a plurality of trapping holes arranged in an array;

[0018] Multiple miniature light-emitting diodes are placed into each of the aforementioned transfer cavities;

[0019] Move the array substrate closer to the base plate, and each of the transfer through holes can be aligned with a collection hole position;

[0020] Each of the aforementioned micro-light-emitting diodes is allowed to fall into one of the aforementioned collection holes through one of the aforementioned transfer vias;

[0021] The array substrate is continuously moved so that each of the capture holes on the array substrate is filled with a micro light-emitting diode.

[0022] In one embodiment, the transfer cavity further includes a baffle, and an opening is provided on the cavity wall, the baffle being detachably disposed in the opening;

[0023] Prior to the step of placing multiple micro-light-emitting diodes into each of the transfer cavities, the method further includes:

[0024] Move the baffle so that the bottom plate is completely covered by the baffle;

[0025] After the step of placing a plurality of miniature light-emitting diodes into each of the transfer cavities, the method further includes:

[0026] Remove the baffle so that each of the transfer through holes can allow the miniature light-emitting diode to pass through.

[0027] In one embodiment, the step of providing at least one transfer cavity includes: providing three of the transfer cavities;

[0028] The step of placing multiple micro light-emitting diodes into each of the transfer cavities includes: placing multiple micro light-emitting diodes for emitting the same color of light into the same transfer cavity, and placing multiple micro light-emitting diodes for emitting different colors of light into different transfer cavities;

[0029] The step of continuously moving the array substrate includes bringing the array substrate closer to the three transfer cavities sequentially or simultaneously, such that the plurality of trapping apertures are respectively filled by the plurality of micro light-emitting diodes in the three transfer cavities.

[0030] In one embodiment, each of the micro LEDs has a first magnetic pole, and the step of causing the micro LEDs to fall into the trapping holes through the transfer vias includes: providing a magnetic generator on the side of the array substrate away from the base plate to generate a magnetic field, such that the plurality of micro LEDs having the first magnetic poles fall into the plurality of trapping holes through the plurality of transfer vias under the action of the magnetic field.

[0031] The mass transfer method provided in this application, by setting a transfer cavity including a base plate with multiple transfer vias, allows multiple micro-LEDs disposed within the transfer cavity to be transferred to the capture holes of an array substrate through the multiple transfer vias, thereby achieving mass transfer of multiple micro-LEDs onto the array substrate with high efficiency and low cost. By setting multiple transfer cavities, micro-LEDs of different colors can be disposed on the array substrate, thereby realizing image display. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the structure of a mass transfer device according to an embodiment of this application.

[0033] Figure 2 This is an exploded three-dimensional view of the transfer cavity according to an embodiment of this application.

[0034] Figure 3 This is a schematic diagram of the structure of a mass transfer system according to an embodiment of this application.

[0035] Figure 4 This is a plan view of an array substrate according to an embodiment of this application.

[0036] Figure 5 This is a partial cross-sectional view of a mass transfer system in one embodiment of this application.

[0037] Figure 6 This is a partial cross-sectional view of a mass transfer system according to another embodiment of this application.

[0038] Figure 7 This is a schematic diagram of the state of the array substrate during a mass transfer process according to an embodiment of this application.

[0039] Figure 8 This is a flowchart of a mass transfer method according to an embodiment of this application.

[0040] Explanation of main component symbols

[0041] Mass Transfer System 100

[0042] Mass transfer device 10

[0043] Transfer chambers 11, 13, 15

[0044] Cavity wall 111

[0045] Opening 112

[0046] baffle 113

[0047] Base plate 115

[0048] Transfer vias 117, 117R, 117G, 117B

[0049] Miniature LEDs 12R, 12G, 12B

[0050] Electrode 121

[0051] Light-emitting part 123

[0052] Array substrate 30

[0053] Collection holes 31, 31R, 31G, 31B

[0054] Magnetic generator 33

[0055] First direction X

[0056] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0057] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0058] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application's specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0059] To further illustrate the technical means and effects adopted by this application in achieving its intended purpose, the following detailed description of this application is provided in conjunction with the accompanying drawings and preferred embodiments.

[0060] Please refer to the following: Figure 1 and Figure 2 The mass transfer device 10 provided in this application embodiment includes at least one transfer cavity 11. Each transfer cavity 11 is used to accommodate multiple micro light-emitting diodes 12R. The transfer cavity 11 includes a cavity wall 111 and a base plate 115 connected to the cavity wall 111. The base plate 115 has multiple transfer through holes 117 arranged in an array. The transfer cavity 11 is also used to transfer multiple micro light-emitting diodes 12R to an array substrate of a display panel through the multiple transfer through holes 117.

[0061] In one embodiment, the transfer cavity 11 further includes a baffle 113. An opening 112 is provided on the cavity wall 111. The baffle 113 is detachably disposed in the transfer cavity 11 through the opening 112. The baffle 113 is used to support the micro-LEDs 12R and to control the multiple micro-LEDs 12R from falling onto the base plate 115, thereby controlling the micro-LEDs 12R to pass through the multiple transfer through holes 117. Specifically, the baffle 113 can move between the inner and outer sides of the transfer cavity 11 through the opening 112. When the baffle 113 is disposed inside the transfer cavity 11, the micro-LEDs 12R are located on the side of the baffle 113 away from the base plate 115 and are supported by the baffle 113. The baffle 113 can cover the base plate 115, that is, the baffle 113 covers and blocks each transfer through hole 117, thereby preventing communication between the multiple micro-LEDs 12R and the multiple transfer through holes 117. After the baffle 113 is moved from the inside to the outside of the transfer cavity 11, the multiple transfer through holes 117 are not covered by the baffle 113. Therefore, a miniature light-emitting diode 12R can be moved from the inside to the outside of the transfer cavity 11 through any one of the transfer through holes 117.

[0062] In one embodiment, the mass transfer device 10 includes three transfer cavities: transfer cavity 11, transfer cavity 13, and transfer cavity 15. The three transfer cavities have identical structures, differing only in that multiple micro-LEDs within the same transfer cavity emit light of the same color, while micro-LEDs located in different transfer cavities emit light of different colors. Specifically, transfer cavity 11 accommodates multiple micro-LEDs 12R emitting a first color of light (e.g., red light), transfer cavity 13 accommodates multiple micro-LEDs 12G emitting a second color of light (e.g., green light), and transfer cavity 15 accommodates multiple micro-LEDs 12B emitting a third color of light (e.g., blue light). The micro-LEDs 12R, 12G, and 12B are of the same size. In other embodiments, the micro-LEDs 12R, 12G, and 12B are of different sizes. In this case, the sizes of multiple transfer vias on different transfer cavities are different, allowing micro-LEDs of different sizes to move from the inside to the outside of the transfer cavity through the transfer vias on the corresponding transfer cavities.

[0063] In one embodiment, the baffle 113 can be disposed in the opening 112 but not covering the bottom plate 115, so that the micro light-emitting diode 12R will not fall out of the transfer cavity 11 through the opening 112.

[0064] In one embodiment, the plurality of transfer vias 117 on the base plate 115 are arranged in a certain pattern, such that when the transfer cavity 11 transfers a plurality of miniature light-emitting diodes 12R onto an array substrate of a display panel, the plurality of transfer vias 117 correspond one-to-one with a plurality of capture holes on the array substrate used to carry the miniature light-emitting diodes 12R, thereby realizing the simultaneous transfer of a plurality of miniature light-emitting diodes 12R onto the array substrate. That is, the transfer cavity 11 can be configured to adjust the spacing between each transfer via 117 on the base plate 115 according to the spacing between the plurality of capture holes on the array substrate.

[0065] The mass transfer device 10 provided in this application embodiment accommodates multiple micro LEDs 12R by setting a transfer cavity 11, and provides multiple transfer through holes 117 on the base plate 115. This allows multiple micro LEDs 12R to move simultaneously from the inside to the outside of the transfer cavity 11 through the transfer through holes 117, thereby achieving mass transfer of the micro LEDs 12R. By setting a transfer cavity 13 to accommodate multiple micro LEDs 12G and a transfer cavity 15 to accommodate multiple micro LEDs 12B, micro LEDs 12R, 12G, and 12B that emit light of different colors can be mass-transferred.

[0066] Please see Figure 3 This application embodiment also provides a mass transfer system 100, which includes the mass transfer device 10 described above, and an array substrate 30 for mounting micro light-emitting diodes. The array substrate 30 is provided with a plurality of trapping holes 31 arranged in an array, and the array substrate 30 is movably disposed on the side of the base plate 115 away from the cavity wall 111.

[0067] In one embodiment, each transfer via 117 on the transfer cavity 11 can be aligned with a collection aperture 31, allowing multiple miniature light-emitting diodes 12R in the transfer cavity 11 to simultaneously pass through multiple transfer vias 117 and fall into multiple collection apertures 31. Specifically, each transfer via 117 is aligned with a collection aperture 31, and a miniature light-emitting diode 12R can pass through any one of the transfer vias 117 and fall into the corresponding collection aperture 31. Each collection aperture 31 is used to accommodate one miniature light-emitting diode 12R.

[0068] In one embodiment, by moving the array substrate 30, multiple unfilled trapping holes 31 on the array substrate 30 can be aligned with a transfer via 117, thereby allowing the micro-LEDs 12R to continue falling into the trapping holes 31 through the transfer via 117. Specifically, in this embodiment, the number of micro-LEDs 12Rs accommodated in the transfer cavity 11 is greater than the number of trapping holes 31, and the number of trapping holes 31 is greater than the number of transfer vias 117. When each transfer via 117 is aligned with a trapping hole 31, the trapping hole 31 aligned with the transfer via 117 is filled with micro-LEDs 12R. At this time, the array substrate 30 also includes some trapping holes 31 that are not filled with micro-LEDs 12R. By moving the array substrate 30, the unfilled trapping holes 31 can be aligned with the transfer via 117, thereby allowing the micro-LEDs 12R to fall into the trapping holes 31 through the transfer via 117. In other embodiments, the number of trapping apertures 31 may also be equal to the number of transfer vias 117, such that when each transfer via 117 is aligned with a trapping aperture 31, all trapping apertures 31 can be filled by a micro light-emitting diode 12R.

[0069] In one embodiment, the array substrate 30 moves against the base plate 115 such that the micro LEDs 12R only fall out of the transfer cavity 11 when each transfer via 117 is aligned with an unfilled trapping aperture 31. Specifically, when the array substrate 30 moves against the base plate 115, the array substrate 30 can also be used to control the micro LEDs 12R from falling out of the transfer cavity 11. When the transfer via 117 is not aligned with a trapping aperture 31, the micro LEDs 12R cannot fall out through the transfer via 117 because the array substrate 30 is attached to the base plate 115. When the transfer via 117 is aligned with a trapping via 31, if the trapping via 31 is not filled, a miniature LED 12R will fall into the trapping via 117 through the transfer via 117. If the trapping via 31 is already filled with a miniature LED 12R, the miniature LED 12R will also be used to prevent the miniature LED 12R in the transfer cavity 11 from continuing to fall into the trapping via 117 through the transfer via 117, so that only one miniature LED 12R is filled in each trapping via 31.

[0070] In one embodiment, please refer to the following: Figure 3 and Figure 4The array substrate 30 has multiple trapping holes 31, including multiple trapping holes 31R, multiple trapping holes 31G, and multiple trapping holes 31B. Each trapping hole 31R is used to carry a miniature light-emitting diode 12R in the transfer cavity 11, each trapping hole 31G is used to carry a miniature light-emitting diode 12G in the transfer cavity 13, and each trapping hole 31B is used to carry a miniature light-emitting diode 12B in the transfer cavity 15. Specifically, the transfer cavities 11, 13, and 15 are arranged sequentially, and the array substrate 30 moves sequentially from the transfer cavity 11 to the transfer cavity 13 and the transfer cavity 15, so that each trapping hole 31 is filled with multiple miniature light-emitting diodes in the three transfer cavities.

[0071] In one embodiment, please refer to Figure 5 The miniature light-emitting diode 12R falls from the transfer through hole 117 into the collection hole position 31R by gravity. The miniature light-emitting diode 12R includes a light-emitting part 123 and two electrodes 121 disposed on opposite sides of the light-emitting part 123, such that when each miniature light-emitting diode 12R falls by gravity, one of the electrodes 121 contacts the bottom of the collection hole position 31R.

[0072] In one embodiment, please refer to Figure 6 Each micro-LED 12R has a first magnetic pole, and the mass transfer system 100 also includes a magnetic generator 33. The magnetic generator 33 is disposed on the side of the array substrate 30 away from the base plate 115, and is used to generate a magnetic field so that the first magnetic pole of each micro-LED 12R is attracted by the magnetic field, so that when each micro-LED 12R is transferred from the transfer via 117 to the trapping via 31R, the side with the first magnetic pole always faces the array substrate 30. Specifically, the magnetic generator 33 can be respectively disposed for each trapping via 31R, trapping via 31G and trapping via 31B, and the corresponding magnetic generator 33 is turned on when the array substrate 30 is transferred to different transfer cavities, so as to prevent the micro-LEDs from being attracted to the side of the base plate 115 away from the array substrate 30, which would affect the micro-LEDs falling out of the transfer via 117.

[0073] In one embodiment, the micro light-emitting diode 12R includes a light-emitting part 123 and an electrode 121, which is a first magnetic pole. Under the action of the magnetic force generator 33, the micro light-emitting diode 12R approaches the array substrate 30 with the electrode 121 facing the magnetic force generator 33, and thus falls into the trapping hole 31R through the transfer through hole 117.

[0074] In one embodiment, please refer to Figure 7The transfer cavities 11, 13, and 15 simultaneously fill multiple trapping holes 31 on the array substrate 30. That is, the array substrate 30 moves along the first direction X, causing the transfer vias 117R on transfer cavity 11, 117G on transfer cavity 13, and 117B on transfer cavity 15 to sequentially fill the trapping holes 31. This results in a multi-array arrangement of micro-LEDs 12R, 12G, and 12B on the array substrate 30, where micro-LEDs 12R emit red light, micro-LEDs 12G emit green light, and micro-LEDs 12B emit blue light. The mass transfer system 100 fabricates a display panel for displaying images by transferring micro-LEDs emitting three colors of light onto the array substrate 30. In other embodiments, after all micro-LEDs 12R have been transferred onto the array substrate 30, micro-LEDs 12G and 12B can be transferred sequentially; this application does not limit this.

[0075] In this embodiment, each miniature light-emitting diode (12R, 12G, 12B) serves as a light-emitting element of the display panel, corresponding to a sub-pixel of the display panel. That is, the display panel defines multiple arrayed sub-pixels, and each sub-pixel has a miniature light-emitting diode.

[0076] The mass transfer system 100 provided in this application embodiment, by setting a mass transfer device 10 and a movable array substrate 30, can transfer multiple micro light-emitting diodes in batches into multiple capture holes 31 on the array substrate 30. By setting the moving direction of the array substrate 30 and / or the arrangement direction of the transfer cavities 11, 13, 15, the multiple capture holes 31 can be filled with micro light-emitting diodes of different colors, thereby realizing the image display function.

[0077] Please see Figure 8 This application also provides a mass transfer method, which includes:

[0078] Step S1: Provide a mass transfer system, which includes at least one transfer cavity and at least one array substrate. The transfer cavity includes a cavity wall and a bottom plate connected to the cavity wall. The bottom plate has a plurality of transfer through holes arranged in an array. The array substrate has a plurality of collection holes arranged in an array.

[0079] Step S2: Place multiple miniature light-emitting diodes into each of the transfer cavities;

[0080] Step S3: Move the array substrate so that each of the transfer vias can be aligned with a capture via.

[0081] Step S4: Allow one of the micro LEDs to fall into the trapping hole through the transfer via;

[0082] Step S5: Continuously move the array substrate so that each of the capture holes on the array substrate is filled with a micro light-emitting diode.

[0083] In one embodiment, the mass transfer system in step S1 is the mass transfer system 100 in this application embodiment, which includes transfer cavities 11, 13 and 15 with the same structure. Taking transfer cavity 11 as an example, it also includes a baffle 113, which can move inside and outside the transfer cavity 11 through the opening 112 provided on the cavity wall 111.

[0084] In one embodiment, before step S2, the method further includes: moving the baffle 113 so that the base plate 115 is completely covered by the baffle 113, that is, each transfer through hole 117 is covered by the baffle 113. After step S2, the method further includes: removing the baffle 113 so that each transfer through hole 117 allows the micro LED 12R to pass through. That is, the baffle 113 is used to control whether the micro LED 12R can pass through the transfer through hole 117. When the micro LED 12R is started to be filled into the transfer cavity 11, the baffle 113 prevents the micro LED 12R from passing through the transfer through hole 117. After multiple micro LEDs 12R are placed, the baffle 113 is removed, so that multiple micro LEDs 12R can fall out of the transfer cavity 11 in batches through multiple transfer through holes 117. The baffle 113 can also be used to cover the opening 112 to prevent the micro LEDs 12R from falling out of the transfer cavity 11 from the opening 112.

[0085] In one embodiment, step S2 specifically involves placing multiple micro LEDs for emitting the same color of light into the same transfer cavity, and placing multiple micro LEDs for emitting different colors of light into different transfer cavities. That is, multiple micro LEDs 12R for emitting red light are placed into transfer cavity 11, multiple micro LEDs 12G for emitting green light are placed into transfer cavity 13, and multiple micro LEDs 12B for emitting blue light are placed into transfer cavity 15.

[0086] In one embodiment, step S4 specifically involves using gravity to make each micro LED fall into the collection hole 31. At this time, the structure of the micro LED includes a light-emitting part 123 and electrodes 121 disposed on opposite sides of the light-emitting part, so that when the micro LED falls into the collection hole 31 under the action of gravity, one electrode 121 will always contact the bottom of the collection hole.

[0087] In one embodiment, step S4 specifically involves providing a magnetic generator 33 on the side of the array substrate 30 away from the base plate 115 to generate a magnetic field. Each micro-LED has a first magnetic pole, and multiple micro-LEDs with the first magnetic pole fall into multiple collection holes 31 through multiple transfer vias 117 under the influence of the magnetic field. Specifically, under the influence of the magnetic field, the first magnetic pole experiences an attractive force, ensuring that when each micro-LED is transferred from the transfer via 117 to the collection hole 31, the side with the first magnetic pole always faces the array substrate 30.

[0088] In one embodiment, step S5 specifically involves attaching the array substrate 30 to the three transfer cavities sequentially or simultaneously, such that the multiple trapping holes 31 on the array substrate 30 are respectively filled by micro light-emitting diodes in the three transfer cavities for emitting different colors of light.

[0089] The mass transfer method provided in this application, by setting a transfer cavity including a base plate with multiple transfer vias, allows multiple micro-LEDs disposed within the transfer cavity to be transferred to the collection vias of an array substrate through the multiple transfer vias. This enables the mass transfer of multiple micro-LEDs onto the array substrate with high efficiency and low cost. By setting multiple transfer cavities, micro-LEDs of different colors can be disposed on the array substrate, thereby achieving image display.

[0090] Those skilled in the art should recognize that the above embodiments are only used to illustrate this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of this application fall within the scope of protection claimed in this application.

Claims

1. A mass transfer device, characterized in that, include: At least one transfer cavity, each of the transfer cavities being used to accommodate a plurality of micro light-emitting diodes, the transfer cavity including a cavity wall and a base plate connected to the cavity wall, the base plate having a plurality of transfer through holes arranged in an array, the transfer cavity being used to transfer the plurality of micro light-emitting diodes through the plurality of transfer through holes onto an array substrate of a display panel; The transfer cavity further includes a baffle, and the cavity wall has an opening. The baffle is detachably disposed in the transfer cavity through the opening and is used to control the multiple micro LEDs to pass through the multiple transfer through holes. The baffle is used to cover the base plate, thereby preventing communication between the multiple micro LEDs and the multiple transfer through holes.

2. The mass transfer device as described in claim 1, characterized in that, The mass transfer device includes three transfer cavities. Different transfer cavities are used to accommodate multiple micro LEDs that emit light of different colors. The same transfer cavity is used to accommodate multiple micro LEDs that emit the same color. Different transfer cavities are used to accommodate micro LEDs that emit light of different colors.

3. A mass transfer system, characterized in that, include: At least one transfer cavity, each of the transfer cavities being used to accommodate multiple micro light-emitting diodes, the transfer cavity including a cavity wall and a base plate connected to the cavity wall, the base plate having multiple transfer through holes arranged in an array; as well as An array substrate is provided with a plurality of collection holes arranged in an array, and the array substrate is movably disposed on the side of the base plate away from the cavity wall. When each of the transfer vias is aligned with a collection aperture, a micro LED can fall into a collection aperture through a transfer via; by moving the array substrate, each collection aperture on the array substrate can be filled by a micro LED. The transfer cavity further includes a baffle, and the cavity wall has an opening. The baffle is detachably disposed in the transfer cavity through the opening and is used to control the multiple micro LEDs to pass through the multiple transfer through holes. The baffle is used to cover the base plate, thereby preventing communication between the multiple micro LEDs and the multiple transfer through holes.

4. The mass transfer system as described in claim 3, characterized in that, The mass transfer system includes three transfer cavities. The plurality of micro LEDs in the same transfer cavity are used to emit light of the same color, and the micro LEDs located in different transfer cavities are used to emit light of different colors. The plurality of collection apertures are filled by the plurality of micro LEDs in the three transfer cavities.

5. The mass transfer system as described in claim 3, characterized in that, Each of the micro LEDs has a first magnetic pole, and the mass transfer system further includes a magnetic generator disposed on the side of the array substrate away from the base plate, for generating a magnetic field so that the plurality of micro LEDs having the first magnetic pole fall into the plurality of collection holes through the plurality of transfer vias under the action of the magnetic field.

6. A mass transfer method, characterized in that, include: At least one transfer cavity is provided, each of the transfer cavities including a cavity wall and a bottom plate connected to the cavity wall, wherein a plurality of transfer through holes are arranged in an array on the bottom plate; An array substrate is provided, wherein the array substrate has a plurality of trapping holes arranged in an array; Multiple miniature light-emitting diodes are placed into each of the aforementioned transfer cavities; The array substrate is moved so that it fits against the base plate, and each of the transfer through holes can be aligned with a collection hole. A miniature light-emitting diode is allowed to fall into a collection aperture through a transfer via. The array substrate is continuously moved so that each of the trapping holes on the array substrate is filled with a micro light-emitting diode; The transfer cavity further includes a baffle, and an opening is provided on the cavity wall. The baffle is detachably disposed in the transfer cavity through the opening. Prior to the step of placing multiple micro-light-emitting diodes into each of the transfer cavities, the method further includes: Move the baffle so that the bottom plate is completely covered by the baffle; After the step of placing a plurality of miniature light-emitting diodes into each of the transfer cavities, the method further includes: Remove the baffle so that each of the transfer through holes can allow the miniature light-emitting diode to pass through.

7. The mass transfer method as described in claim 6, characterized in that, The step of providing at least one transfer cavity includes: providing three of the transfer cavities; The step of placing multiple micro light-emitting diodes into each of the transfer cavities includes: placing multiple micro light-emitting diodes for emitting the same color of light into the same transfer cavity, and placing multiple micro light-emitting diodes for emitting different colors of light into different transfer cavities; The step of continuously moving the array substrate includes making the array substrate sequentially or simultaneously attach to the three transfer cavities, such that the plurality of trapping apertures are respectively filled by the plurality of micro light-emitting diodes in the three transfer cavities.

8. The mass transfer method as described in claim 6, characterized in that, Each of the aforementioned micro-light-emitting diodes has a first magnetic pole. The step of causing the micro-light-emitting diodes to fall into the trapping holes through the transfer vias includes: providing a magnetic generator on the side of the array substrate away from the base plate to generate a magnetic field, such that the plurality of micro-light-emitting diodes having the first magnetic poles fall into the plurality of trapping holes through the plurality of transfer vias under the action of the magnetic field.

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