A vibration sound-generating device and sound-generating system

Abstract

This invention provides a vibration-generating device and system. The device includes a coil, a magnetic circuit system, and two springs. The magnetic circuit system and the coil interact with each other due to the magnetic field generated by a changing current, thus producing vibration. The two springs are respectively positioned at both ends of the magnetic circuit system to control its vibration amplitude. Specifically, the springs have an asymmetrically arranged hollow structure, which effectively avoids strong resonance caused by modal degeneracy during vibration, improving the low-frequency performance of the device. Furthermore, the asymmetrical hollow structure of the springs effectively suppresses the vibration amplitude of each mode, reducing fluctuations in the frequency response curve caused by anti-phase vibration, resulting in a flatter frequency response and higher high-frequency bandwidth, thus improving the mid-to-high frequency performance of the device.

Description

Technical Field

[0001] This invention relates to the field of electroacoustic equipment technology, specifically to a vibration sound-generating device and a sound-generating system. Background Technology

[0002] With the widespread adoption of the internet and mobile communications, people commonly use consumer electronics such as mobile phones, tablets, laptops, and televisions in their daily work, production, and life. In recent years, these products have adopted larger screens and thinner designs, and their limited space can only accommodate thinner and smaller speaker modules. The smaller speaker modules result in a significantly lower overall audio playback bandwidth compared to traditional audio products, especially in terms of low-frequency performance. Summary of the Invention

[0003] In view of this, the purpose of the present invention is to provide a vibration sound generating device and a sound generating system. The vibration sound generating device effectively separates the intrinsic vibration of the low-frequency band of the vibration sound generating device from other vibration modes by setting a spring with an asymmetrical hollow structure, thereby avoiding strong resonance caused by modal degeneracy and improving the low-frequency performance of the overall structure.

[0004] In a first aspect, embodiments of the present invention provide a vibration-generating sound device, the vibration-generating sound device comprising:

[0005] A coil is disposed inside the vibration sound-generating device;

[0006] A magnetic circuit system includes a magnetic structure disposed inside the coil and a magnetically conductive structure that surrounds the coil and the magnetic structure, wherein the magnetically conductive structure has support portions on both sides near the opening of the coil;

[0007] Two spring pieces are respectively disposed at both ends of the coil opening. Each spring piece includes a first connecting part that abuts against the support part, a second connecting part that is sleeved on the outside of the first connecting part, and an elastic part disposed between the first connecting part and the second connecting part. The elastic part is an asymmetrically arranged hollow structure.

[0008] Furthermore, the elastic portion includes a plurality of elastic elements that are respectively connected to the first connecting portion and the second connecting portion, and the elastic element has at least one bending structure.

[0009] Furthermore, the cross-sectional areas of the first segment of the elastic member connected to the first connecting portion and the second segment connected to the second connecting portion are not equal.

[0010] Furthermore, the spring sheet comprises at least two layers of metal material and at least one layer of polymer material, wherein the outermost layer of the spring sheet is entirely composed of the metal material;

[0011] Alternatively, the spring sheet may comprise a blended composite material;

[0012] Alternatively, the spring may comprise a polymer plastic.

[0013] Furthermore, the vibration-generating sound device includes:

[0014] The two coils are spaced apart from each other, and the lead electrodes of the two coils are independent of each other;

[0015] Two circuit boards are respectively disposed between the two coils, and the two circuit boards are connected to the lead electrodes of the two coils in a one-to-one correspondence.

[0016] Furthermore, the magnetic conductive structure also includes a cylindrical outer magnetic conductive frame surrounding the outside of the coil. The outer magnetic conductive frame includes an outer frame that wraps around the outside of the coil and a support end that protrudes between the two coils. The outer frame has a positioning port for positioning the circuit board, and the positioning port is located on the side of the outer frame near the support end.

[0017] Furthermore, the outer frame includes a first frame and a second frame, and the first frame and / or the second frame are provided with a stepped structure forming the positioning port near the support end. The first frame and the second frame are connected by a mutually cooperating connection structure.

[0018] Furthermore, the magnetically conductive structure includes an inner magnetically conductive frame and a magnetically conductive plate. The magnetically conductive plate, in conjunction with the inner magnetically conductive frame, encloses the magnetic structure and the coil. At least one counterweight is provided on the side of the inner magnetically conductive frame away from the coil.

[0019] Furthermore, the vibration sound-generating device also includes a buffer structure disposed on one side of the counterweight.

[0020] Secondly, embodiments of the present invention also provide a sound-generating system, the sound-generating system comprising:

[0021] The vibration-generating sound device as described in the first aspect;

[0022] The vibration guide plate is connected to the vibration sound-generating device and the object to be excited, respectively.

[0023] This invention provides a vibration-generating sound device and system. The vibration-generating sound device includes a coil, a magnetic circuit system, and two springs. The magnetic circuit system and the coil interact with each other due to the magnetic field generated by the changing current, thereby producing vibration. The two springs are respectively disposed at both ends of the magnetic circuit system to control its vibration amplitude. Specifically, the springs have an asymmetrical hollow structure, which effectively avoids strong resonance caused by modal degeneracy during vibration, thus improving the low-frequency performance of the vibration-generating sound device. In addition, the springs with asymmetrical hollow structures can effectively suppress the vibration amplitude of each mode, reduce the fluctuations on the frequency response curve caused by anti-phase vibration, obtain a flatter frequency response and high-frequency bandwidth, and improve the mid-to-high frequency performance of the vibration-generating sound device. Attached Figure Description

[0024] The above and other objects, features and advantages of the present invention will become clearer from the following description of embodiments of the invention with reference to the accompanying drawings, in which:

[0025] Figure 1 This is an exploded schematic diagram of the vibration sound-generating device provided in an embodiment of the present invention;

[0026] Figure 2 This is a schematic diagram of the spring displacement under the working state of the sound generation system provided in the embodiment of the present invention;

[0027] Figure 3 This is a three-dimensional structural diagram of the sound-generating system provided in an embodiment of the present invention;

[0028] Figure 4 This is a top view of the spring sheet provided in Embodiment 1 of the present invention;

[0029] Figure 5 This is a top view of the spring sheet provided in Embodiment 2 of the present invention;

[0030] Figure 6 This is a top view of the spring sheet provided in Embodiment 3 of the present invention;

[0031] Figure 7 This is a cross-sectional view of the vibration sound-generating device provided in an embodiment of the present invention;

[0032] Figure 8 This is a cross-sectional view of the outer magnetic frame for setting the coil provided in an embodiment of the present invention;

[0033] Figure 9 This is a top view of the external magnetic guide frame provided in an embodiment of the present invention;

[0034] Figure 10 This is a three-dimensional structural schematic diagram of the first frame provided in an embodiment of the present invention;

[0035] Figure 11 This is a three-dimensional structural diagram of the second frame provided in an embodiment of the present invention;

[0036] Figure 12 This is a top view of the external magnetic frame and circuit board provided in an embodiment of the present invention;

[0037] Figure 13 This is a top view of the circuit board provided in an embodiment of the present invention;

[0038] Figure 14 This is a top view of the circuit board and coil provided in an embodiment of the present invention;

[0039] Figure 15 This is a cross-sectional view of the magnetic circuit system provided in Embodiment 1 of the present invention;

[0040] Figure 16 This is a cross-sectional view of the magnetic circuit system provided in Embodiment 2 of the present invention;

[0041] Figure 17 This is a cross-sectional view of the magnetic circuit system provided in Embodiment 3 of the present invention;

[0042] Figure 18 This is a top view of the vibration guide plate provided in an embodiment of the present invention;

[0043] Figure 19 This is a side view of the sound-generating system provided in Embodiment 1 of the present invention;

[0044] Figure 20 This is a side view of the sound-generating system provided in Embodiment 2 of the present invention;

[0045] Figure 21 This is a side view of the sound-generating system provided in Embodiment 3 of the present invention;

[0046] Figure 22 This is a side view of the sound-generating system provided in Embodiment 4 of the present invention;

[0047] Figure 23 This is a schematic diagram of the sound generation system provided in an embodiment of the present invention;

[0048] Figure 24 This is a schematic diagram of the first application of the sound-generating system provided in this embodiment of the invention;

[0049] Figure 25 This is a schematic diagram of a second application of the sound-generating system provided in an embodiment of the present invention.

[0050] Explanation of reference numerals in the attached figures:

[0051] 1-Coil;

[0052] 2-Magnetic circuit system; 21-Magnetic structure; 21a-Central magnetic structure; 21b-Ring magnetic structure; 22-Magnetic guiding structure; 23-Supporting part;

[0053] 3-Spring; 31-First connecting part; 32-Second connecting part; 33-Elastic part; 331a-First elastic element; 331b-Second elastic element; 331c-Third elastic element; 331d-Fourth elastic element; 331e-Fifth elastic element; 331f-Sixth elastic element; 331g-Seventh elastic element; 331h-Eighth elastic element; 331i-Ninth elastic element; 331j-Tenth elastic element; 332-Bending structure; 34-Cover plate;

[0054] 4-Circuit board; 4a-External lead-out section; 4b-Internal lead-out section; 41-First electrode; 42-Second electrode; 43-Third electrode; 44-Fourth electrode; 45-Fifth electrode; 46-Sixth electrode; 47-Seventh electrode; 48-Eighth electrode;

[0055] 5-Outer magnetic frame; 51-Outer frame; 511-Positioning port; 512-First frame; 513-Second frame; 513a-First support plate; 513b-Second support plate; 513c-Third support plate; 514-Step structure; 515a-First connecting structure; 515b-Second connecting structure; 52-Support end;

[0056] 61-Magnetic plate; 62-Inner magnetic frame; 71-Counterweight; 72-Buffer structure;

[0057] 8-Vibration guide plate; 81-Insulating section; 82-Conductor section; 83-Connecting section; 84-Inner ring; 85-Vibration guide end; 86-Snap-fit ​​structure;

[0058] 9-Object to be excited; 10-Sound generation system; 101-Vibration sound generation device; 11-Circuit; 12-Feedback coil. Detailed Implementation

[0059] The present invention is described below based on embodiments, but the invention is not limited to these embodiments. In the detailed description of the invention below, certain specific details are described in detail. Those skilled in the art will fully understand the invention even without these details. To avoid obscuring the essence of the invention, well-known methods, processes, flows, elements, and circuits are not described in detail.

[0060] Furthermore, those skilled in the art should understand that the accompanying drawings provided herein are for illustrative purposes only and are not necessarily drawn to scale.

[0061] Unless the context explicitly requires it, words such as "including" or "contains" in the specification should be interpreted as including rather than exclusive or exhaustive; that is, meaning "including but not limited to".

[0062] In the description of this invention, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0063] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in the invention according to the specific circumstances.

[0064] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0065] Figure 1 This is an exploded view of the vibration sound-generating device provided in an embodiment of the present invention. The vibration sound-generating device 101 includes a coil 1, a magnetic circuit system 2, and two spring pieces 3. The magnetic circuit system 2 is partially disposed inside the coil 1, and the two spring pieces 3 are respectively disposed at the two ends of the magnetic circuit system 2 that are not covered by the coil 1. The other side of the spring piece 3 is connected to the object to be excited 9 through a cover plate 34 and a vibration guide plate 8. When the magnetic circuit system 2 moves relative to the coil 1, the spring piece 3 moves accordingly and excites the object to be excited 9 to produce mechanical vibration, thereby causing the object to be excited 9 to vibrate and produce sound.

[0066] Furthermore, the magnetic circuit system 2 includes a magnetic structure 21 movably disposed inside the coil 1. In this embodiment, the magnetic structure 21 is a permanent magnet, such as neodymium iron boron material. The permanent magnet generates magnetic field lines in directions close to and away from the coil 1. The magnetic circuit system 2 also includes a magnetically conductive structure 22 that surrounds the coil 1 and the magnetic structure 21.

[0067] The magnetic guiding structure 22 consists of a cylindrical outer magnetic guiding frame 5 disposed outside the coil 1 and magnetic guiding plates 61 disposed at the openings on both sides of the outer magnetic guiding frame 5. The magnetic guiding plates 61 are attached to both ends of the magnetic structure 21 near the spring sheet 3. The magnetic guiding plates 61 are used to close the magnetic lines of force extending in the direction of the magnetic guiding plates 61 and away from the direction of the coil 1, thereby enhancing the magnetic field strength inside the magnetic circuit system 2 and reducing magnetic field interference to other surrounding devices. The two magnetic guiding plates 61 and the magnetic structure 21 constitute a central magnetic circuit structure. The coil 1 around this central magnetic circuit structure generates a magnetic field due to internal energization. The central magnetic circuit structure moves up and down under the drive of the magnetic field force. In this embodiment, the magnetic guiding plates 61 are made of SPCC material (Steel Plate Cold Common). The magnetic guiding plates 61 and the magnetic guiding structure 22 are bonded together with adhesive to form the central part of the magnetic circuit system 2. The outer magnetically conductive frame 5 is used to enclose the magnetic field lines extending towards the outer magnetically conductive frame 5 and away from the coil 1, so that the magnetic flux concentrated on the coil 1 is maximized and a uniform magnetic field is provided for the coil 1. In this embodiment, the outer magnetically conductive frame 5 is a hollow prism with rounded corners between its various sides. The magnetically conductive plate 61 and the magnetic structure 21 are cubes with rounded corners on their sides. A magnetic gap is formed between the outer magnetically conductive frame 5 and the magnetically conductive plate 61 to accommodate the magnetic structure 21. Since the magnetic gap region is more uniform and the generated magnetic field force is more stable when the gap is closer to an annular shape, in some embodiments, the outer magnetically conductive frame 5 is a cylindrical structure, and the magnetically conductive plate 61 and the magnetic structure 21 are cylinders with different thicknesses.

[0068] like Figure 1 As shown, the magnetic plate 61 has a support portion 23 protruding towards the spring piece 3, and the spring piece 3 has a first connecting portion 31 that abuts against the support portion 23. The support portion 23 is a hollow structure that matches the shape of the first connecting portion 31, thereby increasing the contact area with the first connecting portion 31 while reducing the weight of the magnetic plate 61. In this embodiment, both the support portion 23 and the first connecting portion 31 are rectangular rings with rounded corners, and the first connecting portion 31 is glued to the support portion 23 or laser-welded. The spring piece 3 and the central magnetic circuit structure are connected to form a vibration system. The central magnetic circuit structure generates a tendency to move in the magnetic field provided by the coil 1, and the spring piece 3 assists the central magnetic circuit structure to move up and down through its own elasticity. The support portion 23 increases the distance between the spring piece 3 and the central magnetic circuit structure, that is, it increases the distance between the spring piece 3 and the part of the magnetic plate 61 that is in contact with the magnetic structure 21, thereby increasing the deformation space and displacement distance of the spring piece 3. Figure 2 This is a schematic diagram of the displacement of the spring sheet in the working state of the sound-generating system provided in this embodiment of the invention. The shaded area in the diagram represents the deformation displacement of the spring sheet 3 when the vibration system moves closer to the object to be excited 9 (the spring sheet 3 includes an asymmetrically arranged hollow structure, and the hollow part cannot be cut through in this cross-sectional view, hence the discontinuous shaded area in the diagram). Figure 2As shown, at this time, the central magnetic circuit structure moves closer to the object to be excited 9, the spring 3 deforms and controls the vibration amplitude of the central magnetic circuit structure, ensuring that the central magnetic circuit structure will not collide with and be damaged by the object to be excited 9 while the whole device is making a sound.

[0069] Figure 3 This is a three-dimensional structural diagram of the sound-generating system provided in an embodiment of the present invention. The spring 3 includes a first connecting portion 31 that abuts against the support portion 23, a second connecting portion 32 sleeved on the outside of the first connecting portion 31, and an elastic portion 33 disposed between the first connecting portion 31 and the second connecting portion 32. In this embodiment, the first connecting portion 31 and the second connecting portion 32 are concentrically arranged structures with the same shape. Specifically, both the first connecting portion 31 and the second connecting portion 32 are hollow rectangles with rounded corners. In some embodiments, the first connecting portion 31 and the second connecting portion 32 are structures with different shapes. For example, the first connecting portion 31 is a solid rectangle, and the second connecting portion 32 is a ring.

[0070] Furthermore, the elastic portion 33 is an asymmetrically arranged hollow structure, and includes multiple elastic elements 331 that respectively connect the first connecting portion 31 and the second connecting portion 32. In this embodiment, the elastic elements 331a, 331b, 331c, 331d, 331e, 331f, 331g, 331h, 331i, and 331j each have at least one bending structure 332, thereby having better mechanical properties to improve the vibration modes of the central magnetic circuit structure. The elastic elements 331 in the elastic portion 33 are asymmetrical or non-uniform width structures, thereby effectively separating the intrinsic vibration modes in the low-frequency band of the overall vibration sound generating device 101 and avoiding strong resonance caused by modal degeneracy. In addition, due to the asymmetrical structure of the elastic portion 33, the vibration amplitude of each mode in the mid-to-high frequency band can be effectively suppressed, reducing the fluctuations on the sound pressure frequency response curve caused by anti-phase vibration, and obtaining a flatter sound pressure frequency response and high-frequency bandwidth.

[0071] Figure 4This is a top view of the spring sheet provided in Embodiment 1 of the present invention. The spring sheet 3 provided in Embodiment 1 of the present invention has three different and asymmetrical elastic elements, and the cross-sectional area of ​​the three elastic elements is equal everywhere. The first elastic element 331a has three bending structures 332, and the bending directions of adjacent bending structures 332 are opposite. The first elastic element 331a extends obliquely from the middle part toward the first connecting part 31 and the second connecting part 32 respectively and bends in opposite directions. The side closer to the second connecting part 32 is connected to the second connecting part 32 after bending, and the side closer to the first connecting part 31 is bent again in the opposite direction of the first bending direction and connected to the first connecting part 31. The first side connection point, the second side connection point and the middle point are approximately located on the same straight line. The middle part of the second elastic element 331b is parallel to the adjacent side of the first connecting part 31 and the adjacent side of the second connecting part 32 respectively, and the two ends of the middle part are bent toward the first connecting part 31 and the second connecting part 32 in opposite directions respectively. The bending structure 332 facing the first connecting portion 31 is an arc-shaped bend, and the bending structure 332 facing the second connecting portion 32 is an acute angle, meaning that the bending structure 332 has a rotation angle greater than 90° relative to the middle. The middle of the third elastic member 331c is an arc, and the chord of the arc is approximately parallel to the adjacent side of the first connecting portion 31 and the adjacent side of the second connecting portion 32, respectively. Two bending structures 332 with opposite bending directions are located at each end of the middle portion. The bending angle of the bending structure 332 facing the second connecting portion 32 relative to the middle is an acute angle, and the end of this bending structure 332 connects to the rounded corner of the second connecting portion 32. The bending structure 332 facing the first connecting portion 31 has a bend greater than 90° relative to the middle, followed by a bend in the opposite direction, and finally its end is perpendicular to and connected to the adjacent side of the first connecting portion 31. The two ends of the first elastic member 331a, the second elastic member 331b and the third elastic member 331c are respectively connected to the three adjacent sides of the first connecting part 31 and the second connecting part 32.

[0072] Figure 5 This is a top view of the spring sheet provided in Embodiment 2 of the present invention. The elastic portion 33 of the spring sheet 3 provided in Embodiment 2 of the present invention has three different elastic elements, and the cross-sectional area of ​​the three elastic elements gradually decreases from the side near the second connecting portion 32 to the side near the first connecting portion 31. The fourth elastic element 331d has the same bending structure 332 distribution as the first elastic element 331a, and the two differ only in a local cross-sectional area. The fifth elastic element 331e has a shape approximately the same as the second elastic element 331b, and the two differ only in a local cross-sectional area. The sixth elastic element 331f and the third elastic element 331c correspond to each other, and the two differ only in a local cross-sectional area. In some embodiments, the cross-sectional area of ​​the elastic element gradually increases from the side near the second connecting portion 32 to the side near the first connecting portion 31, or the cross-sectional area at the middle of the elastic element is greater than or less than the cross-sectional area at the end of the elastic element.

[0073] Figure 6 This is a top view of the spring sheet provided in Embodiment 3 of the present invention. The elastic part 33 provided in Embodiment 3 has four different elastic elements, and the cross-sectional area of ​​the four elastic elements gradually decreases from the side near the second connecting part 32 to the side near the first connecting part 31. The seventh elastic element 331g has four bending structures 332, and adjacent bending structures 332 have opposite bending directions. The cross-sectional area of ​​the seventh elastic element 331g gradually decreases as the distance from the first connecting part 31 decreases. The eighth elastic element 331h has three bending structures 332, and the bending directions of adjacent bending structures 332 are opposite. One end of the eighth elastic element 331h is connected to the rounded corner of the first connecting part 31, and the cross-sectional width of the eighth elastic element 331h increases as the distance from this connection point increases. The ninth elastic element 331i has the same structure as the fifth elastic element 331e, and the tenth elastic element 331j has the same structure as the sixth elastic element 331f.

[0074] In this embodiment, the vibration sound-generating device 101 has two spring pieces 3. The two spring pieces 3 can have the same pattern or different patterns. For example, the spring piece 3 closer to the object to be excited 9 is the spring piece 3 of Embodiment 1, and the spring piece 3 farther away from the object to be excited 9 is the spring piece 3 of Embodiment 2. The two spring pieces 3 have different shapes, which can ensure that they have different resonant frequencies, thereby adjusting the mode of the overall vibration sound-generating device 101, reducing the mode degeneracy caused by the symmetrical structure, and thus avoiding the concentration of resonant modes and the aggravation of resonance. When the system requires better stability, it is preferable to use elastic elements with different cross-sectional widths, which can effectively improve the stability of the vibration system and reduce the resonant mode degeneracy. When spring pieces 3 with different patterns / structures are used, unstable modes of vibration (usually manifested as swaying / rocking / rolling) can be suppressed. The elastic element 331 in the same spring piece 3 can have bending structures 332 with different positions and sizes, and can have the same or different cross-sectional areas and cross-sectional area variation trends.

[0075] Furthermore, the spring 3 is made of composite material and has internal damping characteristics, which can effectively suppress the vibration amplitude near the resonance point. When the vibration sound generating device 101 drives the object to be excited 9, the sound generation bandwidth near the final resonance point can be effectively expanded. In addition, when the overall structure is subjected to external impact (drop impact), the spring 3, which is made of composite material, can more effectively absorb and suppress the amplitude generated by the impact, reducing the risk of stress damage to the structure.

[0076] In this embodiment, the spring piece 3 is made of a combination of metal and polymer materials, with the outermost layers on both sides being metal, thus giving the overall structure better damping characteristics. The metal material can be stainless steel, copper, or other metals, and the polymer material can be epoxy resin, plastic, polyurethane resin, silicone rubber, etc. The number of layers and the thickness of each layer of the spring piece 3 are adjusted according to the specific requirements of the vibration sound-generating device 101. Specifically, the spring piece 3 is a sandwich-type composite material made of two layers of metal with a layer of polymer material in between. The metal materials on both sides are 30μm thick SUS304 stainless steel, and the middle layer is a 40μm thick epoxy resin adhesive layer. The middle adhesive layer gives the overall structure greater internal damping, which can effectively reduce the resonance Q value (i.e., quality factor; a lower Q value indicates a faster rate of energy loss from the oscillator and a shorter vibration duration) of the vibration system. The middle adhesive layer absorbs the stress generated by the bending deformation of the spring piece 3, improving the fatigue resistance of the material and extending the life of the vibration sound-generating device 101. When manufacturing this type of spring clip 3, the epoxy resin of the middle layer is first applied to the bottom stainless steel coil, and then the upper stainless steel strip is unfolded and bonded to the epoxy resin of the middle layer. The three layers of materials are combined by a set of rollers with a gap of 100μm, and then enter the subsequent material punching process.

[0077] In some embodiments, the spring sheet 3 is made of a blended composite material, such as epoxy resin reinforced glass fiber board or epoxy resin reinforced carbon fiber board. The spring sheet 3 can also be made of polymer plastics, such as ABS (Acrylonitrilebutadiene Styrene copolymers), PET (Polyethylene Glycol Terephthalate), PEEK (Poly(Ether-Ether-Ketone), PE (Polyethylene), PC (Polycarbonate), POM (Polyoxymethylene), PBT (Polybutylene terephthalate), PPA (Polyphthalamide), LCP (Liquid Crystal Polymer), PU (Polyurethane), silicone rubber, etc.

[0078] The vibration sound-generating device 101 also includes a cover plate 34 connecting the outer magnetic frame 5 and the spring piece 3. The cover plate 34 is a hollow ring structure, with its outer shape matching the magnetic frame 5 and its inner shape matching the second connecting part 32. Figure 7This is a cross-sectional view of the vibration-generating device provided in an embodiment of the present invention. As shown in the figure, the spring piece 3 is located on the side of the outer magnetic frame 5 near the coil 1. The inner side of the cover plate 34 is connected to the second connecting part 32 of the spring piece 3, and the edge of the cover plate 34 is connected to the outer magnetic frame 5. Since the end of the outer magnetic frame 5 is close to the object to be excited 9, in order to ensure that the spring piece 3 has a large vibration space, the cover plate 34 includes a boss protruding into the spring piece 3. The boss matches the shape of the second connecting part 32, so that the spring piece 3 can be tightly connected to the cover plate 34 and set at the inner side of the outer magnetic frame 5. In this embodiment, the cover plate 34 and the outer magnetic frame 5 are bonded by adhesive, laser welding, or partial welding and partial adhesive bonding. The cover plate 34 and the second connecting part 32 are connected by adhesive.

[0079] The cover plate 34 is made of metal or polymer plastic, specifically stainless steel, copper alloy, PBT (polybutylene terephthalate), PPA (polyphthalamide), LCP (liquid crystal polymer), etc. In some embodiments, the cover plate 34 and the spring sheet 3 are integrally injection molded, which effectively reduces the number of parts, simplifies the assembly process, and increases the strength of the structure.

[0080] In this embodiment, the vibration sound-generating device 101 includes two coils 1 and two circuit boards 4 arranged in a one-to-one correspondence with the coils 1. For example... Figure 7 As shown, two coils 1 are spaced apart within the vibration sound-generating device 101, with one side of the coil 1 attached to the outer magnetic frame 5. The vibration system is located inside the coil 1. The lead electrodes of the two coils 1 are independent and soldered to corresponding circuit boards 4, thereby enabling independent control of the two coils 1 and making the vibration sound-generating device 101 more flexible in control. Furthermore, the circuit board 4 reduces the risk of the coil 1 lead sections being exposed to corrosion or impact breakage leading to open circuits, improving the reliability of the device.

[0081] Figure 8This is a cross-sectional view of the outer magnetic frame 5 for mounting coils provided in an embodiment of the present invention. The outer magnetic frame 5 includes an outer frame 51 that surrounds the outer side of the coil 1 and a support end 52 protruding between the two coils 1. The outer frame 51 and the support end 52 are manufactured using a stamping process, and the distance from the end of the outer frame 51 to the support surface of the support end 52 is equal to the height of the coil 1. The coil 1 is bonded to the outer frame 51 and / or the support end 52 using adhesive. When the coil moves, the outer magnetic frame 5 limits the coil 1 through adhesive force, and the support end 52, through its own structure, prevents the upper coil 1 from moving downward and the lower coil 1 from moving upward, thereby limiting the coil 1. The support end 52 can be structurally regarded as a horizontal rib, thereby effectively enhancing the strength of the outer frame 51. Thus, when the strength of the outer magnetic frame 5 remains unchanged, the thickness of the outer frame 51 can be reduced, thereby effectively increasing the window area (effective accommodating area of ​​the coil 1) for arranging the coils and increasing the number of turns of the coil 1. Taking a 50μm diameter copper wire coil 1 as an example, it can safely carry an instantaneous current of 0.5A. With the original magnetic gap design of 0.3mm (i.e., 300μm), due to the need to reserve a 0.1mm safety gap, coil 1 can only be configured with 4 layers (0.2mm / 50μm = 4 layers). However, by creating a 0.1mm indentation on the outer frame 51 metal, 2 more layers of wiring (0.1mm / 0.05mm = 2 layers) can be added, increasing the total length of coil 1 by 50%. Thus, while still ensuring a driving current of 0.5A, the increased length L of coil 1 enhances the driving force of coil 1 on the magnetic structure 21 (based on F = B * IL, where F is the Ampere force, B represents the magnetic induction intensity, I represents the current intensity through the straight conductor, and L represents the length of the straight conductor in the magnetic field). Furthermore, the longer coil 1 increases the electro-electric conversion efficiency of the vibration sound-generating device 101 (proportional to the length of coil 1), thereby increasing the vibration output of the vibration sound-generating device 101.

[0082] Furthermore, the support end 52 has a gap, thereby reducing the overall weight of the outer magnetic frame 5 while achieving the supporting function. Figure 9 This is a top view of the external magnetic frame provided in an embodiment of the present invention. Figure 9 The upper coil 1 is removed, leaving only the lower coil 1 located below the support end 52. As shown in the figure, the support end 52 is only located on opposite sides of the coil 1, and a gap is provided in the middle of each support end 52. Furthermore, the length S of the support end 52 is less than or equal to the thickness W of the coil 1, thereby further reducing the weight of the outer magnetic frame 5 while ensuring the supporting function.

[0083] like Figure 1As shown, a positioning port 511 for positioning the circuit board 4 is provided on the outer frame 51. The end of the circuit board 4 extends out of the positioning port 511 and connects with other devices. In this embodiment, the circuit board 4 is disposed between the support end 52 and the coil 1, and the positioning port 511 is disposed close to the support end 52, thereby facilitating the end of the circuit board 4 to extend out of the positioning port 511.

[0084] Furthermore, the outer magnetic frame 5 is formed by connecting and assembling the first and second outer magnetic frames. The ends of the magnetic frames are provided with support ends 52 or rely on their own structure to support the circuit board 4. During processing, the lower coil 1 is glued to the side wall of the second outer magnetic frame, and the circuit board 4, which is electrically connected to the lower coil 1, is placed at the end of the second outer magnetic frame. The first outer magnetic frame and the upper coil 1 are subjected to the same operation. Finally, the two outer magnetic frames are placed on both sides of the circuit board 4 and attached to each other to form the outer magnetic frame 5.

[0085] In this embodiment, the outer magnetic frame 5 is composed of a first frame 512 and a second frame 513. Figure 10 This is a three-dimensional structural diagram of the first frame provided in an embodiment of the present invention. A stepped structure 514 for forming a positioning opening 511 is provided at the end of the first frame 512. In this embodiment, the stepped structures 514 are symmetrically arranged on both sides of the first frame 512, so that positioning openings 511 can be formed on both sides to fix the circuit board 4. A first connecting structure 515a is provided on the opposite side of the stepped structure 514. The first connecting structure 515a includes a first protrusion and a first recess, which are arranged side-by-side at the end of the first frame 512. Figure 11 This is a three-dimensional structural diagram of the second frame provided in an embodiment of the present invention. The second frame 513 includes a first support plate 513a, a second support plate 513b, and a third support plate 513c connected in sequence. The first support plate 513a and the third support plate 513c have the same structure, with a second connecting structure 515b matching the shape of the first connecting structure 515a at one end, and the other end connected to one end of the second support plate 513b. The first support plate 513a is perpendicularly connected to the second support plate 513b, the third support plate 513c, and the second support plate 513b. The second connecting structure 515b has a second recess corresponding to the first protrusion of the first support plate 513a and a second protrusion corresponding to the first recess. The second protrusion and the second recess are arranged side by side at the ends of the first support plate 513a and the third support plate 513. When the first frame 512 and the second frame 513 are connected through the first connecting structure 515a and the second connecting structure 515b, they constitute an external magnetically conductive frame 5. In this embodiment, the first connecting structure 515a and the second connecting structure 515b are bonded together by adhesive, laser welding, or a combination of the two bonding technologies. Figure 12This is a top view of the external magnetic frame and circuit board provided in an embodiment of the present invention, with the end of the circuit board 4 aligned with the stepped structure 514. In some embodiments, the stepped structure 514 is disposed at both ends of the second support plate 513b.

[0086] Figure 13 This is a top view of the circuit board provided in an embodiment of the present invention. A single circuit board 4 is provided with four electrodes. The circuit board 4 includes a strip-shaped inner lead-out portion 4b disposed between the outer magnetically conductive frames 5 and an outer lead-out portion 4a extending out of the outer magnetically conductive frames 5. A first electrode 41 and a second electrode 42 are respectively disposed on the outer lead-out portion 4a, and a third electrode 43 and a fourth electrode 44 are respectively disposed on the inner lead-out portion 4b. The first electrode 41 and the third electrode 43 are positive electrodes, and the second electrode 42 and the fourth electrode 44 are negative electrodes. The first electrode 41 and the third electrode 43 are electrically connected, and the external positive lead-out portion is connected to the first electrode 41 to conduct electricity to the positive terminal of the coil 1. The second electrode 42 and the fourth electrode 44 are electrically connected, and the external negative lead-out portion is connected to the second electrode 42 to conduct electricity to the negative terminal of the coil 1. Thus, the lead-out portion of the coil 1 does not need to cross the coil to reach the outside of the coil 1, improving the space utilization of the coil 1. Furthermore, by simplifying the lead-out electrode structure of the coil 1, it effectively protects the wires in the coil 1 from fatigue breakage caused by stress concentration. The circuit board 4 is a PCB (Printed Circuit Board) or an FPC (Flexible Printed Circuit). In this embodiment, the coil 1 is bonded to the circuit board 4 with adhesive and conductive circuitry is achieved by soldering.

[0087] Figure 14 This is a top view of the circuit board and coil provided in this embodiment of the invention. The inner lead-out portion 4b of the circuit board 4 is a ring-shaped structure that matches the shape of the coil 1 and the outer magnetic frame 5. A feedback coil 12, concentric with the coil 1, is arranged inside the ring-shaped structure. The feedback coil 12 monitors the electrical signal generated by the relative motion between the coil 1 and the magnetic circuit system 2 cutting the magnetic field lines, and transmits the electrical signal to the circuit 11 for feedback closed-loop drive control. The inner lead-out portion 4b is sequentially provided with a third electrode 43 and a fourth electrode 44 for connecting the lead-out ends of the coil 1, and also provides a seventh electrode 47 and an eighth electrode 48 for connecting the lead-out ends of the feedback coil 12. The outer lead-out portion 4a is provided with a first electrode 41 and a second electrode 42 respectively connecting the third electrode 43 and the fourth electrode 44, and also provides a fifth electrode 45 and a sixth electrode 46 respectively connected to the seventh electrode 47 and the eighth electrode 48. External leads are connected to different electrodes to connect the coil 1 and the feedback coil 12. In this embodiment, the feedback coil 12 is directly printed on the circuit board 4. In some embodiments, the feedback coil 12 is an independently wound multi-turn coil that is glued to the circuit board 4.

[0088] Figure 15 This is a cross-sectional view of the magnetic circuit system provided in Embodiment 1 of the present invention. In this embodiment, the vibration sound-generating device 101 includes two magnetic structures 21 arranged sequentially. The magnetic guiding structure 22 also includes an inner magnetic guiding frame 62 that cooperates with the magnetic guiding plate 61 to wrap around the magnetic structure 21. The inner magnetic guiding frame 62 has receiving grooves on opposite sides for accommodating the magnetic structure 21. Two coils 1 are respectively sleeved on the outside of the two magnetic structures 21, and the two sets of coils 1 and magnetic structures 21 are respectively disposed in the two receiving grooves. The two magnetic guiding plates 61 are respectively disposed on the surfaces of the magnetic structure 21 that are not wrapped by the coils 1 and the inner magnetic guiding frame 62. The inner magnetic guiding frame 62 and the magnetic guiding plate 61 cooperate to close the magnetic lines of force extending away from the coils 1 of the magnetic structure 21, so that the magnetic flux concentrated on the coils 1 reaches its maximum.

[0089] Furthermore, a counterweight 71 is provided around the inner magnetically conductive frame 62. The counterweight 71 has a protrusion extending into the inner magnetically conductive frame 62, and the inner magnetically conductive frame 62 has a groove that matches the protrusion. The counterweight 71 uses a material with a density greater than 8 g / cm³. 3 Alloys, for example, with a density of 8.9 g / cm³. 3 Copper alloy or with a density of 16 g / cm³ 3 The tungsten alloy is used. This increases the overall weight of the vibration system without significantly changing its volume, thereby allowing the vibration sound-generating device 101 to output a larger vibration recoil force at the same amplitude.

[0090] Figure 16 This is a cross-sectional view of the magnetic circuit system provided in Embodiment 2 of the present invention. The magnetic circuit system 2 also includes a buffer structure 72. The buffer structure 72 is glued to the outer magnetic frame 5 or directly embedded in the surface of the outer magnetic frame 5 near the counterweight 71. The buffer structure 72 is a plastic or rubber block with a certain elasticity or buffering capacity. Therefore, when the vibration system is subjected to the lateral impact generated by the vibration sound generating device 101 falling, it can effectively prevent the coil 1 from being impacted and rubbed by the magnetic circuit system 2, especially the high-strength counterweight 71, thereby avoiding the risk of coil 1 being damaged or subsequently corroded and broken.

[0091] Figure 17This is a cross-sectional view of the magnetic circuit system provided in Embodiment 3 of the present invention. The magnetic structure 21 includes two central magnetic structures 21a arranged sequentially and annular magnetic structures 21b respectively sleeved outside the two central magnetic structures 21a. The outer central magnetic structures 21a and annular magnetic structures 21b form a magnetic gap for accommodating coils 1. In some embodiments, the annular magnetic structure 21b is a cylindrical structure and the central magnetic structure 21a is a cylinder, thereby having a more uniform and stable magnetic field. The two coils 1 are respectively arranged between the magnetic gap formed by the central magnetic structures 21a and the annular magnetic structures 21b. Furthermore, in this embodiment, the total volume of the magnetic structure 21 is larger, which can increase the magnetic induction intensity (B value) under the same magnetic gap. Since F = B * IL (F is the Ampere force, B represents the magnetic induction intensity, I represents the current intensity through the straight conductor, and L represents the length of the straight conductor in the magnetic field), the increase in magnetic induction intensity can also increase the vibration force output of the vibration sound generating device 101.

[0092] like Figure 17 As shown, in order to ensure that the total volume of the structure inside the outer magnetic frame 5 remains unchanged, the inner magnetic frame 62 is only a sheet-like structure disposed between the two sets of magnetic structures 21 and the coil 1. The inner magnetic frame 62 closes the magnetic lines of force extending from the two magnetic structures 21 in the opposite direction, so that the magnetic flux concentrated on the coil 1 around the magnetic structure 21 reaches the maximum, and provides a uniform magnetic field for the corresponding coil 1.

[0093] In some embodiments, the vibration sound-generating device 101 includes at least two spaced magnetic structures 21, and multiple magnetic structures 21 are arranged along the vibration direction within the vibration sound-generating device 101. Multiple magnetically conductive structures 22 and coils 1 sequentially surround the magnetic structures 21, and spring pieces 3 are arranged parallel to each other between adjacent magnetically conductive structures 22. That is, multiple spring pieces 3 divide adjacent magnetically conductive structures 22, so that spring pieces 3 are provided between each group of coils 1 and the magnetic circuit system 2.

[0094] This invention also provides a sound-generating system 10, which includes a vibration-generating device 101 and a guide plate 8 as described above. The guide plate 8 connects the vibration-generating device 101 and the object to be excited 9. The object to be excited 9 can be an OLED (Organic Light-Emitting Diode) display screen. The guide plate 8 includes an inner ring 84 that matches the shape of the cover plate 34 and a guide end 85 circumferentially disposed outside the inner ring 84. Figure 18 This is a top view of the vibration guide plate provided in this embodiment of the invention. The inner ring 84 is a hollow rectangular plate. The hollow part can further increase the movement range of the spring plate 3, thereby enabling the entire vibration system to have a larger maximum amplitude when moving towards the object to be excited 9. The vibration guide end 85 is a square plate disposed at the four corners of the inner ring 84.

[0095] In this embodiment, the thickness of the guide plate 8 is 0.02 mm to 1 mm, which is thinner than that of the vibration sound-generating device 101, thereby reducing the overall thickness and volume of the sound-generating system 10. The equivalent elastic modulus of the guide plate 8 is between 0.1 GPa and 200 GPa, which is lower than that of the hard material used on the surface of the vibration sound-generating device 101. As a result, the guide plate 8 can achieve better mechanical impedance matching, reduce damage to the display components during drop impacts, and provide appropriate mechanical damping to improve sound quality.

[0096] like Figure 2 As shown, the vibration guide plate 8 is connected to the vibration sound-generating device 101 via an inner ring 84. The inner ring 84 is bonded to the cover plate 34 using double-sided adhesive, hot melt adhesive, or glue, such as epoxy resin or UV (Ultraviolet Rays) adhesive. The vibration guide plate 8 is connected to the object to be excited 9 via a vibration guide end 85, which is also bonded to the object to be excited 9 using double-sided adhesive, hot melt adhesive, or glue, such as epoxy resin or UV (Ultraviolet Rays) adhesive. In some embodiments, there is a snap-fit ​​structure between the vibration guide plate 8 and the vibration sound-generating device 101 and / or the object to be excited 9. The vibration guide plate 8 is connected to the vibration sound-generating device 101 and / or the object to be excited 9 via structural snap-fit, or by using both adhesive and snap-fit.

[0097] Figure 19 This is a side view of the sound-generating system provided in Embodiment 1 of the present invention. The guide plate 8 is a planar structure, which is bonded to the vibration sound-generating device 101 by double-sided tape, hot melt adhesive or glue, such as epoxy resin UV (Ultraviolet Rays) glue.

[0098] Figure 20 This is a side view of the sound-generating system provided in Embodiment 2 of the present invention. The guide plate 8 includes a snap-fit ​​structure 86 protruding towards the vibration sound-generating device 101. The snap-fit ​​structure 86 matches a corresponding slot on the outer wall of the vibration sound-generating device 101, thereby connecting the guide plate 8 and the vibration sound-generating device 101. Furthermore, an adhesive structure using glue, double-sided tape, or hot melt adhesive can be added between the guide plate 8 and the vibration sound-generating device 101 to ensure the reliability of their connection by using two adhesive structures.

[0099] Figure 21This is a side view of the sound-generating system provided in Embodiment 3 of the present invention. The guide plate 8 also includes an insulating section 81 and a conductor section 82. The conductor section 82 is electrically connected to the coil 1 inside the vibration sound-generating device 101 and the circuit on the object to be excited 9, thereby connecting the object to be excited 9 and the vibration sound-generating device 101, simplifying the power supply and control of the vibration sound-generating device 101. The conductor section 82 can be a wire made of conductive metal. The guide plate 8 is made of metal or circuit board and plastic composite material using in-mold injection molding. The insulating section 81 and the conductor section 82 are combined to form a composite material, which helps to adjust the transmission of vibration, thereby improving the vibration mode of the object to be excited 9 and optimizing the sound it radiates. The conductor section 82 is generally disposed in the guide end 85. When the volume of the conductor section 82 increases, the volume of the guide end 85 also increases to accommodate the conductor section 82.

[0100] In some embodiments, conductor segment 82 can also be an FPC (Flexible Printed Circuit) or a PCB (Printed Circuit Board). Compared to a simple metal sheet, PCB and FCB have conductive rails, suitable rigidity (mechanical impedance characteristics), and a certain internal damping, which helps to improve the vibration coupling between the vibration generating device 101 and the object to be excited 9.

[0101] Figure 22 This is a side view of the sound-generating system provided in Embodiment 4 of the present invention. The conductor segment 82 is also bent and extended from the vibration guide end 85 to the snap-fit ​​structure 86. The end of the snap-fit ​​structure 86 near the vibrating sound-generating device 101 extends out of the electrode pad of the conductor segment 82. The pad can be connected to the circuit board 4 of the vibrating sound-generating device 101 by welding, which facilitates power supply and control signal provision to the vibrating sound-generating device 101.

[0102] Figure 23 This is a schematic diagram of a sound-generating system provided in an embodiment of the present invention. The sound-generating system 10 includes an object to be excited 9, a guide plate 8, and a vibration sound-generating device 101 connected in sequence. The sound-generating system 10 also includes a circuit 11 connected to the vibration sound-generating device 101. The circuit 11 provides a drive signal (excitation signal) to the vibration sound-generating device 101. The drive signal (excitation signal) is input to the coil 1 in parallel, series, or grouped independently. In addition, the feedback coil 12 senses the movement of the magnetic structure 21, cuts the electrical signal sensed by the coil 1, and transmits it to the circuit 11, thereby enabling the circuit 11 to perform drive control with a feedback closed loop. Furthermore, the circuit 11 collects electrical signals from any group of coils 1, and obtains the vibration intensity of the vibration sound-generating device 101 by processing the electrical signals, thus realizing closed-loop control.

[0103] Figure 24This is a schematic diagram of the first application of the sound-generating system provided in the embodiment of the present invention. The object to be excited 9 is the OLED display screen or glass shell of a mobile phone. The sound-generating system 10 is installed on one side of the object to be excited 9. The circuit 11 in the sound-generating system 10 is disposed outside other structures in the sound-generating system 10 and is connected to other structures through wires.

[0104] Figure 25 This is a schematic diagram of a second application of the sound-generating system provided in this embodiment of the invention, where the object to be excited, 9, is a smart pair of glasses. Specifically, the sound-generating system 10 is installed on the temple of the smart glasses to excite the temple to produce sound.

[0105] Furthermore, the sound-generating system 10 provided by the embodiments of the present invention includes, but is not limited to, the following types of devices that generate sound by vibrating the display screen: mobile phones, tablets, laptops, computer monitors and televisions, car displays, security system displays; it also includes, but is not limited to, the following devices that generate sound by vibrating the device casing: mobile phone back covers, mobile phone protective cases, tablet back covers, tablet protective cases, smart speaker back covers, speaker bases, car dashboards; and it also includes, but is not limited to, the following electronic devices that generate sound by vibrating the device structure: smart glasses brackets, safety helmets.

[0106] This invention provides a vibration-generating sound device and system. The vibration-generating sound device includes a coil, a magnetic circuit system, and two springs. The magnetic circuit system and the coil interact with each other due to the magnetic field generated by a changing current, thereby producing vibration. The two springs are respectively disposed at both ends of the magnetic circuit system to control its vibration amplitude. Specifically, the springs have an asymmetrically arranged hollow structure, which effectively avoids strong resonance caused by modal degeneracy during vibration, thus improving the low-frequency performance of the vibration-generating sound device. In addition, the springs with asymmetrical hollow structures can effectively suppress the vibration amplitude of each mode, reduce the fluctuations on the sound pressure frequency response curve caused by anti-phase vibration, obtain a flatter sound pressure frequency response and high-frequency bandwidth, and improve the mid-to-high frequency performance of the vibration-generating sound device.

[0107] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. For those skilled in the art, the present invention can be modified and varied in various ways. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of the present invention should be included within the scope of protection of the present invention.

Claims

1. A vibration-generating sound device, characterized in that, The vibration sound-generating device (101) includes: A coil (1) is disposed inside the vibration sound-generating device (101); The magnetic circuit system (2) includes a magnetic structure (21) disposed inside the coil (1) and a magnetically conductive structure (22) that surrounds the coil (1) and the magnetic structure (21). The magnetically conductive structure (22) has support portions (23) on both sides near the opening of the coil (1). Two spring pieces (3) are respectively disposed at both ends of the opening of the coil (1). Each spring piece (3) includes a first connecting part (31) that abuts against the support part (23), a second connecting part (32) sleeved on the outside of the first connecting part (31), and an elastic part (33) disposed between the first connecting part (31) and the second connecting part (32). The elastic part (33) is an asymmetrical hollow structure. The elastic part (33) includes a plurality of elastic elements (331a, 331b, 331c, 331d, 331e, 331f, 331g, 331h, 331i, 331j) respectively connecting the first connecting part (31) and the second connecting part (32). Each elastic element (331a, 331b, 331c, 331d, 331e, 331f, 331g, 331h, 331i, 331j) has at least one bending structure (332). The elastic elements (331a, 331b, 331c, 331d, 331e, 331f, 331g, 331h, 331i, 331j) are asymmetrical or non-equal width structures, and the bending directions of adjacent bending structures (332) are opposite. The bending structures (332) of different elastic elements (331a, 331b, 331c, 331d, 331e, 331f, 331g, 331h, 331i, 331j) have different positions and different sizes.

2. The vibration-generating sound device according to claim 1, characterized in that, The cross-sectional areas of the first segment of the elastic element (331a, 331b, 331c, 331d, 331e, 331f, 331g, 331h, 331i, 331j) connected to the first connecting part (31) and the second segment connected to the second connecting part (32) are not equal.

3. The vibration-generating sound device according to claim 1, characterized in that, The spring (3) comprises at least two layers of metal material and at least one layer of polymer material, wherein the outermost layer of the spring (3) is the metal material; Alternatively, the spring (3) may comprise a blended composite material; Alternatively, the spring (3) may comprise a polymer plastic.

4. The vibration-generating sound device according to claim 1, characterized in that, The vibration sound-generating device (101) includes: Two coils (1) are arranged at intervals between each other, and the lead electrodes of the two coils (1) are independent of each other; Two circuit boards (4) are respectively disposed between the two coils (1), and the two circuit boards (4) are connected to the lead electrodes of the two coils (1) in a one-to-one correspondence.

5. The vibration-generating sound device according to claim 4, characterized in that, The magnetic conductive structure (22) also includes a cylindrical outer magnetic conductive frame (5) arranged around the outside of the coil (1). The outer magnetic conductive frame (5) includes an outer frame (51) that wraps around the outside of the coil (1) and a support end (52) protruding between the two coils (1). The outer frame (51) has a positioning port (511) for positioning the circuit board (4). The positioning port (511) is located on the side of the outer frame (51) near the support end (52).

6. The vibration-generating sound device according to claim 5, characterized in that, The outer frame (51) includes a first frame (512) and a second frame (513). The first frame (512) and / or the second frame (513) are provided with a stepped structure (514) forming the positioning port (511) near the support end (52). The first frame (512) and the second frame (513) are connected by a mutually cooperating connection structure.

7. The vibration-generating sound device according to claim 1, characterized in that, The magnetic structure (22) includes an inner magnetic frame (62) and a magnetic plate (61). The magnetic plate (61) cooperates with the inner magnetic frame (62) to wrap the magnetic structure (21) and the coil (1). At least one counterweight (71) is provided on the side of the inner magnetic frame (62) away from the coil (1).

8. The vibration-generating sound device according to claim 7, characterized in that, The vibration sound-generating device (101) also includes a buffer structure (72) disposed on one side of the counterweight (71).

9. A sound-generating system, characterized in that, The sound-generating system (10) includes: The vibration sound-generating device (101) as described in any one of claims 1-8; The vibration guide plate (8) is connected to the vibration sound generating device (101) and the object to be excited (9), respectively.

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