A wavy microchannel heat spreader with microneedle fin array

Abstract

The application discloses a wave micro-channel radiator with a micro needle fin array, which comprises a heat-conducting bottom plate and a heat-conducting cover plate, at least two vertical fins are fixedly connected to the upper portion of the heat-conducting bottom plate, the top of the fin is fixedly connected with the heat-conducting cover plate, two adjacent fins and the heat-conducting bottom plate and the heat-conducting cover plate connected therewith form an independent micro-channel heat transfer unit, and the two ends of the micro-channel heat transfer unit are respectively a working medium outlet and a working medium inlet; the micro-channel heat transfer unit comprises a micro needle fin array and a wave channel; when the micro needle fin array is fixedly arranged on the upper surface of the heat-conducting bottom plate and the lower surface of the heat-conducting cover plate, the opposite surfaces of the two adjacent fins are both in a wave shape, so that the wave channel is formed between the fins and the heat-conducting bottom plate and the heat-conducting cover plate; when the micro needle fin array is fixedly arranged on the side surface of the fin, the upper end surface of the heat-conducting bottom plate and the lower end surface of the heat-conducting cover plate are both provided with wave-shaped grooves, so that the wave channel is formed between the fins and the heat-conducting bottom plate and the heat-conducting cover plate, the heat dissipation efficiency is improved, and the thermal resistance and the flow resistance are reduced.

Description

Technical Field

[0001] The invention relates to an electronic device radiator, in particular to a wave microchannel radiator with a micro-needle fin array. Background Art

[0002] In recent years, with the rapid development of industries such as information technology, medicine, materials, and energy, and the widespread application of highly integrated microelectronic devices, modern nanometer manufacturing technologies, and micromachining technologies in engineering, the need for enhanced heat dissipation systems has become increasingly urgent. Furthermore, as the number of transistors per unit area continues to grow in line with Moore's Law and this trend is expected to continue, integrated circuits are moving towards higher density, smaller size, and higher integration. The resulting heat dissipation issues have become a significant constraint on the development of electronic products. The rapidly increasing total power of highly integrated electronic components has led to a significant increase in the applied heat flux per unit area. Each device has a specific operating temperature range. Exceeding the upper limit of this operating temperature range can reduce the reliability and safety of microelectronic systems, leading to their failure. The reliability of microelectronic systems is highly sensitive to temperature. Increases in operating temperature lead to an exponential increase in failure rates, with over 55% of electronic device failures occurring due to operating temperatures exceeding their rated values. Studies have shown that when the operating temperature of electronic components is between 70°C and 80°C, reliability decreases by 5% for every 1°C increase. Therefore, in order to control the operating temperature of electronic devices within the allowable range to ensure their safety and reliability, it has become an urgent problem to carry out reasonable heat dissipation design and adopt safe and effective cooling methods.

[0003] Given the continuous reduction in microelectronic device packaging size and the further improvement in system and component integration, resulting in a significant increase in heat flux, effective thermal management is crucial for the normal and stable operation of microelectronic devices and chips. Traditional cooling technologies cannot meet these requirements, which poses a huge challenge to the cooling needs of simple water-cooled microchannel heat sinks. In addition to the channel structure, the thermal performance of microchannel heat sinks is also limited by the thermal conductivity and specific heat of the working fluid. Therefore, the use of functional thermal fluids mixed with different substances or different phases of substances (solid / liquid / gas) for cooling is a very promising and effective heat transfer enhancement technology. Currently, as described by H. Inaba in the article entitled "New Challenge in Advanced Thermal Energy Transportation Using Functionally Thermal Fluids" (International Journal of Thermal Sciences, Vol. 39, pp. 991-1003, 2000), functional thermal fluids are mixtures of heat transfer media such as water and phase-change or non-phase-change substances such as paraffin. The article also introduces the classification, characteristics, and applications of functional thermal fluids. Although functional thermal fluids have increased flow resistance and frictional pressure drop compared to base fluids, their application in advanced thermal energy transportation and heat exchange systems still has significant advantages, providing attractive opportunities for thermal energy transportation and enhanced heat transfer in heat exchangers. Specifically, functional thermal fluids are cooling fluids created by adding micro- and nano-scale metal / non-metal / phase-change capsule particles to a base fluid. These primarily include nanofluids and phase-change microcapsule suspensions. Nanofluids are a new type of heat-conducting fluid characterized by uniformity, stability, and high thermal conductivity, achieved by dispersing nanoscale metal or non-metal particles into a base fluid through related technologies. Unlike nanofluids, phase-change microcapsule suspensions can absorb and release significant amounts of heat through the melting and solidification of the phase-change material within their shells without losing fluidity, while the wall material of the microcapsule particles ensures a certain degree of stability. Based on the latent heat effect of phase change and micro-mixing, functional thermal fluids utilize a greater effective specific heat capacity and thermal conductivity to enhance fluid heat transfer.

[0004] Furthermore, microchannels filled with porous materials enhance convective heat transfer by leveraging large surface contact areas and robust local fluid mixing, and are considered promising alternatives for high-heat-density applications. Porous structures primarily include sintered porous media, metal foams, nanorod arrays, and microfin arrays. Sintered porous media and metal foams, due to their inherent pore size limitations and to avoid potential pore clogging that can weaken heat transfer and increase flow resistance, impose high requirements on the particle size and volume fraction of micro- and nanoscale metal / non-metal / phase-change capsules. Microfin arrays, however, leverage their structural advantages to mitigate this conflict by simultaneously enhancing heat transfer and reducing flow resistance, thereby raising the threshold for micro- and nanoscale particle size and volume fraction in functional thermal fluids. However, the nearly parallel coolant streamlines in straight channel configurations lead to poor fluid mixing and a thicker thermal boundary layer. Furthermore, the regular coolant flow inevitably reduces heat transfer along the flow direction. It can be seen that under the background of the continuous improvement of the power density and integration of electronic components, it is necessary to further improve the radiator body using functional thermal fluid as the coolant to give full play to the cooling effect of the coolant, thereby improving the cooling performance of the microchannel radiator and reducing the thermal resistance and flow resistance. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the object of the present invention is to provide a wave microchannel heat sink with a micro-needle fin array to improve the heat dissipation efficiency of the heat sink and reduce thermal resistance and flow resistance.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A wave microchannel heat sink with a micro-needle fin array includes a heat-conducting base plate and a heat-conducting cover plate. At least two vertical fins are fixedly connected to the upper portion of the heat-conducting base plate. The tops of the fins are fixedly connected to the heat-conducting cover plate. Two adjacent fins and the heat-conducting base plate and heat-conducting cover plate connected thereto constitute an independent microchannel heat transfer unit. The two ends of the microchannel heat transfer unit are respectively a working fluid outlet and a working fluid inlet.

[0008] The microchannel heat transfer unit includes a micro-needle fin array and a wavy channel. When the micro-needle fin array is fixedly arranged on the upper surface of the heat-conducting base plate and the lower surface of the heat-conducting cover plate, the opposite surfaces of the two adjacent fins are wavy, so that a wavy channel for the circulation of functional thermal fluid is formed between them and the heat-conducting base plate and the heat-conducting cover plate; when the micro-needle fin array is fixedly arranged on the side surface of the fin, the upper end surface of the heat-conducting base plate and the lower end surface of the heat-conducting cover plate are both provided with wavy grooves, so that a wavy channel for the circulation of functional thermal fluid is formed between them and the fins.

[0009] Furthermore, the microneedle fin array includes a plurality of columns, and the cross-section of the columns is circular, square, diamond, triangular or polygonal.

[0010] Furthermore, the columns of the micro-needle fin array are evenly arranged on the upper surface of the heat-conducting base plate and the lower surface of the heat-conducting cover plate or the side surfaces of the fins, and the porosity of the micro-needle fin array is 0.27-0.9.

[0011] Furthermore, the columns of the microneedle fin array are arranged in a staggered pattern of alternating right triangles and inverted triangles, or right triangles and right triangles, in the same period as the waves of the wave channel, on the upper surface of the heat-conducting base plate and the lower surface of the heat-conducting cover plate or the side surface of the fin.

[0012] Furthermore, the columns of the microneedle fin array increase or decrease linearly or gradiently along the direction of the corrugated channel, so that they are arranged in sequence on the upper surface of the heat-conducting base plate and the lower surface of the heat-conducting cover plate or the side surface of the fin with a porosity of dense at the front and sparse at the back or sparse at the front and dense at the back, and the porosity ratio of the microneedle fin array is 0.3 to 3.3.

[0013] Furthermore, the height of the wave channel is 0.2-30 mm, and the width is 0.05-5 mm.

[0014] Furthermore, the amplitude of the waves in the wave channel is 0.01 to 1.5 mm, and the wavelength is 0.1 to 15 mm.

[0015] Compared with the prior art, the present invention has the following technical effects:

[0016] The present invention is based on the principle that a curved interface can induce Dean vortices, and adopts a wavy channel instead of the existing straight channel configuration design, which increases the convection surface area of ​​the functional thermal fluid in the wavy channel and prolongs the residence time, can improve the problem of poor mixing of hot and cold working fluids, enhance the secondary disturbance of the working fluid, make the temperature distribution inside the wavy channel more uniform, and shorten the cooling time of the functional thermal fluid; moreover, under the same cross-section, the wavy channel is more conducive to heat transfer, making heat exchange more sufficient and improving the heat dissipation efficiency of the radiator; in addition, the use of functional thermal fluid as the working fluid, combined with a wavy channel with a micro-needle fin array, can significantly improve the heat transfer capacity of the microchannel radiator. Compared with traditional radiators, it has a smaller temperature gradient and a more uniform temperature distribution, and obtains greater heat transfer enhancement and lower pressure drop loss. It can be seen that the wavy microchannel radiator with a micro-needle fin array of the present invention is not only simple in structure, small in weight and volume, and easy to manufacture, but also has high heat dissipation efficiency and low thermal resistance and low flow resistance.

[0017] The use of micro-needle fin arrays effectively prevents clogging of micro- and nano-scale metal particles, non-metallic particles, and phase change capsules in the functional thermal fluid, ensuring the flow performance of the micro- and nano-scale particles within the channel. This effectively reduces the overall volume of the radiator while significantly increasing the specific surface area. This effectively balances the conflicting demands of simultaneous improvements in flow and heat transfer performance, improving the cooling effect of the microchannel radiator and shortening the cooling time to the desired temperature. Furthermore, the efficient heat transport of the high thermal conductivity / high specific heat micro- and nano-particles in the functional thermal fluid enables the working fluid to absorb and transfer large amounts of heat in a short period of time, resolving the issues of difficult heat collection, low coolant heat capacity / thermal conductivity, and low heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 Schematic diagram of the structure of the microchannel heat transfer unit of the present invention;

[0020] FIG3( a ) is a schematic structural diagram of a microchannel heat transfer unit of the present invention without a heat-conducting cover plate;

[0021] FIG3( b ) is a schematic structural diagram of the fin of the present invention;

[0022] Figure 4 A cross-sectional view of the microchannel heat transfer unit of the present invention Figure 1 ;

[0023] Figure 5 A cross-sectional view of the microchannel heat transfer unit of the present invention Figure 2 ;

[0024] Figure 6 FIG3 is a cross-sectional view of the microchannel heat transfer unit of the present invention;

[0025] Figure 7 A cross-sectional view of the microchannel heat transfer unit of the present invention Figure 4 ;

[0026] Figure 8 A cross-sectional view of the microchannel heat transfer unit of the present invention Figure 5 ;

[0027] Figure 9 A cross-sectional view of the microchannel heat transfer unit of the present invention Figure 6 ;

[0028] Figure 10 A cross-sectional view of the microchannel heat transfer unit of the present invention Figure 7 ;

[0029] Figure 11 A cross-sectional view of the microchannel heat transfer unit of the present invention Figure 8 ;

[0030] Figure 12 A cross-sectional view of the microchannel heat transfer unit of the present invention Figure 9 ;

[0031] In the figure: 1. Thermal conductive base plate; 2. Fins; 3. Thermal conductive cover plate; 4. Microchannel heat transfer unit; 5. Micro-needle fin array. DETAILED DESCRIPTION

[0032] The specific contents of the present invention are further explained in detail below with reference to the embodiments.

[0033] like Figure 1 As shown in Figure 3, a wave microchannel heat sink with a micro-needle fin array includes a horizontally arranged and mutually parallel heat-conducting base plate 1 and a heat-conducting cover plate 3. At least two mutually parallel vertical fins 2 are fixedly connected to the upper portion of the heat-conducting base plate 1. Two adjacent fins 2 and the heat-conducting base plate 1 and heat-conducting cover plate 3 connected thereto constitute an independent microchannel heat transfer unit 4. The two ends of the microchannel heat transfer unit 4 are respectively a working fluid outlet and a working fluid inlet;

[0034] like Figure 2 As shown, the upper surface of the heat-conducting base plate 1 and the lower surface of the heat-conducting cover plate 3 are both provided with wavy grooves, and the side surface of the fin 2 is fixedly arranged with a micro-needle fin array 5, so that the fin 2, the heat-conducting cover plate 3 and the heat-conducting base plate 1 form a wavy channel for the circulation of functional thermal fluid;

[0035] As shown in Figures 3(a) and 3(b), the opposing surfaces of two adjacent fins 2 in the microchannel heat transfer unit 4 are wavy, and a micro-needle fin array 5 is fixedly arranged on the lower surface of the heat-conducting cover plate 3 and the upper surface of the heat-conducting base plate 1, so that the fins 2, the heat-conducting cover plate 3 and the heat-conducting base plate 1 form a wavy channel for the circulation of functional thermal fluid;

[0036] Compared with conventional channels, the functional thermal fluid has a larger convection surface area and a longer residence time in the wavy channel, and the curved interface induces the generation of Dean vortices, thereby enhancing the mixing of the coolant in the radiator channel, reducing the thickness of the radiator boundary layer, and strengthening the heat transfer of the coolant along the flow path. Therefore, under the same channel cross-section, the wavy channel can obtain better thermal performance than the conventional channel; in addition, the micro-needle fin array 5 attached to the fin 2 or the heat-conducting base plate 1 and the heat-conducting cover plate 3 forms a structure similar to a porous medium inside the channel, while improving the effective thermal conductivity of the working medium in the channel cavity, by increasing the contact area between the radiator and the cooling working medium, thereby It enhances heat transfer in the channel, reduces thermal resistance and overall temperature; moreover, the microneedle fin array effectively reduces the flow resistance of the cooling medium at equal thickness / width, and for functional thermal fluids represented by micro / nanofluids, it can effectively avoid problems such as particle blockage and agglomeration. The columnar structure of the microneedle fin array can enhance the disturbance and mixing of fluid microclusters. In the process of the working medium passing through the microcolumns, vortices are generated and shed, which strengthens the chaotic convection in the channel, thereby improving the temperature uniformity of the heat dissipation device. Therefore, the combination of the microneedle fin array and the wave channel has the above technical advantages, which can reduce the thermal resistance and flow resistance while improving the heat dissipation efficiency.

[0037] Preferably, the amplitude range of the waves in the wave channel is 0.01-1.5 mm, the wavelength range is 0.1-15 mm, the wave channel height range is 0.2-30 mm, and the width range of the wave microchannel is 0.05-5 mm; the microneedle fin array 5 includes a number of solid or hollow cylinders, and the functional thermal fluid is evenly distributed inside the radiator through the wave channel and the cylinders of the microneedle fin array 5. According to the actual working conditions, a functional thermal fluid containing micro-nanoscale metal, non-metal and phase change capsule particles that matches the working temperature can be selected. The mass concentration range of the functional thermal fluid is 1-35%, and the speed range is 0.01-3 m / s, thereby realizing efficient heat transfer of the functional thermal fluid.

[0038] The metal particles of the functional thermal fluid are copper, aluminum, titanium and their oxides; the non-metallic particles are silicon, carbon nanotubes or graphene; the phase change capsule particles are microencapsulated n-hexadecane, n-octadecane or n-eicosane and their derivatives; the base liquid of the functional thermal fluid is water, ethylene glycol, toluene, glycerol or ammonia water;

[0039] The heat-conducting base plate 1 , fins 2 and heat-conducting cover plate 3 are all made of metal or non-metal (eg, copper, aluminum, silicon) with relatively high thermal conductivity.

[0040] like Figure 4 、 Figures 7 to 12 As shown, the column of the micro-needle fin array 5 is cylindrical, wherein: Figure 4As shown, the columns are evenly arranged in a row on the upper surface of the heat-conducting base plate 1 and the lower surface of the heat-conducting cover plate 3 or on the side walls of the fins 2 with equal porosity; Figures 7 to 10 As shown, the porosity of the columns of the micro-needle fin array 5 along the coolant flow direction increases or decreases linearly along the corrugated channel direction, or increases or decreases in a gradient manner, based on the principle of "high heat transfer efficiency and low flow resistance", so that the porosity is arranged in a dense-first-then-sparse (small-then-large) or sparse-first-then-dense (large-then-small) manner on the lower surface of the heat-conducting base plate 1 and the upper surface of the heat-conducting cover plate 3 or the inner side wall of the fin 2; Figure 11 As shown, the columns of the micro-needle fin array 5 are arranged in a uniform and staggered pattern with alternating regular and inverted triangles in the same period as the wave trend of the wave channel on the lower surface of the heat-conducting base plate 1 and the upper surface of the heat-conducting cover plate 3 or the inner side wall of the fin 2; Figure 12 As shown, the columns of the micro-needle fin array 5 and the wave channel are arranged in a uniform and alternating pattern of equilateral triangles and equilateral triangles at the same period.

[0041] The uniform arrangement of the columns of the microneedle fin array 5 is suitable for occasions with low requirements on the flow rate of the cooling medium and relatively uniform heat flux density. It can reduce the difficulty and cost of processing while saving time and obtain a more ideal temperature distribution; while the non-uniform arrangement of the columns of the microneedle fin array 5 is suitable for occasions with high requirements on the flow rate of the cooling medium and uneven heat flux density. Since the effect of the boundary layer of the cooling medium is more significant at a lower flow rate, the non-uniform arrangement of the microneedle fin array changes the flow area at the interface and changes the vortex shedding frequency, which can effectively thin or destroy the boundary layer, and at the same time induce strong vortices near the microneedle fins to strengthen the chaotic convection in the channel, thereby improving the temperature uniformity of the heat dissipation device at a lower flow rate; in addition, for applications with uneven heat flux distribution, compared with the uniform arrangement, the linear or gradient non-uniform arrangement design can increase the heat transfer threshold under the same design size, thereby obtaining a more uniform temperature distribution.

[0042] Compared with the straight arrangement, the cross-row arrangement of the columns of the micro-needle fin array 5 is more conducive to the flow of the cooling medium in the relatively curved micro-column gaps, the fluid disturbance and mixing process are more intense, the convection heat transfer coefficient and the flow resistance are greater, therefore, the cross-row arrangement is suitable for occasions where the pumping power / flow resistance is limited and the heat transfer capacity is already strong, wherein: on the one hand, the uniform cross-row arrangement that presents alternation of right triangle and inverted triangle or alternation of right triangle and right triangle in the same period as the wave trend of the wave channel has the significant advantage of enhancing the heat transfer by strengthening the fluid disturbance, however, the function of the cross-row arrangement is The flow resistance of the thermal fluid is greater than that of the functional thermal fluid in the sequential arrangement; on the other hand, compared with the cross-row arrangement with alternating equilateral triangles and equilateral triangles, the cross-row arrangement with alternating equilateral triangles and inverted triangles makes the distances between the micro-columns and between them and the four walls of the radiator relatively constant, which can reduce the flow resistance of the fluid; furthermore, the functional thermal fluid undergoes a gradual expansion-contraction flow process in the cross-row arrangement with alternating equilateral triangles and equilateral triangles, which has a strong diffusion effect, making the boundary layer thickness of the radiator wall thinner, while enhancing the local mixing and disturbance of the coolant and increasing the flow resistance.

[0043] like Figure 5 and Figure 6 As shown, the columns of the micro-needle fin array 5 are in the shape of a regular quadrangular prism or a prism with a rhombus cross section, wherein: the columns are evenly arranged in a row on the upper surface of the heat-conducting base plate 1 and the lower surface of the heat-conducting cover plate 3 or on the inner side wall of the fin 2, or present Figures 7 to 10 The non-uniform arrangement shown, or Figures 11 and 12 As shown, the waves in the wave channel are arranged in a uniform cross-row arrangement, alternating between right triangles and inverted triangles, or right triangles and right triangles, in the same period as the trend of the waves.

[0044] Preferably, the cross-sectional shape of the column of the microneedle fin array 5 includes but is not limited to a circle, a triangle, a quadrilateral or a polygon. When the cross-sectional shape of the column is non-circular, the flushing angle of the fluid on the column, i.e. the incoming flow angle, can be changed by rotating the column in place.

[0045] Preferably, the equivalent diameter range of the columns of the microneedle fin array 5 is 0.01 to 1 mm, the spacing range of the columns is 0.02 to 5 mm, the height range of the columns is 0.02 to 2 mm, the porosity range of the microneedle fin array 5 when uniformly arranged is 0.27 to 0.9, and the porosity ratio range of the microneedle fin array 5 with a non-uniform arrangement design is 0.3 to 3.3, and the ratio of the length of the microneedle fin array at the working fluid inlet section to the length of the microneedle fin array at the working fluid outlet section of the microneedle fin array 5 along the flow direction of the coolant (i.e., functional thermal fluid) is in the range of 0.2 to 5.

[0046] The radiator of the present embodiment having a wavy channel with a micro-needle fin array significantly increases the convective heat transfer area while effectively avoiding the blockage of micro-nanoscale metal / non-metal / phase change capsules and other particles in the functional thermal fluid. The Dean vortex induced by the wavy channel enhances the mixing and secondary disturbance of the working fluid (i.e., coolant), improves the heat dissipation effect of the radiator, shortens the time to cool to a predetermined temperature, and effectively improves the heat dissipation rate and cooling efficiency of the radiator. Moreover, the radiator of the present invention has a reasonable structure, is easy to manufacture, has high reliability, is light in weight and small in size, and has a wide range of applicability.

[0047] The working principle of the present invention is as follows:

[0048] During use, the heat-conducting base plate or heat-conducting cover plate is attached to the heat-generating end of the electronic device, and heat is transferred from the heat source to the inside of the radiator through heat conduction. After being pressurized by the pump body, the functional thermal fluid flows into the wave channel from the working fluid inlet at one end of the microchannel heat transfer unit 4, and the heat is quickly transferred to the heat-conducting cover plate 3 at the top of the channel through the vertical fins 2. The micro-needle fin array 5 with a large convection heat transfer surface area performs convection heat exchange with the functional thermal fluid in the cavity of the wave channel. Dean vortices are formed through the diversion of the micro-needle fin array and the induction of the corrugated wall surface, which causes the flow field of the functional thermal fluid in the micro-channel heat transfer unit 4 to change significantly and cause fluid disturbance and mixing, accompanied by the generation and dissipation of vortices. After absorbing more heat, the functional thermal fluid flows out of the wave channel from the working fluid outlet at the other end of the micro-channel heat transfer unit 4, realizing the function of transferring heat from the heat source, so that the heat source can continue to work stably at a suitable temperature, thereby improving the heat dissipation efficiency of the radiator.

Claims

1. A wave microchannel radiator with a micro-pin fin array, characterized in that: The heat transfer device comprises a heat transfer base plate (1) and a heat transfer cover plate (3); at least two vertical fins (2) are fixedly connected to the upper portion of the heat transfer base plate (1); the tops of the fins (2) are fixedly connected to the heat transfer cover plate (3); two adjacent fins (2) and the heat transfer base plate (1) and the heat transfer cover plate (3) connected thereto form an independent microchannel heat transfer unit (4); and the two ends of the microchannel heat transfer unit (4) are respectively a working fluid outlet and a working fluid inlet; The microchannel heat transfer unit (4) comprises a micro-needle fin array (5) and a wave channel. When the micro-needle fin array (5) is fixedly arranged on the upper surface of the heat-conducting base plate (1) and the lower surface of the heat-conducting cover plate (3), the opposing surfaces of two adjacent fins (2) are all wavy, so that a wave channel for the circulation of a functional thermal fluid is formed between the micro-needle fin array (5) and the heat-conducting base plate (1) and the heat-conducting cover plate (3); when the micro-needle fin array (5) is fixedly arranged on the side surface of the fin (2), the upper end surface of the heat-conducting base plate (1) and the lower end surface of the heat-conducting cover plate (3) are both provided with a wave-shaped groove, so that a wave channel for the circulation of a functional thermal fluid is formed between the micro-needle fin array (5) and the fin (2). The micro-needle fin array (5) comprises a plurality of columns, which increase or decrease linearly or gradiently along the wave channel direction, so that the columns are arranged in a sequence with a porosity of dense at the front and sparse at the back or sparse at the front and dense at the back on the upper surface of the heat-conducting base plate (1) and the lower surface of the heat-conducting cover plate (3) or the side surface of the fin (2), and the porosity ratio of the micro-needle fin array (5) is 0.3 to 3.

3.

2. The wave microchannel radiator with a micro-needle fin array according to claim 1, characterized in that: The cross section of the column is circular, square, diamond, triangular or polygonal.

3. The wave microchannel radiator with a micro-needle fin array according to claim 2, characterized in that: The columns of the micro-needle fin array (5) are evenly arranged on the upper surface of the heat-conducting base plate (1) and the lower surface of the heat-conducting cover plate (3) or the side surfaces of the fins (2), and the porosity of the micro-needle fin array (5) is 0.27-0.

9.

4. The wave microchannel radiator with a micro-needle fin array according to claim 3, characterized in that: The columns of the micro-needle fin array (5) are arranged in a staggered pattern of alternating equilateral triangles and inverted triangles, or alternating equilateral triangles and equilateral triangles, in the same period as the waves of the wave channel, and are arranged on the upper surface of the heat-conducting base plate (1) and the lower surface of the heat-conducting cover plate (3) or the side surface of the fin (2).

5. The wave microchannel heat sink with a micro-needle fin array according to any one of claims 1 to 4, characterized in that: The wave channel has a height of 0.2 to 30 mm and a width of 0.05 to 5 mm.

6. The wave microchannel heat sink with a micro-needle fin array according to any one of claims 1 to 4, characterized in that: The amplitude of the waves in the wave channel is 0.01 to 1.5 mm, and the wavelength is 0.1 to 15 mm.

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