A processing method for a high-adhesion adhesive film material

Abstract

This invention discloses a processing method for a high-adhesion adhesive film material. The processing method includes two parts: a preparation method and a lamination method. The preparation method uses a coating machine to coat a film material to form an adhesive film material. The lamination method uses a lamination device to laminate release paper onto both sides of the formed adhesive film material, and finally cuts it into a product. By adjusting the winding speed of the first coated side of the film material, the basis weight of the release paper, the unwinding speed of the release paper, the pressure of the first and second upper and lower pressure rollers, and combining the adhesive film thickness uniformity, perforation status, and peel force, the adhesion degree and adhesion uniformity between the adhesive film material and the release paper are controlled. Using this method, a high-adhesion adhesive film material product is finally prepared.

Description

Technical Field

[0001] This invention relates to the processing of adhesive film materials for microwave composite dielectric substrate multilayer boards, and particularly to a method for processing a high-adhesion adhesive film material. Background Technology

[0002] With the development of integrated circuits, multilayer boards have become the mainstream form of circuit processing. Adhesive film is a key material for connecting two copper-clad laminates. In the fabrication of multilayer electronic devices, the adhesive film material is required to be thinner and easier to process. The requirements for the adhesive film material during processing are very strict, especially when drilling holes. The release paper bonded to the adhesive film must not have problems such as burrs, paper scraps, or deformation. Chinese patent CN111572888A is applicable to the processing of single-sheet films and cannot realize online roll processing, which seriously affects the processing efficiency. At present, it is not possible to process adhesive film materials with high adhesion and continuity in China. How to achieve continuous high adhesion processing while continuously coating adhesive on both sides of a film substrate with a thickness of no more than 15μm, and how to make the bonded adhesive film material product have no length difference between the adhesive film material and the release paper, be easy to tear, neatly bonded, and free of burrs and paper scraps when drilling holes, requires the exploration of new processing methods based on the characteristics of adhesive film materials and user requirements. Summary of the Invention

[0003] In view of the current state of the technology and existing problems, the present invention provides a processing method for a high-adhesion adhesive film material. This method, based on the characteristics of the adhesive film material and the user's requirements, adopts a new processing technology by combining a coating machine with a bonding device, thereby realizing a high-adhesion adhesive film material product that meets the user's requirements.

[0004] The technical solution adopted by this invention is: a processing method for a high-adhesion adhesive film material, characterized in that the processing method includes two parts: a preparation method and a lamination method. The preparation method uses a coating machine to coat a thin film material to form an adhesive film material; the lamination method uses a lamination device to laminate release paper onto both sides of the formed adhesive film material, and finally cuts it into a product; wherein the preparation method includes the following steps:

[0005] A1. Preparation of resin mixture solution: Dissolve 20% to 80% of the thermosetting resin by mass in 500ml to 2000ml of organic solvent, and stir and dissolve using a stirrer at a temperature of 50℃ to 120℃ to obtain the resin mixture solution.

[0006] A2. Preparation of mixed adhesive solution: Add 20% to 60% ceramic powder, 5% to 20% surfactant, and 2% to 10% initiator by mass to the resin mixture solution in sequence, and stir for 2 to 10 hours to obtain the mixed adhesive solution.

[0007] A3. Degassing treatment of mixed adhesive: The stirred mixed adhesive is degassed in an ultrasonic device with a speed of 200r / min~3000r / min, and the degassed mixed adhesive is injected into the glue supply tank of the coating machine.

[0008] A4. First coating of film material: The degassed mixed adhesive is coated on one side of the film material at a coating speed of 0.5m / min to 5m / min, cured at a temperature of 60℃ to 150℃, and the coated side is attached with a transparent release film. The film is then rolled up to prepare for the second coating at a winding speed of 0.5m / min to 2.0m / min.

[0009] A5. Coating the second side of the film material: The degassed mixed adhesive solution is coated on the second side of the film material at a coating speed of 0.5m / min to 5m / min, and cured at a temperature of 60℃ to 150℃ to obtain the adhesive film material.

[0010] The bonding method includes the following steps:

[0011] B1. Double-sided lamination of release paper with adhesive film material: The adhesive film material travels through the coating machine's drive rollers to the laminating device. The first release paper roll is unwound, and the release paper travels through the upper drive roller and upper winding roller of the laminating device onto the first pressing platform. The first upper pressing roller presses the release paper onto the upper surface of the adhesive film material. Simultaneously, the transparent release film adhered to the lower surface of the adhesive film material is manually torn off, and one end of the torn transparent release film is placed on the winding roller for winding. The second release paper roll is unwound, and the release paper travels through the lower drive roller and lower winding roller of the laminating device under the second pressing platform. The first lower pressing roller presses the release paper onto the lower surface of the adhesive film material. The unwinding speed of both the first and second release paper rolls is 0.1 m / min to 1.0 m / min. The pressure of the first upper pressing roller is 1 MPa to 5 MPa, and the pressure of the first lower pressing roller is 0.5 MPa to 4 MPa.

[0012] B2. Final bonding of adhesive film material on both sides: After the release paper is bonded to both sides of the adhesive film material, the two sides of the adhesive film material are simultaneously bonded by the second upper pressure roller and the second lower pressure roller of the bonding device. The pressure of the second upper pressure roller and the second lower pressure roller is 2 MPa to 6 MPa.

[0013] B3. Adhesive film material cutting: After the adhesive film material is finally bonded, it is pulled to the cutting machine for final cutting to obtain a high-bonding adhesive film material product.

[0014] The beneficial effects of this invention are:

[0015] 1. By adjusting the winding speed of the first coating of the film material, the basis weight of the release paper, the unwinding speed of the release paper, the pressure of the first and second upper and lower pressure rollers, and combining the thickness uniformity of the adhesive film, the perforation state, and the peeling force, the adhesion degree and adhesion uniformity between the adhesive film and the release paper can be controlled. Using this method, the preparation of adhesive film material products with high adhesion degree can be achieved.

[0016] 2. This invention utilizes a coating machine combined with a laminating device to achieve batch processing of a high-adhesion adhesive film material. Simultaneously, by adjusting the release paper unwinding speed and the pressure of the upper and lower pressing rollers, the adhesion between the adhesive film and the release paper is improved. Adjusting the pressure of the pressing rollers allows for stable control of the cut dimensions of the packaged adhesive film products. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the bonding device of the present invention. Detailed Implementation

[0018] The present invention will now be described in detail with reference to the accompanying drawings and embodiments:

[0019] In step A1 of this method, the thermosetting resin selected is one or two of polybutadiene resin, phenolic resin, and bismaleimide resin; the organic solvent selected is at least one of cyclohexane, xylene, toluene, ethanol, and ethyl acetate.

[0020] In step A2 of this method, the ceramic powder selected is one or two of alumina, silicon oxide, boron nitride, perovskite, and barium oxide; the surfactant selected is one of polyether propylene glycol and polyethylene glycol p-isooctylphenyl ether; and the initiator selected is one of azobisisobutyronitrile, dialkyl peroxide, and benzoyl peroxide.

[0021] The transparent release film selected in step A4 of this method is one of PET, PE, PVA, PP, and PC; the thickness of the transparent release film is 0.30μm±0.05μm, and the width is 300mm~1000mm.

[0022] In step B1 of this method, the release paper used has a width of 300mm to 1000mm and a basis weight of 20g / m². 2 ~200g / m 2 The release paper selected is one of the following: laminated kraft paper, silicone paper, or coated paper.

[0023] In this invention, a coating machine is used to coat the thin film material to form an adhesive film. This method uses a thin film material prepared under Chinese patent CN113881082A, with a cured thickness of 11.5 μm, a thickness difference of 0.8 μm, and a tensile strength greater than 6 MPa in both the X and Y directions, as the substrate. The bonding method of this invention is achieved using a bonding device combined with the coating machine.

[0024] Example 1:

[0025] ① Preparation of resin mixture: Dissolve 65% by mass of polybutadiene resin in 1500ml (volume ratio 1:1) of cyclohexane and xylene organic solvent, and stir and dissolve using a double planetary mixer at 80℃ to obtain resin mixture.

[0026] ② Preparation of mixed adhesive solution: Add 20% (by mass) of alumina and silica ceramic powder, 10% of polyethylene glycol p-isooctylphenyl ether, and 5% of azobisisobutyronitrile to the resin mixture solution in sequence, and stir for 4 hours to obtain the mixed adhesive solution.

[0027] ③ Degassing treatment of mixed adhesive: The stirred mixed adhesive is degassed in an ultrasonic device at 2000r / min, and the degassed mixed adhesive is injected into the glue supply tank of the coating machine.

[0028] ④ First coating of film material: The degassed mixed adhesive is coated on one side of the film substrate at a coating speed of 4 m / min. After curing at 120℃, the coated side is bonded with a transparent PET release film with a thickness of (0.30±0.05) μm and a width of 1000 mm. The film is then rolled up to prepare for the second coating at a speed of 0.5 m / min.

[0029] Second coating of film material: The degassed mixed adhesive solution is coated on the second side of the film material at a coating speed of 4 m / min and cured at 120℃ to obtain the adhesive film material.

[0030] Double-sided release paper for adhesive film material: The double-sided coated adhesive film material is fed to the laminating device via the coating machine's drive rollers. The double-sided silicone paper in the double-sided release paper has a basis weight of 150 g / m². 2The unwinding speed of both the upper and lower double-sided silicone paper is 0.2 m / min. The double-sided silicone paper travels through the upper drive roller and upper winding roller of the bonding device to the first pressing platform. The pressure of the first upper pressing roller is 4 MPa, which bonds the double-sided silicone paper to the upper surface of the adhesive film material. The transparent PET release film bonded to the lower surface of the adhesive film material is manually peeled off and placed on the winding roller for winding. The double-sided silicone paper travels through the lower drive roller and lower winding roller of the bonding device to the lower pressing platform. The pressure of the first lower pressing roller is 4 MPa, which bonds the double-sided silicone paper to the lower surface of the adhesive film material.

[0031] Final double-sided lamination of adhesive film material: After double-sided lamination, the adhesive film material is laminated by the second upper and lower pressing rollers. The pressure of the second upper and lower pressing rollers is 5MPa. After automatic edge trimming, it is pulled to the cutting machine and cut to obtain an adhesive film material product with a size of 1000mm×1200mm.

[0032] The test results showed that the average thickness of the adhesive film was 85.6 μm with a range of 0.5 μm. After punching, there were slight rough edges and no obvious paper scraps. The peel force between the adhesive film and the double-sided silicone paper was 0.010 N / mm, indicating poor adhesion. The edges were wavy and bulged.

[0033] Example 2:

[0034] Steps ①, ②, ③ The process and parameter settings are the same as in Example 1, and will not be repeated.

[0035] In step ④, the winding speed during the first coating of the thin film material is 0.8 m / min, and the remaining process and parameter settings are the same as in Example 1.

[0036] step The basis weight of the double-sided silicone paper in the double-sided release paper of the adhesive film material is 130 g / m². 2 The unwinding speed is 0.4 m / min, the pressure of the first upper pressing roller of the adhesive film is 2 MPa, the pressure of the first lower pressing roller is 1 MPa, and the rest of the process and parameter settings are the same as in Example 1.

[0037] step In the final bonding of the adhesive film material on both sides, the pressure of the second upper and lower pressing rollers is 4MPa, and the rest of the process and parameter settings are the same as in Example 1.

[0038] Tests showed that the average thickness of the adhesive film was 86.2 μm with a range of 0.1 μm. After punching, there were no burrs or paper scraps on the edges. The peel force between the adhesive film and the double-sided silicone paper was 0.008 N / mm, indicating good adhesion with neat edges and no bulging.

[0039] Example 3:

[0040] Steps ①, ②, ③ The process and parameter settings are the same as in Example 1, and will not be repeated.

[0041] In step ④, the winding speed during the first coating of the thin film material is 1.5 m / min, and the remaining process and parameter settings are the same as in Example 1.

[0042] step The basis weight of the double-sided silicone paper in the double-sided release paper of the adhesive film material is 130 g / m². 2 The unwinding speed is 0.8 m / min, and the pressure of the first upper and lower pressing rollers of the adhesive film is 2 MPa. The rest of the process and parameter settings are the same as in Example 1.

[0043] step In the final bonding of the adhesive film material on both sides, the pressure of the second upper and lower pressing rollers is 4MPa, and the rest of the process and parameter settings are the same as in Example 1.

[0044] The adhesive film thickness was tested and found to be 84.8 μm with a range of 0.8 μm. After punching, there were no burrs or paper scraps on the edges. The peel force between the adhesive film and the double-sided silicone paper was 0.011 N / mm, indicating good adhesion, neat edges, and slight bulging.

[0045] Example 4:

[0046] Steps ①, ②, ③ The process and parameter settings are the same as in Example 1, and will not be repeated.

[0047] In step ④, the winding speed during the first coating of the thin film material is 1.5 m / min, and the remaining process and parameter settings are the same as in Example 1.

[0048] step The basis weight of the double-sided silicone paper in the double-sided release paper of the adhesive film material is 50 g / m². 2 The unwinding speed is 0.8 m / min, the pressure of the first upper pressing roller of the adhesive film is 4 MPa, the pressure of the first lower pressing roller is 2 MPa, and the rest of the process and parameter settings are the same as in Example 1.

[0049] step In the final bonding of the adhesive film material on both sides, the pressure of the second upper and lower pressing rollers is 4MPa, and the rest of the process and parameter settings are the same as in Example 1.

[0050] The adhesive film thickness was tested and found to be 84.6 μm on average with a range of 0.6 μm. There were slight burrs on the edges after punching, but no paper scraps. The peel force between the adhesive film and the double-sided silicone paper was 0.013 N / mm. The adhesion was generally good, with neat edges but severe blistering.

[0051] Example 5:

[0052] Steps ①, ②, ③ The process and parameter settings are the same as in Example 1, and will not be repeated.

[0053] In step ④, the winding speed during the first coating of the thin film material is 0.5 m / min, and the remaining process and parameter settings are the same as in Example 1.

[0054] step The basis weight of the double-sided silicone paper in the double-sided release paper of the adhesive film material is 120 g / m². 2 The unwinding speed is 0.5 m / min, the pressure of the first upper pressing roller of the adhesive film is 1.5 MPa, the pressure of the first lower pressing roller is 1 MPa, and the rest of the process and parameter settings are the same as in Example 1.

[0055] step In the final bonding of the adhesive film material on both sides, the pressure of the second upper and lower pressing rollers is 4MPa, and the rest of the process and parameter settings are the same as in Example 1.

[0056] The adhesive film thickness was tested and found to be 85.3 μm on average with a range of 0.6 μm. After punching, there were slight burrs on the edges, but no paper scraps. The peel force between the adhesive film and the double-sided silicone paper was 0.009 N / mm, indicating good adhesion. The edges were slightly wavy and there was no blistering.

[0057] Example 6:

[0058] Steps ①, ②, ③ The process and parameter settings are the same as in Example 1, and will not be repeated.

[0059] In step ④, the winding speed during the first coating of the thin film material is 2.0 m / min, and the remaining process and parameter settings are the same as in Example 1.

[0060] step The basis weight of the double-sided silicone paper in the double-sided release paper of the adhesive film material is 100 g / m². 2 The unwinding speed is 1.0 m / min, the pressure of the first upper pressing roller of the adhesive film is 1 MPa, the pressure of the first lower pressing roller is 0.5 MPa, and the rest of the process and parameter settings are the same as in Example 1.

[0061] step In the final bonding of the adhesive film material on both sides, the pressure of the second upper and lower pressing rollers is 3MPa, and the rest of the process and parameter settings are the same as in Example 1.

[0062] Tests showed that the average thickness of the adhesive film was 83.9 μm, with a range of 0.8 μm. After punching, there were rough edges and paper scraps on the edges. The peel force between the adhesive film and the double-sided silicone paper was 0.013 N / mm, indicating that the adhesion was generally poor, with wavy edges and severe blistering.

[0063] The above examples are analyzed as follows:

[0064] 1. High winding speed and irregular winding of the first coating of the film material affect the uniformity of the second coating, while slow winding affects the coating efficiency.

[0065] 2. The lower the basis weight of the double-sided silicone paper, the easier it is to adhere. However, if the basis weight is too low, the cut product will have poor stiffness and the edges will be severely wavy. If the basis weight is too high, the edges will have serious burrs or paper scraps after punching.

[0066] 3. The pressure difference between the first upper and lower pressing rollers affects the neatness of the double-sided release paper bonding. If it is too small or too large, misalignment and displacement are very likely to occur, resulting in poor bonding effect.

[0067] 4. The pressure of the second upper and lower pressing rollers affects the final double-sided adhesion of the adhesive film material. Low pressure results in low adhesion, while high pressure makes the adhesive film material prone to deformation.

[0068] Of the above embodiments, Embodiment 2 is the preferred embodiment, where the winding speed of the first coating of the film material is 0.8 m / min, and the basis weight of the double-sided silicone paper is 130 g / m². 2 The unwinding speed of the upper and lower release paper is 0.4 m / min. When the adhesive film material is double-sided bonded to the release paper, the pressure of the first upper pressing roller is 2 MPa, the pressure of the first lower pressing roller is 1 MPa, and the pressure of the second upper and lower pressing rollers is 4 MPa. This can achieve a high degree of adhesion adhesive film material with a thickness difference of 0.1 μm, no burrs or paper scraps on the edge after perforation, a peel force of 0.008 N / mm between the adhesive film material and the release paper, and good bonding condition.

[0069] Randomly select one of the steps of the embodiment The thickness of the obtained adhesive film sample was measured at 14 equal points along its two diagonals. The average of these 14 measurements was taken as the thickness of the adhesive film sample. The difference between the maximum and minimum thickness values ​​at these 14 points is called the thickness range. For this invention, a thickness range less than 0.2 μm indicates better thickness uniformity in the packaging. A 10 mm diameter punch was used to punch holes in the adhesive film sample, and the edges of the holes were observed for burrs and paper scraps. Ideally, the release liner should have no burrs or paper scraps. The peel force between the adhesive film material and the release liner was tested, and the adhesion between the release liner and the adhesive film material was checked. Good adhesion with no deformation or bulging at the edges was required.

Claims

1. A method for processing a high-adhesion adhesive film material, characterized in that, The processing method includes two parts: a preparation method and a bonding method. The preparation method uses a coating machine to coat the film material to form an adhesive film material. The bonding method uses a bonding device to bond release paper to both sides of the formed adhesive film material, and finally cuts it into a product. The preparation method described herein includes the following steps: A1. Preparation of resin mixture solution: Dissolve 20% to 80% by weight of thermosetting resin in 500ml to 2000ml of organic solvent, and stir and dissolve using a stirrer at a temperature of 50℃ to 120℃ to obtain resin mixture solution; the thermosetting resin is one or two of polybutadiene resin, phenolic resin, and bismaleimide resin. A2. Preparation of the mixed adhesive solution: 20%~60% ceramic powder, 5%~20% surfactant, and 2%~10% initiator by mass are sequentially added to the resin mixture solution, and stirred for 2h~10h to obtain the mixed adhesive solution; the surfactant is one of polyether propylene glycol and polyethylene glycol p-isooctylphenyl ether; the initiator is one of azobisisobutyronitrile, dialkyl peroxide, and benzoyl peroxide. A3. Degassing treatment of mixed adhesive: The stirred mixed adhesive is degassed in an ultrasonic device with a speed of 200r / min~3000r / min, and the degassed mixed adhesive is injected into the glue supply tank of the coating machine. A4. First coating of film material: The degassed mixed adhesive is coated on one side of the film material at a coating speed of 0.5m / min to 5m / min, cured at a temperature of 60℃ to 150℃, and the coated side is attached with a transparent release film. The film is then rolled up to prepare for the second coating at a winding speed of 0.5m / min to 2.0m / min. A5. Coating the second side of the film material: The degassed mixed adhesive solution is coated on the second side of the film material at a coating speed of 0.5m / min to 5m / min, and cured at a temperature of 60℃ to 150℃ to obtain the adhesive film material. The bonding method includes the following steps: B1. Adhesive film material with release paper on both sides: The adhesive film material is carried by the coating machine drive roller to the bonding device, the first release paper roll is unwound, and the release paper is carried by the upper drive roller and upper winding roller of the bonding device onto the first pressing platform, and the release paper is pressed onto the upper surface of the adhesive film material by the first upper pressing roller. At the same time, the transparent release film attached to the lower surface of the adhesive film material is manually peeled off, and one end of the peeled transparent release film is placed on the winding roller to wind up the transparent release film. The second release paper roll is unwound, and the release paper travels under the second pressing platform via the lower drive roller and lower winding roller of the bonding device. The first lower pressing roller presses the release paper onto the lower surface of the adhesive film material. The unwinding speed of both the first and second release paper rolls is 0.1 m / min to 1.0 m / min. The pressure of the first upper pressing roller is 1 MPa to 5 MPa, and the pressure of the first lower pressing roller is 0.5 MPa to 4 MPa. The width of the release paper is 300 mm to 1000 mm, and the basis weight is 20 g / m². 2 ~200g / m 2 The release paper is one of the following: coated kraft paper, silicone paper, or laminated paper. B2. Final bonding of adhesive film material on both sides: After the release paper is bonded to both sides of the adhesive film material, the two sides of the adhesive film material are simultaneously bonded by the second upper pressure roller and the second lower pressure roller of the bonding device. The pressure of the second upper pressure roller and the second lower pressure roller is 2 MPa to 6 MPa. B3. Adhesive film material cutting: After the adhesive film material is finally bonded, it is pulled to the cutting machine for final cutting to obtain a high-bonding adhesive film material product.

2. The processing method of a high-adhesion adhesive film material according to claim 1, characterized in that, In step A1, the organic solvent is at least one of cyclohexane, xylene, toluene, ethanol, and ethyl acetate.

3. The processing method of a high-adhesion adhesive film material according to claim 1, characterized in that, In step A2, the ceramic powder is one or two of alumina, silicon oxide, boron nitride, perovskite, and barium oxide.

4. The processing method of a high-adhesion adhesive film material according to claim 1, characterized in that, In step A4, the transparent release film is one of PET, PE, PVA, PP, and PC.

5. The processing method of a high-adhesion adhesive film material according to claim 4, characterized in that, The thickness of the transparent release film is 0.30μm±0.05μm, and the width is 300mm~1000mm.

Images