Marking shielding film and circuit board

Abstract

The present invention discloses an identification shielding film and a circuit board, wherein the identification shielding film includes a first light-transmitting adhesive layer, a contrast layer, a shielding film layer, and an adhesive film layer stacked in sequence, wherein the contrast layer and the shielding film layer have different grayscale values, and a hollow pattern is provided on the contrast layer so that the contrast layer and the shielding film layer are combined to form a first identification code and a second identification code, the first identification code and the second identification code are arranged at intervals, the first light-transmitting adhesive layer is a semi-transmitting adhesive layer, and a hollow area is provided on the first light-transmitting adhesive layer, and the hollow area and the first identification code are directly opposite. By providing the contrast layer and the shielding film layer to form the first identification code and the second identification code, not only can the identification shielding film serve as an identification function, but the number of film layers of the identification shielding film can also be reduced, thereby reducing the cost of the identification shielding film; by providing the first identification code and the second identification code, product information can be stored in different channels, and the second identification code can be used as an anti-counterfeiting code.

Description

Technical Field

[0001] The present invention relates to the technical field of identification code production, in particular to an identification shielding film and a circuit board comprising the identification shielding film. Background Art

[0002] With the rapid development of the electronics industry, electronic products are further developing towards miniaturization, lightweight, and high-density assembly, which has greatly promoted the development of flexible circuit boards, thereby realizing the integration of various components and wire connections.

[0003] Electronic products are integrated with various components. To better trace the electronic product or a component within it, an identification code is often provided inside the electronic product. By scanning the identification code, the information of the product or a component can be traced to verify whether the product or a component is authentic.

[0004] Patent document [CN 212970634 U] discloses a film and circuit board that incorporates an identification code, which is then affixed to a product or component. The identification code can be scanned to trace and verify the product. However, as counterfeiting techniques continue to improve, the identification codes of counterfeit and authentic products are becoming increasingly similar. Therefore, existing identification code structures are difficult to use to distinguish genuine products from counterfeits, hindering the rights of consumers and legitimate manufacturers. Furthermore, the circuit board requires an additional electromagnetic shielding film, which not only hinders thinning the circuit board but also increases the workload of the attachment process, hindering cost reduction. Summary of the Invention

[0005] An object of the embodiments of the present invention is to provide a marking shielding film and a circuit board, which can further improve the accuracy of recognition results and have low cost.

[0006] To achieve the above object, the present invention adopts the following technical solutions:

[0007] In a first aspect, an identification shielding film is provided, comprising a first light-transmitting adhesive layer, a contrast layer, a shielding film layer and an adhesive film layer stacked in sequence, the contrast layer and the shielding film layer having different grayscale values, the contrast layer being provided with a hollow pattern so that the contrast layer and the shielding film layer are combined to form a first identification code and a second identification code, the first identification code and the second identification code being arranged at intervals, the first light-transmitting adhesive layer being a semi-transmitting adhesive layer, the first light-transmitting adhesive layer being provided with a hollow area, the hollow area being opposite to the position of the first identification code.

[0008] As a preferred solution for the identification shielding film, it includes a second light-transmitting adhesive layer, which is arranged on a side of the first light-transmitting adhesive layer away from the contrast layer, and the transmittance of the second light-transmitting adhesive layer is greater than the transmittance of the first light-transmitting adhesive layer.

[0009] As a preferred solution of the marking shielding film, the shielding film layer includes a heat-conducting layer and a first shielding layer, the heat-conducting layer is arranged between the contrasting layer and the first shielding layer, and the contrasting layer and the heat-conducting layer have different grayscale values.

[0010] As a preferred solution of the marking shielding film, the heat-conducting layer includes two graphite layers, a heat-conducting metal layer is provided between the two graphite layers, and the size of the heat-conducting metal layer is greater than or equal to the size of the graphite layer.

[0011] As a preferred solution for marking the shielding film, one of the contrast layer and the shielding film layer is black, and the other of the contrast layer and the shielding film layer is white.

[0012] As a preferred solution for identifying the shielding film, the first identification code includes at least one of a barcode, a QR code and characters; and / or,

[0013] The second identification code includes at least one of a barcode, a QR code and characters.

[0014] As a preferred solution of the marking shielding film, it includes a protective layer, and the protective layer is arranged on a side of the first light-transmitting adhesive layer away from the contrast layer.

[0015] As a preferred solution for identifying a shielding film, the shielding film layer includes a first shielding layer and a second shielding layer, the first shielding layer is arranged between the contrast layer and the second shielding layer, the side of the first shielding layer close to the second shielding layer is an uneven surface, the side of the first shielding layer close to the second shielding layer is provided with convex first conductor particles, and the side of the second shielding layer close to the adhesive film layer is an uneven surface.

[0016] As a preferred solution for marking the shielding film, convex second conductor particles are provided on a side of the second shielding layer close to the adhesive film layer.

[0017] As a preferred solution for the identification shielding film, the shielding film layer further includes at least one third shielding layer, which is arranged between the second shielding layer and the adhesive film layer, and the side of the third shielding layer close to the adhesive film layer is a non-flat surface.

[0018] As a preferred solution for marking the shielding film, third conductor particles are provided on a side of each third shielding layer close to the adhesive film layer.

[0019] In a second aspect, a circuit board is provided, comprising a substrate layer and the aforementioned marking shielding film, wherein the adhesive film layer of the marking shielding film is attached to the substrate layer.

[0020] The beneficial effects of the present invention are: by setting a contrast layer and a shielding film layer to combine and form a first identification code and a second identification code, not only can the identification shielding film play an identification role, but also the number of film layers of the identification shielding film can be reduced, thereby reducing the cost of the identification shielding film; by setting the first identification code and the second identification code, the product information can be stored in different channels, and the second identification code can be used as an anti-counterfeiting code; by setting the first translucent adhesive layer to a semi-translucent adhesive layer, a hollow area is formed on the first translucent adhesive layer. When the ambient light is weak, the light can directly pass through the hollow area and illuminate the first identification code, so the first identification code can be recognized, and the light penetrating the first translucent adhesive layer is less, so that the first translucent adhesive layer blocks the second identification code. At this time, the second identification code is hidden. When the ambient light is strong, the light penetrating the first translucent adhesive layer is more. At this time, the second identification code can be revealed, and the second identification code can be identified by a scanner to obtain the information of the second identification code, that is, only the second identification code with anti-counterfeiting function in a specific environment can be recognized, thereby improving the accuracy of the recognition result. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention will be described in further detail below with reference to the accompanying drawings and examples.

[0022] Figure 1 This is a schematic diagram of the marking shielding film described in Example 1 of the present invention.

[0023] Figure 2 This is a schematic diagram of the marking shielding film described in Example 2 of the present invention.

[0024] Figure 3 This is a schematic diagram of the marking shielding film described in Example 3 of the present invention.

[0025] Figure 4 This is a schematic diagram of the marking shielding film described in Example 4 of the present invention.

[0026] Figure 5 This is a schematic diagram of the marking shielding film described in Example 5 of the present invention.

[0027] Figure 6 This is a schematic diagram of the identification shielding film described in Example 6 of the present invention.

[0028] Figure 7 This is a schematic diagram of the identification shielding film described in Example 7 of the present invention.

[0029] Figure 8 This is a schematic diagram of a circuit board according to an embodiment of the present invention.

[0030] In the picture:

[0031] 100, marking shielding film; 200, circuit board;

[0032] 1. Adhesive film layer; 2. Shielding film layer; 21. First shielding layer; 211. First conductor particles; 22. Second shielding layer; 221. Second conductor particles; 23. Third shielding layer; 231. Third conductor particles; 24. Thermal conductive layer; 241. Graphite layer; 242. Thermal conductive metal layer; 3. Contrast layer; 31. Hollow pattern; 4. First light-transmitting adhesive layer; 41. Hollow area; 5. Second light-transmitting adhesive layer; 6. Protective layer; 7. First identification code; 8. Second identification code. DETAILED DESCRIPTION

[0033] To make the technical problems solved, the technical solutions adopted, and the technical effects achieved by the present invention more clearly understood, the technical solutions of the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. It is apparent that the described embodiments are only some of the embodiments of the present invention, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0034] like Figure 1As shown, the present invention provides an identification shielding film 100, including a first light-transmitting adhesive layer 4, a contrast layer 3, a shielding film layer 2 and an adhesive film layer 1 stacked in sequence, the contrast layer 3 and the shielding film layer 2 have different grayscale values, and the contrast layer 3 is provided with a hollow pattern 31 so that the contrast layer 3 and the shielding film layer 2 are combined to form a first identification code 7 and a second identification code 8, the first identification code 7 and the second identification code 8 are arranged at intervals, the first light-transmitting adhesive layer 4 is a semi-transmitting adhesive layer, and the first light-transmitting adhesive layer 4 is provided with a hollow area 41, and the hollow area 41 and the first identification code 7 are positioned opposite each other. By setting the contrast layer 3 and the shielding film layer 2 to form the first identification code 7 and the second identification code 8, not only can the identification shielding film 100 play an identification role, but also the number of film layers of the identification shielding film 100 can be reduced, and the cost of the identification shielding film 100 can be reduced; by setting the first identification code 7 and the second identification code 8, the product information can be stored in different channels. For example, the production date information of the product is stored in the first identification code 7, and the anti-counterfeiting information of the product is stored in the second identification code 8. At this time, the second identification code 8 can be used as an anti-counterfeiting code; by setting the first light-transmitting adhesive layer 4 to be a semi-transmitting adhesive layer, a hollow area 41 is formed on the first light-transmitting adhesive layer 4, When the ambient light is weak, the light can directly pass through the hollow area 41 and illuminate the first identification code 7, so the first identification code 7 can be identified, while the light penetrating the first light-transmitting adhesive layer 4 is less, so that the first light-transmitting adhesive layer 4 blocks the second identification code 8. At this time, the second identification code 8 is hidden. When the ambient light is strong, the light penetrating the first light-transmitting adhesive layer 4 is more, and the second identification code 8 can be revealed. The second identification code 8 can be identified by a scanner, thereby obtaining the information of the second identification code 8. That is, only the second identification code 8 with anti-counterfeiting function under specific circumstances can be identified, thereby improving the accuracy of the identification result, which is conducive to distinguishing between genuine products and imitations.

[0035] Reference Figure 2 Specifically, the identification shielding film 100 further includes a second light-transmitting adhesive layer 5, which is disposed on a side of the first light-transmitting adhesive layer 4 away from the contrast layer 3. The second light-transmitting adhesive layer 5 has a greater light transmittance than the first light-transmitting adhesive layer 4. The second light-transmitting adhesive layer 5 protects the contrast layer 3 from scratches, thereby ensuring that the first identification code 7 and the second identification code 8 can be accurately identified.

[0036] Specifically, the color of the shielding film layer 2 is black, and the color of the contrast layer 3 is white. It is understood that the grayscale values ​​of black and white differ significantly, and to a certain extent, the contrast layer 3 and the shielding film layer 2 can create a more obvious brightness contrast, thereby enhancing the clarity and resolution of the first identification code 7 and the second identification code 8. This facilitates the scanner to recognize the first identification code 7 and the second identification code 8. In other embodiments, the color of the shielding film layer 2 can be set to white, and the color of the contrast layer 3 can be set to black.

[0037] Alternatively, contrast layer 3 may be made of a metal. In this case, the material of contrast layer 3 may be at least one element selected from nickel, silver, platinum, titanium, aluminum, cobalt, and chromium; or, the material of contrast layer 3 may be an alloy formed by at least two of nickel, silver, platinum, titanium, aluminum, cobalt, and chromium; or, the material of contrast layer 3 may be a combination of alloys formed by at least two of nickel, silver, platinum, aluminum, titanium, aluminum, cobalt, and chromium. When contrast layer 3 is a lighter color such as white or silvery white, contrast layer 3 may be made of nickel, silver, platinum, chromium, titanium, aluminum, cobalt, or an alloy of any two or more of the above metals. When contrast layer 3 is black, contrast layer 3 may be made of a metal such as iron, chromium, or manganese, or an alloy thereof. For example, ferrous iron and its alloys, such as steel, pig iron, iron alloys, and cast iron, may be used. Of course, contrast layer 3 may also be an insulating layer.

[0038] The thickness range of the contrast layer 3 is 1-30 microns, the thickness range of the first light-transmitting adhesive layer 4 is 1-30 microns, and the thickness range of the second light-transmitting adhesive layer 5 is 1-30 microns. Preferably, the thickness of the contrast layer 3 is 4 microns, the thickness of the first light-transmitting adhesive layer 4 is 4 microns, and the thickness of the second light-transmitting adhesive layer 5 is 4 microns.

[0039] Specifically, the first identification code 7 includes at least one of a barcode, a QR code, and characters, and the second identification code 8 includes at least one of a barcode, a QR code, and characters. The types of the first identification code 7 and the second identification code 8 can be selected according to actual needs. The identification code is a unique identification mark that identifies a component or electronic product. The identification code can include characters such as numbers and letters, or it can be a barcode or a QR code. The identification shielding film 100 of this embodiment can include at least one of the above-mentioned barcodes, QR codes, and characters to identify the corresponding component or electronic product.

[0040] Reference Figure 3Specifically, the identification shielding film 100 further includes a protective layer 6, which is disposed on a side of the first light-transmitting adhesive layer 4 away from the contrast layer 3. The second light-transmitting adhesive layer 5 can be disposed between the protective layer 6 and the first light-transmitting adhesive layer 4. The protective layer 6 has a protective function to ensure that the first light-transmitting adhesive layer 4 and the second light-transmitting adhesive layer 5 are not scratched or damaged during use, thereby ensuring the light transmission effect of the identification shielding film 100 and ensuring the concealment effect of the second identification code 8 under low light conditions. The protective layer 6 includes a PPS film layer, a PEN film layer, a polyester film layer, a polyimide film layer, a film layer formed by curing epoxy resin ink, a film layer formed by curing polyurethane ink, a film layer formed by curing modified acrylic resin, or a film layer formed by curing polyimide resin.

[0041] Reference Figure 4 In one embodiment, the shielding film layer 2 includes a thermally conductive layer 24 and a first shielding layer 21. The thermally conductive layer 24 is disposed between the contrast layer 3 and the first shielding layer 21. The contrast layer 3 and the thermally conductive layer 24 have different grayscale values. The provision of the thermally conductive layer 24 enables the logo shielding film 100 to have a heat dissipation function. When the logo shielding film 100 is applied to a circuit board 200, heat generated by the electronic components on the circuit board 200 is transferred to the thermally conductive layer 24 of the logo shielding film 100. The thermally conductive layer 24 dissipates the heat into the air, reducing heat accumulation on the circuit board 200.

[0042] Preferably, the thermally conductive layer 24 comprises two graphite layers 241, with a thermally conductive metal layer 242 disposed between the two graphite layers 241. The dimensions of the thermally conductive metal layer 242 are not smaller than those of the graphite layers 241. In this case, the thermally conductive metal layer 242 can serve as a support for the graphite layers 241, preventing them from breaking or falling off. The thermally conductive metal layer 242 can be a copper foil layer, and the surface of the thermally conductive metal layer 242 can be roughened to improve the connection stability between the two graphite layers 241 and the thermally conductive metal layer 242. To ensure the thermal conductivity of the thermally conductive layer 244, the thermal conductivity of the thermally conductive layer 244 is 2500-2700 W / (mK), and the total thickness of the thermally conductive layer 244 is 0.02-2 mm.

[0043] Reference Figure 5 and Figure 8Specifically, the shielding film layer 2 also includes a second shielding layer 22, which is arranged on a side of the first shielding layer 21 away from the contrast layer 3. The side of the first shielding layer 21 close to the first shielding layer 21 is a non-flat surface. The side of the first shielding layer 21 close to the second shielding layer 22 is provided with convex first conductor particles 211. There can be multiple first conductor particles 211, and the multiple first conductor particles 211 can be regularly or irregularly distributed on the side of the first shielding layer 21. The side of the second shielding layer 22 close to the film layer 1 is a non-flat surface. By setting the side of the second shielding layer 22 away from the first shielding layer 21 as a non-flat surface, when the identification shielding film 100 is applied to the circuit board 200, the second shielding layer 22 can pierce the adhesive film layer 1 and connect to the ground layer of the circuit board 200 when the identification shielding film 100 and the circuit board 200 are pressed together, ensuring the ground layer connection between the identification shielding film 100 and the circuit board 200; in addition, because the side of the second shielding layer 22 close to the adhesive film layer 1 is a non-flat surface, when the identification shielding film 100 and the circuit board 200 are pressed together, the adhesive material constituting the adhesive film layer 1 is squeezed into the concave position of the non-flat surface to increase the adhesive capacity, thereby reducing the risk of board explosion. In this embodiment, the non-flat surface is a regular non-flat surface or an irregular non-flat surface. Specifically, when the non-flat surface is a regular non-flat surface, the non-flat surface is a structure with periodic undulations, and the amplitude of the undulations and the interval of the undulations on the non-flat surface are the same; when the non-flat surface is an irregular non-flat surface, the non-flat surface is a structure with non-periodic undulations, and the amplitude of the undulations and / or the interval of the undulations on the non-flat surface are different.

[0044] Specifically, a side of the first shielding layer 21 close to the second shielding layer 22 is provided with a plurality of first protrusions, which make the side of the first shielding layer 21 close to the second shielding layer 22 an uneven surface, and the first conductive particles 211 are provided on the first protrusions.

[0045] Reference Figure 6 Specifically, a convex second conductive particle 221 is provided on a side of the second shielding layer 22 adjacent to the adhesive film layer 1. Multiple second conductive particles 221 may be provided, and the plurality of second conductive particles 221 may be regularly or irregularly distributed on the side of the second shielding layer 22. The provision of the second conductive particles 221 facilitates piercing the adhesive film layer 1, thereby further ensuring electrical connection between the marking shielding film 100 and the ground layer of the circuit board 200.

[0046] Specifically, the second shielding layer 22 is provided with a plurality of second protrusions on the side thereof adjacent to the film layer 1. These second protrusions create an uneven surface on the side thereof adjacent to the film layer 1. The second conductive particles 221 are disposed on the second protrusions. By arranging the second conductive particles 221 on the second protrusions, the second shielding layer 22 can more easily penetrate the film layer 1 during the lamination process, thereby achieving grounding and improving the electromagnetic shielding effect.

[0047] Preferably, the height of the first and second conductive particles 211, 221 ranges from 0.1 microns to 30 microns. The second conductive particles 221 on the second shielding layer 22 may be at a certain distance from the outer surface of the adhesive film layer 1, or may contact the outer surface of the adhesive film layer 1 or extend beyond the outer surface of the adhesive film layer 1. Furthermore, the outer surface of the adhesive film layer 1 may be a flat surface with no undulations or a gently undulating, uneven surface. The first and second conductive particles 211, 221 comprise one or more of metal particles, carbon nanotube particles, and ferrite particles. Furthermore, the metal particles may comprise single metal particles and / or alloy particles. The single metal particles may be made of any one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, and gold, while the alloy particles may be made of any two or more of the following materials: aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, and gold. It should be noted that the first and second conductive particles 211, 221 may be made of the same material as the first or second shielding layer 21, 22, or may be made of different materials.

[0048] It should be noted that Figure 5 and Figure 6 The shapes of the first conductive particles 211 and the second conductive particles 221 are merely exemplary. Due to differences in process methods and parameters, the first conductive particles 211 and the second conductive particles 221 may also have other shapes, such as clusters, hanging ice, stalactites, or dendrites. Furthermore, the first conductive particles 211 and the second conductive particles 221 in this embodiment are not limited to the shapes shown and described above.

[0049] Preferably, the undulation of the side of the second shielding layer 22 close to the film layer 1 (i.e., the distance between the highest point and the lowest point of the side of the second shielding layer 22 close to the film layer 1) is 0.1 microns to 30 microns. Setting the undulation of the side of the second shielding layer 22 close to the film layer 1 within the above range can enhance the piercing function of the second shielding layer 22, thereby ensuring that the interference charges in the first shielding layer 21 and the second shielding layer 22 are smoothly introduced into the ground, thereby avoiding the accumulation of interference charges to form an interference source.

[0050] Preferably, the thickness of the film layer 1, the sum of the undulation of the side of the second shielding layer 22 close to the film layer 1, and the height of the second conductor particles 221 satisfy a proportional relationship of 0.5 to 2 to ensure sufficient puncture strength and glue capacity, which is specifically reflected in: on the one hand, preventing the thickness of the film layer 1 from being too small relative to the sum of the undulation of the side of the second shielding layer 22 close to the film layer 1 and the height of the second conductor particles 221, resulting in insufficient glue capacity and causing a board burst phenomenon; on the other hand, preventing the sum of the undulation of the side of the second shielding layer 22 close to the film layer 1 and the height of the second conductor particles 221 from being too small relative to the thickness of the film layer 1, resulting in insufficient puncture strength and causing grounding failure.

[0051] To further ensure the ground connection between the marking shielding film 100 and the circuit board 200, the adhesive layer 1 in this embodiment includes an adhesive layer containing conductive particles. The adhesive layer 1 including conductive particles improves the conductivity of the adhesive layer 1, thereby further ensuring the ground connection between the marking shielding film 100 and the circuit board 200.

[0052] Reference Figure 7 Specifically, the shielding film layer 2 also includes at least one third shielding layer 23. In this embodiment, only one third shielding layer 23 is provided. In other embodiments, two, three, or even more third shielding layers 23 may be provided. The third shielding layer 23 is disposed between the second shielding layer 22 and the adhesive film layer 1. The side of the third shielding layer 23 proximal to the adhesive film layer 1 is uneven. The provision of the third shielding layer 23 facilitates piercing the adhesive film layer 1, thereby further ensuring electrical connection between the marker shielding film 100 and the ground layer of the circuit board 200.

[0053] Specifically, each third shielding layer 23 is provided with convex third conductor particles 231 on one side thereof adjacent to the adhesive film layer 1. A plurality of third conductor particles 231 may be provided, and the plurality of third conductor particles 231 may be regularly or irregularly distributed on the side of the third shielding layer 23. The provision of the third conductor particles 231 facilitates piercing the adhesive film layer 1, thereby further ensuring electrical connection between the marking shielding film 100 and the ground layer of the circuit board 200.

[0054] Specifically, each third shielding layer 23 is provided with a plurality of third protrusions on the side closest to the film layer 1. These third protrusions create an uneven surface on the side of the third shielding layer 23 closest to the film layer 1. The third conductive particles 231 are disposed on the third protrusions. By arranging the third conductive particles 231 on the third protrusions, the third shielding layer 23 can more easily penetrate the film layer 1 during the lamination process, thereby achieving grounding and improving the electromagnetic shielding effect.

[0055] Preferably, the thickness of the first shielding layer 21 is 0.1 micron to 45 microns, the thickness of the second shielding layer 22 is 0.1 micron to 45 microns, the thickness of the third shielding layer 23 is 0.1 micron to 45 microns, and the thickness of the adhesive film layer 1 is 1 micron to 80 microns. The material used for the adhesive film layer 1 is selected from the following: modified epoxy resins, acrylic resins, modified rubbers, and modified thermoplastic polyimides. It will be appreciated that to ensure good electrical conductivity of the first shielding layer 21 and the second shielding layer 22, the first shielding layer 21, the second shielding layer 22, and the third shielding layer 23 each include one or more of a metal adhesive layer, a carbon nanotube adhesive layer, a ferrite adhesive layer, and a graphene adhesive layer. The metal adhesive layer includes a single metal adhesive layer and / or an alloy adhesive layer; the single metal adhesive layer is made of any one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, and the alloy adhesive layer is made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.

[0056] Preferably, the height of the third conductive particles 231 is 0.1 microns to 30 microns. The third conductive particles 231 may be at a certain distance from the outer surface of the adhesive film layer 1, or may be in contact with the outer surface of the adhesive film layer 1 or extend beyond the outer surface of the adhesive film layer 1. In this embodiment, the third conductive particles 231 may be the same as or different from the first adhesive conductive particles or the second conductive particles 221.

[0057] This embodiment further provides a circuit board 200 comprising a substrate layer and the aforementioned identification shielding film 100. The adhesive film layer 1 of the identification shielding film 100 is attached to the substrate layer. In this case, information about the circuit board 200 can be stored using the first identification code 7 and the second identification code 8, respectively, to enhance the anti-counterfeiting capabilities of the circuit board 200. Circuit board 200 can be used in computers, televisions, smart wearable devices, and the present embodiment does not impose any particular limitations thereto.

[0058] In the description herein, it should be understood that the terms "upper," "lower," "left," "right," and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely for ease of description and simplified operation. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0059] In this specification, reference to terms such as "one embodiment" or "example" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example.

[0060] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0061] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are intended solely to illustrate the principles of the present invention and are not to be construed in any way as limiting the scope of protection of the present invention. Based on the explanations herein, those skilled in the art will readily conceive of other specific embodiments of the present invention without inventive effort, and such embodiments will fall within the scope of protection of the present invention.

Claims

1. A marking shielding film, characterized in that: The invention comprises sequentially stacking a first light-transmitting adhesive layer, a contrast layer, a shielding film layer, and an adhesive film layer, wherein the contrast layer and the shielding film layer have different grayscale values, the contrast layer is provided with a hollow pattern, so that the contrast layer and the shielding film layer are combined to form a first identification code and a second identification code, the first identification code and the second identification code are arranged at intervals, the first light-transmitting adhesive layer is a semi-transmitting adhesive layer, and the first light-transmitting adhesive layer is provided with a hollow area, and the hollow area and the first identification code are directly opposite each other; The second identification code serves as an anti-counterfeiting code; when the ambient light is weak, the light can directly pass through the hollow area and shine on the first identification code, and the first identification code can be recognized. The first light-transmitting adhesive layer blocks the second identification code. At this time, the second identification code is hidden. When the ambient light is strong, the second identification code can be revealed, and the information of the second identification code can be obtained.

2. The marking shielding film according to claim 1, characterized in that: It includes a second light-transmitting adhesive layer, which is arranged on a side of the first light-transmitting adhesive layer away from the contrast layer, and has a light transmittance greater than that of the first light-transmitting adhesive layer.

3. The marking shielding film according to claim 1, wherein: The shielding film layer includes a heat-conducting layer and a first shielding layer. The heat-conducting layer is arranged between the contrast layer and the first shielding layer. The contrast layer and the heat-conducting layer have different grayscale values.

4. The marking shielding film according to claim 3, characterized in that: The heat-conducting layer includes two graphite layers, a heat-conducting metal layer is arranged between the two graphite layers, and the size of the heat-conducting metal layer is greater than or equal to the size of the graphite layer.

5. The marking shielding film according to claim 1, wherein: One of the contrast layer and the shielding film layer is black, and the other of the contrast layer and the shielding film layer is white.

6. The marking shielding film according to claim 1, wherein: The first identification code includes at least one of a barcode, a QR code and characters; and / or, The second identification code includes at least one of a barcode, a QR code and characters.

7. The marking shielding film according to claim 1, wherein: It comprises a protective layer, and the protective layer is arranged on a side of the first light-transmitting adhesive layer away from the contrast layer.

8. The marking shielding film according to claim 1, wherein: The shielding film layer includes a first shielding layer and a second shielding layer, the first shielding layer is arranged between the contrast layer and the second shielding layer, the side of the first shielding layer close to the second shielding layer is an uneven surface, the side of the first shielding layer close to the second shielding layer is provided with convex first conductor particles, and the side of the second shielding layer close to the adhesive film layer is an uneven surface.

9. The marking shielding film according to claim 8, characterized in that: A side of the second shielding layer close to the adhesive film layer is provided with convex second conductor particles.

10. The marking shielding film according to claim 8, characterized in that: The shielding film layer further includes at least one third shielding layer, which is arranged between the second shielding layer and the adhesive film layer. A side surface of the third shielding layer close to the adhesive film layer is a non-flat surface.

11. The marking shielding film according to claim 10, characterized in that: A side surface of each third shielding layer close to the adhesive film layer is provided with third conductor particles.

12. A circuit board comprising a substrate layer, characterized in that: It also includes the identification shielding film according to any one of claims 1 to 11, wherein the adhesive film layer of the identification shielding film is attached to the substrate layer.

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