Silicon wafer fixing device and degumming and separating device

Abstract

The present application relates to a kind of silicon wafer fixing device, for fixing the silicon wafer group formed after linear cutting silicon rod, comprising: two annular supports, opposite and interval are arranged along first direction;First connecting rod group is arranged between the two annular supports, in the second direction perpendicular to the first direction, the first connecting rod group includes two first connecting rods symmetrically arranged in the opposite sides of the annular support, at least one end of each first connecting rod is movably connected with the corresponding annular support, so that the distance between the two annular supports is adjustable.The present application also relates to a kind of degumming and slicing equipment.Setting silicon wafer fixing device can fix the silicon wafer group after cutting protection, avoid the damage of separated silicon wafer when degumming and slicing subsequently.

Description

Technical Field

[0001] This invention relates to the field of silicon product fixing technology, and in particular to a silicon wafer fixing device and a debonding and separating equipment. Background Technology

[0002] Silicon wafer processing technology primarily utilizes multi-wire abrasive cutting. Multi-wire cutting boasts high cutting efficiency and is therefore widely used. It is currently an advanced slicing technology. Its principle involves cutting wires passing through a set of grooved wheels to form a wire mesh with varying spacing. The high-speed reciprocating motion of the cutting wires propels the abrasive material into the processing area of ​​the material to be cut. Meanwhile, the workpiece is fed vertically by the lifting and lowering of the worktable, thus simultaneously cutting the workpiece into several thin slices of the desired size and shape.

[0003] After the multi-wire dicing process, the silicon ingot is unloaded using a tool cart and then directly subjected to cleaning, debonding, and slitting operations. Currently, after multi-wire dicing, the silicon ingot is transferred using a tool cart and installed on a debonding and slitting machine, followed directly by cleaning, debonding, and slitting operations. Because there is no protection on the surface of the silicon ingot during the transfer process after multi-wire dicing, it may be damaged by external forces during the transfer, leading to residual stress inside the silicon wafer and causing breakage in subsequent processes. Then, cleaning and debonding / slitting are performed on the debonding and slitting machine. During the cleaning process, the adhesive between the silicon wafer and the adhesive strip is affected by liquid expansion, reducing the bonding strength. Since the silicon ingot is inverted during the cleaning process, when the bonding strength is lower than the downward attraction of the silicon wafer, the silicon wafer is prone to falling off. When a silicon wafer falls, it may pull adjacent silicon wafers downwards simultaneously. After cleaning, the silicon rod will be flipped and then subjected to heating and debonding. There is a risk of silicon wafers falling off when the silicon rod is flipped. During heating and debonding, there is a risk that the silicon wafers may collapse and squeeze adjacent silicon wafers due to low bonding strength, thus amplifying the impact area. Any abnormality, even if it does not cause wafer breakage at the moment, may cause damage to the inside of the silicon wafer and lead to wafer breakage in subsequent processes. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a silicon wafer fixing device and a debonding and slitting equipment, which solves the problem that silicon wafer assemblies are easily damaged during the debonding and slitting process after cutting.

[0005] To achieve the above objectives, the technical solution adopted in this embodiment of the invention is: a silicon wafer fixing device for fixing a silicon wafer assembly formed after wire-cut silicon rods, comprising:

[0006] Two ring-shaped supports are positioned opposite each other and spaced apart along the first direction;

[0007] A first connecting rod group is disposed between the two annular supports. In a second direction perpendicular to the first direction, the first connecting rod group includes two first connecting rods symmetrically arranged around the center of the annular supports. At least one end of each first connecting rod is movably connected to the corresponding annular support, so that the distance between the two annular supports is adjustable.

[0008] Optionally, each of the annular supports has a center line, the center line extending in a second direction perpendicular to the first direction;

[0009] In the third direction, the first connecting rod group is located on one side of the center line, and in the second direction, the distance between the two first connecting rods is less than the diameter of the silicon wafer to be fixed. The third direction is perpendicular to the first direction and the third direction is perpendicular to the second direction.

[0010] Optionally, in the first direction, each of the first connecting rods includes a first end and a second end, the first end being fixedly connected to the corresponding annular bracket, and the second end being connected to the corresponding annular bracket via a telescopic connector.

[0011] Optionally, from the first end to the second end, the first connecting rod includes a first part and a second part, the second part is hollow, the retractable connector is accommodated in the second part, and one end of the retractable connector is fixed to the first part, and the other end of the retractable connector is fixed to the annular bracket corresponding to the second end.

[0012] Optionally, the retractable connector is a spring.

[0013] Optionally, a second connecting rod assembly is also included, which is detachably connected between the two annular supports. In the second direction, which is perpendicular to the first direction, the second connecting rod assembly includes two second connecting rods symmetrically arranged on opposite sides of the annular supports.

[0014] Optionally, in the third direction, the first connecting rod group and the second connecting rod group are located on opposite sides of the centerline.

[0015] Optionally, in the second direction, the distance between the two second connecting rods is less than or equal to the distance between the two first connecting rods.

[0016] Optionally, both the first connecting rod and the second connecting rod are covered with an elastic buffer layer.

[0017] Optionally, the annular bracket has a polygonal structure, and the first connecting rod is connected to the corner of the polygonal structure.

[0018] Optionally, a connector is provided at the corner to connect with the first connecting rod.

[0019] This invention also provides a debonding and slitting device, including a cleaning unit and a debonding and slitting unit, as well as the aforementioned silicon wafer fixing device;

[0020] The cleaning unit includes a cleaning tank for accommodating the silicon wafer fixing device that carries the cut silicon wafer assembly.

[0021] The debonding and slitting unit includes a debonding section and a slitting section. The debonding section is used to heat and debond the cleaned silicon wafer assembly, and the slitting section is used to slitting the silicon wafer assembly after debonding and separation from the silicon wafer fixing device.

[0022] The beneficial effects of this invention are: the silicon wafer fixing device can fix and protect the cut silicon wafer assembly, preventing damage to the separated silicon wafers during subsequent debonding and slitting. The silicon wafer fixing device includes two annular supports and a first connecting rod assembly disposed between the two annular supports. The first connecting rod assembly includes two first connecting rods to cooperate with the two annular supports to fix the cut silicon wafer assembly. At least one end of each first connecting rod is movably connected to the corresponding annular support, making the distance between the two annular supports adjustable, thus expanding its applicability to fixing silicon wafer assemblies of different lengths and facilitating the placement and removal of the silicon wafer assembly. Attached Figure Description

[0023] Figure 1 Schematic diagram of the silicon wafer fixing device in an embodiment of the present invention. Figure 1 ;

[0024] Figure 2 Schematic diagram of the silicon wafer fixing device in an embodiment of the present invention. Figure 2 ;

[0025] Figure 3 This is a schematic diagram showing the state of the silicon wafer fixing device fixing the silicon wafer group in an embodiment of the present invention;

[0026] Figure 4 A schematic diagram illustrating the state of the silicon wafer assembly being cleaned in an embodiment of the present invention;

[0027] Figure 5 This is a schematic diagram illustrating the state of silicon wafer slicing in an embodiment of the present invention. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0029] Unless otherwise defined, the technical or scientific terms used in this invention shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms "first," "second," and similar terms used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms "an," "a," or "the," etc., do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "comprising," "including," etc., mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms "connected," "linked," etc., are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up," "down," "left," "right," etc., are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0030] In related technologies, during the wire cutting process, silicon rods are fixed to workpiece 10 with adhesive. After the wire cutting process is completed, due to the presence of workpiece 10, the multiple silicon wafers formed after cutting are not separated and require cleaning, debonding, and slitting processes. However, since the cut silicon wafers do not have a fixed protective device, they are prone to breakage, falling, and some silicon wafers collapsing and squeezing adjacent silicon wafers during transportation or during debonding and cleaning processes.

[0031] refer to Figures 1-5 To address the aforementioned problems, this embodiment provides a silicon wafer fixing device for fixing a silicon wafer assembly 20 formed after wire-cutting a silicon rod, comprising:

[0032] Two ring-shaped supports 1, along the first direction (reference) Figure 1 The X direction (in the image) is set relative to and spaced apart;

[0033] The first connecting rod group 2 is disposed between the two annular supports 1. In the second direction perpendicular to the first direction, the first connecting rod group 2 includes two first connecting rods 21 symmetrically arranged around the center of the annular supports. The extension direction of the two first connecting rods 21 is parallel to the first direction. At least one end of each first connecting rod 21 is movably connected to the corresponding annular support 1 so that the distance between the two annular supports 1 is adjustable.

[0034] The silicon wafer fixing device can protect the silicon wafers. During transportation, cleaning, or degumming processes, the silicon wafer assembly 20 is fixed in the silicon wafer fixing device, effectively preventing the silicon wafers from falling or tilting.

[0035] At least one end of each of the first connecting rods 21 is movably connected to the corresponding annular bracket 1, so that the distance between the two annular brackets 1 is adjustable, thus expanding its applicability to fixing silicon wafer assemblies 20 of different lengths and facilitating the placement and removal of the silicon wafer assemblies 20. Figure 1 and Figure 2 , Figure 2 The figure shows the state where the distance between the two annular supports 1 increases.

[0036] In an exemplary embodiment, each of the annular supports 1 has a center line, the center line extending in a second direction perpendicular to the first direction (see reference). Figure 1 Y direction in );

[0037] In the third party (reference) Figure 1 In the Z direction, the first connecting rod group 2 is located on one side of the center line, and in the second direction, the distance between the two first connecting rods 21 is less than the diameter of the silicon wafer to be fixed. The third direction is perpendicular to the first direction and the third direction is perpendicular to the second direction.

[0038] The silicon wafers in the silicon wafer assembly 20 are generally circular, and when fixing the silicon wafer assembly 20, the silicon wafers are positioned below the workpiece 10 (see reference). Figure 3 (The silicon wafer group is fixed in the silicon wafer fixing device). The silicon wafer fixing device is in direct contact with the silicon wafer in the silicon wafer group 20. Therefore, the first connecting rod group 2 is located on one side of the center line. The distance between the two first connecting rods 21 is less than the diameter of the silicon wafer of the silicon wafer group to be fixed. When the silicon wafer group 20 is fixed, it is in contact with the edge of the lower half of the silicon wafer of the silicon wafer group 20, so as to effectively fix the silicon wafer group 20.

[0039] It should be noted that the number of the first connecting rod group 2 can be set according to actual needs, as long as it can support and fix the silicon wafer group 20. Figures 1-3 In this context, the silicon wafer fixing device has two sets of the first connecting rod group 2, but is not limited thereto.

[0040] In an exemplary embodiment, in the first direction, each of the first connecting rods 21 includes a first end and a second end, the first end being fixedly connected to the corresponding annular bracket 1, and the second end being connected to the corresponding annular bracket 1 via a telescopic connector 5.

[0041] There are multiple ways to connect the first end to the annular bracket 1. For example, both the annular bracket 1 and the first connecting rod 21 are made of metal to ensure their support strength. The first end of the first connecting rod 21 and the corresponding annular bracket 1 can be fixedly connected by welding, or the first end of the first connecting rod 21 and the corresponding annular bracket 1 can be connected by bolts or other means.

[0042] The second end of the first connecting rod 21 is connected to the corresponding annular bracket 1 via a telescopic connector 5. This allows the distance between the two annular brackets 1 to be adjusted by extending or retracting the telescopic connector 5, thereby accommodating the placement and removal of different silicon wafer assemblies.

[0043] The specific structural form of the telescopic connector can be various. For example, the telescopic connector can be an elastic body, which can adjust the distance between the two annular supports 1 through elastic deformation; or, the telescopic connector can also be a telescopic rod, including an inner rod and an outer rod sleeved together. Along the extension direction of the telescopic rod, the outer rod is provided with multiple through holes, and the inner rod is provided with protrusions. The protrusions can cooperate with the through holes to adjust the overall length of the telescopic rod.

[0044] For example, when the retractable connector is an elastic body, the distance between the two annular supports 1 is adjusted by elastic deformation.

[0045] This allows the distance between the two annular supports 1 to be adjusted by the elastic deformation of the retractable connector 5. When placing the silicon wafer assembly 20 to be fixed, the corresponding annular support 1 (the one connected to the second end) can be pulled directly, causing the retractable connector 5 to deform and thus increasing the distance between the two annular supports 1. After placing the silicon wafer assembly 20 to be fixed, the corresponding annular support 1 returns to its original position, which facilitates the fixing of the silicon wafer assembly 20. Therefore, in this embodiment, the retractable connector 5 is preferably an elastic body.

[0046] For example, the elastomer may be a spring, but is not limited thereto.

[0047] In an exemplary embodiment, from the first end to the second end, the first connecting rod 21 includes a first part and a second part, the second part is hollow, the retractable connector 5 is accommodated in the second part, and one end of the retractable connector 5 is fixed to the first part, and the other end of the retractable connector 5 is fixed to the annular bracket 1 corresponding to the second end.

[0048] When the retractable connector 5 is an elastic body, the hollow second part guides the retractable connector 5, preventing it from shifting in the second direction. When the retractable connector 5 is an elastic body, in its natural state, the retractable connector 5 is completely contained within the second part, which is beneficial to the stability of the silicon wafer assembly 20.

[0049] In an exemplary embodiment, a latch is provided between the first connecting rod 21 and the annular bracket 1, so that after the silicon wafer assembly 20 is fixed in the silicon wafer fixing device, the latch locks the first connecting rod 21 and the annular bracket, thereby preventing the retractable connector 5 from deforming due to external force and causing damage to the silicon wafer.

[0050] The latch can have various specific structural forms. For example, the latch includes a magnetic connecting block disposed between the end face of the second end and the annular ring, which locks the first connecting rod and the annular bracket 1 by magnetic attraction. The latch may also include a locking plate disposed on the outer peripheral surface of the second end of the first connecting rod 21, the locking plate having a locking hole, and the annular bracket 1 having a protrusion corresponding to the locking plate, the locking hole cooperating with the protrusion to achieve the locking function.

[0051] It should be noted that the length of the second part can be set according to actual needs. For example, the length of the second part is less than half the length of the corresponding first connecting rod 21, and the length of the second part is greater than 1 / 3 of the length of the corresponding first connecting rod 21, but it is not limited to this.

[0052] In an exemplary embodiment, the first connecting rod 21 is a telescopic connecting rod, including a hollow main rod and a secondary rod inserted into the main rod. The secondary rod can telescopically move along the main rod to adjust the length of the first connecting rod 21, thereby adjusting the distance between the two annular supports 1.

[0053] In an exemplary embodiment, the silicon wafer fixing device further includes a second connecting rod group 3, which is detachably connected between the two annular supports 1. In the second direction perpendicular to the first direction, the second connecting rod group 3 includes two second connecting rods 31 symmetrically arranged on opposite sides of the annular supports 1.

[0054] The second connecting rod group 3 facilitates the placement and removal of the silicon wafer group 20 to be fixed. It also facilitates the assembly and maintenance of the second connecting rod group 3 and the annular support 1.

[0055] In an exemplary embodiment, in the third direction, the first connecting rod group 2 and the second connecting rod group 3 are located on opposite sides of the centerline.

[0056] The first connecting rod group 2 and the second connecting rod group 3 cooperate to further improve the stability of the silicon wafer fixing device in fixing the silicon wafer group 20. Furthermore, the cooperation of the first connecting rod group 2 and the second connecting rod group 3 allows the silicon wafer group 20, which is fixed in the silicon wafer fixing device, to be flipped, increasing the flexibility of the silicon wafer fixing device. After the cut silicon wafer group 20 is cleaned, it needs to be flipped before being heated to remove the adhesive. In this way, the cleaned silicon wafer group 20 can be directly flipped using the silicon wafer fixing device, effectively preventing problems such as silicon wafer falling or fragmentation.

[0057] In an exemplary embodiment, in the second direction, the distance between the two second connecting rods 31 is less than or equal to the distance between the two first connecting rods 21.

[0058] In some embodiments, the first connecting rod assembly 2 and the annular bracket 1 can also be detachably connected. The first end of the first connecting rod 21 is connected to the corresponding annular bracket 1 via a first mounting member. The movable connecting member 4 can be a connecting block with a mounting hole. The extension direction of the mounting hole is parallel to the first direction. An internal thread is provided on the inner wall of the mounting hole. An external thread matching the internal thread is provided on the outer circumferential surface of the first end of the first connecting rod 21, so that the first end of the first connecting rod 21 is screwed into the mounting hole. The second end of the first connecting rod 21 is connected to the corresponding annular bracket 1 via a second mounting member. The telescopic connecting member 5 is fixedly connected to one side of the second mounting member. A connecting post is provided on the other side of the second mounting member. An external thread is provided on the outer circumferential surface of the connecting post. A connecting hole is provided on the annular bracket 1 corresponding to the second end of the first connecting rod 21. The connecting post is screwed into the connecting hole and locked by a nut after being screwed into the connecting hole.

[0059] Although both the first connecting rod group 2 and the second connecting rod group 3 can be detachably connected to the annular bracket 1, the first connecting rod group 2 is equipped with the telescopic connector 5, making it more convenient to remove and place the silicon wafer group 20 by disassembling the second connecting rod group 3. Therefore, in some embodiments, in the second direction, the distance between the two second connecting rods 31 is less than or equal to the distance between the two first connecting rods 21, serving as an indicator to help users intuitively locate the detachable second connecting rod group 3. Furthermore, the first connecting rod group 2 is located below and is mainly used for load-bearing. The distance between the two second connecting rods 31 is less than or equal to the distance between the two first connecting rods 21, which is more conducive to the stability of the silicon wafer group 20.

[0060] In an exemplary embodiment, both the first connecting rod 21 and the second connecting rod 31 are covered with an elastic buffer layer.

[0061] The elastic buffer layer can protect the silicon wafer and prevent it from directly contacting the rigid first connecting rod 21 or the second connecting rod 31, thus preventing damage to the silicon wafer.

[0062] The elastic buffer layer can be made of plastics such as PET (polyethylene terephthalate) or elastic materials such as foam.

[0063] The annular support 1 can be circular, but to increase its stability, in an exemplary embodiment, the annular support 1 is a polygonal structure, with the first connecting rod 21 connected to the corner of the polygonal structure. This facilitates the connection between the annular support 1 and the first connecting rod group 2 and the second connecting rod group 3.

[0064] In an exemplary embodiment, a connector 4 connected to the first connecting rod 21 is provided at the corner.

[0065] The connector 4 is fixedly connected to the annular bracket 1 or movably connected to the annular bracket 1. When the annular bracket 1 has a polygonal structure, the connector 4 can be used to connect two adjacent sides of the polygonal structure. The annular bracket 1 can be a single-piece structure, with the connector 4 covering the corners of the polygonal structure. The connector 4 facilitates the connection between the first connecting rod group 2 and the second connecting rod group 3 and the annular bracket 1, improving the stability of the silicon wafer fixing device.

[0066] In an exemplary embodiment, when the annular support 1 is a polygonal structure, the polygonal structure has a first corner and a second corner, and there is at least one corner between the first corner and the second corner. A reinforcing rod 101 is connected between the first corner and the second corner to improve the stability of the annular support 1.

[0067] For example, the polygonal structure includes at least one of the reinforcing rods 101, which divides the polygonal structure into multiple triangles, thereby improving the stability of the annular support 1 by utilizing the stability of the triangles.

[0068] Figure 1 and Figure 2 The annular bracket is a hexagonal structure, and the extension direction of the reinforcing rod 101 is parallel to the second direction, dividing the annular bracket into two trapezoidal structures, but not limited thereto.

[0069] This invention also provides a debonding and slitting device, including a cleaning unit and a debonding and slitting unit, as well as the aforementioned silicon wafer fixing device;

[0070] The cleaning unit includes a cleaning tank 100, which is used to accommodate the silicon wafer fixing device that carries the cut silicon wafer assembly 20.

[0071] The debonding and slitting unit includes a debonding section and a slitting section. The debonding section is used to heat and debond the cleaned silicon wafer group 20, and the slitting section is used to slitting the silicon wafer group 20 after debonding and separation from the silicon wafer fixing device.

[0072] The silicon rod is fixed to the workpiece 10 with adhesive and then cut by wire cutting. After the silicon rod is cut, multiple silicon wafers are formed. However, the multiple silicon wafers are still connected to the adhesive (i.e., silicon wafer group 20). They need to be cleaned, de-adheded, and separated. To separate the multiple silicon wafers, the multiple silicon wafers need to be transported to the cleaning unit by a tool cart. Before being placed on the tool cart, the multiple silicon wafers are fixed in the silicon wafer fixing device to prevent the silicon wafers from falling off during transportation.

[0073] Figure 4 This is a schematic diagram showing the silicon wafer fixing device 200, which carries the silicon wafer assembly, placed in the cleaning tank 100. The cleaning tank 100 contains cleaning fluid and may also be equipped with an ultrasonic generator to clean the silicon wafers using ultrasonic waves. During cleaning, the silicon wafers are fixed to the silicon wafer fixing device before being placed in the cleaning tank 100 together with the silicon wafer assembly for cleaning. Even if the adhesive strength between the silicon wafer and the workpiece 10 decreases during the cleaning process, the silicon wafer fixing device protects against problems such as the silicon wafer falling or tilting.

[0074] After cleaning, multiple silicon wafers need to be heated to remove the adhesive. The debonding process includes a heating chamber. During this process, the silicon wafers are always fixed in the silicon wafer fixing device.

[0075] Figure 5 This diagram illustrates the state of the silicon wafer holding device 200, which carries a silicon wafer assembly, before wafer slicing, placed within the slicing slot 300. During wafer slicing, the slicing section includes a slicing arm 400, which removes and places each silicon wafer. Before the slicing arm 400 performs the slicing, multiple silicon wafers need to be separated from the silicon wafer holding device to facilitate wafer removal.

[0076] It should be noted that the separation of multiple silicon wafers from the silicon wafer fixing device can be complete or partial. For example, the second connecting rod group 3 located above the center line of the annular bracket 1 can be disassembled. If the first connecting rod group 2 is located above the center line of the annular bracket 1, the corresponding first connecting rod group 2 can be disassembled. This facilitates the placement and removal of the silicon wafers. Furthermore, the first connecting rod group 2 located below the center line of the annular bracket 1 can also support the multiple silicon wafers, preventing damage to the silicon wafers.

[0077] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A silicon wafer fixing device for fixing a silicon wafer assembly formed after wire-cut silicon rods, characterized in that, include: Two ring-shaped supports are positioned opposite each other and spaced apart along the first direction; A first connecting rod group is disposed between the two ring supports. In a second direction perpendicular to the first direction, the first connecting rod group includes two first connecting rods symmetrically arranged around the center of the ring supports. At least one end of each first connecting rod is movably connected to the corresponding ring support, so that the distance between the two ring supports is adjustable. Each of the ring-shaped supports has a center line, the center line extending in a second direction perpendicular to the first direction; In the third direction, the first connecting rod group is located on one side of the center line, and in the second direction, the distance between the two first connecting rods is less than the diameter of the silicon wafer to be fixed. The third direction is perpendicular to the first direction and the third direction is perpendicular to the second direction. It also includes a second connecting rod group, which is detachably connected between the two annular supports. In the second direction, which is perpendicular to the first direction, the second connecting rod group includes two second connecting rods symmetrically arranged on opposite sides of the annular supports. In the third direction, the first connecting rod group and the second connecting rod group are located on opposite sides of the center line.

2. The silicon wafer fixing device according to claim 1, characterized in that, In the first direction, each of the first connecting rods includes a first end and a second end, the first end being fixedly connected to the corresponding annular bracket, and the second end being connected to the corresponding annular bracket via a telescopic connector.

3. The silicon wafer fixing device according to claim 2, characterized in that, From the first end to the second end, the first connecting rod includes a first part and a second part. The second part is hollow, and the retractable connector is housed within the second part. One end of the retractable connector is fixed to the first part, and the other end of the retractable connector is fixed to the annular bracket corresponding to the second end.

4. The silicon wafer fixing device according to claim 2, characterized in that, The retractable connector is a spring.

5. The silicon wafer fixing device according to claim 1, characterized in that, In the second direction, the distance between the two second connecting rods is less than or equal to the distance between the two first connecting rods.

6. The silicon wafer fixing device according to claim 1, characterized in that, Both the first connecting rod and the second connecting rod are covered with an elastic buffer layer.

7. The silicon wafer fixing device according to claim 1, characterized in that, The ring-shaped bracket has a polygonal structure, and the first connecting rod is connected to the corner of the polygonal structure.

8. The silicon wafer fixing device according to claim 7, characterized in that, A connector is provided at the corner to connect with the first connecting rod.

9. A degumming and separating device, characterized in that, It includes a cleaning unit and a debinding and slitting unit, as well as the silicon wafer fixing device according to any one of claims 1-8; The cleaning unit includes a cleaning tank for accommodating the silicon wafer fixing device that carries the cut silicon wafer assembly. The debonding and slitting unit includes a debonding section and a slitting section. The debonding section is used to heat and debond the cleaned silicon wafer assembly, and the slitting section is used to slitting the silicon wafer assembly after debonding and separation from the silicon wafer fixing device.

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