Cleaning unit, substrate processing device including the same, and head cleaning method

Abstract

A substrate processing apparatus is disclosed. The apparatus includes: a head unit having at least one nozzle for spraying a processing liquid onto a substrate; and a cleaning unit for cleaning the head, wherein the cleaning unit includes: a first cleaning member for spraying the cleaning liquid onto the head; and a second cleaning member for forming a suction space when in close contact with the head and combining with the head to remove impurities attached to the head by applying reduced pressure to the suction space.

Description

Technical Field

[0001] Embodiments of the present disclosure described herein relate to a cleaning unit, a substrate processing apparatus including the cleaning unit, and a head cleaning method. Background Art

[0002] In recent years, display elements such as liquid crystal display elements and organic EL display elements are required to have high resolution. To produce high-resolution display elements, it is necessary to form more pixels per unit area on a substrate, and it is important to accurately eject ink into each of the densely arranged pixels. This is because otherwise, a poorly manufactured display element may be identified as defective.

[0003] On the other hand, the ink typically used to manufacture display elements has the property of solidifying without flowing. Furthermore, as mentioned above, the diameter of the nozzles used to eject ink in the head is often very small to allow for the delivery of ink to each of the densely arranged pixels. Consequently, these nozzles can become clogged with solidified ink, rendering them unusable.

[0004] Furthermore, sometimes solidified ink adheres to both the inside and outside of the head, making it impossible to remove. When solidified ink adheres to the inside of the head, a method is used to clean the inside of the head by supplying high-pressure ink to the head and ejecting ink from the head. However, even this high-pressure purge operation may fail to remove the solidified ink. In this case, some nozzles become unusable. As the number of unusable nozzles increases, the number of substrates that can be processed per unit time decreases, and the head replacement cycle also shortens. Furthermore, there is the problem of consuming a very large amount of ink during the high-pressure purge operation. Summary of the Invention

[0005] Embodiments of the present disclosure provide a cleaning unit capable of effectively performing head maintenance, a substrate processing apparatus including the cleaning unit, and a head cleaning method.

[0006] In addition, embodiments of the present disclosure provide a cleaning unit capable of effectively removing solidified ink (processing liquid) adhering to the inside of a head, a substrate processing apparatus including the cleaning unit, and a head cleaning method.

[0007] Furthermore, embodiments of the present disclosure provide a cleaning unit capable of extending a head replacement cycle, a substrate processing apparatus including the cleaning unit, and a head cleaning method.

[0008] The objects of the present disclosure are not limited to the above objects, and any other objects not mentioned herein will be clearly understood by those skilled in the art from the following description.

[0009] The present disclosure provides a substrate processing apparatus. The apparatus includes: a head unit including a head having at least one nozzle for spraying a processing liquid onto a substrate; and a cleaning unit configured to clean the head, wherein the cleaning unit includes: a first cleaning member that sprays the cleaning liquid onto the head; and a second cleaning member that, when in close contact with the head, combines with the head to form a suction space and removes impurities attached to the head by applying reduced pressure to the suction space.

[0010] According to one embodiment, the second cleaning member includes a suction portion facing a lower portion of the head and having at least one suction hole formed therein, and a sealing portion disposed above the suction portion to maintain airtightness of the suction space.

[0011] According to an embodiment, the substrate processing apparatus may further include at least one suction line transmitting reduced pressure to the suction hole, and a decompression member transmitting reduced pressure to the suction line.

[0012] According to one embodiment, the suction line and the suction hole may be provided in plural, and each suction line may be installed with a suction valve.

[0013] According to one embodiment, the substrate processing device may further include a liquid supply unit that supplies processing liquid to the head unit and a controller that controls the liquid supply unit, the head unit and the cleaning unit, and the controller may control the liquid supply unit, the head unit and the cleaning unit so that the first cleaning member supplies cleaning liquid to the head unit and the second cleaning member is in close contact with the head unit to form a suction space.

[0014] According to an embodiment, the controller may control the cleaning unit to remove foreign matter attached to the head by providing reduced pressure to the suction space.

[0015] According to an embodiment, the liquid supply unit may include a reservoir containing the treatment liquid, a supply line supplying the treatment liquid from the reservoir to the head, and a recovery line recovering the treatment liquid from the head to the reservoir.

[0016] According to one embodiment, a supply valve may be installed in the supply line, and a recovery valve may be installed in the recovery line.

[0017] According to an embodiment, the controller may control the cleaning unit so that the supply valve and the recovery valve are closed when the decompression member provides decompression to the suction space.

[0018] According to an embodiment, the controller may control the cleaning unit to open one of the suction valves and then open the other one of the suction valves.

[0019] According to an embodiment, the controller may control the liquid supply unit and the cleaning unit so that the liquid supply unit performs a purge operation of supplying the processing liquid to the head while providing reduced pressure to the suction space.

[0020] According to one embodiment, the first cleaning component may spray the cleaning liquid in a steam form toward the head.

[0021] The present disclosure also provides a cleaning unit for cleaning a head that ejects ink onto a substrate. The cleaning unit may include a second cleaning member that forms a suction space when in close contact with the head and removes impurities attached to the head by providing reduced pressure in the suction space.

[0022] According to an embodiment, the cleaning unit may further include a first cleaning member configured to spray cleaning liquid in a steam form toward the head.

[0023] According to an embodiment, the second cleaning member may include a suction portion facing the lower portion of the head and having at least one suction hole formed therein; and a sealing portion disposed above the suction portion to maintain airtightness of the suction space.

[0024] According to an embodiment, the cleaning unit may further include at least one suction line transmitting reduced pressure to the suction portion and a decompression member transmitting reduced pressure to the suction line.

[0025] The present disclosure also provides a method for cleaning a head having a nozzle for spraying a processing liquid onto a substrate. The method may include: forming a suction space by closely contacting a cleaning member providing reduced pressure with a lower portion of the head, wherein the suction space is defined by the combination of the head and the cleaning member; and applying reduced pressure to the suction space to remove impurities attached to the head.

[0026] According to an embodiment, the method may further include closing a valve of a liquid supply unit that supplies the treatment liquid to the head when the reduced pressure is applied to the suction space.

[0027] According to one embodiment, when the cleaning member is in close contact with the head, the sealing portion of the cleaning member may be in close contact with the head to maintain airtightness of the suction space.

[0028] According to an embodiment, the method may further include spraying cleaning liquid in a steam form toward the lower portion of the head. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The above and other objects and features of the present disclosure will become more apparent from the detailed description of embodiments with reference to the accompanying drawings.

[0030] Figure 1 is a view showing a substrate processing apparatus according to an embodiment of the present disclosure.

[0031] Figure 2 It shows Figure 1 A view of the appearance of the head and supply unit.

[0032] Figure 3 It is schematically shown Figure 1 FIG. 1 is a view of a first cleaning member of a cleaning unit.

[0033] Figure 4 It is schematically shown Figure 1 FIG. 1 is a view of a second cleaning member of a cleaning unit.

[0034] Figure 5 FIG. 4 is a flow chart schematically illustrating a head washing method according to an embodiment of the present disclosure.

[0035] Figure 6 is schematically shown Figure 5 FIG. 1 is a view of a substrate processing apparatus during a first processing operation.

[0036] Figure 7 is schematically shown Figure 5 FIG. 1 is a diagram illustrating an example of a substrate processing apparatus for a second processing operation.

[0037] Figure 8 is schematically shown Figure 5 FIG. 1 is a view of another example of a substrate processing apparatus for a second processing operation.

[0038] Figures 9 to 12 is schematically shown Figure 5 FIG. 1 is a view of another example of a substrate processing apparatus for a second processing operation. DETAILED DESCRIPTION

[0039] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings so that a person skilled in the art can easily implement the present disclosure. However, the present disclosure can be implemented in a variety of different forms and is not limited to the embodiments described herein. In addition, when describing the preferred embodiments of the present disclosure in detail, detailed descriptions of well-known functions or configurations will be excluded to avoid unnecessarily obscuring the subject matter of the present disclosure. In addition, for parts with similar functions and effects, the same reference numerals are used throughout the drawings.

[0040] In addition, throughout the specification, unless otherwise expressly described, the word "include" or "comprising" will be understood to imply the inclusion of another element rather than the exclusion of any other element. It should also be understood that the terms "include," "have," "comprises," and / or their variations, when used in this specification, specify the presence of stated features, numbers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, numbers, steps, operations, elements, components, and / or groups thereof.

[0041] As used herein, a singular form may also include a plural form, unless the context clearly indicates otherwise. In addition, the shapes, sizes, etc. of elements in the drawings may be exaggerated for clearer description.

[0042] Terms such as first and / or second can be used to describe different elements, but these elements should not be limited by the terms. These terms can be used to distinguish one element from another element. For example, without departing from the scope of this disclosure, a first component can be referred to as a second component, and similarly, a second component can be referred to as a first component.

[0043] It should also be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element, or intervening elements may be present. Conversely, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements. Other expressions describing the relationship between components, such as "between" and "exactly between" or "adjacent" and "directly adjacent," should be interpreted similarly.

[0044] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as those commonly understood by those skilled in the art to which the present disclosure belongs. Terms defined in general dictionaries should be interpreted as having the same meaning as in the context of the relevant technical field, and should not be interpreted as having an ideal or overly formal meaning unless expressly defined as having such meaning in this application.

[0045] In the following, reference will be made to Figures 1 to 12 Embodiments of the present disclosure are described.

[0046] Figure 1 1 is a view showing a substrate processing apparatus according to an embodiment of the present disclosure. Figure 1 The substrate processing apparatus 100 according to an embodiment of the present disclosure may be an inkjet device that processes a substrate "S" by supplying a liquid chemical such as ink to the substrate "S." For example, the substrate processing apparatus 100 may perform a printing process on the substrate "S" by discharging ink (I, an example of a processing liquid) in the form of droplets onto the substrate "S." Furthermore, the substrate "S" may be a glass substrate. However, the present invention is not limited thereto, and various modifications may be made to the type of substrate "S."

[0047] The substrate processing apparatus 100 may include a printing area 10 , a maintenance area 20 , a hanger 30 , a head unit 40 , a nozzle alignment unit 50 , a vision member 60 , a liquid supply unit 70 , a controller 80 , and a head cleaning unit 200 .

[0048] When viewed from above, the printing area 10 may have a longitudinal direction along a first direction "X." Hereinafter, when viewed from above, a direction perpendicular to the first direction "X" is referred to as a second direction "Y," and a direction perpendicular to both the first and second directions "X" is referred to as a third direction "Z." The third direction "Z" may be a direction perpendicular to the ground. Furthermore, the first direction "X" may be a direction for transporting a substrate "S," which will be described later. In the printing area 10, the head unit 40, which will be described later, may eject ink "I" in the form of droplets toward the substrate "S," thereby performing a printing process on the substrate "S."

[0049] Furthermore, the substrate "S" conveyed in the printing area 10 can be kept suspended. Therefore, a lifting platform capable of raising and lowering the substrate "S" during conveyance can be provided in the printing area 10. Furthermore, a conveying unit for holding one or both sides of the substrate "S" while conveying it can be further provided in the printing area 10. This conveying unit can include guide rails provided along one or both sides of the suspension platform, grippers that slide along the guide rails while holding one or both sides of the substrate "S," and the like. Furthermore, the substrate "S" conveyed in the printing area 10 can be conveyed along a first direction "X."

[0050] The maintenance area 20 primarily performs maintenance on the head unit 40, which will be described later. When viewed from above, the longitudinal direction of the maintenance area 20 may be a first direction "X." Furthermore, the maintenance area 20 may be arranged parallel to the printing area 10. For example, the maintenance area 20 and the printing area 10 may be arranged side by side in a second direction "Y."

[0051] Furthermore, since the head unit 40 to be described later may eject the ink “I” in the form of droplets in the maintenance area 20 , the maintenance area 20 may have a processing environment that is the same as or similar to that of the printing area 10 .

[0052] The hanger 30 may also be configured to enable the head unit 40 to be described later or the visual component 60 to be described later to perform linear reciprocating motion. The hanger 30 may include a first hanger 31, a second hanger 32, and a third hanger 33. The first hanger 31 and the second hanger 32 may be configured to have a structure extending across the printing area 10 and the maintenance area 20. In addition, the first hanger 31 and the second hanger 32 may be spaced apart from each other along the first direction "X". That is, the first hanger 31 and the second hanger 32 may be configured to have a structure extending along the second direction Y (the arrangement direction of the printing area 10 and the maintenance area 20), so that the head unit 40 to be described later can reciprocate between the printing area 10 and the maintenance area 20 along the second direction "Y".

[0053] Furthermore, the third hanger 33 may be provided to have a structure extending across the maintenance area 20 in the second direction "Y". That is, the third hanger 33 may be provided to have a structure extending so that the visual member 60 to be described later can move in the second direction "Y".

[0054] The head unit 40 can eject ink "I" in the form of droplets onto a substrate "S." The ink "I" ejected from the head unit 40 can solidify after a certain period of inactivity. The head unit 40 can perform a printing process on the substrate "S" by ejecting the ink "I" in the form of droplets onto the substrate "S." For example, the head unit 40 can perform a printing process on the substrate "S" by ejecting the ink "I" onto the substrate "S" while reciprocating in a second direction "Y." Specifically, when the head unit 40 is positioned in a first position when viewed from above, the substrate "S" can be transported in a first direction "X" and pass through an area below the head unit 40. In this case, the head unit 40 can eject the ink "I" onto the substrate "S." After the substrate "S" passes through the area below the head unit 40, the head unit 40 can move in a second direction "Y" and be positioned in a second position. Again, the substrate "S" can move in a direction opposite to the direction in which the head unit 40 was positioned in the first position and again pass through the area below the head unit 40. In this case, the head unit 40 may eject the ink "I" toward the substrate "S." The operation of the head unit 40 ejecting the ink "I" toward the substrate "S" while the substrate "S" passes through the area below the head unit 40 may be referred to as one swath operation, and the printing process on the substrate "S" may be completed by performing the swath operation multiple times.

[0055] The head unit 40 may include a head 42 , a head frame 44 , a driving member 45 , a first imaging member 46 , and a second imaging member 48 .

[0056] A plurality of nozzles 42a may be formed in the head 42 to eject ink "I" in the form of droplets. At least one head 42 may be provided. For example, a plurality of heads 42 may be provided. The plurality of heads 42 may be arranged side by side along a first direction "X." The plurality of heads 42 may be assembled into a head frame 44. The head 42 may include a head body and a nozzle plate mounted below the head body and having the nozzles 42a formed thereon.

[0057] In addition, the driving member 45 can move the head frame 44. Specifically, the driving member 45 can be configured to move the head frame 44 along the second direction "Y" that is the longitudinal direction of the first hanger 31 and the second hanger 32. In addition, the driving member 45 can be configured to move the head frame 44 along the third direction "Z". The driving member 45 can move the head frame 44 in the third direction "Z" to bring the head frame 44 into close contact with the second cleaning member 250, which will be described later.

[0058] Furthermore, when viewed from above, the first imaging element 46 and the second imaging element 48 may be coupled to one side of the head frame 44. The first imaging element 46 and the second imaging element 48 may be arranged side by side along the first direction "X." The first imaging element 46 and the second imaging element 48 may enable recognition of the ink "I" in the form of droplets ejected from the head 42. The first imaging element 46 and the second imaging element 48 may be cameras including image acquisition modules.

[0059] The nozzle alignment unit 50 may be provided in the maintenance area 20. The nozzle alignment unit 50 may be provided between the first hanger 31 and the second hanger 32 when viewed from above. Thus, the nozzle alignment unit 50 may enable identification of the state of the nozzle 42a formed in the head 42. For example, the nozzle alignment unit 50 may include a moving rail 52 and a camera member 54. The longitudinal direction 52 of the moving rail may be a first direction "X". The camera member 54 may perform linear reciprocating motion in the first direction "X" which is the longitudinal direction of the moving rail 52. The camera member 54 may capture an image of the nozzle 42a of the head 42 while moving along the longitudinal direction of the moving rail 52.

[0060] The visual component 60 may be mounted on the third hanger 33 so as to be movable in the second direction "Y" that is the longitudinal direction of the third hanger 33. The visual component 60 may be a camera including an image acquisition module. The visual component 60 may capture an image of the ink "I" ejected onto a virtual substrate (not shown, a substrate for checking the amount of ink "I" ejected from the head unit 42 or the impact point of the ink (I), etc.) that may be set in the maintenance area 20, and transmit the captured image to the controller 80, which will be described later. The controller 80 may analyze the image captured by the visual component 60 and calculate data for calibrating the points of the ink droplets ejected by the head unit 40, the movement speed of the head unit 42, the movement speed of the substrate, and the like.

[0061] The liquid supply unit 70 may be configured to supply and / or recover ink “I” as a treatment liquid to and / or from the head unit 40 . Figure 2 It shows Figure 1 A view of the exterior of the head and supply unit. Figure 2The liquid supply unit 70 may include a liquid reservoir 71 , a supply line 72 , a supply valve 73 , a recovery line 74 , a recovery valve 75 , a discharge line 76 , and a discharge valve 77 .

[0062] The reservoir 71 may have a storage space for storing the ink “I.” A stirrer may be installed in the reservoir 71 to impart fluidity to the ink “I” stored in the storage space to prevent the ink “I” from solidifying.

[0063] The supply line 72 may be configured to supply ink "I" from the reservoir 71 to the head 42. A supply valve 73, serving as an on-off valve or a flow control valve, may be installed in the supply line 72. When the head 42 is viewed in the first direction "X," the supply line 72 may be connected to one side of the head 42. A recovery line 74 may be configured to recover the ink "I" from the head 42 to the reservoir 71. A recovery valve 75 may be installed in the recovery line 74. When the head 42 is viewed in the first direction "X," the recovery line 74 may be connected to the other side of the head 42. A discharge line 76 may branch from the recovery line 74. A discharge valve 77 may be installed in the discharge line 76. The discharge line 76 may branch from the recovery line 74 to allow at least a portion of the ink "I" to flow into the recovery line 74 for discharge outside the substrate processing apparatus 100. Furthermore, a pressure regulator capable of adjusting the pressure of the storage space may be provided within the reservoir 71. The ink “I” may be supplied to or recovered from the head 42 based on the pressure in the accommodation space and the opening and closing of the supply valve 73 , the recovery valve 75 , and the discharge valve 77 .

[0064] Return to reference Figure 1 The controller 80 may control the substrate processing apparatus 100. The controller 80 may control the substrate processing apparatus 100 so that the substrate processing apparatus 100 performs a processing process on the substrate "S." For example, the controller 80 may control the substrate processing apparatus 100 so that the substrate processing apparatus 100 performs a printing process on the substrate "S." In addition, the controller 80 may control the head unit 40, the supply unit 70, and the cleaning unit 200 of the substrate processing apparatus 100.

[0065] In addition, the controller 80 may include a process controller, which includes a microprocessor (computer) that controls the substrate processing device 100; a user interface, which includes a keyboard, etc. for an operator to input commands, etc. to manage the substrate processing device 100; a display, which visualizes and displays the operating status of the substrate processing device 100; and a memory, which stores a control program for executing the process performed in the substrate processing device 10 under the control of the process controller or a program for causing each component to perform the process according to various data and process conditions, i.e., a process plan. In addition, the user interface and a storage unit may be connected to the process controller. The process plan can be stored in a storage medium of the storage unit, which can be a hard disk, a removable disk such as a CD-ROM, a DVD, or a semiconductor memory such as a flash memory.

[0066] A cleaning unit 200, which cleans the head, may be installed in the maintenance area 20. The cleaning unit 200 may be configured to be movable in the maintenance area 20. For example, the cleaning unit 200 may be configured to be movable in a first direction "X" in the maintenance area 20. For example, the cleaning unit 200 may be configured to be movable in a direction parallel to the direction in which the substrate "S" moves in the printing area 10. The cleaning unit 200 can maintain the head 42, specifically, clean the head 42.

[0067] The cleaning unit 200 may include a platform 210, a first cleaning member 230, and a second cleaning member 250. The first cleaning member 230 and the second cleaning member 250 may be mounted on the platform 210. The platform 210 may be configured to be movable in the maintenance area 20. The platform 210 may be configured to be movable along a first direction "X" in the maintenance area 20. Alternatively, the platform 210 may be configured to be movable along the first direction "X" and / or the second direction "Y". The platform 210 may be configured to change the position of the first cleaning member 230 and the second cleaning member 250.

[0068] The first cleaning member 230 can spray a cleaning liquid in a vapor form onto the head 42. The first cleaning member 230 can spray a cleaning liquid in a vapor form, such as water or a cleaning liquid containing chemicals that can easily remove the ink "I", onto the head 42. The vapor form can refer to a form in which very small particles of the cleaning liquid are sprayed in the form of a mist, and the temperature thereof is relatively high. The temperature of the cleaning liquid sprayed in the vapor form can be higher than the temperature of the ink "I" sprayed onto the substrate "S". The cleaning liquid in the vapor form sprayed onto the head 42 can reduce the degree of solidification of the solidified ink that may adhere to the head 42. In other words, the cleaning liquid can reduce the adhesion of the ink that may adhere to the head 42.

[0069] The first cleaning member 230 may include one or more cleaning portions 231. When viewed from above, the cleaning portions 231 may be arranged side by side along the first direction "X". The distance between the cleaning portions 231 may be the same or similar to the distance between the heads 42. Each cleaning portion 231 may be provided to correspond to each head 42.

[0070] Figure 3 It is schematically shown Figure 1 Specifically, in Figure 3 2. The cleaning section 231 is shown in FIG. The cleaning section 231 may include one or more cleaning nozzles 233, which may be configured to spray a cleaning liquid in a steam form. For example, a plurality of cleaning nozzles 233 may be provided. The cleaning section 231 may include a heating element (not shown) for heating the cleaning liquid sprayed from the cleaning nozzles 233.

[0071] Return to reference Figure 1 When the second cleaning member 250 is in close contact with the head 42, the second cleaning member 250 can be combined with the head 42 to form a suction space VA, and provide decompression to the suction space VA to remove solidified ink (impurities) attached to the outside of the head 42 and / or inside the head 42.

[0072] The second cleaning member 250 may include at least one suction portion 251. When viewed from above, the suction portions 251 may be arranged side by side along the first direction "X". The distance between the suction portions 251 may be the same as or similar to the distance between the heads 42. Each suction portion 251 may be provided to correspond to each head 42.

[0073] Figure 4 It is schematically shown Figure 1 1. A view of the second cleaning member of the cleaning unit. Figure 4 The second cleaning member 250 may include a suction portion 251, a suction line 253, a suction valve 254, a sealing portion 255, and a decompression member 270. The suction line 253, the suction valve 254, the sealing portion 255, and the decompression member 270 may be provided in plural to correspond to each suction portion 251.

[0074] A suction hole 252 may be formed in the suction portion 251. The suction hole 252 can provide reduced pressure to the suction space VA, which will be described later. The suction hole 252 can be formed to face the lower portion of the head portion 42, specifically, the nozzle 42a formed in the head portion 42. Multiple suction holes 252 may be formed. A suction line 253 may be connected to the suction hole 252. Multiple suction lines 253 may be provided. Each suction line 253 may be connected to the suction hole 252. The suction line 253 can deliver reduced pressure to the suction hole 252. A suction valve 254 may be installed in each suction line 253. The suction valve 254 may be an on-off valve or a flow control valve. The suction line 253 may be connected to a pressure reducing member 270. The pressure reducing member 270 may be a pump that provides vacuum pressure, but is not limited thereto. The type of the pressure reducing member 270 may be changed to a known device that provides reduced pressure.

[0075] The sealing portion 255 can be arranged above the suction portion 251. The sealing portion 255 can be an O-ring. The sealing portion 255 can be provided with a material having elasticity. The sealing portion 255 can be provided with a material comprising rubber. When viewed from above, the sealing portion 255 can be configured to surround the suction hole 252 formed in the suction portion 251. When the second cleaning member 250 cleans the head 42, the sealing portion 255 can be configured to surround the corresponding nozzle 42a formed in the head 42 when viewed from above.

[0076] Hereinafter, a head cleaning method according to an embodiment of the present disclosure will be described. The head cleaning method can be implemented by the cleaning unit 200 of the substrate processing apparatus 100. In addition, the controller 80 can control components of the substrate processing apparatus 100, such as the head unit 40, the supply unit 70, and the cleaning unit 200, so that the substrate processing apparatus 100 can perform the head cleaning method described below.

[0077] Figure 5 FIG is a flow chart schematically illustrating a head washing method according to an embodiment of the present disclosure. Figure 5 The head cleaning method according to an embodiment of the present disclosure may include a first processing operation (S10) and a second processing operation (S20). The first processing operation (S10) and the second processing operation (S20) may be performed sequentially.

[0078] In the first processing operation (S10), the first cleaning member 230 may spray the cleaning liquid CM in the form of steam toward the lower portion of the head 42 (see Figure 6). In the first processing operation (S10), the platform 210 of the cleaning unit 200 and the driving member 45 of the head unit 40 can change the position of the first cleaning member 230 and the head 42. In the first processing operation (S10), the first cleaning member 230 can be arranged in the area below the corresponding head 42. The cleaning liquid CM in the form of steam supplied to the lower part of the head 42 can reduce the degree of solidification of impurities "P" such as solidified ink "I". Therefore, the adhesion of the ink "I" can be reduced. In addition, since the cleaning liquid CM is supplied in the form of steam, the cleaning liquid CM not only penetrates into the outside of the head 42, but also penetrates into the inside of the head 42, specifically into the inside of the nozzle 42a, to reduce the adhesion of the solidified ink "I" attached to the nozzle 42a. In this case, the supply valve 73, the recovery valve 75 and the discharge valve 77 can be closed.

[0079] In the second processing operation (S20), the suction space VA may be formed by bringing the second cleaning member 250 providing reduced pressure into close contact with the lower portion of the head 42 (see FIG. Figure 7 ). The suction space VA can be defined by combining the lower part of the head 42, the upper part of the suction part 251 and the sealing part 255 with each other. The sealing part 255 can maintain the airtightness of the suction space VA. In addition, the head 42 can be moved downward by the driving member 45. Therefore, the second cleaning member 250 and the head 42 can be in close contact with each other to form the suction space VA. Thereafter, the decompression member 270 can provide decompression to the suction line 253 to provide decompression to the suction space VA. In this case, the supply valve 73, the recovery valve 75 and the discharge valve 77 can be closed. In addition, the suction valve 254 can also be opened. Therefore, the impurities "P" attached to the head 42 can be discharged to the outside through the suction line 253.

[0080] According to an embodiment of the present disclosure, in the first processing operation (S10), the cleaning liquid CM in the form of steam is sprayed toward the head 42 to reduce the degree of solidification and adhesion of impurities "P" such as the solidified ink "I" (i.e., the solidified ink "I" can be changed from a solidified state to a liquefied state). As a result, the impurities "P" can be removed from the head 42 more effectively.

[0081] In addition, in the second processing operation (S20), the second cleaning member 250 is in close contact with the head 42 (specifically, the nozzle plate of the head 42) to form the suction space VA, and the airtightness VA of the suction space can be maintained by the sealing portion 255. Therefore, the problem of the impurities "P" separated from the head 42 diffusing in all directions can be solved. In addition, since the airtightness of the suction space VA is maintained, the reduced pressure transmitted to the suction space VA can be more effectively transferred to the inside of the head 42. Therefore, the impurities "P" attached to the inside of the head 42 can be effectively removed. That is, according to an embodiment of the present disclosure, the solids in the head 42 can be effectively removed by suction after the sealed space has been formed.

[0082] In the above example, the case where the second cleaning member 250 provides decompression to the suction space VA in a state where the supply valve 73 and the discharge valve 77 are closed is described as an example, but the present disclosure is not limited thereto. Figure 8 As shown, the liquid supply unit 70 can supply ink "I" to the head 42 while providing reduced pressure to the suction space VA, thereby performing a purging operation to purge the interior of the head 42. In this case, the second cleaning member 250 can provide reduced pressure to the suction space VA with the supply valve 73 and the discharge valve 77 opened.

[0083] In the above example, the case where all the suction valves 254 are opened when the reduced pressure is provided to the suction space VA has been exemplified, but the present disclosure is not limited thereto.

[0084] For example, refer to Figures 9 to 12 When providing reduced pressure to the suction space VA, the suction valves 254 installed in the suction lines 253 providing reduced pressure to the suction holes 252 near the sealing portion 255 can be opened first. Then, the suction valves 254 installed in the suction lines 253 providing reduced pressure to the suction holes 252 farther from the sealing portion 255 can be opened sequentially. In other words, the suction valves 254 can be opened sequentially, from those closest to the sealing portion 255 to those farther from the sealing portion 255. In this manner, the suction airflow in the suction space VA is given directionality, thereby minimizing the problem of debris P introduced into the suction space VA adhering to the head portion 42 or the suction portion 251 and remaining unremoved. Specifically, by sequentially opening one of the suction valves 254 after opening the other suction valves 254, debris P introduced into the suction space VA adhering to the head portion 42 or the suction portion 251 and remaining unremoved can be minimized.

[0085] In addition, embodiments can be considered in which the suction valve 254 is opened sequentially from the suction valve 254 far from the sealing portion 255 to the suction valve 254 close to the sealing portion 255, embodiments can be considered in which the suction valve 254 is opened sequentially from the suction valve 254 close to the supply pipeline 72 to the suction valve 254 close to the recovery pipeline 74, and embodiments can be considered in which the suction valve 254 is opened sequentially from the suction valve 254 close to the recovery pipeline 74 to the suction valve 254 close to the supply pipeline 72.

[0086] In the above example, the head 42 is described as moving downward and in close contact with the second cleaning member 250, but the present disclosure is not limited thereto. For example, the second cleaning member 250 can move upward and in close contact with the head 42. In this case, the second cleaning member 250 can also include a lifting member.

[0087] The above description is an explanation of the present disclosure. In addition, the above disclosure is intended to illustrate and explain the preferred embodiments of the present disclosure, and the present disclosure can be used in various other combinations, modifications and environments. In other words, the present disclosure can be changed or modified within the scope of the concept of the present disclosure disclosed herein, within the equivalent scope of the present disclosure and / or within the skill and knowledge of the art. The described embodiments illustrate the best mode for implementing the technical concept of the present disclosure, and various changes can be made to it according to the needs of the specific application and use of the present disclosure. Therefore, the above description is not intended to limit the present disclosure to the embodiments. In addition, the appended claims should be interpreted as covering such other embodiments.

[0088] According to the embodiments of the present disclosure, maintenance of the head can be efficiently performed.

[0089] In addition, according to the embodiment of the present disclosure, it is possible to effectively remove solidified ink (processing liquid) adhering to the inside of the head.

[0090] Furthermore, according to the embodiments of the present disclosure, the head replacement cycle can be extended.

[0091] Effects of the present disclosure are not limited to the above-mentioned effects, and those having ordinary skill in the art to which the present disclosure pertains will clearly understand unmentioned effects from the present specification and the accompanying drawings.

[0092] While the present disclosure has been described with reference to the embodiments thereof, it will be apparent to one skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the disclosure as recited in the following claims.

Claims

1. A substrate processing device comprising: a head unit including a head having at least one nozzle for spraying a processing liquid toward a substrate; and a cleaning unit configured to clean the head, Wherein the cleaning unit comprises: a platform configured to move in at least one horizontal direction; a first cleaning member disposed on the platform, the first cleaning member being configured to spray a cleaning fluid toward the head; a second cleaning member disposed on the platform, the second cleaning member being configured to form a suction space in combination with the head when in close contact with the head, and to remove foreign matter attached to the head by providing reduced pressure to the suction space; a liquid supply unit configured to supply the processing liquid to the head unit; and a controller configured to control a liquid supply unit, the head unit, and the cleaning unit, Wherein, the second cleaning component comprises: a suction portion facing a lower portion of the head and having a plurality of suction holes formed therein; and a sealing portion arranged above the suction portion to maintain airtightness of the suction space, wherein the controller is configured to control the cleaning unit to remove foreign matter attached to the head by providing the reduced pressure to the suction space, The reduced pressure is first provided to the suction space through a first suction hole among the plurality of suction holes close to the sealing portion, and then provided to the suction space through a second suction hole among the plurality of suction holes that is relatively farther from the sealing portion than the first suction hole.

2. The substrate processing apparatus according to claim 1, further comprising: a plurality of suction lines configured to deliver the reduced pressure to the plurality of suction apertures; and A reduced pressure member is configured to deliver the reduced pressure to the plurality of suction lines. 3 . The substrate processing apparatus according to claim 2 , wherein each of the plurality of suction lines is installed with a suction valve.

4. The substrate processing apparatus according to claim 3, wherein the controller is configured to control the liquid supply unit, the head unit, and the cleaning unit so that the first cleaning member supplies the cleaning liquid to the head unit and the second cleaning member is in close contact with the head unit to form the suction space.

5. The substrate processing apparatus according to claim 4 , wherein the liquid supply unit comprises: a liquid reservoir configured to contain the treatment liquid; a supply line configured to supply the treatment fluid from the reservoir to the head; and A recovery line is configured to recover the processing liquid from the head to the liquid reservoir. 6 . The substrate processing apparatus according to claim 5 , wherein a supply valve is installed in the supply line, and a recovery valve is installed in the recovery line. 7 . The substrate processing apparatus according to claim 6 , wherein the controller is configured to control the cleaning unit so that the supply valve and the recovery valve are closed when the decompression member provides the decompression to the suction space. 8 . The substrate processing apparatus according to claim 4 , wherein the controller is configured to control the cleaning unit to open one of the suction valves and then open the other one of the suction valves.

9. The substrate processing apparatus according to claim 4, wherein the controller is configured to control the liquid supply unit and the cleaning unit so that the liquid supply unit performs a purge operation of supplying the processing liquid to the head while providing the reduced pressure to the suction space. 10 . The substrate processing apparatus according to claim 1 , wherein the first cleaning member is configured to spray the cleaning liquid in a vapor form toward the head portion.

11. A cleaning unit for cleaning a head for spraying ink onto a substrate, comprising: a platform configured to move in at least one horizontal direction; a first cleaning member disposed on the platform, the first cleaning member being configured to spray a cleaning liquid in a steam form toward the head; as well as a second cleaning member disposed on the platform, the second cleaning member being configured to form a suction space in combination with the head when in close contact with the head, and to remove impurities attached to the head by providing reduced pressure to the suction space, Wherein, the second cleaning component comprises: a suction portion facing a lower portion of the head and having a plurality of suction holes formed therein; and a sealing portion arranged above the suction portion to maintain airtightness of the suction space, The reduced pressure is first provided to the suction space through a first suction hole among the plurality of suction holes close to the sealing portion, and then provided to the suction space through a second suction hole among the plurality of suction holes that is relatively farther from the sealing portion than the first suction hole.

12. The cleaning unit according to claim 11, further comprising: a plurality of suction lines configured to deliver the reduced pressure to the suction portion; and A reduced pressure member is configured to deliver the reduced pressure to the plurality of suction lines.

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