A heat-resistant silicone conductive adhesive material and its preparation method

Abstract

The present invention relates to the technical field of silicone conductive materials, and more specifically, to a heat-resistant silicone conductive adhesive material and a preparation method thereof. The raw materials of the conductive adhesive material include 20-40 parts of modified heat-resistant silicone resin, 45-70 parts of conductive powder, 0.62-2.8 parts of cross-linking agent, 0.2-1.5 parts of dispersant, 0.5-2 parts of reinforcing agent, 0.1-0.7 parts of catalyst, 0.05-0.1 parts of auxiliary agent, 0.2-0.6 parts of accelerator, and 10-20 parts of solvent. The conductive adhesive prepared with the modified heat-resistant silicone resin can be cured at room temperature. The cured conductive adhesive material overcomes the current deficiency of silicone conductive adhesives in high-temperature resistance and can withstand a high temperature of 600 °C, effectively solving the reliability problem of electromagnetic shielding conductive adhesives in the instantaneous high heat and high heat flux environment during the operation of aerospace equipment.

Description

Technical Field

[0001] The present invention relates to the technical field of organosilicon conductive materials, and more specifically, to a heat-resistant organosilicon conductive adhesive material and a preparation method thereof. Background Art

[0002] One-component room-temperature-curing organosilicon conductive adhesives can absorb moisture in the air at room temperature and undergo a condensation reaction to achieve curing. After curing, they have good sealing, adhesion, and conductivity, and can be widely used in shell gaps to achieve electromagnetic shielding functions. At the same time, due to the relatively high bond energy of the Si-O bond, they have high thermal stability and can be used for a long time at 200°C. However, at 500°C, such materials may undergo internal cracking, resulting in seal failure and even causing a fire. In practical applications, some aerospace equipment may form an instantaneous high-temperature and high-heat flux environment during operation, causing the seals to possibly withstand a temperature of 500°C instantaneously, which poses requirements for the high-temperature resistance of electromagnetic sealing materials. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, an object of one aspect of the present invention is to provide a heat-resistant organosilicon conductive adhesive material, and the raw materials of the conductive adhesive material include 20-40 parts of a modified heat-resistant organosilicon resin, 45-70 parts of a conductive powder, 0.62-2.8 parts of a cross-linking agent, 0.2-1.5 parts of a dispersant, 0.5-2 parts of a reinforcing agent, 0.1-0.7 parts of a catalyst, 0.05-0.1 parts of an auxiliary agent, 0.2-0.6 parts of an accelerator, and 10-20 parts of a solvent.

[0004] Another object of the present invention is to provide a preparation method of a heat-resistant organosilicon conductive adhesive material. The specific steps of the preparation method are as follows:

[0005] S1. Add α,ω-dihydroxypolydimethylsiloxane, boric acid, and titanium acetylacetonate to a reaction kettle in sequence, then add deionized water, turn on the stirrer, ventilate, and raise the temperature to 85±5°C at a rate of 1°C / min. Pre-polymerize for 2 hours at this temperature, then raise the temperature of the mixture to 180±5°C at a rate of 1.5°C / min and maintain this temperature for 4 hours. Seal and preserve the obtained product and cool it to room temperature to obtain the modified heat-resistant organosilicon resin.

[0006] S2. Vacuum-disperse the modified heat-resistant organosilicon resin, cross-linking agent, dispersant, accelerator, and auxiliary agent in a double-planet mixer, and then add the reinforcing agent for vacuum dispersion to obtain a mixture.

[0007] S3. Add the solvent and the conductive powder to the mixture obtained in S2 for vacuum dispersion, then add the catalyst, and perform vacuum dispersion in a double-planet mixer to prepare the heat-resistant organosilicon conductive adhesive material.

[0008] The modified heat-resistant silicone resin is polydimethylborontitanosiloxane, and its chemical formula is

[0009] .

[0010] Preferably, in S1, the mass ratio of α,ω-dihydroxypolydimethylsiloxane, boric acid and acetylacetone is 100:8.09-26.3:0.25-0.53. The amount of deionized water added is 30%-50% of the amount of α,ω-dihydroxypolydimethylsiloxane used. The rotation speed of the stirrer is 100rmp-200rmp. Air is introduced, and the viscosity of the modified heat-resistant silicone resin is between 50000mPa·S and 80000mPa·S.

[0011] Preferably, in S2, the vacuum degree of the double planetary mixer is -0.065MPa to -0.08MPa, the stirring speed is 900rmp to 1500rmp. The dispersion time of the modified heat-resistant silicone resin, crosslinking agent, dispersant, accelerator and auxiliary agent is 10min-30min, and the dispersion time of adding the reinforcing agent is 15min-40min.

[0012] Preferably, in S2, the crosslinking agent is one or a combination of two or more of methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, and tetramethoxysilane; the dispersant is one or a combination of two or more of BYK-161, BYK-163, and BYK-110.

[0013] Preferably, in S2, the accelerator is an adhesion promoter, and the accelerators used are one or a combination of two or more of vinyltriethoxysilane (A-151), vinyltrimethoxysilane (A-171), γ-aminopropyltriethoxysilane (KH-550), and γ-(2,3-epoxypropane)propyltrimethoxysilane; the auxiliary agent is one or a combination of two or more of cyanoalkylsiloxane, low-viscosity α,ω-dihydroxypolydimethylsiloxane, polyether, and polyether-modified silicone oil.

[0014] Preferably, in S2, the reinforcing agent is one or a combination of two or more of fumed silica, light calcium carbonate, and precipitated silica.

[0015] Preferably, in S3, the vacuum degree of the double planetary mixer is -0.065MPa to -0.08MPa, the stirring speed is 900rmp to 1500rmp. The dispersion time of the mixture, solvent and conductive powder is 20min-30min, and the dispersion time of adding the catalyst is 10min-20min.

[0016] Preferably, the solvent in S3 is one or a combination of two or more of OS-10, OS-20, silicone oil, isoparaffin, and solvent oil; the conductive powder is one or a combination of two or more of silver powder, silver-coated copper powder, silver-coated glass microsphere powder, silver-coated aluminum powder, and nickel-coated graphite powder, and the particle size of the conductive powder is between 5 μm and 25 μm.

[0017] Preferably, the catalyst in S3 is one of organotin, titanate and its complexes, and guanidylalkoxysilane.

[0018] The beneficial effects of the present invention are as follows:

[0019] The heat-resistant silicone conductive adhesive material of the present invention improves the thermal stability and antioxidant thermal destruction ability of the silicone resin by introducing titanium and boron elements into the α,ω-dihydroxypolydimethylsiloxane chain for main chain hybridization. After introducing boron and titanium elements into the silicone main chain, under the action of heat source, boron and titanium elements can promote the carbonization of the material, and the silicon dioxide formed by silicon oxidation will inhibit the oxidation of the carbon layer. In the absence of boron and titanium, the siloxane chain is converted into silica ash and is a discontinuous layer. Therefore, adding boron and titanium elements to the silicone resin can play a synergistic role, which can promote the formation of a continuous carbon layer with high thermal oxidation stability, thereby improving the thermal oxidation stability of the material. In addition, the B-O chain part in the molecular chain is more stable than the Si-O chain part, which is also the main reason for improving its heat resistance stability.

[0020] The conductive adhesive prepared with the modified heat-resistant silicone resin can be cured at room temperature. The cured conductive adhesive material overcomes the current deficiency of the silicone conductive adhesive in high temperature resistance and can withstand a high temperature of 600 °C, effectively solving the reliability problem of the electromagnetic shielding conductive adhesive in the instantaneous high heat and high heat flux environment during the operation of aerospace equipment.

[0021] The conductive adhesive material provided by the present invention has a moderate viscosity and good thixotropy, can be constructed by processes such as scraping and dispensing, and the prepared conductive adhesive layer has stable dimensions, good conductivity, and strong bonding performance. The volume resistivity of the conductive adhesive is less than 0.05 Ω·cm, and the peel strength is greater than 10 N / cm. The volume resistivity and peel strength of the conductive adhesive can meet the application requirements of the electromagnetic shielding and sealing conductive adhesive material, have broad application prospects, and the preparation method is simple and easy to operate, suitable for mass production applications.

[0022] The additional aspects and advantages of the present invention will become obvious in the following description, or be understood through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above and / or additional aspects and advantages of the present invention will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, where:

[0024] Figure 1 This is the flow chart for preparing the heat-resistant organosilicon conductive adhesive material of the present invention. Specific embodiments

[0025] In order to more clearly understand the above-mentioned objects, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0026] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited by the specific embodiments disclosed below.

[0027] Example 1

[0028] α,ω-dihydroxypolydimethylsiloxane (hydroxyl content 2%, viscosity 150 cps), boric acid, and titanium acetylacetonate were sequentially added to a reaction kettle in a mass ratio of 100:16.18:0.35. 40 parts by weight of deionized water was added. The stirrer was turned on and the stirring speed was adjusted to 120 rmp. Air was introduced, and the temperature was raised to 85 ± 5 °C at a rate of 1 °C / min. The pre-polymerization was carried out at this temperature for 2 hours, and then the temperature of the mixture was raised to 180 ± 5 °C at a rate of 1.5 °C / min and maintained at this temperature for 4 hours. The obtained product was sealed and stored and cooled to room temperature to obtain the modified heat-resistant organosilicon resin.

[0029] 23.15 parts by weight of the modified heat-resistant organosilicon resin, 0.72 parts by weight of methyltrimethoxysilane, 0.34 parts by weight of BYK-161, 0.27 parts by weight of A-171, and 0.06 parts by weight of α,ω-dihydroxypolydimethylsiloxane (100 cps) were vacuum-dispersed in a double planetary mixer for 10 min - 30 min, and then 0.53 parts by weight of fumed silica was added and vacuum-dispersed for 15 min - 40 min to obtain a mixture.

[0030] 10.56 parts by weight of OS-10 and 64.16 parts by weight of silver-coated copper powder were added to the mixture and vacuum-dispersed for 20 min - 30 min; then 0.21 parts by weight of titanate was added and vacuum-dispersed in a double planetary mixer for 10 min - 20 min. The vacuum degree of the above double planetary mixer was -0.07 MPa, and the stirring speed was 1200 rmp to obtain the heat-resistant organosilicon conductive adhesive.

[0031] Example 2

[0032] Add α,ω-dihydroxypolydimethylsiloxane (hydroxyl content 3%, viscosity 100 cps), boric acid and titanium acetylacetonate into the reaction kettle in sequence according to the mass ratio of 100:22.16:0.42, add 40 parts by weight of deionized water, turn on the stirrer and adjust the stirring speed to 120 rmp, introduce air, raise the temperature to 85 ± 5 °C at a rate of 1 °C / min, pre-polymerize for 2 hours at this temperature, then raise the temperature of the mixture to 180 ± 5 °C at a rate of 1.5 °C / min, and keep it at this temperature for 4 hours. Seal and preserve the obtained product and cool it to room temperature to obtain the modified heat-resistant silicone resin.

[0033] Vacuum disperse 22.43 parts by weight of the modified heat-resistant silicone resin, 0.65 part by weight of methyltrimethoxysilane, 0.48 part by weight of BYK-161, 0.32 part by weight of A-171 and 0.06 part by weight of α,ω-dihydroxypolydimethylsiloxane (100 cps) in a double planetary mixer for 10 min - 30 min, then add 0.55 part by weight of fumed silica and vacuum disperse for 15 min - 40 min to obtain a mixture.

[0034] Add 10.11 parts by weight of OS-10 and 65.24 parts by weight of silver-coated copper powder to the mixture and vacuum disperse for 20 min - 30 min; then add 0.16 part by weight of titanate and vacuum disperse in a double planetary mixer for 10 min - 20 min. The vacuum degree of the above double planetary mixer is -0.07 MPa and the stirring speed is 1200 rmp to obtain the heat-resistant silicone conductive adhesive.

[0035] Example 3

[0036] Add α,ω-dihydroxypolydimethylsiloxane (hydroxyl content 4%, viscosity 200 cps), boric acid and titanium acetylacetonate into the reaction kettle in sequence according to the mass ratio of 100:12.13:0.35, add 40 parts by weight of deionized water, turn on the stirrer and adjust the stirring speed to 120 rmp, introduce air, raise the temperature to 85 ± 5 °C at a rate of 1 °C / min, pre-polymerize for 2 hours at this temperature, then raise the temperature of the mixture to 180 ± 5 °C at a rate of 1.5 °C / min, and keep it at this temperature for 4 hours. Seal and preserve the obtained product and cool it to room temperature to obtain the modified heat-resistant silicone resin.

[0037] Vacuum disperse 23.64 parts by weight of the modified heat-resistant silicone resin, 0.73 part by weight of methyltrimethoxysilane, 0.32 part by weight of BYK-161, 0.25 part by weight of A-171 and 0.07 part by weight of α,ω-dihydroxypolydimethylsiloxane (100 cps) in a double planetary mixer for 10 min - 30 min, then add 0.62 part by weight of fumed silica and vacuum disperse for 15 min - 40 min to obtain a mixture.

[0038] Add 11.32 parts by weight of OS-10 and 62.89 parts by weight of silver-coated copper powder to the mixture and disperse them in vacuum for 20 min - 30 min; then add 0.16 part by weight of titanate and disperse it in a double planetary mixer in vacuum for 10 min - 20 min. The vacuum degree of the above double planetary mixer is -0.07 MPa, and the stirring speed is 1200 rmp to obtain a heat-resistant silicone conductive adhesive.

[0039] Comparative Example 1

[0040] Disperse 23.15 parts by weight of silicone resin, 0.72 part by weight of methyltrimethoxysilane, 0.34 part by weight of BYK-161, 0.27 part by weight of A-171, and 0.06 part by weight of α,ω-dihydroxypolydimethylsiloxane (100 cps) in a double planetary mixer in vacuum for 10 min - 30 min, and then add 0.53 part by weight of fumed silica and disperse it in vacuum for 15 min - 40 min to obtain a mixture.

[0041] Add 10.56 parts by weight of OS-10 and 64.16 parts by weight of silver-coated copper powder to the mixture and disperse them in vacuum for 20 min - 30 min; then add 0.21 part by weight of titanate and disperse it in a double planetary mixer in vacuum for 10 min - 20 min. The vacuum degree of the above double planetary mixer is -0.07 MPa, and the stirring speed is 1200 rmp to obtain a silicone conductive adhesive.

[0042] Comparative Example 2

[0043] Add α,ω-dihydroxypolydimethylsiloxane (hydroxyl content 3%, viscosity 100 cps) and boric acid to the reaction kettle in a mass ratio of 100:22.16 in sequence, add 40 parts by weight of deionized water, turn on the stirrer, adjust the stirring speed to 120 rmp, introduce air, raise the temperature to 85 ± 5 °C at a rate of 1 °C / min, pre-polymerize at this temperature for 2 hours, then raise the temperature of the mixture to 180 ± 5 °C at a rate of 1.5 °C / min, and keep it at this temperature for 4 hours. Seal and preserve the obtained product and cool it to room temperature to obtain a modified silicone resin.

[0044] Disperse 22.43 parts by weight of modified silicone resin, 0.65 part by weight of methyltrimethoxysilane, 0.48 part by weight of BYK-161, 0.32 part by weight of A-171, and 0.06 part by weight of α,ω-dihydroxypolydimethylsiloxane (100 cps) in a double planetary mixer in vacuum for 10 min - 30 min, and then add 0.55 part by weight of fumed silica and disperse it in vacuum for 15 min - 40 min to obtain a mixture.

[0045] Add 10.11 parts by weight of OS-10 and 65.24 parts by weight of silver-coated copper powder to the mixture and disperse them in vacuum for 20 min - 30 min; then add 0.16 parts by weight of titanate and disperse it in a double planetary mixer in vacuum for 10 min - 20 min. The vacuum degree of the above double planetary mixer is -0.07 MPa, and the stirring speed is 1200 rmp to obtain the silicone conductive adhesive.

[0046] Comparative Example 3

[0047] Add α,ω-dihydroxypolydimethylsiloxane (hydroxyl content 4%, viscosity 200 cps) and titanium acetylacetonate to the reaction kettle in a mass ratio of 100:0.35 in sequence, add 40 parts by weight of deionized water, turn on the stirrer, adjust the stirring speed to 120 rmp, introduce air, raise the temperature to 85 ± 5 °C at a rate of 1 °C / min, pre-polymerize for 2 hours at this temperature, then raise the temperature of the mixture to 180 ± 5 °C at a rate of 1.5 °C / min, and keep it at this temperature for 4 hours. Seal and preserve the obtained product and cool it to room temperature to obtain the modified silicone resin.

[0048] Vacuum disperse 23.64 parts by weight of the modified silicone resin, 0.73 parts by weight of methyltrimethoxysilane, 0.32 parts by weight of dispersant, 0.25 parts by weight of A-171, and 0.07 parts by weight of α,ω-dihydroxypolydimethylsiloxane (100 cps) in a double planetary mixer for 10 min - 30 min, then add 0.62 parts by weight of fumed silica and vacuum disperse for 15 min - 40 min to obtain a mixture.

[0049] Add 11.32 parts by weight of OS-10 and 62.89 parts by weight of silver-coated copper powder to the mixture and disperse them in vacuum for 20 min - 30 min; then add 0.16 parts by weight of titanate and disperse it in a double planetary mixer in vacuum for 10 min - 20 min. The vacuum degree of the above double planetary mixer is -0.07 MPa, and the stirring speed is 1200 rmp to obtain the silicone conductive adhesive.

[0050] Test Example:

[0051] Compare the bonding performance of the conductive adhesive through the shear strength. Use the conductive adhesives prepared in Examples 1 - 3 and Comparative Examples 1 - 3 above to bond the silicone rubber strip to the aluminum substrate, cure at room temperature for 7 days, and then test the peel strength.

[0052] Compare the conductive performance of the conductive adhesive through the volume resistivity. Use the conductive adhesives prepared in Examples 1 - 3 and Comparative Examples 1 - 3 above to prepare volume resistivity test samples and conduct tests.

[0053] Compare the heat resistance of the conductive adhesives through heat resistance tests. Apply the conductive adhesives prepared in Examples 1 to 3 and Comparative Examples 1 to 3 above on the aluminum substrate, cure at room temperature for 7 days, then store at 600 °C for 30 min, and record the product changes.

[0054] The peel strength of the samples was measured in accordance with GB / T 2790-1995;

[0055] The volume resistivity was measured in accordance with SJ20673A-2016.

[0056] The test results are shown in Table 1 below:

[0057] Functional indicators

[0058] Samples

[0059] Example 1

[0060] Example 2

[0061] Example 3

[0062] Comparative Example 1

[0063] Comparative Example 2

[0064] Comparative Example 3

[0065] Peel strength (N / cm) 11.52 10.73 11.81 9.86 10.66 10.82

[0072] Volume resistivity (Ω·cm)

[0073] 3.85×10-2

[0074] 2.14×10-2

[0075] 4.05×10-2

[0076] 3.52×10-2

[0077] 2.33×10-2

[0078] 3.27×10-2

[0079] Heat resistance (600 °C)

[0080] No peeling, bubbling, flaking, etc.

[0081] No peeling, bubbling, flaking, etc.

[0082] No peeling, bubbling, flaking, etc.

[0083] Smoke appears during storage, the product bubbles, cracks

[0084] Slight bubbling, no peeling, cracking, etc.

[0085] There is bubbling, no peeling, cracking, etc.

[0086] The test results of Example 1 and Comparative Example 1 show that the heat resistance of the modified silicone resin is significantly improved at 600 °C. The test results of Example 2 and Example 3 and Comparative Example 2 and Comparative Example 3 show that the heat resistance effects of the silicone resins modified by boric acid and titanium acetylacetonate are worse than those after the composite modification of the two. In summary, the composite modification of boric acid and titanium acetylacetonate has little effect on the peel strength and volume resistivity of the conductive adhesive, and significantly improves the heat resistance of the resin system.

[0087] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, various modifications and changes can be made to the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A heat-resistant silicone conductive adhesive material, characterized in that: The raw materials of the conductive adhesive material include 20-40 parts of modified heat-resistant silicone resin, 45-70 parts of conductive powder, 0.62-2.8 parts of cross-linking agent, 0.2-1.5 parts of dispersant, 0.5-2 parts of reinforcing agent, 0.1-0.7 parts of catalyst, 0.05-0.1 parts of auxiliary agent, 0.2-0.6 parts of accelerator, and 10-20 parts of solvent; The modified heat-resistant silicone resin is prepared by adding α,ω-dihydroxypolydimethylsiloxane, boric acid and titanium acetylacetonate into a reaction kettle in sequence, then adding deionized water, turning on the stirrer, ventilating, raising the temperature to 85±5°C at a rate of 1°C / min, pre-polymerizing for 2 hours at this temperature, then raising the temperature of the mixture to 180±5°C at a rate of 1.5°C / min, and maintaining at this temperature for 4 hours. The obtained product is sealed and stored and cooled to room temperature to obtain the modified heat-resistant silicone resin; The mass ratio of α,ω-dihydroxypolydimethylsiloxane, boric acid and titanium acetylacetonate is 100:8.09-26.3:0.25-0.

53.

2. The preparation method of a heat-resistant silicone conductive adhesive material according to claim 1, characterized in that: The specific steps of the preparation method are as follows: S1. Vacuum disperse the modified heat-resistant silicone resin, cross-linking agent, dispersant, accelerator and auxiliary agent in a double planetary mixer, and then add the reinforcing agent for vacuum dispersion to obtain a mixture; S2. Add the solvent and conductive powder to the mixture obtained in S1 for vacuum dispersion, then add the catalyst, and conduct vacuum dispersion in a double planetary mixer to prepare the heat-resistant silicone conductive adhesive material.

3. The preparation method of a heat-resistant silicone conductive adhesive material for a vacuum machine according to claim 1, characterized in that: The amount of deionized water added is 30%-50% of the amount of α,ω-dihydroxypolydimethylsiloxane used, the stirrer speed is 100rmp-200rmp, air is introduced, and the viscosity of the modified heat-resistant silicone resin is between 50000mPa·S and 80000mPa·S.

4. The preparation method of a heat-resistant silicone conductive adhesive material according to claim 2, characterized in that: In S1, the vacuum degree of the double planetary mixer is -0.065MPa to -0.08MPa, the stirring speed is 900rmp to 1500rmp, the dispersion time of the modified heat-resistant silicone resin, cross-linking agent, dispersant, accelerator and auxiliary agent is 10min-30min, and the dispersion time of adding the reinforcing agent is 15min-40min.

5. The preparation method of a heat-resistant silicone conductive adhesive material according to claim 2, characterized in that: In S1, the cross-linking agent is one or a combination of two or more of methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, and tetramethoxysilane; the dispersant is one or a combination of two or more of BYK-161, BYK-163, and BYK-110.

6. The preparation method of a heat-resistant silicone conductive adhesive material according to claim 2, characterized in that: In S1, the accelerator is an adhesion promoter, and the accelerators used are one or a combination of two or more of vinyltriethoxysilane, vinyltrimethoxysilane, γ-aminopropyltriethoxysilane, and γ-(2,3-epoxypropane)propyltrimethoxysilane; the auxiliary agent is one or a combination of two or more of cyanoalkylsiloxane, low-viscosity α,ω-dihydroxypolydimethylsiloxane, polyether and polyether-modified silicone oil.

7. The preparation method of a heat-resistant silicone conductive adhesive material according to claim 2, characterized in that: In S1, the reinforcing agent is one or a combination of two or more of fumed silica, light calcium carbonate, and precipitated silica.

8. The preparation method of a heat-resistant silicone conductive adhesive material according to claim 2, characterized in that: In the above-mentioned S2, the vacuum degree of the double planetary mixer is -0.065 MPa to -0.08 MPa, the stirring speed is 900 rmp to 1500 rmp, the dispersion time of the mixture, solvent and conductive powder is 20 min - 30 min, and the dispersion time of the added catalyst is 10 min - 20 min.

9. The preparation method of a heat-resistant silicone conductive adhesive material according to claim 2, characterized in that: In the above-mentioned S2, the solvent is one or more combinations of OS-10, OS-20, silicone oil, isoparaffin, and solvent oil; the conductive powder is one or more combinations of silver powder, silver-coated copper powder, silver-coated glass microsphere powder, silver-coated aluminum powder, and nickel-coated graphite powder, and the particle size of the conductive powder is between 5 μm and 25 μm.

10. The preparation method of a heat-resistant silicone conductive adhesive material according to claim 2, characterized in that: In the above-mentioned S2, the catalyst is one of organotin, titanate and its complexes, and guanidylalkoxysilane.

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