A multi-wire sawing device

Abstract

The application provides a multi-wire cutting device, comprising: a cutting wire assembly, which comprises a cutting wire, and a driving groove shaft and a driven groove shaft arranged at intervals, the cutting wire being wound between the driving groove shaft and the driven groove shaft and forming an upper cutting wire net and a lower cutting wire net; a processing table, which is located above the upper cutting wire net in the vertical direction and can move along the vertical direction to enable the cutting wire to cut a workpiece; and a posture limiting assembly, which comprises: a workpiece supporting unit; a linear slide rail unit, which extends along the vertical direction, and the workpiece supporting unit is slidably arranged on the linear slide rail unit; and a control unit, which is connected with the linear slide rail unit and is used for controlling the sliding parameters of the workpiece supporting unit along the linear slide rail unit, so that the workpiece supporting unit supports the workpiece and keeps the workpiece in a predetermined posture during the cutting of the workpiece. The multi-wire cutting device provided by the application can solve the problem of the risk of wire breakage or wire mark defects caused by the contact or extrusion of silicon wafers.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a multi-wire cutting device. Background Technology

[0002] Silicon wafer processing technology mainly employs multi-wire cutting, which offers superior cutting results and is widely used. Multi-wire cutting is an advanced slicing technology. Its principle involves using cutting wires to form a wire mesh with varying spacing through a set of grooved wheels. The high-speed reciprocating motion of the cutting wires carries abrasive material into the processing area of ​​the material to be cut. Meanwhile, the workpiece is fed vertically by the lifting and lowering of the processing table, thus simultaneously cutting the workpiece into several thin slices of the required size and shape.

[0003] In multi-wire cutting, the steel wire reciprocates at high speed, while the processing table slowly descends to bring the silicon rod into contact with the wire for cutting. In related technologies, multi-wire cutting machines fix the silicon rod on the feed processing table, and the multi-wire cutting process is performed by lowering the table while maintaining a constant horizontal position. To improve production efficiency, smaller wire diameters and slurry particle sizes are used to reduce the groove pitch on the grooved rollers, thus producing more silicon wafers with the same input silicon rod length.

[0004] However, as the slot pitch decreases, the distance between silicon wafers also decreases. This decrease in distance between wafers reduces the gap through which the steel wire can pass. Furthermore, as the silicon rod is processed closer to the end, the distance between the connection points of the wafers and the starting point increases, resulting in a larger range of motion for the wafers. This can cause the gap between the wafers to become extremely small. As the gap shrinks, the probability and contact area between the steel wire and the silicon wafer increase, which in turn increases the resistance as the steel wire moves forward. Increased resistance increases the probability of wire breakage.

[0005] Furthermore, the steel wire needs to be removed from the workpiece after the cutting process. If the gap between the silicon wafers is too small during removal, it can result in wire marks as a defect in the cutting effect. Additionally, if the adhesion angle between the two sides of the workpiece matches the crystal lattice structure during processing, it is prone to breakage. Therefore, when the slurry is introduced into the workpiece by the steel wire during cutting, the resulting impact may cause the material to break easily on both sides. Summary of the Invention

[0006] This invention provides a multi-wire cutting device that can solve the problem of wire breakage or wire mark defects caused by contact or compression between silicon wafers in related technologies.

[0007] The technical solutions provided by the embodiments of the present invention are as follows:

[0008] A multi-wire cutting device, comprising:

[0009] A cutting wire assembly includes a cutting wire, and an active slotted shaft and a driven slotted shaft spaced apart. The cutting wire is wound between the active slotted shaft and the driven slotted shaft to form an upper cutting wire mesh and a lower cutting wire mesh.

[0010] A processing table for loading workpieces, the processing table being located vertically above the upper cutting wire mesh, and the processing table being movable along the vertical direction so that the cutting wire cuts the workpiece;

[0011] An attitude limiting component for defining the attitude of the workpiece during the workpiece cutting process, the attitude limiting component comprising:

[0012] A workpiece support unit is used to support the workpiece;

[0013] A linear guide rail unit, the linear guide rail unit extending along the vertical direction, and the workpiece support unit slidably disposed on the linear guide rail unit; and

[0014] A control unit, connected to the linear guide rail unit, is used to control the sliding parameters of the workpiece support unit along the linear guide rail unit, so that the workpiece support unit supports the workpiece and keeps the workpiece in a predetermined posture during the workpiece cutting process.

[0015] For example, the workpiece support unit includes: a first support roller and a second support roller spaced apart in the horizontal direction, the first support roller and the second support roller being located between the active groove shaft and the driven groove shaft in the horizontal direction, and being able to support the workpiece on opposite sides in the horizontal direction respectively.

[0016] For example, the axial direction of the first support roller and the second support roller is aligned with the axial direction of the active groove shaft and the driven groove shaft, and the length of the workpiece in the axial direction of the first support roller and the second support roller is less than or equal to the axial length of the first support roller and the second support roller.

[0017] For example, the linear slide rail unit includes: a first slide rail and a second slide rail spaced apart in the horizontal direction, the first slide rail and the second slide rail being parallel to each other and both extending in the vertical direction, and the first support roller being slidably disposed on the first slide rail, and the second support roller being slidably disposed on the second slide rail.

[0018] For example, the distance D between the first slide rail and the second slide rail in the horizontal direction satisfies the following relationship:

[0019] D≤1 / 4R V , where R VThe width of the workpiece in the horizontal direction.

[0020] For example, the workpiece support unit includes an initial position and an end position in the vertical direction. The initial position is the position of the workpiece support unit when the workpiece is in the cutting start position, and the end position is the position of the workpiece support unit when the workpiece is in the cutting end position. In the vertical direction, the distance between the initial position and the upper cutting grid is H, and the value of H is in the range of (0 to 1 / 4*Rh), where Rh is the height of the workpiece in the vertical direction.

[0021] For example, the control unit includes:

[0022] A pressure sensor, disposed on the workpiece support unit, is used to sense the current support force provided by the workpiece support unit to the workpiece; and

[0023] A controller, electrically connected to the pressure sensor, is configured to control the sliding parameters of the workpiece support unit along the linear slide rail unit based on the current support force, so that the workpiece support unit supports the workpiece with a predetermined support force during the workpiece cutting process, wherein the sliding parameters include at least one of sliding direction and sliding speed.

[0024] For example, the controller is specifically used to determine whether the relative distance Y1 between the current position and the initial position of the workpiece support unit in the vertical direction is greater than 0;

[0025] If so, when the current support force value is within the threshold of the predetermined support force, the current motion parameter of the processing table is set as the sliding parameter of the workpiece support unit; when the current support force value exceeds the threshold of the predetermined support force, the sliding speed compensation value is calculated based on the difference between the current support force and the predetermined support force, and the sliding parameter is obtained based on the speed compensation value and the current motion parameter of the processing table.

[0026] If not, the workpiece support unit is controlled to remain fixed in the initial position without moving.

[0027] For example, the relative distance Y1 satisfies the following relationship: Y1 = YH, where Y is the distance between the upper cutting wire mesh and the end position in the vertical direction, and H is the distance between the initial position and the upper cutting wire mesh in the vertical direction.

[0028] For example, the pressure sensor is located at the connection point between the workpiece support unit and the linear slide rail unit.

[0029] The beneficial effects brought about by the embodiments of the present invention are as follows:

[0030] In the above solution, the attitude limiting component is set in the multi-wire cutting device to limit the attitude of the workpiece during the cutting process. Specifically, the control unit and the linear guide rail unit enable the workpiece support unit to move with the workpiece in the vertical direction. In this way, the workpiece can be effectively supported throughout the cutting process to keep the workpiece in the predetermined attitude. This ensures that the distance between silicon wafers remains constant throughout the cutting process, thereby reducing wire marks and wire breaks caused by silicon wafers squeezing the cutting lines. At the same time, it can reduce the breakage caused by slurry impact on both sides of the workpiece, thereby improving the stability of the quality of the cut silicon wafers. Attached Figure Description

[0031] Figure 1 This is a side view of the structure of the multi-wire cutting device provided in an embodiment of the present invention;

[0032] Figure 2 This is a front view of the structure of the multi-wire cutting device provided in an embodiment of the present invention. Figure 1 ;

[0033] Figure 3 This is a front view of the structure of the multi-wire cutting device provided in an embodiment of the present invention. Figure 2 ;

[0034] Figure 4 This is a front view of the structure of the multi-wire cutting device provided in an embodiment of the present invention. Figure 3 . Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0036] Unless otherwise defined, the technical or scientific terms used in this invention shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms "first," "second," and similar terms used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms "an," "a," or "the," etc., do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "comprising," "including," etc., mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms "connected," "linked," etc., are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up," "down," "left," "right," etc., are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0037] Before providing a detailed description of the multi-wire cutting apparatus provided in the embodiments of the present invention, it is necessary to explain the related technologies as follows:

[0038] In related technologies, to improve production efficiency, multi-wire cutting equipment reduces the slot pitch on the slotted wheel by selecting smaller wire diameters and slurry particle sizes. This allows for the production of more silicon wafers with the same input silicon rod length. However, reducing the slot pitch leads to a corresponding reduction in the distance between silicon wafers, which in turn increases the risk of wire breakage or wire mark defects due to contact or compression between the silicon wafers.

[0039] However, reducing the slot pitch leads to a simultaneous reduction in the distance between silicon wafers. This reduction in distance, in turn, narrows the gap through which the steel wire can pass. Furthermore, as the silicon ingot processing nears its end, the connection point between the wafers becomes increasingly distant from the starting point, resulting in a larger relative range of motion for the wafers. This can cause the gap between the wafers to become extremely small. Simultaneously, this narrowing of the gap increases the probability of contact between the steel wire and the wafer, and also increases the contact area, consequently increasing the resistance as the steel wire advances. Increased resistance raises the probability of wire breakage. Additionally, after the cutting process, the steel wire must be removed from the workpiece. If the gap between the wafers is too small during removal, it can result in wire marks and other defects in the cutting effect. Moreover, during processing, if the adhesion angle between the two sides of the workpiece matches the crystal lattice structure, it is prone to breakage. Therefore, when the slurry is introduced into the workpiece by the steel wire during cutting, the resulting impact may cause the material to easily break at both ends.

[0040] To address the aforementioned problems, embodiments of the present invention provide a multi-wire cutting device that can resolve the risk of wire breakage or wire mark defects caused by contact or compression between silicon wafers in related technologies.

[0041] like Figures 1 to 3 As shown, the multi-wire cutting device provided in this embodiment of the invention includes:

[0042] A cutting wire assembly includes a cutting wire 100 and an active slotted shaft 110 and a driven slotted shaft 120 spaced apart. The cutting wire 100 is wound between the active slotted shaft 110 and the driven slotted shaft 120 to form an upper cutting wire mesh 100a and a lower cutting wire mesh 100b.

[0043] A processing table 200 for loading workpiece 10 is located above the upper cutting wire mesh 100a in the vertical direction, and the processing table 200 is movable in the vertical direction Y so that the cutting wire 100 cuts the workpiece 10.

[0044] An attitude limiting component 300 for limiting the attitude of the workpiece 10 during the cutting process;

[0045] The attitude limiting component 300 includes:

[0046] Workpiece support unit 310 is used to support the workpiece 10;

[0047] A linear slide rail unit 320 extends along the vertical direction Y, and the workpiece support unit 310 is slidably disposed on the linear slide rail unit 320; and

[0048] Control unit 330, which is connected to linear slide rail unit 320, is used to control the sliding parameters of workpiece support unit 310 along linear slide rail unit 320, so that workpiece support unit 310 supports workpiece 10 and keeps workpiece 10 in a predetermined posture during the cutting process of workpiece 10.

[0049] In the above scheme, by setting an attitude limiting component 300 in the multi-wire cutting device to limit the attitude of the workpiece 10 during the cutting process, the workpiece 10 is kept in a predetermined attitude. This allows the distance between silicon wafers to remain constant throughout the entire cutting process, thereby reducing wire marks and wire breaks caused by silicon wafers squeezing the cutting line 100. At the same time, it can reduce the breakage caused by slurry impact on both sides of the workpiece 10, thereby improving the stability of the quality of the cut silicon wafers.

[0050] Specifically, the control unit and the linear guide rail unit 320 enable the workpiece support unit 310 to move as the workpiece 10 moves in the vertical direction Y. This effectively supports the workpiece 10 throughout the entire cutting process, keeping the workpiece 10 in the predetermined posture.

[0051] For example, such as Figures 1 to 2 As shown, the processing table 200 includes a feed axis 210 and a work plate 220, wherein the feed axis 210 is used to drive the work plate 220 to move in the vertical direction Y, and a workpiece 10 can be loaded under the work plate 220.

[0052] In some exemplary embodiments, such as Figures 1 to 3 As shown, the workpiece support unit 310 includes a first support roller 311 and a second support roller 312 spaced apart in the horizontal direction X. The first support roller 311 and the second support roller 312 are located between the active groove shaft 110 and the driven groove shaft 120 in the horizontal direction X, and can respectively support the workpiece 10 on opposite sides in the horizontal direction X.

[0053] In the above scheme, the workpiece support unit 310 can be composed of two support rollers arranged at intervals and in parallel. These two support rollers can respectively support the opposite sides of the workpiece 10, such as... Figures 1 to 3 As shown, since the lower edge of the workpiece 10 contacts the cutting line 100 first to complete the cutting, the first support roller 311 and the second support roller 312 can support the workpiece 10 at opposite sides of its lower edge. This support effect is stable, effectively supports the workpiece 10, and does not affect the cutting operation.

[0054] It is understood that the specific structure of the workpiece support unit 310 is not limited to this. For example, the workpiece support unit 310 may also be composed of one support member or two or more support members.

[0055] Furthermore, in some exemplary embodiments, such as Figures 1 to 3 As shown, the axial direction of the first support roller 311 and the second support roller 312 is consistent with the axial direction of the active groove shaft 110 and the driven groove shaft 120, and the length of the workpiece 10 along the axial direction of the first support roller 311 and the second support roller 312 is less than or equal to the axial length of the first support roller 311 and the second support roller 312.

[0056] It should be noted that the axial directions of the active groove shaft 110 and the driven groove shaft 120 are perpendicular to the vertical direction Y and the horizontal direction X.

[0057] During the cutting process, the workpiece 10, such as a silicon rod, includes a cutting start end and a cutting end end along its axial direction. As the silicon rod is processed closer to the cutting end end, the connection point between the silicon wafers becomes farther and farther from the start position, and the relative swing range of the silicon wafers becomes larger and larger. This results in the gap between the silicon wafers becoming extremely small. As the gap shrinks, the probability of the cutting line 100 contacting the silicon wafers increases, and the contact area also increases. This, in turn, increases the resistance when the steel wire moves forward, and the increased resistance increases the probability of wire breakage.

[0058] Therefore, in the above scheme, the axial direction of the first support roller 311 and the second support roller 312 is consistent with the axial direction of the active groove shaft 110 and the driven groove shaft 120, and the axial length of the first support roller 311 and the second support roller 312 is greater than or equal to the length of the workpiece 10 in the axial direction. In this way, the workpiece support unit 310 can fully support the workpiece 10 in the axial direction, thereby avoiding problems such as the workpiece 10 swinging, and further avoiding the phenomenon of broken lines and line marks caused by the gap between silicon wafers being too small.

[0059] Furthermore, in some exemplary embodiments, such as Figures 1 to 3 As shown, the linear slide rail unit 320 includes: a first slide rail 321 and a second slide rail 322 spaced apart in the horizontal direction X. The first slide rail 321 and the second slide rail 322 are parallel to each other and both extend in the vertical direction Y. The first support roller 311 is slidably disposed on the first slide rail 321, and the second support roller 312 is slidably disposed on the second slide rail 322.

[0060] In the above scheme, the specific structure of the first slide rail 321 and the second slide rail 322 is not limited, as long as the first support roller 311 and the second support roller 312 slide on the corresponding slide rail respectively.

[0061] Furthermore, in some exemplary embodiments, such as Figure 4 As shown, the distance D between the first slide rail 321 and the second slide rail 322 in the horizontal direction X satisfies the following relationship: D≤1 / 4R V , where R V The width of the workpiece 10 in the horizontal direction X.

[0062] By adopting the above solution, the workpiece support unit 310 can effectively support the workpiece 10 without affecting the cutting operation of the workpiece 10.

[0063] Furthermore, in some exemplary embodiments, such as Figure 3 and Figure 4As shown, the top position of the linear guide rail assembly can be the location of the upper cutting wire mesh 100a, and the bottom position can be the position of moving down in the vertical direction Y by Rh mm, where Rh is the height of the workpiece 10 in the vertical direction Y.

[0064] The workpiece support unit 310 includes an initial position and an end position in the vertical direction Y. The initial position is the position of the workpiece support unit 310 when the workpiece 10 is in the cutting start position, and the end position is the position of the workpiece support unit 310 when the workpiece 10 is in the cutting end position. In the vertical direction Y, the distance between the initial position and the upper cutting wire mesh 100a is H, and the value of H is in the range of (0~1 / 4*Rh)mm, where Rh is the height of the workpiece 10 in the vertical direction Y.

[0065] In addition, for example, Figure 1 and Figure 2 As shown, the control unit includes:

[0066] Pressure sensor 331, disposed on the workpiece support unit 310, is used to sense the current support force provided by the workpiece support unit 310 to the workpiece 10; and

[0067] A controller, electrically connected to the pressure sensor 331, is used to control the sliding parameters of the workpiece support unit 310 along the linear slide rail unit 320 according to the current support force, so that the workpiece support unit 310 supports the workpiece 10 with a predetermined support force during the cutting process of the workpiece 10, wherein the sliding parameters include at least one of sliding direction and sliding speed.

[0068] For example, the controller is specifically used to determine whether the relative distance Y1 between the current position and the initial position of the workpiece support unit 310 in the vertical direction Y is greater than 0;

[0069] If so, when the current support force value is within the threshold of the predetermined support force, the current motion parameter of the processing table 200 is set as the sliding parameter of the workpiece support unit 310; when the current support force value exceeds the threshold of the predetermined support force, the sliding speed compensation value is calculated based on the difference between the current support force and the predetermined support force, and the sliding parameter is obtained based on the speed compensation value and the current motion parameter of the processing table 200.

[0070] If not, the workpiece support unit 310 is controlled to remain fixed in the initial position without moving.

[0071] For example, the relative distance Y1 satisfies the following relationship: Y1 = YH, where Y is the distance between the upper cutting wire mesh 100a and the end position in the vertical direction Y, and H is the distance between the initial position and the upper cutting wire mesh in the vertical direction Y.

[0072] In the above scheme, the horizontal position of the upper cutting wire mesh 100a is taken as the zero point, and the downward advance distance of the workpiece 10 is Y. When the workpiece 10 moves to a certain cutting position, the vertical distance Y1 = YH between the workpiece support unit 310 and the upper cutting wire mesh 100a is obtained. Therefore, when Y1 is greater than zero, the workpiece support unit 310 can move downward according to the moving speed set by the advance axis of the processing table 200. When Y1 is less than zero, the workpiece support unit 310 will be fixed at the initial position H away from the upper cutting wire mesh 100a and will not move.

[0073] For example, the pressure sensor 331 is disposed at the connection position between the workpiece support unit 310 and the linear slide rail unit 320.

[0074] Furthermore, in some embodiments, the first support roller 311 and the second support roller 312 may be configured to include: a metal inner core and a rubber layer wrapped around the surface of the metal inner core.

[0075] The following points need to be explained:

[0076] (1) The accompanying drawings of the embodiments of the present invention only involve the structures involved in the embodiments of the present invention. Other structures can refer to the general design.

[0077] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present invention; that is, these drawings are not drawn to actual scale. It is understood that when an element such as a layer, film, region, or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element, or there may be intermediate elements.

[0078] (3) Where there is no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other to obtain new embodiments.

[0079] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. The scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A multi-wire cutting device, comprising: A cutting wire assembly includes a cutting wire, and an active slotted shaft and a driven slotted shaft spaced apart. The cutting wire is wound between the active slotted shaft and the driven slotted shaft to form an upper cutting wire mesh and a lower cutting wire mesh. A processing table for loading workpieces, the processing table being vertically positioned above the upper cutting wire mesh, and the processing table being movable along the vertical direction to allow the cutting wires to cut the workpiece; characterized in that the multi-wire cutting device further includes: An attitude limiting component for defining the attitude of the workpiece during the workpiece cutting process, the attitude limiting component comprising: A workpiece support unit is used to support the workpiece; A linear guide rail unit, the linear guide rail unit extending along the vertical direction, and a workpiece support unit slidably disposed on the linear guide rail unit; and A control unit, connected to the linear slide rail unit, is used to control the sliding parameters of the workpiece support unit along the linear slide rail unit, so that the workpiece support unit supports the workpiece and keeps the workpiece in a predetermined posture during the workpiece cutting process. The workpiece support unit includes: a first support roller and a second support roller spaced apart in the horizontal direction, the first support roller and the second support roller being located between the active groove shaft and the driven groove shaft in the horizontal direction, and being able to support the workpiece on opposite sides in the horizontal direction respectively; The linear slide rail unit includes: a first slide rail and a second slide rail spaced apart in the horizontal direction, the first slide rail and the second slide rail being parallel to each other and both extending in the vertical direction, and a first support roller slidably disposed on the first slide rail, and a second support roller slidably disposed on the second slide rail, wherein the distance D between the first slide rail and the second slide rail in the horizontal direction satisfies the following relationship: D≤1 / 4R V , where R V The width of the workpiece in the horizontal direction.

2. The multi-wire cutting device according to claim 1, characterized in that, The axial direction of the first support roller and the second support roller is aligned with the axial direction of the active groove shaft and the driven groove shaft, and the length of the workpiece along the axial direction of the first support roller and the second support roller is less than or equal to the axial length of the first support roller and the second support roller.

3. The multi-wire cutting device according to claim 1, characterized in that, The workpiece support unit includes an initial position and an end position in the vertical direction. The initial position is the position of the workpiece support unit when the workpiece is in the cutting start position, and the end position is the position of the workpiece support unit when the workpiece is in the cutting end position. In the vertical direction, the distance between the initial position and the upper cutting grid is H, and the value of H is in the range of (0 ~ 1 / 4*Rh), where Rh is the height of the workpiece in the vertical direction.

4. The multi-wire cutting device according to claim 3, characterized in that, The control unit includes: A pressure sensor, disposed on the workpiece support unit, is used to sense the current support force provided by the workpiece support unit to the workpiece; and A controller, electrically connected to the pressure sensor, is configured to control the sliding parameters of the workpiece support unit along the linear slide rail unit based on the current support force, so that the workpiece support unit supports the workpiece with a predetermined support force during the workpiece cutting process, wherein the sliding parameters include at least one of sliding direction and sliding speed.

5. The multi-wire cutting device according to claim 4, characterized in that, The controller is specifically used to determine whether the relative distance Y1 between the current position and the initial position of the workpiece support unit in the vertical direction is greater than 0; If so, when the current support force value is within the threshold of the predetermined support force, the current motion parameter of the processing table is set as the sliding parameter of the workpiece support unit; When the current support force value exceeds the threshold of the predetermined support force, the sliding speed compensation value is calculated based on the difference between the current support force and the predetermined support force, and the sliding parameters are obtained based on the speed compensation value and the current motion parameters of the processing table. If not, the workpiece support unit is controlled to remain fixed in the initial position without moving.

6. The multi-wire cutting device according to claim 5, characterized in that, The relative distance Y1 satisfies the following relationship: Y1=YH, where Y is the distance between the upper cutting wire mesh and the end position of the workpiece support unit in the vertical direction, and H is the distance between the initial position and the upper cutting wire mesh in the vertical direction.

7. The multi-wire cutting device according to claim 4, characterized in that, The pressure sensor is located at the connection point between the workpiece support unit and the linear slide rail unit.

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