A composite diamond cutting system based on ultrasonic vibration resonant and non-resonant coupling

Abstract

This invention belongs to the technical field of ultra-precision diamond cutting and discloses a composite diamond cutting system with ultrasonic vibration resonant and non-resonant coupling. The system includes a cutting module and a laser emission module. The cutting module includes an ultrasonic power supply for outputting two independent sinusoidal AC signals with adjustable phase difference, an adder circuit for lossless superposition of the sinusoidal AC signals, a power amplifier for gain amplification of the superimposed signals, and a resonant / non-resonant ultrasonic vibration device. This device drives the diamond tool tip to intermittently move along the cutting depth direction by changing the amplitude according to the received composite electrical signals, thereby achieving micro-texturing of the workpiece surface. The laser emission module is located behind the cutting module and is used to emit a laser. This invention enables efficient and high-precision surface micro-texturing of difficult-to-machine hard and brittle materials.

Description

Technical Field

[0001] This invention belongs to the technical field of ultra-precision diamond cutting, and more specifically, relates to a composite diamond cutting system with ultrasonic vibration resonance and non-resonant coupling. Background Technology

[0002] Currently, difficult-to-process hard and brittle materials (such as semiconductor materials and optical crystal materials) have been widely used due to their excellent mechanical, optical, physical, and chemical properties. To impart functional characteristics to products, micro / nano structures with appropriately precise patterns can be engraved on their surfaces. Some studies have shown that microtextured surfaces can endow products with properties such as hydrophobicity, optical functionality, and tribological properties. However, to truly expand the application of micro / nano functional surfaces, efficient manufacturing technologies are required. Conventional methods for manufacturing micro / nano functional surfaces, such as laser processing, photolithography, and focused ion beam processing, suffer from drawbacks such as long manufacturing cycles and large equipment sizes.

[0003] Ultra-precision diamond cutting is an important method for machining micro / nano functional surface structures. Ultrasonic elliptical vibration-assisted diamond ultra-precision cutting technology can not only be directly applied to ultra-precision diamond cutting of various difficult-to-machine materials, but also engrave complex textures into micro / nano functional structures on these materials, achieving ultra-precision molding of optical micro / nano structures. It is a practical method that allows for high structural freedom and generates the most accurate and repeatable geometries, making it the finest surface machining method among various processing techniques. Furthermore, the cutting edges of diamond tools can be precisely manufactured using nanostructures to achieve high-value-added surface textures.

[0004] Micro-laser assisted machining is a cutting technique that uses laser-assisted heating. Because the laser alters the properties of the material being processed, it improves machining performance and is commonly used in the aerospace, military, and other fields for machining various difficult-to-machine hard and brittle materials. Diamond machining technology based on Fast Tool Servo (FTS) has evolved into a highly efficient method for surface micro-texturing.

[0005] However, further research shows that due to the large operating frequency bandwidth of FTS and the approximately 300Hz bandwidth of elliptical vibration cutting amplitude control, the coupling between the two results in low processing efficiency, high difficulty, and difficulty in ensuring processing accuracy. In addition, for hard and brittle materials, laser-assisted cutting technology can increase the critical ductile-brittle transition depth and improve the material removal rate by softening the material through laser heating. However, the technical problem at the same time is that continuous and large laser heating can easily cause subsurface damage to the workpiece surface, which in turn leads to a reduction in surface integrity.

[0006] Accordingly, further research and improvements are urgently needed in this field to better meet the higher quality requirements of ultra-precision diamond cutting. Summary of the Invention

[0007] In view of the above-mentioned defects or needs of the prior art, the purpose of this invention is to provide a composite diamond cutting system with ultrasonic vibration resonance non-resonant coupling. By closely combining the process characteristics and specific requirements of applications such as ultra-precision diamond cutting, the structure and multiple key modules of the entire system have been redesigned. Accordingly, it can realize efficient and high-precision ultra-precision surface micro-texture manufacturing, as well as laser-assisted processing of hard and brittle materials, thereby effectively solving the above-mentioned technical problems of the prior art.

[0008] To achieve the above objectives, according to the present invention, a composite diamond cutting system based on ultrasonic vibration resonant-non-resonant coupling is provided. This system includes a cutting module and a laser emission module, characterized in that:

[0009] The cutting module includes an ultrasonic power supply, an adder circuit, a power amplifier, and a resonant / non-resonant ultrasonic vibration device. The ultrasonic power supply outputs two independent sinusoidal alternating current signals with adjustable phase difference: one is a low-frequency non-resonant input signal, and the other is a high-frequency resonant input signal. The adder circuit performs lossless superposition of the two sinusoidal alternating current signals. The power amplifier amplifies the gain of the superimposed two sinusoidal alternating current signals and then outputs a composite signal. The resonant / non-resonant ultrasonic vibration device drives the tip of its diamond tool to move intermittently along the cutting depth direction by changing the amplitude according to the received composite signal, thereby achieving surface micro-texture processing of the workpiece.

[0010] The laser emitting module is located behind the cutting module and is used to emit lasers; during cutting, the laser is focused on the tip of the diamond tool to soften the material surface of the workpiece, and at the same time, it radiates the machined surface during cutting separation to achieve laser heating tempering.

[0011] As a further preferred embodiment, the resonant / non-resonant ultrasonic vibration device, in addition to the diamond tool, preferably includes a fixed base, a piezoelectric ceramic assembly (402), electrode plates (403), and a circular flexible hinge mechanism. The piezoelectric ceramic assembly is respectively disposed on the left and right sides of the fixed base, and drives the output end of the circular flexible hinge mechanism according to the composite electrical signal from the power amplifier, thereby causing the diamond tool to generate corresponding elliptical vibration with controllable amplitude along the cutting depth direction. There are multiple electrode plates, which are respectively disposed on both sides of each piezoelectric ceramic assembly. The extension ends of these electrode plates are led out and connected to the positive and negative output terminals of the power amplifier, thereby receiving the composite electrical signal output by the power amplifier. The circular flexible hinge mechanism is disposed between the piezoelectric ceramic assemblies and is used to directly drive the diamond tool that is connected to it.

[0012] As a further preferred embodiment, the electrode sheets are preferably bonded to both sides of each of the piezoelectric ceramic assemblies by epoxy resin, the piezoelectric ceramic assemblies are preferably bonded to the fixed base, and the fixed base is preferably fixed to the external components by four bolts; in addition, the diamond tool is preferably bonded and installed at the output end of the circular flexible hinge mechanism, and the input end of the circular flexible hinge mechanism is preferably bonded to the output end of the piezoelectric ceramic assembly.

[0013] As a further preferred embodiment, the circular flexible hinge mechanism preferably has a symmetrical hinge structure, and the wall thickness at the hinge connection is 0.2 to 0.4, and the diameter is 2 to 4.

[0014] As a further preferred embodiment, the piezoelectric ceramic assembly is preferably made of PZT-8 lead zirconate titanate piezoelectric ceramic material.

[0015] As a further preferred embodiment, both the fixed base and the circular flexible hinge mechanism are preferably made of stainless steel.

[0016] As a further preferred embodiment, piezoelectric detection elements are preferably provided at two different positions at the front and rear ends of the piezoelectric ceramic assembly. The piezoelectric detection elements are used to convert the deformation generated at their positions due to the vibration of the piezoelectric ceramic assembly into dynamic current signals, and the dynamic current signals include low-frequency output signals and high-frequency output signals.

[0017] As a further preferred embodiment, the laser emission power of the laser emission module is preferably set to be adjustable from 0 to 100W.

[0018] In summary, compared with the prior art, the above-described technical solutions conceived by this invention have the following advantages:

[0019] Beneficial effects:

[0020] (1) This invention redesigns the structure and multiple key modules of the entire system, and in a compact and easy-to-operate manner, it can achieve both high-efficiency and high-precision ultra-precision surface micro-texture manufacturing and laser-assisted processing of hard and brittle materials. It ensures the quality of the processed surface while processing efficiently, thereby achieving ultra-precision manufacturing of complex surface micro-texture processing of hard and brittle materials.

[0021] (2) The present invention further improves the specific structure and setting of the resonant / non-resonant ultrasonic vibration device. The circular flexible hinge mechanism is used as the output end of the piezoelectric element. While amplifying the displacement of the output end, it has good output displacement sensitivity, moderate flexibility, and no serious stress concentration phenomenon. Considering the flexibility of the flexible hinge, displacement sensitivity, stress concentration phenomenon and design and processing complexity, the circular flexible hinge is selected as the basic unit of the flexible hinge mechanism design. It has the best comprehensive performance and the best cutting effect.

[0022] (3) The present invention further improves the working method of the laser emission module. By setting the laser emission module at the rear end of the cutting module, ultrasonic vibration resonance / non-resonant coupling laser-assisted composite cutting processing can be realized. In this process, the heat radiated by the laser first softens the material at the processing site, increases the critical plastic-brittle transition depth of hard and brittle materials, and enables the processing to be carried out without breakage and with high precision, while avoiding brittle fission of the material at the processing site. In addition, after the tool processes the processing site, the tool deviates from the processing position due to the elliptical vibration trajectory. The heat radiated by the laser causes the processed position to be tempered, so that the phase transformation generated in the workpiece during the processing returns to the original structural state, ensuring processing efficiency while taking into account surface quality.

[0023] (4) The present invention further provides a piezoelectric element on the resonant / non-resonant ultrasonic vibration device. The piezoelectric element drives the output end of the flexible hinge mechanism, i.e. the tip of the diamond tool, to generate elliptical vibration. Compared with the traditional continuous cutting process, after the tool completes the processing of the surface to be processed, the elliptical vibration causes the tool to move away from the processed surface, thereby converting continuous cutting into intermittent cutting. This intermittent cutting avoids the subsurface damage to the workpiece surface caused by the continuous heating of the laser during the laser-assisted cutting process.

[0024] (5) In this invention, the ultrasonic power supply outputs two independent low-frequency / high-frequency sinusoidal AC signals with adjustable phase difference according to the external input command. These signals act on the piezoelectric element, causing the diamond tool to generate a large-amplitude elliptical trajectory vibration at the resonant frequency. At the non-resonant frequency, the amplitude of the elliptical trajectory is adjusted by adjusting the frequency and phase difference. The coupling of the two realizes the ultra-precision manufacturing of micro / nano complex surface micro-texture processing, which can replace the surface micro-texture processing method based on FTS (Fast Tool Servo) with low precision and high operation difficulty. Attached Figure Description

[0025] Figure 1 This is an overall structural block diagram of the ultrasonic vibration resonant-non-resonant coupled composite diamond cutting system according to the present invention.

[0026] Figure 2 This is a schematic diagram of the structure of a resonant / non-resonant ultrasonic vibration device according to a preferred embodiment of the present invention;

[0027] Figure 3 This is a schematic diagram illustrating the working principle of the piezoelectric ceramic assembly in this invention.

[0028] Figure 4 This is a more detailed overall block diagram of a composite diamond cutting system with an added controller, according to another preferred embodiment of the present invention;

[0029] In all the accompanying drawings, the same reference numerals are used to denote the same elements or structures, wherein:

[0030] 100-Ultrasonic power supply; 200-Adding circuit; 300-Power amplifier; 400-Resonant / non-resonant ultrasonic vibration device; 500-Controller; 401-Fixed base; 402-Piezoelectric ceramic assembly; 403-Electrode sheet; 404-Circular flexible hinge mechanism; 405-Diamond tool; 406-Laser. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0032] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0033] To address the challenges of ultra-precision machining of microtextures on the surfaces of hard and brittle materials, this invention provides an ultrasonic vibration resonant / non-resonant coupled micro-laser assisted composite diamond cutting system. This system can be assembled with ultra-precision machine tools and other components to efficiently manufacture high-precision microtextures on the surfaces of difficult-to-machine hard and brittle materials. Figure 1 This is a block diagram of the overall structure of the ultrasonic vibration resonant-non-resonant coupled composite diamond cutting system according to the present invention. Figure 1 As shown, the system mainly includes two functional modules: a cutting module and a laser emission module. The following will explain each of these important modules in detail with reference to the attached diagram.

[0034] The cutting module includes an ultrasonic power supply 100, an adder circuit 200, a power amplifier 300, and a resonant / non-resonant ultrasonic vibration device 400. The ultrasonic power supply 100 outputs two independent sinusoidal alternating current signals with adjustable phase difference, one being a low-frequency non-resonant input signal and the other a high-frequency resonant input signal. The adder circuit 200 performs lossless superposition of the two sinusoidal alternating current signals. The power amplifier 300 amplifies the superimposed sinusoidal alternating current signals and outputs a composite signal. The resonant / non-resonant ultrasonic vibration device 400 drives the tip of its diamond tool 405 to move intermittently along the cutting depth direction by changing the amplitude, thereby achieving surface micro-texture processing of the workpiece.

[0035] More specifically, the ultrasonic power supply 100 is used to output two independent low-frequency / high-frequency sinusoidal AC signals with adjustable phase difference according to external input commands. These two independent low-frequency / high-frequency sinusoidal AC signals are two sinusoidal AC signals with adjustable voltage amplitude and frequency; one is a low-frequency signal, and the other is a high-frequency signal. Adjusting the amplitude, frequency, and phase difference of the two low-frequency / high-frequency sinusoidal AC signals can control the amplitude of the elliptical vibration cutting depth direction at the tip of the diamond tool in the resonant / non-resonant ultrasonic vibration device, meeting the requirements for efficient and high-precision manufacturing of micro-textures on the target surface.

[0036] More specifically, the adder circuit 200 is used to non-destructively superimpose the low-frequency / high-frequency sinusoidal AC signals transmitted from the ultrasonic power supply 100 to ultimately form the specific waveform required for the fabrication of micro-textures on the surface of the processing target, while ensuring that the signal is not distorted, the phase difference is stable and does not drift, and then transmits the superimposed two high-frequency sinusoidal AC signals to the power amplifier 300.

[0037] More specifically, the power amplifier 300, with high-gain and adjustable AC signal amplification, is used to amplify the two superimposed low-frequency / high-frequency sinusoidal AC signals output from the adder circuit 200 into the composite electrical signal required by the resonant / non-resonant ultrasonic vibration device 400. To facilitate adjustment of the composite waveform excitation signal input to the resonant / non-resonant ultrasonic vibration device 400, the gain of the power amplifier 300 can be adjusted to its maximum and kept constant.

[0038] More specifically, the resonant / non-resonant ultrasonic vibration device 400 is the output unit of this cutting system. It drives the tip of its diamond tool 405 to move intermittently along the cutting depth direction by changing the amplitude, based on the received composite electrical signal, thereby achieving surface micro-texture processing on the workpiece. Under the action of the composite waveform excitation signal from the power amplifier 300, the resonant / non-resonant ultrasonic vibration device 400 can generate high-frequency vibrations with controllable amplitude, phase, and trajectory shape. The principle is as follows:

[0039] Suppose the high-frequency input signal of the low-frequency input signal generated by the ultrasonic power supply 100 is as follows:

[0040]

[0041]

[0042] y = y1 + y2

[0043] y1 is a low-frequency input signal, a is the amplitude of the y1 signal, and f1 is the frequency of the y1 signal. y1 is the initial phase of the signal; y2 is the high-frequency input signal, b is the amplitude of the y2 signal, and f2 is the frequency of the y2 signal. This is the initial phase of the y2 signal. Signal y is a composite waveform obtained by superimposing signals through adder circuit 200, based on a, b, Different composite waveform signals of different shapes can be obtained by varying the characteristics of the materials. The gain is amplified by the power amplifier 300, which drives the resonant / non-resonant ultrasonic vibration device 400 to generate corresponding vibration trajectories, and then generates corresponding vibration trajectories on the diamond tool 405, so as to realize the ultra-precision manufacturing of complex surface microtextures of hard and brittle materials.

[0044] Based on the above concept, the ultrasonic power supply 100, the adding circuit 200, and the power amplifier 300 enable the resonant / non-resonant ultrasonic vibration device 400 to operate under low-frequency and high-frequency composite vibration. By superimposing two independent low-frequency / high-frequency vibrations, the diamond tool 405 can be driven to generate a large-amplitude elliptical vibration trajectory. In the cutting depth direction, the center of the elliptical vibration trajectory can be controlled by adjusting the frequency and phase of the low-frequency signal, thereby controlling the amplitude of the elliptical vibration in the cutting depth direction, which greatly improves the efficiency of micro-texturing on the surface of difficult-to-machine hard and brittle materials. In addition, by coupling in-situ micro-laser assisted processing, the material surface is softened, the critical plastic-brittle transition depth of difficult-to-machine hard and brittle materials is increased, and the surface quality of the processed material is guaranteed, thereby realizing ultra-precision manufacturing of micro-texturing on the surface of difficult-to-machine hard and brittle materials.

[0045] like Figure 2 As shown, according to a preferred embodiment of the present invention, the resonant / non-resonant ultrasonic vibration device 400 may further preferably include a fixed base 401, a piezoelectric ceramic assembly 402, an electrode 403, a circular flexible hinge mechanism 404, and a diamond cutter 405. The electrode 403 can be bonded to both sides of the piezoelectric ceramic assembly 402, for example, using JW-1 epoxy resin adhesive. The piezoelectric ceramic assembly 402 is bonded to the fixed base 401, which can be fixed to external components, for example, using four bolts. The diamond cutter 405 is bonded to the output end of the circular flexible hinge mechanism 404, and the input end of the circular flexible hinge mechanism 404 is bonded to the output end of the piezoelectric ceramic assembly 402. The laser 406 emitted by the rear laser emission module is focused at the tip of the diamond cutter 405 through the through-hole of the resonant / non-resonant ultrasonic vibration device.

[0046] For the fixed base 401, it can be made of 40Cr13 material, for example. The arc transition section of the base has a through hole, so that the laser emitted by the laser emitting module can be focused on the tip of the diamond tool. The base has 4 M2 threaded holes for fixing the base.

[0047] For the piezoelectric ceramic assembly 402, it is used to receive the composite electrical signal output by the power amplifier 300 and drive the output end of the circular flexible hinge mechanism 404 according to the composite electrical signal, thereby driving the diamond tool 405 to generate a large-amplitude elliptical vibration with controllable amplitude along the cutting depth direction.

[0048] More specifically, the piezoelectric ceramic assembly 402 may include, for example, m circular annular piezoelectric ceramic pieces. These m circular annular piezoelectric ceramic pieces are assembled in a manner where adjacent pieces have opposite polarization directions. For details regarding the polarization direction, assembly sequence, and working principle of the piezoelectric ceramic assembly, please refer to [link to relevant documentation]. Figure 3 Under the excitation of low-frequency / high-frequency sinusoidal AC signals, it can generate vibration along an elliptical trajectory at the output end of the circular flexible hinge mechanism 404.

[0049] According to another preferred embodiment of the present invention, the piezoelectric ceramic can be PZT-8 lead zirconate titanate piezoelectric ceramic, which has a density similar to 40Cr13, high output power, and is polarized in the thickness direction, operating in the same direction as the applied force during measurement. 33 Modality.

[0050] For electrode plates 403, each piezoelectric ceramic has an electrode plate on both sides, and the extension ends of the spaced-apart electrode plates are led out and connected to the positive and negative output terminals of the power amplifier 300, respectively. Specifically, copper electrode plates can be used to receive composite electrical signals, forming a low-frequency / high-frequency alternating electric field between the electrode plates. This drives the piezoelectric ceramic assembly 402 to vibrate, thereby causing the resonant / non-resonant ultrasonic vibration device 400 to vibrate. This causes the diamond tool 405 at the output terminal of the resonant / non-resonant ultrasonic vibration device 400 to produce flexible and variable vibrations along the cutting depth direction, enabling the diamond tool 405 to perform high-degree-of-freedom cutting of the workpiece.

[0051] The laser emitting module is located behind the cutting module and is used to emit laser 406. During cutting, the laser 406 is focused on the tip of the diamond tool 405 to soften the material surface of the workpiece, and at the same time, it radiates the machined surface during cutting separation to achieve laser heating tempering.

[0052] More specifically, the laser 406 is connected to the laser generator via an optical fiber from a laser emission module. The laser power of the laser generator is adjustable, ranging from 0 to 100W. In the ultrasonic vibration resonant / non-resonant coupled micro-laser assisted composite diamond cutting system, the laser is emitted from the tip of the diamond tool, heating and softening the material. The ultrasonic vibration makes the cutting process intermittent. During the separation of the cut surfaces, the laser irradiates the processed surface, performing laser heating and tempering to restore the material to its original structure, reducing subsurface damage and improving surface finish.

[0053] See Figure 4 According to another preferred embodiment of the present invention, in order to enable the diamond tool 405 to generate a stable target trajectory with controllable amplitude along the cutting depth direction and to ensure machining quality, the composite diamond cutting system provided by the present invention may further include a controller 500.

[0054] The piezoelectric detection element is selected as a set of piezoelectric ceramic groups 402 at the front and rear ends, which is used to convert the deformation generated at its position due to the vibration of the resonant / non-resonant ultrasonic vibration device into a dynamic current signal. The dynamic current signal includes a low-frequency output signal and a high-frequency output signal. The controller 500 is used to process the two dynamic current signals, analyze the changes and phase difference of the two output signals in each dynamic current signal, and perform feedback control on the two low-frequency / high-frequency sinusoidal AC signals output by the ultrasonic power supply 100 according to the changes and phase difference.

[0055] It should be noted that the working principle of the piezoelectric detection element in this invention is as follows: when the resonant / non-resonant ultrasonic vibration device generates high-frequency vibration, a corresponding deformation will be generated at the piezoelectric detection element. Based on the positive piezoelectric effect, a dynamic current signal will be generated on both sides of the piezoelectric detection element.

[0056] More specifically, the controller 500 provided by the present invention may include a power control circuit, a current sampling and detection circuit, and a control CPU. When the composite diamond cutting system of the present invention is started, the power control circuit inside the controller 500 can control the output signal bandwidth of the ultrasonic power supply 100 to sweep the frequency around the low-frequency non-resonant vibration frequency and the high-frequency resonant vibration frequency, respectively; the current sampling and detection circuit receives the dynamic current signal from the piezoelectric detection element; the control CPU processes the two dynamic current signals, analyzes the changes and phase difference of the low-frequency output signal and the high-frequency output signal in each dynamic current signal, thereby determining the amplitude change at the output end of the resonant / non-resonant ultrasonic vibration device.

[0057] In summary, the composite diamond cutting system of this invention ingeniously integrates ultrasonic vibration, high-efficiency and high-precision surface microtexturing manufacturing, and micro-laser-assisted processing technology. First, it drives the flexible hinge mechanism with a phase difference through two ultrasonic vibration transducers, causing the cutting tip of the flexible hinge mechanism to generate elliptical trajectory vibrations in both low-frequency and high-frequency states. In the low-frequency state, it generates non-resonant elliptical trajectory vibrations, in which the cutting depth can be adjusted by changing the voltage frequency. In the high-frequency state, it generates resonant elliptical trajectory vibrations. The coupling of these two states achieves high-efficiency and high-precision ultra-precision surface microtexturing manufacturing. Second, it uses micro-laser-assisted technology to increase the critical ductile-brittle transition depth of difficult-to-machine hard and brittle materials. After surface machining, the laser heats and anneals the cut surface, causing the phase transition generated during machining to return the workpiece to its original structure. This processing system ensures both processing efficiency and surface quality, guaranteeing machining accuracy and solving the technical challenge of achieving ultra-precision machining of hard and brittle material surfaces with microtexturing. Therefore, it has broad application prospects.

[0058] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A composite diamond cutting system based on ultrasonic vibration resonant-non-resonant coupling, the system comprising a cutting module and a laser emission module, characterized in that: The cutting module includes an ultrasonic power supply (100), an adder circuit (200), a power amplifier (300), and a resonant / non-resonant ultrasonic vibration device (400). The ultrasonic power supply (100) is used to output two independent sinusoidal alternating current signals with adjustable phase difference, one being a low-frequency non-resonant input signal and the other being a high-frequency resonant input signal. The adder circuit (200) is used to losslessly superimpose the two sinusoidal alternating current signals. The power amplifier (300) is used to amplify the gain of the superimposed two sinusoidal alternating current signals and then output a composite signal. The resonant / non-resonant ultrasonic vibration device (400) is used to drive the tip of its equipped diamond tool (405) to move intermittently along the cutting depth direction by changing the amplitude according to the received composite electrical signal, thereby realizing the surface micro-texturing of the workpiece. The laser emitting module is located behind the cutting module and is used to emit laser (406); the laser (406) is focused on the tip of the diamond tool (405) during cutting to soften the material surface of the workpiece, and at the same time, it radiates the processed surface during cutting separation to achieve laser heating tempering. In addition, the resonant / non-resonant ultrasonic vibration device (400) includes, in addition to the diamond tool (405), a fixed base (401), a piezoelectric ceramic assembly (402), an electrode plate (403), and a circular flexible hinge mechanism (404). The piezoelectric ceramic assembly (402) is respectively disposed on the left and right sides of the fixed base (401), and drives the output end of the circular flexible hinge mechanism (404) according to the composite electrical signal from the power amplifier (300), thereby driving the diamond tool (405). 05) Generates corresponding elliptical vibrations with controllable amplitude along the cutting depth direction; there are multiple electrode plates (403), which are respectively disposed on both sides of each of the piezoelectric ceramic groups (402), and the extension ends of these electrode plates are led out and connected to the positive and negative output terminals of the power amplifier (300), thereby receiving the composite electrical signal output by the power amplifier (300); the circular flexible hinge mechanism (404) is disposed between the piezoelectric ceramic groups (402) and is used to directly drive the diamond tool (405) that is connected to it.

2. The composite diamond cutting system as described in claim 1, characterized in that, The electrode sheet (403) is bonded to both sides of each of the piezoelectric ceramic assemblies (402) by epoxy resin. The piezoelectric ceramic assemblies (402) are bonded to the fixed base (401). The fixed base (401) is fixed to the external components by four bolts. In addition, the diamond tool (405) is bonded to the output end of the circular flexible hinge mechanism (404). The input end of the circular flexible hinge mechanism (404) is bonded to the output end of the piezoelectric ceramic assembly (402).

3. The composite diamond cutting system as described in claim 2, characterized in that, The circular flexible hinge mechanism (404) has a symmetrical hinge structure.

4. The composite diamond cutting system as described in claim 3, characterized in that, The piezoelectric ceramic assembly (402) is made of PZT-8 lead zirconate titanate piezoelectric ceramic material.

5. The composite diamond cutting system as described in claim 4, characterized in that, The fixed base (401) and the circular flexible hinge mechanism (404) are both made of stainless steel.

6. The composite diamond cutting system according to any one of claims 2-5, characterized in that, The piezoelectric ceramic assembly (402) is provided with piezoelectric detection elements at two different positions at the front and rear ends. The piezoelectric detection elements are used to convert the deformation generated at their positions due to the vibration of the piezoelectric ceramic assembly into dynamic current signals, and the dynamic current signals include low-frequency output signals and high-frequency output signals.

Images