Terminal heat dissipation device and mobile terminal

By designing a terminal heat dissipation device including a heat flow chamber, a micropump, a heat pool and a control component, the problem of existing mobile terminal heat dissipation accessories requiring an external power supply is solved, and the efficient heat dissipation effect of portable and no external power supply is achieved. .

CN116456674BActive Publication Date: 2025-02-07HUAWEI TECH CO LTD
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Patent Information

Application Number
CN202310349332.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2023-01-29
Filing Date
2023-03-27
Publication Date
2025-02-07
Estimated Expiration
2043-03-27

AI Technical Summary

Technical Problem

The existing mobile terminal heat dissipation accessories require a power adapter to connect to an external power supply before they can be used. It is inconvenient to use and cannot be used outdoors without an external power supply.

Method used

A terminal heat dissipation device is provided, including a heat flow chamber, a micropump, a heat tank and a control assembly. The first side wall of the hot flow chamber faces the mobile terminal, and drives the fluid working fluid to flow in the circulation channel through a micropump, absorbs and dissipates heat, and controls the components to supply power to the micropump, achieving a heat dissipation effect that can be used without an external power supply.

Benefits of technology

This terminal heat dissipation device is easy to use, can be used outdoors, has improved portability and low power consumption, which solves the problem of inconvenient use of existing heat dissipation accessories.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The present application provides a terminal heat dissipation device and a mobile terminal. The terminal heat dissipation device includes a heat flow cavity, a micropump, a heat pool and a control component. The first side wall of the heat flow cavity and the mobile terminal are arranged relative to each other, and the heat pool is arranged on the heat flow cavity. The first side wall, the second side wall and the supporting wall of the heat flow cavity form a circulation channel, and the fluid working medium is driven by the micropump to continuously flow in the circulation channel. The heat generated by the mobile terminal is directly or indirectly conducted to the fluid working medium at the corresponding position through the first side wall, and the flowing fluid working medium brings the local heat to other positions of the heat flow cavity to achieve uniform heating. The heat of the heat flow cavity is conducted outward through the second side wall, or the heat of the heat flow cavity is conducted to the heat pool. The heat pool can absorb the heat of the heat flow cavity and conduct the heat outward, so as to achieve external heat dissipation of the mobile terminal. The control component can provide the electric energy of the mobile terminal to the micropump, or the control component can power the micropump. The terminal heat dissipation device is easy to use and has improved portability.
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Description

[0001] This application claims the priority of the Chinese patent application filed with the State Intellectual Property Office on January 29, 2023, with application number 202320219283.3 and application name “A terminal heat dissipation device and mobile terminal”, all contents of which are incorporated by reference in this application. Technical Field

[0002] The embodiments of the present application relate to the technical field of mobile terminal accessories, and in particular to a terminal heat dissipation device and a mobile terminal. Background Art

[0003] When a mobile terminal is used in a high-power consumption scenario, it will generate a lot of heat and the body temperature will be high. There are some mobile terminal heat dissipation accessories on the market, such as a heat dissipation back clip set on the back of the mobile terminal, which includes a semiconductor cooling plate and a fan. The cold end of the semiconductor cooling plate is in contact with the back of the mobile terminal, and the hot end of the semiconductor cooling plate is blown outward by the fan, which can achieve heat dissipation and cooling of the mobile terminal. The heat dissipation back clip should be used in conjunction with a power adapter. One end of the power adapter is connected to an external power source, and the other end is connected to the heat dissipation back clip. The power adapter converts AC power into DC power to power the semiconductor cooling plate and the fan. When using the heat dissipation back clip, it needs to be connected to a power adapter, which is inconvenient to use and cannot be used outdoors without an external power source. Summary of the invention

[0004] The embodiments of the present application provide a terminal heat dissipation device and a mobile terminal, which solve the problem that the existing mobile terminal heat dissipation accessories need a power adapter to be connected to an external power source before use, which is inconvenient to use.

[0005] The embodiment of the present application adopts the following technical solution:

[0006] In the first aspect, an embodiment of the present application provides a terminal heat dissipation device, which includes a heat flow cavity, a micropump, a heat pool and a control component. The heat flow cavity includes a first side wall, a second side wall and a support wall, the first side wall and the second side wall are relatively spaced apart, the support wall is arranged between the first side wall and the second side wall, the first side wall, the second side wall and the support wall form a circulation channel, and the circulation channel is filled with a fluid medium. The first side wall is arranged facing the mobile terminal. The micropump has an input end and an output end, both of which are connected to the circulation channel, and the micropump is used to drive the fluid medium to flow in the circulation channel. The heat pool is arranged on the heat flow cavity. The control component and the heat flow cavity are relatively fixed, and the control component is at least used to transmit the electric energy of the mobile terminal to the micropump and / or power the micropump.

[0007] The terminal heat dissipation device provided by the embodiment of the present application, the first side wall of the heat flow cavity and the mobile terminal are arranged relative to each other, and the heat pool is arranged on the heat flow cavity. The first side wall, the second side wall and the supporting wall of the heat flow cavity form a circulation channel, and the fluid working medium is driven by a micropump to continuously flow in the circulation channel. The heat generated by the mobile terminal is directly or indirectly conducted to the fluid working medium at the corresponding position through the first side wall, and the flowing fluid working medium brings the local heat to other positions of the heat flow cavity to achieve uniform heating, and the heat of the heat flow cavity is conducted outward through the second side wall, or the heat of the heat flow cavity is conducted to the heat pool, and the heat pool can absorb the heat of the heat flow cavity and conduct the heat outward, thereby realizing the external heat dissipation of the mobile terminal. The control component can provide the electric energy of the mobile terminal to the micropump, or the control component directly powers the micropump. The terminal heat dissipation device is easy to use and can be used outdoors. It does not need to be connected to an external power supply by a power adapter like the existing heat dissipation back clip, and the portability is improved. Compared with the existing heat dissipation back clip that needs to power the semiconductor refrigeration plate and the fan, the terminal heat dissipation device of the present application only needs to power the micropump, and the power consumption is low.

[0008] In an optional implementation, the heat pool is entirely or partially disposed on the first side wall, so that heat conduction can be formed between the heat flow cavity and the heat pool. The heat of the mobile terminal can be first conducted to the heat pool of the first side wall, then conducted to the first side wall through the heat pool, and then conducted from the first side wall to the fluid medium.

[0009] In an optional implementation, the heat pool is entirely or partially disposed on the second side wall, so that heat conduction can be formed between the heat flow cavity and the heat pool. The heat of the fluid working medium can be firstly conducted to the second side wall, and then conducted to the heat pool of the second side wall through the second side wall, and the heat is conducted outwardly from the heat pool.

[0010] In an optional implementation, a portion of the heat pool is disposed on the first side wall, and another portion of the heat pool is disposed on the second side wall, so that heat conduction can be formed between the heat flow cavity and the heat pool. The heat of the mobile terminal can be first conducted to the heat pool of the first side wall, then conducted to the first side wall through the heat pool, and then conducted from the first side wall to the fluid medium. The heat of the fluid medium can be first conducted to the second side wall, then conducted to the heat pool of the second side wall through the second side wall, and the heat is conducted outward from the heat pool.

[0011] In an optional implementation, the heat pool is in a shell shape, and the heat flow cavity is disposed in the shell-shaped heat pool, so that heat conduction can be formed between the heat flow cavity and the heat pool.

[0012] In an optional implementation, the heat pool and the heat flow cavity are spaced apart and connected via other structural members, so that heat conduction can be formed between the heat flow cavity and the heat pool.

[0013] In an optional implementation, a portion of the area between the heat pool and the heat flow cavity is spaced apart, while another portion of the area is connected, so that heat conduction can be formed between the heat flow cavity and the heat pool.

[0014] In an optional implementation, the heat flow cavity can be set according to the shape of the mobile terminal, and can be set to a shape that matches the back of the mobile terminal, so that the heat flow cavity can absorb heat from the heating position on the back of the mobile terminal and conduct the heat to the position with lower heating, thereby achieving a uniform heating effect.

[0015] In an optional implementation, a avoidance position may be provided at a corresponding position of the heat flow cavity, so that when the terminal heat dissipation device is installed in the mobile terminal, related devices can still work normally instead of being blocked by the heat flow cavity.

[0016] In an optional implementation, a camera and a flash are arranged in the upper left corner of the back of the mobile terminal, an avoidance position is set at the corresponding position of the heat flow cavity, and a notch is also set at the corresponding position of the shell when the shell is set. When the terminal heat dissipation device is assembled on the mobile terminal, the camera and the flash can work normally.

[0017] In an optional implementation, the control component includes a first wireless coil, the micro pump is electrically connected to the first wireless coil, and the first wireless coil and the second wireless coil of the mobile terminal are correspondingly arranged to enable reverse charging of the mobile terminal.

[0018] The terminal heat dissipation device can be configured with a first wireless coil, so that the first wireless coil is coupled with the second wireless coil of the mobile terminal, so that the power of the mobile terminal battery is transmitted from the second wireless coil to the first wireless coil, and the first wireless coil supplies power to the micro pump.

[0019] In an optional implementation, the position of the first wireless coil needs to be set relative to the second wireless coil of the mobile terminal to improve the wireless charging efficiency. The first wireless coil can be set on the side of the heat pool facing away from the heat flow cavity, between the heat flow cavity and the heat pool, or on the side of the heat flow cavity facing away from the heat pool, as long as the first wireless coil and the second wireless coil of the mobile terminal are coupled to achieve power transmission.

[0020] In an optional implementation, the heat flow cavity, micropump and heat pool are all arranged in the shell, the first wireless coil is arranged between the inner wall of the shell and the heat pool, the heat flow cavity and the heat pool are made of non-metallic materials, and the first wireless coil and the second wireless coil of the mobile terminal can be coupled.

[0021] In an optional implementation, the heat flow cavity, the micropump and the heat pool are all arranged in the shell, and a partition is provided on the first side wall of the heat flow cavity. The partition is made of non-metallic material, and the first wireless coil is arranged between the heat flow cavity and the partition, which can realize coupling between the first wireless coil and the second wireless coil of the mobile terminal.

[0022] In an optional implementation, the control component includes a charging cable, the micro pump is electrically connected to the charging cable, and a first plug of the charging cable and an electrical interface of the mobile terminal can be plugged and matched to enable reverse charging of the mobile terminal.

[0023] The mobile terminal and the terminal heat dissipation device are connected via a charging line, so that the electric energy of the mobile terminal battery supplies power to the micro pump via the charging line.

[0024] In an optional implementation, the first plug of the charging cable can be plugged into the electrical interface of the mobile terminal, and the other end of the charging cable can be directly electrically connected to the micro pump to achieve power transmission.

[0025] In an optional implementation, the other end of the charging cable is set as a second plug, the micro pump is electrically connected to the electrical interface, and the second plug is plugged into the electrical interface to achieve power transmission.

[0026] In an optional implementation, the control component includes a battery, the battery and the micro pump are electrically connected, and the battery and the micro pump are relatively fixed. The battery is arranged on the terminal heat dissipation device to supply power to the micro pump. The battery can be a button battery, which occupies a small space and makes the whole machine compact. The battery can be arranged in the heat flow cavity or other positions.

[0027] In an optional implementation, the control component further includes a communication unit, which is relatively fixed to the heat flow cavity, and is used to cooperate with the mobile terminal to control the operation of the micro pump.

[0028] A communication unit is configured in the terminal heat sink to realize the start and stop control of the micro pump. When the terminal heat sink is assembled to the mobile terminal, the mobile terminal and the communication unit cooperate to start the micro pump and make the fluid flow in the circulation channel of the heat flow cavity. When the terminal heat sink is separated from the mobile terminal, the mobile terminal and the communication unit lose cooperation, and the micro pump stops.

[0029] In an optional implementation, when the mobile terminal and the communication unit cooperate, the reverse charging function of the mobile terminal is activated, so that the power of the mobile terminal is transmitted to the micro pump through the wireless coil or the charging line, so that the micro pump works.

[0030] In an optional implementation, the mobile terminal and the communication unit cooperate to detect that the terminal heat dissipation device has been installed on the mobile terminal. The mobile terminal has the function of detecting its own temperature. When the detected temperature of the mobile terminal reaches a predetermined value, the reverse charging function of the mobile terminal is activated.

[0031] In an optional implementation, the communication unit and the mobile terminal are matched magnetically. The communication unit is a magnet, and the mobile terminal has a Hall sensor. The position of the communication unit needs to correspond to the position of the Hall sensor of the mobile terminal. When the terminal heat sink is assembled to the mobile terminal, the Hall sensor can detect the change in the predetermined magnetic field strength caused by the magnet, and the micro pump is started. When the terminal heat sink is separated from the mobile terminal, the Hall sensor cannot detect the change in the predetermined magnetic field strength caused by the magnet, and the micro pump is stopped.

[0032] In an optional implementation, near field communication is performed between the communication unit and the mobile terminal, and the communication unit is a near field communication (NFC) device that can perform NFC communication with the mobile terminal. When the terminal heat dissipation device is assembled to the mobile terminal, the mobile terminal and the NFC device establish communication, and the micro pump is started. When the terminal heat dissipation device is separated from the mobile terminal, the mobile terminal and the NFC device do not establish communication, and the micro pump is stopped.

[0033] In an optional implementation, the communication unit and the mobile terminal communicate via Bluetooth, and the communication unit is a Bluetooth communication device that can communicate with the mobile terminal via Bluetooth. When the terminal heat sink is assembled to the mobile terminal, the mobile terminal and the Bluetooth communication device establish communication, and the micro pump is started. When the terminal heat sink is separated from the mobile terminal, the mobile terminal and the Bluetooth communication device do not establish communication, and the micro pump is stopped.

[0034] In an optional implementation, the communication unit and the mobile terminal communicate via a universal serial bus (USB), the communication unit is an electrical interface that cooperates with a data line, and the mobile terminal and the electrical interface are connected via the data line for USB communication. When the terminal heat sink is assembled to the mobile terminal, the mobile terminal and the electrical interface establish communication, so that the micro pump works. When the terminal heat sink is separated from the mobile terminal, the mobile terminal and the electrical interface do not establish communication, so that the micro pump stops.

[0035] In an optional implementation, the communication unit and the mobile terminal communicate via a feature verification code. The user enters the correct feature verification code on the display screen of the mobile terminal, and the mobile terminal sends a start signal to the communication unit. After receiving the start signal, the micro pump can be started.

[0036] In an optional implementation, the control component further includes a switch element, the micro pump and the switch element are electrically connected, the switch element and the heat flow cavity are relatively fixed, and the switch element is used to control the operation of the micro pump.

[0037] By operating the switch, the circuit of the micro pump is turned on or off, so as to realize the start or stop control of the micro pump. The switch can be a toggle switch, a push switch, etc.

[0038] In an optional implementation, the control component further includes a driving unit, the micro pump and the driving unit are electrically connected, the driving unit and the thermal fluid cavity are relatively fixed, and the driving unit is used to drive the micro pump to work.

[0039] The driving unit generates a driving signal for controlling the operation of the micro pump. After the micro pump receives the driving signal, the micro pump operates according to requirements such as a predetermined rotation speed.

[0040] In an optional implementation, the micro pump is configured to be driven by a mobile terminal.

[0041] A driving signal for controlling the operation of the micropump is generated by the mobile terminal. Wired or wireless communication can be used between the mobile terminal and the micropump. After the micropump receives the driving signal, the micropump operates according to requirements such as a predetermined speed.

[0042] In an optional implementation, the terminal heat dissipation device further includes a shell, and the heat flow cavity is located in the shell.

[0043] The shell is used as a carrier, and the heat flow cavity is set in the shell, so that the terminal heat dissipation device can be assembled on the back of the mobile terminal. The shell is used as a heat dissipation component, and the heat flow cavity directly or indirectly absorbs the heat of the mobile terminal. The heat of the heat flow cavity is directly or indirectly transferred to the shell, and the shell and the external environment exchange heat to achieve heat dissipation.

[0044] In an optional implementation, the housing and the heat flow cavity can be an assembled structure, the housing has a receiving cavity, and the heat flow cavity is arranged in the receiving cavity. The receiving cavity of the housing can be set according to the shape of the heat flow cavity, and can be set to a shape that matches the heat flow cavity.

[0045] In an optional implementation, the shell and the heat flow cavity may also be an integrated structure, and the overall structure is simple.

[0046] In an optional implementation, the housing is a plastic part, a glass part, a metal part and / or a silicone part. These housings can absorb the heat of the heat pool or the heat flow cavity well and exchange heat with the external environment to achieve heat dissipation.

[0047] In an optional implementation, the housing has a buckling portion, and the buckling portion is used to buckle and cooperate with the mobile terminal.

[0048] When assembling the terminal heat dissipation device to the mobile terminal, the buckle portion is buckled at the edge of the mobile terminal, so that the terminal heat dissipation device can be conveniently and stably assembled on the back of the mobile terminal, so that the first side wall of the heat flow cavity and the back of the mobile terminal are arranged relative to each other to achieve heat conduction.

[0049] In an optional implementation, the buckled portion can be set as a surrounding wall with an opening, and the mobile terminal can be placed inside the surrounding wall through the opening. The surrounding wall can be buckled on the four edges of the mobile terminal similar to a conventional mobile phone protective case, which is easy to assemble and has a reliable connection.

[0050] In an optional implementation, the buckling portion is a pair of buckles arranged at intervals, and the pair of buckles arranged at intervals can be buckled on two opposite edges of the mobile terminal, which is convenient for assembly and reliable for connection.

[0051] In an optional implementation, a partition is provided on a side of the first side wall facing away from the second side wall, and the partition is connected to the shell.

[0052] When the terminal heat dissipation device is assembled on the mobile terminal, the back of the mobile terminal and the partition are arranged against each other, and the heat generated on the back of the mobile terminal can be conducted to the heat flow cavity through the partition.

[0053] In an optional implementation, the shape of the partition is adapted to the shape of the heat flow cavity. For example, the heat flow cavity is configured as a plate-like rectangular parallelepiped and the partition is also configured as a plate-like rectangular parallelepiped.

[0054] In an optional implementation, the partition is a Mylar piece, a plastic piece, a silicone piece or a glass piece. These materials are light in weight and can achieve good heat conduction, and are specifically set as needed.

[0055] In an optional implementation, the partition and the shell are connected by hot melt connection, colloid bonding or snap connection. These methods can better fix the partition on the shell, and the connection is reliable, and the specific setting is as needed.

[0056] In an optional implementation, no partition is configured, the back of the mobile terminal and the first side wall of the heat flow cavity are arranged against each other, and the heat generated by the back of the mobile terminal is conducted to the fluid in the heat flow cavity through the first side wall.

[0057] In an optional implementation, the heat flow cavity has a flexible function, and the heat flow cavity can be bent and deformed, so that the user experience is better. When the terminal heat dissipation device has a shell, the flexible heat flow cavity is easy to be assembled in the shell.

[0058] In an optional implementation, the bending angle of the heat flow cavity is greater than or equal to 5° with the center line of the heat flow cavity as the axis. The heat flow cavity is subjected to a bending test, and a pressure head with a bending radius of 1.5 mm is used to press the center line position of the heat flow cavity. The bending angle of the heat flow cavity can be greater than or equal to 5°, indicating that the heat flow cavity has good flexibility.

[0059] In an optional implementation, the heat flow cavity can be a plastic part, a glass part or a metal part. These materials can achieve good heat conduction. When making the heat flow cavity, the first side wall, the second side wall and the support wall can be made of the same or different materials.

[0060] In an optional implementation, the heat flow cavities may be of equal thickness or unequal thickness and may be arranged as required. These heat flow cavities may absorb the heat of the mobile terminal, and the heat is conducted to part of the fluid medium through the first side wall.

[0061] In an optional implementation, the heat flow cavity has a uniform thickness, and the heat pool can be arranged on the entire surface or a local area of ​​the second side wall of the heat flow cavity.

[0062] In an optional implementation, the heat flow cavity has unequal thickness, and the second side wall may be partially convex or partially concave, or the first side wall may be partially concave, depending on the specific needs.

[0063] In an optional implementation, the circulation channel is in the form of a maze, a racetrack or a parallel type, etc. Under the action of a micropump, the fluid medium continuously flows in a direction in the circulation channel, so that the heat from the local back of the mobile terminal is transferred to the area with lower heat through the flowing fluid medium, thereby achieving a uniform heating effect.

[0064] In an optional implementation, the circulation channel is in a maze shape. The circulation channel is similar to a plane maze. The routes of the maze are connected. It can be a closed route or multiple connected routes, so that the fluid can circulate in a direction in the maze-like circulation channel.

[0065] The support wall in the heat flow cavity is arranged between the first side wall and the second side wall, and the support wall includes an outer peripheral wall, one or more longitudinal walls and one or more transverse walls. The longitudinal wall and the transverse wall are located inside the outer peripheral wall, and maze routes of different shapes are formed by the outer peripheral wall, the longitudinal wall and the transverse wall.

[0066] In an optional implementation, the supporting wall of the heat flow cavity includes an outer peripheral wall, a first longitudinal wall, a second longitudinal wall, a third longitudinal wall and a transverse wall. The first longitudinal wall, the second longitudinal wall and the third longitudinal wall are arranged in sequence, and both ends of the first longitudinal wall are spaced from the outer peripheral wall. The middle of the first longitudinal wall and one end of the third longitudinal wall are connected by the transverse wall, and the other end of the third longitudinal wall is spaced from the outer peripheral wall. One end of the second longitudinal wall is connected to the outer peripheral wall, and the other end is spaced from the transverse wall. A labyrinth-shaped circulation channel is formed by the outer peripheral wall, multiple longitudinal walls and one transverse wall.

[0067] In an optional implementation, the micro pump can be arranged at any position of the circulation channel, such as at one end of the third longitudinal wall. In addition, the micro pump can also be arranged at one end of the first longitudinal wall, one end of the second longitudinal wall or other positions.

[0068] In an optional implementation, the circulation channel is in a racetrack shape, the support wall in the heat flow cavity is arranged between the first side wall and the second side wall, the support wall includes an outer peripheral wall and a longitudinal wall, the longitudinal wall is arranged inside the outer peripheral wall, and the two ends of the longitudinal wall are respectively arranged with the outer peripheral wall to form a racetrack-shaped circulation channel. The micro pump can be arranged at any position of the circulation channel, such as at one end of the longitudinal wall.

[0069] In an optional implementation, the circulation channel is in parallel, and the circulation channel includes multiple branches, the first ends of the multiple branches are connected, and the second ends of the multiple branches are connected to form a parallel circulation channel.

[0070] The support wall in the heat flow cavity is arranged between the first side wall and the second side wall, and the support wall includes an outer peripheral wall and a plurality of longitudinal walls arranged at intervals, and the two ends of each longitudinal wall are respectively arranged at intervals from the outer peripheral wall, thereby forming a parallel circulation channel. The micro pump can be arranged at any position of the circulation channel, such as on one of the branches. In addition, multiple micro pumps can be configured to drive the flow of the fluid working medium.

[0071] In an optional implementation, the circulation channel includes three branches, the first ends of the three branches are connected, the second ends of the three branches are connected, and micro pumps are respectively arranged on two of the branches to drive the flow of the fluid.

[0072] In an optional implementation, the fluid medium is water, fluoride liquid, saline solution, organic aqueous solution or air. Driven by the micro pump, the fluid medium continuously flows in the circulation channel, and the heat generated by the mobile terminal is transferred to the fluid medium at the corresponding position through the first side wall. The heat carried by the fluid medium can be transferred to each position of the heat flow cavity to achieve uniform heating.

[0073] In an optional implementation, the fluid working medium is an aqueous solution with an antifreeze additive. The antifreeze additive may be salt, ethylene glycol, alcohol, etc. The aqueous solution with the antifreeze additive has a low freezing point. In the low temperature of winter, the fluid working medium is not easy to solidify and freeze, which reduces the situation where the fluid working medium in the heat flow cavity solidifies and expands, causing the heat flow cavity to be damaged, and improves the reliability of the terminal heat dissipation device in a low temperature environment, so that the terminal heat dissipation device can still be used in the low temperature of winter.

[0074] In an optional implementation, the heat pool has a flexible function, the heat pool can be bent and deformed, and the user experience is better. When the terminal heat dissipation device has a shell, the flexible heat pool is easy to be assembled in the shell.

[0075] In an optional implementation, the bending angle of the heat pool is greater than or equal to 5° with the center line of the heat pool as the axis. The heat pool is subjected to a bending test, and a pressure head with a bending radius of 1.5 mm is used to press the center line of the heat pool. The bending angle of the heat pool can be greater than or equal to 5°, indicating that the heat pool has good flexibility.

[0076] In an optional implementation, the heat pool is a phase-change thermal storage element, and the phase-change peak temperature range of the phase-change thermal storage element is 30°C to 50°C.

[0077] Phase change heat storage elements are used as heat pools, which can absorb and store heat. When the phase change temperature is reached, the heat pool can absorb a large amount of latent heat while maintaining the temperature unchanged, providing a better user experience.

[0078] In an optional implementation, the heat sink is a plastic part, a metal part or a glass part. The heat sink made of these materials can achieve heat conduction or heat exchange with the external environment to achieve heat dissipation.

[0079] In an optional implementation, the heat pool is at least partially disposed on the second side wall of the heat flow cavity.

[0080] When the terminal heat dissipation device is mounted on a mobile terminal, the first side wall is arranged facing the back of the mobile terminal and is used to absorb the heat of the mobile terminal, and the heat pool on the second side wall absorbs the heat of the second side wall and conducts the heat outward to achieve heat dissipation of the mobile terminal. The heat pool is arranged on the entire surface of the second side wall. Alternatively, the heat pool is arranged on a part of the second side wall.

[0081] In an optional implementation, a shell is provided, the inner wall of the shell is provided with one or more protrusions, heat pools are arranged between adjacent protrusions, and the second side wall is provided with a plurality of heat pools.

[0082] In an optional implementation, the heat pool is at least partially disposed on the first side wall of the heat flow cavity.

[0083] When the terminal heat dissipation device is mounted on a mobile terminal, the heat pool on the first side wall is arranged facing the back of the mobile terminal and is used to absorb the heat of the mobile terminal, and the heat flow cavity is used to absorb the heat of the heat pool and conduct the heat outward to achieve heat dissipation of the mobile terminal. The heat pool can be arranged on the entire surface or a part of the first side wall.

[0084] In an optional implementation, a portion of the heat pool is disposed on a first side wall of the heat flow cavity, and another portion of the heat pool is disposed on a second side wall of the heat flow cavity.

[0085] When the terminal heat dissipation device is assembled on the mobile terminal, the heat of the mobile terminal is absorbed by the partial heat pool on the first side wall (and the first side wall), the heat flow cavity absorbs the heat of the partial heat pool of the first side wall and conducts the heat outward, and the heat flow cavity also conducts the heat to the partial heat pool of the second side wall, and the heat is conducted outward from the heat pool to achieve heat dissipation of the mobile terminal.

[0086] In an optional implementation, the heat pool is provided as a shell, and the heat flow cavity is located in the shell. The overall structure is simple, and the terminal heat dissipation device can effectively dissipate heat for the mobile terminal when it is assembled in the mobile terminal.

[0087] In an optional implementation, the shell and the heat flow cavity may be an assembled structure, the shell has a containing cavity, and the heat flow cavity is disposed in the containing cavity.

[0088] In an optional implementation, the shell and the heat flow cavity may also be an integrated structure, and the overall structure is simple.

[0089] In an optional implementation, the housing has a buckle portion, which is used to buckle with the mobile terminal. The buckle portion is buckled at the edge of the mobile terminal, so that the terminal heat dissipation device can be conveniently and stably assembled on the back of the mobile terminal.

[0090] In an optional implementation, the buckled portion can be set as a surrounding wall with an opening, and the mobile terminal can be placed inside the surrounding wall through the opening. The surrounding wall can be buckled on the four edges of the mobile terminal similar to a conventional mobile phone protective case, which is easy to assemble and has a reliable connection.

[0091] In an optional implementation, the buckling portion is a pair of buckles arranged at intervals, and the pair of buckles arranged at intervals can be buckled on two opposite edges of the mobile terminal, which is convenient for assembly and reliable for connection.

[0092] In an optional implementation, a partition is provided on a side of the first side wall facing away from the second side wall, and the partition is connected to the shell.

[0093] The heat flow cavity is arranged between the housing and the partition, and the terminal heat dissipation device has a good appearance. The back of the mobile terminal and the partition are arranged against each other, and the heat generated by the back of the mobile terminal can be transferred to the heat flow cavity through the partition. The micro pump drives the fluid to flow in the heat flow cavity, so that the heat is transferred to each position of the heat flow cavity to achieve uniform heating. The heat pool conducts heat and exchanges heat with the external environment to achieve heat dissipation.

[0094] In an optional implementation, the partition is a Mylar piece, a plastic piece, a silicone piece or a glass piece. These materials are light in weight and can achieve good heat conduction, and are specifically set as needed.

[0095] In an optional implementation, the partition and the shell are connected by hot melt connection, colloid bonding or snap connection. These methods can better fix the partition on the shell, and the connection is reliable, and the specific setting is as needed.

[0096] In an optional implementation, the first side wall and / or the second side wall is a phase-change heat storage element. The phase-change heat storage element has a large heat storage capacity and can absorb a large amount of latent heat while maintaining a constant temperature when the phase change temperature is reached, thereby improving the user experience of the terminal heat dissipation device.

[0097] In an optional implementation, at least part of the outer surface of the heat flow cavity is provided with a phase change heat storage layer. The phase change heat storage layer has a large heat storage capacity, and when the phase change temperature is reached, it can absorb a large amount of latent heat while maintaining the temperature unchanged, thereby improving the user experience of the terminal heat dissipation device.

[0098] In an optional implementation, the fluid medium is colored, or the fluid medium includes a colored medium; when the terminal heat dissipation device includes a shell, the shell is transparent as a whole or partially transparent, and the heat flow cavity is transparent as a whole or partially transparent, so that the fluid medium can be presented through the shell and the heat flow cavity. The user can see the flow effect of at least part of the fluid medium inside the heat flow cavity through the shell and the heat flow cavity, and the user experience is improved.

[0099] In an optional implementation, the elongation at break of the first side wall is greater than or equal to 10%; and / or, the elongation at break of the second side wall is greater than or equal to 10%. The fluid filling rate in the circulation channel reaches more than 95%, and more fluid is driven to flow by the micropump, which can improve the thermal conductivity of the heat flow cavity. The first side wall (second side wall) will stretch to prevent the fluid that expands due to temperature from damaging the heat flow cavity, thereby improving the reliability of the device.

[0100] In an optional implementation, the heat pool is a phase-change heat storage element, which includes a skeleton, phase-change heat storage microcapsules and heat-conducting fillers, and the phase-change heat storage microcapsules and heat-conducting fillers are filled in the skeleton. The phase-change heat storage element is easy to manufacture and has a stable structure.

[0101] In an optional implementation, the phase-change heat storage element is located in the housing, and the thermal conductivity of the phase-change heat storage element is greater than or equal to the thermal conductivity of the housing, which is beneficial to improving the thermal conductivity of the heat pool and allowing the heat of the mobile terminal or the heat flow cavity to be transferred to the heat pool more quickly.

[0102] In an optional implementation, the heat pool is a phase-change thermal storage element, and the thermal conductive filler in the phase-change thermal storage element includes at least one of aluminum oxide, aluminum nitride, magnesium oxide, zinc oxide, and boron nitride, which effectively improves the thermal conductivity of the phase-change thermal storage element and the thermal conductivity of the heat pool.

[0103] In an optional implementation, the skeleton can be made of polymer foam, such as at least one of polyurethane, silicone, and polyacrylic acid. These materials are easy to form a stable skeleton and form a porous structure.

[0104] In an optional implementation, the phase-change heat storage microcapsules are normal alkane microcapsules. Normal alkane paraffin is a hydrocarbon phase-change material with stable performance and high energy storage density.

[0105] In an optional implementation, the mass proportion of the phase-change heat storage microcapsules in the phase-change heat storage element is 70% to 80%, and the mass proportion of the heat conductive filler in the phase-change heat storage element is 20% to 30%. The phase-change heat storage element can realize a uniformly distributed heat conductive network structure, and the heat pool has a predetermined heat storage capacity.

[0106] In a second aspect, an embodiment of the present application provides a mobile terminal, which adopts the above-mentioned terminal heat dissipation device, and the mobile terminal and the first side wall of the heat flow cavity are arranged relative to each other so that the first side wall absorbs the heat of the mobile terminal.

[0107] The mobile terminal provided in the embodiment of the present application adopts the above-mentioned terminal heat dissipation device. The heat generated by the mobile terminal is directly or indirectly conducted to the fluid medium at the corresponding position through the first side wall. The fluid medium driven by the micropump brings the local heat to other positions of the heat flow cavity to achieve uniform heating. The heat of the heat flow cavity is conducted outward through the second side wall, or the heat of the heat flow cavity is conducted to the heat pool. The heat pool can absorb the heat of the heat flow cavity and conduct the heat outward, thereby achieving external heat dissipation of the mobile terminal. The control component can provide the electric energy of the mobile terminal to the micropump, or the control component can directly power the micropump. The terminal heat dissipation device is easy to use and can be used outdoors, and the portability is improved. The terminal heat dissipation device of the present application only needs to power the micropump, and the power consumption is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0108] Figure 1 (a) is a front view of the terminal heat dissipation device provided in an embodiment of the present application;

[0109] Figure 1 (b) in Figure 1 Schematic diagram of assembly of the terminal heat dissipation device and the mobile terminal in (a);

[0110] Figure 2 for Figure 1 A cross-sectional view of the terminal heat dissipation device along line AA of (a);

[0111] Figure 3 (a) and (b) are schematic structural diagrams of a terminal heat dissipation device and a mobile terminal provided in an embodiment of the present application when not assembled and when assembled, respectively;

[0112] Figure 4 (a) and (b) are schematic diagrams of the structures of the heat flow cavity and the micro pump in the terminal heat dissipation device provided in different embodiments of the present application;

[0113] Figure 5 for Figure 4 (a) is a cross-sectional view of the heat flow cavity along the CC line;

[0114] Figure 6 (a) and (b) are Figure 1 A cross-sectional view of the terminal heat dissipation device and the mobile terminal in (a) when not assembled and when assembled along line BB;

[0115] Figure 7 (a) and (b) are schematic structural diagrams of a terminal heat dissipation device and a mobile terminal provided in another embodiment of the present application when they are not assembled and when they are assembled, respectively;

[0116] Figure 8 (a) and (b) are schematic structural diagrams of a terminal heat dissipation device and a mobile terminal provided in another embodiment of the present application when assembled and when not assembled;

[0117] Fig. 9 (a) and (b) are schematic structural diagrams of a terminal heat dissipation device and a mobile terminal provided in another embodiment of the present application when they are not assembled and when they are assembled, respectively;

[0118] Fig.10 for Figure 2 Bending test diagram of the heat flow cavity or heat pool in the terminal heat dissipation device;

[0119] Fig.11 A schematic diagram of the structure of a terminal heat dissipation device provided in another embodiment of the present application;

[0120] Fig.12 A schematic diagram of the structure of a heat flow cavity and a micro pump in a terminal heat dissipation device provided in another embodiment of the present application;

[0121] Fig.13 (a) and (b) are schematic diagrams of the structures of the heat flow cavity and the micro pump in the terminal heat dissipation device provided in different embodiments of the present application;

[0122] Fig.14 for Figure 2 Phase change heat storage curve of the heat pool in the terminal heat dissipation device;

[0123] Fig.15 A schematic diagram of the structure of a terminal heat dissipation device provided in another embodiment of the present application;

[0124] Fig.16 (a) and (b) are schematic structural diagrams of a terminal heat dissipation device and a mobile terminal provided in another embodiment of the present application when they are not assembled and when they are assembled, respectively;

[0125] Fig.17 (a) and (b) are schematic structural diagrams of a terminal heat dissipation device and a mobile terminal provided in another embodiment of the present application when they are not assembled and when they are assembled, respectively;

[0126] Fig.18 (a) and (b) are schematic structural diagrams of a terminal heat dissipation device and a mobile terminal provided in another embodiment of the present application when they are not assembled and when they are assembled, respectively;

[0127] Fig.19 (a) and (b) are infrared temperature measurement images of a mobile terminal using and not using the terminal heat dissipation device of the present application, respectively.

[0128] Description of reference numerals:

[0129] 100-terminal heat dissipation device;

[0130] 10-heat flow cavity; 10a-center line; 11-first side wall; 12-second side wall;

[0131] 13-support wall; 131-peripheral wall; 132-longitudinal wall; 132a-first longitudinal wall; 132b-second longitudinal wall; 132c-third longitudinal wall; 133-transverse wall;

[0132] 14-circulation channel; 141-branch; 15-fluid medium; 16-avoidance position;

[0133] 20-micro pump; 21-input end; 22-output end;

[0134] 30, 30b, 30c - heat pool; 30a - center line;

[0135] 40-control component; 41-first wireless coil; 42-battery;

[0136] 43-charging cable; 431-first plug; 432-second plug;

[0137] 44-electrical interface; 45-communication unit; 46-circuit board; 47-switch element; 48-driving unit;

[0138] 60-housing; 61-accommodating cavity; 62-notch;

[0139] 63- buckle part; 63a- wall; 631- opening; 63b- buckle; 64- raised part;

[0140] 70-partition;

[0141] 200-mobile terminal; 200a-front; 200b-back;

[0142] 201-display screen; 202-battery; 203-second wireless coil; 204-electrical interface; 205-camera;

[0143] 101-pressure head. DETAILED DESCRIPTION

[0144] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application. Although the description of the present application will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to the implementation mode. On the contrary, the purpose of combining the implementation mode as an application introduction is to cover other options or modifications that may be extended based on the claims of the present application. In order to provide a deep understanding of the present application, many specific details will be included in the following description. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details will be omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0145] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0146] It should be understood that in the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0147] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0148] In the embodiments of the present application, "and / or" is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0149] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0150] See also Figure 1 (a) and (b) in Figure 2 , Figure 3 (a) and (b) in the embodiment of the present application, a terminal heat dissipation device 100 is provided, which includes a heat flow cavity 10, a micro pump 20, a heat pool 30 and a control component 40. Figure 4 (a) Figure 5 The heat flow cavity 10 includes a first side wall 11, a second side wall 12 and a support wall 13. The first side wall 11 and the second side wall 12 are arranged at a relative interval. The support wall 13 is arranged between the first side wall 11 and the second side wall 12. The first side wall 11, the second side wall 12 and the support wall 13 surround a circulation channel 14, and the circulation channel 14 is filled with a fluid working medium 15. The first side wall 11 is arranged facing the mobile terminal 200. The micro pump 20 has an input end 21 and an output end 22, and the input end 21 and the output end 22 are both connected to the circulation channel 14. The micro pump 20 is used to drive the fluid working medium 15 to flow in the circulation channel 14. The heat pool 30 is arranged on the heat flow cavity 10. The control component 40 and the heat flow cavity 10 are relatively fixed, and the control component 40 is at least used to transmit the electric energy of the mobile terminal 200 to the micro pump 20 and / or to power the micro pump 20.

[0151] The mobile terminal 200 may be a mobile phone, a tablet computer, a laptop computer, an ultra-mobile personal computer, an e-book reader, a netbook, a personal digital assistant, etc. Figure 3In (a), the front side 200a and the back side 200b of the mobile terminal 200 are opposite sides. Generally, the front side 200a of the mobile terminal 200 has a display screen 201, and the back side 200b of the mobile terminal 200 is a side where components such as a processor (not shown) and a battery 202 are arranged. The processor is the main heat source of the mobile terminal 200 when in use.

[0152] See also Figure 4 In (a) and (b), the micro pump 20 occupies a small space, making the whole structure compact. The input end 21 and the output end 22 of the micro pump 20 are connected to the circulation channel 14, and the micro pump 20 can drive the fluid 15 in the circulation channel 14 to circulate. Figure 4 In (a) and (b), the arrow in the circulation channel 14 is the flow direction of the fluid 15.

[0153] The heat pool 30 is disposed on the heat flow cavity 10, and there are many ways to implement it. Exemplarily, the heat pool 30 is disposed entirely or partially on the first side wall 11; or, the heat pool 30 is disposed entirely or partially on the second side wall 12; or, a part of the heat pool 30 is disposed on the first side wall 11, and another part of the heat pool 30 is disposed on the second side wall 12; or, the heat pool 30 is in the shape of a shell, and the heat flow cavity 10 is disposed in the shell-shaped heat pool 30; or, the heat pool 30 and the heat flow cavity 10 are spaced apart, and the two are connected by other structural members; or, a part of the area between the heat pool 30 and the heat flow cavity 10 is spaced apart, and another part of the area is connected. As long as the heat pool 30 is disposed on the heat flow cavity 10, heat conduction can be formed between the heat flow cavity 10 and the heat pool 30. According to the heat dissipation requirements, the number of heat pools 30 can be set to one or more.

[0154] The first side wall 11 of the heat flow cavity 10 is arranged facing the mobile terminal 200, and there are multiple heat conduction modes for the mobile terminal 200. The heat of the mobile terminal 200 can be conducted to the fluid medium 15 through the first side wall 11. Alternatively, when a heat pool 30 is provided on the first side wall 11, the heat of the mobile terminal 200 can be first conducted to the heat pool 30 of the first side wall 11, and then conducted to the first side wall 11 through the heat pool 30, and then conducted to the fluid medium 15 from the first side wall 11. Similarly, the heat of the fluid medium 15 can be conducted to the second side wall 12, and the heat is conducted outwardly from the second side wall 12. Alternatively, when a heat pool 30 is provided on the second side wall 12, the heat of the fluid medium 15 can be first conducted to the second side wall 12, and then conducted to the heat pool 30 of the second side wall 12 through the second side wall 12, and the heat is conducted outwardly from the heat pool 30.

[0155] The control component 40 and the heat flow cavity 10 are relatively fixed. The control component 40 may be directly fixed on the heat flow cavity 10 , or the control component 40 may be fixed on a predetermined structure and the predetermined structure may be fixed on the heat flow cavity 10 .

[0156] The control component 40 is at least used to transmit the electric energy of the mobile terminal 200 to the micropump 20 and / or power the micropump 20. The micropump 20 may be powered by the battery 42 of the mobile terminal 200 or the terminal heat dissipation device 100 alone, or the micropump 20 may be powered by the battery 42 of the mobile terminal 200 and the terminal heat dissipation device 100.

[0157] In the terminal heat dissipation device 100 provided in the embodiment of the present application, the first side wall 11 of the heat flow cavity 10 and the mobile terminal 200 are arranged oppositely, and the heat pool 30 is arranged on the heat flow cavity 10. The first side wall 11, the second side wall 12 and the support wall 13 of the heat flow cavity 10 form a circulation channel 14, and the fluid working medium 15 is driven by the micro pump 20 to continuously flow in the circulation channel 14. The heat generated by the mobile terminal 200 is directly or indirectly conducted to the fluid working medium 15 at the corresponding position through the first side wall 11, and the flowing fluid working medium 15 brings the local heat to other positions of the heat flow cavity 10 to achieve uniform heating. The heat of the heat flow cavity 10 is conducted outward through the second side wall 12, or the heat of the heat flow cavity 10 is conducted to the heat pool 30. The heat pool 30 can absorb the heat of the heat flow cavity 10 and conduct the heat outward, thereby realizing the external heat dissipation of the mobile terminal 200. The control component 40 can provide the power of the mobile terminal 200 to the micro pump 20, or the control component 40 can directly power the micro pump 20. The terminal heat dissipation device 100 is easy to use and can be used outdoors. It does not need to be connected to an external power supply by a power adapter like the existing heat dissipation back clip, and the portability is improved. Compared with the existing heat dissipation back clip that needs to supply power to the semiconductor cooling sheet and the fan, the terminal heat dissipation device 100 of the present application only needs to supply power to the micro pump 20, and the power consumption is lower.

[0158] When setting up the heat flow cavity 10, refer to Figure 4 In (a) and (b), the heat flow cavity 10 can be set according to the shape of the mobile terminal 200, and can be set to a shape that matches the back 200b of the mobile terminal 200. For example, the mobile terminal 200 is roughly a plate-shaped rectangular parallelepiped, and the heat flow cavity 10 can be set to a matching plate-shaped rectangular parallelepiped, so that the heat flow cavity 10 can absorb heat from the heat-generating position on the back 200b of the mobile terminal 200, and conduct the heat to a position with lower heat generation, thereby achieving a uniform heating effect.

[0159] See also Figure 1 In (a) and (b), when considering setting devices such as a camera 205 and a flash on the back 200b of the mobile terminal 200, the heat flow cavity 10 can be provided with an avoidance position 16 at the corresponding position, so that when the terminal heat dissipation device 100 is assembled on the mobile terminal 200, the related devices can still work normally instead of being blocked by the heat flow cavity 10.

[0160] For example, a camera and a flash are provided at the upper left corner of the back side 200b of the mobile terminal 200, and a avoidance position 16 is provided at the corresponding position of the heat flow cavity 10. Figure 1In (a) and (b), when the housing 60 is provided, a notch 62 is also provided at a corresponding position of the housing 60, so that when the terminal heat dissipation device 100 is assembled in the mobile terminal 200, the camera and the flash can work normally.

[0161] There are multiple optional implementations for powering the micro pump 20 .

[0162] The first power supply method of the micro pump 20 is to couple the power supply with the wireless coil of the mobile terminal 200: Figure 1 (a) and (b) in Figure 6 In (a) and (b), the control component 40 includes a first wireless coil 41, the micro pump 20 is electrically connected to the first wireless coil 41, and the first wireless coil 41 and the second wireless coil 203 of the mobile terminal 200 are correspondingly arranged to enable the mobile terminal 200 to be reverse charged.

[0163] For a mobile terminal 200 with a wireless coil and reverse charging function, the terminal heat dissipation device 100 can be configured with a first wireless coil 41 to couple the first wireless coil 41 with the second wireless coil 203 of the mobile terminal 200, so that the electric energy of the battery 202 of the mobile terminal 200 is transmitted from the second wireless coil 203 to the first wireless coil 41, and the first wireless coil 41 supplies power to the micro pump 20.

[0164] When the first wireless coil 41 is set, the first wireless coil 41 needs to be set relative to the second wireless coil 203 of the mobile terminal 200 to improve the wireless charging efficiency. Figure 6 In (a), the first wireless coil 41 can be set on the side of the heat pool 30 facing away from the heat flow cavity 10, between the heat flow cavity 10 and the heat pool 30, or on the side of the heat flow cavity 10 facing away from the heat pool 30, as long as the first wireless coil 41 and the second wireless coil 203 of the mobile terminal 200 are coupled to achieve power transmission.

[0165] For example, see Figure 6 In (a) and (b), the heat flow cavity 10, the micro pump 20 and the heat pool 30 are all arranged in the shell 60, and the first wireless coil 41 is arranged between the inner wall of the shell 60 and the heat pool 30. The heat flow cavity 10 and the heat pool 30 are made of non-metallic materials, which can realize the coupling of the first wireless coil 41 and the second wireless coil 203 of the mobile terminal 200.

[0166] For example, see Figure 7 In (a) and (b), the heat flow cavity 10, the micro pump 20 and the heat pool 30 are all arranged in the shell 60, and a partition 70 is provided on the first side wall of the heat flow cavity 10. The partition 70 is made of non-metallic material. The first wireless coil 41 is arranged between the heat flow cavity 10 and the partition 70, which can realize the coupling of the first wireless coil 41 and the second wireless coil 203 of the mobile terminal 200.

[0167] The second power supply method of the micro pump 20 is to connect the charging line 43 and the mobile terminal 200 to supply power: Figure 8 In (a) and (b), the control component 40 includes a charging cable 43, the micro pump 20 and the charging cable 43 are electrically connected, and the first plug 431 of the charging cable 43 and the electrical interface 204 of the mobile terminal 200 can be plugged together to enable the mobile terminal 200 to be reverse charged.

[0168] For a mobile terminal 200 with a reverse charging function, the mobile terminal 200 and the terminal heat dissipation device 100 are connected via a charging line 43 , so that the power of the battery 202 of the mobile terminal 200 supplies power to the micro pump 20 via the charging line 43 .

[0169] The charging cable 43 may be a conventional data cable. The first plug 431 of the charging cable 43 may be plugged into the electrical interface 204 of the mobile terminal 200, and the other end of the charging cable 43 may be directly electrically connected to the micro pump 20 to achieve power transmission.

[0170] Alternatively, the other end of the charging cable 43 is provided as a second plug 432, the micro pump 20 is electrically connected to the electrical interface 44, and the second plug 432 is plugged into the electrical interface 44 to achieve power transmission. The electrical interface 44 can be provided in the thermal fluid cavity 10 or other locations. When the housing 60 is configured, the electrical interface 44 can be provided on the housing 60.

[0171] The third power supply method of the micro pump 20 is to use a built-in battery 42: Figure 1 In (a) and (b), the control component 40 includes a battery 42, and the battery 42 is electrically connected to the micro pump 20, and the battery 42 and the micro pump 20 are relatively fixed.

[0172] A battery 42 is configured on the terminal heat dissipation device 100 to supply power to the micro pump 20. The battery 42 can be a button battery, which takes up little space and makes the whole structure compact. The battery 42 can be arranged in the heat flow cavity 10 or other positions. When the housing 60 is configured, the battery 42 can be arranged on the housing 60.

[0173] There are optional implementations when setting the control mode of the micro pump 20 .

[0174] See also Figure 1 In (a) and (b), the first micro pump 20 control mode is to communicate with the mobile terminal 200 to control the micro pump 20. The control component 40 also includes a communication unit 45, the communication unit 45 and the heat flow cavity 10 are relatively fixed, and the communication unit 45 is used to cooperate with the mobile terminal 200 to control the micro pump 20 to work.

[0175] The communication unit 45 is configured in the terminal heat dissipation device 100 to realize the start and stop control of the micro pump 20. Figure 3 (a) and (b) in Figure 4 In (a) and (b), when the terminal heat sink 100 is assembled to the mobile terminal 200, the mobile terminal 200 and the communication unit 45 cooperate to start the micro pump 20 to make the fluid 15 flow in the circulation channel 14 of the heat flow cavity 10. When the terminal heat sink 100 and the mobile terminal 200 are separated, the mobile terminal 200 and the communication unit 45 lose cooperation, and the micro pump 20 stops.

[0176] Exemplarily, when the mobile terminal 200 and the communication unit 45 cooperate, the reverse charging function of the mobile terminal 200 is activated, so that the power of the mobile terminal 200 is transmitted to the micro pump 20 through the wireless coil or the charging line, so that the micro pump 20 works.

[0177] Alternatively, the mobile terminal 200 and the communication unit 45 cooperate to detect that the terminal heat dissipation device 100 has been installed on the mobile terminal 200, and the mobile terminal 200 has the function of detecting its own temperature. When the detected temperature of the mobile terminal 200 reaches a predetermined value, the reverse charging function of the mobile terminal 200 is activated.

[0178] See also Figure 1 In (a), the communication unit 45 can be disposed on a circuit board 46, and the circuit board 46 can be disposed on the housing 60, the heat flow cavity 10 or other locations.

[0179] There are a variety of optional cooperation modes between the communication unit 45 and the mobile terminal 200, such as magnetic cooperation, near field communication (NFC), Bluetooth communication, universal serial bus (USB) communication, feature verification code communication, etc.

[0180] Exemplarily, the communication unit 45 and the mobile terminal 200 are magnetically matched. The communication unit 45 is a magnet, and the mobile terminal 200 has a Hall sensor (not shown). The position where the communication unit 45 is set needs to correspond to the position of the Hall sensor of the mobile terminal 200. When the terminal heat sink 100 is assembled to the mobile terminal 200, the Hall sensor can detect the change in the predetermined magnetic field strength caused by the magnet, and the micro pump 20 is started. When the terminal heat sink 100 and the mobile terminal 200 are separated, the Hall sensor cannot detect the change in the predetermined magnetic field strength caused by the magnet, and the micro pump 20 is stopped.

[0181] Exemplarily, there is near field communication between the communication unit 45 and the mobile terminal 200, and the communication unit 45 is an NFC device that can perform NFC communication with the mobile terminal 200. When the terminal heat dissipation device 100 is assembled to the mobile terminal 200, the mobile terminal 200 and the NFC device establish communication, and the micro pump 20 is started. When the terminal heat dissipation device 100 and the mobile terminal 200 are separated, the mobile terminal 200 and the NFC device do not establish communication, and the micro pump 20 is stopped.

[0182] Exemplarily, the communication unit 45 and the mobile terminal 200 communicate via Bluetooth, and the communication unit 45 is a Bluetooth communication device that can communicate via Bluetooth with the mobile terminal 200. When the terminal heat sink 100 is assembled to the mobile terminal 200, the mobile terminal 200 and the Bluetooth communication device establish communication, and the micro pump 20 is started. When the terminal heat sink 100 and the mobile terminal 200 are separated, the mobile terminal 200 and the Bluetooth communication device do not establish communication, and the micro pump 20 is stopped.

[0183] Exemplarily, the communication unit 45 and the mobile terminal 200 are in USB communication, the communication unit 45 is an electrical interface that cooperates with the data line, and the mobile terminal 200 and the electrical interface are connected through the data line for USB communication. When the terminal heat sink 100 is assembled to the mobile terminal 200, the mobile terminal 200 and the electrical interface establish communication, so that the micro pump 20 works. When the terminal heat sink 100 and the mobile terminal 200 are separated, the mobile terminal 200 and the electrical interface do not establish communication, so that the micro pump 20 stops.

[0184] Exemplarily, the communication unit 45 and the mobile terminal 200 communicate via a feature verification code. The user enters the correct feature verification code (e.g., a graphic verification code, a sliding verification code, or a touch verification code) on the display screen 201 interface of the mobile terminal 200. The mobile terminal 200 sends a start signal to the communication unit 45. After the communication unit 45 receives the start signal, the micropump 20 can be started.

[0185] See also Figure 1 In (a) and (b), the second micro pump 20 control mode is that the switch 47 controls the micro pump 20. The control assembly 40 also includes a switch, the micro pump 20 and the switch 47 are electrically connected, the switch 47 and the heat flow cavity 10 are relatively fixed, and the switch 47 is used to control the micro pump 20 to work.

[0186] A switch 47 is configured in the terminal heat dissipation device 100. By operating the switch 47, the circuit of the micro pump 20 is turned on or off, thereby realizing the start or stop control of the micro pump 20. The switch 47 can be set in the housing 60, the heat flow cavity 10 or other positions, and needs to be set in a position convenient for user operation. The switch 47 can be a toggle switch, a push switch, etc.

[0187] There are optional implementations when setting the driving mode of the micro pump 20 .

[0188] See also Figure 1 In (a) and (b), the first driving mode of the micro pump 20 is driven by the driving unit 48. The control component 40 also includes a driving unit, the micro pump 20 and the driving unit 48 are electrically connected, the driving unit 48 and the thermal fluid cavity 10 are relatively fixed, and the driving unit 48 is used to drive the micro pump 20 to work.

[0189] The driving unit 48 generates a driving signal for controlling the operation of the micro pump 20. After the micro pump 20 receives the driving signal, the micro pump 20 operates according to the predetermined speed and other requirements. The driving unit 48 can be a circuit board, a driving chip, etc. The driving unit 48 can be fixed to the heat flow cavity 10, the housing 60 or other positions.

[0190] See also Figure 8 In (a) and (b), the second driving mode of the micro pump 20 is driven by the mobile terminal 200. The micro pump 20 is configured to be driven by the mobile terminal 200.

[0191] The mobile terminal 200 generates a driving signal to control the operation of the micro pump 20. The mobile terminal 200 and the micro pump 20 can use wired communication or wireless communication. After the micro pump 20 receives the driving signal, the micro pump 20 operates according to the requirements of the predetermined speed, etc. It is a conventional technology to generate a driving signal to control the operation of certain actuators (such as the micro pump 20) through the mobile terminal 200.

[0192] See also Figure 8 In (a) and (b), wired communication refers to communication between the electrical interface 204 of the mobile terminal 200 and the electrical interface 44 of the terminal heat dissipation device 100 via a charging cable (data cable) 43.

[0193] Combination Figure 1 In (a) and (b), when wireless communication is adopted, NFC communication, Bluetooth communication, etc. are adopted between the mobile terminal 200 and the terminal heat dissipation device 100. Accordingly, the terminal heat dissipation device 100 needs to be provided with a communication unit 45, and the micro pump 20 is electrically connected to the communication unit 45, and wireless communication is performed with the mobile terminal 200 through the communication unit 45. Reference may be made to the above description that the communication unit 45 is an NFC device or a Bluetooth communication device.

[0194] In order to make the terminal heat dissipation device 100 have a better appearance and heat dissipation effect, in some embodiments, refer to Figure 1 (a) and (b) in Figure 2 , Figure 3 In (a) and (b), the terminal heat dissipation device 100 also includes a shell 60, and the heat flow cavity 10 is located in the shell 60.

[0195] The housing 60 is used as a carrier, and the heat flow cavity 10 is set on the housing 60, so that the terminal heat dissipation device 100 can be assembled on the back 200b of the mobile terminal 200. The housing 60 is used as a heat dissipation component, and the heat flow cavity 10 directly or indirectly absorbs the heat of the mobile terminal 200. The heat of the heat flow cavity 10 is directly or indirectly transferred to the housing 60, and the housing 60 and the external environment exchange heat to achieve heat dissipation. The housing 60 is used as an appearance component, so that the mobile terminal 200 equipped with the terminal heat dissipation device 100 has a better appearance.

[0196] The housing 60 and the heat flow cavity 10 may be an assembled structure, the housing 60 has a receiving cavity 61, and the heat flow cavity 10 is disposed in the receiving cavity 61. Exemplarily, the receiving cavity 61 of the housing 60 may be set according to the shape of the heat flow cavity 10, and may be set to a shape that matches the heat flow cavity 10. For example, the heat flow cavity 10 is set to a plate-shaped rectangular parallelepiped that matches the mobile terminal 200, and the receiving cavity 61 of the housing 60 may be roughly set to a plate-shaped rectangular parallelepiped.

[0197] In addition, the shell 60 and the heat flow cavity 10 can also be an integrated structure, and the overall structure is simple.

[0198] When manufacturing the housing 60, the housing 60 may be a plastic part, a glass part, a metal part and / or a silicone part, etc. These housings 60 can absorb the heat of the heat flow cavity 10 or the heat pool 30 well, and exchange heat with the external environment to achieve heat dissipation. Among them, the plastic part can be made of materials such as polycarbonate and polyurethane, which has a certain flexibility and can be bent.

[0199] The housing 60 can be made of a single material (such as a plastic part, a glass part, a metal part, and a silicone part), or made of multiple materials (at least two of the plastic part, the glass part, the metal part, and the silicone part). The housing 60 can be an integrated structure or an assembled structure. Exemplarily, the housing 60 includes a transparent plastic part and a non-transparent plastic part connected to each other. Alternatively, the housing 60 is a transparent silicone part.

[0200] In order to facilitate the assembly of the terminal heat dissipation device 100 on the mobile terminal 200, in some embodiments, refer to Figure 3 In (a) and (b), the housing 60 has a snap-fit ​​portion 63, and the snap-fit ​​portion 63 is used for snap-fitting with the mobile terminal 200.

[0201] When the terminal heat dissipation device 100 is assembled to the mobile terminal 200, the buckle portion 63 is buckled at the edge of the mobile terminal 200, so that the terminal heat dissipation device 100 can be easily and stably assembled on the back side 200b of the mobile terminal 200. Figure 5 , so that the first side wall 11 of the heat flow cavity 10 and the back surface 200b of the mobile terminal 200 are arranged relative to each other to achieve heat conduction.

[0202] For example, see Figure 3In (a) and (b), the buckle portion 63 can be set as a surrounding wall 63a, and the surrounding wall 63a is formed with an opening 631. The mobile terminal 200 can be placed inside the surrounding wall 63a through the opening 631. The surrounding wall 63a can be buckled on the four edges of the mobile terminal 200 similar to a conventional mobile phone protective case, which is easy to assemble and has a reliable connection.

[0203] For example, see Fig. 9 In (a) and (b), the buckle connection portion 63 is a pair of buckles 63b arranged at intervals. The pair of buckles 63b arranged at intervals can be buckled on two opposite edges of the mobile terminal 200, which is convenient for assembly and reliable for connection.

[0204] In order to make the terminal heat dissipation device 100 have a better appearance and heat conduction effect, refer to Figure 2 , Figure 5 In some embodiments, a partition plate 70 is provided on a side of the first side wall 11 facing away from the second side wall 12 , and the partition plate 70 is connected to the shell 60 .

[0205] The partition 70 is arranged on the housing 60, so that the heat flow cavity 10 and the heat pool 30 are arranged between the housing 60 and the partition 70, so that the terminal heat dissipation device 100 has a better appearance. When the terminal heat dissipation device 100 is assembled on the mobile terminal 200, the back side 200b of the mobile terminal 200 and the partition 70 are arranged against each other, and the heat generated by the back side 200b of the mobile terminal 200 can be conducted to the heat flow cavity 10 through the partition 70, and the heat generated by the back side 200b of the mobile terminal 200 can be conducted to the heat flow cavity 10 through the partition 70. Figure 4 In (a) and (b), the micro pump 20 drives the fluid 15 to flow in the heat flow cavity 10, so that the heat is transferred to each position of the heat flow cavity 10 to achieve uniform heating, the heat pool 30 conducts and stores the heat, and finally the heat is dissipated through the shell 60 and the external environment through heat exchange. The shape of the partition 70 is adapted to the shape of the heat flow cavity 10. For example, if the heat flow cavity 10 is set as a plate-shaped rectangular parallelepiped, the partition 70 is also set as a plate-shaped rectangular parallelepiped.

[0206] When manufacturing the partition 70, refer to Figure 2 The partition 70 is a Mylar piece, a plastic piece, a silicone piece or a glass piece. These materials are light in weight and can achieve good heat conduction, and are specifically set as needed.

[0207] When assembling the partition 70 and the housing 60, the partition 70 and the housing 60 are connected by hot melt connection, adhesive bonding or snap connection. These methods can better fix the partition 70 on the housing 60, and the connection is reliable, and the specific setting is as needed.

[0208] In other embodiments, the partition 70 is not configured, the back side 200 b of the mobile terminal 200 and the first side wall 11 of the heat flow cavity 10 are set against each other, and the heat generated by the back side 200 b of the mobile terminal 200 is conducted to the fluid 15 in the heat flow cavity 10 through the first side wall 11.

[0209] In some embodiments, see Fig.10 The heat flow cavity 10 has a flexible function, and the heat flow cavity 10 can be bent and deformed, and the user experience is better. When the terminal heat dissipation device 100 has a shell 60, the flexible heat flow cavity 10 is easily assembled in the shell 60.

[0210] The bending angle α of the heat-fluid cavity 10 with the center line 10a of the heat-fluid cavity 10 as the axis is greater than or equal to 5°. The heat-fluid cavity 10 is subjected to a bending test, and a pressure head 101 with a bending radius of 1.5 mm is used to press the center line 10a of the heat-fluid cavity 10. The bending angle α of the heat-fluid cavity 10 can be greater than or equal to 5°, indicating that the heat-fluid cavity 10 has good flexibility.

[0211] When manufacturing the heat flow cavity 10, refer to Figure 1 (a) and (b) in Figure 5 The heat flow cavity 10 can be made of plastic (e.g., polyethylene terephthalate), glass (e.g., polymethyl methacrylate) or metal (e.g., copper, aluminum, etc.). These materials can achieve better heat conduction. When making the heat flow cavity 10, the first side wall 11, the second side wall 12 and the support wall 13 can be made of the same or different materials.

[0212] When setting up the heat flow cavity 10, refer to Figure 5 The heat flow cavity 10 can be of equal thickness or unequal thickness, and can be set as needed. These heat flow cavities 10 can absorb the heat of the mobile terminal 200, and the heat is transferred to part of the fluid working medium 15 through the first side wall 11. Figure 4 In (a) and (b), the fluid medium 15 with heat is driven by the micro pump 20 to flow in the circulation channel 14 to transfer heat to various positions of the heat flow cavity 10.

[0213] For example, see Figure 2 , the heat flow cavity 10 has a uniform thickness, and the heat pool 30 can be arranged on the entire surface or a local area of ​​the second side wall 12 of the heat flow cavity 10.

[0214] For example, see Fig.11 The heat flow cavity 10 has different thicknesses. The second side wall 12 may be partially convex or partially concave, or the first side wall 11 may be partially concave, depending on the specific needs.

[0215] There are many optional implementations for setting the circulation channel 14. The circulation channel 14 is in a maze type, a racetrack type, or a parallel type, etc. Figure 4 (a) and (b) in Figure 5Under the action of the micro pump 20, the fluid medium 15 continuously flows in a directional manner in the circulation channel 14, so that the heat from the local back 200b of the mobile terminal 200 is transferred to the area with lower heat through the flowing fluid medium 15, thereby achieving a uniform heating effect.

[0216] See also Figure 4 In (a) and (b), when the circulation channel 14 is in a maze shape, the circulation channel 14 is similar to a plane maze, and the routes of the maze are interconnected, and can be a closed route or multiple interconnected routes, so that the fluid 15 can circulate in a direction in the maze-like circulation channel 14. The support wall 13 in the heat flow cavity 10 is arranged between the first side wall 11 and the second side wall 12, and the support wall 13 includes an outer peripheral wall 131, one or more longitudinal walls 132 and one or more transverse walls 133. The outer peripheral wall 131 can be rectangular, circular or other shapes. The longitudinal wall 132 and the transverse wall 133 can extend in a straight line or an arc. The longitudinal wall 132 and the transverse wall 133 are located inside the outer peripheral wall 131, and maze routes of different shapes are formed by the outer peripheral wall 131, the longitudinal wall 132 and the transverse wall 133.

[0217] For example, see Figure 4 In (a) and (b), the support wall 13 of the heat flow cavity 10 includes an outer peripheral wall 131, a first longitudinal wall 132a, a second longitudinal wall 132b, a third longitudinal wall 132c and a transverse wall 133. The first longitudinal wall 132a, the second longitudinal wall 132b and the third longitudinal wall 132c are arranged in sequence, and both ends of the first longitudinal wall 132a are spaced from the outer peripheral wall 131. The middle of the first longitudinal wall 132a and one end of the third longitudinal wall 132c are connected by the transverse wall 133, and the other end of the third longitudinal wall 132c is spaced from the outer peripheral wall 131; one end of the second longitudinal wall 132b is connected to the outer peripheral wall 131, and the other end is spaced from the transverse wall 133. A labyrinth-shaped circulation channel 14 is formed by the outer peripheral wall 131, a plurality of longitudinal walls 132 and one transverse wall 133.

[0218] The micro pump 20 can be arranged at any position of the circulation channel 14. Figure 4 As shown in (a) of FIG. 1 , the micro pump 20 is disposed at one end of the third longitudinal wall 132c. Figure 4 As shown in (b), the micro pump 20 can also be arranged at one end of the first longitudinal wall 132a. In addition, the micro pump 20 can also be arranged at one end of the second longitudinal wall 132b or at other positions. The arrow in the circulation channel 14 is the flow direction of the fluid medium 15.

[0219] It is understandable that the maze-type circulation channel 14 can also be set as other maze routes.

[0220] See also Fig.12When the circulation channel 14 is in a racetrack shape, the support wall 13 in the heat flow cavity 10 is arranged between the first side wall and the second side wall, and the support wall 13 includes an outer peripheral wall 131 and a longitudinal wall 132. The longitudinal wall 132 is arranged inside the outer peripheral wall 131, and the two ends of the longitudinal wall 132 are respectively spaced from the outer peripheral wall 131 to form a racetrack-shaped circulation channel 14. The micro pump 20 can be arranged at any position of the circulation channel 14, such as at one end of the longitudinal wall 132. The arrow in the circulation channel 14 is the flow direction of the fluid working medium 15.

[0221] See also Fig.13 In (a) and (b), when the circulation channel 14 is in parallel, the circulation channel 14 includes a plurality of branches 141, the first ends of the plurality of branches 141 are connected, and the second ends of the plurality of branches 141 are connected, forming a parallel circulation channel 14. Each branch 141 can extend along a single straight line segment, a plurality of straight line segments, a single arc line, etc., and the shapes of the branches 141 can be the same or different. The support wall 13 in the heat flow cavity 10 is arranged between the first side wall 11 and the second side wall 12, and the support wall 13 includes an outer peripheral wall 131 and a plurality of longitudinal walls 132 arranged at intervals, and the two ends of each longitudinal wall 132 are respectively arranged at intervals from the outer peripheral wall 131, thereby forming a parallel circulation channel 14.

[0222] See also Fig.13 In (b), the micro pump 20 can be arranged at any position of the circulation channel 14, for example, on one of the branches 141. Fig.13 In (a), multiple micro pumps 20 can be configured to drive the fluid medium 15 to flow. The arrow in the circulation channel 14 is the flow direction of the fluid medium 15.

[0223] For example, see Fig.13 In (a), the circulation channel 14 includes three branches 141, the first ends of the three branches 141 are connected, the second ends of the three branches 141 are connected, and micro pumps 20 are respectively arranged on two of the branches 141 to drive the fluid 15 to flow.

[0224] When setting the fluid medium, refer to Figure 5 The fluid medium 15 can be water, fluorinated liquid, saline solution, organic aqueous solution (such as ethylene glycol aqueous solution, alcohol aqueous solution), air, etc. Driven by the micro pump 20, the fluid medium 15 continuously flows in the circulation channel 14, and the heat generated by the mobile terminal 200 is transferred to the fluid medium 15 at the corresponding position through the first side wall 11. The heat carried by the fluid medium 15 can be transferred to each position of the heat flow cavity 10 to achieve uniform heating.

[0225] In some embodiments, the fluid working medium 15 is an aqueous solution with an antifreeze additive, and the antifreeze additive may be salt, ethylene glycol, alcohol, etc. Compared with an aqueous solution without an antifreeze additive, an aqueous solution with an antifreeze additive has a lower freezing point, and in low temperatures (sub-zero temperatures) in winter, the fluid working medium 15 is not easy to solidify and freeze, thereby reducing the situation where the fluid working medium 15 in the heat flow cavity 10 solidifies and expands, causing the heat flow cavity 10 to be damaged, thereby improving the reliability of the terminal heat dissipation device 100 in a low temperature environment, and enabling the terminal heat dissipation device 100 to still be used in low temperatures in winter.

[0226] In some embodiments, see Fig.10 The heat pool 30 has a flexible function, and the heat pool 30 can be bent and deformed, and the user experience is better. When the terminal heat dissipation device 100 has a shell 60, the flexible heat pool 30 is easy to be assembled in the shell 60.

[0227] The bending angle α of the heat pool 30 with the center line 30a of the heat pool 30 as the axis is greater than or equal to 5°. The heat pool 30 is subjected to a bending test, and a pressing head 101 with a bending radius of 1.5 mm is used to press the center line 30a of the heat pool 30. The bending angle α of the heat pool 30 can be greater than or equal to 5°, indicating that the heat pool 30 has good flexibility.

[0228] In some embodiments, see Figure 2 , Fig.14 The heat pool 30 is a phase change heat storage element, and the phase change peak temperature range of the phase change heat storage element is 30°C to 50°C. The phase change heat storage element refers to a structure made of phase change heat storage material. When the phase change peak temperature is reached, the phase change heat storage material undergoes a physical phase change, absorbs or releases latent heat, and maintains the temperature unchanged. Some phase change heat storage materials can undergo solid-solid phase change, and no liquid is produced during the phase change process. They have a large heat storage capacity, and the volume does not change basically before and after the phase change, which is convenient for application in terminal heat dissipation devices.

[0229] A phase change heat storage component is used as the heat pool 30. The heat pool 30 can absorb and store heat. When the phase change temperature is reached, the heat pool 30 can absorb a large amount of latent heat while maintaining the temperature unchanged, and the user experience is better. When the shell 60 is not set, the heat pool 30 directly exchanges heat with the external environment to achieve heat dissipation. When the shell 60 is set, the heat pool 30 is against the inner wall of the shell 60, and the heat of the heat pool 30 is transferred to the shell 60, and indirectly exchanges heat with the external environment through the shell 60 to achieve heat dissipation. The phase change heat storage material suitable for the terminal heat dissipation device 100 of the present application can be an organic phase change material (such as paraffin), a hydrogel material (such as a hydrated salt), a liquid metal material, an organic metal framework material, etc.

[0230] Exemplarily, the heat pool 30 is a phase-change heat storage element, and the phase change peak temperature of the phase-change heat storage element is 35° C., 38° C., 40° C., 42° C., 45° C., etc., which can be set as needed.

[0231] In some embodiments, the heat pool 30 is a plastic part, a metal part or a glass part. The heat pool 30 made of these materials can achieve heat conduction or heat exchange with the external environment to achieve heat dissipation. The specific material is set as needed.

[0232] In some embodiments, see Figure 3 In (a), the heat pool 30 is at least partially disposed on the second side wall 12 of the heat flow cavity 10. When the terminal heat dissipation device 100 is mounted on the mobile terminal 200, the first side wall 11 is disposed facing the back side 200b of the mobile terminal 200 and is used to absorb the heat of the mobile terminal 200, and the heat pool 30 on the second side wall 12 absorbs the heat of the second side wall 12 and conducts the heat outward, thereby achieving heat dissipation of the mobile terminal 200. Figure 3 As shown in (a) of FIG. 1 , the heat pool 30 is arranged on the entire surface of the second side wall 12. Alternatively, as shown in FIG. Fig.15 As shown, the heat pool 30 is arranged in a part of the second side wall 12. In this embodiment, the housing 60 may be provided or not provided.

[0233] exist Fig.15 In the embodiment, a shell 60 is provided, the inner wall of the shell 60 is provided with one or more protrusions 64 , the heat pool 30 is arranged between adjacent protrusions 64 , and the second side wall 12 is provided with a plurality of heat pools 30 .

[0234] In some embodiments, see Fig.16 In (a) and (b), the heat pool 30 is at least partially disposed on the first side wall 11 of the heat flow cavity 10. When the terminal heat dissipation device 100 is assembled on the mobile terminal 200, the heat pool 30 on the first side wall 11 is disposed facing the back side 200b of the mobile terminal 200 and is used to absorb the heat of the mobile terminal 200, and the heat flow cavity 10 is used to absorb the heat of the heat pool 30 and conduct the heat outward to achieve heat dissipation of the mobile terminal 200. The heat pool 30 can be arranged on the entire surface or a part of the first side wall 11. In this embodiment, the housing 60 can be configured or not configured.

[0235] In some embodiments, see Fig.17 In (a) and (b), a portion of the heat pool 30b is disposed on the first side wall 11 of the heat flow cavity 10, and another portion of the heat pool 30c is disposed on the second side wall 12 of the heat flow cavity 10. When the terminal heat dissipation device 100 is assembled on the mobile terminal 200, the heat of the mobile terminal 200 is absorbed by the portion of the heat pool 30b on the first side wall 11 (and the first side wall 11), the heat flow cavity 10 absorbs the heat of the portion of the heat pool 30b on the first side wall 11 and conducts the heat outward, and the heat flow cavity 10 also conducts the heat to the portion of the heat pool 30c on the second side wall 12, and the heat is conducted outward by the heat pool 30c, thereby achieving heat dissipation of the mobile terminal 200. In this embodiment, the housing 60 may be configured or not configured.

[0236] In some embodiments, see Fig.18 In (a) and (b), the heat pool 30 is configured as a shell 60, and the heat flow cavity 10 is located in the shell 60. That is, the heat pool 30 is configured as a shell, and the heat flow cavity 10 is disposed in the shell-shaped heat pool 30, so that the overall structure is simple, and the terminal heat dissipation device 100 can effectively dissipate heat for the mobile terminal 200 when assembled in the mobile terminal 200. The shell 60 and the heat flow cavity 10 can be an assembled structure, the shell 60 has a receiving cavity 61, and the heat flow cavity 10 is disposed in the receiving cavity 61. In addition, the shell 60 and the heat flow cavity 10 can also be an integrated structure, and the overall structure is simple.

[0237] In order to facilitate the assembly of the terminal heat dissipation device 100 on the mobile terminal 200, in some embodiments, refer to Fig.18 In (a) and (b), the housing 60 has a buckle portion 63, which is used to buckle with the mobile terminal 200. The buckle portion 63 is buckled at the edge of the mobile terminal 200, so that the terminal heat dissipation device 100 can be conveniently and stably assembled on the back 200b of the mobile terminal 200.

[0238] Exemplarily, the buckle portion 63 can be configured as a surrounding wall having an opening 631, and the mobile terminal 200 can be placed inside the surrounding wall through the opening 631. The surrounding wall can be buckled on the four edges of the mobile terminal 200 similar to a conventional mobile phone protective case, which is easy to assemble and has a reliable connection.

[0239] Exemplarily, the buckle parts 63 are buckles arranged in pairs at intervals, and the buckles arranged in pairs at intervals can be buckled on two opposite edges of the mobile terminal 200, which is convenient for assembly and reliable for connection.

[0240] In some embodiments, see Fig.18 In (a) and (b), a partition 70 is provided on the side of the first side wall 11 away from the second side wall 12, and the partition 70 is connected to the shell 60. The heat flow cavity 10 is arranged between the shell 60 and the partition 70, and the terminal heat dissipation device 100 has a better appearance. The back side 200b of the mobile terminal 200 and the partition 70 are arranged opposite to each other, and the heat generated by the back side 200b of the mobile terminal 200 can be transferred to the heat flow cavity 10 through the partition 70. The micro pump 20 drives the fluid 15 to flow in the heat flow cavity 10, so that the heat is transferred to each position of the heat flow cavity 10 to achieve uniform heating. The heat pool 30 conducts heat and exchanges heat with the external environment to achieve heat dissipation. The shape of the partition 70 is compatible with the shape of the heat flow cavity 10. For example, if the heat flow cavity 10 is set as a plate-like rectangular parallelepiped, the partition 70 is also set as a plate-like rectangular parallelepiped.

[0241] When the partition 70 is manufactured, the partition 70 is made of Mylar, plastic, silicone or glass. These materials are light in weight and can achieve good heat conduction, and are specifically set as needed.

[0242] When assembling the partition 70 and the housing 60, the partition 70 and the housing 60 are connected by hot melt connection, adhesive bonding or snap connection. These methods can better fix the partition 70 on the housing 60, and the connection is reliable, and the specific setting is as needed.

[0243] In some embodiments, see Figure 5 The first side wall 11 and / or the second side wall 12 is a phase change heat storage component. The phase change heat storage component refers to a structure made of phase change heat storage material.

[0244] When manufacturing the heat flow cavity 10, the first side wall 11 may be set as a phase change heat storage component, the second side wall 12 may be set as a phase change heat storage component, or both the first side wall 11 and the second side wall 12 may be set as phase change heat storage components. The heat on the first side wall 11 made of phase change heat storage material can be transferred to the fluid working medium 15, and the heat of the fluid working medium 15 can be transferred to the second side wall 12 made of phase change heat storage material. The phase change heat storage component has a large heat storage capacity and can absorb a large amount of latent heat while maintaining the temperature unchanged when the phase change temperature is reached, thereby improving the user experience of the terminal heat dissipation device 100.

[0245] Exemplarily, the first side wall 11 and / or the second side wall 12 may be made of phase-change thermal storage plastic.

[0246] In some embodiments, see Figure 5 At least part of the outer surface of the heat flow cavity 10 is provided with a phase change heat storage layer.

[0247] The phase change heat storage layer is a layered structure on the outer surface of the heat flow cavity, and can be disposed on the outer surface of the heat flow cavity by coating or the like. The phase change heat storage layer has a large heat storage capacity, and can absorb a large amount of latent heat while maintaining a constant temperature when the phase change temperature is reached, thereby improving the user experience of the terminal heat dissipation device 100.

[0248] In some embodiments, see Figure 4 In (a) and (b), the fluid medium 15 is colored, or the fluid medium 15 includes a colored medium; when the terminal heat dissipation device 100 includes a shell 60, the shell 60 is transparent as a whole or partially transparent, and the heat flow cavity 10 is transparent as a whole or partially transparent, so that the fluid medium 15 can be presented through the shell 60 and the heat flow cavity 10. The shell 60 and the heat flow cavity 10 have a predetermined transparency, which can be fully transparent or semi-transparent.

[0249] This solution enables the user to see the flow effect of at least part of the fluid medium 15 inside the heat flow cavity 10 through the housing 60 and the heat flow cavity 10, which can be used to confirm that the micro pump 20 is working properly to drive the fluid medium 15 to flow, thereby improving the user experience. The fluid medium 15 can be configured in various colors. The colored medium can be colored particles (such as spherical particles with a diameter of less than or equal to 20 μm), colored ink, etc.

[0250] In this embodiment, it can be used in the case where the terminal heat dissipation device 100 includes a heat flow cavity 10, a heat pool 30 and a shell 60, and the heat flow cavity 10 is located in the shell 60. It can also be used in the case where the terminal heat dissipation device 100 includes a heat flow cavity 10 and a heat pool 30, and the heat pool 30 is set as the shell 60. A transparent heat pool 30 can be set between the shell 60 and the second side wall 12 of the heat flow cavity 10; or, the heat pool 30 is not set between the shell 60 and the second side wall 12; or, the heat pool 30 is only set at a part of the position between the shell 60 and the second side wall 12, and the flow effect of part of the fluid working medium 15 in the heat flow cavity 10 can be seen through the shell 60 and the heat flow cavity 10 at the position where the heat pool 30 is not set.

[0251] For example, see Figure 3 In (a), the shell 60 and the heat flow cavity 10 are transparent as a whole, and a transparent heat pool 30 is arranged between the shell 60 and the second side wall 12 of the heat flow cavity 10. The user can see the flow effect of the entire fluid working medium 15 in the heat flow cavity 10.

[0252] For example, see Fig.11 The corresponding positions of the shell 60 and the second side wall 12 of the heat flow cavity 10 are set to be transparent, and the other positions are opaque. The heat pool 30 is only partially set between the shell 60 and the second side wall 12. The user can see the flow effect of the fluid 15 at the partially transparent positions of the shell 60 and the heat flow cavity 10.

[0253] In some embodiments, see Figure 5 , the elongation at break of the first side wall 11 is greater than or equal to 10%; and / or, the elongation at break of the second side wall 12 is greater than or equal to 10%. By setting the elongation at break of the first side wall 11 and the second side wall 12 in the heat flow cavity 10 to be relatively high (i.e., greater than or equal to 10%), the filling rate of the fluid medium 15 in the circulation channel 14 can reach more than 95%, and more fluid medium 15 can be driven to flow by the micro pump 20, thereby improving the thermal conductivity of the heat flow cavity 10.

[0254] The first side wall 11 and the second side wall 12 can be made of metal material, polymer material, or polymer composite material to achieve a higher elongation at break, so that the filling rate of the fluid medium 15 in the circulation channel 14 reaches 95% to 100%.

[0255] During operation, the first side wall 11 and the second side wall 12 will deform accordingly according to the physical state of the fluid medium 15. When the terminal heat dissipation device 100 is installed on the back of the mobile terminal 200 and the mobile terminal 200 releases heat, the heat is directly or indirectly transferred to the first side wall 11, and then the heat is transferred from the first side wall 11 to the fluid medium 15, and then the fluid medium 15 is first transferred to the second side wall 12. In this process, the first side wall 11 (the second side wall 12) will stretch, which is conducive to keeping the fluid medium 15 that expands due to the temperature in the circulation channel 14, avoiding the expanded fluid medium 15 from damaging the heat flow cavity 10, and improving the reliability of the device. After the heat flow cavity 10 and the fluid medium 15 dissipate heat, the first side wall 11 (the second side wall 12) will shrink and return to its initial state.

[0256] In some embodiments, the heat pool 30 is a phase-change thermal storage element, which includes a skeleton, phase-change thermal storage microcapsules and thermal conductive fillers, and the phase-change thermal storage microcapsules and thermal conductive fillers are filled in the skeleton.

[0257] The skeleton has a porous structure and serves as a filling carrier for phase change thermal storage microcapsules and thermal conductive fillers. The skeleton also plays a role in strengthening the structural strength. Phase change thermal storage microcapsules and thermal conductive fillers are mixed and filled in the skeleton to achieve heat absorption and heat storage. After heat absorption, the phase change temperature is maintained and the temperature basically does not rise. The phase change thermal storage component is easy to manufacture and has a stable structure.

[0258] In some embodiments, the heat pool 30 is a phase-change heat storage element, which is located in the housing 60, and the thermal conductivity of the phase-change heat storage element is greater than or equal to the thermal conductivity of the housing 60. This solution is conducive to improving the thermal conductivity of the heat pool 30, so that the heat of the mobile terminal 200 or the heat flow cavity 10 is transferred to the heat pool 30 more quickly, and the heat is quickly diffused in the heat pool 30, thereby improving the heat dissipation effect on the mobile terminal 200 or the heat flow cavity 10.

[0259] For example, the phase-change thermal storage element is roughly film-shaped, and the thermal conductivity of the phase-change thermal storage element in its plane direction can be greater than or equal to the thermal conductivity of the shell 60, which can effectively improve the thermal conductivity of the heat pool 30 and achieve a better heat dissipation effect. The plane direction and thickness direction of the phase-change thermal storage element are perpendicular to each other.

[0260] In some embodiments, the heat pool 30 is a phase-change thermal storage element, and the thermal conductive filler in the phase-change thermal storage element includes at least one of aluminum oxide, aluminum nitride, magnesium oxide, zinc oxide, and boron nitride. Using the above materials as the thermal conductive filler in the phase-change thermal storage element can effectively improve the thermal conductivity of the phase-change thermal storage element, thereby improving the thermal conductivity of the heat pool 30.

[0261] Among them, when the thermal conductive filler is boron nitride, boron nitride has the characteristics of electromagnetic wave permeability, high thermal conductivity, high flexibility, high insulation, low dielectric constant, and low dielectric loss. Boron nitride can be laid over a large area as a thermal conductive filler. When the terminal heat dissipation device 100 is installed on the mobile terminal 200, it has little effect on the short-range wireless communication performance of the mobile terminal 200.

[0262] In some embodiments, the skeleton can be made of polymer foam, such as at least one of polyurethane, silicone, and polyacrylic acid. These materials are easy to form a stable skeleton and form a porous structure, such as a honeycomb structure.

[0263] When the skeleton is made of polyurethane (polyurethane), it can be a polymerization of a rigid isocyanate structure with an aromatic ring and a soft segment containing a hydroxyl structure. The rigid isocyanate structure with an aromatic ring can be diphenylmethane diisocyanate, toluene diisocyanate, etc., and the soft segment can be polyester polyol, polyether polyol, etc.

[0264] In some embodiments, the phase change heat storage microcapsules are normal alkane microcapsules. Normal alkane paraffin is a hydrocarbon phase change material with a molecular formula of CnH2n+2, stable performance and high energy storage density. Normal alkane paraffin has different phase change temperatures (melting points), and commonly used ones are C14, C15, C16, C17, C18, C20, C21, C22, C24, etc. The more carbon atoms in the normal alkane, the higher the phase change temperature. The normal alkane can be a long-chain segment normal alkane or a short-chain segment normal alkane.

[0265] In some embodiments, the mass proportion of the phase-change heat storage microcapsules in the phase-change heat storage element is 70% to 80%, and the mass proportion of the thermal conductive filler in the phase-change heat storage element is 20% to 30%.

[0266] The heat storage enthalpy value of the phase change heat storage element in the terminal heat dissipation device 100 is set to be greater than or equal to 140 joules / gram (J / g), so that the heat pool 30 has a predetermined heat storage capacity. The heat storage enthalpy value refers to how many joules (J) of heat is absorbed by 1 gram (g) of material, and the material temperature is basically maintained at the same level. The heat storage enthalpy value is used to evaluate the heat storage performance of the material.

[0267] Phase-change heat storage microcapsules can use normal alkane paraffin with a carbon number greater than or equal to 20, and the heat storage enthalpy is 180 J / g to 200 J / g or higher. The mass proportion of the phase-change heat storage microcapsules is 70% to 80%, and the actual heat storage enthalpy of the phase-change heat storage component is greater than or equal to 140 J / g, which meets the set value of the heat storage enthalpy of the phase-change heat storage component. The remaining mass of the phase-change heat storage component accounts for 20% to 30% of the space used to fill the thermal conductive filler. The phase-change heat storage component can realize a uniformly distributed heat-conducting network structure, and the heat pool 30 has a predetermined heat storage capacity.

[0268] See also Figure 1(a) and (b) in Figure 3 (a) and (b) in Figure 4 (a) and (b) in Figure 5 An embodiment of the present application provides a mobile terminal 200, which adopts the terminal heat dissipation device 100 mentioned above. The mobile terminal 200 and the first side wall 11 of the heat flow cavity 10 are arranged relative to each other so that the first side wall 11 absorbs the heat of the mobile terminal 200.

[0269] The mobile terminal 200 may be a mobile phone, a tablet computer, a laptop computer, an ultra-mobile personal computer, an e-book reader, a netbook, a personal digital assistant, etc.

[0270] The mobile terminal 200 provided in the embodiment of the present application adopts the above-mentioned terminal heat dissipation device 100. The heat generated by the mobile terminal 200 is directly or indirectly conducted to the fluid medium 15 at the corresponding position through the first side wall 11. The fluid medium 15 driven by the micropump 20 brings the local heat to other positions of the heat flow cavity 10 to achieve uniform heating. The heat of the heat flow cavity 10 is conducted outward through the second side wall 12, or the heat of the heat flow cavity 10 is conducted to the heat pool 30. The heat pool 30 can absorb the heat of the heat flow cavity 10 and conduct the heat outward, so as to achieve external heat dissipation of the mobile terminal 200. The control component 40 can provide the electric energy of the mobile terminal 200 to the micropump 20, or the control component 40 directly supplies power to the micropump 20. The terminal heat dissipation device 100 is easy to use, can be used outdoors, and has improved portability. The terminal heat dissipation device 100 of the present application only needs to supply power to the micropump 20, and has low power consumption.

[0271] In order to verify that the mobile terminal 200 using the terminal heat dissipation device 100 of the present application has heat dissipation advantages, infrared temperature measurement is performed on mobile terminals that do not use the terminal heat dissipation device of the present application and mobile terminals that use the terminal heat dissipation device of the present application under the same high power consumption usage scenario.

[0272] See also Fig.19 In (b), for the mobile terminal 200' that does not adopt the terminal heat dissipation device of the present application, the dark area in the upper right corner of the back of the mobile terminal 200' is a high temperature area, which has a processor inside. The area of ​​the high temperature area is large, and the hot spot temperature at the P2 position reaches 41.2°C. The temperature at the upper right corner of the back of the mobile terminal 200' is obviously higher than the temperature at other positions, the temperature distribution is uneven, and the heat dissipation effect is poor.

[0273] See also Fig.19In (a), for the mobile terminal 200 using the terminal heat dissipation device 100 of the present application, a processor is also provided inside the upper right corner of the back of the mobile terminal 200. Under the same high-power usage scenario, the area of ​​the height zone (dark zone) is very small, the temperature at the P1 position is 36.6°C, and the temperature distribution of the entire back of the mobile terminal 200 is relatively uniform. Compared with the case without the terminal heat dissipation device 100, the temperature distribution of the mobile terminal 200 using the terminal heat dissipation device 100 of the present application is well improved, effectively reducing the temperature rise rate and hot spot temperature rise of the mobile terminal 200.

[0274] Finally, it should be noted that the above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A terminal heat dissipation device, characterized in that: include: Thermal fluid chamber, micro pump, thermal pool and control components; The heat flow cavity comprises a first side wall, a second side wall and a supporting wall, the first side wall and the second side wall are arranged relatively spaced apart, the supporting wall is arranged between the first side wall and the second side wall, the first side wall, the second side wall and the supporting wall form a circulation channel, and the circulation channel is filled with a fluid medium; the first side wall is arranged facing the mobile terminal; The micro pump has an input end and an output end, both of which are in communication with the circulation channel, and the micro pump is used to drive the fluid medium to flow in the circulation channel; The heat pool is a phase-change heat storage component, and the phase change peak temperature range of the phase-change heat storage component is 30°C to 50°C; the heat pool is arranged on the heat flow cavity, so that heat conduction is formed between the heat flow cavity and the heat pool; the control component and the heat flow cavity are relatively fixed, and the control component is at least used to transmit the electric energy of the mobile terminal to the micro pump and / or power the micro pump; The control component further includes a communication unit, the communication unit and the heat flow cavity are relatively fixed, and the communication unit is used to cooperate with the mobile terminal to control the operation of the micro pump; When the terminal heat dissipation device is assembled to the mobile terminal, the mobile terminal cooperates with the communication unit, and the mobile terminal has a function of detecting its own temperature. When the detected temperature of the mobile terminal reaches a predetermined value, the reverse charging function of the mobile terminal is activated, so that the electric energy of the mobile terminal is transmitted to the micro pump, so that the micro pump starts to work; The heat generated by the mobile terminal is directly or indirectly conducted to the fluid medium at the corresponding position through the first side wall, and the flowing fluid medium brings the local heat to other positions of the heat flow cavity to achieve uniform heating. The heat of the heat flow cavity is conducted outward through the second side wall, or the heat of the heat flow cavity is conducted to the heat pool, and the heat pool can absorb the heat of the heat flow cavity and conduct the heat outward; When the terminal heat sink and the mobile terminal are separated, the mobile terminal and the communication unit lose coordination, causing the micro pump to stop.

2. The terminal heat dissipation device according to claim 1, characterized in that: The control component includes a first wireless coil, the micro pump is electrically connected to the first wireless coil, and the first wireless coil and the second wireless coil of the mobile terminal are correspondingly arranged to enable the mobile terminal to be reversely charged; Or, the control component includes a charging cable, the micro pump is electrically connected to the charging cable, and a first plug of the charging cable and an electrical interface of the mobile terminal can be plugged and matched to enable reverse charging of the mobile terminal; Alternatively, the control component includes a battery, the battery is electrically connected to the micro pump, and the battery and the micro pump are relatively fixed.

3. The terminal heat dissipation device according to claim 1, characterized in that: The terminal heat dissipation device also includes a shell, and the heat flow cavity is located in the shell.

4. The terminal heat dissipation device according to claim 3, characterized in that: The shell is a plastic part, a glass part, a metal part and / or a silicone part.

5. The terminal heat dissipation device according to claim 1, characterized in that: The heat pool is configured as a shell, and the heat flow cavity is located in the shell.

6. The terminal heat dissipation device according to claim 3, characterized in that: The housing has a buckling portion, and the buckling portion is used for buckling and matching with the mobile terminal.

7. The terminal heat dissipation device according to claim 3, characterized in that: A partition is provided on a side of the first side wall facing away from the second side wall, and the partition is connected to the shell.

8. The terminal heat dissipation device according to claim 7, characterized in that: The partition is a Mylar piece, a plastic piece, a silicone piece or a glass piece; And / or, the partition and the shell are connected by hot melt, colloid bonding or snap connection.

9. The terminal heat dissipation device according to any one of claims 1 to 8, characterized in that: The heat flow cavity has a flexible function, and with the center line of the heat flow cavity as the axis, the bending angle of the heat flow cavity is greater than or equal to 5°; And / or, the heat flow cavity is a plastic part, a glass part or a metal part; And / or, the heat flow cavity has equal thickness or unequal thickness; And / or, the circulation channel is in a maze type, a racetrack type or a parallel type; And / or, the fluid working medium is water, fluorinated liquid, saline solution, organic aqueous solution or air.

10. The terminal heat dissipation device according to any one of claims 1 to 8, characterized in that: The heat pool has a flexible function, and with the center line of the heat pool as the axis, the bending angle of the heat pool is greater than or equal to 5°; Alternatively, the heat pool is a plastic part, a metal part or a glass part.

11. The terminal heat dissipation device according to any one of claims 1 to 8, characterized in that: The control component further comprises a switch component, the micro pump is electrically connected to the switch component, the switch component and the heat flow cavity are relatively fixed, and the switch component is used to control the operation of the micro pump.

12. The terminal heat dissipation device according to any one of claims 1 to 8, characterized in that: The control assembly further comprises a driving part, the micro pump is electrically connected to the driving part, the driving part and the heat flow cavity are relatively fixed, and the driving part is used to drive the micro pump to work; Alternatively, the micro pump is configured to be driven by a mobile terminal.

13. The terminal heat dissipation device according to any one of claims 1 to 8, characterized in that: The first side wall and / or the second side wall is a phase change heat storage element; Alternatively, at least a portion of the outer surface of the heat flow cavity is provided with a phase change heat storage layer.

14. The terminal heat dissipation device according to any one of claims 1 to 8, characterized in that: The fluid working medium is colored, or the fluid working medium includes a colored medium; When the terminal heat dissipation device includes a shell, the shell is transparent as a whole or partially transparent, and the heat flow cavity is transparent as a whole or partially transparent, so that the fluid working medium can be presented through the shell and the heat flow cavity.

15. The terminal heat dissipation device according to any one of claims 1 to 8, characterized in that: The elongation at break of the first side wall is greater than or equal to 10%; and / or the elongation at break of the second side wall is greater than or equal to 10%.

16. The terminal heat dissipation device according to any one of claims 1 to 8, characterized in that: The phase-change heat storage component comprises a skeleton, phase-change heat storage microcapsules and a heat-conducting filler, and the phase-change heat storage microcapsules and the heat-conducting filler are filled in the skeleton.

17. The terminal heat dissipation device according to claim 16, characterized in that: The phase-change heat storage component is located in the shell, and the thermal conductivity of the phase-change heat storage component is greater than or equal to the thermal conductivity of the shell; And / or, the thermally conductive filler includes at least one of aluminum oxide, aluminum nitride, magnesium oxide, zinc oxide, and boron nitride; And / or, the skeleton is made of at least one of polyurethane, silicone, and polyacrylic acid; And / or, the phase-change heat storage microcapsules are normal alkane microcapsules; And / or, the mass proportion of the phase-change heat-storage microcapsules in the phase-change heat-storage element is 70% to 80%, and the mass proportion of the thermal conductive filler in the phase-change heat-storage element is 20% to 30%.

18. A mobile terminal, characterized in that: The mobile terminal adopts the terminal heat dissipation device according to any one of claims 1 to 17, and the mobile terminal and the first side wall are arranged opposite to each other so that the first side wall absorbs the heat of the mobile terminal.

Citation Information

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