Sound production device, screen sound production display device and preparation method thereof

Abstract

A sound generating panel (10), a screen sound generating display device (40) and a manufacturing method thereof. The sound generating panel (10) comprises a plurality of sound generating unit groups (100), each of which comprises a plurality of sound generating units (101). Each sound generating unit (101) comprises a support layer (131) with an opening (132) and two piezoelectric structures (1021, 1022) resonating through the cavity, which improves the sound pressure of the sound generating panel (10). Each sound generating unit group (100) comprises sound generating units (1014) with different radii, which can realize multi-audio sound generation and improve the sound effect of the sound generating panel (10). Some sound generating unit groups (100) have ultrasonic detection units (1014) for detecting the distance between the audience and the sound generating panel (10) to achieve the effect of automatically regulating the volume. A screen sound generating display device (40) with the sound generating panel (10) located on the display side of the display panel (20) can make the sound waves directly enter the ear. An automatic volume control and sound effect realistic sound generating panel (10) is integrated on the display panel (20), which improves the integration level of the screen.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a sound emitting panel, a screen sound emitting display device and a manufacturing method thereof, and more particularly, to a screen sound emitting display device having a sound emitting panel with a two-layer piezoelectric structure. BACKGROUND

[0002] As an important component of display products, loudspeakers are directly related to the experience effect of users. The display screen and loudspeaker of traditional display products are independent of each other, and the loudspeaker is assembled with the display product through a module process. In mobile phone products, the loudspeaker is generally located at a specific position above the display screen, which is contrary to the development trend of high screen ratio of mobile phone products, and also increases the thickness of the mobile phone. In TV products, the loudspeaker is placed below the screen, and the sound experience effect is not good.

[0003] The above information disclosed in the background section is only for the purpose of understanding the background of the present disclosure concept, and therefore, it can contain information that does not constitute prior art. SUMMARY

[0004] The screen sound emitting display device constructed according to the exemplary implementation of the present disclosure can not only realize sound emission of full frequency, improve sound pressure of sound emission, but also collect position information of users using ultrasonic waves, regulate the size of volume, improve user experience, and create immersive sound quality effect, without affecting the screen ratio of the display device.

[0005] At least one embodiment of the present disclosure provides a sound emitting panel, which includes at least one sound emitting unit group. Each sound emitting unit group includes at least one sound emitting unit. Each sound emitting unit includes a support layer, a first piezoelectric structure and a second piezoelectric structure: the support layer includes a plurality of openings penetrating the support layer, and the first piezoelectric structure and the second piezoelectric structure are respectively located on both sides of the support layer and cover the openings on the support layer. The first piezoelectric structure includes a first electrode on the support layer, a first piezoelectric material layer on the side of the first electrode away from the support layer, and a second electrode on the side of the first piezoelectric material layer away from the first electrode. The second piezoelectric structure includes a third electrode on the support layer away from the first piezoelectric structure, a second piezoelectric material layer on the side of the third electrode away from the support layer, and a fourth electrode on the side of the second piezoelectric material layer away from the third electrode. Each sound emitting unit in the sound emitting panel includes two piezoelectric structures, which improves sound pressure and enhances user experience.

[0006] For example, in the sound emitting panel provided by an embodiment of the present disclosure, a packaging layer is further included, which includes a first packaging layer on the side of the second electrode away from the first piezoelectric material layer and a second packaging layer on the side of the fourth electrode away from the second piezoelectric material layer.

[0007] For example, in a sound-generating panel provided in one embodiment of this disclosure, the projection of the first piezoelectric structure onto the plane where the support layer is located overlaps with the opening, and / or, the projection of the second piezoelectric structure onto the plane where the support layer is located overlaps with the opening.

[0008] For example, in a sound-emitting panel provided in one embodiment of this disclosure, a first insulating layer is provided between the second electrode and the first piezoelectric material layer, and a second insulating layer is provided between the fourth electrode and the second piezoelectric material layer.

[0009] For example, in a sound-emitting panel provided in one embodiment of this disclosure, the sound-emitting unit is used to emit sound waves with a frequency range of 20-20000Hz.

[0010] For example, in a sound-emitting panel provided in one embodiment of this disclosure, each of the sound-emitting unit groups includes at least one first sound-emitting unit for emitting a first frequency sound wave and at least one second sound-emitting unit for emitting a second frequency sound wave.

[0011] For example, in a sound-emitting panel provided in an embodiment of this disclosure, each of the sound-emitting unit groups further includes at least one third sound-emitting unit for emitting a third frequency sound wave, wherein the first frequency sound wave takes a value in the range of 20-500Hz, the second frequency sound wave takes a value in the range of 500-2000Hz, and the third frequency sound wave takes a value in the range of 2000Hz-20000 Hz.

[0012] For example, in a sound-emitting panel provided in an embodiment of this disclosure, sound-emitting units that emit sound waves of the same frequency in each sound-emitting unit group are arranged along a first direction, and sound-emitting units that emit sound waves of different frequencies are arranged along a second direction; the first direction and the second direction intersect.

[0013] For example, in a sound-emitting panel provided in one embodiment of this disclosure, the orthographic projection of the first sound-emitting unit on the encapsulation layer is greater than the orthographic projection of the second sound-emitting unit on the encapsulation layer, and the orthographic projection of the second sound-emitting unit on the encapsulation layer is greater than the orthographic projection of the third sound-emitting unit on the encapsulation layer.

[0014] For example, in a sound-emitting panel provided in an embodiment of this disclosure, at least one of the sound-emitting unit groups includes at least one ultrasonic detection unit for emitting a frequency exceeding 20,000 Hz. The ultrasonic detection unit includes a receiving electrode disposed in the same layer as the second electrode, a transmitting electrode disposed in the same layer as the fourth electrode, a third piezoelectric material layer disposed in the same layer and with the same material as the first piezoelectric material layer, a fourth piezoelectric material layer disposed in the same layer and with the same material as the second piezoelectric material, and an ultrasonic support layer disposed in the same layer as the support layer.

[0015] For example, in a sound-emitting panel provided in one embodiment of this disclosure, a third insulating layer is provided between the third piezoelectric material layer and the receiving electrode, and a fourth insulating layer is provided between the fourth piezoelectric material layer and the transmitting electrode.

[0016] For example, in a sound-emitting panel provided in one embodiment of this disclosure, the orthographic projection of the ultrasonic detection unit on the plane of the encapsulation layer is smaller than the orthographic projection of the third sound-emitting unit on the encapsulation layer.

[0017] For example, in a sound-emitting panel provided in one embodiment of this disclosure, a first adhesive layer is further provided between the support layer and the first electrode, and a second adhesive layer is provided between the support layer and the third electrode. The materials of the first adhesive layer and the second adhesive layer include transparent optical adhesive.

[0018] For example, in a sound-emitting panel provided in one embodiment of this disclosure, a first flexible layer is further provided between the first adhesive layer and the first electrode, and a second flexible layer is further provided between the second adhesive layer and the third electrode, wherein the materials of the first flexible layer and the second flexible layer include polyimide resin.

[0019] For example, in a sound-emitting panel provided in one embodiment of this disclosure, the material of the support layer includes polyethylene terephthalate.

[0020] For example, in a sound-emitting panel provided in one embodiment of this disclosure, the material of the encapsulation layer is polyimide resin.

[0021] For example, in a sound-emitting panel provided in one embodiment of this disclosure, the materials of the first insulating layer and the second insulating layer are silicon nitride.

[0022] For example, in a sound-emitting panel provided in one embodiment of this disclosure, the materials of the third insulating layer and the fourth insulating layer are silicon nitride.

[0023] For example, in a sound-emitting panel provided in an embodiment of this disclosure, the materials of the first piezoelectric material layer, the second piezoelectric material layer, the third piezoelectric material layer and the fourth piezoelectric material layer include one or more of polyvinylidene fluoride and poly(vinylidene fluoride-co-trifluoroethylene).

[0024] For example, in a sound-emitting panel provided in one embodiment of this disclosure, the first piezoelectric material layer, the second piezoelectric material layer, the third piezoelectric material layer, and the fourth piezoelectric material layer are all made of polyvinylidene fluoride.

[0025] For example, in a sound-emitting panel provided in one embodiment of this disclosure, the first electrode, second electrode, third electrode, fourth electrode, emitting electrode, and receiving electrode are all made of transparent electrode material.

[0026] At least one embodiment of this disclosure provides a screen sound-emitting display device, including the sound-emitting panel and display panel described in any of the above claims.

[0027] For example, in one embodiment of the present disclosure, the screen sound-emitting display device includes a display area and a peripheral area, the display area including a plurality of pixel units arranged in an array; the sound-emitting unit group includes at least one pixel unit in the orthographic projection of the display panel.

[0028] For example, in a screen sound-emitting display device provided in an embodiment of this disclosure, the sound-emitting panel is located on the light-emitting side of the display panel, the sound-emitting panel is connected to the display panel through the connecting layer, and the material of the connecting layer includes optically transparent adhesive.

[0029] For example, in a screen sound-emitting display device provided in an embodiment of this disclosure, the orthographic projection of the ultrasonic detection unit on the display panel partially overlaps with the peripheral area.

[0030] For example, in a screen sound-emitting display device provided in an embodiment of this disclosure, the ultrasonic detection unit's orthogonal projection on the display panel includes at least one pixel unit.

[0031] At least one embodiment of this disclosure provides a method for manufacturing a sound-emitting panel, including:

[0032] Forming a first encapsulation layer and a first piezoelectric structure, including:

[0033] A first encapsulation layer is formed on a first glass substrate. A patterned second electrode and a transmitting electrode are formed on the side of the first encapsulation layer away from the glass substrate. A first insulating layer and a third insulating layer are formed on the sides of the second electrode and the transmitting electrode away from the first encapsulation layer, respectively, with the first insulating layer and the third insulating layer being of the same layer and material. A first piezoelectric material layer and a third piezoelectric material layer are formed on the sides of the first insulating layer and the third insulating layer away from the first encapsulation layer, with the first piezoelectric material layer and the third piezoelectric material layer being of the same layer and material. A first electrode layer is formed on the side of the first piezoelectric material layer away from the first encapsulation layer. The first glass substrate is then peeled off using a laser lift-off method.

[0034] Forming a second encapsulation layer and a second piezoelectric structure, including:

[0035] A second encapsulation layer is formed on a second glass substrate. A patterned fourth electrode and a receiving electrode are formed on the side of the second encapsulation layer away from the glass substrate. A second insulating layer and a fourth insulating layer are formed on the side of the fourth electrode and the receiving electrode away from the second encapsulation layer, respectively. The second insulating layer and the fourth insulating layer are disposed in the same layer and made of the same material. A second piezoelectric material layer and a fourth piezoelectric material layer are formed on the side of the second insulating layer and the fourth insulating layer away from the second encapsulation layer. The second piezoelectric material layer and the fourth piezoelectric material layer are disposed in the same layer and made of the same material. A third electrode layer is formed on the side of the second piezoelectric material layer away from the second encapsulation layer. The second glass substrate is peeled off using a laser lift-off method.

[0036] For example, in a method for manufacturing a sound-emitting panel according to an embodiment of this disclosure, the method includes: forming a plurality of arrayed openings on a support layer, forming a first adhesive layer and a second adhesive layer on both sides of the support layer, wherein the first adhesive layer is used to bond the first piezoelectric structure and the support layer, and the second adhesive layer is used to bond the second piezoelectric structure and the support layer.

[0037] The beneficial technical effects of this disclosure are as follows:

[0038] 1. Since all the materials used in this sound-emitting panel are transparent, placing the sound-emitting panel on the light-emitting side of the display panel will not affect the normal display effect. On the other hand, the vibration of the piezoelectric material layer can be directly transmitted to the air, causing the air to vibrate and thus transmitting the sound waves to the listener. During the propagation of the sound waves, the energy loss is minimal and the distortion of the sound waves is minimal.

[0039] 2. Each sound-generating unit of this sound-generating panel adopts a special sound-generating structure with a double-layer piezoelectric structure sharing a single opening. Compared with the existing sandwich piezoelectric structure, under the same excitation voltage, this structure has the largest vibration amplitude and vibration energy, thus maximizing the sound pressure.

[0040] 3. This sound-emitting panel can also utilize the function of ultrasonic spatial ranging. By utilizing the characteristic that the ultrasonic detection unit can not only emit ultrasonic waves but also receive ultrasonic waves, when the sound-emitting panel is working, it first determines the distance of the listener and then emits the optimal volume according to the distance of the listener.

[0041] 4. Since the resonant frequency is related to the radius of the vibrating element, the resonant frequency can be controlled by controlling the size of the vibrating element's radius (i.e., the radius of the sound-emitting unit). We can set different sizes of vibrating element radii in the piezoelectric vibrating element so that its resonant frequency is in the low-frequency, mid-frequency, and high-frequency stages, making the sound-emitting frequency band of the screen sound-emitting display device more complete and the sound wave quality more realistic and full.

[0042] This disclosure can solve and replace the existing external speaker of display products and the existing screen sound technology that uses the exciter attached to the back of the screen and the screen as the diaphragm of the speaker, to achieve the effect of true screen sound, full-screen sound, and integration of display function and sound function.

[0043] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are intended to provide a further interpretation of the claimed disclosure. Attached Figure Description

[0044] The above and other features and advantages of this disclosure will become more apparent from the detailed description of exemplary embodiments thereof with reference to the accompanying drawings. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0045] Figure 1 A sound-emitting panel is provided as an embodiment of this disclosure;

[0046] Figure 2 A cross-sectional view of a sound-emitting panel provided in an embodiment of this disclosure;

[0047] Figure 3 A cross-sectional view of another sound-emitting panel provided in an embodiment of this disclosure;

[0048] Figure 4 A cross-sectional view of another sound-emitting panel provided in an embodiment of this disclosure;

[0049] Figure 5 Another sound-emitting panel provided in one embodiment of this disclosure;

[0050] Figure 6 A cross-sectional view of another sound-emitting panel provided in an embodiment of this disclosure;

[0051] Figure 7 Another sound-emitting panel provided in one embodiment of this disclosure;

[0052] Figure 8 Another sound-emitting panel provided in one embodiment of this disclosure;

[0053] Figure 9 A cross-sectional view of another sound-emitting panel provided in an embodiment of this disclosure;

[0054] Figure 10 A cross-sectional view of another sound-emitting panel provided in an embodiment of this disclosure;

[0055] Figure 11A cross-sectional view of another sound-emitting panel portion provided in an embodiment of this disclosure;

[0056] Figure 12 A scatter plot showing the relationship between the transmittance and wavelength of different piezoelectric material layers provided in an embodiment of this disclosure;

[0057] Figure 13 Another sound-emitting panel provided in one embodiment of this disclosure;

[0058] Figure 14 A cross-sectional view of another sound-emitting panel provided in an embodiment of this disclosure;

[0059] Figure 15 Another sound-emitting panel provided in one embodiment of this disclosure;

[0060] Figure 16 Another sound-emitting panel provided in one embodiment of this disclosure;

[0061] Figure 17 A cross-sectional view of another sound-emitting panel provided in an embodiment of this disclosure;

[0062] Figure 18 A screen sound-emitting display device is provided as an embodiment of this disclosure;

[0063] Figure 19 A display panel for a screen-emitting sound display device provided in one embodiment of the present disclosure;

[0064] Figure 20 Another screen sound-emitting display device provided in one embodiment of this disclosure;

[0065] Figures 21A-21F This is a schematic diagram illustrating the steps of a method for fabricating a piezoelectric structure according to an embodiment of the present disclosure;

[0066] Figures 22A-22B A schematic diagram illustrating a method for fabricating a support layer according to an embodiment of this disclosure;

[0067] Figure 23 This is a schematic diagram illustrating a method for manufacturing a sound-emitting panel according to an embodiment of the present disclosure. Detailed Implementation

[0068] In the following description, numerous specific details are set forth for purposes of explanation to provide a thorough understanding of various exemplary embodiments or implementations of this disclosure. As used herein, “implementation” and “method” are interchangeable terms and are non-limiting examples of apparatuses or methods employing one or more of the concepts disclosed herein. However, it will be apparent, however, that various exemplary embodiments may be practiced without specific details or with one or more equivalent arrangements. In other instances, well-known structures and apparatuses are shown in block diagram form to avoid unnecessarily obscuring the various exemplary embodiments. Furthermore, the various exemplary embodiments may be different, but not necessarily exclusive. For example, the specific shape, configuration, and characteristics of an exemplary embodiment may be used or implemented in another exemplary embodiment without departing from the concepts of this disclosure.

[0069] Unless otherwise stated, the exemplary embodiments shown should be understood as exemplary features providing different details of some ways in which the concepts of this disclosure can be implemented in practice. Therefore, unless otherwise stated, features, components, modules, layers, films, panels, areas and / or aspects of various embodiments (hereinafter individually or collectively referred to as “elements”) may be combined, separated, interchanged and / or rearranged in other ways without departing from the concepts of this disclosure.

[0070] Crosshairs and / or shading are typically provided in the accompanying drawings to clarify the boundaries between adjacent elements. Thus, unless otherwise stated, the presence or absence of crosshairs or shading does not convey or indicate any preference or requirement for specific materials, material properties, dimensions, proportions, commonalities between illustrated elements, or any other characteristics, properties, etc., of the elements. Furthermore, in the drawings, the dimensions and relative dimensions of elements may be exaggerated for clarity and / or descriptive purposes. When exemplary embodiments can be implemented differently, the specific process sequence may be performed differently than the described sequence. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of description. Moreover, the same reference numerals denote the same elements.

[0071] When a component (such as a layer) is referred to as being "on" another component or layer, "connected to," or "attached to" another component or layer, the component (e.g., the layer) may be directly on, connected to, or attached to the other component or layer, or there may be intermediate components or layers present. However, when a component or layer is referred to as being "directly on" another component or layer, "directly connected to," or "directly attached to" another component or layer, there are no intermediate components or layers present. Therefore, the term "connection" can indicate a physical, electrical, and / or fluid connection, with or without intermediate components. Furthermore, the D1-axis, D2-axis, and D3-axis are not limited to the three axes of a Cartesian coordinate system (such as the x-axis, y-axis, and z-axis) and can be interpreted in a broader sense. For example, the D1-axis, D2-axis, and D3-axis may be perpendicular to each other, or they may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the cluster consisting of X, Y, and Z" can be interpreted as X only, Y only, Z only, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0072] Although the terms “first,” “second,” etc., may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, without departing from the teachings of this disclosure, the first element discussed below may be referred to as the second element.

[0073] Spatial relative terms such as “beneath,” “below,” “lower,” “above,” “upper,” “over,” “higher,” and “side” (e.g., in “sidewall”) may be used herein for descriptive purposes and, therefore, to describe the relationship between one element and another as shown in the figures. In addition to the orientations depicted in the figures, spatial relative terms are also intended to cover different orientations of the device in use, operation, and / or manufacture. For example, if the device in the figures is flipped, an element described as “below” or “under” other elements or features would subsequently be oriented “above” other elements or features. Thus, the exemplary term “below” may encompass both above and below orientations. Furthermore, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and thus, the spatial relative descriptive terms used herein are interpreted accordingly.

[0074] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” as used herein are intended to include the plural forms as well. Furthermore, when the terms “comprise,” “comprising,” “include,” and / or “including” are used in this specification, they indicate the presence of stated features, integrals, steps, operations, elements, components, and / or clusters thereof, but do not preclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or clusters thereof. It should also be noted that, as used herein, the terms “substantially,” “about,” and similar terms are used as approximations rather than terms of degree, and are thus utilized to account for the inherent biases in measurements, calculated values, and / or provided values ​​that would be recognized by those skilled in the art.

[0075] Various exemplary embodiments are described herein with reference to schematic cross-sectional and / or exploded views as idealized exemplary embodiments and / or intermediate structures. Thus, variations in the shapes of the illustrations are expected, resulting from, for example, manufacturing techniques and / or tolerances. Therefore, the exemplary embodiments disclosed herein should not necessarily be interpreted as limited to the shape of the specifically shown areas, but rather include deviations in shape due to, for example, manufacturing processes. In this way, the areas shown in the figures can be schematic in nature, and the shapes of these areas may not reflect the actual shapes of the areas of the device, and are therefore not necessarily intended to be limiting.

[0076] As is customary in the art, exemplary embodiments of functional blocks, units, and / or modules are shown and described in the accompanying drawings. Those skilled in the art will understand that these blocks, units, and / or modules are physically implemented via electronic (or optical) circuitry, such as logic circuits, discrete components, microprocessors, hardwired circuits, memory elements, wiring connections, etc., which may be formed using semiconductor-based or other manufacturing techniques. In the case of blocks, units, and / or modules implemented by microprocessors or other similar hardware, they can be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and may be optionally driven by firmware and / or software. It is also contemplated that each block, unit, and / or module may be implemented by dedicated hardware, or as a combination of dedicated hardware performing some functions with a processor (e.g., one or more programmed microprocessors and associated circuitry) to perform other functions. Moreover, without departing from the scope of the concepts of this disclosure, each block, unit, and / or module of some exemplary embodiments may be physically separated into two or more interactive and discrete blocks, units, and / or modules. Furthermore, without departing from the scope of this disclosure, some exemplary embodiments of blocks, units, and / or modules may be physically combined into more complex blocks, units, and / or modules.

[0077] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Unless expressly defined herein, terms such as those defined in common dictionaries shall be interpreted as having the meaning consistent with their meaning in the context of the relevant art and shall not be interpreted in an idealized or overly formal sense.

[0078] Figure 1 This is a schematic diagram of the structure of a sound-emitting panel 10 constructed according to an exemplary embodiment of the present disclosure. Figure 2 yes Figure 1 A cross-sectional view along line A-A'. (Refer to...) Figure 1 , Figure 2The sound-emitting panel 10 includes at least one sound-emitting unit group 100, and further includes a first encapsulation layer 141 and a second encapsulation layer 142. The sound-emitting unit group 100 includes at least one sound-emitting unit 101, each sound-emitting unit 101 including a support layer 131 and a first piezoelectric structure 1021 and a second piezoelectric structure 1022 located on both sides of the support layer 131. The first piezoelectric structure 1021 includes a first electrode 111, a second electrode 112, and a first piezoelectric material layer 121 located between the first and second electrodes; the second piezoelectric structure 1022 includes a third electrode 113, a fourth electrode 114, and a second piezoelectric material layer 122 located between the third and fourth electrodes 113 and 114. The support layer 131 has a plurality of openings 132 penetrating the support layer. In this embodiment, on the one hand, the first piezoelectric structure and the second piezoelectric structure are located on both sides of the support layer, which can simultaneously achieve vibration at the same frequency, thereby increasing the sound pressure of the sound-emitting panel; on the other hand, the opening on the support layer can constrain the vibration of the piezoelectric material layer perpendicular to the sound-emitting direction, increase the bending effect of the piezoelectric structure layer, avoid noise and crosstalk, and improve the listening experience of the audience.

[0079] Continue to refer to Figure 1 , Figure 2 In some embodiments, the projection of the first piezoelectric structure 1021 onto the plane of the support layer 131 overlaps with the opening 132 as much as possible, and / or, the projection of the second piezoelectric structure 1022 onto the plane of the support layer 131 overlaps with the opening 132. The inventors verified that when the projection of the piezoelectric structure onto the plane of the support layer is larger than the opening, it reduces the amplitude of the piezoelectric structure's vibration, affecting the volume. Those skilled in the art should understand that volume and sound pressure are positively correlated, both being physical quantities used to reflect loudness. Conversely, when the projection of the piezoelectric structure onto the plane of the support layer is smaller than the opening, it increases the cost and difficulty of processing. In this embodiment, the first and second piezoelectric structures fully utilize the space of the opening, which not only maximizes the amplitude of the sound-generating unit but also reduces costs.

[0080] Reference Figure 3 In some embodiments, the first electrodes 111 of multiple sound-generating units 101 are disposed in the same layer and made of the same material, and / or the third electrodes 113 of multiple sound-generating units 101 are disposed in the same layer and made of the same material. A full-surface first electrode 111 and a full-surface third electrode 113 can be connected to different common electrode signals, or they can be connected to the same common electrode signal, for example, the first electrode 111 and the third electrode 113 can be grounded. Making the first electrode and the third electrode into full-surface electrodes saves the patterning step and reduces production costs.

[0081] Reference Figure 4In some embodiments, a first insulating layer 151 is provided between the second electrode 112 and the first piezoelectric material layer 121; a second insulating layer 152 is provided between the fourth electrode 114 and the second piezoelectric material layer 122. By providing the insulating layer, on the one hand, defects caused by contact between the piezoelectric material layer and the electrode before curing can be suppressed; on the other hand, the addition of the insulating layer can prevent the piezoelectric material layer from being broken down, thus improving the yield. In some embodiments, the piezoelectric material layer is coated on the insulating layer in the form of a solution, and the solvent in the solution is evaporated by curing. Before curing, the solvent in the solution may affect the electrode and affect the sound generation effect.

[0082] Continue to refer to Figure 1 In some embodiments, the orthographic projection shape of the sound-emitting unit 101 on the plane of the support layer on the sound-emitting panel 10 is not limited to a circle, but can also be a rectangle, a regular polygon, or other shapes. This embodiment does not limit this. In this embodiment, the orthographic projection shape and radius of each sound-emitting unit 101 on the plane of the support layer are consistent. For example, each sound-emitting unit is a cube with a side length of 0.6-1mm, or each sound-emitting unit is a circle with a diameter of 0.6-1mm, and each sound-emitting unit is used to emit sound waves with a frequency range of 20-20000Hz.

[0083] Reference Figure 5 , Figure 6 . Figure 6 for Figure 5 A cross-sectional view along B-B'. Each sound-emitting unit group 100 includes at least one first sound-emitting unit 1011 for emitting a first frequency sound wave, at least one second sound-emitting unit 1012 for emitting a second frequency sound wave, and at least one third sound-emitting unit 1013 for emitting a third frequency sound wave. In some embodiments, it may also include at least one fourth sound-emitting unit for emitting a fourth frequency sound wave, at least one fifth sound-emitting unit for emitting a fifth frequency sound wave, etc., which are not limited in this embodiment. The first frequency sound wave is in the range of 20-500Hz, the second frequency sound wave is in the range of 500-2000Hz, and the third frequency sound wave is in the range of 2000-20000Hz. In this embodiment, the sound waves of the three frequencies are all distributed within the range of human hearing. Compared with a sound-emitting panel that can only emit one sound wave frequency, the sound-emitting panel of this embodiment can emit low-frequency (20-500Hz), mid-frequency (500-2000Hz), and high-frequency (2000-20000Hz) sound waves, so that the listener can hear a fuller and more realistic sound.

[0084] Continue to refer to Figure 5 , Figure 6In some embodiments, sound-emitting units that emit sound waves of the same frequency are arranged along a first direction, and sound-emitting units that emit sound waves of different frequencies are arranged along a second direction. The first and second directions intersect, and in particular, the first and second directions are perpendicular. This arrangement of sound-emitting units can make the sound waves of each frequency evenly distributed, improving the layering of the sound.

[0085] Formula (1) is the relationship between the resonant frequency and the radius of the vibrating element. In the formula, f0 is the resonant frequency, which is also the sound frequency of the sound-generating unit; t is the resonant point, and the first-order resonant point is used in the embodiment of this application, that is, t=1; r is the radius of the vibrating element, that is, the radius of the sound-generating unit; ρ is the density of the sound wave propagation medium; v is the speed of the sound wave in the medium.

[0086]

[0087] Combining the above formula (1), it can be seen that the radius of the sound-producing unit is inversely proportional to the sound frequency. Continuing to refer to... Figure 5 , Figure 6 The radius of the first sound-emitting unit 1011 is larger than the radius of the second sound-emitting unit 1012, and the radius of the second unit 1012 is larger than the radius of the third unit 1013.

[0088] Reference Figure 7 In some embodiments, at least one sound-emitting unit group 100 in the sound-emitting panel 10 further includes at least one ultrasonic detection unit 1014, which is used to emit and receive sound waves with frequencies exceeding 20,000 Hz. The ultrasonic detection unit 1014 is used to test the distance between the listener and the sound-emitting panel, and the sound-emitting panel having the ultrasonic detection unit 1014 can adjust the sound pressure of the sound waves according to the distance of the listener. Specifically, referring to… Figure 7 The ultrasonic detection unit 1014 is located on the side or corner of the sound-emitting panel. For example, ultrasonic detection units 1014 are respectively provided on the left and right edges of the sound-emitting panel. The ultrasonic detection unit located on the left edge is used to detect the distance between the listener and the left edge of the sound-emitting panel, and the ultrasonic detection unit located on the right edge is used to detect the distance between the listener and the right edge of the sound-emitting panel. By simultaneously detecting the listener's position on both edges, and in conjunction with the algorithm, the listener's precise location can be achieved.

[0089] Reference Figure 8 In some embodiments, at least one sound-emitting unit group 100 in the sound-emitting panel 10 includes at least one ultrasonic detection unit 1014, which is used to emit and receive sound waves with frequencies exceeding 20,000 Hz. The ultrasonic detection unit 1014 is used to test the distance between the listener and the sound-emitting panel and adjust the sound pressure level of the sound waves according to the listener's distance. Specifically, refer to... Figure 8The ultrasonic detection unit 1014 is located at the edge of the display panel. The ultrasonic detection unit on the left edge detects the distance between the listener and the left edge of the sound-emitting panel, while the ultrasonic detection unit on the right edge detects the distance between the listener and the right edge of the sound-emitting panel. This arrangement allows for precise listener positioning. Figure 7 The sound-emitting unit can only emit sound waves of a single frequency; Figure 8 The sound-producing unit can emit sound waves in three different frequency ranges, such as low frequency, mid frequency and high frequency.

[0090] Reference Figure 9 and Figure 10 , Figure 9 yes Figure 7 Cross-sectional view along C-C' Figure 10 yes Figure 8 A cross-sectional view along D-D'. The ultrasonic detection unit 1014 includes a receiving electrode 115 disposed in the same layer as the second electrode 112 and a transmitting electrode 116 disposed in the same layer as the fourth electrode 114. The transmitting electrode 116 is used to transmit ultrasonic signals to the outside, and the receiving electrode 115 is used to receive ultrasonic signals reflected from the outside. The ultrasonic detection unit also includes a third piezoelectric material layer 123 disposed in the same layer and with the same material as the first piezoelectric material layer 121, a fourth piezoelectric material layer 124 disposed in the same layer and with the same material as the second piezoelectric material layer 122, and an ultrasonic support layer 133 disposed in the same layer as the support layer 131. In some embodiments, the thickness of the first electrode 111 and the third electrode 113 (approximately 0.08 μm in this embodiment) is much smaller than the thickness of the first piezoelectric material layer 121 and the second piezoelectric material layer 122 (approximately 9 μm in this embodiment), combined with... Figure 9 The third piezoelectric material layer 123 and the first piezoelectric material layer 121 can be considered to be disposed in the same layer and with the same material, as can the fourth piezoelectric material layer 124 and the second piezoelectric material layer 122. Preferably, the thicknesses of the third piezoelectric material layer 123 and the first piezoelectric material layer 121 are equal; the thicknesses of the fourth piezoelectric material layer 124 and the second piezoelectric material layer 122 are also equal. The inventors verified that this thickness design can reduce the number of process steps and improve production efficiency.

[0091] Continue to refer to Figure 9 and Figure 10 In some embodiments, the ultrasonic detection unit 1014 further includes a third insulating layer 153 located between the third piezoelectric material layer 123 and the receiving electrode 115, and a fourth insulating layer 154 located between the fourth piezoelectric material layer 124 and the transmitting electrode 116. The third insulating layer 153 and the first insulating layer 151 are disposed in the same layer and with the same material, and the fourth insulating layer 154 and the second insulating layer 152 are disposed in the same layer and with the same material.

[0092] Based on formula (1) above, those skilled in the art should understand that, referring to... Figure 9It can be seen that the radius of the ultrasonic detection unit 1014 is smaller than the radius of the sound-generating unit 101; (Refer to...) Figure 10 It can be seen that the radius of the ultrasonic detection unit 1014 is smaller than the radius of the third sound-generating unit 1013.

[0093] Reference Figure 11 , Figure 11 for Figure 10 A detailed schematic diagram of the circled portion. In some embodiments, a first adhesive layer 161 is provided between the support layer 131 and the first electrode 111, and a second adhesive layer 162 is provided between the support layer 131 and the third electrode 112. The materials of the first adhesive layer 161 and the second adhesive layer 162 are optically transparent adhesive (OCA) or optically transparent resin (OCR), used to fix the support layer 131 and the first electrode 111 and the third electrode 113. The inventors have verified that the thicker the first adhesive layer 161 and the second adhesive layer 162, the lower the sound pressure level, and the more muffled the sound heard by the listener. Preferably, the thickness of both the first adhesive layer 161 and the second adhesive layer 162 is between 10µm and 25µm.

[0094] Continue to refer to Figure 11 In some embodiments, a first flexible layer 171 is provided between the first adhesive layer 161 and the first electrode 111, and a second flexible layer 172 is provided between the second adhesive layer 162 and the third electrode 113. The materials of the first flexible layer 171 and the second flexible layer 172 include polyimide resin; specifically, the materials of the first flexible layer 171 and the second flexible layer 172 include transparent polyimide resin. The inventors have verified that the thicker the first flexible layer 171 and the second flexible layer 172, the higher the sound pressure level, and the clearer the sound waves heard by the listener. However, a thicker flexible layer will reduce light transmittance and increase the thickness of the sound-emitting panel. Preferably, the thickness of the first flexible layer 171 and the second flexible layer 172 is 5-50 μm.

[0095] In some embodiments, the materials of the support layer 131 and the ultrasonic support layer 133 include polyethylene terephthalate.

[0096] In some embodiments, the materials of the first encapsulation layer 141 and the second encapsulation layer 142 include polyimide resin. In particular, the materials of the first encapsulation layer 141 and the second encapsulation layer 142 include transparent polyimide resin.

[0097] In some embodiments, the materials of the first insulating layer 151, the second insulating layer 152, the third insulating layer 153, and the fourth insulating layer 154 include silicon nitride. Silicon nitride can prevent the piezoelectric material layer from contacting the electrode before curing. At the same time, silicon nitride also has a suitable dielectric constant, which avoids the problem of excessive voltage and piezoelectric material layer breakdown during use of the sound-emitting panel, thereby improving the yield of the sound-emitting panel.

[0098] In some embodiments, the materials of the first piezoelectric material layer 121, the second piezoelectric material layer 122, the third piezoelectric material layer 123, and the fourth piezoelectric material layer 124 include one or more of polyvinylidene fluoride (hereinafter referred to as PVDF) and poly(vinylidene fluoride-co-trifluoroethylene) (hereinafter referred to as P(VDF-TrFE)). In particular, the materials of the first piezoelectric material layer 121, the second piezoelectric material layer 122, the third piezoelectric material layer 123, and the fourth piezoelectric material layer 124 are all poly(vinylidene fluoride-co-trifluoroethylene) (P(VDF-TrFE)).

[0099] The inventors discovered that PVDF has poor piezoelectric properties (i.e., the ability to convert electrical signals into vibrational signals). Using P(VDF-TrFE) can improve these piezoelectric properties. Figure 12 The inventors compared two P(VDF-TrFE) materials (FC-20 representing a 20wt% mass fraction of trifluoroethylene monomer in the P(VDF-TrFE) copolymer, and FC-30 representing a 30wt% mass fraction of trifluoroethylene monomer in the P(VDF-TrFE) copolymer) and found that FC-30 had significantly higher transmittance in the visible light region than FC-20. To improve the transmittance of the display image, the first piezoelectric material layer 121, the second piezoelectric material layer 122, the third piezoelectric material layer 123, and the fourth piezoelectric material layer 124 are all made of FC-30.

[0100] In some embodiments, the first electrode 111, the second electrode 112, the third electrode 113, the fourth electrode 114, the receiving electrode 115, and the emitting electrode 116 are all made of transparent electrode materials. In particular, transparent electrode materials include indium tin oxide (ITO), graphene, silver nanowire electrodes, etc.

[0101] Reference Figure 13 In some embodiments, the sound-emitting panel includes a sound-emitting area 11 and a control chip area 18. The sound-emitting area 11 includes at least one sound-emitting unit group 100, and the sound-emitting units and ultrasonic detection units in each sound-emitting unit group are connected to a chip located in the control chip area 18 via multiple traces. Figure 14 , Figure 14 for Figure 13A cross-sectional view along E-E'. In this embodiment, the sound-emitting unit group includes a first trace 1811 disposed on the same layer 112 as the second electrode, a second trace 1812 disposed on the same layer 114 as the fourth electrode, a receiving trace 1821 disposed on the same layer as the receiving electrode 115, and a transmitting trace 1831 disposed on the same layer as the transmitting electrode 116. The first trace 1811 and the second trace 1812 are electrically connected to the sound-emitting unit chip 181, the receiving trace 1821 is electrically connected to the receiving chip 182, and the transmitting trace 1831 is electrically connected to the transmitting chip 183. Those skilled in the art should understand that in the top view of the sound-emitting panel 10, the projections of the receiving chip 182 and the transmitting chip 183 may or may not overlap; this embodiment shows the case where the receiving chip 182 and the transmitting chip 183 overlap.

[0102] In some embodiments, each column of sound-emitting units in each sound-emitting unit group 100 can be connected to a pin in the control chip area 18. See details below. Figure 15 .

[0103] Reference Figure 16 and Figure 17 ,in Figure 17 for Figure 16 A cross-sectional view along F-F'. In some embodiments, the control chip region 18 further includes a first sound-emitting unit chip 18101, a second sound-emitting unit chip 18102, and a third sound-emitting unit chip 18103. (Combined) Figure 17 The first sound unit traces 181011 and 181012 are electrically connected to the first sound unit chip 18101; the second sound unit traces 181021 and 181022 are electrically connected to the second sound unit chip 18102; and the third sound unit traces 181031 and 181032 are electrically connected to the third sound unit chip 18103. See also... Figure 16 and Figure 17 The first sound unit 1011 controlled by the first sound unit chip 18101 has the largest radius, the third sound unit 1013 controlled by the third sound unit chip 18103 has the smallest radius, and the second sound unit 1012 controlled by the second sound unit chip 18102 has a radius larger than the radius of the third sound unit 1013 but smaller than the radius of the first sound unit 1011.

[0104] At least one embodiment of this disclosure also provides a screen sound-emitting display device, see reference Figure 18The screen-based sound-emitting display device 40 includes a sound-emitting panel 10, a display panel 20, and a connecting layer 30 connecting the sound-emitting panel 10 and the display panel 20. The display panel 20 can be a thin-film transistor liquid crystal display (TFT-LCD), a miniature LED (Mini LED or Micro LED) display panel, or an organic light-emitting diode (OLED) display panel. The connecting layer 30 is made of optically transparent adhesive (OCA) and optically transparent resin (OCR). The sound-emitting panel 10 and the display panel 20 can be bonded together via the connecting layer 30. In some embodiments, the connecting layer 30 is coated over its entire surface between the sound-emitting panel 10 and the display panel 20. Compared to other connection methods, this method increases the connection strength between the sound-emitting panel 10 and the display panel 20 by increasing the connection area between the connecting layer and the sound-emitting panel 10 and the display panel 20. This embodiment maintains the integration of the display device without significantly increasing its thickness, meeting customer demands for ultra-thin display devices.

[0105] Reference Figure 19 In some embodiments, the display device includes a display area 21 and a peripheral area 22. The display area includes an array of pixel units 211. On the sound-emitting panel 10, each sound-emitting unit group 100 includes at least one pixel unit in its orthographic projection onto the display panel 20.

[0106] Reference Figure 20 Because each film layer of the sound-emitting panel 10 uses a high-transmittance material, the visible light transmittance of the entire sound-emitting panel is over 90%. Therefore, the sound-emitting panel 10 can be directly attached to the light-emitting side of the display panel 20. In particular, the receiving electrode 115 is farther away from the light-emitting side of the display panel 20 than the emitting electrode 116, which reduces the loss of ultrasonic signals received by the receiving electrode 115.

[0107] Continue to refer to Figure 20 In some embodiments, the projection of the ultrasonic detection unit 1014 onto the display device may be located in the peripheral area 22 of the display device 20 or in the display area 21, and may overlap with at least one pixel unit 211. This embodiment does not limit this.

[0108] At least one embodiment of this disclosure also provides a method for manufacturing a sound-emitting panel. In this embodiment, a piezoelectric structure and a support layer are fabricated separately, and the sound-emitting panel is fabricated by bonding them together. This manufacturing method simplifies the process and reduces manufacturing costs.

[0109] Figures 21A-21F The manufacturing method of the first piezoelectric structure 1021 is the same as that of the second piezoelectric structure 1022.

[0110] ReferenceFigure 21A A glass substrate 191 is provided, and a first encapsulation layer 141 is formed on the glass substrate. For example... Figure 21B An electrode layer is formed on the side of the first encapsulation layer 141 away from the glass substrate 191. The electrode layer is patterned using processes such as photolithography and etching to form multiple second electrodes 112 and receiving electrodes 115. The radii of the second electrode layers 112 and the receiving electrodes 115 may be the same or different. The materials of the second electrodes 112 and the receiving electrodes 115 are transparent electrode materials, specifically indium tin oxide (ITO). Multiple traces 181031, 181021, 181011, and 1821 are formed to electrically connect to the second electrodes 112. These traces can connect to the same sound-emitting unit pin or to different sound-emitting unit pins; this solution does not limit this.

[0111] like Figure 21C A first insulating layer 151 and a third insulating layer 153 are formed on the electrode layer, and the first insulating layer 151 and the third insulating layer 153 are disposed in the same layer and made of the same material. In particular, the material of the first insulating layer 151 and the third insulating layer 153 can be silicon nitride, which has excellent light transmittance. On the one hand, it can prevent the piezoelectric material layer from contacting the electrode before curing, thus affecting the electrode performance; on the other hand, it can avoid voltage breakdown and improve yield.

[0112] like Figure 21D A 40-50 μm thick organic piezoelectric material is coated onto the first insulating layer 151 and the third insulating layer 153. Specifically, the organic piezoelectric material can be P(VDF-TrFE), wherein the mass fraction of trifluoroethylene monomer in the P(VDF-TrFE) copolymer is 30 wt%. The organic piezoelectric material is then cured and subjected to crystallization treatment to complete the crystal transformation, forming the first piezoelectric material layer 121 and the third piezoelectric material layer 123. The first piezoelectric material layer 121 and the third piezoelectric material layer 123 are disposed in the same layer and made of the same material.

[0113] like Figure 21E A first electrode 111 is formed on the first piezoelectric material layer 121. The first electrode can be patterned or formed as a single, continuous electrode layer. The thickness of the first electrode 111 and the third electrode 113 (approximately 0.08 μm in this embodiment) is much smaller than the thickness of the first piezoelectric material layer 121 and the second piezoelectric material layer 122 (approximately 9 μm in this embodiment). This attached figure is only for illustration of the first electrode 111; in the actual product and its manufacturing process, the thickness of the first electrode 111 relative to the thickness of the first piezoelectric material layer 121 is negligible. The piezoelectric structure and the support layer are then bonded together. In this embodiment, forming the first electrode 111 as a single continuous electrode layer on the first piezoelectric material layer 121 reduces process complexity and saves costs.

[0114] like Figure 21FThe glass substrate 119 is peeled off using laser lift-off (LLO) technology to obtain a first encapsulation layer 141 and a plurality of first piezoelectric structures 1021 and a portion of ultrasonic detection units located on the first encapsulation layer 141.

[0115] Figures 22A-22B This describes the fabrication method for support layer 131. For example... Figure 22A A support layer 131 is provided, and multiple openings 132 are formed on the support layer 131 by laser drilling. The shape of the openings 132 can be circular, square, regular polygon, etc. This embodiment does not follow this. The shape of the openings 132 is the same as the shape of the second electrode 112 or the receiving electrode 115, and the radius of the openings 132 is the same as the radius of the second electrode 112 or the receiving electrode 115. Figure 22B for Figure 22A Cross-sectional view along G-G'.

[0116] like Figure 23 The first piezoelectric structure 1021 and the second piezoelectric structure 1022 are respectively attached to both sides of the support layer 131 to form the sound-generating panel 10.

[0117] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. A sound-emitting panel, comprising At least one sound-producing unit group, The sound-generating unit group includes at least one sound-generating unit, and each sound-generating unit includes a support layer, a first piezoelectric structure, and a second piezoelectric structure; the first piezoelectric structure and the second piezoelectric structure are respectively located on both sides of the support layer; The support layer includes an opening, and the orthographic projections of the first piezoelectric structure and the second piezoelectric structure onto the plane of the support layer overlap with the opening portion; The first piezoelectric structure includes a first electrode located on the support layer, a first piezoelectric material layer located on the side of the first electrode away from the support layer, and a second electrode located on the first piezoelectric material layer away from the first electrode; The second piezoelectric structure includes a third electrode located on the side of the support layer away from the first piezoelectric structure, a second piezoelectric material layer located on the side of the third electrode away from the support layer, and a fourth electrode located on the second piezoelectric material layer away from the third electrode; It also includes an encapsulation layer, which includes a first encapsulation layer located on the side of the second electrode away from the first piezoelectric material layer and a second encapsulation layer located on the side of the fourth electrode away from the second piezoelectric material layer; The at least one sound-emitting unit includes a first sound-emitting unit, a second sound-emitting unit, and a third sound-emitting unit; the orthographic projection of the first sound-emitting unit on the encapsulation layer is greater than the orthographic projection of the second sound-emitting unit on the encapsulation layer, and the orthographic projection of the second sound-emitting unit on the encapsulation layer is greater than the orthographic projection of the third sound-emitting unit on the encapsulation layer.

2. The sound-emitting panel according to claim 1, characterized in that, The projection of the first piezoelectric structure onto the plane of the support layer overlaps with the opening. And / or, the projection of the second piezoelectric structure onto the plane of the support layer overlaps with the opening.

3. The sound-emitting panel according to claim 2, characterized in that, A first insulating layer is provided between the second electrode and the first piezoelectric material layer, and a second insulating layer is provided between the fourth electrode and the second piezoelectric material layer.

4. The sound-generating panel according to any one of claims 1 to 3, characterized in that, The sound-emitting unit is used to emit sound waves with a frequency range of 20-20000 Hz.

5. The sound-emitting panel according to claim 4, characterized in that, Each of the sound-emitting unit groups includes at least one first sound-emitting unit and at least one second sound-emitting unit, the first sound-emitting unit being used to emit sound waves having a first frequency, and the second sound-emitting unit being used to emit sound waves having a second frequency, the first frequency and the second frequency belonging to different frequency ranges.

6. The sound-emitting panel according to claim 5, characterized in that, Each of the sound-emitting unit groups includes a plurality of first sound-emitting units and a plurality of second sound-emitting units. The plurality of first sound-emitting units are arranged along a first direction, and the plurality of second sound-emitting units are arranged along a first direction. The first sound-emitting units and the second sound-emitting units are arranged adjacent to each other along a second direction. The first direction and the second direction intersect.

7. The sound-emitting panel according to claim 5, characterized in that, Each of the aforementioned sound-emitting unit groups further includes at least one third sound-emitting unit, the third sound-emitting unit being used to emit sound waves of a third frequency. The first frequency is in the range of 20-500 Hz, the second frequency is in the range of 500-2000 Hz, and the third frequency is in the range of 2000 Hz-20000 Hz.

8. The sound-emitting panel according to claim 1, characterized in that, At least one of the sound-generating unit groups includes at least one ultrasonic detection unit for emitting and receiving frequencies exceeding 20,000 Hz. The ultrasonic detection unit includes a receiving electrode disposed in the same layer as the second electrode, a transmitting electrode disposed in the same layer as the fourth electrode, a third piezoelectric material layer disposed in the same layer and with the same material as the first piezoelectric material layer, a fourth piezoelectric material layer disposed in the same layer and with the same material as the second piezoelectric material, and an ultrasonic support layer disposed in the same layer as the support layer.

9. The sound-emitting panel according to claim 8, characterized in that, A third insulating layer is provided between the third piezoelectric material layer and the receiving electrode, and a fourth insulating layer is provided between the fourth piezoelectric material layer and the transmitting electrode.

10. The sound-emitting panel according to claim 8 or 9, characterized in that, The orthographic projection of the ultrasonic detection unit on the plane of the encapsulation layer is smaller than the orthographic projection of any of the sound-emitting units on the encapsulation layer.

11. The sound-emitting panel according to claim 1, characterized in that, It also includes a first adhesive layer located between the support layer and the first electrode, and a second adhesive layer located between the support layer and the third electrode, wherein the materials of the first adhesive layer and the second adhesive layer include transparent optical adhesive.

12. The sound-emitting panel according to claim 11, characterized in that, It also includes a first flexible layer located between the first adhesive layer and the first electrode, and a second flexible layer located between the second adhesive layer and the third electrode, wherein the materials of the first flexible layer and the second flexible layer include polyimide resin.

13. The sound-emitting panel according to claim 8, characterized in that, The material of the support layer and / or the ultrasonic support layer includes polyethylene terephthalate.

14. The sound-emitting panel according to claim 1, characterized in that, The encapsulation layer is made of polyimide resin.

15. The sound-emitting panel according to claim 3, characterized in that, The materials of the first insulating layer and the second insulating layer are silicon nitride.

16. The sound-emitting panel according to claim 9, characterized in that, The materials of the third insulating layer and the fourth insulating layer are silicon nitride.

17. The sound-emitting panel according to claim 8, characterized in that, The materials of the first piezoelectric material layer, the second piezoelectric material layer, the third piezoelectric material layer and the fourth piezoelectric material layer include one or more of polyvinylidene fluoride and poly(vinylidene fluoride-co-trifluoroethylene).

18. The sound-emitting panel according to claim 17, characterized in that, The first piezoelectric material layer, the second piezoelectric material layer, the third piezoelectric material layer and the fourth piezoelectric material layer are all made of poly(vinylidene fluoride-co-trifluoroethylene).

19. The sound-emitting panel according to claim 8, characterized in that, The first electrode, second electrode, third electrode, fourth electrode, emitting electrode, and receiving electrode are all made of transparent electrode material.

20. A screen-emitting sound display device, comprising a display panel and a sound-emitting panel as described in any one of claims 1-19.

21. The screen sound-emitting display device according to claim 20, characterized in that, The display panel includes a display area and a peripheral area. The display area includes a plurality of pixel units arranged in an array. The sound-emitting unit group includes at least one pixel unit in its orthographic projection onto the display panel.

22. The screen sound-emitting display device according to claim 20, characterized in that, The sound-emitting panel is located on the light-emitting side of the display panel. The sound-emitting panel is connected to the display panel through a connecting layer, the material of which includes optically transparent adhesive.

23. The screen sound-emitting display device according to claim 21, characterized in that, At least one of the sound-emitting unit groups includes at least one ultrasonic detection unit for emitting and receiving frequencies exceeding 20,000 Hz; the orthographic projection of the ultrasonic detection unit on the display panel partially overlaps with the peripheral area.

24. The screen sound-emitting display device according to claim 21 or 22, characterized in that, At least one of the sound-emitting unit groups includes at least one ultrasonic detection unit for emitting and receiving frequencies exceeding 20,000 Hz; the ultrasonic detection unit, in its orthographic projection onto the display panel, includes at least one pixel unit.

25. A method for manufacturing a sound-emitting panel, used to prepare a sound-emitting panel as described in any one of claims 1-19, the sound-emitting panel comprising at least one sound-emitting unit group, the sound-emitting unit group comprising at least one sound-emitting unit; The preparation method includes: Forming a first encapsulation layer and a first piezoelectric structure, including: A first encapsulation layer is formed on a first glass substrate. A patterned second electrode and a transmitting electrode are formed on the side of the first encapsulation layer away from the glass substrate. A first insulating layer and a third insulating layer are formed on the sides of the second electrode and the transmitting electrode away from the first encapsulation layer, respectively, with the first insulating layer and the third insulating layer being of the same layer and material. A first piezoelectric material layer and a third piezoelectric material layer are formed on the sides of the first insulating layer and the third insulating layer away from the first encapsulation layer, with the first piezoelectric material layer and the third piezoelectric material layer being of the same layer and material. A first electrode layer is formed on the side of the first piezoelectric material layer away from the first encapsulation layer. The first glass substrate is then peeled off using a laser lift-off method. Forming a second encapsulation layer and a second piezoelectric structure, including: A second encapsulation layer is formed on a second glass substrate. A patterned fourth electrode and a receiving electrode are formed on the side of the second encapsulation layer away from the glass substrate. A second insulating layer and a fourth insulating layer are formed on the sides of the fourth electrode and the receiving electrode away from the second encapsulation layer, respectively, with the second insulating layer and the fourth insulating layer being of the same layer and material. A second piezoelectric material layer and a fourth piezoelectric material layer are formed on the sides of the second insulating layer and the fourth insulating layer away from the second encapsulation layer, with the second piezoelectric material layer and the fourth piezoelectric material layer being of the same layer and material. A third electrode layer is formed on the side of the second piezoelectric material layer away from the second encapsulation layer. The second glass substrate is then peeled off using a laser lift-off method. The at least one sound-emitting unit includes a first sound-emitting unit, a second sound-emitting unit, and a third sound-emitting unit; the orthographic projection of the first sound-emitting unit on the encapsulation layer is greater than the orthographic projection of the second sound-emitting unit on the encapsulation layer, and the orthographic projection of the second sound-emitting unit on the encapsulation layer is greater than the orthographic projection of the third sound-emitting unit on the encapsulation layer.

26. The method for manufacturing a sound-emitting panel according to claim 25, comprising: Multiple arrayed openings are formed on the support layer, and a first adhesive layer and a second adhesive layer are formed on both sides of the support layer. The first adhesive layer is used to bond the first piezoelectric structure and the support layer, and the second adhesive layer is used to bond the second piezoelectric structure and the support layer.

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