Microneedle assembly assembly device and method

Abstract

The embodiment of the present application provides an assembly device and method for a microneedle group, which relates to the field of medical device technology. The assembly device includes a fixing seat and a base. The fixing seat is arranged on the base, and the fixing seat has a mating surface for placing a circuit board and a first microneedle through-hole that vertically penetrates the fixing seat along the thickness direction of the fixing seat. The base is arranged on the side of the fixing seat away from the mating surface, and is used to block the microneedles that pass through the first microneedle through-hole, ensuring that the microneedles can be placed vertically in the fixing seat. The assembly device uses the microneedle setting hole and the first microneedle through-hole to perform multi-point positioning of the microneedles, which can ensure that all microneedles are perpendicular to the circuit board, improve the assembly quality of the microneedles and the circuit board, and thus improve the quality of the microneedle group.

Description

Technical Field

[0001] The present application relates to the field of medical device technology, and in particular to an assembly device and method for a microneedle assembly. Background Art

[0002] A person's life progresses from youth to old age, and as they age, their skin changes. Problems like pimples and acne during adolescence, wrinkles from aging, and scars left behind by daily life all become challenges in the pursuit of beauty. To address these issues, radiofrequency (RF) beauty devices are used to treat damaged skin. RF beauty devices include microneedle arrays, which transmit radiofrequency generated by the device to the skin.

[0003] Currently, when making a microneedle set, it is necessary to manually insert multiple microneedles into the holes of a circuit board in sequence, and then use welding equipment to weld the microneedles to the circuit board, and finally complete the assembly of the microneedles and the circuit board to form a microneedle set.

[0004] However, current assembly methods produce microneedle sets of poor quality. Summary of the Invention

[0005] The embodiments of the present application provide a microneedle assembly device and method to solve the problem of poor quality of microneedle assemblies produced by current assembly methods.

[0006] In a first aspect, an embodiment of the present application provides an assembly device for a microneedle assembly, the microneedle assembly comprising microneedles and a circuit board, the circuit board being provided with a microneedle placement hole, a portion of the microneedle being disposed in the microneedle placement hole, the assembly device comprising:

[0007] A fixing base, the fixing base having a mating surface for placing a circuit board, the mating surface being used to place a circuit board, the fixing base being provided with a first microneedle through-hole, the first microneedle through-hole vertically penetrating the fixing base along a thickness direction of the fixing base, the first microneedle through-hole being configured to correspond to a position of the microneedle setting hole when the circuit board is placed on the mating surface;

[0008] The base is arranged on a side of the fixing seat away from the mating surface, and the base is configured to resist one end of the microneedle after the microneedle passes through the microneedle setting hole and the first microneedle through hole in sequence.

[0009] In a feasible implementation, the first microneedle through hole includes a conical portion and a columnar portion, the large end of the conical portion is connected to the mating surface, the small end of the conical portion is connected to the columnar portion, and the conical portion and the columnar portion are coaxially arranged.

[0010] In a feasible implementation, the assembly device further includes a microneedle limiting plate, which is disposed between the fixing seat and the base, and a second microneedle through hole is provided on the microneedle limiting plate, and the position of the second microneedle through hole corresponds to the position of the first microneedle through hole;

[0011] The base is configured to resist one end of the microneedle after the microneedle passes through the microneedle setting hole, the first microneedle through hole and the second microneedle through hole in sequence.

[0012] In a feasible implementation, the second microneedle through hole is tapered, with the large end of the second microneedle through hole facing the fixing seat and the small end of the second microneedle through hole facing the base.

[0013] In a feasible implementation, a groove is provided on the side of the base facing the fixing seat, at least a portion of the microneedle limiting plate is arranged in the groove, and a surface of the microneedle limiting plate away from the fixing seat and a surface of the groove facing the fixing seat have a separation space.

[0014] In a feasible implementation, a magnetic member is provided on a side of the base away from the fixing seat, and the magnetic member is used to attract the microneedle abutting against the base.

[0015] In a feasible implementation, a plurality of limiting parts are provided on the fixing seat, all of which are distributed on the mating surface, and each limiting part is provided with a limiting recess, which is used to limit the circuit board.

[0016] In a feasible implementation, there are multiple microneedle groups, and the circuit boards in the multiple microneedle groups form a circuit board group; the mating surface is configured to place the circuit board group;

[0017] Multiple limiting parts are spaced apart and distributed on the edge of the mating surface. The notches of the limiting recesses on all limiting parts face the middle area of ​​the mating surface. The edges of the circuit board assembly are placed in all limiting recesses.

[0018] In one feasible implementation, a plurality of spaced support protrusions are provided on the mating surface, and the support protrusions are configured to contact the edge area of ​​the circuit board when a circuit board is placed on the mating surface to support the circuit board, and the edge area is arranged around the periphery of the area formed by the plurality of microneedle setting holes.

[0019] In a second aspect, an embodiment of the present application provides a method for assembling a microneedle assembly, wherein the microneedle assembly assembly device of the first aspect is used to assemble the microneedles and a circuit board, comprising:

[0020] placing the circuit board on a holder in the assembly device;

[0021] Pass the microneedle through the microneedle setting hole on the circuit board and the first microneedle through-hole in the fixing seat in sequence, so that the end of the microneedle abuts against the base of the assembly device;

[0022] Apply solder paste to the microneedle setting hole;

[0023] Use welding equipment to solder the microneedles to the circuit board.

[0024] The embodiment of the present application provides an assembly device and method for a microneedle group, including a fixing seat and a base. The fixing seat is arranged on the base, and the fixing seat has a mating surface for placing a circuit board and a first microneedle through-hole that vertically penetrates the fixing seat along the thickness direction of the fixing seat. The base is arranged on the side of the fixing seat away from the mating surface, and is used to block the microneedles that pass through the first microneedle through-hole, ensuring that the microneedles can be placed vertically in the fixing seat. When assembling the microneedle group, the circuit board is placed on the mating surface of the fixing seat, and then all the microneedles are sequentially passed through the microneedle setting holes and the first microneedle through-hole on the circuit board to position the microneedles, and finally all the microneedles are welded to the circuit board to complete the assembly of the microneedle group. The assembly device uses the microneedle setting holes and the first microneedle through-hole to perform multi-point positioning of the microneedles, which can ensure that all microneedles are perpendicular to the circuit board, improve the assembly quality of the microneedles and the circuit board, and thus improve the quality of the microneedle group. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 Schematic diagram of the structure of a microneedle assembly provided in one embodiment of the present application;

[0026] Figure 2 Schematic diagram of the structure of the assembly device of the microneedle assembly provided in one embodiment of the present application;

[0027] Figure 3 yes Figure 1 Exploded schematic diagram of the assembly device in FIG.

[0028] Figure 4 yes Figure 1 A top view of the assembly device in FIG.

[0029] Figure 5 There are multiple Figure 2 A schematic structural diagram of a circuit board group composed of circuit boards in FIG.

[0030] Figure 6 yes Figure 1 Schematic diagram of the assembly device with the cover removed.

[0031] Description of reference numerals:

[0032] 100 - circuit board assembly; 110 - circuit board; 111 - microneedle setting hole;

[0033] 200 - fixing seat; 210 - mating surface; 220 - first microneedle through hole; 230 - limiting portion; 231 - limiting recess; 240 - supporting protrusion; 241 - supporting column; 242 - first supporting block; 243 - second supporting block;

[0034] 300-microneedle limiting plate; 310-second microneedle through hole;

[0035] 400-base; 410-groove; 420-step;

[0036] 500-magnetic parts;

[0037] 600-cover plate;

[0038] 700-microneedle group;

[0039] 800-microneedles. DETAILED DESCRIPTION

[0040] In order to enable those skilled in the art to better understand the technical solutions in this application, the following will provide a clear and complete description of the technical solutions in the embodiments of this application in conjunction with the drawings in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0041] In the description of the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "plurality" is at least two, for example, two, three, etc., unless otherwise clearly and specifically defined.

[0042] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0043] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it can mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0044] Figure 1 Schematic diagram of the structure of a microneedle assembly 700 provided in one embodiment of the present application.

[0045] refer to Figure 1 As shown, microneedle assembly 700 includes a circuit board 110 and microneedles 800. Multiple microneedles 800 are evenly distributed and vertically arranged on circuit board 110. Exemplarily, microneedles 800 have a tip and a connecting end. The tip is used to treat the skin, while the connecting end is fixed to circuit board 110.

[0046] Currently, when making the microneedle assembly 700, it is necessary to manually insert multiple microneedles 800 into the holes of the circuit board 110 in sequence, and then use welding equipment to weld the microneedles 800 to the circuit board 110, and finally complete the assembly of the microneedles 800 and the circuit board 110 to form the microneedle assembly 700.

[0047] However, the current assembly method cannot ensure that all microneedles 800 are perpendicular to the circuit board 110, which ultimately results in poor quality of the produced microneedle assembly 700.

[0048] In order to solve the problem of poor assembly precision of the current microneedle assembly 700, the embodiment of the present application provides an assembly device and method for a microneedle assembly. The assembly device includes a fixing seat 200 and a base 400. The fixing seat 200 is arranged on the base 400, and the fixing seat 200 has a mating surface 210 for placing the circuit board 110 and a thickness direction (such as Figure 1 The first microneedle through-hole 220 of the fixing base 200 is perpendicularly penetrated (in the thickness direction shown in FIG). This assembly device utilizes the microneedle placement holes 111 and the first microneedle through-hole 220 to perform multi-point positioning of the microneedles 800, ensuring that all microneedles 800 are perpendicular to the circuit board 110 before soldering the microneedles 800 to the circuit board 110. This assembly device improves the assembly of the microneedles 800 and the circuit board 110, thereby enhancing the quality of the microneedle assembly 700.

[0049] The applicant will now describe in detail the solutions provided in the embodiments of the present application with reference to the accompanying drawings.

[0050] Figure 2 Schematic diagram of the structure of the assembly device of the microneedle assembly provided in one embodiment of the present application; Figure 3 yes Figure 1 Exploded schematic diagram of the assembly device in FIG. Figure 4 yes Figure 1 A top view of the assembly device in FIG.

[0051] It should be noted that the microneedle assembly 700 includes microneedles 800 and a circuit board 110. The circuit board 110 is provided with microneedle placement holes 111, and a portion of the microneedles 800 is placed in the microneedle placement holes 111. It is understood that each microneedle assembly 700 includes a plurality of microneedles 800, and the circuit board 110 has microneedle placement holes 111 corresponding to the number of microneedles 800 (not all microneedle placement holes 111 are shown in the figure).

[0052] refer to Figures 2 to 4 As shown, an embodiment of the present application provides an assembly device for a microneedle assembly, which includes a fixing seat 200 and a base 400 , and the fixing seat 200 is disposed on the base 400 .

[0053] The fixing base 200 has a mating surface 210 for placing the circuit board 110. The fixing base 200 is provided with a first microneedle through hole 220. The first microneedle through hole 220 vertically penetrates the fixing base 200 along the thickness direction of the fixing base 200. The first microneedle through hole 220 is configured to correspond to the position of the microneedle setting hole 111 when the circuit board 110 is placed on the mating surface 210. It should be noted that Figure 1 and Figure 3 Not all of the first microneedle through-holes 220 are shown.

[0054] Exemplarily, the upper surface of the fixing base 200 (the surface of the fixing base 200 away from the base 400) is configured as a mating surface 210 for placing the circuit board 110. The fixing base 200 is provided with a first microneedle through-hole 220, which vertically penetrates the fixing base 200 along the thickness direction of the fixing base 200. In other words, the first microneedle through-hole 220 penetrates the fixing base 200 perpendicularly to the mating surface 210 (upper surface) of the fixing base 200.

[0055] Furthermore, it should be noted that the position of the first microneedle through-hole 220 on the fixing base 200 corresponds to the position of the microneedle setting hole 111 of the circuit board 110 placed on the mating surface 210, thereby ensuring that the tip of the microneedle 800 can sequentially pass through the microneedle setting hole 111 and the first microneedle through-hole 220. At the same time, illustratively, the shape of the first microneedle through-hole 220 can be a cylindrical through-hole, and the diameter of the cylindrical through-hole is greater than or equal to the diameter of the microneedle 800 to ensure that the microneedle 800 can pass through.

[0056] Furthermore, the base 400 is disposed on the side of the mounting base 200 opposite the mating surface 210. The base 400 is configured to support the tips of the microneedles 800 after they sequentially pass through the microneedle placement holes 111 and the first microneedle through-holes 220. Exemplarily, the side of the base 400 proximal to the mounting base 200 is flat. When the tips of the multiple microneedles 800 abut against the base 400, this flat surface aligns the tips of the multiple microneedles 800, thereby aligning their connecting ends. This allows the connecting ends to be evenly secured to the circuit board 110, ensuring a high-quality microneedle assembly 700.

[0057] It can be understood that when assembling the microneedle group 700, the circuit board 110 is first placed on the mating surface 210 of the fixing seat 200, and then the tips of all the microneedles 800 are sequentially passed through the microneedle setting holes 111 and the first microneedle through holes 220 on the circuit board 110 to position the microneedles 800, and finally the connecting ends of all the microneedles 800 are welded to the circuit board 110 to complete the assembly of the microneedle group 700.

[0058] The assembly device uses the microneedle setting hole 111 and the first microneedle through hole 220 to perform multi-point positioning of the microneedles 800, which can ensure that all microneedles 800 are perpendicular to the circuit board 110, thereby improving the assembly quality of the microneedles 800 and the circuit board 110, thereby improving the quality of the microneedle group 700.

[0059] To put it another way, an embodiment of the present application provides an assembly device for a microneedle assembly, comprising a fixing base 200 and a base 400. The fixing base 200 is disposed on the base 400, and the fixing base 200 has a mating surface 210 for placing a circuit board 110 and a first microneedle through-hole 220 that vertically penetrates the fixing base 200 along the thickness direction of the fixing base 200. The base 400 is disposed on a side of the fixing base 200 away from the mating surface 210, and is used to block the microneedles 800 that pass through the first microneedle through-hole 220, ensuring that the microneedles 800 can be vertically placed in the fixing base 200.

[0060] When assembling the microneedles 800 and the circuit board 110, the circuit board 110 is first placed on the mating surface 210 of the fixing base 200. The tips of all the microneedles 800 are then sequentially passed through the microneedle placement holes 111 and the first microneedle through-holes 220 on the circuit board 110. Finally, the connecting ends of all the microneedles 800 are soldered to the circuit board 110 to complete the assembly of the microneedle assembly 700. This assembly device utilizes the microneedle placement holes 111 and the first microneedle through-holes 220 to perform multi-point positioning of the microneedles 800, ensuring that all microneedles 800 are perpendicular to the circuit board 110, improving the assembly level of the microneedles 800 and the circuit board 110, and thus improving the quality of the microneedle assembly 700.

[0061] In certain embodiments, the first microneedle through hole 220 includes a conical portion and a cylindrical portion, the large end of the conical portion is connected to the mating surface 210, the small end of the conical portion is connected to the cylindrical portion, and the conical portion and the cylindrical portion are coaxially arranged. It is understood that the first microneedle through hole 220 is funnel-shaped and includes two parts, the conical portion and the cylindrical portion. Exemplarily, the upper half of the first microneedle through hole 220 is the conical portion, the lower half is the cylindrical portion, and the conical portion and the cylindrical portion are coaxially arranged and connected; in addition, the large end of the conical portion is connected to the mating surface 210, and the small end of the conical portion is connected to the cylindrical portion.

[0062] To ensure accurate positioning of microneedle 800 within first microneedle through-hole 220, the diameter of the columnar portion is slightly greater than or equal to the diameter of microneedle 800. Furthermore, illustratively, the diameter of the small end of the tapered portion is equal to the diameter of the columnar portion, while the diameter of the large end of the tapered portion is greater than the diameter of the small end. It will be appreciated that when the tip of microneedle 800 is inserted into first microneedle through-hole 220, the large end of the tapered portion ensures that microneedle 800 can easily enter the columnar portion for positioning.

[0063] Continue to refer Figure 3 As shown, in some other embodiments, the assembly device further includes a microneedle limiting plate 300, which is disposed between the fixing seat 200 and the base 400, and a second microneedle through-hole 310 is disposed on the microneedle limiting plate 300, the position of the second microneedle through-hole 310 corresponding to the position of the first microneedle through-hole 220. Exemplarily, the lower surface of the microneedle limiting plate 300 contacts the upper surface of the base 400, and the upper surface of the microneedle limiting plate 300 contacts the lower surface of the fixing seat 200. In other words, the microneedle limiting plate 300 is located between the fixing seat 200 and the base 400, and the microneedle limiting plate 300 separates the fixing seat 200. In addition, exemplarily, the second microneedle through-hole 310 may be a cylindrical through-hole.

[0064] In some embodiments, the microneedle limiting plate 300 can be replaced by the circuit board 110 in the microneedle assembly 700 .

[0065] The base 400 is configured to receive the tip of the microneedle 800 after it sequentially passes through the microneedle placement hole 111, the first microneedle through-hole 220, and the second microneedle through-hole 310. Specifically, the tip of the microneedle 800 abuts against the base 400 after sequentially passing through the microneedle placement hole 111, the first microneedle through-hole 220, and the second microneedle through-hole 310. The assembly apparatus of these embodiments uses the microneedle placement hole 111, the first microneedle through-hole 220, and the second microneedle through-hole 310 to perform three-point positioning of the microneedle 800, ensuring that the microneedle 800 is perpendicular to the circuit board 110. This improves the assembly precision between the microneedle 800 and the circuit board 110, further enhancing the quality of the microneedle assembly 700.

[0066] In certain embodiments, the second microneedle through-hole 310 is tapered, with the larger end of the second microneedle through-hole 310 facing the fixing base 200 and the smaller end of the second microneedle through-hole 310 facing the base 400. It is understood that because the second microneedle through-hole 310 is tapered and the larger end of the second microneedle through-hole 310 faces the fixing base 200, even if the angle of the microneedle 800 deviates, the microneedle 800 can smoothly enter the second microneedle through-hole 310 for angle adjustment, ultimately ensuring that the microneedle 800 is perpendicular to the circuit board 110.

[0067] Continue to refer Figure 3 As shown, in some other embodiments, a groove 410 is provided on the side of the base 400 facing the fixing seat 200, and at least a portion of the microneedle limiting plate 300 is disposed in the groove 410, and a space is separated between the side surface of the microneedle limiting plate 300 away from the fixing seat 200 and the surface of the groove 410 facing the fixing seat 200. Exemplarily, a groove 410 is provided on the side of the base 400 facing the fixing seat 200, and the depth of the groove 410 is greater than the thickness of the microneedle limiting plate 300. When the microneedle limiting plate 300 is placed in the groove 410, a certain gap is formed between the upper surface of the microneedle limiting plate 300 and the fixing seat 200, thereby facilitating the microneedle limiting plate 300 to position the microneedles 800.

[0068] In addition, illustratively, when the microneedle limiting plate 300 is placed in the groove 410, there is a gap between the four sides of the microneedle limiting plate 300 and the sidewalls of the groove 410. Since there is a gap between the four sides of the microneedle limiting plate 300 and the sidewalls of the groove 410, when the microneedle 800 penetrates the second microneedle through-hole 310, under the action of the microneedle 800, the microneedle limiting plate 300 can be horizontally displaced to fine-tune the position. Exemplarily, a step 420 is provided at the bottom of the groove 410, and the microneedle limiting plate 300 is placed on the step 420 to reduce the contact area between the microneedle limiting plate 300 and the bottom wall of the groove 410, thereby reducing friction, which is conducive to the horizontal movement of the microneedle limiting plate 300 under the action of the microneedle 800.

[0069] Figure 6 yes Figure 2 Schematic diagram of the assembly device after removing the cover plate 600.

[0070] refer to Figure 6 as well as Figure 3As shown, in some embodiments, a magnetic member 500 is disposed on the side of the base 400 away from the fixing base 200. The magnetic member 500 is used to attract the microneedles 800 abutting against the base 400. This not only ensures the alignment of the tips of the microneedles 800, but also prevents the misalignment of the microneedles 800 during subsequent assembly, thereby improving the quality of the microneedle assembly 700. For example, the magnetic member 500 can be a single magnet or a separate magnet. It should be noted that the material of the microneedles 800 can be attracted by the magnetic member.

[0071] Continue to refer Figure 2 and Figure 4 As shown, the fixing base 200 is provided with a plurality of limiting portions 230, all of which are distributed on the mating surface 210. Each limiting portion 230 is provided with a limiting recess 231, and the limiting recess 231 is used to limit the position of the circuit board 110. Exemplarily, the limiting portions 230 are uniformly distributed along the edges of the mating surface 210, and the limiting recess 231 in the limiting portion 230 is used to limit the horizontal movement of the circuit board 110.

[0072] Figure 5 There are multiple Figure 2 Schematic diagram of the structure of the circuit board group composed of the circuit boards in .

[0073] refer to Figure 5 As shown, in some embodiments, the microneedle group 700 has a plurality of circuit boards 110 , and the circuit boards 110 in all the microneedle groups 700 form a circuit board group 100 ; the mating surface 210 is configured to place the circuit board group 100 .

[0074] It should be noted that during the production of circuit boards 110, circuit board assemblies 100 are first produced, and then each circuit board assembly 100 is separated into multiple circuit boards 110. In other words, circuit board assembly 100 comprises multiple circuit boards 110. To improve assembly efficiency when assembling multiple microneedle assemblies 700, the circuit board assembly 100 can be directly placed on the mating surface 210 of the fixing base 200. Microneedles 800 are then sequentially secured to each circuit board 110 in the circuit board assembly 100. After the microneedles 800 are assembled with the circuit boards 110, the multiple circuit boards 110 are separated.

[0075] Continue to refer Figure 2 and Figure 4 As shown, multiple limiting portions 230 are spaced apart and distributed on the edge of the mating surface 210, and the notches of the limiting recesses 231 on all limiting portions 230 are facing the middle area of ​​the mating surface 210. The edges of the circuit board group 100 are placed in all limiting recesses 231 to position the circuit board group 100.

[0076] In addition, continue to refer to Figure 2 and Figure 4As shown, a plurality of support protrusions 240 are arranged at intervals on the mating surface 210. The support protrusions 240 are configured to contact the edge area of ​​the circuit board 110 when the circuit board 110 is placed on the mating surface 210 to support the circuit board 110. The edge area is arranged around the periphery of the area formed by the plurality of microneedle setting holes 111, thereby forming a gap between the circuit board 110 and the surface of the fixing seat 200, which can ensure that the microneedle setting hole 111 of each circuit board 110 together with the first microneedle through hole 220 and the second microneedle through hole 310 can perform three-point positioning of the microneedle 800.

[0077] It is understood that the multiple support protrusions 240 can also be used to support the circuit board assembly 100. In other words, the mating surface 210 is provided with multiple support protrusions 240, and the multiple support protrusions 240 are evenly distributed on the mating surface 210 of the fixing base 200. The circuit board assembly 100 is placed on the support protrusions 240 to form a gap between the circuit board assembly 100 and the surface of the fixing base 200. This can ensure that the microneedle setting hole 111 of each circuit board 110, together with the first microneedle through hole 220 and the second microneedle through hole 310, can achieve three-point positioning of the microneedle 800.

[0078] Continue to refer Figure 2 and Figure 4 As shown, the support protrusion 240 includes a support column 241, a first support block 242, and a second support block 243. There are multiple support columns 241, first support blocks 242, and second support blocks 243, and the multiple support columns 241, multiple first support blocks 242, and multiple second support blocks 243 are used to support the circuit board 110 or the circuit board assembly 100.

[0079] For example, when the circuit board assembly 100 includes at least two rows of circuit boards 110, the plurality of support columns 241 are spaced apart along the extending direction of each row of circuit boards 110 to support the circuit board assembly 100. The plurality of first support blocks 242 are spaced apart in the middle region of the mating surface 210 to support the middle portion of the circuit board assembly 100.

[0080] Furthermore, second support blocks 243 are spaced between support pillars 241 and first support blocks 242 to support circuit board assembly 100. A barrier space is formed between two adjacent second support blocks 243. Because the second support blocks 243 block the flow of heat, they help maintain the heat of holder 200 during the welding process between microneedles 800 and circuit board 110, thereby improving the welding quality.

[0081] In certain embodiments, the assembly device of the microneedle assembly further includes a cover plate 600. The cover plate 600 is disposed on a side of the base 400 away from the fixing base 200 and is used to fix the magnetic member 500 in the base 400. Exemplarily, the magnetic member 500 is a magnet, and the cover plate 600 fixes the magnet in the base 400.

[0082] In some other embodiments, the base 400 has a cavity for placing the magnetic member 500, and an opening is provided on the side of the base 400, which is connected to the cavity, so that the magnetic member 500 is placed in the cavity through the opening.

[0083] In a second aspect, an embodiment of the present application provides a method for assembling a microneedle assembly, wherein the microneedle assembly assembly device of the first aspect is used to assemble the microneedles 800 and the circuit board 110, comprising:

[0084] The circuit board 110 is placed on the fixing base 200 , and the limiting portion 230 on the fixing base 200 limits the movement of the circuit board 110 ;

[0085] The tip of the microneedle 800 is sequentially passed through the microneedle setting hole 111 on the circuit board 110 and the first microneedle through-hole 220 on the fixing seat 200, and abuts against the base 400;

[0086] Solder paste is placed on the microneedle setting hole 111, and the microneedle setting hole 111 of the circuit board 110 and the microneedle 800 are covered with solder paste;

[0087] The microneedles 800 are welded to the circuit board 110 using welding equipment, thereby completing the assembly of the microneedle assembly 700 .

[0088] It is easy to understand that those skilled in the art can combine, split, reorganize, etc. the embodiments of the present application based on the several embodiments provided in the present application to obtain other embodiments, and these embodiments do not exceed the scope of protection of the present application.

[0089] The above specific implementation methods further explain in detail the purpose, technical solutions and beneficial effects of the embodiments of the present application. It should be understood that the above are only specific implementation methods of the embodiments of the present application and are not intended to limit the scope of protection of the embodiments of the present application. Any modifications, equivalent replacements, improvements, etc. made on the basis of the technical solutions of the embodiments of the present application should be included in the scope of protection of the embodiments of the present application.

Claims

1. A microneedle assembly device, wherein the microneedle assembly (700) comprises microneedles (800) and a circuit board (110), wherein the circuit board (110) is provided with a microneedle setting hole (111), and a portion of the microneedle (800) is set in the microneedle setting hole (111), characterized in that: The assembly device comprises: A fixing seat (200), the fixing seat (200) having a mating surface (210), the mating surface (210) being used to place the circuit board (110), the fixing seat (200) being provided with a first microneedle through-hole (220), the first microneedle through-hole (220) vertically penetrating the fixing seat (200) along the thickness direction of the fixing seat (200), the first microneedle through-hole (220) being configured to correspond to the position of the microneedle setting hole (111) when the circuit board (110) is placed on the mating surface (210); a base (400), the base (400) being arranged on a side of the fixing seat (200) away from the mating surface (210), the base (400) being configured to resist one end of the microneedle (800) after the microneedle (800) passes through the microneedle setting hole (111) and the first microneedle through hole (220) in sequence; The assembly device further comprises a microneedle limiting plate (300), the microneedle limiting plate (300) being arranged between the fixing seat (200) and the base (400), the microneedle limiting plate (300) being provided with a second microneedle through hole (310), the position of the second microneedle through hole (310) corresponding to the position of the first microneedle through hole (220); The base (400) is configured to resist one end of the microneedle (800) after the microneedle (800) passes through the microneedle setting hole (111), the first microneedle through hole (220) and the second microneedle through hole (310) in sequence.

2. The microneedle assembly assembly device according to claim 1, characterized in that: The first microneedle through hole (220) includes a conical portion and a columnar portion, the large end of the conical portion is connected to the matching surface (210), the small end of the conical portion is connected to the columnar portion, and the conical portion and the columnar portion are coaxially arranged.

3. The microneedle assembly assembly device according to claim 1, characterized in that: The second microneedle through hole (310) is tapered, with the large end of the second microneedle through hole (310) facing the fixing seat (200) and the small end of the second microneedle through hole (310) facing the base (400).

4. The microneedle assembly assembly device according to claim 1, characterized in that: A groove (410) is provided on a side of the base (400) facing the fixing seat (200), at least a portion of the microneedle limiting plate (300) is arranged in the groove (410), and a space is provided between a side surface of the microneedle limiting plate (300) away from the fixing seat (200) and a surface of the groove (410) facing the fixing seat (200).

5. The microneedle assembly assembly device according to claim 1, characterized in that: A magnetic member (500) is provided on a side of the base (400) away from the fixing seat (200), and the magnetic member (500) is used to attract the microneedle (800) that is pressed against the base (400).

6. The microneedle assembly assembly device according to any one of claims 1 to 5, characterized in that: A plurality of limiting portions (230) are provided on the fixing seat (200), all of the limiting portions (230) are distributed on the mating surface (210), and each limiting portion (230) is provided with a limiting recess (231), and the limiting recess (231) is used to limit the circuit board (110).

7. The microneedle assembly assembly device according to claim 6, characterized in that: The microneedle group (700) has a plurality of circuit boards (110) in the plurality of microneedle groups (700) forming a circuit board group (100); the mating surface (210) is configured to place the circuit board group (100); A plurality of the limiting portions (230) are spaced apart and distributed on the edge of the mating surface (210); the notches of the limiting recesses (231) on all the limiting portions (230) face the middle area of ​​the mating surface (210); and the edges of the circuit board assembly (100) are arranged in all the limiting recesses (231).

8. The microneedle assembly assembly device according to claim 6, characterized in that: A plurality of spaced support protrusions (240) are provided on the mating surface (210), and the support protrusions (240) are configured to contact an edge area of ​​the circuit board (110) when the circuit board (110) is placed on the mating surface (210) to support the circuit board (110), wherein the edge area is arranged around the periphery of an area formed by the plurality of microneedle setting holes (111).

9. A method for assembling a microneedle assembly, characterized in that: Assembling a microneedle (800) and a circuit board (110) using the microneedle assembly assembly device according to any one of claims 1 to 5, comprising: placing the circuit board (110) on a fixing seat (200) in the assembly device; The microneedle (800) is sequentially passed through the microneedle setting hole (111) on the circuit board (110) and the first microneedle through hole (220) in the fixing seat (200), so that the end of the microneedle (800) abuts against the base (400); Setting solder paste at the microneedle setting hole (111) in the circuit board (110); The microneedles (800) are welded onto the circuit board (110) using welding equipment.

Images