A high-resilience adsorbing pad and a preparation method thereof

Abstract

The application discloses a kind of adsorption pad with high resilience and preparation method, belong to adsorption pad technical field.The application of a kind of adsorption pad with high resilience, including substrate, adsorption layer and protective film, the upper surface of substrate is adhered with adsorption layer by adhesive layer, the upper surface of adsorption layer is adhered with protective film, the adsorption layer includes foaming layer, support layer and support piece, the lower surface of support layer is arrayed with support piece.The application solves the problem of low overall compression resilience of existing adsorption pad, the application proposes a kind of adsorption pad with high resilience and preparation method, water drop-shaped porous structure is provided on foaming layer, so that foaming layer can have greater compression rate and adsorption capacity, foaming layer is wrapped with support piece, foaming layer material is provided between spiral blade, foaming layer improves compression rate, and foaming layer after compression can be supported under the support of spiral blade and support column, realize fast resilience.

Description

Technical Field

[0001] This invention relates to the field of adsorption pad technology, specifically to an adsorption pad with high resilience and its preparation method. Background Technology

[0002] In the processing of semiconductor materials, silicon wafers, sapphire, and gallium arsenide, as the basic materials for commonly used semiconductor devices and integrated circuits, often require polishing. The quality of the polishing technique directly affects the surface quality of silicon wafers, sapphire, and gallium arsenide, and the performance of semiconductor devices. Adsorption pads are undoubtedly required during the polishing process.

[0003] Chinese patent publication number CN210650152U discloses an adsorption pad, which includes an adhesive layer and an adsorption layer connected together. The adhesive layer and the adsorption layer are made of TPU material. The sum of the thicknesses of the adhesive layer and the adsorption layer is less than or equal to 0.6 mm, and the thickness of the adhesive layer is less than or equal to 0.15 mm.

[0004] This invention, by incorporating an adhesive layer and an adsorption layer connected together, and designing the adsorption layer for adsorbing the back of the product to be made of TPU material, minimizes the pores in the adsorption layer, resulting in good dimensional uniformity and adsorption capacity, thus leading to more uniform product grinding. However, the reduced pores in this invention relatively decrease the adsorption capacity of the adsorption pad, and the overall compression resilience of the adsorption pad is low, making it prone to creases and resulting in a short service life. Summary of the Invention

[0005] The purpose of this invention is to provide an adsorption pad with high resilience and its preparation method. By setting a teardrop-shaped porous structure on the foam layer, the foam layer can have a large compressibility and adsorption capacity. The foam layer wraps the support, and the foam layer material is set between the spiral blades. The foam layer increases the compressibility, and the spiral blades drive the foam layer to rebound, thus solving the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an absorbent pad with high resilience, comprising a base layer, an absorbent layer, and a protective film. The absorbent layer is bonded to the upper surface of the base layer via an adhesive layer, and the protective film is bonded to the upper surface of the absorbent layer. The absorbent layer comprises a foam layer, a support layer, and support members. Support members are arranged in an array on the lower surface of the support layer. The upper surface of the foam layer is connected to the lower surface of the support layer, and the foam layer encapsulates the support members. The support layer is made of the following materials in parts by weight: 20-40 parts of elastomer-toughened epoxy resin, 10-15 parts of styrene-butadiene rubber, 1-2 parts of antistatic agent, 3-6 parts of flame retardant, and 2-5 parts of coupling agent. The support members 23 are made of the following materials in parts by weight: 20-30 parts of elastomer-toughened epoxy resin, 10-15 parts of styrene-butadiene rubber, 5-10 parts of pig bristles, 1-2 parts of antistatic agent, 3-6 parts of flame retardant, and 2-5 parts of coupling agent.

[0007] Preferably, the foam layer has a teardrop-shaped porous structure, and the foam layer has an array of engaging holes that match the support member.

[0008] Preferably, the foamed layer is made of the following materials in parts by weight: 30-40 parts toluene diisocyanate, 20-30 parts polyether glycol, 1-3 parts leveling agent, 1-2 parts surfactant and 2-5 parts chain extender.

[0009] Preferably, the support member includes helical blades and a support column. The helical blades are distributed in a ring at equal intervals on the outer wall of the support column, and both the helical blades and the support column engage with the engagement holes.

[0010] Preferably, the upper end of the support column is provided with an adsorption hole that penetrates the support layer.

[0011] Preferably, the support layer has dense holes that penetrate the support layer, the diameter of the dense holes is less than 0.2 mm, and the spacing between the dense holes is less than 5 mm.

[0012] Preferably, the base layer is made of the following raw materials in parts by weight: 20-30 parts nylon fiber, 15-25 parts spandex fiber, and 20-30 parts aramid fiber.

[0013] Another technical problem to be solved by the present invention is to provide a method for preparing an absorbent pad with high resilience, comprising the following steps:

[0014] S1: Prepare the base layer by taking nylon fiber, spandex fiber and aramid fiber materials with a diameter of 0.01-0.015mm and weaving them with a warp density and a weft density of 40 yarns / cm to make base layer 1;

[0015] S2: Preparation of the adsorption layer,

[0016] S21: Toluene diisocyanate and polyether glycol are dehydrated and then added to a reaction vessel. Under a dry nitrogen atmosphere, the mixture is stirred for 10-15 minutes at a speed of 100-120 r / min and a temperature of 30℃. After stirring, it is ultrasonically dispersed at a frequency of 30-50 kHz for 20-30 minutes to obtain a premix. At a speed of 600-800 r / min and a room temperature, a leveling agent, a surfactant, a chain extender, and a catalyst are added to the premix in sequence and stirred for 5-10 minutes to obtain a polyurethane foaming stock solution.

[0017] S22: Spray polyurethane foaming liquid into the mold, use a spraying device to evenly spray deionized water onto the polyurethane foaming liquid, and then dry and demold to obtain a foamed layer with interlocking holes.

[0018] S23: The foam layer is loaded into the mold, the support material is processed and mixed, and then poured into the locking holes of the foam layer;

[0019] S24: Mix the materials of the support layer, lay the mixed materials of the support layer on the upper surface of the foam layer, and close the mold. The upper mold forms adsorption holes and dense holes on the support layer and the support component. Put the whole into the curing device for drying and curing to make the adsorption layer.

[0020] S3: Prepare a protective film by spraying polyurethane foam raw liquid onto the support component, uniformly spraying deionized water onto the polyurethane foam raw liquid, and then drying and demolding to form a protective film.

[0021] S4: Prepare the adsorption pad.

[0022] S41: Preheat the adhesive material of the bonding layer for 1-2 hours to make the adhesive material flow into a liquid state;

[0023] S42: The flowing colloidal material is uniformly coated onto the surface of the substrate layer, while the prepared adsorption layer is adhered to the colloidal material on the surface of the substrate layer, and another layer of colloidal material is coated on the upper surface of the adsorption layer for bonding.

[0024] S43: Put the whole thing into a curing device for drying and curing to make an adsorption pad.

[0025] Preferably, the mixing of the support material after treatment in step S23 is as follows:

[0026] S231: Crush and sieve the pig bristles so that the particles of the pig bristle powder are less than 200 mesh;

[0027] S232: Add elastomer-toughened epoxy resin and styrene-butadiene rubber to a reactor, heat to above 90°C and maintain the temperature, disperse at 500 r / min for 15-20 min to obtain a preliminary mixed material;

[0028] S233: Add flame retardant, antistatic agent and coupling agent to the preliminary mixture, continue stirring for 10-25 minutes at a speed of 800 r / min, add pig bristle powder to the reaction vessel and stir to obtain a deeply mixed material, continue stirring for 20-30 minutes.

[0029] Preferably, the adhesive material of the bonding layer is one of TPU hot melt adhesive, EVA hot melt adhesive, PO hot melt adhesive, PU hot melt adhesive, epoxy structural adhesive or polyurethane adhesive.

[0030] Compared with the prior art, the beneficial effects of the present invention are:

[0031] 1. The adsorption layer of the present invention includes a foamed layer, a support layer and a support member. The support layer and the support member are made of elastomer-toughened epoxy resin material, which makes the support layer and the support member themselves have greater resilience. At the same time, the support layer is more compact than the foamed layer and the compressibility of the support layer is lower than that of the foamed layer. When the protective film adsorbs semiconductor materials, the support layer plays a good supporting role for the protective film, avoiding excessive local suction force and causing uneven local stress on the adsorbed semiconductor material.

[0032] 2. The foam layer of this invention is provided with a teardrop-shaped porous structure, which enables the foam layer to have a large compressibility and adsorption capacity. The foam layer wraps the support component, and the foam layer material is provided between the spiral blades. The foam layer increases the compressibility, while the spiral blades drive the foam layer to rebound. The support component is made of elastomer-toughened epoxy resin and pig bristle material, which itself has a high resilience. In addition, the spiral structure of the spiral blades themselves allows the compressed foam layer to rebound quickly under the support of the spiral blades and the support column.

[0033] 3. The upper end of the support column of the present invention is provided with an adsorption hole, which penetrates the support layer. The adsorption force of the adsorption hole is dispersed by the protective film to avoid the concentration of adsorption force. At the same time, the adsorption hole facilitates the entry of air, which can drive the support column to rebound and realize the rebound of the entire adsorption pad. Attached Figure Description

[0034] Figure 1 This is a layer diagram of the adsorption pad of the present invention;

[0035] Figure 2 This is an exploded view of the adsorption pad of the present invention;

[0036] Figure 3 This is a partial cross-sectional view of the adsorption pad of the present invention;

[0037] Figure 4 This is a structural diagram of the support component of the present invention.

[0038] In the figure: 1. Base layer; 2. Adsorption layer; 21. Foaming layer; 211. Engagement hole; 22. Support layer; 23. Support component; 231. Spiral blade; 232. Support column; 2321. Adsorption hole; 3. Protective film. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] Example 1:

[0041] To address the issues of poor adsorption capacity, low overall compression resilience, crease formation, and short lifespan of existing adsorption pads, please refer to [link / reference needed]. Figures 1-4 This embodiment provides the following technical solution:

[0042] An absorbent pad with high resilience includes a base layer 1, an absorbent layer 2, and a protective film 3. The upper surface of the base layer 1 is bonded to the absorbent layer 2 via an adhesive layer, and the upper surface of the absorbent layer 2 is bonded to the protective film 3. The absorbent layer 2 includes a foam layer 21, a support layer 22, and support members 23. The lower surface of the support layer 22 has support members 23 distributed in an array. The upper surface of the foam layer 21 is connected to the lower surface of the support layer 22, and the foam layer 21 wraps around the support members 23.

[0043] The foam layer 21 has a teardrop-shaped porous structure, and the foam layer 21 has an array of engaging holes 211 that match the support member 23.

[0044] The support layer 22 has dense holes that penetrate the support layer 22. The diameter of the dense holes is less than 0.2 mm and the spacing between the dense holes is less than 5 mm.

[0045] Specifically, dense holes are formed in the support layer 22. These holes allow gas to pass through, accelerating the rebound of the support layer 22 and enabling gas flow between the foam layer 21 and the support layer 22.

[0046] The support member 23 includes a helical blade 231 and a support column 232. The helical blades 231 are distributed in a ring at equal intervals on the outer wall of the support column 232. Both the helical blades 231 and the support column 232 are engaged with the engagement hole 211.

[0047] Specifically, the spiral blades 231 engage with the locking holes 211, and a foam layer 21 is provided between the spiral blades 231, so that the foam layer 21 is tightly connected with the support member 23. At the same time, the compression ratio of the foam layer 21 is greater, and the rebound rate of the spiral blades 231 and the support column 232 is higher. The compressed foam layer 21 can achieve rapid rebound under the support of the spiral blades 231 and the support column 232.

[0048] An adsorption hole 2321 is provided at the upper end of the support column 232, and the adsorption hole 2321 penetrates the support layer 22.

[0049] Specifically, the adsorption force of the adsorption layer 2 is improved by adsorption pores 2321. When the adsorption pores 2321 are pressurized, the air inside the adsorption pores 2321 is discharged, and a negative pressure is generated inside the adsorption pores 2321 to improve the adsorption force.

[0050] The base layer 1 is made of the following raw materials in parts by weight: 20 parts nylon fiber, 15 parts spandex fiber, and 30 parts aramid fiber.

[0051] The foam layer 21 is made of the following materials in parts by weight: 30 parts toluene diisocyanate, 30 parts polyether glycol, 1 part leveling agent, 1 part surfactant, and 2 parts chain extender;

[0052] The support layer 22 is made of the following materials in parts by weight: 40 parts of elastomer-toughened epoxy resin, 15 parts of styrene-butadiene rubber, 1 part of antistatic agent, 3 parts of flame retardant, and 2 parts of coupling agent.

[0053] The support component 23 is made of the following materials in parts by weight: 30 parts of elastomer toughened epoxy resin, 10 parts of styrene-butadiene rubber, 10 parts of pig bristles, 1 part of antistatic agent, 3 parts of flame retardant, and 2 parts of coupling agent.

[0054] The adhesive material for the bonding layer is TPU hot melt adhesive.

[0055] The protective film 3 is made of the same material as the foam layer 21, and the protective film 3 also has a teardrop-shaped porous structure. However, the spacing between the teardrop-shaped holes on the protective film 3 is greater than that on the foam layer 21, and the diameter of the teardrop-shaped holes on the protective film 3 is smaller than that on the foam layer 21. As a result, the protective film 3 is more compact and has a lower compression ratio than the foam layer 21, which avoids excessive deformation of the protective film 3, especially excessive local deformation, which would cause uneven stress on the adsorbed semiconductor material.

[0056] To better demonstrate the preparation process of a high-resilience adsorption pad, this embodiment proposes a method for preparing a high-resilience adsorption pad, including the following steps:

[0057] S1: Prepare the base layer 1 by taking nylon fiber, spandex fiber and aramid fiber materials with a diameter of 0.01-0.015mm and weaving them with a warp density and a weft density of 40 yarns / cm to make the base layer 1;

[0058] S2: Prepare adsorption layer 2.

[0059] S21: Toluene diisocyanate and polyether glycol are dehydrated and then added to a reaction vessel. Under a dry nitrogen atmosphere, the mixture is stirred for 15 minutes at a speed of 120 r / min and a temperature of 30℃. After stirring, it is ultrasonically dispersed at a frequency of 30-50 kHz for 20 minutes to obtain a premix. Leveling agent, surfactant, chain extender and catalyst are added to the premix in sequence at a speed of 600 r / min and a room temperature. The mixture is stirred for 10 minutes to obtain polyurethane foam stock solution.

[0060] S22: Spray polyurethane foaming liquid into the mold, use a spraying device to evenly spray deionized water onto the polyurethane foaming liquid, and then dry and demold to obtain a foamed layer 21 with interlocking holes 211.

[0061] S23: The foam layer 21 is loaded into the mold, and the material of the support 23 is mixed after processing and poured into the locking hole 211 of the foam layer 21.

[0062] S24: Mix the material of the support layer 22 and lay the mixed material of the support layer 22 on the upper surface of the foam layer 21, and close the mold. The upper mold forms adsorption holes 2321 and dense holes on the support layer 22 and the support member 23. Put the whole into the curing device for drying and curing to make the adsorption layer 2.

[0063] S3: Prepare protective film 3 by spraying polyurethane foam raw liquid onto support 23, uniformly spraying deionized water onto polyurethane foam raw liquid, and then drying and demolding to form protective film 3.

[0064] S4: Prepare the adsorption pad.

[0065] S41: Preheat the adhesive material of the bonding layer for 1-2 hours to make the adhesive material flow into a liquid state;

[0066] S42: The flowing colloidal material is uniformly coated onto the surface of the substrate layer 1, while the prepared adsorption layer 2 is adhered to the colloidal material on the surface of the substrate layer 1, and another layer of colloidal material is coated on the upper surface of the adsorption layer 2 for bonding.

[0067] S43: Put the whole thing into a curing device for drying and curing to make an adsorption pad.

[0068] Preferably, the mixing of the material of the support member 23 after treatment in step S23 is as follows:

[0069] S231: Crush and sieve the pig bristles so that the particles of the pig bristle powder are less than 200 mesh;

[0070] S232: Add elastomer-toughened epoxy resin and styrene-butadiene rubber to a reactor, heat to above 90°C and maintain the temperature, disperse at 500 r / min for 15-20 min to obtain a preliminary mixed material;

[0071] S233: Add flame retardant, antistatic agent and coupling agent to the preliminary mixture, continue stirring for 25 minutes at a speed of 800 r / min, add pig bristle powder to the reaction vessel and stir to obtain a deeply mixed material, continue stirring for 20-30 minutes;

[0072] Example 2:

[0073] In this embodiment, the base layer 1 is made of the following raw materials in parts by weight: 20 parts nylon fiber, 15 parts spandex fiber, and 30 parts aramid fiber.

[0074] The foam layer 21 is made of the following materials in parts by weight: 30 parts toluene diisocyanate, 30 parts polyether glycol, 1 part leveling agent, 1 part surfactant, and 2 parts chain extender;

[0075] The support layer 22 is made of the following materials in parts by weight: 40 parts of elastomer-toughened epoxy resin, 15 parts of styrene-butadiene rubber, 1 part of antistatic agent, 3 parts of flame retardant, and 2 parts of coupling agent.

[0076] The support component 23 is made of the following materials in parts by weight: 30 parts of elastomer-toughened epoxy resin, 10 parts of styrene-butadiene rubber, 5 parts of pig bristles, 1 part of antistatic agent, 3 parts of flame retardant, and 2 parts of coupling agent.

[0077] The adhesive material for the bonding layer is TPU hot melt adhesive.

[0078] The protective film 3 is made of the same material as the foam layer 21, and the adsorption pad is prepared using the method of Example 1.

[0079] Example 3:

[0080] In this embodiment, the base layer 1 is made of the following raw materials in parts by weight: 20 parts nylon fiber, 15 parts spandex fiber, and 30 parts aramid fiber.

[0081] The foam layer 21 is made of the following materials in parts by weight: 30 parts toluene diisocyanate, 30 parts polyether glycol, 1 part leveling agent, 1 part surfactant, and 2 parts chain extender;

[0082] The support layer 22 is made of the following materials in parts by weight: 40 parts of elastomer-toughened epoxy resin, 15 parts of styrene-butadiene rubber, 1 part of antistatic agent, 3 parts of flame retardant, and 2 parts of coupling agent.

[0083] The support component 23 is made of the following materials in parts by weight: 20 parts of elastomer toughened epoxy resin, 10 parts of styrene-butadiene rubber, 10 parts of pig bristles, 1 part of antistatic agent, 3 parts of flame retardant, and 2 parts of coupling agent.

[0084] The adhesive material for the bonding layer is TPU hot melt adhesive.

[0085] The protective film 3 is made of the same material as the foam layer 21, and the adsorption pad is prepared using the method of Example 1.

[0086] Example 4:

[0087] In this embodiment, the base layer 1 is made of the following raw materials in parts by weight: 20 parts nylon fiber, 15 parts spandex fiber, and 30 parts aramid fiber.

[0088] The foam layer 21 is made of the following materials in parts by weight: 30 parts toluene diisocyanate, 30 parts polyether glycol, 1 part leveling agent, 1 part surfactant, and 2 parts chain extender;

[0089] The support layer 22 is made of the following materials in parts by weight: 40 parts of elastomer-toughened epoxy resin, 15 parts of styrene-butadiene rubber, 1 part of antistatic agent, 3 parts of flame retardant, and 2 parts of coupling agent.

[0090] The support component 23 is made of the following materials in parts by weight: 20 parts of elastomer toughened epoxy resin, 10 parts of styrene-butadiene rubber, 5 parts of pig bristles, 1 part of antistatic agent, 3 parts of flame retardant, and 2 parts of coupling agent.

[0091] The adhesive material for the bonding layer is TPU hot melt adhesive.

[0092] The protective film 3 is made of the same material as the foam layer 21, and the adsorption pad is prepared using the method of Example 1.

[0093] Comparative Example 1:

[0094] In this comparative example, the base layer 1 is made of the following raw materials in parts by weight: 20 parts nylon fiber, 15 parts spandex fiber, and 30 parts aramid fiber.

[0095] The foam layer 21 is made of the following materials in parts by weight: 30 parts toluene diisocyanate, 30 parts polyether glycol, 1 part leveling agent, 1 part surfactant, and 2 parts chain extender;

[0096] The support layer 22 is made of the following materials in parts by weight: 40 parts of elastomer-toughened epoxy resin, 15 parts of styrene-butadiene rubber, 1 part of antistatic agent, 3 parts of flame retardant, and 2 parts of coupling agent.

[0097] The support component 23 is made of the following materials in parts by weight: 30 parts of elastomer-toughened epoxy resin, 10 parts of styrene-butadiene rubber, 1 part of antistatic agent, 3 parts of flame retardant, and 2 parts of coupling agent.

[0098] The adhesive material of the bonding layer is TPU hot melt adhesive; the material of the protective film 3 is the same as that of the foam layer 21, and the absorbent pad is prepared using the method in Example 1.

[0099] Comparative Example 2:

[0100] The base layer 1 is made of the following raw materials in parts by weight: 20 parts nylon fiber, 15 parts spandex fiber, and 30 parts aramid fiber.

[0101] The foam layer 21 is made of the following materials in parts by weight: 30 parts toluene diisocyanate, 30 parts polyether glycol, 1 part leveling agent, 1 part surfactant, and 2 parts chain extender;

[0102] The support layer 22 is made of the following materials in parts by weight: 40 parts of elastomer-toughened epoxy resin, 15 parts of styrene-butadiene rubber, 1 part of antistatic agent, 3 parts of flame retardant, and 2 parts of coupling agent.

[0103] The adhesive material of the bonding layer is TPU hot melt adhesive, and the material of the protective film 3 is the same as that of the foam layer 21. The adsorption pad is prepared using the method in Example 1.

[0104] Compared with Example 1, Example 2 reduces the proportion of pig bristles. Compared with Example 1, Example 3 reduces the proportion of elastomer-toughened epoxy resin in support member 23. Compared with Example 1, Example 4 reduces the proportion of both pig bristles and elastomer-toughened epoxy resin in support member 23.

[0105] In Comparative Example 1, no pig bristle component was used; in Comparative Example 2, no support structure 23 was used.

[0106] The adsorption pads prepared in the above embodiments and comparative examples were subjected to performance tests, and the following data were obtained:

[0107] Example 1 Example 2 Example 3 Example 4 Comparative Example 1 Comparative Example 2 Adsorption rate (N) 13 13 13 13 13 11 Compression ratio (%) 30 29 28 27 32 31 Compression rebound rate (%) 96 95 94 92 90 72

[0108] Based on the above data, it can be concluded that the adsorption pad prepared in Example 1 has higher adsorption rate, compression rate, and compression rebound rate than other examples and comparative examples. In Example 2, the proportion of pig bristles was reduced, and the adsorption pad prepared in Example 2 had lower adsorption rate, compression rate, and compression rebound rate than Example 1. In Example 3, due to the reduction in the proportion of elastomer-toughened epoxy resin, the adsorption pad prepared with paint also had lower adsorption rate, compression rate, and compression rebound rate than Example 1. Especially in Example 4, the reduction in both pig bristles and elastomer-toughened epoxy resin significantly reduced the adsorption rate, compression rate, and compression rebound rate of the adsorption pad prepared in Example 4. It can be seen that the elastomer-toughened epoxy resin and pig bristles can improve the rebound rate of the adsorption pad. In Comparative Examples 1 and 2, the compression rebound rate was reduced to a greater extent. It can be seen that the support member 23 structure plays a significant role in the rebound rate, and the pig bristles and elastomer-toughened epoxy resin improve the elasticity of the support member 23 itself.

[0109] In summary, this invention proposes an adsorption pad with high resilience and its preparation method. The adsorption layer 2 includes a foamed layer 21, a support layer 22, and a support member 23. The support layer 22 and the support member 23 are made of elastomer-toughened epoxy resin material, giving them high resilience. Simultaneously, the support layer 22 is more compact than the foamed layer 21, and its compressibility is lower. When the protective film 3 adsorbs semiconductor materials, the support layer 22 provides good support, preventing excessive local suction and uneven stress on the adsorbed semiconductor material. The foamed layer 21 has a teardrop-shaped porous structure, enabling it to have a high compressibility and adsorption capacity. The foamed layer 21 supports the support member 23. The 3-layer package includes a foam layer 21 between the spiral blades 231. The foam layer 21 increases the compression ratio, while the spiral blades 231 cause the foam layer 21 to rebound. The support member 23 is made of elastomer-toughened epoxy resin and pig bristle material, which has a high rebound rate. Combined with the spiral structure of the spiral blades 231, the compressed foam layer 21 can rebound quickly under the support of the spiral blades 231 and the support column 232. The upper end of the support column 232 is provided with an adsorption hole 2321, which penetrates the support layer 22. The adsorption force of the adsorption hole 2321 is dispersed by the protective film 3 to avoid the concentration of adsorption force. At the same time, the adsorption hole 2321 facilitates the entry of air, which can drive the support column 232 to rebound, thus realizing the rebound of the entire adsorption pad.

[0110] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0111] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An absorbent pad with high resilience, comprising a base layer (1), an absorbent layer (2), and a protective film (3), characterized in that: An adsorption layer (2) is bonded to the upper surface of the base layer (1) via an adhesive layer. A protective film (3) is bonded to the upper surface of the adsorption layer (2). The adsorption layer (2) includes a foam layer (21), a support layer (22), and a support member (23). The support member (23) is arranged in an array on the lower surface of the support layer (22). The upper surface of the foam layer (21) is connected to the lower surface of the support layer (22), and the foam layer (21) wraps around the support member (23). The foam layer (21) is provided with a teardrop-shaped porous structure, and the foam layer (21) is provided with an array of engaging holes (211) that match the support member (23). The support member (23) includes a spiral blade (231) and a support column (232). The outer wall of the support column (232) is provided with spiral blades (231) distributed in a ring at equal intervals. Both the spiral blades (231) and the support column (232) engage with the engaging holes (211). The support layer (22) is made of the following materials in parts by weight: 20-40 parts of elastomer-toughened epoxy resin, 10-15 parts of styrene-butadiene rubber, 1-2 parts of antistatic agent, 3-6 parts of flame retardant, and 2-5 parts of coupling agent; the support component (23) is made of the following materials in parts by weight: 20-30 parts of elastomer-toughened epoxy resin, 10-15 parts of styrene-butadiene rubber, 5-10 parts of pig bristles, 1-2 parts of antistatic agent, 3-6 parts of flame retardant, and 2-5 parts of coupling agent.

2. The high resilience absorbent pad according to claim 1, characterized in that: The foamed layer (21) is made of the following materials in parts by weight: 30-40 parts toluene diisocyanate, 20-30 parts polyether glycol, 1-3 parts leveling agent, 1-2 parts surfactant and 2-5 parts chain extender.

3. The high resilience absorbent pad according to claim 2, characterized in that: The upper end of the support column (232) is provided with an adsorption hole (2321), which penetrates the support layer (22).

4. The high resilience absorbent pad according to claim 3, characterized in that: The support layer (22) has dense holes that penetrate the support layer (22), the diameter of the dense holes is less than 0.2 mm, and the spacing between the dense holes is less than 5 mm.

5. The high resilience absorbent pad according to claim 4, characterized in that: The base layer (1) is made of the following raw materials in parts by weight: 20-30 parts nylon fiber, 15-25 parts spandex fiber, and 20-30 parts aramid fiber.

6. A method for preparing an absorbent pad with high resilience as described in claim 5, characterized in that, Includes the following steps: S1: Prepare the base layer (1). Take nylon fiber, spandex fiber and aramid fiber materials with a diameter of 0.01-0.015mm and weave them with a warp density and a weft density of 40 yarns / cm to make the base layer (1); S2: Prepare the adsorption layer (2); S21: Dehydrate toluene diisocyanate and polyether glycol, add them to the reaction vessel after treatment, stir for 10-15 minutes under a dry nitrogen atmosphere, a rotation speed of 100-120r / min and a temperature of 30℃, and then stir at a frequency of 30 S22: The polyurethane foaming stock solution is obtained by ultrasonic dispersion at -50kHz for 20-30 min. The premixed solution is then added sequentially to the premixed solution at a speed of 600-800 r / min and room temperature. The mixture is stirred for 5-10 min to obtain the polyurethane foaming stock solution. S23: The polyurethane foaming stock solution is sprayed into the mold. Deionized water is sprayed evenly onto the polyurethane foaming stock solution using a spraying device. After drying and demolding, a foamed layer (21) with interlocking holes (211) is obtained. (21) The material of the support component (23) is mixed after being processed and poured into the locking hole (211) of the foam layer (21) after being loaded into the mold; S24: The material of the support layer (22) is mixed and the mixed material of the support layer (22) is laid on the upper surface of the foam layer (21), and the mold is closed. The upper mold forms adsorption holes (2321) and dense holes on the support layer (22) and the support component (23). The whole thing is put into the curing device for drying and curing to make the adsorption layer (2); S3: Prepare the protective film (3), polymerize The polyurethane foaming liquid is sprayed onto the support (23), and deionized water is sprayed evenly onto the polyurethane foaming liquid. After drying and demolding, a protective film (3) is made. S4: Prepare the adsorption pad. S41: Preheat the adhesive material of the bonding layer for 1-2 hours to make the adhesive material flowable liquid. S42: The flowable adhesive material is evenly coated onto the surface of the base layer (1). At the same time, the prepared adsorption layer (2) is adhered to the adhesive material on the surface of the base layer (1), and another layer of adhesive material is coated on the upper surface of the adsorption layer (2) and bonded. S43: Put the whole thing into a curing device for drying and curing to make an adsorption pad.

7. The method for preparing an absorbent pad with high resilience according to claim 6, characterized in that: The specific mixing of the support component (23) material after processing in step S23 is as follows: S231: Crush and sieve the pig bristles so that the particles of the pig bristle powder are less than 200 mesh; S232: Add the elastomer toughened epoxy resin and styrene-butadiene rubber to the reactor, heat to above 90°C and maintain at a speed of 500 r / min for 15-20 min to obtain the preliminary mixed material; S233: Add the flame retardant, antistatic agent and coupling agent to the preliminary mixed material, continue stirring for 10-25 min at a speed of 800 r / min, add the pig bristle powder to the reactor and stir to obtain the deep mixed material, and continue stirring for 20-30 min.

8. The method for preparing an absorbent pad with high resilience according to claim 7, characterized in that: The adhesive material of the bonding layer is one of TPU hot melt adhesive, EVA hot melt adhesive, PO hot melt adhesive, epoxy structural adhesive or polyurethane adhesive.

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