Corrosion-resistant silicone epoxy resin and method for preparing the same

Abstract

The application relates to the technical field of epoxy resins, and discloses a kind of corrosion-resistant silicone epoxy resin and a preparation method thereof, which comprises the following raw materials in parts by weight: 250-500 parts of silicone monomer, 80-120 parts of solvent and 2-40 parts of catalyst.The silicone monomer comprises an epoxy group functional group.The epoxy group-containing silicone monomer accounts for 5-30 wt% of the total amount of the silicone monomer.The catalyst is a molecular sieve catalyst.The resin prepared by the application has excellent corrosion resistance, high strength and no heavy metal pollution.

Description

Technical Field

[0001] This application relates to the field of epoxy resin technology, and in particular to a corrosion-resistant organosilicon resin and its preparation method. Background Technology

[0002] Epoxy resins, due to the active epoxy groups in their molecules, can form a three-dimensional network structure after curing. They possess excellent physical and chemical properties, such as corrosion resistance, electrical insulation, and a wide curing temperature range. As coatings, casting materials, molding materials, adhesives, and laminating materials, they can be used directly or indirectly in all aspects of the national economy, from daily necessities to high-tech fields. They are widely used in industrial production and have flourished throughout the country.

[0003] As the industry continues to develop, the requirements for the physicochemical properties of epoxy resins are becoming increasingly stringent. Existing properties are no longer sufficient to meet the demands, leading to research into improving the various properties of resins, such as organosilicon modification.

[0004] However, most corrosion-resistant products on the market currently contain heavy metals such as tin or organic solvents, which can easily lead to excessive VOC emissions. As society continues to develop, people's environmental awareness is increasing and environmental policies are becoming more comprehensive. Resins containing heavy metals or organic solvents will be replaced, and solvent-free and heavy metal-free resins urgently need to be developed.

[0005] Therefore, there is an urgent need to develop an organosilicon epoxy resin that is free of heavy metals or organic solvents, has excellent corrosion resistance, and is low in cost. Summary of the Invention

[0006] In order to solve at least one of the above-mentioned technical problems, and to develop an organosilicon epoxy resin that is free of heavy metals or organic solvents and has excellent corrosion resistance and strength, this application provides a corrosion-resistant organosilicon epoxy resin.

[0007] Firstly, the corrosion-resistant silicone epoxy resin provided in this application adopts the following technical solution:

[0008] A corrosion-resistant organosilicon epoxy resin comprises the following raw materials in parts by weight: 250-500 parts organosilicon monomer, 80-120 parts solvent, and 2-40 parts catalyst;

[0009] The organosilicon monomer includes an epoxy functional group; the content of the epoxy-containing organosilicon monomer is 5-30 wt% of the total amount of organosilicon monomer; the catalyst is a molecular sieve catalyst.

[0010] By adopting the above technical solutions, the organosilicon epoxy resin prepared in this application exhibits excellent corrosion resistance and strength, and is free of heavy metals or organic solvents, making it environmentally friendly and pollution-free. This application precisely determines the content of organosilicon monomers containing epoxy groups, avoiding the impact on the adhesion between the resin and the substrate when the epoxy group content is low, and the impact on the resin's temperature resistance when the epoxy group content is high. Furthermore, this application uses a special catalyst with no side reactions, which can improve the epoxy value of the resin, thereby optimizing its corrosion resistance. The molecular sieve can be used for filtration, leaving no residual catalyst in the resin and having no impact on the resin's stability. Moreover, this catalyst can be reused, greatly saving costs.

[0011] Optionally, the corrosion-resistant organosilicon epoxy resin comprises the following raw materials in parts by weight: 300-400 parts of the organosilicon monomer, 90-110 parts of the solvent, and 5-20 parts of the catalyst.

[0012] By adopting the above technical solution, the raw material component ratio of this application is further optimized, the raw material ratio is more refined, and the prepared corrosion-resistant resin has better performance.

[0013] Optionally, the content of the epoxy-containing organosilicon monomer is 10-20 wt% of the total organosilicon monomer.

[0014] By adopting the above technical solution, this application uses a more optimized epoxy group ratio, which makes the reaction efficient and the flexible organosilicon segments and epoxy group segments fully combined, thereby improving the flexibility and corrosion resistance of the resin.

[0015] Optionally, the organosilicon monomer may further contain at least one functional group selected from phenyl, methyl, and ethyl.

[0016] By adopting the above technical solutions, the resin's resistance to high and low temperatures, corrosion resistance, and flexibility can be improved.

[0017] Optionally, the organosilicon monomer includes phenyl, methyl and ethyl groups, and the weight ratio of the monomers containing phenyl, methyl and ethyl functional groups is (0.4-2.5):1:(1-1.2).

[0018] Optionally, the molecular sieve catalyst is one of the following: type A molecular sieve catalyst, type Y molecular sieve catalyst, ZSM-5 molecular sieve catalyst, SSZ-13 molecular sieve catalyst, or SAPO-34 molecular sieve catalyst.

[0019] Optionally, the solvent is one of methanol, ethanol, butanediol, and ethylene glycol.

[0020] By adopting the above technical solution, this application uses inorganic solvents, thus avoiding the volatilization of organic solvents and the resulting environmental pollution.

[0021] Secondly, the preparation method of the corrosion-resistant silicone resin provided in this application adopts the following technical solution:

[0022] A method for preparing a corrosion-resistant silicone resin includes the following steps:

[0023] S1. Add the organosilicon monomer, solvent and catalyst to the container in sequence, and heat and stir.

[0024] S2. First, heat the water to 30-40℃, then add 20-50 parts of deionized water, and then heat the water again to carry out the reaction.

[0025] S3. The product after reaction S2 is subjected to distillation reaction. First, it is distilled to 100°C and then distilled under reduced pressure until no bubbles are present to prepare organosilicon resin.

[0026] By adopting the above technical solution, the preparation process of this application is simple and pollution-free. The staged heating reaction in S2 ensures that the raw materials are fully hydrolyzed before the polymerization reaction. The vacuum distillation in S3 is carried out to reduce the impact on the flash point of the resin.

[0027] Optionally, the stirring rate in S1 is 800-1500 r / min; in S2, after adding deionized water, the temperature is increased to 70-80℃ at a heating rate of 1.2-2℃ / h and reacted for 9-12 hours.

[0028] Optionally, the catalyst is a pretreated molecular sieve, prepared by the following steps: subjecting the molecular sieve to acidification pretreatment by soaking it in acid for 2-60 hours to obtain the acidified molecular sieve; the acid in the acidification pretreatment is one of acetic acid, hydrochloric acid, sulfuric acid, nitric acid, carbonic acid, formic acid, acetic acid, oxalic acid, citric acid, malic acid, or salicylic acid.

[0029] By adopting the above technical solution, this application acidifies the molecular sieve, which greatly catalyzes the reaction, increases the epoxy value of the resin, and does not affect the pH value of the resin.

[0030] In summary, this application includes at least one of the following beneficial technical effects:

[0031] 1. The organosilicon epoxy resin prepared in this application has excellent corrosion resistance and flexibility, and is free of heavy metals or organic solvents, making it environmentally friendly and pollution-free;

[0032] 2. This application uses a special catalyst that can improve the epoxy value of the resin, thereby optimizing its corrosion resistance. The acidified molecular sieve can be filtered through a sieve, leaving no residual catalyst in the resin and having no impact on the resin's stability. Furthermore, this catalyst can be reused, greatly saving costs.

[0033] 3. The preparation process of this application is simple, pollution-free, and low-cost;

[0034] 4. The organosilicon epoxy resin prepared in this application can be used in high-temperature corrosion-resistant fields. Detailed Implementation

[0035] The present application will be further described in detail below with reference to the embodiments.

[0036] A corrosion-resistant organosilicon epoxy resin comprises the following raw materials in parts by weight: 250-500 parts of organosilicon monomer, 80-120 parts of solvent, and 2-40 parts of catalyst; wherein the organosilicon monomer includes epoxy functional groups; the content of the epoxy-containing organosilicon monomer is 5-30 wt% of the total amount of the organosilicon monomer; and the catalyst is a molecular sieve catalyst.

[0037] A method for preparing a corrosion-resistant organosilicon epoxy resin includes the following steps:

[0038] S1. Add the organosilicon monomer, solvent and catalyst to the container in sequence, and heat and stir.

[0039] S2. First, heat the water to 30-40℃, then add 20-50 parts of deionized water, and then heat the water again to carry out the reaction.

[0040] S3. The product after reaction S2 is subjected to distillation reaction. First, it is distilled to 100°C and then distilled under reduced pressure until no bubbles are present to prepare organosilicon resin.

[0041] Prior to this application, most corrosion-resistant products on the market contained heavy metals, such as tin, or organic solvents, resulting in excessive emissions and serious environmental pollution. Some corrosion-resistant products that did not contain heavy metals or organic solvents showed a significant decline in physical properties and poor corrosion resistance under the influence of acids, alkalis, and salts.

[0042] Currently, the catalysts for preparing anticorrosive resins generally use dibutyltin dilaurate, titanate, hydrogen chloride, or sulfuric acid, etc. The resulting resins have low epoxy values, poor physical properties, and affect the stability of the resins.

[0043] To address the aforementioned technical problems, the applicant has designed the technical solution of this application. Firstly, this application employs a unique molecular sieve catalyst to pre-treat the molecular sieve with acidification. The pre-treated molecular sieve promotes efficient and complete reaction, greatly increases the epoxy value of the resin, and improves the corrosion resistance of the resin. Furthermore, the molecular sieve after acidification is neutralized, and the molecular sieve can be reused by filtration with a sieve screen, leaving no residue in the resin and having no impact on the pH of the resin.

[0044] Secondly, this application designed the mass fraction of epoxy groups and optimized the raw material ratio, resulting in a resin with excellent corrosion resistance, toughness, and impact resistance prepared by modifying organosilicon and epoxy.

[0045] Finally, this application uses inorganic solvents and raw materials free of heavy metals to prepare the anticorrosive resin, thus eliminating the environmental impact of organic solvent volatilization and heavy metals from the source.

[0046] The raw materials and manufacturers used in this application are as follows. Unless otherwise specified, all raw materials are commercially available products:

[0047] Epoxysilane: KH-560, Hubei Shishun Biotechnology Co., Ltd.;

[0048] Phenylacetylene: 335150-1G, Sigma-Aldrich (Shanghai) Trading Co., Ltd.;

[0049] Methylsilane: Jinjinle Chemical Co., Ltd.;

[0050] Phenylacetylsilane: 99% purity, Hubei Nuona Technology Co., Ltd.;

[0051] Ethylsilane: Jinjinle Chemical Co., Ltd.;

[0052] Methylethoxysilane: 98% purity, Zhengzhou Huiju Chemical Co., Ltd.

[0053] Type A molecular sieve: Shanghai Aiyan Biotechnology Co., Ltd.;

[0054] Y-type molecular sieve: Dalian Evolution Technology Co., Ltd.;

[0055] ZSM-5 molecular sieve: Dalian Evolution Technology Co., Ltd.;

[0056] SSZ-13 molecular sieve: Dalian Evolution Technology Co., Ltd.;

[0057] SAPO-34 molecular sieve: Dalian Evolution Technology Co., Ltd.

[0058] Testing items, instruments and testing methods

[0059] The solid content (%) and heat storage at 80℃ (h) of the resin were measured according to the standard GB / T7193-2008 Test Method for Unsaturated Polyester Resins.

[0060] The acid value of the resin (mgKOH / g) was measured according to the standard GB / T2895-2008 "Determination of Acid Value and Total Acid Value of Plastics and Polyester Resins".

[0061] Tensile strength (MPa), flexural strength (MPa), and impact strength (KJ / m²) were measured according to the standard GB / T 2567-2008 Test Methods for Properties of Resin Castings. 2 );

[0062] The corrosion resistance of the resin was measured according to the standard GB / T11547-2008 "Determination of the resistance of plastics to liquid chemical reagents".

[0063] The epoxy value of the resin was measured according to the method of "characterizing epoxy value of epoxy resin by infrared and chemical methods".

[0064] Some test items are defined as follows: 50℃ heat storage (h): the time from the start of the test to the appearance of gelation in liquid unsaturated polyester resin at 50℃;

[0065] Acid value (mgKOH / g): The number of milligrams (mg) of potassium hydroxide (KOH) required to neutralize 1g of resin sample under test conditions; Corrosion resistance: The resin's resistance to acids, alkalis, salts and other chemicals.

[0066] Example 1

[0067] S1. Add 12.5g of epoxy silane, 39.6g of phenyl silane, 99g of methyl silane, 99g of ethyl silane, 80g of methanol and 2g of type A molecular sieve into a container in sequence, heat and stir at a stirring rate of 1000r / min.

[0068] S2. First, heat the water to 30°C, then add 20g of deionized water and heat it at a rate of 1.2°C / h until it reaches 70°C and reacts for 9 hours.

[0069] S3. The product after reaction S2 is subjected to distillation reaction. First, it is distilled to 100℃ and then distilled under reduced pressure until no bubbles are present to prepare organosilicon resin.

[0070] Example 2

[0071] S1. Add 30g of epoxy silane, 41.5g of phenyl silane, 103.8g of methyl silane, 124.6g of ethyl silane, 90g of methanol and 5g of Y-type molecular sieve into a container in sequence, heat and stir at a stirring rate of 800r / min.

[0072] S2. First, heat the water to 32°C, then add 30g of deionized water and heat at a rate of 1.4°C / h until the temperature reaches 72°C and the reaction proceeds for 10 hours.

[0073] S3. The product after reaction S2 is subjected to distillation reaction. First, it is distilled to 100℃ and then distilled under reduced pressure until no bubbles are present to prepare organosilicon resin.

[0074] Example 3

[0075] S1. Add 70g of epoxy silane, 93.3g of phenyl ethoxy silane, 93.3g of methyl ethoxy silane, 93.3g of ethyl silane, 95g of butanediol and 10g of ZSM-5 molecular sieve into a container in sequence, heat and stir at a stirring rate of 900r / min.

[0076] S2. First, heat the water to 34°C, then add 40g of deionized water and heat at a rate of 1.6°C / h until the temperature reaches 74°C and the reaction proceeds for 11 hours.

[0077] S3. The product after reaction S2 is subjected to distillation reaction. First, it is distilled to 100℃ and then distilled under reduced pressure until no bubbles are present to prepare organosilicon resin.

[0078] Example 4

[0079] S1. Add 100g of epoxy silane, 180g of phenyl silane, 120g of methyl silane, 100g of methanol and 15g of type A molecular sieve into a container in sequence, heat and stir at a stirring rate of 1000r / min.

[0080] S2. First, heat the water to 34°C, then add 50g of deionized water and heat it at a rate of 1.8°C / h until it reaches 78°C and reacts for 12 hours.

[0081] S3. The product after reaction S2 is subjected to distillation reaction. First, it is distilled to 100℃ and then distilled under reduced pressure until no bubbles are present to prepare organosilicon resin.

[0082] Example 5

[0083] S1. Add 135g of epoxy silane, 157.5g of methyl silane, 157.5g of ethyl silane, 105g of methanol and 20g of SSZ-13 molecular sieve into a container in sequence, heat and stir at a stirring rate of 1200r / min.

[0084] S2. First, heat the water to 38°C, then add 30g of deionized water and heat it at a rate of 2°C / h until it reaches 80°C and reacts for 10 hours.

[0085] S3. The product after reaction S2 is subjected to distillation reaction. First, it is distilled to 100℃ and then distilled under reduced pressure until no bubbles are present to prepare organosilicon resin.

[0086] Example 6

[0087] S1. Add 100g epoxy silane, 212.8g phenyl silane, 85.1g methyl silane, 102.1g ethyl silane, 110g ethanol and 30g Y-type molecular sieve into a container in sequence, heat and stir at a stirring rate of 1500r / min;

[0088] S2. First, heat the water to 40°C, then add 20g of deionized water and heat at a rate of 1.7°C / h until the temperature reaches 76°C and the reaction proceeds for 9 hours.

[0089] S3. The product after reaction S2 is subjected to distillation reaction. First, it is distilled to 100℃ and then distilled under reduced pressure until no bubbles are present to prepare organosilicon resin.

[0090] Example 7

[0091] S1. Add 25g of epoxy silane, 160.7g of phenyl ethoxy silane, 64.3g of ethyl silane, 120g of methanol and 40g of SAPO-34 molecular sieve into a container in sequence, heat and stir at a stirring rate of 1100r / min.

[0092] S2. First, heat the water to 35°C, then add 40g of deionized water and heat it at a rate of 1.5°C / h until it reaches 75°C and reacts for 10 hours.

[0093] S3. The product after reaction S2 is subjected to distillation reaction. First, it is distilled to 100℃ and then distilled under reduced pressure until no bubbles are present to prepare organosilicon resin.

[0094] Example 8

[0095] Based on Example 4, except that the organosilicon monomers are epoxy silane and phenyl silane, wherein epoxy silane is 100g and phenyl silane is 300g, the other components and preparation methods are the same as in Example 4.

[0096] Example 9

[0097] Based on Example 4, except that the organosilicon monomers are epoxy silane and ethyl silane, wherein epoxy silane is 100g and ethyl silane is 300g, the other components and preparation methods are the same as in Example 4.

[0098] Comparative Example 1

[0099] Based on Example 1, except that the epoxy monomer is 3 wt% of the total organosilicon monomer, the other components and preparation methods are the same as in Example 1.

[0100] Comparative Example 2

[0101] Based on Example 1, except that the epoxy monomer is 35 wt% of the total organosilicon monomer, the other components and preparation methods are the same as in Example 1.

[0102] Comparative Example 3

[0103] Based on Example 1, except that the catalyst is a titanate ester, the other components and preparation methods are the same as in Example 1.

[0104] Comparative Example 4

[0105] Based on Example 1, except that the catalyst is dibutyltin dilaurate, the other components and preparation methods are the same as in Example 1.

[0106] Comparative Example 5

[0107] Based on Example 1, except that the catalyst is sulfuric acid, the other components and preparation methods are the same as in Example 1.

[0108] Comparative Example 6

[0109] Based on Example 1, except that the amount of catalyst molecular sieve is 1g, the other components and preparation methods are the same as in Example 1.

[0110] The resins prepared in Examples 1-7 and Comparative Examples 1-6 were subjected to performance testing. The test results are shown in Tables 1 and 2.

[0111] Table 1. Performance test results of the resins prepared in Examples 1-7 and Comparative Examples 1-6.

[0112]

[0113] Table 2. Corrosion resistance test results of the resins prepared in Examples 1-7 and Comparative Examples 1-6.

[0114]

[0115] As can be seen from Examples 1-7, Comparative Examples 1-6, and Tables 1 and 2, the corrosion-resistant organosilicon epoxy resin prepared in this application has excellent corrosion resistance. In acid-base-salt tests, under the conditions of 35°C and one week, the appearance of the resin showed no change. It also has excellent physical properties, with a minimum tensile strength of 98.6 MPa, a minimum flexural strength of 130 MPa, and a minimum impact strength of 11.3 KJ / m2. In the 50°C heat storage test, it can be stored for a minimum of 50 hours, with an acid value of 14.7-16.4 mgKOH / g and an epoxy value of 0.42-0.56 mol / 100g.

[0116] Comparative Examples 1 and 2 show cases where the weight of the epoxy-containing organosilicon monomer is insufficient or excessive. In both cases, the epoxy and siloxane segments cannot be fully combined, which seriously affects the physical and corrosion resistance properties of the prepared resin. The strengths are far lower than those in Example 1. In the corrosion resistance test, the appearance changes slightly, affecting its use.

[0117] Comparative Examples 3, 4, and 5 used titanate, dibutyltin dilaurate, and sulfuric acid as catalysts, respectively. The epoxy values ​​of the prepared resins were 0.25-0.3 mol / 100g, which were much lower than the epoxy value of 0.42 mol / 100g in Example 1. The strengths of the resins were also much lower than those in Example 1. In the corrosion resistance test, the appearance changed moderately, which seriously affected the use of the resin. This shows that using molecular sieves as catalysts does not produce side reactions and does not consume epoxy groups, thus affecting the performance of the resin.

[0118] In Comparative Example 6, the molecular sieve dosage was too small, which affected the reaction process. The epoxy and silicon oxide segments were not fully combined, resulting in poor resin performance.

[0119] Examples 10-27

[0120] Based on Example 1, except for the different amounts of organosilicon monomer, solvent and molecular sieve, the other components and preparation methods are the same as in Example 1. The specific raw material composition ratio is shown in Table 3.

[0121] Table 3. Raw material component distribution ratio for Examples 10-27

[0122]

[0123] The resins prepared in Examples 10-27 were subjected to performance testing, and the test results are shown in Tables 4 and 5.

[0124] Table 4. Performance testing of the resins prepared in Examples 10-27

[0125]

[0126]

[0127] Table 5. Corrosion resistance test results of the resins prepared in Examples 10-27

[0128]

[0129] As can be seen from Examples 1, 10-27 and Tables 4 and 5, the organosilicon epoxy resins prepared in this application are all superior to the epoxy resins prepared in Example 1. Moreover, with the increase of organosilicon content, the performance of the epoxy resin first increases and then decreases; with the increase of solvent content, the performance gradually tends to saturate, and the performance remains unchanged with subsequent increases of solvent content; with the increase of molecular sieve catalyst content, the performance of organosilicon epoxy resin gradually tends to saturate, and the performance remains unchanged with subsequent increases of catalyst content.

[0130] Examples 28-32

[0131] Based on Example 1, except for the different mass fraction of the epoxy-containing organosilicon monomer, the other components and preparation methods are the same as in Example 1. The specific mass fraction and content of the epoxy-containing organosilicon monomer are shown in Table 6.

[0132] Table 6. Specific mass fractions and contents of epoxy-containing organosilicon monomers in Examples 8-12.

[0133] quality score Example 28 Example 29 Example 30 Example 31 Example 32 Epoxy groups / % 8 10 12 16 20

[0134] The resins prepared in Examples 8-12 were subjected to performance testing, and the test results are shown in Tables 7 and 8.

[0135] Table 7. Performance testing of the resins prepared in Examples 28-32

[0136]

[0137] Table 8. Corrosion resistance test results of the resins prepared in Examples 28-32

[0138]

[0139]

[0140] As can be seen from Examples 28-32 and Tables 4 and 5, when the content of epoxy-containing monomers is controlled within the range of 8-20 wt% of the total amount of organosilicon monomers, the physical properties and corrosion resistance of the prepared organosilicon epoxy resin are better than those of Example 1. Moreover, as the content of epoxy-containing monomers increases, the various properties first increase and then decrease. The resin with the best performance is obtained when the content of epoxy-containing monomers is 12%.

[0141] Examples 33-37

[0142] Based on Example 30, except that the catalyst is a pretreated molecular sieve, the other components and preparation methods are the same as in Example 30. The specific molecular sieve treatment conditions are shown in Table 9.

[0143]

[0144] The resins prepared in Examples 33-37 were subjected to performance testing, and the test results are shown in Tables 10 and 11.

[0145] Table 10: Performance Test Table of Resins Prepared in Examples 33-37

[0146]

[0147] Table 11 Corrosion resistance test results of the resins prepared in Examples 33-37

[0148]

[0149]

[0150] As can be seen from Examples 33-37 and Tables 10-11, the resins prepared using acidified molecular sieves as catalysts are all superior to the resins prepared using untreated molecular sieves in Example 30. Moreover, compared to Example 30, the epoxy values ​​of Examples 33-37 (0.55-0.57 mol / 100g) are much higher than those of Example 30 (0.45 mol / 100g), indicating that acidified molecular sieves can improve the epoxy value of the resin, thereby further optimizing the various properties of the resin.

[0151] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the principles of this application should be covered within the scope of protection of this application.

Claims

1. A corrosion-resistant organosilicon epoxy resin, characterized in that, The raw materials include the following parts by weight: 250-500 parts of organosilicon monomer, 80-120 parts of solvent, and 2-40 parts of catalyst; the organosilicon monomer includes an epoxy-containing organosilicon monomer; the content of the epoxy-containing organosilicon monomer is 5-30 wt% of the total amount of the organosilicon monomer; the catalyst is a molecular sieve catalyst, and the molecular sieve catalyst is one of the following: type A molecular sieve catalyst, type Y molecular sieve catalyst, ZSM-5 molecular sieve catalyst, SSZ-13 molecular sieve catalyst, and SAPO-34 molecular sieve catalyst.

2. The corrosion-resistant organosilicon epoxy resin according to claim 1, characterized in that, The raw materials include the following parts by weight: 300-400 parts of the organosilicon monomer, 90-110 parts of the solvent, and 5-20 parts of the catalyst.

3. The corrosion-resistant organosilicon epoxy resin according to claim 1, characterized in that, The content of the epoxy-containing organosilicon monomer is 10-20 wt% of the total organosilicon monomer.

4. The corrosion-resistant organosilicon epoxy resin according to claim 1, characterized in that, The solvent is one of methanol, ethanol, butanediol, and ethylene glycol.

5. A method for preparing a corrosion-resistant organosilicon epoxy resin as described in claim 1, characterized in that, Includes the following steps: S1. Add the organosilicon monomer, solvent and catalyst to the container in sequence, and heat and stir. S2. First, heat the water to 30-40℃, then add 20-50 parts of deionized water, and then heat the water again to carry out the reaction. S3. The product after reaction S2 is subjected to distillation reaction. First, it is distilled to 100℃ and then distilled under reduced pressure until no bubbles are present to prepare organosilicon epoxy resin.

6. A method for preparing a corrosion-resistant organosilicon epoxy resin as described in claim 5, characterized in that, The stirring rate in S1 is 800-1500 r / min; in S2, after adding deionized water, the temperature is increased to 70-80℃ at a rate of 1.2-2℃ / h and reacted for 9-12 hours.

7. A method for preparing a corrosion-resistant organosilicon epoxy resin as described in claim 6, characterized in that, The catalyst is a pretreated molecular sieve, prepared by the following steps: the molecular sieve is subjected to acidification pretreatment by soaking in acid for 2-60 hours to obtain the acidified molecular sieve; the acid in the acidification pretreatment is one of acetic acid, hydrochloric acid, sulfuric acid, nitric acid, carbonic acid, formic acid, oxalic acid, citric acid, malic acid or salicylic acid.

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