Tft substrate detection circuit, detection method and tft substrate

Abstract

The application discloses a TFT substrate detection circuit, a detection method and a TFT substrate, and relates to the field of glass substrate detection. The TFT substrate detection circuit comprises a detection circuit arranged along the edge of the TFT substrate. The detection circuit is connected to a detection point which can be used to determine the on-off state of the detection circuit. The detection circuit comprises a first detection circuit. A plurality of first breakage gaps are arranged on the first detection circuit. The first breakage gaps extend from one side to the other side in the width direction of the first detection circuit. The extension depth of the first breakage gaps is smaller than the width of the first detection circuit, so that the first breakage gaps have an open end and a closed end. The detection circuit improves the fineness of the edge damage detection, so as to detect the slight edge damage on the TFT substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of glass substrate detection, and in particular to a TFT substrate detection circuit. BACKGROUND

[0002] A TFT (Thin Film Transistor) substrate (or TFT glass) is a kind of glass substrate, which is a kind of thin glass sheet with extremely flat surface. The TFT substrate is widely used in various displays, and the electronic paper module is one of the applications. The electronic paper module needs to be detected for edge damage in the production process. The current edge damage detection of the electronic paper module is through a closed detection line around the TFT substrate. The two ends of the detection line are respectively connected to the TIN pin and the TPE pin of the driving IC chip. A high level is output through the TPE pin end. If a high level is detected at the TIN pin end, it proves that the detection line on the TFT substrate is intact, and the substrate is not broken.

[0003] However, the current detection method is suitable for edge damage detection of obvious cracks including through the detection line. The detection line is completely disconnected due to the through crack, so that the detection is realized. However, when the detection line is not completely disconnected by the crack, or there is a slight edge damage between the detection line and the edge of the TFT substrate, such as some slight continuous cracks, it cannot be detected by the current detection line because the cracks do not directly damage the detection line. Although these edge damages will not directly affect the function of the TFT substrate in a short time, they seriously affect the appearance. Due to the existence of these edge damages, some slight stress can cause the edge damage to be broken again during the use of the TFT substrate, which directly affects the normal use of the TFT substrate and exists a great safety hazard.

[0004] Therefore, in view of the above defects, the existing edge damage detection line needs to be improved so that it can detect some slight cracks and other edge damages that will not directly affect the TFT substrate in a short time, and reduce the safety hazard. SUMMARY

[0005] The purpose of the present application is to provide a TFT substrate detection circuit, a detection method, a TFT substrate, a liquid crystal display and an electronic terminal. Through the detection circuit, the fineness of edge damage detection can be improved to detect the slight edge damage on the TFT substrate.

[0006] To achieve the above purpose, the present application adopts the following technical solutions:

[0007] A TFT substrate detection circuit, comprising a detection line arranged along the edge of the TFT substrate, the detection line being provided with a detection point for determining the continuity of the detection line, the detection line comprising a first detection line, a plurality of first breakage gaps being arranged on the first detection line, the first breakage gaps extending from one side to the other side in the width direction of the first detection line, and the extension depth of the first breakage gaps being less than the width of the first detection line, so that the first breakage gaps have an open end and a closed end; the detectable edge damage depth is limited by the first detection line, when there is edge damage with a depth extending to at least the closed end of the first breakage gap, the first detection line will be disconnected due to the existence of the edge damage, so as to detect such slight edge damage, that is, by expanding the size range of the edge damage sufficient to affect the continuity of the first detection line, the fineness of edge damage detection is improved;

[0008] Further, the detection point comprises a TIN pin and a TPE pin of a driving IC chip on the TFT substrate;

[0009] Further, the width of the detection line satisfies the following relationship: dt=Dsg-Dtg, wherein dt is the width of the detection line, Dsg is the distance between the outermost signal line on the TFT substrate and the edge of the TFT substrate, and Dtg is the distance between the detection line and the edge of the TFT substrate;

[0010] Further, the width of the detection line is equal to the distance between the outermost signal line on the TFT substrate and the edge of the TFT substrate; thereby expanding the size range of the edge damage that can be detected by the detection line;

[0011] Further, the interval between the closed ends of adjacent first breakage gaps is less than or equal to the length of the edge damage with a depth extending to at least the closed end of the first breakage gap; it should be noted that the length refers to the straight-line distance between the two ends of the edge damage, and the same applies hereinafter;

[0012] Further, the difference between the depth of the first breakage gap and the width of the first detection line is 0.2 mm, and the distance between the closed ends of adjacent first breakage gaps is 3 mm;

[0013] Further, the detection circuit further comprises a second detection circuit located on the upper layer or lower layer of the first detection circuit and electrically insulated from the first detection circuit, the second detection circuit is provided with a plurality of continuous detection intervals, the number of the detection intervals is less than the number of the first break gaps by one, each of the detection intervals is provided with at least two second break gaps, the extension depth of the second break gaps is equal to the extension depth of the first break gaps, so that the second break gaps have an open end and a closed end, the distance between the closed ends of the two second break gaps farthest apart in one of the detection intervals is equal to the distance between the closed ends of the two adjacent first break gaps, and the lines on both sides of the corresponding second break gaps in each of the detection intervals are connected in sequence; the second detection circuit limits the detectable edge damage length, and only when the edge damage exists and has a depth extending to the closed end of the second break gap and a length greater than or equal to the distance between the closed ends of the two second break gaps farthest apart in one of the detection intervals, the second detection circuit is cut off, so as to cause the detection circuit to be cut off, avoiding the case that the detection circuit is cut off as long as the edge damage exists and has a depth extending to the closed end of the first break gap, and improving the detection accuracy of the edge damage of a limited length.

[0014] Further, the closed ends of the second break gaps and the closed ends of all the first break gaps are overlapped or staggered in the projection direction, and for the staggered arrangement, the distance between the closed ends of the two second break gaps farthest apart in one of the detection intervals is unchanged, and the detection accuracy of the detection circuit is changed by modifying the number of the second break gaps in one of the detection intervals.

[0015] A TFT substrate detection circuit, comprising a detection circuit arranged along the edge of the TFT substrate, the detection circuit is provided or connected to a detection point for judging the on-off of the detection circuit, the detection circuit comprises a second detection circuit, the second detection circuit is provided with a plurality of continuous detection intervals, each of the detection intervals is provided with at least two second break gaps, the second break gaps extend from one side to the other side in the width direction of the second detection circuit, and the extension depth of the second break gaps is less than the width of the second detection circuit, so that the second break gaps have an open end and a closed end, and the lines on both sides of the corresponding second break gaps in each of the detection intervals are connected in sequence; the second detection circuit limits the detectable edge damage depth and length, so that the edge damage detection is more targeted and accurate;

[0016] Further, the detection point comprises a TIN pin and a TPE pin of a driving IC chip on the TFT substrate;

[0017] Further, the width of the detection line satisfies the following relationship: dt=Dsg-Dtg, wherein dt is the width of the detection line, Dsg is the distance between the outermost signal line on the TFT substrate and the edge of the TFT substrate, and Dtg is the distance between the detection line and the edge of the TFT substrate.

[0018] Further, the width of the detection line is equal to the distance between the outermost signal line on the TFT substrate and the edge of the TFT substrate, so that the size range of the edge damage that can be detected by the detection line is enlarged.

[0019] Further, the difference between the depth of the second breakage gap and the width of the second detection line is 0.2 mm, and the distance between the closed ends of the two second breakage gaps that are farthest apart in one detection interval is 3 mm.

[0020] A TFT substrate detection method, comprising on-off detection of the detection line.

[0021] Further, the on-off detection of the detection line is performed by a detection point, the detection point comprising a TIN pin and a TPE pin of a driving IC chip on the TFT substrate, and a high level is output through the TPE pin end, if a high level is detected at the TIN pin end, it proves that the detection line on the TFT substrate is intact, and there is no edge damage in the detectable range on the TFT substrate.

[0022] A TFT substrate, comprising a substrate body and the detection line along the edge of the substrate body.

[0023] A liquid crystal display, comprising the TFT substrate.

[0024] An electronic terminal, comprising the liquid crystal display.

[0025] The beneficial effects of the present application are:

[0026] 1) By the provision of the first breakage gap on the first detection line, some slight edge damage that extends at least to the closed end of the first breakage gap will cause the first detection line to be disconnected, so that the detection of slight edge damage is realized, and the problem that the existing detection technology cannot effectively detect such slight edge damage is solved.

[0027] 2) The second detection line is provided, and the detectable edge damage depth and length are limited by the provision of the second detection line, only when the edge damage that extends at least to the closed end of the second breakage gap and has a length greater than or equal to the distance of one detection interval exists, the second detection line will be cut off, so that the accuracy of the detection of edge damage with specific depth and length is improved. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 is a schematic diagram of the TFT substrate detection circuit according to an embodiment of the present application;

[0029] Figure 2 is a schematic diagram of the first detection circuit according to an embodiment of the present application;

[0030] Figure 3 is a schematic diagram of the second detection circuit according to an embodiment of the present application;

[0031] Figure 4 is a schematic diagram of the first detection circuit and the second detection circuit according to an embodiment of the present application;

[0032] Figure 5 is a schematic diagram of a situation that causes the on-off results of the first detection circuit and the second detection circuit to be inconsistent according to an embodiment of the present application;

[0033] Figure 6 is a schematic diagram of a situation that four second break gaps are arranged in one detection interval according to an embodiment of the present application;

[0034] Figure 7 is a schematic diagram of a situation that seven second break gaps are arranged in one detection interval according to an embodiment of the present application;

[0035] In the figure:

[0036] 1, TFT substrate; 2, signal line;

[0037] 3, detection circuit; 31, first detection circuit; 311, first break gap; 32, second detection circuit; 321, second break gap;

[0038] 4, TPE pin; 5, TIN pin; 6, crack. DETAILED DESCRIPTION

[0039] In the description of this invention, it should be understood that terms or positional relationships indicating orientation are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention. For example, terms such as "upper" and "lower" indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature. The term "multiple" refers to two or more.

[0040] The principles and features of the present invention are described below with reference to the accompanying drawings. The examples given are for illustrative purposes only and are not intended to limit the scope of the invention. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.

[0041] like Figure 1 As shown, in one embodiment of the present invention, the edge loss detection circuit of the TFT substrate 1 includes a detection line 3 disposed on the TFT substrate 1 along the perimeter of the TFT substrate 1. The detection line 3 is disposed or connected to a detection point that can be used to determine the continuity of the detection line 3. In this embodiment, the TIN pin and TPE pin 4 of the driving IC chip on the TFT substrate 1 are used directly. A high level is output at the TPE pin 4 terminal. If a high level is detected at the TIN pin 5 terminal, it proves that the detection line 3 on the TFT substrate 1 is intact and there is no edge loss within the measurable range on the TFT substrate 1. Otherwise, there is a detectable edge loss. Of course, in other embodiments, the continuity of the circuit is not limited to the detection of voltage. For example, the continuity of the circuit can also be determined by detecting parameters such as current and resistance that can directly or indirectly reflect the continuity of the circuit. In addition, the detection is not limited to the TIN pin and TPE pin 4 of the driving IC chip. The detection circuit can be connected to other circuits, tools, devices, equipment, etc. that can perform continuity detection. The same applies below. This embodiment is for simplification only, and takes the TIN pin and TPE pin 4 of the driver IC chip as the detection points for example.

[0042] The detection line 3 has a certain width, and the width of the detection line 3 is set to satisfy the following relationship: Dt=Dsg-Dtg, where Dt is the width of the detection line 3, Dsg is the distance between the outermost signal line 2 on the TFT substrate 1 and the edge of the TFT substrate 1, and Dtg is the distance between the detection line 3 and the edge of the TFT substrate 1. In this embodiment, the width Dt of the detection line 3 is equal to the distance Dsg between the outermost signal line 2 on the TFT substrate 1 and the edge of the TFT substrate 1.

[0043] Embodiment One

[0044] The detection line 3 includes a first detection line 31, and the on-off of the first detection line 31 determines the on-off of the detection line 3. A plurality of first breakage notches 311 are arranged (including continuous arrangement and uniform interval arrangement) on the first detection line 31 along the voltage transmission direction of the first detection line 31 (i.e. the length direction of the first detection line 31), the first breakage notches 311 extend from one side to the other side in the width direction of the first detection line 31, and the extension depth of the first breakage notches 311 is less than the width of the first detection line 31, so that the first breakage notches 311 have an open end and a closed end.

[0045] The first detection line 31 limits the detectable edge damage depth, and when there is edge damage with a depth extending to at least the closed end of the first breakage notch 311, the first detection line 31 will be disconnected due to the existence of the edge damage, thereby detecting such slight edge damage, i.e. by expanding the edge damage size range that can affect the on-off of the first detection line 31, the fineness of edge damage detection is improved, and the problem that the existing detection technology cannot effectively detect such slight edge damage is solved. Therefore, the deeper the extension depth of the first breakage notch 311, the smaller the edge damage size that can be detected, and the larger the edge damage detection range.

[0046] In view of the certain correlation between the depth and length of the edge damage, for example, when the crack 6 has a depth less than the width of the first detection line 31, i.e. the crack 6 is a non-penetrating crack 6, the length of the crack 6 is proportional to the depth of the crack 6. Generally, when the depth of the crack 6 is 0.2 mm, the length of the crack 6 is greater than 3 mm, which means that for a crack 6 with a depth less than 0.2 mm, its length is also relatively short (usually less than 3 mm), and even in subsequent use, it will not cause damage to the TFT substrate 1 and can be ignored. Therefore, in this embodiment and the following embodiments, the parameters of the slight crack 6 that can usually cause damage to the TFT substrate 1 are taken as examples for illustration.

[0047] Based on the fact that the depth of the crack 6 that can cause damage to the TFT substrate 1 in subsequent production, transportation or use is usually more than 0.2 mm. Therefore, as shown in FIG. 2, the first breakage notch 311 has an extension depth less than the width of the first detection line 31, so that the first breakage notch 311 has an open end and a closed end. Figure 2As shown, three adjacent first circuit breaking gaps 311 are shown on the first detection line 31, the three first circuit breaking gaps 311 are respectively A, B and C, the distance between the closed end of the first circuit breaking gap 311 and the edge of the first detection line 31 is 0.2mm, and in view of the fact that the depth of the crack 6 is usually 0.2mm and the length of the crack 6 is greater than 3mm, in order to ensure that any crack 6 that may cause damage to the TFT substrate 1 can extend to at least one first circuit breaking gap 311, so that the crack 6 is detected. Therefore, in this embodiment, the first circuit breaking gaps 311 are uniformly spaced, so that the distance between the closed ends of adjacent first circuit breaking gaps 311 is 3mm, so that any crack 6 that meets the requirements falls within the detection range. In this way, when a through crack 6 or a crack 6 with a depth greater than or equal to 0.2mm occurs, it can be detected by the first detection line 31. It should be noted that the above parameters are based on the general analysis data, and the extension depth of the first circuit breaking gap 311 and the interval distance between adjacent first circuit breaking gaps 311 can be modified according to specific needs to adapt to different crack 6 detection.

[0048] In addition, the purpose of the first circuit breaking gap 311 is to form a line that is easily affected by the crack 6 to achieve the purpose of detection, so the shape of the first circuit breaking gap 311 is not limited, and in this embodiment it is an isosceles triangular structure, and in other embodiments it can also be a trapezoidal, oval or other shape, as long as the purpose can be achieved, the same applies to the second circuit breaking gap 321 below, which will not be described below.

[0049] Embodiment two

[0050] The detection circuit 3 comprises a second detection circuit 32, and the on-off of the second detection circuit 32 determines the on-off of the detection circuit 3. The second detection circuit 32 is provided with a plurality of continuous detection intervals, and each detection interval is provided with at least two second breakage gaps 321 (for the sake of simplification, in the embodiment, the second breakage gaps 321 are continuously arranged between the opening ends, and in other embodiments, the second breakage gaps 321 can be arranged at intervals). The second breakage gaps 321 extend from one side to the other side in the width direction of the second detection circuit 32, and the extension depth of the second breakage gaps 321 is less than the width of the second detection circuit 32, so that the second breakage gaps 321 have opening ends and closed ends, and the lines on both sides of the corresponding second breakage gaps 321 in each detection interval are connected in series. The series connection is that the connection point at the left side of the second breakage gap 321 is electrically connected with the connection point at the right side of the corresponding second breakage gap 321 in the adjacent previous detection interval, and the connection point at the right side of the second breakage gap 321 is electrically connected with the connection point at the left side of the corresponding second breakage gap 321 in the adjacent next detection interval, thereby forming a series connection. The purpose of the series connection is to ensure that a certain number of continuous second breakage gaps 321 form a whole, and only when the continuous number of second breakage gaps 321 are cut off at the same time can the second detection circuit 32 be disconnected, thereby limiting the depth and length of the detectable crack 6.

[0051] For example, as Figure 3As shown, the second detection line 32 illustrates two consecutive detection intervals, each interval having four consecutive second circuit break gaps 321. The four second circuit break gaps 321 in the first detection interval are numbered A1, B1, C1 and D1, respectively, and the four second circuit break gaps 321 in the second detection interval are numbered A2, B2, C2 and D2, respectively. In a detection interval, the distance between the closed ends of the two second circuit break gaps 321 that are farthest apart among the four consecutive second circuit break gaps 321 is a certain value, for example, 3mm. The left and right positions of A1 contain two connection points a1 and a2 respectively. Similarly, the left and right positions of B1 contain two connection points b1 and b2 respectively, the left and right positions of C1 contain two connection points c1 and c2 respectively, the left and right positions of D1 contain two connection points d1 and d2 respectively, the left and right positions of A2 contain two connection points a1' and a2' respectively, the left and right positions of B2 contain two connection points b1' and b2' respectively, the left and right positions of C2 contain two connection points c1' and c2' respectively, and the left and right positions of D2 contain two connection points d1' and d2' respectively. It should be noted that since the first and last detection intervals each have only one adjacent detection interval, only a one-sided connection is required. More specifically: the second open circuit gap 321 in the first detection interval only needs to have a connection point set on the right side so as to short-circuit with the connection point on the left side of the corresponding second open circuit gap 321 in the second detection interval; the second open circuit gap 321 in the last detection interval only needs to have a connection point set on the left side so as to short-circuit with the connection point on the right side of the corresponding second open circuit gap 321 in the penultimate detection interval.

[0052] In this embodiment, only in Figure 3 Taking the connection of the first and last connection points as an example, a2 and a1', b2 and b1', c2 and c1', and d2 and d1' are connected by perforated wires, resulting in short circuits between a2 and a1', b2 and b1', c2 and c1', and d2 and d1'. This ensures that the second detection line 32 will only be disconnected when all four consecutive second break gaps 321 are simultaneously cut, thus limiting the edge loss length.

[0053] It should be noted that, similar to the setting of the first break gap 311, the extension depth of the second break gap 321, the width of a detection interval, and the number of second break gaps 321 set in a detection interval can all be modified according to actual needs to adapt to different crack detection requirements.

[0054] Example 3

[0055] The detection circuit 3 includes a first detection circuit 31 and a second detection circuit 32 with the same line width, as shown in Figure 4 The second detection circuit 32 is above the first detection circuit 31, and an insulating layer is arranged between the first detection circuit 31 and the second detection circuit 32 to realize electrical insulation and ensure that short circuit does not occur between the two circuits. Based on the embodiment, the detection circuit 3 will only present an open circuit state when both the first detection circuit 31 and the second detection circuit 32 are open. When only the first detection circuit 31 is open and the second detection circuit 32 is in a closed state, the entire detection circuit 3 still presents a closed state.

[0056] The embodiment is an improvement on the first embodiment, and the second detection circuit 32 is added to the first detection circuit 31 of the first embodiment to supplement and limit the first detection circuit 31. The first detection circuit 31 is set as in the first embodiment, and the second detection circuit 32 is set as in the second embodiment.

[0057] In the embodiment, the first detection circuit 31 and the second detection circuit 32 are further limited as follows: the number of detection intervals is one less than the number of first open gaps 311, and the distance between the closed ends of the two second open gaps 321 farthest apart in a detection interval is equal to the distance between the closed ends of two adjacent first open gaps 311. By unifying the measurement parameters, the consistency of the results is improved, that is, the consistency of the on-off of the first detection circuit 31 and the second detection circuit 32 is improved. In the embodiment, the distance between the closed ends of adjacent first open gaps 311 is 3 mm, and the distance between the closed ends of the two second open gaps 321 farthest apart in a detection interval is also 3 mm. The combination of the first detection circuit 31 and the second detection circuit 32 includes the case where the closed ends of the first open gap 311 and the closed ends of any second open gap 321 are projected to coincide, and also includes the case where the closed ends of the first open gap 311 and the closed ends of any second open gap 321 are projected to be offset.

[0058] For the case where the closed ends of the first open gap 311 and the closed ends of any second open gap 321 are projected to be offset, there is a case where the same crack 6 causes the first detection circuit 31 to be disconnected but does not cause the second detection circuit 32 to be disconnected, such as when the starting end and the ending end of the crack 6 fall between the second open gap 321 and the first open gap 311. More specifically, as shown in Figure 5As shown, the two first disconnection gaps 311 on the first detection line 31 are A and B, and the second detection line 32 has four second disconnection gaps 321, namely A, B, C and D. The starting end of crack 6 is located between A and A. This means that for the first detection line 31, crack 6 has extended and cut through A and B (at least cutting through A), causing the first detection line 31 to break. However, for the second detection line 32, crack 6 only extends and cuts through B, C and D. According to the aforementioned setting of the second detection line 32, when four disconnection gaps are set in a detection interval, it must be ensured that cutting through at least four consecutive second disconnection gaps 321 may cause the second detection line 32 to break. Therefore, in this case, the second detection line 32 cannot be broken, making the continuity results of the first detection line 31 and the second detection line 32 inconsistent. Ultimately, the detection line 3 is in a continuous state, resulting in the inability to detect the aforementioned crack 6.

[0059] Based on this situation, by increasing the number of second break gaps 321 within a detection interval, the gaps between A and Jia, and between D and Yi, will be reduced, decreasing the probability that crack 6 is located between A and Jia, and between D and Yi, while simultaneously increasing the range of detectable edge damage sizes. For example, as... Figure 6 As shown, the distance between the closed ends of the two first circuit breakers 311 is set to 3mm, which is also the distance between the closed ends of A and B. The distance between the closed ends of the two farthest second circuit breakers 321 among the four consecutive second circuit breakers 321 is set to 3mm, which is also the distance between the closed ends of A and D. Then the spacing between two adjacent second circuit breakers 321 is 1mm. Taking the first circuit breaker 311 being exactly in the middle of two adjacent second circuit breakers 321 as an example, the gap between A and A and between D and B is 0.5mm. The gap that may cause the inconsistency between the two opening and closing results is 0.5mm. Combining the relationship between the depth and length of crack 6, the detectable length of crack 6 is greater than 3.5mm.

[0060] like Figure 7 As shown, it is similar to Figure 6 The only difference is that the number of second break gaps 321 set in the detection interval has increased to seven. The seven second break gaps 321 are numbered E, F, G, H, I, J and K respectively. The distance between the closed ends of E and K is 3mm, so the spacing between two adjacent second break gaps 321 is 0.5mm. The gap between E and A and between F and B is 0.25mm. The gap that may cause the inconsistency between the two opening and closing results is 0.5mm. Combining the relationship between the depth and length of crack 6, the detectable length of crack 6 is greater than 3.25mm.

[0061] Through the Figure 6 andFigure 7 By comparison, the influence of the number of the second break gaps 321 in a detection interval on the detection accuracy and the uniformity of the detection results can be seen: increasing the number of the second break gaps 321 in a detection interval is conducive to improving the detection accuracy (from being able to detect a 3.5mm crack 6 to being able to detect a 3.25mm crack 6) and improving the uniformity of the detection results of the first detection line 31 and the second detection line 32 (reducing the distance between the first break gap 311 and the second break gap 321 to reduce the probability of falling into the region).

[0062] Based on the foregoing embodiments, the present embodiment also provides a substrate detection method, comprising detecting the on-off of the detection line 3 by means of the detection points.

[0063] The present embodiment also provides a TFT substrate 1, comprising a substrate body and the detection line 3 along the edge of the substrate body.

[0064] The TFT substrate 1 is one of the basic components of an LCD (Liquid Crystal Display) and one of the key basic materials, therefore, the present embodiment also provides an LCD comprising the TFT substrate 1.

[0065] The LCD is used in various electronic terminals, such as visual equipment such as readers, therefore, the present embodiment also provides an electronic terminal comprising the LCD.

[0066] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the division of the above functional modules is exemplified, and in actual application, the above functions can be completed by different functional modules according to needs, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. The specific working process of the device described above can refer to the corresponding process in the foregoing method embodiments, which will not be repeated here.

Claims

1. A TFT substrate detection circuit, comprising a detection line disposed on the TFT substrate along a circumference of the edge of the TFT substrate, the detection line being disposed or connected to a detection point for determining the continuity of the detection line, characterized in that, The detection circuit includes a first detection circuit, a plurality of first breakage gaps are arranged on the first detection circuit, the first breakage gaps extend from one side to the other side in the width direction of the first detection circuit, and the extension depth of the first breakage gaps is less than the width of the first detection circuit, so that the first breakage gaps have open ends and closed ends; The detection circuit further includes a second detection circuit which is arranged on the upper layer or the lower layer of the first detection circuit and is electrically insulated from the first detection circuit, a plurality of continuous detection intervals are arranged on the second detection circuit, the number of the detection intervals is less than the number of the first breakage gaps by one, each of the detection intervals is provided with two or more second breakage gaps, the extension depth of the second breakage gaps is equal to the extension depth of the first breakage gaps, so that the second breakage gaps have open ends and closed ends, the distance between the closed ends of the two second breakage gaps which are farthest apart in one of the detection intervals is equal to the distance between the closed ends of two adjacent first breakage gaps, and the lines on both sides of the corresponding second breakage gaps in each of the detection intervals are connected in series.

2. The TFT substrate inspection circuit according to claim 1, wherein The detection points include TIN pins and TPE pins of an ic chip on a TFT substrate.

3. The TFT substrate inspection circuit according to claim 1, wherein The width of the detection circuit satisfies the following relationship: dt=Dsg-Dtg, wherein dt is the width of the detection circuit, Dsg is the distance between the outermost signal line on the TFT substrate and the edge of the TFT substrate, and Dtg is the distance between the detection circuit and the edge of the TFT substrate.

4. The TFT substrate inspection circuit according to claim 3, wherein The width of the detection circuit is equal to the distance between the outermost signal line on the TFT substrate and the edge of the TFT substrate.

5. The TFT substrate inspection circuit according to claim 1, wherein The distance between the closed ends of adjacent first breakage gaps is less than or equal to the length of the side damage whose depth extends to the closed end of the first breakage gap.

6. The TFT substrate inspection circuit according to claim 1, wherein The difference between the depth of the first breakage gap and the width of the first detection circuit is 0.2 mm, and the distance between the closed ends of adjacent first breakage gaps is 3 mm.

7. The TFT substrate inspection circuit according to claim 1, wherein The closed ends of the second breakage gaps and the closed ends of all the first breakage gaps are overlapped or staggered in the stacking direction, for the staggered arrangement, the distance between the closed ends of the two second breakage gaps which are farthest apart in one of the detection intervals is unchanged, and the detection accuracy of the detection circuit is changed by modifying the number of the second breakage gaps in one of the detection intervals.

8. A TFT substrate inspection method, characterized by, The method includes on-off detection of the detection circuit according to any one of claims 1-7.

9. A TFT substrate, characterized by, The TFT substrate includes the base body and the detection circuit according to any one of claims 1-7 which is arranged along the edge of the base body.

10. A liquid crystal display, characterized by comprising: The TFT substrate includes the TFT substrate according to claim 9.

11. An electronic terminal, characterized in that The liquid crystal display includes the liquid crystal display according to claim 10.

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