Optoelectronic coupler die bonding support

Abstract

The application discloses an optoelectronic coupler die bonding support and belongs to the field of optoelectronic semiconductor component packaging. The application comprises a wafer, a first groove, a second groove, a transmitting die bonding support and a receiving die bonding support. The first groove and the second groove are oppositely arranged on the inner sides of the two ends of the wafer and staggered along the X direction, and the two ends of the transmitting die bonding support are connected with the first groove and the second groove respectively. The receiving die bonding support is arranged on the inner sides of the two ends of the wafer and staggered along the X direction with the transmitting die bonding support. According to the structure and layout of the transmitting die bonding support and the receiving die bonding support, the transmitting die bonding support and the receiving die bonding support are combined with each other on the same wafer. The wafer is fully utilized, the generation of waste is reduced, and the production cost is lowered. Meanwhile, the combination of the positioning taper part and the positioning through hole realizes accurate positioning and pre-fixing when the transmitting die bonding support and the receiving die bonding support are overlapped, and the two are quickly combined through riveting, spot welding or laser welding, so that the production efficiency is improved.

Description

Technical Field

[0001] This invention belongs to the field of optoelectronic semiconductor component packaging technology, and particularly relates to a die-bonding bracket for an optocoupler. Background Technology

[0002] An optocoupler is an optoelectronic component that transmits electrical signals using light as a medium. Typically, an optocoupler includes a chip, a die-attach support, and a package. The chip is divided into a transmitter chip and a receiver chip, and the die-attach support is divided into a transmitter die-attach support and a receiver die-attach support. The transmitter die-attach support carries the transmitter chip, and the receiver die-attach support carries the receiver chip. Current technological trends in die-attach support development involve fabricating both the transmitter and receiver die-attach supports on a single wafer, replacing the previous method of fabricating them on two separate supports. This addresses the issue of wasted raw material resources. For example, Chinese utility model patent CN208127198U discloses a chip support, such as... Figure 1 As shown, it includes a sheet material, which comprises multiple parallel support strips. Each support strip includes multiple light-emitting chip supports and multiple photosensitive chip supports, with the light-emitting chip supports and photosensitive chip supports arranged alternately within each support strip to address the technical problem of low material utilization of the sheet material. However, in the subsequent processing of the sheet material, the supports need to be broken, overlapped, and assembled for connection. This technical solution cannot accurately determine whether the emitter die-bonding support and the receiver die-bonding support are completely overlapped based on the support structure, affecting the positioning of subsequent equipment and the connection efficiency between the emitter die-bonding support and the receiver die-bonding support.

[0003] To address this issue, a new die-bonding support for optocouplers is proposed. This improves the utilization rate of the sheet material while solving the problem in existing die-bonding support structures where it is impossible to accurately determine whether the emitter die-bonding support and receiver die-bonding support are properly overlapped. Summary of the Invention

[0004] The purpose of this invention is to provide a die-bonding bracket for an optocoupler, aiming to solve the problems of low material utilization and inaccurate determination of whether the emitter and receiver die-bonding brackets overlap properly in the existing die-bonding bracket structure. To achieve this purpose, the technical solution adopted by this invention is: a die-bonding bracket for an optocoupler, comprising a sheet, a first groove, a second groove, an emitter die-bonding bracket, and a receiver die-bonding bracket. The first and second grooves are oppositely disposed on the inner sides of both ends of the sheet and staggered along the X-direction. The two ends of the emitter die-bonding bracket are respectively connected to the first and second grooves. The receiver die-bonding bracket is disposed on the inner sides of both ends of the sheet and staggered with the emitter die-bonding bracket along the X-direction. This technical solution cleverly arranges the die-bonding bracket and receiver die-bonding bracket based on the shapes of die-bonding bracket unit A and die-bonding bracket B, then arranges either the emitter die-bonding bracket or the receiver die-bonding bracket, or both, closely on the same sheet, and finally, the emitter die-bonding bracket and receiver die-bonding bracket are superimposed and fastened by separation and positioning based on the bracket's own features.

[0005] Furthermore, both the second and first grooves are provided with a positioning cone, which is recessed. The difference is that the positioning cone is located at the opening of the second groove and at the bottom of the first groove. The main function of the positioning cone, located at different positions in the first and second grooves, is to assist in the initial fixation of the die-bonding support.

[0006] Furthermore, the absolute value of the depth difference between the second groove and the first groove is L3, which ensures the initial fixation of the transmitter die-bonding bracket and the precise overlap of the transmitter die-bonding bracket and the receiver die-bonding bracket.

[0007] Furthermore, positioning through holes are provided at both ends of the transmitter die-bonding bracket, with the through holes protruding upwards, and die-bonding bracket units A arranged along the Y direction are provided in the middle. The protruding positioning through holes, combined with the concave positioning cone, can pre-fix the stacked transmitter die-bonding bracket and receiver die-bonding bracket.

[0008] Furthermore, the receiving die-bonding support is connected to the inner sides of both ends of the wafer, with die-bonding support units B arranged along the Y direction in the middle. Connecting the receiving die-bonding support to the inner sides of both ends of the wafer helps reduce the number of process steps in the die-bonding support separation and stacking process, thus lowering production costs.

[0009] Even better, both die bonder unit A and die bonder unit B include leads and buffer holes. The leads include through-hole and surface mount types. The difference is that die bonder unit A also includes a transmitter pad, while die bonder unit B also includes a receiver pad. The buffer holes are rectangular, triangular, elliptical, or a combination thereof, which can prevent or reduce bending deformation of the die bonder. The transmitter pad is used to fix the transmitter chip, and the receiver pad is used to fix the receiver chip.

[0010] Even better, the vertical distances from the root of the pins at both ends of the transmitter and receiver die-bonding brackets to the positioning through-holes or positioning cones are L1 and L2, respectively, and the absolute value of the difference between L1 and L2 is equal to L3. The inequality of L1 and L2 offsets the pins of the transmitter and receiver die-bonding brackets, achieving an alternating arrangement of die-bonding bracket unit A and unit B in the Y direction and a mutual alternating arrangement of the transmitter and receiver die-bonding brackets in the X direction, increasing density and reducing waste. The absolute value of the difference between L1 and L2 being equal to L3 ensures precise positioning when the transmitter and receiver die-bonding brackets are stacked.

[0011] Compared with existing technologies, this invention utilizes a structural layout where the emitter and receiver die-bonding supports L1 and L2 are unequal, combined with a design where the emitter and receiver die-bonding supports are on the same sheet, achieving an interleaved bonding of the emitter and receiver die-bonding supports in the X and Y directions on the same sheet. This fully utilizes the sheet, reduces waste, and lowers production costs. Simultaneously, positioning cones are provided on the first and second grooves, and positioning through holes are provided on the emitter die-bonding support. The absolute value of the depth difference L3 between the first and second grooves is equal to the absolute value of the difference between L1 and L2, enabling precise positioning and pre-fixation of the emitter and receiver die-bonding supports during stacking. Finally, through riveting, spot welding, or laser welding, the two are quickly joined, improving production efficiency. Attached Figure Description

[0012] Figure 1 A schematic diagram provided for Chinese utility model patent CN208127198U;

[0013] Figure 2 This is a schematic diagram of the initial and bonding state of the die-bonding scaffold provided in Embodiment 1 of the present invention;

[0014] Figure 3 This is a schematic diagram of the integrally separated sheet of the emitter die-bonding support provided in Embodiment 1 of the present invention;

[0015] Figure 4 This is a schematic diagram of die-bonding scaffold monomer A and die-bonding scaffold B provided in Embodiment 1 of the present invention;

[0016] Figure 5 This is a positioning effect diagram of the transmitter die-bonding bracket and receiver die-bonding bracket provided in Embodiment 1 of the present invention;

[0017] Figure 6 This is a diagram showing the die-bonding scaffold and its bonding state provided in Embodiment 2 of the present invention.

[0018] Figure 7 This is a schematic diagram of the transmitter die-bonding bracket A and the receiver bracket B provided in Embodiment 2 of the present invention;

[0019] Figure 8This is a diagram showing the flipping effect of the receiving bracket B provided in Embodiment 2 of the present invention.

[0020] The following are the labeling elements in the figure:

[0021] 1. Die-bonding bracket; 10. Sheet; 100. Connection point; 20. First groove; 200. Positioning cone; 30. Second groove; 40. Emitter die-bonding bracket; 400. Positioning through hole; 401. Die-bonding bracket unit A; 402. Emitter pad; 403. Pin; 404. Buffer hole; 50. Receiver die-bonding bracket; 501. Die-bonding bracket unit B; 502. Receiver pad; 2. Surface mount die-bonding bracket; 60. Third groove; 70. Emitter die-bonding bracket sheet; 80. Receiver die-bonding bracket sheet; 3. Sub-emitter bracket; 4. Sub-receiver bracket; L1, L2. Vertical distance from the root of the end pin to the positioning through hole or positioning cone; L3. Difference in depth between the second groove and the first groove; L4, L5. Vertical distance from the end pin to the inside of both ends of the sheet. Detailed Implementation

[0022] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0023] The technical solution of this patent will be further described in detail below with reference to specific embodiments.

[0024] Example 1

[0025] Please see Figures 2-4 In this embodiment, a first groove 20, a second groove 30, an emitter die-bonding bracket 40, and a receiver die-bonding bracket 50 are provided on the sheet 10. The first groove 20 and the second groove 30 are opposite to each other and are staggered along the X direction. The two ends of the emitter die-bonding bracket 40 are connected to the first groove 20 and the second groove 30, respectively. The receiver die-bonding bracket 50 is provided on the inner sides of both ends of the sheet 10 and is staggered with the emitter die-bonding bracket 40 along the X direction. This technical solution cleverly arranges the emitter die-bonding bracket 40 and the receiver die-bonding bracket 50 according to the shapes of the die-bonding bracket unit A401 and the die-bonding bracket unit B501. Then, the emitter die-bonding bracket 40 or the receiver die-bonding bracket 50, or both, are closely arranged on the same sheet 10. Finally, the emitter die-bonding bracket 40 and the receiver die-bonding bracket 50 are stacked and fastened by separation and positioning based on the characteristics of the bracket itself.

[0026] like Figure 3As shown, the transmitting die-bonding bracket 40 has positioning through holes 400 at both ends, and die-bonding bracket units A401 are arranged equidistantly along the Y direction in the middle. The distances from the pins 403 at both ends of the bracket to the positioning through holes 400 are L1 and L2, respectively. The receiving die-bonding bracket 50 is connected to the inside of both ends of the sheet 10, and the die-bonding bracket units B501 are arranged equidistantly along the Y direction. The first groove 20 and the second groove 30 are oppositely arranged on the inner sides of both ends of the sheet 10 and are staggered along the X direction. The absolute value of the depth difference between the first groove 20 and the second groove 30 is L3.

[0027] Please see Figure 5 To further explain the process steps required before the transmitter die-bonding bracket 40 and the receiver die-bonding bracket 50 are stacked, the transmitter die-bonding bracket 40 needs to be numbered. When stacking, the receiver die-bonding bracket 50 is flipped left and right, and then the even-numbered row of the transmitter die-bonding bracket 40 is moved to the right by L3 or the odd-numbered row is moved to the left by L3, and then the whole bracket is stacked with the receiver die-bonding bracket 50.

[0028] In actual use, the thickness of sheet 10 is no more than 0.5 mm, and the whole sheet is in the form of a rolled metal strip. The specific process steps are as follows:

[0029] S1: When using sheet 10, the coiled metal strip must be installed on the coil feeder. The feeder pre-processes the coiled metal sheet 10 during the feeding process before it enters the processing equipment for processing. The stamped whole support is then formed. Figure 2 As shown, the pins 403 of die bonder unit A401 and die bonder unit B501, as well as the emitter pad 402 and receiver pad 502, are arranged in a cross-combination manner with unequal L1 and L2 on the same sheet 10 to double the density. Furthermore, the emitter pad 402 and receiver pad 502 are on the same plane under the stamping process, enabling them to share the same die bonder and wire bonder.

[0030] S2: The transmitter chip and receiver chip are fixed to the transmitter pad 402 and receiver pad 502 respectively by die bonding and wire bonding. The transmitter die bond bracket 40 is separated by stamping. Figure 3 As shown, the emitting surface of the emitter die bonder 40 remains on the stamping fixture, and the two ends of the receiver die bonder 50 are connected to the sheet 10 to form a whole;

[0031] S3: The transmitter die bonders 40 are numbered from top to bottom. The receiver die bonders 50 are flipped approximately as follows: Figure 5 As shown, after the even-numbered rows are moved horizontally to the right by L3 or the odd-numbered rows are moved horizontally by L3, the transmitter die bonder 40 and the receiver die bonder 50 are overlapped, wherein the transmitter pad 402 and the receiver pad 502 are in an up-down facing state.

[0032] S4: The positioning through hole 400 and the positioning cone 200 are combined by a stamping die, the combination status is detected by the testing equipment, and finally the emitter die bonder 40 and the receiver die bonder 50 are fastened by one or more combinations of riveting, welding and sintering.

[0033] In summary, this embodiment is applicable to situations where the material sheet 10 has a first groove 20 and a second groove 30 at both ends, and the depths of the first groove 20 and the second groove 30 are unequal. By utilizing the characteristic that the absolute value of the difference between the first groove 20 and the second groove 30 on the material sheet 10 is equal to the absolute value of the difference between L1 and L2, the staggered arrangement between the emitter die-bonding bracket 40 and the receiver die-bonding bracket 50 is achieved, improving the utilization rate of the material sheet 10. Simultaneously, the positioning cones 200 provided in the first groove 20 and the second groove 30 cooperate with the positioning through holes 400 provided on the emitter die-bonding bracket 40, enabling pre-fixation before the emitter die-bonding bracket 40 and the receiver die-bonding bracket 50 are tightened, allowing for accurate detection by both manual labor and equipment.

[0034] Example 2

[0035] Please see Figure 6 In this embodiment, a third groove 60 is provided on the sheet 10, and the pins 403 of the emitter die bond 40 are connected opposite each other to form the emitter die bond 70 and the pins 403 of the receiver die bond 80 are connected opposite each other to form the receiver die bond 80. The emitter pads 402 and receiver pads 502, with unequal L4 and L5, are arranged alternately in the Y direction, and the emitter die bond 70 and receiver die bond 80 are arranged intersectingly in the X direction. Based on the shape of the surface-mount pins 403, this embodiment cleverly combines the emitter die bond 40 and the receiver die bond 50 into a sheet-like assembly. The emitter die bond 70 or the receiver die bond 80, or both, are then closely arranged on the same sheet 10. Finally, the emitter die bond 70 and the receiver die bond 80 are stacked and fastened by separation and positioning based on the characteristics of the bond itself.

[0036] like Figure 7 As shown, after the emitter die-bonding support plate 70 and the receiver die-bonding support plate 80 are separated, one end of each is connected to the material plate 10, and the other end of each is provided with positioning through holes 400 to form a sub-emitter support plate 3 and a sub-receiver support plate 4 respectively.

[0037] In practical use, the thickness of sheet 10 is no greater than 0.5 mm, and the entire sheet is in the form of a rolled metal strip. The specific process steps are as follows:

[0038] S1: When using sheet 10, the coiled metal strip must be installed on the coil feeder. During the feeding process, the feeder pre-processes the coiled metal sheet 10 before it enters the processing equipment for processing, stamping out a complete support sheet, such as... Figure 6As shown, the emitter die bonder 40 pins 403 are connected opposite each other to form the emitter die bonder sheet 70, and the receiver die bonder 50 pins 403 are connected opposite each other to form the receiver die bonder sheet 80. By arranging the emitter pads 402 and receiver pads 502 with unequal L4 and L5 in an alternating manner in the Y direction, and arranging the emitter die bonder sheet 70 and receiver die bonder sheet 80 in an intersecting manner in the X direction, the density is doubled. Furthermore, the emitter pads 402 and receiver pads 502 are on the same plane under the stamping process, enabling them to share the same die bonder and wire bonder.

[0039] S2: The transmitter chip and receiver chip are fixed onto the transmitter pad 402 and receiver pad 502 respectively by die bonding and wire bonding. The entire assembly is formed into sub-transmitter bracket 3 and sub-receiver bracket 4 by stamping and cutting. Figure 7 As shown;

[0040] S3: Fix the transmitting and receiving surfaces of the sub-transmitter bracket 3 and the sub-receiver bracket 4 to the clamps respectively. Then, rotate the sub-transmitter bracket 3 or the sub-receiver bracket 4 180 degrees vertically. Figure 8 As shown, it is then stacked with the unflipped sub-support piece to form a state in which the center of the transmitting pad 402 and the receiving pad 502 are facing each other.

[0041] S4: The positioning through hole 400 and the positioning cone 200 are combined by a stamping die, the combination status is detected by the testing equipment, and finally the emitter die bonder and the receiver die bonder are fastened by one or more combinations of riveting, welding and sintering.

[0042] In summary, this embodiment is applicable to cases where the pins 403 of die bonder unit A401 and die bonder unit B501 are surface-mount. By making L4 and L5 in the emitter die bonder 70 and the receiver die bonder 80 unequal, the emitter pad 402 and the receiver pad 502 are arranged alternately in the Y direction, and the emitter die bonder 70 and the receiver die bonder 80 are arranged intersectingly in the X direction, improving the utilization rate of the die 10. At the same time, the positioning through-hole 400 at one end of the emitter die bonder 70 and the receiver die bonder 80 cooperates with the positioning cone 200 of the third groove 60, which can pre-fix the emitter die bonder 70 and the receiver die bonder 80 before they are tightened, allowing for accurate detection by both manual labor and equipment.

[0043] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element present. Conversely, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations. The terms "upper end," "lower end," "left side," "right side," "front end," "rear end," and similar expressions used herein refer to the positional relationship with reference to the accompanying drawings.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0045] The above embodiments are only used to illustrate the present invention and are not intended to limit the present invention. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, all equivalent technical solutions also fall within the scope of the present invention, and the patent protection scope of the present invention should be defined by the claims.

Claims

1. A die-bonding support for an optocoupler, characterized in that: Includes a die bonder (1), the die bonder (1) comprising The sheet (10), the first groove (20), the second groove (30), the emitter die bonder (40), and the receiver die bonder (50) are all present. The first groove (20) and the second groove (30) are respectively disposed opposite to each other on the inner sides of both ends of the sheet (10) and are staggered along the X direction. The transmitting die-bonding bracket (40) is connected at both ends to the first groove (20) and the second groove (30) respectively, and the receiving die-bonding bracket (50) is disposed on the inner sides of both ends of the sheet (10) and is staggered with the emitter die bonder (40) along the X direction; the emitter die bonder The vertical distance from the root of the pins (403) at both ends of the holder (40) and the receiving die bonder (50) to the positioning through hole (400) or positioning cone (200) The straight distances are L1 and L2, respectively, and the absolute value of the difference between L1 and L2 is equal to the depths of the first groove (20) and the second groove (30). The absolute value of the difference, L3.

2. The die-bonding support for an optocoupler according to claim 1, characterized in that: The second groove (30) Both the first groove (20) and the second groove are provided with a positioning cone (200), the difference being that the positioning cone (200) is provided in the second groove. (30) The opening is located at the bottom of the first groove (20).

3. The die-bonding support for an optocoupler according to claim 1, characterized in that: The die-bonding support for emission (40) includes a positioning through-hole (400) and a die-bonding support unit A (401), wherein the positioning through-hole (400) is disposed on the die-bonding support unit A. At both ends of the frame (40), the die-bonding support unit A (401) is arranged at equal intervals along the Y direction.

4. The die-bonding support for an optocoupler according to claim 1, characterized in that: The receiving die bonder (50) includes die bonded support monomers B (501), which are equidistantly arranged along the Y direction.

5. The die-bonding support for an optocoupler according to claim 3, characterized in that: The die bonder unit A(401) includes pins (403) and a buffer via (404), wherein the pins (403) include through-hole and surface mount types, and the die bond... The bracket unit A (401) also includes a launch pad (402).

6. The die-bonding support for an optocoupler according to claim 4, characterized in that: The die bonder unit B(501) includes pins (403) and a buffer via (404), wherein the pins (403) include through-hole and surface mount types, and the die bond... The bracket unit B (501) also includes a receiving pad (502).

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