Buffer module and electronic device applying the same

Abstract

The application provides a buffer module and an electronic device using the same. The buffer module comprises a base, a buffer member and an elastic member. The base has a groove. The buffer member comprises a spherical body movably arranged in the groove. The elastic member is arranged between the bottom surface of the groove and the spherical body.

Description

TECHNICAL FIELD

[0001] The present application relates to a cushion module and an electronic device using the same. BACKGROUND

[0002] Electronic devices include many electronic components and circuit boards, and the electronic components are usually fixed to the circuit boards by soldering. However, when the electronic device is subjected to an impact force (e.g., falling) or a drop test, the electronic device is subjected to an external force, which can cause the circuit board to be bent and deformed and cause the solder on the circuit board to crack, resulting in poor contact or even component detachment. SUMMARY

[0003] Therefore, the purpose of the present application is to provide a cushion module and an electronic device using the same, which can improve the above-mentioned problems.

[0004] One embodiment of the present application provides a cushion module. The cushion module includes a base, a cushion member, and an elastic member. The base has a recess. The cushion member includes a spherical body movably disposed in the recess. The elastic member is disposed between a bottom surface of the recess and the spherical body.

[0005] According to one embodiment of the present application, the base includes at least one through hole, and the cushion module further includes a limiting member connected to the spherical body and partially located in the at least one through hole.

[0006] According to one embodiment of the present application, the at least one through hole has a height along a first cushioning direction, and the limiting member has a thickness along the first cushioning direction, and the height is greater than the thickness.

[0007] According to one embodiment of the present application, the at least one through hole has a first width along a second cushioning direction, and the limiting member has a second width along the second cushioning direction, and the first width is greater than the second width.

[0008] According to one embodiment of the present application, the spherical body has a first recess and a second recess, and the cushion module further includes a limiting member, and the limiting member includes a first end portion and a second end portion, and the first end portion and the second end portion are respectively disposed in the first recess and the second recess.

[0009] According to one embodiment of the present application, the cushion member further includes a first protruding column connected to the spherical body, and an end portion of the elastic member surrounds the first protruding column.

[0010] According to one embodiment of the present application, the end portion of the elastic member contacts an outer circumferential surface of the first protruding column.

[0011] According to one of the embodiments of the present application, the buffer member further comprises a second protrusion and a flange, the flange connecting the second protrusion and protruding relative to the outer circumferential surface of the second protrusion.

[0012] According to one of the embodiments of the present application, the buffer member further comprises a third protrusion, the second protrusion and the third protrusion being respectively connected to opposite sides of the flange.

[0013] According to one of the embodiments of the present application, the spherical body has an end surface, the end surface and the elastic member being in contact with each other.

[0014] Another embodiment of the present application provides an electronic device. The electronic device comprises a housing, a circuit board and a buffer module. The buffer module connects the housing and the circuit board. The buffer module comprises a base, a buffer member and an elastic member. The base has a recess. The buffer member comprises a spherical body, the spherical body being movably arranged in the recess. The elastic member is arranged between a bottom surface of the recess and the spherical body.

[0015] Based on the above-mentioned buffer module and the electronic device using the same according to the embodiments of the present application, the buffer member is movably arranged relative to the base by the spherical body, so that a buffer stroke can be provided. In the buffer stroke, the elastic member can absorb external force, so as to reduce the damage of the external force to the electronic device. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to have a better understanding of the above-mentioned and other aspects of the present application, the following embodiments are described in detail below with reference to the accompanying drawings:

[0017] Figure 1 and Figure 2 FIG. 1 shows a perspective view of an electronic device according to an embodiment of the present application.

[0018] Figure 3 FIG. 2 shows a bottom view of the electronic device of FIG. 1. Figure 1

[0019] FIG. 3 shows a cross-sectional view of the electronic device of FIG. 1 along direction 3-3’. Figure 4 Figure 3 FIG. 4 shows a cross-sectional view of the electronic device of FIG. 1 along direction 4-4’.

[0020] Figure 5 Figure 2 FIG. 5 shows an exploded view of the buffer module of FIG. 1.

[0021] The reference signs are as follows:

[0022] 100: electronic device

[0023] 110: housing

[0024] 120: circuit board

[0025] 120a: through hole ​​

[0026] 130: buffer module

[0027] 131: base

[0028] 131a: first through hole

[0029] 131b: second through hole

[0030] 131c: bottom surface

[0031] 131r: recess

[0032] 131s, 1322s, 1323s: outer peripheral surface

[0033] 132: buffer

[0034] 132a: fixing hole

[0035] 1321: spherical body

[0036] 1321a: first recess

[0037] 1321b: second recess

[0038] 1321c: end surface

[0039] 1322: first protrusion

[0040] 1323: second protrusion

[0041] 1324: flange

[0042] 1325: third protrusion

[0043] 1325e: end surface

[0044] 133: elastic member

[0045] 1331: end portion

[0046] 134: limiting member

[0047] 1341: first end portion

[0048] 1342: second end portion

[0049] 1343: surrounding portion

[0050] 140: fixing member

[0051] H1: height

[0052] T1: thickness

[0053] W1: first width

[0054] W2: second width

[0055] X: Direction

[0056] Y: Second buffer direction

[0057] Z: First buffer direction Detailed Implementation

[0058] Please refer to Figures 1-5 , Figure 1 and Figure 2 The diagrams show an electronic device 100 according to an embodiment of the present invention from different viewing angles. Figure 3 Show Figure 1 A bottom view of the electronic device 100. Figure 4 Show Figure 3 A cross-sectional view of the electronic device 100 along direction 4-4', and Figure 5 Show Figure 2 An exploded view of the buffer module 130.

[0059] As shown in Figures 1 and 2, the electronic device 100 includes a housing 110, a circuit board 120, and at least one buffer module 130. The buffer module 130 is connected to the housing 110 and the circuit board 120. Thus, when the electronic device 100 is subjected to an external force (e.g., an impact force), the buffer module 130 can absorb the external force and reduce the damage to the electronic device 100.

[0060] like Figure 3 As shown, the number of buffer modules 130 can be four, respectively arranged near the four corners of the housing 110 of the electronic device 100, but is not limited thereto. The number of buffer modules can be adjusted based on the size of the circuit board 120. Figure 4 As shown, the electronic device 100 also includes at least one fixing member 140, and the circuit board 120 includes at least one through hole 120a. Each fixing member 140 can pass through the corresponding through hole 120a of the circuit board 120 and be fixed to the buffer module 130 to connect the buffer module 130 and the circuit board 120 to each other.

[0061] like Figures 4-5 As shown, the buffer module 130 includes a base 131, a buffer member 132, and an elastic member 133. The base 131 has a groove 131r. The buffer member 132 includes a spherical body 1321, which is movably disposed within the groove 131r. The elastic member 133 is disposed between the bottom surface 131c of the groove 131r and the spherical body 1321. The buffer member 132 provides a buffer stroke by movably displacing the spherical body 1321 relative to the base 131. During the buffer stroke, the elastic member 133 can absorb external forces, reducing damage to the electronic device 100. In addition, the elastic member 133 can also guide the spherical body 1321, which has moved due to the buffer stroke, back to its original position.

[0062] like Figure 4As shown, there is a gap between the spherical body 1321 and the groove 131r of the base 131, so that the spherical body 1321 can rotate and / or swing relative to the base 131.

[0063] like Figure 4 and Figure 5 As shown, the base 131 further includes at least one through hole, such as a first through hole 131a and a second through hole 131b. The buffer module 130 also includes a limiting member 134. The limiting member 134 is connected to the spherical body 1321 and is partially located within the first through hole 131a. In this embodiment, the first through hole 131a and the second through hole 131b are configured opposite to each other. The limiting member 134 has a first end 1341 and a second end 1342, which are configured opposite to each other. The first end 1341 passes through the first through hole 131a, and the second end 1342 passes through the second through hole 131b. In this embodiment, the limiting member 134 is, for example, an annular body with an opening, such as a C-ring, which also includes a surrounding portion 1343, wherein the first end 1341 and the second end 1342 are connected to the surrounding portion 1343. In one embodiment, the surrounding portion 1343, the first end portion 1341, and the second end portion 1342 are, for example, integrally formed structures, but the embodiments of the present invention are not limited thereto. When the limiting member 134 is connected to the base 131, the surrounding portion 1343 surrounds a portion of the outer peripheral surface 131s of the base 131.

[0064] like Figure 4 and Figure 5 As shown, the sphere 1321 has a first recess 1321a and a second recess 1321b. The first recess 1321a and the second recess 1321b are arranged opposite to each other. The first end 1341 and the second end 1342 of the limiting member 134 are respectively disposed in the first recess 1321a and the second recess 1321b, so that the limiting member 134 is connected to the sphere 1321. In addition, the first through hole 131a corresponds to the first recess 1321a in the X direction, so that the first end 1341 of the limiting member 134 can be disposed in the first recess 1321a through the first through hole 131a. Similarly, the second through hole 131b corresponds to the second recess 1321b in the X direction, so that the second end 1342 of the limiting member 134 can be disposed in the second recess 1321b through the second through hole 131b. The X direction, Y direction and Z direction in the figure are perpendicular to each other.

[0065] like Figure 4 and Figure 5As shown, the first end 1341 and the second end 1342 of the stopper 134 can be interferingly (e.g., snap-fittingly) engaged with the first hole 131a and the second hole 131b, respectively, or can be loosely or transitionally fitted with the first hole 131a and the second hole 131b. In addition, the first hole 131a is in communication with the recess 131r, such that the first end 1341 of the stopper 134 can pass through the first hole 131a and enter the recess 131r to be connected to the first recessed hole 1321a. Similarly, the second hole 131b is in communication with the recess 131r, such that the second end 1342 of the stopper 134 can pass through the second hole 131b and enter the recess 131r to be connected to the second recessed hole 1321b.

[0066] As shown in FIG. 1, the stopper 134 is movable relative to the first hole 131a and the second hole 131b, such that the buffer module 130 can provide a buffer stroke in at least one direction. In the present embodiment, the buffer module 130 can provide buffer strokes in at least two different directions. Further illustration is provided below. Figure 4

[0067] As shown in FIG. 1, the first hole 131a has a height H1 along the first buffer direction Z, and the first end 1341 of the stopper 134 has a thickness T1 along the first buffer direction Z, where the height H1 is greater than the thickness T1, such that the stopper 134 is movable along the first buffer direction Z. In this way, when the buffer module 130 is subjected to an external force along the first buffer direction Z, the buffer member 132 can be displaced along the first buffer direction Z, and the elastic member 133 can absorb the external force during the buffer stroke along the first buffer direction Z, thereby preventing the external force from excessively damaging the elements of the electronic device 100, such as the circuit board 120 and / or other components, and preventing electronic components on the circuit board 120 from being detached from the circuit board 120. Figure 4

[0068] Figure 4 Figure 5 ​​​​As shown, the first through hole 131a has a first width W1 along a second buffering direction Y. In other words, the first through hole 131a has a first width W1 along the circumferential direction of the base 131. The first end 1341 of the limiting member 134 has a second width W2 along the second buffering direction Y (or along the circumferential direction), and the first width W1 is greater than the second width W2. Thus, when the buffer module 130 is subjected to an external force along the second buffering direction Y, the buffer member 132 can be displaced along the second buffering direction Y. During the buffering stroke along the second buffering direction Y, the elastic member 133 can absorb external force or vibration energy, preventing excessive damage to the components of the electronic device 100, such as the circuit board 120 and / or other components, and preventing electronic components on the circuit board 120 from detaching from the circuit board 120. In addition, there is a gap along the direction Y between the peripheral surface of the spherical body 1321 and the inner sidewall of the groove 131r, allowing the buffer member 132 to be displaced relative to the groove 131r along the second buffering direction Y.

[0069] like Figure 4 and Figure 5 As shown, a gap exists along direction X between the peripheral surface of the spherical body 1321 and the inner wall of the groove 131r. Thus, when the buffer module 130 is subjected to an external force along direction X, the buffer member 132 can be displaced along direction X. During the buffering stroke along direction X, the elastic member 133 can absorb external force or vibration energy, preventing excessive damage to the components of the electronic device 100, such as the circuit board 120 and / or other parts, and preventing electronic components on the circuit board 120 from detaching from the circuit board 120.

[0070] like Figure 4 and Figure 5 As shown, due to the spherical design of the sphere 1321, and the gap between the peripheral surface of the sphere 1321 and the inner wall of the groove 131r, the peripheral surface of the sphere 1321 does not contact the inner wall of the groove 131r. Instead, it is suspended in the groove 131r by the elastic element 133. Therefore, the sphere 1321 is allowed to rotate or yaw relative to the groove 131r in the X, Y, and Z directions. When the sphere 1321 rotates or yaws relative to the groove 131r, the elastic element 133 can absorb external forces or vibration energy, preventing excessive damage to the components of the electronic device 100, such as the circuit board 120 and / or other parts, and preventing electronic components on the circuit board 120 from detaching from the circuit board 120.

[0071] In summary, the sphere 1321 has three translational degrees of freedom and three rotational degrees of freedom relative to the groove 131r, covering all degrees of freedom of movement in space.

[0072] like Figure 4 and Figure 5As shown, the elastic element 133 is, for example, a spring, such as a compression spring, but the embodiments of the present invention are not limited thereto. The spherical body 1321 has an end face 1321c, and the elastic element 133 is spaced apart from the end face 1321c; or, the end face 1321c and the elastic element 133 can contact each other. Thus, when the buffer module 130 is subjected to an external force or vibration energy along the first buffering direction Z, because the spherical body 1321 contacts the elastic element 133, it can immediately cause the elastic element 133 to deform, so that the elastic element 133 immediately absorbs the vibration energy. Therefore, the buffer module 130 has the characteristic of the fastest buffering response time. Furthermore, the elastic element 133 can be pre-compressed, thus having a pre-deformation, so that the elastic element 133 bears a pre-pressure; or, the elastic element 133 can lightly touch the end face 1321c without pre-compression, in which case the elastic element 133 does not bear a pre-pressure. When the buffer module 130 is subjected to external force or vibration energy along the first buffer direction Z, the buffer member 132 is displaced, which in turn causes the elastic member 133 to be displaced, causing the elastic member 133 to deform and store elastic potential energy (absorbing vibration energy). Since the elastic member 133 can absorb vibration energy, damage to the electronic device 100 can be avoided or the degree of damage to the electronic device 100 can be reduced.

[0073] Furthermore, the relative size and connection between the second end 1342 of the limiting member 134 and the second through hole 131b can be similar to the relative size and connection between the first end 1341 and the first through hole 131a described above, and will not be repeated here.

[0074] like Figure 4 and Figure 5 As shown, the buffer 132 further includes a first protrusion 1322, which is connected to the spherical body 1321. For example, the first protrusion 1322 is connected to the end face 1321c of the spherical body 1321 and protrudes relative to the end face 1321c. The end 1331 of the elastic member 133 surrounds the first protrusion 1322. Thus, when the buffer 132 wobbles, for example, when the buffer module 130 rotates about the first buffering direction Z, the first protrusion 1322 can cause the elastic member 133 to deform to store elastic potential energy (absorb vibration energy). In one embodiment, the inner peripheral surface of the end 1331 of the elastic member 133 can contact the outer peripheral surface 1322s of the first protrusion 1322. Thus, when the buffer 132 wobbles, since the first protrusion 1322 contacts the elastic member 133, it can immediately cause the elastic member 133 to deform, so that the elastic member 133 can immediately absorb vibration energy. In another embodiment, the end 1331 of the elastic member 133 may also be connected to the end face 1321c of the sphere 1321, but only adjacent to, but not in contact with, the outer peripheral surface 1322s of the first protrusion 1322.

[0075] like Figure 4 and Figure 5As shown, the buffer 132 also includes a second protrusion 1323 and a flange 1324. The flange 1324 connects to the second protrusion 1323 and protrudes relative to the outer peripheral surface 1323s of the second protrusion 1323, allowing the circuit board 120 to rest against the outwardly protruding flange 1324.

[0076] like Figure 4 and Figure 5 As shown, the buffer 132 further includes a third protrusion 1325. The second protrusion 1323 and the third protrusion 1325 are respectively connected to opposite sides of the flange 1324, for example, respectively connected to opposite end faces of the flange 1324. The third protrusion 1325 passes through or is located in the through hole 120a of the circuit board 120, and the circuit board 120 abuts against the end face of the flange 1324. The buffer 132 has a fixing hole 132a, which extends from the end face 1325e of the third protrusion 1325 toward the spherical body 1321, and may extend, for example, to the flange 1324, the second protrusion 1323, or even the spherical body 1321. In one embodiment, the fixing hole 132a is, for example, a screw hole, and the fixing member 140 is, for example, a male threaded element (e.g., a screw), which can be screwed into the fixing hole 132a to connect the circuit board 120 and the buffer module 130 to each other. In another embodiment, the fixing hole 132a may not have an internal thread, and the fixing member 140 may engage with the fixing hole 132a and press the circuit board 120 against the flange 1324 of the buffer module 130.

[0077] In summary, this invention provides a buffer module that can connect a housing and a circuit board of an electronic device to absorb the energy generated by external forces acting on the electronic device, reducing the degree of damage to the electronic device, or even preventing damage to the electronic device. Furthermore, the buffer module can provide buffer travel in at least one direction, thus exhibiting excellent vibration resistance even when subjected to impacts from external forces in different directions.

[0078] In summary, although the present invention has been disclosed above with reference to embodiments, it is not intended to limit the invention. Those skilled in the art to which this invention pertains can make various modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of protection of this invention shall be determined by the appended claims.

Claims

1. A cushioning module characterized by, The application relates to a buffer module, comprising: a base having a recess, the base comprising at least one through hole; a buffer member comprising a spherical body movably arranged in the recess; a resilient member arranged between a bottom surface of the recess and the spherical body; and a limiting member connected to the spherical body and partially located in the at least one through hole; wherein the at least one through hole has a first width along a circumferential direction, and the limiting member has a second width along the circumferential direction, the first width being greater than the second width. The at least one through hole has a height along a first buffer direction, and the limiting member has a thickness along the first buffer direction, the height being greater than the thickness.

2. The cushioning module of claim 1, wherein, The spherical body has a first recess and a second recess, and the limiting member comprises a first end portion and a second end portion, the first end portion and the second end portion being arranged in the first recess and the second recess respectively.

3. The cushioning module of claim 1, wherein, The buffer member further comprises a first protrusion connected to the spherical body, and an end portion of the resilient member surrounds the first protrusion.

4. The cushioning module of claim 1, wherein, The end portion of the resilient member contacts an outer circumferential surface of the first protrusion.

5. The cushioning module of claim 4, wherein, The buffer member further comprises a second protrusion and a flange, the flange connecting the second protrusion and protruding relative to an outer circumferential surface of the second protrusion.

6. The cushioning module of claim 1, wherein, The buffer member further comprises a third protrusion, the second protrusion and the third protrusion being connected to opposite sides of the flange respectively.

7. The cushioning module of claim 6, wherein, The spherical body has an end surface, and the end surface and the resilient member contact each other.

8. The cushioning module of claim 1, wherein, The application relates to a buffer module, comprising:

9. An electronic device, comprising: a housing; a circuit board; and a buffer module as claimed in any one of claims 1 to 8, wherein the buffer module connects the housing and the circuit board. ​ ​

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