Quick conditioning device for electronic component heating and pressurizing treatment furnace

Abstract

The present application provides a kind of electronic component heating and pressurizing treatment furnace fast preparation device, including a containing space in the furnace;At least one heating device, is arranged in the containing space to adjust the temperature in the containing space to a predetermined temperature;At least one pressurizing device, to adjust the pressure in the containing space to a predetermined pressure greater than 1atm;At least one replaceable heat insulation liner, including an outer layer and an inner layer;And a fan, is arranged in the containing space, and is connected to a driving motor via a transmission shaft protruding from the cavity, whereby, contaminated and clean replaceable heat insulation liner can be quickly replaced, and is forced in the furnace using a plurality of radial expansion structures and a plurality of C-shaped rings, so that the preparation work can be quickly completed, the downtime maintenance time is greatly shortened, effectively increases production efficiency and capacity.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic component processing furnace, in particular to a kind of electronic component heating and pressurizing processing furnace quick preparation device, and its contaminated and clean replacement heat insulation bushing can be quickly replaced. BACKGROUND

[0002] In the process of manufacturing electronic components, processing furnace with heating and pressurizing function is often used, and part of process chemicals in the heating process of the known heating and pressurizing function processing furnace will diffuse in the processing chamber due to volatilization or evaporation, when cooling process, gaseous process chemicals floating in the processing chamber condense to form pollutants attached to the inner wall of the cavity, causing the machine to be shut down for cleaning and maintenance after a period of time, so that the cleaning and maintenance cost of the furnace is high and time-consuming, which causes the production time to be compressed and the production capacity to be reduced, however, the processing of electronic components cannot be stopped for too long, which easily causes the whole production line to fail to operate smoothly, in addition to low efficiency, also seriously affects production capacity, therefore, the cleaning work is stopped for too long, and it is necessary to improve.

[0003] Therefore, in view of the problems existing in the above-mentioned prior art structure, how to develop an innovative structure with more ideal practicality is the earnest expectation of consumers, and is also the goal and direction that relevant persons in the industry should strive to break through.

[0004] Therefore, the inventor, based on years of experience in manufacturing, developing and designing related products, and in view of the above-mentioned goal, has finally developed a practical application after careful design and evaluation. SUMMARY

[0005] The main purpose of the present application is to provide a kind of electronic component heating and pressurizing processing furnace quick preparation device, wherein pollutants will be attached during production process in the furnace, the heat insulation bushing of the accommodating space surface is set as replacement heat insulation bushing, so when its pollutants are attached and it becomes contaminated replacement heat insulation bushing, only clean replacement heat insulation bushing needs to be replaced, and production operation can continue, so that the downtime is compressed to a very short time, which can increase production efficiency and production capacity.

[0006] To achieve the above purpose, the present application provides a kind of electronic component heating and pressurizing processing furnace quick preparation device, which is characterized by comprising:

[0007] A cavity, the cavity includes a door and a barrel body, and the barrel body forms an accommodating space inside;

[0008] At least one heating device is arranged in the accommodating space, and is used to adjust the temperature in the accommodating space to a predetermined temperature;

[0009] At least one alternative heat insulating sleeve is provided with a C-shaped cross section, comprising an outer layer and an inner layer, wherein the outer layer is arranged on the inner wall of the barrel, and the inner layer is arranged inside the accommodating space relative to the outer layer to form a closed heat insulating space between the outer layer and the inner layer, the thickness of the inner layer is smaller than the thickness of the barrel part corresponding to the alternative heat insulating sleeve, and a plurality of radial expansion structures are arranged in a slot of the alternative heat insulating sleeve in an axial direction, so that the alternative heat insulating sleeve has radial expansion force support and can be fixed in the barrel or detached from the barrel.

[0010] A first pressurizing device is used to adjust the pressure in the accommodating space to a predetermined pressure greater than 1 atm; and

[0011] A fan is arranged in the accommodating space and connected to a driving motor through a transmission shaft protruding from the barrel, and the fan is driven to rotate by the driving motor to improve the temperature adjustment efficiency of the heating device on the accommodating space.

[0012] The electronic component heating and pressurizing treatment furnace rapid preparation device, wherein: the closed heat insulating space is arranged in a non-sealed manner, the pressure in the closed heat insulating space of the alternative heat insulating sleeve is adjusted to a pressure substantially the same as the pressure in the accommodating space by the first pressurizing device, so as to prevent the alternative heat insulating sleeve from deforming when the pressure in the accommodating space changes.

[0013] The electronic component heating and pressurizing treatment furnace rapid preparation device, wherein: a second pressurizing device is further included, and the closed heat insulating space is arranged in a sealed manner, and the second pressurizing device is operated in a manner that the pressure in the accommodating space and the pressure in the closed heat insulating space are substantially simultaneously adjusted to the predetermined pressure.

[0014] The electronic component heating and pressurizing treatment furnace rapid preparation device, wherein: the inner layer is arranged in an axial direction with a plurality of C-shaped rings, and the two ends of the C-shaped rings are locked with a tensioning structure for tensioning and fixing the alternative heat insulating sleeve or detaching the C-shaped rings from the alternative heat insulating sleeve.

[0015] The electronic component heating and pressurizing treatment furnace rapid preparation device, wherein: one end of the tensioning structure is provided with a right-handed thread, and the other end is provided with a left-handed thread, and the C-shaped rings are quickly locked or loosened.

[0016] The electronic component heating and pressurizing treatment furnace rapid preparation device, wherein: the C-shaped rings are uniformly arranged, and each C-shaped ring uniformly applies force to the alternative heat insulating sleeve to tightly fix the alternative heat insulating sleeve to the surface of the inner layer.

[0017] The electronic component heating and pressurizing processing furnace rapid preparation device further comprises at least one partition member for partitioning the enclosed thermal insulation space into multiple regions.

[0018] The electronic component heating and pressurizing processing furnace rapid preparation device, wherein the partition member is made of metal.

[0019] The electronic component heating and pressurizing processing furnace rapid preparation device further comprises a particle detector connected to the enclosed thermal insulation space for detecting the particle content discharged from the enclosed thermal insulation space.

[0020] An electronic component heating and pressurizing processing furnace rapid preparation device, comprising:

[0021] a cavity comprising a door and a barrel, the barrel having an internal space;

[0022] at least one heating device arranged in the internal space and used for adjusting the temperature in the internal space to a predetermined temperature;

[0023] at least one replaceable thermal insulation liner having a C-shaped cross section, comprising an outer layer arranged on the inner wall of the barrel and an inner layer arranged inside the internal space relative to the outer layer to form an enclosed thermal insulation space between the outer layer and the inner layer, the thickness of the inner layer being smaller than the thickness of the part of the barrel corresponding to the replaceable thermal insulation liner, and a plate group protruding into the internal space arranged at the gap between the two ends of the replaceable thermal insulation liner, the plate group being combined with a plurality of radial expansion structures to provide the replaceable thermal insulation liner with radial expansion force support, so that the replaceable thermal insulation liner can be fixed on or detached from the inner wall of the barrel;

[0024] a first pressurizing device used for adjusting the pressure in the internal space to a predetermined pressure greater than 1 atm; and

[0025] a fan arranged in the internal space and connected to a driving motor via a transmission shaft protruding out of the barrel, the driving motor being used to drive the fan to rotate to improve the temperature adjusting efficiency of the heating device on the internal space.

[0026] The electronic component heating and pressurizing processing furnace rapid preparation device, wherein the enclosed thermal insulation space is arranged in a non-sealed manner, the pressure in the enclosed thermal insulation space of the replaceable thermal insulation liner is adjusted by the first pressurizing device to a pressure substantially the same as the pressure in the internal space, so as to prevent the replaceable thermal insulation liner from deforming when the pressure in the internal space changes.

[0027] The rapid preparation device for the electronic component heating and pressurizing furnace includes: several C-shaped rings arranged axially in the inner layer toward the accommodating space; each C-shaped ring is secured with a tensioning structure at both ends to tension and fix the replaceable heat insulation bushing or to remove the C-shaped ring from the replaceable heat insulation bushing in the opposite direction.

[0028] The aforementioned rapid preparation device for the electronic component heating and pressurizing furnace, wherein: the first pressurizing device is operated in such a way that the pressure in the accommodating space and the pressure in the enclosed insulated space are substantially simultaneously adjusted to the predetermined pressure.

[0029] The aforementioned rapid preparation device for heating and pressurizing electronic components furnace, wherein: the enclosed insulated space is filled with a substance with a thermal conductivity of less than 16 W / mK.

[0030] The aforementioned rapid preparation device for heating and pressurizing electronic components furnace, wherein the substance is a gas.

[0031] The aforementioned rapid preparation device for heating and pressurizing electronic components furnace, wherein the gas is air or nitrogen.

[0032] The aforementioned rapid preparation device for heating and pressurizing electronic components furnace, wherein the substance is carbon, glass, Teflon, or water.

[0033] The aforementioned rapid preparation device for the electronic component heating and pressurization furnace, wherein: the replaceable heat insulation bushing is made of metal.

[0034] Accordingly, contaminated and clean replacement insulation bushings can be quickly replaced, and multiple radial expansion structures and multiple C-rings can be used to press them into the furnace, thus enabling rapid preparation work, significantly reducing downtime for maintenance, and effectively increasing production efficiency and capacity.

[0035] The techniques, methods, and effects of this invention are described in detail below with reference to a preferred embodiment and accompanying drawings. It is believed that the above-mentioned objectives, structure, and features of this invention can be understood in depth and in detail from these examples. Attached Figure Description

[0036] Figure 1 This is a three-dimensional schematic diagram of one embodiment of the present invention.

[0037] Figure 2 This is a front view schematic diagram of an embodiment of the present invention.

[0038] Figure 3A for Figure 2 A schematic diagram of the AA cross-section.

[0039] Figure 3B for Figure 3A A magnified view of section 3B in the image.

[0040] Figure 4 The action profile of replacing the alternative heat insulation bushing for one embodiment of the present application.

[0041] Figure 5 The perspective view of the alternative heat insulation bushing for one embodiment of the present application.

[0042] Figure 6 The side profile view of the alternative heat insulation bushing for one embodiment of the present application.

[0043] Figure 7A The side profile view of another embodiment of the present application.

[0044] Figure 7B The partial enlarged view of 7B in Figure 7A

[0045] Figure 8 The perspective view of the alternative heat insulation bushing for another embodiment of the present application.

[0046] Figure 9 The side profile view of the alternative heat insulation bushing for another embodiment of the present application.

[0047] Figure 10 The side profile view of another embodiment of the present application.

[0048] Figure 11 The side profile view of another embodiment of the present application.

[0049] BRIEF DESCRIPTION OF DRAWINGS 10 cavity; 11 door; 12 barrel; 13 accommodating space; 14 transmission shaft; 15 driving motor; 20 heating device; 30 alternative heat insulation bushing; 31 outer layer; 32 inner layer; 33 enclosed heat insulation space; 35 slot; 351 radial expansion structure; 36 C-shaped ring; 37 tensioning structure; 30a alternative heat insulation bushing; 31a outer layer; 32a inner layer; 33a enclosed heat insulation space; 35a slot; 351a radial expansion structure; 36a C-shaped ring; 37a tensioning structure; 38a plate group; 41 first pressurizing device; 42 second pressurizing device; 50 fan; 60 particulate detector; 70 partition. DETAILED DESCRIPTION

[0050] The present application provides a design of a rapid preparation device for an electronic component heating and pressurizing treatment furnace.

[0051] In order to have a further understanding and knowledge of the purposes, features and effects of the present application, the following embodiments and drawings are provided for detailed description:

[0052] Reference is made to Figures 1 to 6 ​As shown, an embodiment of the present application provides a rapid conditioning device for an electronic component heating and pressurizing processing furnace, comprising:

[0053] a cavity 10, which comprises a door 11 and a barrel body 12, and the barrel body 12 forms an accommodation space 13 inside;

[0054] at least one heating device 20, which is arranged in the accommodation space 13 and is used to adjust the temperature in the accommodation space 13 to a predetermined temperature;

[0055] at least one replaceable thermal insulation sleeve 30, which is arranged in a C-shaped cross section, comprises an outer layer 31 and an inner layer 32, wherein the outer layer 31 is arranged on the inner wall of the barrel body 12, and the inner layer 32 is arranged inside the accommodation space 13 relative to the outer layer 31 to form a closed thermal insulation space 33 between the outer layer 31 and the inner layer 32, and the distance between the outer layer 31 and the inner layer 32 is greater than 1 μm, the thickness of the inner layer 32 is less than the thickness of the part of the barrel body 12 corresponding to the replaceable thermal insulation sleeve 30, and a plurality of radial expansion structures 351 are arranged in a slot gap 35 of the replaceable thermal insulation sleeve 30 in an axial arrangement, so that the replaceable thermal insulation sleeve 30 has radial expansion force support and can be fixed in the barrel body 12 or detached from the inner wall of the barrel body 12;

[0056] a first pressurizing device 41, which is used to adjust the pressure in the accommodation space 13 to a predetermined pressure greater than 1 atm; and

[0057] a fan 50, which is arranged in the accommodation space 13 and is connected to a drive motor 15 through a transmission shaft 14 protruding from the barrel body 12, and the drive motor 15 drives the fan 50 to rotate to improve the temperature adjustment efficiency of the heating device 20 on the accommodation space 13.

[0058] Referring to Figure 1 and Figures 7A to 9 As shown, another embodiment of the present application provides a rapid conditioning device for an electronic component heating and pressurizing processing furnace, comprising:

[0059] a cavity 10, which comprises a door 11 and a barrel body 12, and the barrel body 12 forms an accommodation space 13 inside;

[0060] at least one heating device 20, which is arranged in the accommodation space 13 and is used to adjust the temperature in the accommodation space 13 to a predetermined temperature;

[0061] At least one alternative heat insulation liner 30a is provided in a C-shaped cross section, comprising an outer layer 31a and an inner layer 32a, wherein the outer layer 31a is arranged on the inner wall of the barrel 12, and the inner layer 32a is arranged inside the barrel 12 relative to the outer layer 31a to form a closed heat insulation space 33a between the outer layer 31a and the inner layer 32a, and the distance between the outer layer 31a and the inner layer 32a is greater than 1 μm, and the thickness of the inner layer 32a is less than the thickness of the barrel 12 corresponding to the alternative heat insulation liner 30a; the alternative heat insulation liner 30a is provided with a plate group 38a protruding into the accommodating space 13 at the gap 35a of the two ends of the alternative heat insulation liner 30a, and the plate group 38a is combined with a plurality of radial expansion structures 351a, so that the alternative heat insulation liner 30a has radial expansion force support, and can be fixed on the inner wall of the barrel 12, or be detached from the inner wall of the barrel 12.

[0062] A first pressurizing device 41 is used to adjust the pressure in the accommodating space 13 to a predetermined pressure greater than 1 atm; and

[0063] A fan 50 is arranged in the accommodating space 13, and is connected to a driving motor 15 through a driving shaft 14 protruding out of the barrel 12, and the driving motor 15 drives the fan 50 to rotate, so as to improve the temperature adjusting efficiency of the heating device 20 on the accommodating space 13.

[0064] Referring to Figures 1 to 6 The electronic component heating and pressurizing treatment furnace rapid preparation device is characterized in that the closed heat insulation space 33 is arranged in a non-sealed manner, the pressure in the closed heat insulation space 33 of the alternative heat insulation liner 30 is adjusted to a pressure substantially the same as the pressure in the accommodating space 13 by the first pressurizing device 41, so as to prevent the alternative heat insulation liner 30 from being deformed when the pressure in the accommodating space 13 changes.

[0065] Referring to Figures 1 to 6 The electronic component heating and pressurizing treatment furnace rapid preparation device is characterized in that the inner layer 32 is arranged in an axial arrangement in the accommodating space 13, and the C-shaped ring 36 is provided with a tensioning structure 37 at the two ends, so as to tensionally fix the alternative heat insulation liner 30 or detach the C-shaped ring 36 from the alternative heat insulation liner 30, and the tensioning structure 37 can adjust the tensioning force according to the compressive strength of the alternative heat insulation liner 30, so that the C-shaped ring 36 tightly fixes the alternative heat insulation liner 30 on the surface of the inner layer 32, thereby enhancing the fixing effect of the alternative heat insulation liner 30.

[0066] Referring to Figures 1 to 6As shown, the electronic component heating and pressurizing treatment furnace quick preparation device, wherein the tensioning structure 37 is provided with right-handed threads at one end and left-handed threads at the other end, and the C-shaped ring 36 is locked or loosened quickly.

[0067] As shown, Figures 1 to 6 As shown, the electronic component heating and pressurizing treatment furnace quick preparation device, wherein the C-shaped rings 36 are uniformly arranged, and each C-shaped ring 36 uniformly applies force to the replaceable heat insulation liner 30 to fasten the replaceable heat insulation liner 30 to the surface of the inner layer 32, thereby enhancing the fixing effect of the replaceable heat insulation liner 30.

[0068] As shown, Figures 7A to 9 As shown, the electronic component heating and pressurizing treatment furnace quick preparation device, wherein the enclosed heat insulation space 33a is arranged in a non-sealed manner, the pressure in the enclosed heat insulation space 33a of the replaceable heat insulation liner 30a is adjusted to be substantially the same as the pressure in the accommodating space 13 by the first pressurizing device 41, thereby preventing the replaceable heat insulation liner 30a from deforming when the pressure in the accommodating space 13 changes.

[0069] As shown, Figures 7A to 9 As shown, the electronic component heating and pressurizing treatment furnace quick preparation device, wherein the inner layer 32a is arranged in an axial direction to the accommodating space 13 and is provided with a plurality of C-shaped rings 36a, and the two ends of each C-shaped ring 36a are lockably provided with a tensioning structure 37a, so as to tensionally fix the replaceable heat insulation liner 30a or reversely detach the C-shaped ring 36a from the replaceable heat insulation liner 30a, and the tensioning structure 37a can adjust the tensioning force according to the compressive strength of the replaceable heat insulation liner 30a, so that the C-shaped ring 36a fastens the replaceable heat insulation liner 30a to the surface of the inner layer 32a, thereby enhancing the fixing effect of the replaceable heat insulation liner 30a.

[0070] As shown, Figure 3A , Figure 3B , Figure 7A and Figure 7B As shown, the electronic component heating and pressurizing treatment furnace quick preparation device, wherein the first pressurizing device 41 is operated in a manner that the pressure in the accommodating space 13 and the pressure in the enclosed heat insulation space 33, 33a are substantially simultaneously adjusted to the predetermined pressure.

[0071] As shown, Figures 1 to 6 and Figure 11 As shown, the electronic component heating and pressurizing treatment furnace quick preparation device further comprises a second pressurizing device 42, and the enclosed heat insulation space 33 is arranged in a sealed manner, and the second pressurizing device 42 is operated in a manner that the pressure in the accommodating space 13 and the pressure in the enclosed heat insulation space 33 are substantially simultaneously adjusted to the predetermined pressure.

[0072] Referring to Figure 3A , Figure 3B , Figure 10 and Figure 11 , the electronic component heat and pressure treatment furnace rapid preparation device further comprises a particle detector 60 connected to the enclosed and insulated space 33 to detect the particle content discharged from the enclosed and insulated space 33, so as to determine whether the filler material in the enclosed and insulated space 33 needs to be supplemented or replaced to rapidly replace the replaceable insulation liner 30.

[0073] Referring to Figure 6 and Figure 9 , the electronic component heat and pressure treatment furnace rapid preparation device, wherein the enclosed and insulated space 33, 33a is filled with a substance having a thermal conductivity of less than 16 W / mK.

[0074] The electronic component heat and pressure treatment furnace rapid preparation device, wherein the substance is a gas.

[0075] The electronic component heat and pressure treatment furnace rapid preparation device, wherein the gas is air or nitrogen.

[0076] The electronic component heat and pressure treatment furnace rapid preparation device, wherein the substance is carbon, glass, Teflon or water.

[0077] Referring to Figures 5 to 9 , the electronic component heat and pressure treatment furnace rapid preparation device, wherein the replaceable insulation liner 30, 30a is made of metal.

[0078] Referring to Figure 3A , Figure 4 , Figure 6 , Figure 10 and Figure 11 , the electronic component heat and pressure treatment furnace rapid preparation device further comprises at least one partition 70 for dividing the enclosed and insulated space 33 into multiple regions.

[0079] Referring to Figure 3A , Figure 4 , Figure 6 , Figure 10 and Figure 11 , the electronic component heat and pressure treatment furnace rapid preparation device, wherein the partition 70 is made of metal.

[0080] From the above, the electronic component heating and pressurizing treatment furnace rapid preparation device of the present application is the first in the industry and meets the novelty requirement of the invention patent. The overall innovative design meets the progress requirement of the invention patent. In the production process in the furnace, pollutants may be attached. The heat insulation sleeve of the accommodating space periphery is designed as a replaceable heat insulation sleeve. When the pollutants are attached and the heat insulation sleeve becomes a contaminated replaceable heat insulation sleeve, only a clean replaceable heat insulation sleeve needs to be replaced, and the production operation can continue, the downtime is compressed to a very short time, the production efficiency and capacity can be increased, and the better industrial applicability is met.

[0081] The above description is only illustrative and not limiting. Those skilled in the art understand that many modifications, changes or equivalents can be made without departing from the spirit and scope of the claims.

Claims

1. A rapid preparation device for an electronic component heating and pressurization furnace, characterized in that, The application comprises: a cavity, which comprises a door and a barrel, and the barrel forms a containing space inside; at least one heating device, which is arranged in the containing space and is used to adjust the temperature in the containing space to a predetermined temperature; at least one replaceable thermal insulation sleeve, which is arranged in a C-shaped cross section, comprises an outer layer and an inner layer, wherein the outer layer is arranged on the inner wall of the barrel, the inner layer is arranged inside the containing space relative to the outer layer to form a closed thermal insulation space between the outer layer and the inner layer, the thickness of the inner layer is smaller than the thickness of the part of the barrel corresponding to the replaceable thermal insulation sleeve, and a plurality of radial expansion structures are arranged in a slot of the replaceable thermal insulation sleeve in an axial arrangement, so that the replaceable thermal insulation sleeve has radial expansion force support and can be fixed in the barrel or detached from the inner wall of the barrel; a first pressurizing device, which is used to adjust the pressure in the containing space to a predetermined pressure greater than 1 atm; and a fan, which is arranged in the containing space and is connected to a driving motor through a transmission shaft protruding from the barrel, and the fan is driven to rotate by the driving motor to improve the temperature adjustment efficiency of the heating device on the containing space.

2. The rapid setup apparatus for an electronic component heating and pressurizing treatment furnace according to Claim 1, wherein: The closed thermal insulation space is arranged in a non-sealed manner, the pressure in the closed thermal insulation space of the replaceable thermal insulation sleeve is adjusted to a pressure substantially the same as the pressure in the containing space by the first pressurizing device, so as to prevent the replaceable thermal insulation sleeve from deforming when the pressure in the containing space changes.

3. The rapid setup apparatus for an electronic component heating and pressurizing processing furnace according to Claim 1, wherein: Further comprising a second pressurizing device, and the closed thermal insulation space is arranged in a sealed manner, and the second pressurizing device operates in a manner that the pressure in the containing space and the pressure in the closed thermal insulation space are substantially simultaneously adjusted to the predetermined pressure.

4. The rapid setup apparatus for an electronic component heating and pressurizing processing furnace according to Claim 1, wherein: The inner layer is arranged in an axial arrangement with a plurality of C-shaped rings towards the containing space, and the two ends of each C-shaped ring are locked with a tensioning structure for tensioning and fixing the replaceable thermal insulation sleeve or detaching the C-shaped ring from the replaceable thermal insulation sleeve.

5. The rapid setup apparatus for an electronic component heating and pressurizing processing furnace according to claim 4, characterized in that: The tensioning structure is provided with a right-handed thread at one end and a left-handed thread at the other end, so as to quickly lock or loosen the C-shaped ring.

6. The rapid setup apparatus for an electronic component heating and pressurizing treatment furnace according to claim 4 or 5, characterized in that: Each C-shaped ring is arranged uniformly, so that each C-shaped ring uniformly exerts force on the replaceable thermal insulation sleeve to tightly fix the replaceable thermal insulation sleeve on the surface of the inner layer.

7. The rapid setup apparatus for an electronic component heating and pressurizing processing furnace according to claim 1, wherein: Further comprising at least one partition, which is used to divide the closed thermal insulation space into a plurality of regions.

8. The rapid setup apparatus for an electronic component heating and pressurizing processing furnace according to claim 7, wherein: The partition is made of metal.

9. The rapid setup apparatus for an electronic component heating and pressurizing processing furnace according to claim 2 or 3, characterized in that: Further comprising a particle detector connected to the closed thermal insulation space to detect the particle content discharged from the closed thermal insulation space.

10. A rapid preparation device for an electronic component heating and pressurization furnace, characterized in that, The application comprises: a cavity, which comprises a door and a barrel, and the barrel forms a containing space inside; at least one heating device, which is arranged in the containing space and is used to adjust the temperature in the containing space to a predetermined temperature; At least one alternative heat insulation sleeve is provided in a cross-section in a C shape, and includes an outer layer and an inner layer, wherein the outer layer is arranged on the inner wall of the barrel body, and the inner layer is arranged inside the accommodation space relative to the outer layer to form a closed heat insulation space between the outer layer and the inner layer, the thickness of the inner layer is less than the thickness of the barrel body part corresponding to the alternative heat insulation sleeve, and a plate group protruding into the accommodation space is arranged at the gap of the two ends of the alternative heat insulation sleeve, and the plate group is combined with a plurality of radial expansion structures, so that the alternative heat insulation sleeve has radial expansion force support, and can be fixed on the inner wall of the barrel body or be detached from the inner wall of the barrel body in reverse; a first pressurizing device for adjusting the pressure in the accommodation space to a predetermined pressure greater than 1 atm; and a fan arranged in the accommodation space and connected to a driving motor through a driving shaft protruding out of the barrel body, and the fan is driven to rotate by the driving motor to improve the temperature adjusting efficiency of the heating device on the accommodation space.

11. The rapid setup apparatus for an electronic component heat / pressure treatment furnace according to claim 10, wherein: The closed heat insulation space is arranged in a non-sealed manner, the pressure in the closed heat insulation space of the alternative heat insulation sleeve is adjusted to a pressure substantially the same as the pressure in the accommodation space by the first pressurizing device, so as to prevent the alternative heat insulation sleeve from deforming when the pressure in the accommodation space changes.

12. The rapid setup apparatus for an electronic component heating and pressurizing processing furnace according to Claim 10, wherein: The inner layer is arranged in an axial arrangement with a plurality of C-shaped rings, and a tensioning structure is arranged at the two ends of the C-shaped ring to tension and fix the alternative heat insulation sleeve or detach the C-shaped ring from the alternative heat insulation sleeve in reverse.

13. The rapid setup apparatus for an electronic component heating and pressurizing processing furnace according to claim 10, wherein: The first pressurizing device is operated in a manner that the pressure in the accommodation space and the pressure in the closed heat insulation space are substantially simultaneously adjusted to the predetermined pressure.

14. The rapid setup apparatus for an electronic component heat press treatment furnace according to claim 1 or 10, wherein: The closed heat insulation space is filled with a substance with a thermal conductivity less than 16 W / mK.

15. The rapid setup apparatus for an electronic component heating and pressurizing processing furnace according to claim 14, wherein: The substance is a gas.

16. The electronic component heat press treatment furnace quick setup apparatus of claim 15, wherein: The gas is air or nitrogen.

17. The rapid setup apparatus for an electronic component heating and pressurizing processing furnace as recited in claim 14, wherein: The substance is carbon, glass, Teflon or water.

18. The rapid setup apparatus for an electronic component heat press treatment furnace according to claim 1 or 10, wherein: The alternative heat insulation sleeve is made of metal.

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