A structure for efficiently controlling impedance continuity of a high-speed connector

Abstract

The application relates to the field of PCB design, in particular to a structure for efficiently controlling the impedance continuity of a high-speed connector, which comprises a plurality of modular anti-pad areas and modular high-speed vias capable of extending horizontally or vertically; each modular high-speed via comprises two first high-speed vias and second high-speed vias arranged horizontally side by side, third high-speed vias and fourth high-speed vias arranged symmetrically above and below the first high-speed vias and the second high-speed vias, fifth high-speed vias and sixth high-speed vias located on the two sides of the first high-speed vias and the second high-speed vias and with the center of the circle located on the symmetric axis of the first high-speed vias and the third high-speed vias, and the modular high-speed vias are in a structure symmetric above and below and left and right. Compared with the prior art, the application has the advantages that the design of the application is optimized on the PCB, the shape is uniformly designed, signal integrity simulation is confirmed, and the application is added to a packaging library, so that the optimization of the connector pad can be realized only by synchronously packaging the library.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of PCB design, in particular to a structure for efficiently controlling the impedance continuity of high-speed connectors. BACKGROUND

[0002] In high-speed PCB design, the size and shape of the connector pads should match the pins of the connector, the layout of the connector pads should consider signal integrity and electromagnetic compatibility, and the optimization scheme at the connector pads needs to consider multiple factors. However, in the prior art, the optimization scheme at the connector pads is various in shape, resulting in a huge workload and easy to make mistakes in the PCB design stage, and the desired effect cannot be achieved. SUMMARY

[0003] The purpose of the present application is to overcome the shortcomings of the prior art, to provide a high-speed connector impedance continuity structure that optimizes the design of high-speed connector pads, meets the requirements of signal integrity, controls the impedance continuity of high-speed traces at the connector pads, and can be efficiently developed in the PCB design stage.

[0004] In order to achieve the above purpose, a structure for efficiently controlling the impedance continuity of high-speed connectors is designed, which includes a plurality of modular anti-pad areas and modular high-speed vias that can extend horizontally or vertically. Each modular high-speed via includes two first high-speed vias arranged side by side horizontally, a third high-speed via and a fourth high-speed via arranged symmetrically above and below the first high-speed via and the second high-speed via, a fifth high-speed via and a sixth high-speed via located on both sides of the first high-speed via and the second high-speed via, and the center of the fifth high-speed via and the sixth high-speed via is located on the symmetry axis of the first high-speed via and the third high-speed via. The modular high-speed via has an up-down symmetric and left-right symmetric structure. Each modular anti-pad area includes a first anti-pad area arranged outside the first high-speed via, the second high-speed via, the third high-speed via and the fourth high-speed via, a second anti-pad area arranged outside the fifth high-speed via and a third anti-pad area arranged outside the sixth high-speed via. The first anti-pad area has a shape of two fan-shaped left-right spliced structures on both sides of the up-down, and the middle is connected by a straight section. The second anti-pad area and the third anti-pad area are circular. The modular anti-pad area is up-down symmetric and left-right symmetric.

[0005] The above two types of connecting pipe supports also have the following preferred technical solutions:

[0006] 1. It also includes a trace, a first trace is arranged outside the fan-shaped structure on the upper side or the lower side of the first anti-pad area and vertically connected to the high-speed via inside the first anti-pad area, and a second trace is connected to the high-speed via inside the first anti-pad area through the gap between the first anti-pad area and the second anti-pad area or the gap between the first anti-pad area and the third anti-pad area.

[0007] 2. The vertical distance from the vertical line where the center of the first high-speed via circle is located to the vertical line where the center of the second high-speed via circle is located is equal to the vertical distance from the vertical line where the center of the fifth high-speed via circle is located to the vertical line where the center of the first high-speed via circle is located and the vertical distance from the vertical line where the center of the sixth high-speed via circle is located to the vertical line where the center of the second high-speed via circle is located.

[0008] 3. The vertical distance from the vertical line where the center of the first high-speed via circle is located to the vertical line where the center of the second high-speed via circle is located is 0.80mm.

[0009] 4. The vertical distance between the horizontal line where the outermost end point of the first anti-pad area sector arc segment is located and the horizontal line where the end point of the connection between the sector and the straight segment is located is 0.47mm.

[0010] 5. The length of the straight segment is 0.5mm up and down.

[0011] Compared with the prior art, the present application has the following advantages:

[0012] 1. The present application optimizes the design on the PCB, unifies the design shape, confirms the signal integrity simulation, and is added to the package library, so that the optimization at the connector pad can be realized only by synchronizing the package library;

[0013] 2. Compared with the processing mode of separately optimizing each pad on the PCB according to various different shapes recommended by some design data, the present application optimizes in the package while meeting the signal integrity requirement, so that the design efficiency is greatly improved only by synchronizing the package library;

[0014] 3. The present application is designed as a symmetrical pattern, so that the outgoing lines in four directions can meet the requirements. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is an optimized design pattern of the present application;

[0016] Figure 2 is a specific size diagram of the present application;

[0017] Figure 3 is an optimized design signal integrity simulation test diagram of the present application;

[0018] Figure 4 is another optimized design signal integrity simulation test diagram of the present application;

[0019] Figure 5 is a way of synchronizing the PCB design through the package library of the present application;

[0020] Figure 6 is another way of synchronizing the PCB design through the package library of the present application;

[0021] In the diagram: 1. First high-speed via; 2. Second high-speed via; 3. Third high-speed via; 4. Fourth high-speed via; 5. Fifth high-speed via; 6. Sixth high-speed via; 7. First anti-pad area; 8. Second anti-pad area; 9. Third anti-pad area; 10. Fan-shaped; 11. Straight section; 12. First trace; 13. Second trace. Detailed Implementation

[0022] The invention will be further described below with reference to the accompanying drawings. The structure and principle of the invention are very clear to those skilled in the art. It should be understood that the specific embodiments described herein are only for explaining the invention and are not intended to limit the invention.

[0023] like Figure 1 As shown, the optimized design of the anti-solder pad of the high-speed connector is shown on the left side of the figure below, and the trace design is shown on the right side of the figure below, with a trace width of 5mil and a trace spacing of 6mil. Figure 1 The image shows modular anti-pad areas extending laterally or vertically, and modular high-speed vias; each modular high-speed via includes two horizontally arranged side-by-side first high-speed vias 1 and second high-speed vias 2, and a third high-speed via 3 and a fourth high-speed via 4 arranged symmetrically above and below the first high-speed vias 1 and second high-speed vias 2.

[0024] Located on both sides of the first high-speed via 1 and the second high-speed via 2, and with their centers on the axis of symmetry of the first high-speed via 1 and the third high-speed via 3, the modular high-speed vias are symmetrical in both vertical and horizontal directions. Each modular anti-pad area includes a first anti-pad area 7 located outside the first high-speed via 1, the second high-speed via 2, the third high-speed via 3, and the fourth high-speed via 4; a second anti-pad area 8 located outside the fifth high-speed via 5; and a third anti-pad area 9 located outside the sixth high-speed via 6. The first anti-pad area 7 is formed by two fan-shaped sections 10 joined together on both the upper and lower sides and connected by a straight section 11 in the middle. The second anti-pad area 8 and the third anti-pad area 9 are circular. The modular anti-pad areas are symmetrical in both vertical and horizontal directions.

[0025] Figure 2 , 5 Figure 6 illustrates the routing method of the present invention, wherein the first trace 12 is disposed along the outer side of the fan-shaped structure 10 on the upper or lower side of the first anti-pad region 7 and vertically connected to the high-speed via in the first anti-pad region 7, and the second trace 13 is connected to the high-speed via in the first anti-pad region 7 along the gap between the first anti-pad region 7 and the second anti-pad region 8 or the gap between the first anti-pad region 7 and the third anti-pad region 9. Figure 2The specific size is shown, the vertical distance between the vertical line where the center of the first high-speed via 1 is located and the vertical line where the center of the second high-speed via 2 is located is equal to the vertical distance between the vertical line where the center of the fifth high-speed via 5 is located and the vertical line where the first high-speed via 1 is located and the vertical distance between the vertical line where the center of the sixth high-speed via 6 is located and the vertical line where the second high-speed via 2 is located. The vertical distance between the vertical line where the center of the first high-speed via 1 is located and the vertical line where the center of the second high-speed via 2 is located is 0.80mm. The vertical distance between the horizontal line where the outermost end point of the arc segment of the first anti-pad area 7 sector 10 is located and the horizontal line where the end point of the connecting part between the sector 10 and the straight section 11 is located is 0.47mm, and the up and down length of the straight section 11 is 0.5mm.

[0026] Figure 3 、 4 The test result diagram of the present application is shown, and all of them pass the signal integrity simulation test. Figure 5 、 6 The present application is synchronized to the PCB design through the package library, and the wire-out requirements in all directions are met.

[0027] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited to this. Any skilled person in the art can make equivalent replacement or change according to the technical scheme and novel concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A structure for efficiently controlling the impedance continuity of a high-speed connector, characterized in that... It includes several modular anti-pad areas that can extend laterally or vertically and modular high-speed vias; Each modular high-speed via includes Two high-speed vias, the first and the second, are arranged side by side in a horizontal direction. The third and fourth high-speed vias are arranged symmetrically above and below the first and second high-speed vias. The fifth and sixth high-speed vias are located on either side of the first and second high-speed vias, and their centers are located on the axis of symmetry between the first and third high-speed vias. The modular high-speed vias have a top-bottom symmetrical and left-right symmetrical structure. Each modular anti-solder pad region includes The first anti-pad area is located outside the first high-speed via, the second high-speed via, the third high-speed via, and the fourth high-speed via. The second anti-soldering pad area located outside the fifth high-speed via and The third anti-pad area is located outside the sixth high-speed via. The first anti-pad area has two fan-shaped sections joined together on the top and bottom sides, connected by a straight section in the middle. The second and third anti-pad areas are circular. The modular anti-soldering pad area is symmetrical both vertically and horizontally.

2. The structure for efficiently controlling the impedance continuity of a high-speed connector as described in claim 1, characterized in that... It also includes traces, wherein the first trace is set along the outer side of the fan-shaped structure on the upper or lower side of the first anti-pad area and vertically connected to the high-speed via in the first anti-pad area, and the second trace is connected along the gap between the first anti-pad area and the second anti-pad area or the gap between the first anti-pad area and the third anti-pad area to the high-speed via in the first anti-pad area.

3. The structure for efficiently controlling the impedance continuity of a high-speed connector as described in claim 1, characterized in that... The vertical distance from the center of the first high-speed via circle to the vertical distance from the center of the second high-speed via circle is equal to the vertical distance from the center of the fifth high-speed via circle to the vertical distance from the center of the first high-speed via circle and the vertical distance from the center of the sixth high-speed via circle to the vertical distance from the center of the second high-speed via circle.

4. The structure for efficiently controlling the impedance continuity of a high-speed connector as described in claim 3, characterized in that... The vertical distance between the center of the first high-speed via and the center of the second high-speed via is 0.80 mm.

5. The structure for efficiently controlling the impedance continuity of a high-speed connector as described in claim 1, characterized in that... The vertical distance between the horizontal line at the outermost endpoint of the first anti-pad region's fan-shaped arc segment and the horizontal line at the endpoint where the fan-shaped arc segment connects to the straight segment is 0.47 mm.

6. The structure for efficiently controlling the impedance continuity of a high-speed connector as described in claim 1, characterized in that... The straight section is 0.5mm long both vertically.

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