Semiconductor devices and electronic equipment

Abstract

A semiconductor device is provided that prevents the embedded O-ring from dislodging. The semiconductor device (10) of the present invention includes: a detection element (16) mounted on a substrate (12) and having a detection portion (16d) for detecting pressure; a base (23) disposed on the substrate (12) and having the detection element (16) embedded therein; a protrusion (24) protruding upward from the base (23) and having an exposure hole (22a) exposing the detection portion (16d) upward; and a cover member (26) supported on the upper surface (24b) of the protrusion (24) and blocking the exposure hole (22a). The outer peripheral portion (26a) of the cover member (26) extends outward from the protrusion (24) when viewed from above. The cover member (26) has a slit (27) opening on its outer side (26c). The slit (27) allows the exposure hole (22a) to communicate with the outside from the side of the semiconductor device (10).

Description

Technical Field

[0001] This invention relates to a waterproof semiconductor device and an electronic device equipped with the semiconductor device. Background Technology

[0002] Patent Document 1 discloses a waterproof semiconductor device installed in electronic devices such as pressure measuring devices for measuring pressure. The semiconductor device includes a substrate, a sensing element, and a resin encapsulation. The sensing element is used to detect pressure and is mounted on the substrate. The sensing element is electrically connected to the substrate and circuit elements mounted on the substrate via connecting members such as wires. The resin encapsulation is disposed on the substrate. The sensing element and the connecting members are embedded in the resin encapsulation. The resin encapsulation has an exposure hole for exposing the sensing portion of the sensing element to the outside. Pressure is applied to the sensing portion of the sensing element through the exposure hole.

[0003] The semiconductor device disclosed in Patent Document 1 includes a cylindrical member having a through hole communicating with an exposure hole. An O-ring passes through the cylindrical member. Thus, an O-ring is fitted around the cylindrical member. When the semiconductor device is mounted in an electronic device, the gap between the electronic device's housing and the semiconductor device is sealed by the O-ring. This prevents liquid from entering the interior of the electronic device from the outside through this gap.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: International Publication No. 2019 / 208127 Summary of the Invention

[0007] The problem the invention aims to solve

[0008] When the semiconductor device disclosed in Patent Document 1 is installed in an electronic device, an O-ring is first fitted into the semiconductor device. Then, the semiconductor device with the O-ring fitted is installed in the electronic device.

[0009] The desired outcome is to facilitate the insertion of O-rings into semiconductor devices. Therefore, for example, the O-ring is formed such that its inner diameter is greater than or equal to the outer diameter of the cylindrical member. This facilitates the penetration of the cylindrical member into the O-ring. Consequently, the O-ring can be easily inserted into the cylindrical member.

[0010] However, if, as described above, it is easier for the cylindrical member to penetrate the O-ring, then it is also easier for the O-ring to detach from the cylindrical member. Therefore, when mounting a semiconductor device with an embedded O-ring into an electronic device, the likelihood of the O-ring detaching from the cylindrical member increases. Consequently, mounting a semiconductor device with an embedded O-ring into an electronic device may become more difficult.

[0011] Therefore, the object of the present invention is to solve the aforementioned problem and provide a semiconductor device capable of preventing the embedded O-ring from detaching.

[0012] Solution for solving the problem

[0013] To achieve the stated objective, the present invention is configured as follows.

[0014] One technical solution of the present invention provides a semiconductor device for detecting pressure, wherein,

[0015] The semiconductor device includes:

[0016] Substrate;

[0017] A detection element, which is mounted on the upper surface of the substrate, has a detection section for detecting pressure;

[0018] A resin encapsulation body is disposed on the upper surface of the substrate, and the detection element is embedded therein, having an exposure hole that exposes the detection portion of the detection element upwards;

[0019] A cover member, which is supported on the resin encapsulation body in a manner that blocks the exposure hole; and

[0020] The connecting part allows the exposed hole to communicate with the outside.

[0021] The resin encapsulation body includes:

[0022] The base, wherein the detection element is embedded; and

[0023] The protrusion, which protrudes upward from the base, has the exposure hole.

[0024] When viewed from above, the base extends to a position further outward than the outer side of the protrusion.

[0025] The cover member is supported on the upper surface of the protrusion.

[0026] The cover member has at least a portion of its outer periphery that extends outward from the outer side of the protrusion when viewed from above.

[0027] The connecting portion communicates with the outside through an opening on the side of the semiconductor device.

[0028] The effects of the invention

[0029] According to the present invention, it is possible to prevent the embedded O-ring from detaching. Attached Figure Description

[0030] Figure 1 This is a perspective view of a semiconductor device according to the first embodiment of the present invention.

[0031] Figure 2 This is a top view of a semiconductor device according to the first embodiment of the present invention.

[0032] Figure 3 It is along Figure 2 A sectional view of line A-A.

[0033] Figure 4 yes Figure 3 A cross-sectional view of an article in which a semiconductor device is installed in an electronic device.

[0034] Figure 5 This is a top view of a semiconductor device according to the second embodiment of the present invention.

[0035] Figure 6 This is a top view of the semiconductor device according to the third embodiment of the present invention.

[0036] Figure 7 This is a top view of the semiconductor device according to the fourth embodiment of the present invention.

[0037] Figure 8 This is a top view of the semiconductor device according to the fifth embodiment of the present invention.

[0038] Figure 9 It is along Figure 8 A cross-sectional view along line B-B.

[0039] Figure 10 This is a perspective view of a semiconductor device according to the sixth embodiment of the present invention.

[0040] Figure 11 It is along Figure 10 A cross-sectional view of the C-C line.

[0041] Figure 12 This is a perspective view of the cover member of the semiconductor device according to the seventh embodiment of the present invention, viewed from the bottom side.

[0042] Figure 13 This is a longitudinal sectional view of a semiconductor device according to the seventh embodiment of the present invention.

[0043] Figure 14 This is a top view of the semiconductor device according to the eighth embodiment of the present invention.

[0044] Figure 15 It is along Figure 14 A cross-sectional view of the D-D line.

[0045] Figure 16 This is a longitudinal sectional view of a modified example of the semiconductor device according to the eighth embodiment of the present invention.

[0046] Figure 17 This is a top view of the semiconductor device according to the ninth embodiment of the present invention. Detailed Implementation

[0047] One technical solution of the present invention provides a semiconductor device for detecting pressure, wherein,

[0048] The semiconductor device includes:

[0049] Substrate;

[0050] A detection element, which is mounted on the upper surface of the substrate, has a detection section for detecting pressure;

[0051] A resin encapsulation body is disposed on the upper surface of the substrate, and the detection element is embedded therein, having an exposure hole that exposes the detection portion of the detection element upwards;

[0052] A cover member, which is supported on the resin encapsulation body in a manner that blocks the exposure hole; and

[0053] A connecting portion that connects the exposure hole to the outside of the semiconductor device.

[0054] The resin encapsulation body includes:

[0055] The base, wherein the detection element is embedded; and

[0056] The protrusion, which protrudes upward from the base, has the exposure hole.

[0057] When viewed from above, the base extends to a position further outward than the outer side of the protrusion.

[0058] The cover member is supported on the upper surface of the protrusion.

[0059] The cover member has at least a portion of its outer periphery that extends outward from the outer side of the protrusion when viewed from above.

[0060] The connecting portion communicates with the outside through an opening on the side of the semiconductor device.

[0061] According to this structure, the cover member has a protruding portion. The protruding portion extends to a position further outward than the outer side of the protrusion. Therefore, when the O-ring is arranged such that its inner circumference surrounds the protrusion when viewed from above, the protruding portion can be used to prevent the O-ring from detaching from above.

[0062] In the absence of a cover member in the semiconductor device, foreign objects falling from above could potentially contact the detection unit through the exposure hole, thus affecting the pressure detection achieved by the detection unit. According to this structure, since the exposure hole is blocked by the cover member, foreign objects falling from above are prevented from entering the exposure hole.

[0063] To apply external pressure to the detection unit while simultaneously blocking the exposure hole using the cover member, a through hole is considered, extending vertically through the cover member to connect the external environment and the exposure hole. However, if a foreign object falling from above blocks the through hole, external pressure cannot be applied to the detection unit. But with this structure, external pressure acts on the detection unit from the side of the semiconductor device via the connecting portion and the exposure hole. Therefore, the possibility of foreign objects falling from above blocking the connecting portion can be reduced.

[0064] Alternatively, the connecting portion may include a space formed by a slit that, when viewed from above, extends inward from the outer periphery of the cover member.

[0065] According to this structure, the function of the connecting part can be achieved simply by setting a slit in the cover member.

[0066] According to this structure, the slit allows the cover member to open not only on the side but also on the top. Therefore, the communication portion allows the exposure hole to communicate with the outside of the semiconductor device not only on the side but also on the top. This facilitates the flow of fluid from the outside to the exposure hole, thus improving the responsiveness of the pressure detection unit. Furthermore, even if the top of the slit is blocked by a foreign object, communication from the side of the semiconductor device to the exposure hole can be maintained.

[0067] Alternatively, when viewed from above, the slit may be positioned offset from the detection unit.

[0068] This structure reduces the likelihood of foreign objects falling from above coming into contact with the detection unit through the slit.

[0069] Alternatively, the slit may include: a wide portion that at least partially overlaps with the exposure hole when viewed from above; and a narrow portion connected to the wide portion that does not overlap with the exposure hole when viewed from above.

[0070] According to this structure, the wide section facilitates fluid flow between the top of the cover member and the exposure hole. Therefore, the responsiveness of the detection unit for detecting fluid pressure can be improved.

[0071] According to this structure, the slit width is narrower in the portion that does not overlap with the exposed hole when viewed from above, which is the part where the cover member contacts the upper surface of the protrusion. Therefore, the contact area between the cover member and the protrusion can be increased. Consequently, the cover member is more stable.

[0072] Alternatively, the cover member may have three or more of the aforementioned slits.

[0073] According to this structure, when the cover member is supported on the upper surface of the protrusion, the outer surface of the protrusion can be visually identified at three or more locations using three or more slits. This allows for more precise alignment of the cover member with respect to the protrusion.

[0074] A semiconductor device according to one embodiment of the present invention may also include an adhesive portion existing in a portion between the upper surface of the protrusion and the cover member, for fixing the cover member to the protrusion, and the connecting portion including the space between the upper surface of the protrusion and the cover member opposite to each other at the portion between the upper surface of the protrusion and the cover member where the adhesive portion is not present.

[0075] According to this structure, when the cover member is bonded to the protrusion, the area between the cover member and the protrusion can function as a connecting part simply by providing a local area without adhesive.

[0076] Alternatively, the protrusion may have a first recess that extends downward from the upper surface of the protrusion, and the connecting portion may include a space formed by the first recess.

[0077] According to this structure, the function of the connecting part can be achieved simply by providing a first recess in the protrusion.

[0078] The cover member has a second recess that is recessed upward from the lower surface of the cover member, and the connecting portion includes a space formed by the second recess.

[0079] According to this structure, the function of the connecting part can be achieved simply by providing a second recess in the cover member.

[0080] Alternatively, a semiconductor device according to one embodiment of the present invention may include at least two of the following: a slit formed from the outer periphery of the cover member toward the inward side when viewed from above; an adhesive portion existing between the upper surface of the protrusion and the cover member and fixing the cover member to the protrusion; a first recess recessed downward from the upper surface of the protrusion; and a second recess recessed upward from the lower surface of the cover member.

[0081] When the semiconductor device includes the slit, the connecting portion includes a first space formed by the slit.

[0082] When the semiconductor device includes the adhesive portion, the connecting portion includes a second space between the upper surfaces of the protrusion and the cover member, where the portion of the protrusion without the adhesive portion is located opposite each other.

[0083] When the semiconductor device includes the first recess, the connecting portion includes a third space formed by the first recess.

[0084] When the semiconductor device includes the second recess, the connecting portion includes a fourth space formed by the second recess.

[0085] When viewed from above, the first space, the second space, the third space, and the fourth space overlap.

[0086] This structure allows for an increase in the cross-sectional area of ​​the connecting portion. Consequently, fluid flow through the connecting portion becomes easier, thus improving the responsiveness of the pressure detection unit.

[0087] Alternatively, a semiconductor device according to one embodiment of the present invention may include at least two of the following: a slit formed from the outer periphery of the cover member toward the inward side when viewed from above; an adhesive portion existing between the upper surface of the protrusion and the cover member and fixing the cover member to the protrusion; a first recess recessed downward from the upper surface of the protrusion; and a second recess recessed upward from the lower surface of the cover member.

[0088] When the semiconductor device includes the slit, the connecting portion includes a first space formed by the slit.

[0089] When the semiconductor device includes the adhesive portion, the connecting portion includes a second space between the upper surfaces of the protrusion and the cover member, where the portion of the protrusion without the adhesive portion is located opposite each other.

[0090] When the semiconductor device includes the first recess, the connecting portion includes a third space formed by the first recess.

[0091] When the semiconductor device includes the second recess, the connecting portion includes a fourth space formed by the second recess.

[0092] When viewed from above, the first space, the second space, the third space, and the fourth space do not overlap.

[0093] This structure increases the number of paths for fluid flow. Consequently, fluid flow through the connecting parts becomes easier, thus improving the responsiveness of the pressure detection unit.

[0094] Alternatively, one embodiment of the present invention includes a semiconductor device comprising: a circuit element mounted on the upper surface of the substrate; and a connecting member electrically connecting the circuit element and the detection element.

[0095] Alternatively, one embodiment of the present invention may include: the semiconductor device; an O-ring configured to surround the protrusion of the resin encapsulation body of the semiconductor device when viewed from above, the inner periphery of the O-ring contacting the outer surface of the protrusion; and a housing on which the semiconductor device is mounted.

[0096] According to this structure, in electronic devices equipped with semiconductor devices, the protrusion can be used to prevent the O-ring from detaching from above.

[0097] <First Embodiment>

[0098] Figure 1 This is a perspective view of the semiconductor device 10 according to the first embodiment of the present invention. Figure 2 This is a top view of the semiconductor device 10 according to the first embodiment. Figure 3 It is along Figure 2 A sectional view of line A-A. Figure 4 It is Figure 3 A cross-sectional view of an article in which a semiconductor device is mounted in an electronic device. The X-Y-Z orthogonal coordinate system shown in the above and subsequent figures is for ease of understanding of the invention and is not intended to limit the invention.

[0099] Semiconductor device 10 is a pressure sensor that detects pressure. For example... Figures 1-3 As shown, the semiconductor device 10 includes a substrate 12, a circuit element 14 mounted on the substrate 12, a detection element 16 mounted on the substrate 12, a resin encapsulation body 22, and a cover member 26.

[0100] In the first embodiment, the substrate 12 is a rigid substrate such as a glass epoxy board or a ceramic substrate, but it is not limited to this. For example, the substrate 12 may also be a lead frame.

[0101] like Figure 3 As shown, circuit elements 14 and detection elements 16 are mounted on the upper surface 12a of the substrate 12. The substrate 12 has pads 12b on its upper surface 12a. Figure 3The diagram describes a pad 12b, but the pad 12b is not limited to one. The pad 12b is electrically connected to the circuit element 14 via a bonding wire 18. The substrate 12 has external connection terminals 12c on the back side of the upper surface 12a, i.e., the lower surface 12d. The semiconductor device 10 is electrically connected to other external devices (not shown) via the external connection terminals 12c.

[0102] The circuit element 14 has an upper surface 14a and a back surface of the upper surface 14a, namely a lower surface 14b. In the first embodiment, the circuit element 14 is an element having an application-specific integrated circuit (ASIC). In the case of the first embodiment, the lower surface 14b of the circuit element 14 is bonded to the upper surface 12a of the substrate 12 using a chip mounting film, chip mounting material, or the like.

[0103] Circuit element 14 has a first pad 14c on its upper surface 14a. Figure 3 Only one first pad 14c is described, but the first pad 14c is not limited to one. The first pad 14c is electrically connected to the pad 12b of the substrate 12 via bonding wire 18.

[0104] In addition to having a first pad 14c, circuit element 14 also has a second pad 14d on its upper surface 14a. Figure 3 The document describes a second pad 14d, but the second pad 14d is not limited to one. The second pad 14d is electrically connected to the detection element 16 via a bonding wire 20. The bonding wire 20 is an example of a connecting component.

[0105] Circuit element 14 includes a signal processing circuit that processes the signal output from detection element 16 and outputs the processed signal to substrate 12. For example, in the first embodiment, circuit element 14 includes a converter, a filter, a temperature sensor, a processor, and a memory. The converter converts the voltage signal output from detection element 16 into a digital signal. The filter filters the digital signal from the converter. The temperature sensor detects the temperature. The processor corrects the filtered digital signal based on the detected temperature. The memory stores correction coefficients and other data used when correcting the digital signal using the detected temperature.

[0106] In the first embodiment, the detection element 16 is a pressure sensor element for measuring pressure. The detection element 16 has an upper surface 16a and a back surface of the upper surface 16a, namely a lower surface 16b. The detection element 16 is, for example, a piezoresistive pressure sensor element or a capacitive pressure sensor element, and is a MEMS (Micro Electro Mechanical Systems) element. In the first embodiment, the lower surface 16b of the detection element 16 is bonded to the upper surface 12a of the substrate 12 using a chip mounting film, chip mounting material, or the like. Furthermore, although the detection element 16 is mounted on the upper surface 12a of the substrate 12 in the first embodiment, the detection element 16 may also be mounted on the circuit element 14.

[0107] The detection element 16 has pads 16c on its upper surface 16a. Figure 3 The document describes a pad 16c, but the pad 16c is not limited to one. The pad 16c is electrically connected to the second pad 14d of the circuit element 14 via a bonding line 20. That is, the bonding line 20 of the detection element 16 is electrically connected to the substrate 12 via the circuit element 14 and the bonding line 18.

[0108] The sensing element 16 has a sensing portion 16d on its upper surface 16a for pressure action. That is, the sensing portion 16d detects pressure. In the first embodiment, the sensing portion 16d of the sensing element 16, which is a pressure sensor element, is a pressure-bearing partition or diaphragm. In addition, the sensing portion 16d is provided with a passivation film, for example, and is waterproof.

[0109] The resin encapsulation 22 is, for example, an encapsulation made by molding a rigid resin, such as a thermosetting resin, onto the upper surface 12a of the substrate 12. That is, such as... Figure 3 As shown, a resin encapsulation 22 is disposed on the upper surface 12a of the substrate 12. A portion of the upper surface 12a of the substrate 12 (particularly the pads 12b) is protected and waterproofed by being covered by the resin encapsulation 22.

[0110] like Figure 3 As shown, circuit element 14, detection element 16, and bonding wires 18 and 20 are embedded in resin encapsulation 22. Circuit element 14 (particularly first pad 14c and second pad 14d), detection element 16 (particularly pad 16c), and bonding wires 18 and 20 are protected and waterproofed by being embedded in resin encapsulation 22.

[0111] Based on the above structure, the resin encapsulation body 22 is used to waterproof the electrical connection between the substrate 12 and the circuit element 14, as well as the electrical connection between the circuit element 14 and the detection element 16.

[0112] like Figure 1 and Figure 3 As shown, the resin encapsulation 22 includes a base 23 and a protrusion 24.

[0113] The base 23 forms the substrate 12 side (negative Z-axis direction side) of the resin encapsulation 22. For example... Figure 3 As shown, the lower surface 23a of the base 23 is in contact with the upper surface 12a of the substrate 12.

[0114] Circuit element 14, detection element 16 and connecting wires 18 and 20 are embedded in base 23.

[0115] The protrusion 24 forms the side of the resin encapsulation 22 opposite to the side where the base substrate 12 is located, relative to the base 23 (positive Z-axis side). The protrusion 24 protrudes from the base 23 away from the base substrate 12. In other words, the protrusion 24 protrudes from the base 23 in the positive Z-axis direction (upward).

[0116] like Figure 1 and Figure 2 As shown, the protrusion 24 is located at the center of the base 23 when viewed from above. In other words, when viewed from above, the base 23 extends outward from the outer side 24a of the protrusion 24.

[0117] The protrusion 24 has an exposure hole 22a. The exposure hole 22a extends through the protrusion 24 along the Z-axis direction (vertical direction). The protrusion 24 is cylindrical.

[0118] like Figure 3 As shown, a portion of the upper surface 16a and the detection portion 16d of the detection element 16 face the lower end of the exposure hole 22a. That is, a portion of the upper surface 16a and the detection portion 16d of the detection element 16 are exposed to the outside of the resin encapsulation 22 via the exposure hole 22a. Specifically, the exposure hole 22a exposes the detection portion 16d of the detection element 16 to the outside of the resin encapsulation 22. The opening of the exposure hole 22a is located on the upper surface 24b (the surface in the positive Z-axis direction) of the protrusion 24. In other words, the resin encapsulation 22 exposes the detection portion 16d of the detection element 16 upwards. Pressure is applied to the detection portion 16d of the detection element 16 from outside the semiconductor device 10 via the slit 27 of the cover member 26 (described later) and the exposure hole 22a, and the detection element 16 can measure this pressure.

[0119] like Figure 2 As shown, when viewed from above, the protrusion 24 is located around the detection portion 16d of the detection element 16. That is, when viewed from above, the protrusion 24 is located outside the detection portion 16d.

[0120] Furthermore, in the detection element 16, the portion exposed to the outside via the exposure hole 22a, namely the detection section 16d, is waterproofed, for example, using a passivation film. Additionally, in the case of the first embodiment, regarding the shape of the exposure hole 22a, as... Figure 1 and Figure 2 The opening shown is circular when viewed from above (along the Z-axis), and is as follows: Figure 3 The shape shown is a cone shape in which the cross-sectional area along the XY plane decreases as the detection portion 16d approaches the detection element 16 from the opening, but it can also be other shapes. The exposure hole 22a only needs to function as a pressure inlet hole to introduce pressure into the detection portion 16d.

[0121] like Figures 1-3 As shown, the cover member 26 is supported on the upper surface 24b of the protrusion 24 of the resin encapsulation body 22 in a manner that blocks the exposure hole 22a. In the first embodiment, the cover member 26 is attached to the upper surface 24b of the protrusion 24 using an adhesive (not shown). In the first embodiment, the adhesive is applied to the entire circumference of the upper surface 24b of the protrusion 24 when viewed from above. Furthermore, the adhesive is only used in the fifth embodiment described later. Figure 8 and Figure 9 Some illustrations are shown in the figure; illustrations are omitted in other figures.

[0122] like Figure 1 and Figure 2 As shown, in the first embodiment, the cover member 26 is generally disc-shaped. However, the shape of the cover member 26 is not limited to a disc shape; for example, it can also be a cuboid shape.

[0123] In the first embodiment, the cover member 26 is made of a resin such as a liquid crystal polymer. However, the cover member 26 is not limited to resin; for example, it may be made of a metal such as stainless steel (SUS). In the first embodiment, the thickness (length in the Z-axis direction) of the cover member 26 is 50 μm to 200 μm, and the diameter of the cover member 26 is 2 mm to 4 mm.

[0124] The cover member 26 has a slit 27. The slit 27 is formed from the outer periphery 26a of the cover member 26 toward the central portion 26b of the cover member 26 when viewed from above. In other words, the slit 27 is formed from the outer periphery 26a of the cover member 26 toward the inner side of the cover member 26 when viewed from above. The outer periphery 26a of the cover member 26 is the portion of the cover member 26 that overlaps with the exposure hole 22a when viewed from above.

[0125] In the first embodiment, such as Figures 1-3As shown, the slit 27 extends from the outer surface 26c of the cover member 26 to the central portion 26b of the cover member 26. That is, when viewed from above, a portion (inner portion) of the slit 27 overlaps with the exposure hole 22a. However, in the first embodiment, as... Figure 2 As shown, when viewed from above, the inner side of the slit 27 does not overlap with the detection portion 16d of the detection element 16. That is, in the first embodiment, when viewed from above, the slit 27 is located at a position offset from the detection portion 16d of the detection element 16. Alternatively, the slit 27 may overlap with the detection portion 16d of the detection element 16 when viewed from above.

[0126] The slit 27 opens above (on the positive Z-axis side), below (on the negative Z-axis side), and to the outside (radially extending from the center of the cover member 26 towards the outer periphery 26a when viewed from above) the cover member 26. The slit 27 communicates with the exposure hole 22a through its lower opening. The slit 27 also communicates with the outside of the semiconductor device 10 through its openings on the upper and outer sides of the cover member 26. Thus, the slit 27 connects the outside of the semiconductor device 10 with the exposure hole 22a.

[0127] In the first embodiment, the width W of the slit 27 (refer to...) Figure 2 The range is 50 (μm) to 500 (μm), but is not limited to this.

[0128] Slit 27 (more specifically, the space formed by slit 27) is an example of a connecting part. The space formed by slit 27 is an example of a first space. It can also be said that the inner surfaces 27a, 27b, and 27c of the cover member 26 constituting slit 27 are examples of a connecting part.

[0129] In the first embodiment, such as Figure 2 As shown, in a top view, the outer peripheral portion 26a of the cover member 26 extends radially outward from the outer surface 24a of the protrusion 24. In the first embodiment, the outer peripheral portion 26a of the cover member 26 corresponds to the protrusion. That is, in the first embodiment, the entire outer peripheral portion 26a of the cover member 26 is a protrusion that extends radially outward from the outer surface 24a of the protrusion 24 in a top view.

[0130] Figure 4 yes Figure 3 A cross-sectional view of an article in which a semiconductor device is mounted in an electronic device. (e.g.) Figure 3 and Figure 4 As shown, the resin encapsulation 22 is configured to support the O-ring OR.

[0131] like Figure 4As shown, the semiconductor device 10 is mounted on the housing 2 of the electronic device 1 for use. The electronic device 1 is, for example, a pressure measuring device, which includes the semiconductor device 10, an O-ring OR, and the housing 2.

[0132] The O-ring OR is annular. The inner diameter of the O-ring OR is the same as or approximately the same as the outer diameter of the protrusion 24 of the resin encapsulation body 22. The O-ring OR is made of a component that is easily compressed and deformed, such as nitrile rubber.

[0133] like Figure 3 As shown by the dashed line, the O-ring OR is installed from above onto the protrusion 24 of the resin encapsulation body 22 before the cover member 26 is mounted. The O-ring OR mounted on the protrusion 24 is arranged to surround the protrusion 24 when viewed from above. In the first embodiment, the inner diameter of the O-ring OR is configured to be larger than the outer diameter of the protrusion 24. This allows for easy installation as described above. After the O-ring OR is installed on the protrusion 24, the cover member 26 is bonded to the upper surface 24b of the protrusion 24.

[0134] like Figure 3 As shown, the outer periphery 26a of the cover member 26 restricts the O-ring OR mounted on the protrusion 24 from detaching from the upper end of the protrusion 24. The base 23 of the resin encapsulation body 22 restricts the O-ring OR mounted on the protrusion 24 from detaching from the lower end of the protrusion 24.

[0135] like Figure 4 As shown, the housing 2 has an internal space 2a in which a semiconductor device 10 with an O-ring OR is disposed. The semiconductor device 10 disposed in the internal space 2a is mounted to the housing 2 by a well-known means (not shown) such as fitting.

[0136] The housing 2 has a through hole 2b. The through hole 2b connects the exterior of the housing 2 and the interior space 2a. The exposure hole 22a of the semiconductor device 10 communicates with the exterior of the electronic device 1 via the slit 27 of the cover member 26, the interior space 2a of the housing 2, and the through hole 2b of the housing 2. Thus, the external pressure of the electronic device 1 can be measured using the semiconductor device 10.

[0137] In order to seal the gap between the semiconductor device 10 configured as described above and the inner peripheral surface 2c of the internal space 2a constituting the housing 2, an O-ring OR is provided in the gap.

[0138] With the semiconductor device 10 disposed in the internal space 2a of the housing 2, the gap G between the outer surface 24a of the protrusion 24 and the inner peripheral surface 2c constituting the internal space 2a is greater than the diameter R of the O-ring OR (refer to...). Figure 3 The O-ring OR is short. Therefore, when the semiconductor device 10 is disposed in the internal space 2a, the O-ring OR will be compressed and deformed (see reference). Figure 4 Thus, the inner peripheral portion ORa of the O-ring OR contacts the outer surface 24a of the protrusion 24, and the outer peripheral portion ORb of the O-ring OR contacts the inner peripheral surface 2c that constitutes the internal space 2a. As a result, the gap between the semiconductor device 10 and the housing 2 is sealed, and the O-ring OR prevents liquid from entering the interior of the electronic device 1 from the outside through this gap.

[0139] According to the first embodiment, the outer peripheral portion 26a of the cover member 26 is a protrusion that extends radially outward from the outer side surface 24a of the protrusion 24. Therefore, when the O-ring OR is configured to surround the protrusion 24 when viewed from above, the protrusion can be used to prevent the O-ring OR from detaching from above.

[0140] Assuming that the semiconductor device 10 does not have a cover member 26, foreign objects falling from above may come into contact with the detection unit 16d through the exposure hole 22a, thereby affecting the pressure detection achieved by the detection unit 16d. According to the first embodiment, since the exposure hole 22a is blocked by the cover member 26, foreign objects falling from above are prevented from entering the exposure hole 22a.

[0141] In order to apply external pressure to the detection unit 16d while blocking the exposure hole 22a using the cover member 26, it is considered to provide a through hole that passes through the cover member 26 in the vertical direction (Z-axis direction) to connect the outside and the exposure hole 22a. However, if a foreign object falling from above blocks the through hole, external pressure cannot be applied to the detection unit 16d. However, according to the first embodiment, external pressure is applied to the detection unit 16d from the side of the semiconductor device 10 via the slit 27 and the exposure hole 22a. Therefore, the possibility that a foreign object falling from above cannot reach the exposure hole 22a can be reduced.

[0142] According to the first embodiment, the function of the connecting portion can be realized by simply providing a slit 27 in the cover member 26.

[0143] According to the first embodiment, the slit 27 allows the cover member 26 to open not only to the side but also to the top. Therefore, the slit 27 allows the exposure hole 22a to communicate with the outside of the semiconductor device 10 not only to the side but also to the top. This facilitates the flow of fluid from the outside to the exposure hole 22a, thereby improving the responsiveness of the pressure detection unit 16d. Furthermore, even if the top of the slit 27 is blocked by a foreign object, communication from the side of the semiconductor device 10 to the exposure hole 22a can be maintained.

[0144] According to the first embodiment, the possibility of foreign objects falling from above coming into contact with the detection unit 16d through the slit 27 can be reduced.

[0145] According to the first embodiment, in an electronic device 1 equipped with a semiconductor device 10, the outer peripheral portion 26a of the cover member 26 can be used to restrict the O-ring OR from detaching from above.

[0146] The shape and structure of the resin encapsulation 22 are not limited to the structures described above. Figures 1-4 (The structure shown). For example, in the first embodiment, the base 23 of the resin encapsulation 22 is quadrilateral when viewed from above, but the base 23 may also be a shape other than quadrilateral (e.g., circular) when viewed from above.

[0147] In the first embodiment, circuit element 14 is electrically connected to substrate 12 via bonding wire 18, and detection element 16 is electrically connected to circuit element 14 via bonding wire 20. However, the connection configuration of substrate 12, circuit element 14, and detection element 16 is not limited to this. For example, detection element 16 may also be connected to substrate 12 via bonding wire, just like circuit element 14. In this case, detection element 16 is electrically connected to circuit element 14 via substrate 12.

[0148] In the first embodiment, the substrate 12, circuit element 14, and detection element 16 are electrically connected by bonding wires. However, the substrate 12, circuit element 14, and detection element 16 can also be electrically connected by means other than bonding wires. For example, the circuit element 14 can be mounted on the substrate 12 by flip-chip bonding. In this case, the circuit element 14 and the substrate 12 are electrically connected by solder.

[0149] <Second Implementation>

[0150] Figure 5 This is a top view of a semiconductor device according to a second embodiment of the present invention. The difference between the semiconductor device 10A of the second embodiment and the semiconductor device 10 of the first embodiment is that the cover member 26 has a slit 28 instead of a slit 27.

[0151] like Figure 5 As shown, slit 28 and Figure 2 The slit 27 shown is also formed from the outer periphery 26a of the cover member 26 toward the central portion 26b of the cover member 26.

[0152] The slit 28 includes a wide portion 28A and a narrow portion 28B. Compared to the narrow portion 28B, the wide portion 28A is longer in the width direction. In the second embodiment, the width direction is the X-axis direction.

[0153] The wide portion 28A forms the inner side of the slit 28. When viewed from above, at least a portion of the wide portion 28A overlaps with the exposure hole 22a. In the second embodiment, when viewed from above, the wide portion 28A does not overlap with the detection portion 16d of the detection element 16, but they may overlap.

[0154] The narrow portion 28B constitutes the portion of the slit 28 excluding the inner side. One end of the narrow portion 28B is connected to the wide portion 28A. The other end of the narrow portion 28B opens on the outer surface 26c of the cover member 26. In plan view, the narrow portion 28B is located radially outward of the cover member 26 compared to the exposure hole 22a. That is, in plan view, the narrow portion 28B does not overlap with the exposure hole 22a.

[0155] The slit 28 (more specifically, the space formed by the slit 28) is an example of a connecting part. The space formed by the slit 28 is an example of a first space. It can also be said that the inner surface 28a of the cover member 26 constituting the slit 28 is an example of a connecting part.

[0156] In the second embodiment, the slit 28 is a tapered shape that tapers at its front end as it moves radially outward toward the cover member 26. However, the shape of the slit 28 is not limited to a tapered shape. For example, it can also be as follows: Figure 5 The single-dot-dash line in the middle indicates that the slit 28 has a step at the boundary between the wide portion 28A and the narrow portion 28B.

[0157] According to the second embodiment, the wide portion 28A facilitates the flow of fluid between the top of the cover member 26 and the exposure hole 22a. Therefore, the responsiveness of the detection unit 16d, which detects the pressure of the fluid, can be improved.

[0158] According to the second embodiment, the slit 28 is narrower in the portion that does not overlap with the exposure hole 22a when viewed from above, which is the portion where the cover member 26 contacts the upper surface 24b of the protrusion 24. Therefore, the contact area between the cover member 26 and the protrusion 24 can be increased. Consequently, the cover member 26 is more stable.

[0159] <Third Implementation>

[0160] Figure 6 This is a top view of a semiconductor device according to a third embodiment of the present invention. The semiconductor device 10B of the third embodiment differs from the semiconductor device 10 of the first embodiment in that the cover member 26 has a plurality of slits 27.

[0161] like Figure 6 As shown, the cover member 26 of the semiconductor device 10B has four slits 27. The four slits 27 are arranged at equal intervals on the circumferential CD of the cover member 26. In other words, the four slits 27 are arranged at 90-degree intervals on the circumferential CD.

[0162] Furthermore, the number of slits 27 provided by the cover member 26 is not limited to four. Alternatively, multiple slits 27 may be arranged at different intervals along the circumferential direction CD of the cover member 26. Furthermore, the width of each slit 27 can be as follows: Figure 6 The widths shown are the same for all slits, but they can also be different. Furthermore, the width of each slit 27 is not limited to... Figure 6 The width shown.

[0163] According to the third embodiment, when the semiconductor device 10B has three or more slits 27, when the cover member 26 is supported on the upper surface 24b of the protrusion 24, the outer surface 24a of the protrusion 24 can be visually identified at three or more locations by means of the three or more slits 27. As a result, the alignment of the cover member 26 with respect to the protrusion 24 can be performed with better accuracy.

[0164] <Fourth Implementation>

[0165] Figure 7 This is a top view of a semiconductor device according to the fourth embodiment of the present invention. The semiconductor device 10C of the fourth embodiment differs from the semiconductor device 10 of the first embodiment in that the semiconductor device 10C includes a cover member 29 instead of a cover member 26.

[0166] Cover member 29 and cover member 26 of semiconductor device 10 in the first embodiment (see reference) Figure 2 Similarly, it is supported on the upper surface 24b of the protrusion 24 of the resin package 22 in a manner that blocks the exposure hole 22a, and has a slit 27. The slit 27 is connected to the cover member 26 of the semiconductor device 10 of the first embodiment (see reference). Figure 2 (The same structure)

[0167] In the third embodiment, the cover member 29 is generally disc-shaped. The diameter of the cover member 29 is less than or equal to the outer diameter of the protrusion 24. Figure 7 In this case, the diameter of the cover member 29 is the same as the outer diameter of the protrusion 24. The cover member 29 has four protrusions 29A. Each protrusion 29A extends radially outward from the outer side 29c of the cover member 29. The radial direction of the cover member 29 is the direction in which it extends radially from the center of the cover member 29 toward the outer periphery 29a when viewed from above.

[0168] Four protrusions 29A are equally spaced apart on the circumferential CD of the cover member 29. In other words, the four protrusions 29A are arranged at 90-degree intervals on the circumferential CD. In the fourth embodiment, the portion near the outer surface 29c of the outer peripheral portion 29a of the cover member 29 includes not only the portion radially inward of the outer surface 29c when viewed from above, but also the portion radially outward of the outer surface 29c when viewed from above, i.e., the four protrusions 29A. That is, in the fourth embodiment, the cover member 29 has protrusions 29A partially on the outer peripheral portion 29a.

[0169] Furthermore, the number of protrusions 29A provided by the cover member 29 is not limited to four. Alternatively, multiple protrusions 29A may be arranged at different intervals along the circumferential CD of the cover member 29. Furthermore, the length of the circumferential CD of each protrusion 29A is not limited to... Figure 7 The length shown.

[0170] <Fifth Implementation>

[0171] Figure 8 This is a top view of the semiconductor device according to the fifth embodiment of the present invention. Figure 9 It is along Figure 8 A cross-sectional view along line B-B. The difference between the semiconductor device 10D of the fifth embodiment and the semiconductor device 10 of the first embodiment is that the cover member 26 does not have a slit 27, but there is a portion between the cover member 26 and the upper surface 24b of the protrusion 24 where no adhesive is present.

[0172] like Figure 8 As shown, the cover member 26 of the semiconductor device 10D does not have Figure 2 The slit 27 shown.

[0173] like Figure 9 As shown, the cover member 26 is attached to the upper surface 24b of the protrusion 24 using an adhesive. An adhesive portion 30, also made of adhesive, exists between the protrusion 24 and the cover member 26. In the fifth embodiment, there are two locations on the circumferential direction CD of the upper surface 24b of the protrusion 24 in a top view where no adhesive is applied. In other words, in the fifth embodiment, there is a portion between the lower surface 26d of the cover member 26 and the upper surface 24b of the protrusion 24 where the adhesive portion 30 is absent. At this portion, a space 31 is formed between the lower surface 26d of the cover member 26 and the upper surface 24b of the protrusion 24. That is, the lower surface 26d of the cover member 26 and the upper surface 24b of the protrusion 24 face each other, spaced apart by a space 31 in the Z-axis direction.

[0174] like Figure 8As shown, in a top view, each space 31 is formed from the outer surface 24a to the inner surface 24c of the protrusion 24. The inner surface 24c of the protrusion 24 is the surface that constitutes the exposure hole 22a. That is, the exposure hole 22a is connected to the outside of the semiconductor device 10D via each space 31.

[0175] In the fifth embodiment, when viewed from above, the two spaces 31 are opposite each other in the Y-axis direction, separated by the detection section 16d of the detection element 16. In other words, the two spaces 31 are arranged at a 180-degree interval in the circumferential direction CD.

[0176] Furthermore, the number of spaces 31 formed between the lower surface 26d of the cover member 26 and the upper surface 24b of the protrusion 24 is not limited to two. Moreover, the locations where each space 31 is formed are not limited to... Figure 8 The positions shown are as indicated. Alternatively, the two spaces 31 can be arranged at intervals other than 180 degrees along the circumferential CD. For example, the interval along the circumferential CD of the narrower side of the two spaces 31 could be 90 degrees, and the interval along the circumferential CD of the wider side of the two spaces 31 could be 270 degrees. Furthermore, when three or more spaces 31 are formed, the spaces 31 can be arranged at equal intervals or at different intervals along the circumferential CD. Moreover, the length of the circumferential CD of each space 31 is not limited to... Figure 8 The length shown. Furthermore, the circumferential length CD of each space 31 can be as follows: Figure 8 The values ​​shown are the same length, or they can be different lengths.

[0177] Space 31 is an example of a connecting portion. Furthermore, space 31 is an example of a second space. It can also be said that the lower surface 26d of the cover member 26 constituting space 31, the upper surface 24b of the protrusion 24, and the side end 30a of the adhesive portion 30 are examples of a connecting portion.

[0178] According to the fifth embodiment, when the cover member 26 is bonded to the protrusion 24, the space 31 can function as a connecting part simply by providing a space 31 without adhesive between the cover member 26 and the protrusion 24.

[0179] <Sixth Implementation>

[0180] Figure 10 This is a perspective view of a semiconductor device according to the sixth embodiment of the present invention. Figure 11 It is along Figure 10 A cross-sectional view along the C-C line. Additionally, in Figure 10The illustration of the cover member 26 is omitted. The difference between the semiconductor device 10E of the sixth embodiment and the semiconductor device 10 of the first embodiment is that the cover member 26 does not have a slit 27, but instead the protrusion 24 of the resin encapsulation body 22 has a recess 24A.

[0181] like Figure 11 As shown, the cover member 26 of the semiconductor device 10E does not have Figure 2 The slit 27 shown.

[0182] like Figure 10 As shown, the protrusion 24 of the resin encapsulation 22 has two recesses 24A. Recesses 24A are an example of the first recess. Each recess 24A is formed by recessing the upper surface 24b of the protrusion 24 downwards. Each recess 24A is formed from the outer surface 24a to the inner surface 24c of the protrusion 24. That is, as shown... Figure 10 and Figure 11 As shown, the exposure hole 22a and the exterior of the semiconductor device 10D are connected by the recesses 24A.

[0183] In the sixth embodiment, such as Figure 10 As shown, the two recesses 24A are located on a straight line in the Y-axis direction. In other words, the two recesses 24A are arranged at a 180-degree interval in the circumferential direction CD.

[0184] Furthermore, the number of recesses 24A provided by the protrusion 24 is not limited to two. Moreover, the positions where each recess 24A is formed are not limited to... Figure 10 The position shown. Alternatively, the two recesses 24A may be arranged at intervals other than 180 degrees on the circumferential CD. For example, the circumferential CD interval on the narrower side of the two recesses 24A may be 90 degrees, and the circumferential CD interval on the wider side of the two recesses 24A may be 270 degrees. Furthermore, when three or more recesses 24A are formed, the recesses 24A may be arranged at equal intervals or at different intervals on the circumferential CD. Furthermore, the length of the circumferential CD of each recess 24A is not limited to... Figure 10 The length shown. Furthermore, the circumferential CD length of each recess 24A can be as follows: Figure 10 The lengths shown are the same for all of them, but they can also be different. In addition, in the sixth embodiment, the depth (length in the Z-axis direction) of each recess 24A is 10 (μm) to 100 (μm), but it is not limited to this.

[0185] The recess 24A (more specifically, the space formed by the recess 24A) is an example of a connecting portion. The space formed by the recess 24A is an example of a third space. It can also be said that the pair of inner surface surfaces 24d, 24e and the inner bottom surface 24f of the protrusion 24 constituting the recess 24A are an example of a connecting portion.

[0186] According to the sixth embodiment, the function of the connecting portion can be achieved simply by providing a recess 24A in the protrusion 24.

[0187] <Seventh Implementation>

[0188] Figure 12 This is a perspective view of the cover member of the semiconductor device according to the seventh embodiment of the present invention, viewed from the bottom side. Figure 13 This is a longitudinal sectional view of a semiconductor device according to the seventh embodiment of the present invention. The semiconductor device 10F of the seventh embodiment differs from the semiconductor device 10 of the first embodiment in that the cover member 26 has a recess 26A but does not have a slit 27.

[0189] like Figure 12 As shown, the cover member 26 of the semiconductor device 10F does not have Figure 2 The slit 27 shown.

[0190] The cover member 26 has two recesses 26A. Recesses 26A are an example of the second recess. Each recess 26A is formed by recessing the lower surface 26d of the cover member 26 upwards.

[0191] like Figure 13 As shown, each recess 26A extends in the Y-axis direction towards the exposed hole 22a, closer to the inner surface 24c of the protrusion 24 of the resin package 22. Thus, each recess 26A communicates with the exposed hole 22a. Each recess 26A also extends in the Y-axis direction towards the outer surface 24a of the protrusion 24. Therefore, each recess 26A communicates with the outside of the semiconductor device 10F. Based on the above, the exposed hole 22a and the outside of the semiconductor device 10D are connected via each recess 26A.

[0192] In the 7th embodiment, such as Figure 13 As shown, the two recesses 26A are aligned on a straight line in the Y-axis direction. In other words, as... Figure 12 As shown, the two recesses 26A are arranged at 180-degree intervals on the circumferential direction CD.

[0193] Furthermore, the number of recesses 26A provided by the cover member 26 is not limited to two. Moreover, the locations where each recess 26A is formed are not limited to... Figure 12The positions shown are as indicated. Alternatively, the two recesses 26A may be arranged at intervals other than 180 degrees on the circumferential CD. For example, the circumferential CD interval on the narrower side of the two recesses 26A may be 90 degrees, and the circumferential CD interval on the wider side of the two recesses 26A may be 270 degrees. Furthermore, when three or more recesses 26A are formed, the recesses 26A may be arranged at equal intervals or at different intervals on the circumferential CD. Moreover, the size and shape of each recess 26A are not limited to... Figure 10 The size and shape are shown. For example, in the seventh embodiment, the depth of each recess 26A is 10 (μm) to 100 (μm), but it is not limited to this. Furthermore, the size and shape of each recess 26A may be the same as each other or different from each other.

[0194] The recess 26A (more specifically, the space formed by the recess 26A) is an example of a connecting portion. The space formed by the recess 26A is an example of a fourth space. It can also be said that the inner surface 26e and the inner bottom surface 26f of the cover member 26 constituting the recess 26A are examples of a connecting portion.

[0195] According to the seventh embodiment, the function of the connecting portion can be achieved simply by providing a recess 26A in the cover member 26.

[0196] <Eighth Implementation>

[0197] Figure 14 This is a top view of the semiconductor device according to the eighth embodiment of the present invention. Figure 15 It is along Figure 14 A cross-sectional view along line D-D. The semiconductor device 10G of the eighth embodiment differs from the semiconductor device 10 of the first embodiment in that the cover member 26 has a slit 27 and the protrusion 24 of the resin encapsulation body 22 has a recess 24A.

[0198] like Figure 14 and Figure 15 As shown, the cover member 26 of the semiconductor device 10G has two slits 27. In addition, the number, formation position, shape and size of the slits 27 provided by the cover member 26 are arbitrary.

[0199] The protrusion 24 of the resin package 22 of the semiconductor device 10G also has two recesses 24A, similar to those in the sixth embodiment. Furthermore, the number, location, shape, and size of the recesses 24A on the protrusion 24 are arbitrary.

[0200] The connecting portion includes each slit 27 and each recess 24A. More specifically, the connecting portion includes a first space formed by each slit 27 and a third space formed by each recess 24A.

[0201] like Figure 14 As shown, in a top-down view, slit 27 overlaps with recess 24A. That is, in a top-down view, the first space overlaps with the third space. Therefore, as... Figure 15 As shown, the first space formed by each slit 27 and the third space formed by each recess 24A are interconnected.

[0202] exist Figure 14 and Figure 15 In the semiconductor device 10G shown, the cover member 26 has a slit 27 and the protrusion 24 of the resin encapsulation body 22 has a recess 24A.

[0203] However, for the semiconductor device 10G of the eighth embodiment, it is also possible to have at least one of the adhesive portion 30 and the recess 26A in addition to the slit 27 and the recess 24A, or to have at least one of the adhesive portion 30 and the recess 26A instead of the slit 27 and the recess 24A. That is, the semiconductor device 10G of the eighth embodiment only needs to have at least two of the slit 27, the adhesive portion 30, the recess 24A and the recess 26A. The adhesive portion 30 exists between the protrusion 24 and the cover member 26, as described in the fifth embodiment. The recess 26A is formed on the lower surface 26d of the cover member 26, as described in the seventh embodiment.

[0204] In the case where the cover member 26 of the semiconductor device 10G in the eighth embodiment has a slit 27, the connecting portion of the semiconductor device 10G includes a first space formed by the slit 27.

[0205] In the case where the semiconductor device 10G of the eighth embodiment includes the adhesive portion 30, the adhesive portion 30 is not coated over the entire circumference of the upper surface 24b of the protrusion 24 when viewed from above. In this case, the connecting portion of the semiconductor device 10G includes a space 31 (second space), which is formed in the portion where the adhesive portion 30 is not coated.

[0206] In the case where the protrusion 24 of the resin package 22 of the semiconductor device 10G in the eighth embodiment has a recess 24A, the communication portion of the semiconductor device 10G includes a third space formed by the recess 24A.

[0207] In the case where the cover member 26 of the semiconductor device 10G in the eighth embodiment has a recess 26A, the connecting portion of the semiconductor device 10G includes a fourth space formed by the recess 26A.

[0208] Based on the above, the connecting portion of the semiconductor device 10G in the eighth embodiment includes at least two of a first space, a second space, a third space, and a fourth space. These at least two spaces overlap when viewed from above. The first to fourth spaces may overlap only partially or completely when viewed from above.

[0209] Furthermore, the at least two spaces in the connecting portion do not necessarily need to completely overlap when viewed from above. For example, if the connecting portion has spaces 1 to 3, then when viewed from above, spaces 1 and 2 may overlap, while space 3 may not overlap with spaces 1 and 2. Alternatively, if the connecting portion has spaces 1 to 4, then when viewed from above, spaces 1 and 2 may overlap, spaces 3 and 4 may overlap, while spaces 1 and 2 may not overlap with spaces 3 and 4.

[0210] According to the eighth embodiment, since two or more of the first to fourth spaces overlap and are interconnected when viewed from above, the cross-sectional area of ​​the connecting portion can be increased. This facilitates fluid flow at the connecting portion, thereby improving the responsiveness of the pressure detection unit 16d.

[0211] An example was described as an eighth embodiment. Figure 14 and Figure 15 In the structure shown, the first space and the third space independently connect the exposure hole 22a and the external of the semiconductor device 10G. However, it is also possible for two or more of the first to fourth spaces to cooperate in connecting the exposure hole 22a and the external of the semiconductor device 10G.

[0212] Figure 16 This is a longitudinal sectional view of a modified example of the semiconductor device according to the eighth embodiment of the present invention. For example, in Figure 16 In the semiconductor device 10H shown, the slit 27 of the cover member 26 communicates with the outside of the semiconductor device 10H but not with the exposure hole 22a, and the recess 24A of the protrusion 24 of the resin package 22 communicates with the exposure hole 22a but does not open on the side of the semiconductor device 10H. However, when viewed from above, the slit 27 and the recess 24A overlap, making the slit 27 and the recess 24A interconnected. Thus, the exposure hole 22a and the outside of the semiconductor device 10H are connected by the recess 24A and the slit 27.

[0213] <Ninth Embodiment>

[0214] Figure 17This is a top view of the semiconductor device according to the ninth embodiment of the present invention. The difference between the semiconductor device 10I of the ninth embodiment and the semiconductor device 10G of the eighth embodiment is that, when viewed from above, the first space and the third space do not overlap.

[0215] like Figure 17 As shown, the cover member 26 of the semiconductor device 10I has two slits 27, and the protrusion 24 of the resin encapsulation body 22 of the semiconductor device 10I has two recesses 24A. In this respect, the semiconductor device 10I has the same structure as the semiconductor device 10G of the eighth embodiment. However, in the semiconductor device 10I, the two slits 27 and the two recesses 24A do not overlap when viewed from above. In this respect, the semiconductor device 10I differs from the semiconductor device 10G of the eighth embodiment.

[0216] The semiconductor device 10I of the ninth embodiment, like the semiconductor device 10G of the eighth embodiment, only needs to include at least two of the slit 27, the adhesive portion 30, the recess 24A, and the recess 26A. That is, the connecting portion of the semiconductor device 10I of the ninth embodiment only needs to include at least two of the first space, the second space, the third space, and the fourth space. In this case, in the ninth embodiment, the at least two spaces included in the connecting portion do not overlap when viewed from above.

[0217] According to the ninth embodiment, the number of paths for fluid flow can be increased. This facilitates fluid flow at the connecting portion, thereby improving the responsiveness of the detection unit 16d that detects fluid pressure.

[0218] Furthermore, the effects of each embodiment can be achieved by appropriately combining any of the various embodiments. For example, the cover member 26 of the semiconductor device 10B of the third embodiment may have a plurality of slits 28 of the second embodiment (including slits 28 of the wide portion 28A and the narrow portion 28B), or may have at least one slit 27 of the first embodiment and one slit 28 of the second embodiment.

[0219] The invention has been fully described with reference to the accompanying drawings and in connection with preferred embodiments, but various modifications and variations will be apparent to those skilled in the art. Such modifications and variations are to be understood as included therein, provided they do not depart from the scope of the invention as defined by the claims.

[0220] Explanation of reference numerals in the attached figures

[0221] 1. Electronic device; 2. Housing; 10. Semiconductor device; 12. Substrate; 12a. Upper surface; 14. Circuit element; 16. Detection element; 16d. Detection part; 20. Bonding wire (connecting member); 22. Resin encapsulation body; 22a. Exposure hole; 23. Base; 24. Protrusion; 24A. Recess (first recess); 24a. Outer surface; 24b. Upper surface; 26. Cover member; 26A. Recess (second recess); 26a. Outer peripheral part (protrusion); 27. Slit; 28. Slit; 28A. Wide part; 28B. Narrow part; 30. Adhesive part; 31. Space; OR, O-ring; ORa, inner peripheral part.

Claims

1. A semiconductor device for detecting pressure, wherein, The semiconductor device includes: Substrate; A detection element, which is mounted on the upper surface of the substrate, has a detection section for detecting pressure; A resin encapsulation body is disposed on the upper surface of the substrate, and the detection element is embedded therein, having an opening that exposes the detection portion of the detection element upwards; A cover member, which is supported on the resin encapsulation body in a manner that blocks the opening; and A connecting portion that connects the opening to the outside of the semiconductor device. The resin encapsulation body includes: The base, wherein the detection element is embedded; and A protrusion, which projects upward from the base, has the opening. When viewed from above, the base extends to a position further outward than the outer side of the protrusion. The cover member is supported on the upper surface of the protrusion. The cover member has at least a portion of its outer periphery that extends outward from the outer side of the protrusion when viewed from above. The connecting portion communicates with the outside through an opening on the side of the semiconductor device. The connecting portion includes a space formed by a slit that, when viewed from above, extends inward from the outer periphery of the cover member.

2. The semiconductor device according to claim 1, wherein, When viewed from above, the slit is positioned offset from the detection unit.

3. The semiconductor device according to claim 1 or 2, wherein, The slit includes: The wide portion, at least partially overlapping the opening when viewed from above; and The narrow section is connected to the wide section and does not overlap with the opening when viewed from above.

4. The semiconductor device according to claim 1 or 2, wherein, The cover member has three or more of the aforementioned slits.

5. A semiconductor device for detecting pressure, wherein, The semiconductor device includes: Substrate; A detection element, which is mounted on the upper surface of the substrate, has a detection section for detecting pressure; A resin encapsulation body is disposed on the upper surface of the substrate, and the detection element is embedded therein, having an opening that exposes the detection portion of the detection element upwards; A cover member, which is supported on the resin encapsulation body in a manner that blocks the opening; and A connecting portion that connects the opening to the outside of the semiconductor device. The resin encapsulation body includes: The base, wherein the detection element is embedded; and A protrusion, which projects upward from the base, has the opening. When viewed from above, the base extends to a position further outward than the outer side of the protrusion. The cover member is supported on the upper surface of the protrusion. The cover member has at least a portion of its outer periphery that extends outward from the outer side of the protrusion when viewed from above. The connecting portion communicates with the outside through an opening on the side of the semiconductor device. The semiconductor device includes an adhesive portion located between the upper surface of the protrusion and the cover member, which secures the cover member to the protrusion. The connecting portion includes the space between the upper surfaces of the protrusion and the cover member, where the adhesive portion is absent, at the portion between the upper surface of the protrusion and the cover member.

6. A semiconductor device for detecting pressure, wherein, The semiconductor device includes: Substrate; A detection element, which is mounted on the upper surface of the substrate, has a detection section for detecting pressure; A resin encapsulation body is disposed on the upper surface of the substrate, and the detection element is embedded therein, having an opening that exposes the detection portion of the detection element upwards; A cover member, which is supported on the resin encapsulation body in a manner that blocks the opening; and A connecting portion that connects the opening to the outside of the semiconductor device. The resin encapsulation body includes: The base, wherein the detection element is embedded; and A protrusion, which projects upward from the base, has the opening. When viewed from above, the base extends to a position further outward than the outer side of the protrusion. The cover member is supported on the upper surface of the protrusion. The cover member has at least a portion of its outer periphery that extends outward from the outer side of the protrusion when viewed from above. The connecting portion communicates with the outside through an opening on the side of the semiconductor device. The cover member has a second recess that extends upward from the lower surface of the cover member. The connecting portion includes the space formed by the second recess.

7. The semiconductor device according to any one of claims 1, 5, and 6, wherein, The protrusion has a first recess that extends downward from the upper surface of the protrusion. The connecting portion includes the space formed by the first recess.

8. A semiconductor device for detecting pressure, wherein, The semiconductor device includes: Substrate; A detection element, which is mounted on the upper surface of the substrate, has a detection section for detecting pressure; A resin encapsulation body is disposed on the upper surface of the substrate, and the detection element is embedded therein, having an opening that exposes the detection portion of the detection element upwards; A cover member, which is supported on the resin encapsulation body in a manner that blocks the opening; and A connecting portion that connects the opening to the outside of the semiconductor device. The resin encapsulation body includes: The base, wherein the detection element is embedded; and A protrusion, which projects upward from the base, has the opening. When viewed from above, the base extends to a position further outward than the outer side of the protrusion. The cover member is supported on the upper surface of the protrusion. The cover member has at least a portion of its outer periphery that extends outward from the outer side of the protrusion when viewed from above. The connecting portion communicates with the outside through an opening on the side of the semiconductor device. The semiconductor device includes at least two of the following: a slit formed from the outer periphery of the cover member toward the inward side when viewed from above; an adhesive portion existing between the upper surface of the protrusion and the cover member and fixing the cover member to the protrusion; a first recess recessed downward from the upper surface of the protrusion; and a second recess recessed upward from the lower surface of the cover member. When the semiconductor device includes the slit, the connecting portion includes a first space formed by the slit. When the semiconductor device includes the adhesive portion, the connecting portion includes a second space between the upper surfaces of the protrusion and the cover member, where the portion of the protrusion without the adhesive portion is located opposite each other. When the semiconductor device includes the first recess, the connecting portion includes a third space formed by the first recess. When the semiconductor device includes the second recess, the connecting portion includes a fourth space formed by the second recess. When viewed from above, the first space, the second space, the third space, and the fourth space overlap.

9. A semiconductor device for detecting pressure, wherein, The semiconductor device includes: Substrate; A detection element, which is mounted on the upper surface of the substrate, has a detection section for detecting pressure; A resin encapsulation body is disposed on the upper surface of the substrate, and the detection element is embedded therein, having an opening that exposes the detection portion of the detection element upwards; A cover member, which is supported on the resin encapsulation body in a manner that blocks the opening; and A connecting portion that connects the opening to the outside of the semiconductor device. The resin encapsulation body includes: The base, wherein the detection element is embedded; and A protrusion, which projects upward from the base, has the opening. When viewed from above, the base extends to a position further outward than the outer side of the protrusion. The cover member is supported on the upper surface of the protrusion. The cover member has at least a portion of its outer periphery that extends outward from the outer side of the protrusion when viewed from above. The connecting portion communicates with the outside through an opening on the side of the semiconductor device. The semiconductor device includes at least two of the following: a slit formed from the outer periphery of the cover member toward the inward side when viewed from above; an adhesive portion existing between the upper surface of the protrusion and the cover member and fixing the cover member to the protrusion; a first recess recessed downward from the upper surface of the protrusion; and a second recess recessed upward from the lower surface of the cover member. When the semiconductor device includes the slit, the connecting portion includes a first space formed by the slit. When the semiconductor device includes the adhesive portion, the connecting portion includes a second space between the upper surfaces of the protrusion and the cover member, where the portion of the protrusion without the adhesive portion is located opposite each other. When the semiconductor device includes the first recess, the connecting portion includes a third space formed by the first recess. When the semiconductor device includes the second recess, the connecting portion includes a fourth space formed by the second recess. When viewed from above, the first space, the second space, the third space, and the fourth space do not overlap.

10. The semiconductor device according to any one of claims 1, 5, 6, 8, and 9, wherein, The semiconductor device includes: Circuit elements, which are mounted on the upper surface of the substrate; and A connecting member that electrically connects the circuit element and the detection element.

11. An electronic device, wherein, The electronic device includes: The semiconductor device according to any one of claims 1 to 10; An O-ring, configured to surround the protrusion of the resin package of the semiconductor device when viewed from above, wherein the inner periphery of the O-ring contacts the outer surface of the protrusion; and The housing on which the semiconductor device is mounted.

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