A device for removing semiconductor finished products with damaged appearances

Abstract

The present invention discloses a device for removing defective semiconductor finished products, which includes: a main cabinet body, a horizontally penetrating detection chamber is provided on the side wall of the main cabinet body, and a transparent glass window installed on the main cabinet body is provided on the front side of the detection chamber; a slide table module frame, the slide table module frame is installed on the inner top of the detection chamber, and two first electric cylinders are fixedly arranged on the moving table of the slide table module frame, and a defective product sorting mechanism is fixedly installed at the driving end of each first electric cylinder; and a transmission mechanism, the transmission mechanism is arranged on the right side of the main cabinet body, and the end of the transmission mechanism passes through the detection chamber and extends to the left side of the main cabinet body. In the device of the present invention, a loading mechanism and a defective product sorting mechanism are provided, and the two can cooperate to sort defective semiconductor devices, greatly improving the production efficiency and quality of semiconductor devices.

Description

Technical Field

[0001] The present invention specifically relates to the technical field of semiconductor finished product sorting, and specifically is a semiconductor appearance damaged finished product rejection device. Background Art

[0002] A semiconductor device is an electronic device with electrical conductivity between that of a good conductor and an insulator. It can utilize the special electrical properties of semiconductor materials to generate, control, receive, convert, amplify signals, and perform energy conversion. In the manufacturing of semiconductor devices, unavoidable graphic defects, dirt, breakage, and defects will occur. In order to improve the yield and product reliability of subsequent process steps, strict appearance inspection of semiconductor devices is required.

[0003] Existing semiconductor finished product sorting equipment on semiconductor device production lines performs automated sorting of good and defective products through microscopy, and most sorting equipment mainly uses the following two methods for sorting:

[0004] 1. Using a sorting manipulator for sorting;

[0005] 2. Using an elastic pusher for sorting;

[0006] Among them, although the first method can perform error-free and non-destructive sorting operations on semiconductor devices, its efficiency is slow, seriously dragging down the production efficiency of the semiconductor device production line; although the second method can perform rapid sorting operations on semiconductor devices, its sorting method is too harsh, extremely likely to damage the non-damaged finished semiconductor devices, and thus affecting the production quality of the semiconductor device production line. Summary of the Invention

[0007] Therefore, the present invention proposes a semiconductor appearance damaged finished product rejection device to solve the problems raised in the above background art.

[0008] To achieve the above object, the present invention provides the following technical solutions: A semiconductor appearance damaged finished product rejection device, which includes:

[0009] A main cabinet body, a horizontally penetrating detection chamber is provided on the side wall of the main cabinet body, and a transparent glass window installed on the main cabinet body is provided in front of the detection chamber;

[0010] A slide table module frame is installed on the inner top of the detection chamber. Two first electric cylinders are fixedly provided on the moving table of the slide table module frame, and a defective product sorting mechanism is fixedly installed at the driving end of each first electric cylinder;

[0011] and a transmission mechanism, which is arranged on the right side of the main cabinet body, and the end of the transmission mechanism passes through the detection bin and extends to the left side of the main cabinet body. A plurality of mounting disks are fixed on the conveyor belt of the transmission mechanism, and a loading mechanism for loading semiconductor devices is fixedly installed on each mounting disk.

[0012] Further, as a preference, the distance between every two adjacent loading mechanisms is the same, and under the transmission action of the transmission mechanism, the loading mechanism can cooperate with the defective product sorting mechanism to sort defective semiconductor devices.

[0013] Further, as a preference, the loading mechanism includes

[0014] a carrier base, on the top surface of which a plurality of component slots are circumferentially arrayed, and a compensation base is fixedly installed on the inner bottom surface of each component slot;

[0015] an unlocking assembly, which is symmetrically arranged on the left and right sides of each component slot;

[0016] and a flexible unlocking arc block, two relatively symmetrical flexible unlocking arc blocks are arranged in each component slot, and the flexible unlocking arc block is drivingly connected to the driving end of the corresponding unlocking assembly.

[0017] Further, as a preference, the unlocking assembly includes

[0018] a slider, which is slidably arranged in a sliding cavity in the carrier base in a matching manner. One end of a pressing key is fixedly connected to the top surface of the slider, and the other end of the pressing key passes through the top surface of the carrier base and extends out;

[0019] a downward pressing rod, one end of which is fixedly connected to the bottom surface of the slider, and the other end of which penetrates into an adjustment cavity one in the carrier base;

[0020] a compression spring, which is sleeved on a part of the downward pressing rod located between the slider and the inner bottom surface of the sliding cavity;

[0021] and a push rod, one end of which is fixedly connected to the flexible unlocking arc block, and the other end of which penetrates into an adjustment cavity two in the carrier base and is connected to the downward pressing rod through a gear linkage mechanism.

[0022] Further, as a preference, the adjustment cavity two is located behind the adjustment cavity one, and there is a shaft hole communicating between the adjustment cavity two and the adjustment cavity one.

[0023] Further, as a preference, the gear linkage mechanism includes

[0024] Gear 1, which is arranged in Adjustment Chamber 1 and meshes with Rack 1 fixed on the side wall of the Lower Pressing Rod;

[0025] Gear 2, which is arranged in Adjustment Chamber 2 and meshes with Rack 2 fixed on the side wall of the Push Rod;

[0026] And a linkage shaft, one end of which is fixedly connected to Gear 1, the other end of which passes through the shaft hole and extends into Adjustment Chamber 2, and then is fixedly connected to Gear 2.

[0027] Further, as a preference, the defective product sorting mechanism includes

[0028] A large housing, which is fixedly connected to the driving end of the first electric cylinder;

[0029] A small housing, the number of which is the same as that of the component grooves in the carrier seat, and a plurality of the small housings are circumferentially arrayed on the inner top surface of the large housing;

[0030] An inner housing, which is fixedly installed in each small housing, and a plurality of obliquely arranged microscope heads are circumferentially arrayed at the edge of the inner top surface of each inner housing;

[0031] Flexible clamping arc blocks, and two symmetrically arranged flexible clamping arc blocks are arranged in each inner housing;

[0032] And a pressing and locking assembly, and a pressing and locking assembly is arranged on the left and right sides of each inner housing, and the driving end of the pressing and locking assembly is connected to the corresponding flexible clamping arc block.

[0033] Further, as a preference, the pressing and locking assembly includes

[0034] A pull rod, one end of which is fixedly connected to the flexible clamping arc block, the other end of which passes through the side wall of the inner housing and extends out, and one ends of two inclined rods 1 are rotatably installed on the upper and lower end faces of the extending end of the pull rod;

[0035] A fixing bolt, which is fixed on the inner side wall of the small housing, a sliding ring is slidably sleeved on the side wall of the fixing bolt in a matching manner, one ends of two inclined rods 2 are rotatably installed on the upper and lower end faces of the sliding ring, and the other end of each inclined rod 2 is hinged to the other end of the adjacent inclined rod 1;

[0036] And a second electric cylinder, the driving end of which is fixedly connected to one end of a driving rod, and the other end of the driving rod is hinged to the connection end of the adjacent inclined rod 1 and inclined rod 2.

[0037] Further, as a preference, the inner diameter of the large housing is slightly larger than the diameter of the carrier seat, such that under the drive of the first electric cylinder, the large housing can be adaptively pressed against the carrier seat, and the connection ends of the first inclined rod and the second inclined rod close to the pressing key can push the pressing key downward.

[0038] The present invention adopts the above technologies and has the following beneficial effects compared with the existing technologies: In the device of the present invention, a supporting mechanism and a defective product sorting mechanism are provided, and the two can cooperate to sort defective semiconductor devices. When the defective product sorting mechanism is pressed against the supporting mechanism until they are in contact, the connection ends of the first inclined rod and the second inclined rod in the initial gathering state come into contact with the pressing key and perform a downward pressing action, causing the slider to drive the downward pressing rod to move downward, and driving the push rod to move to the right through the gear linkage mechanism to flexibly clamp the semiconductor device to be detected. At the same time, the position of the semiconductor device is corrected. Then, the microscope head starts to identify and detect. If a defective semiconductor device is detected, the driving end of the second electric cylinder extends downward and drives the driving rod to perform a downward pressing action, causing the first inclined rod and the second inclined rod to be in an open state, and then pushing the pull rod to move to the right, thereby realizing clamping and fixing of the semiconductor device. At the same time, the connection ends of the first inclined rod and the second inclined rod in the open state move out of the pressing key, and the compression spring rebounds, realizing unlocking of the semiconductor device in the clamped and fixed state and removing and recycling it, greatly improving the production efficiency and quality of semiconductor devices. Description of the Drawings

[0039] Figure 1 It is a schematic diagram of the overall structure of a semiconductor appearance damaged finished product removing device;

[0040] Figure 2 It is a schematic diagram of the relationship between the defective product sorting mechanism and the supporting mechanism in a semiconductor appearance damaged finished product removing device;

[0041] Figure 3 It is a schematic diagram of the structure inside the small housing of a semiconductor appearance damaged finished product removing device;

[0042] Figure 4 It is Figure 3 an enlarged schematic diagram of part A in

[0043] Figure 5 It is a schematic diagram of the internal structure of the supporting mechanism in a semiconductor appearance damaged finished product removing device;

[0044] Figure 6 It is a sectional schematic Figure 1 diagram of the gear linkage mechanism in a semiconductor appearance damaged finished product removing device

[0045] Figure 7 It is a sectional schematic Figure 2。

[0046] In the figure: 1, main cabinet body; 2, defective product sorting mechanism; 3, slide table module frame; 4, first electric cylinder; 5, loading mechanism; 6, mounting plate; 7, transmission mechanism; 21, large housing; 22, small housing; 23, inner housing; 24, microscope inspection head; 25, flexible clamping arc block; 201, second electric cylinder; 202, driving rod; 203, first inclined rod; 204, pull rod; 205, fixing bolt; 206, slip ring; 207, second inclined rod; 51, carrier seat; 52, flexible unlocking arc block; 53, component slot; 54, compensation base; 55, sliding cavity; 56, slider; 57, pressing key; 58, compression spring; 501, downward pressing rod; 502, first gear; 503, first adjustment cavity; 504, second adjustment cavity; 505, push rod; 506, linkage shaft; 507, second gear. Specific embodiments

[0047] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0048] Embodiment: Please refer to the attached Figure 1-7 , the present invention provides a technical solution: a semiconductor appearance damaged finished product rejection device, which includes:

[0049] The main cabinet body 1, a horizontally penetrating detection chamber is provided on the side wall of the main cabinet body 1, and a transparent glass window installed on the main cabinet body 1 is provided on the front side of the detection chamber;

[0050] The slide table module frame 3 is installed on the inner top of the detection chamber. Two first electric cylinders 4 are fixedly arranged on the moving table of the slide table module frame 3, and a defective product sorting mechanism 2 is fixedly installed at the driving end of each first electric cylinder 4;

[0051] And a transmission mechanism 7, the transmission mechanism 7 is arranged on the right side of the main cabinet body 1, and the end of the transmission mechanism 7 passes through the detection chamber and extends to the left side of the main cabinet body 1. A plurality of mounting plates 6 are fixed on the conveyor belt of the transmission mechanism 7, and a loading mechanism 5 for loading semiconductor devices is fixedly installed on each mounting plate 6;

[0052] It should also be added that a defective product storage box is provided in the detection chamber and behind the transmission mechanism 7 for storing defective semiconductor devices to be eliminated.

[0053] In this embodiment, the distance between every two adjacent loading mechanisms 5 is the same. Under the transmission action of the transmission mechanism 7, the loading mechanism 5 can cooperate with the defective product sorting mechanism 2 to sort defective semiconductor devices.

[0054] In this embodiment, the loading mechanism 5 includes

[0055] a carrier base 51, on the top surface of the carrier base 51, a plurality of component slots 53 are circumferentially arranged in an array, and a compensation base 54 is fixed on the inner bottom surface of each component slot 53;

[0056] Specifically, the compensation base 54 can support the bottom of the semiconductor device to be detected and provide height compensation for the semiconductor device to be detected, which is convenient for detection;

[0057] an unlocking assembly, unlocking assemblies are symmetrically arranged on the left and right sides of each component slot 53;

[0058] and flexible unlocking arc blocks 52, two relatively symmetric flexible unlocking arc blocks 52 are arranged in each component slot 53, and the flexible unlocking arc blocks 52 are drivingly connected to the driving ends of the corresponding unlocking assemblies.

[0059] In this embodiment, the unlocking assembly includes

[0060] a slider 56, the slider 56 is slidably arranged in a sliding cavity 55 in the carrier base 51, one end of a pressing key 57 is fixedly connected to the top surface of the slider 56, and the other end of the pressing key 57 passes through the top surface of the carrier base 51 and extends out;

[0061] a lower pressing rod 501, one end of the lower pressing rod 501 is fixedly connected to the bottom surface of the slider 56, and the other end of the lower pressing rod 501 penetrates into an adjustment cavity one 503 in the carrier base 51;

[0062] a compression spring 58, the compression spring 58 is sleeved on a part of the lower pressing rod 501 between the slider 56 and the inner bottom surface of the sliding cavity 55;

[0063] and a push rod 505, one end of the push rod 505 is fixedly connected to the flexible unlocking arc block 52, the other end of the push rod 505 penetrates into an adjustment cavity two 504 in the carrier base 51 and is connected to the lower pressing rod 501 through a gear linkage mechanism.

[0064] In this embodiment, the adjustment cavity two 504 is located behind the adjustment cavity one 503, and a shaft hole is communicated between the adjustment cavity two 504 and the adjustment cavity one 503.

[0065] In this embodiment, the gear linkage mechanism includes

[0066] a gear one 502, the gear one 502 is arranged in the adjustment cavity one 503, and the gear one 502 meshes with a rack one fixed on the side wall of the lower pressing rod 501;

[0067] The second gear 507 is arranged in the second adjustment cavity 504. The second gear 507 meshes with a second rack fixed on the side wall of the push rod 505;

[0068] And a linkage shaft 506, one end of the linkage shaft 506 is fixedly connected to the first gear 502, the other end of the linkage shaft 506 passes through the shaft hole and extends into the second adjustment cavity 504, and then is fixedly connected to the second gear 507;

[0069] Specifically, when the pressing key 57 is acted on by an external force and can overcome the elastic force of the compression spring 58, the slider 56 moves downward, driving the downward pressing rod 501 to move downward, thereby causing the first gear 502 to rotate clockwise. Since there is a linkage shaft 506 connected between the first gear 502 and the second gear 507, the second gear 507 rotates in the same direction as the first gear 502, thereby driving the push rod 505 to move to the right, so as to realize the flexible clamping of the semiconductor device to be detected and be able to correct the position of the semiconductor device, so as to facilitate the appearance detection of it;

[0070] When the external force acting on the pressing key 57 is removed, the compression spring 58 rebounds, and the slider 56 drives the downward pressing rod 501 to move upward. At this time, the first gear 502 and the second gear 507 rotate counterclockwise, thereby driving the push rod 505 to move to the left, so as to realize the unlocking of the semiconductor device in the clamped and fixed state.

[0071] In this embodiment, the defective product sorting mechanism 2 includes

[0072] A large housing 21, the large housing 21 is fixedly connected to the driving end of the first electric cylinder 4;

[0073] A small housing 22, the number of small housings 22 is the same as that of the component slots 53 in the carrier 51, and a plurality of small housings 22 are circumferentially arrayed on the inner top surface of the large housing 21;

[0074] An inner housing 23, an inner housing 23 is fixedly installed in each small housing 22, and a plurality of obliquely arranged mirror inspection heads 24 are circumferentially arrayed at the edge of the inner top surface of each inner housing 23;

[0075] Specifically, the downward inclination angle of the mirror inspection head 24 is 55-65°, which can make the semiconductor device within the recognition and detection range of the mirror inspection head 24;

[0076] Flexible clamping arc blocks 25, two symmetric flexible clamping arc blocks 25 are arranged in each inner housing 23. During the detection process, the flexible clamping arc blocks 25 are located directly above the flexible unlocking arc blocks 52;

[0077] and a press-lock assembly, with a press-lock assembly provided on each of the left and right sides of each inner housing 23, and a driving end of the press-lock assembly being connected to a corresponding flexible clamping arc block 25.

[0078] In this embodiment, the press-lock assembly includes

[0079] a pull rod 204, one end of the pull rod 204 is fixedly connected to the flexible clamping arc block 25, the other end of the pull rod 204 passes through the side wall of the inner housing 23 and extends out, and one ends of a first inclined rod 203 are rotatably installed on the upper and lower end faces of the extending end of the pull rod 204;

[0080] a fixing bolt 205, the fixing bolt 205 is fixed on the inner side wall of the small housing 22, a sliding ring 206 is slidably sleeved on the side wall of the fixing bolt 205 in a matching manner, one ends of a second inclined rod 207 are rotatably installed on the upper and lower end faces of the sliding ring 206, and the other end of each second inclined rod 207 is hinged to the other end of the adjacent first inclined rod 203;

[0081] and a second electric cylinder 201, a driving end of the second electric cylinder 201 is fixedly connected to one end of a driving rod 202, and the other end of the driving rod 202 is hinged to the connection end of the adjacent first inclined rod 203 and second inclined rod 207;

[0082] Specifically, during the process when the first inclined rod 203 and the second inclined rod 207 are in an open state, it can push the pull rod 204 to move rightward, and during the process when the first inclined rod 203 and the second inclined rod 207 are in a converging state, it can pull the pull rod 204 to move leftward.

[0083] In this embodiment, the inner diameter of the large housing 21 is slightly larger than the diameter of the carrier 51, so that under the drive of the first electric cylinder 4, the large housing 21 can be adaptively pressed against the carrier 51, and the connection end of the first inclined rod 203 and the second inclined rod 207 close to the press key 57 can push the press key 57 to be pressed down.

[0084] In specific implementation, the semiconductor devices to be detected are orderly placed in the component slots 53 on the carrier 51. The transmission mechanism is started. When the carrier mechanism 5 moves to directly below the defective product sorting mechanism 2, the transmission mechanism stops. The first electric cylinder 4 drives the defective product sorting mechanism 2 to move downward until the defective product sorting mechanism 2 is pressed against the carrier mechanism 5. The connecting end of the first inclined rod 203 and the second inclined rod 207 in the converged state contacts the pressure key 57 and performs a pressing action, causing the slider 56 to drive the downward pressing rod 501 to move downward, and driving the push rod 505 to move to the right through the gear linkage mechanism to flexibly clamp the semiconductor device to be detected. At the same time, the position of the semiconductor device is corrected. Then, the microscope head 24 starts the identification and detection work. If a defective semiconductor device is detected, the driving end of the second electric cylinder 201 extends downward and drives the driving rod 202 to perform a pressing action, causing the first inclined rod 203 and the second inclined rod 207 to be in an open state, and then pushing the pull rod 204 to move to the right, thereby realizing the clamping and fixing of the semiconductor device. At the same time, the connecting end of the first inclined rod 203 and the second inclined rod 207 in the open state moves out of the pressure key 57, and the compression spring 58 rebounds to unlock the semiconductor device in the clamped and fixed state (the unlocking at this time is for the removal of the defective semiconductor device), and it is removed and recycled;

[0085] If no defective semiconductor device is detected, the second electric cylinder 201 remains stationary. After the detection is completed, the first electric cylinder 4 drives the defective product sorting mechanism 2 to move upward. At this time, the connecting end of the first inclined rod 203 and the second inclined rod 207 in the converged state is separated from the pressure key 57, and the compression spring 58 rebounds to unlock the semiconductor device (the unlocking at this time is for the removal of the non-damaged semiconductor device), and then the transmission mechanism conveys the semiconductor devices with undamaged appearance to the finished product packing area.

[0086] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirits of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor appearance damaged finished product rejection device, characterized in that, Including: A main cabinet body, with a horizontally penetrating detection chamber provided on the side wall, and a transparent glass window installed on the main cabinet body is provided in front of the detection chamber; A sliding table module frame, installed on the inner top of the detection chamber, and two first electric cylinders are fixedly arranged on the moving table of the sliding table module frame, and a defective product sorting mechanism is fixedly installed at the driving end of each first electric cylinder; A transmission mechanism, arranged on the right side of the main cabinet body, the end of the transmission mechanism passes through the detection chamber and extends to the left side of the main cabinet body, and a plurality of mounting disks are fixed on the conveyor belt of the transmission mechanism, and a carrier mechanism for loading semiconductor devices is fixedly installed on each mounting disk; The carrier mechanism includes: A carrier base, with a plurality of component grooves arranged in a circumferential array on the top surface, and a compensation base is fixedly installed on the inner bottom surface of each component groove; An unlocking assembly, and unlocking assemblies are symmetrically arranged on the left and right sides of each component groove; Flexible unlocking arc blocks, two relatively symmetrical flexible unlocking arc blocks are arranged in each component groove, and the flexible unlocking arc blocks are drivingly connected to the driving ends of the corresponding unlocking assemblies; The unlocking assembly includes: A slider, which is slidably arranged in a sliding cavity in the carrier base in a matching manner, one end of a pressing key is fixedly connected to the top surface of the slider, and the other end of the pressing key passes through the top surface of the carrier base and extends out; A downward pressing rod, one end of which is fixedly connected to the bottom surface of the slider, and the other end penetrates into the first adjustment cavity in the carrier base; A compression spring, sleeved on the part of the downward pressing rod between the slider and the inner bottom surface of the sliding cavity; A push rod, one end of which is fixedly connected to the flexible unlocking arc block, and the other end penetrates into the second adjustment cavity in the carrier base and is connected to the downward pressing rod through a gear linkage mechanism; The defective product sorting mechanism includes: A large shell, fixedly connected to the driving end of the first electric cylinder; Small shells, the same number as the component grooves in the carrier base, and a plurality of small shells are arranged in a circumferential array on the inner top surface of the large shell; Inner shells, an inner shell is fixedly installed in each small shell, and a plurality of obliquely arranged mirror inspection heads are arranged in a circumferential array at the edge of the inner top surface of each inner shell; Flexible clamping arc blocks, two relatively symmetrical flexible clamping arc blocks are arranged in each inner shell; A pressure locking assembly, and a pressure locking assembly is arranged on the left and right sides of each inner shell, and the driving end of the pressure locking assembly is connected to the corresponding flexible clamping arc block; The pressure locking assembly includes: A pull rod, one end of which is fixedly connected to the flexible clamping arc block, the other end passes through the side wall of the inner shell and extends out, and one ends of two inclined rods one are rotatably installed on the upper and lower end faces of the extending end part of the pull rod; A fixing bolt, fixed on the inner side wall of the small shell, a sliding ring is slidably sleeved on the side wall of the fixing bolt in a matching manner, and one ends of two inclined rods two are rotatably installed on the upper and lower end faces of the sliding ring, and the other end of each inclined rod two is hinged to the other end of the adjacent inclined rod one; A second electric cylinder, the driving end of which is fixedly connected to one end of a driving rod, and the other end is hinged to the connection end of the adjacent inclined rod one and inclined rod two; The connection ends of the first inclined rod and the second inclined rod close to the pressing key push the pressing key downward, causing the slider to drive the downward pressing rod to move downward, and driving the push rod to move to the right through the gear linkage mechanism to flexibly clamp the semiconductor device to be detected. When a defective semiconductor device is detected, the driving end of the second electric cylinder extends downward and drives the driving rod to perform a downward pressing action. At the same time, the connection end of the first inclined rod and the second inclined rod in the open state moves out of the pressing key.

2. A semiconductor appearance damaged finished product rejection device according to claim 1, characterized in that: The spacing between every two adjacent carrier mechanisms is the same. Under the transmission action of the transmission mechanism, the carrier mechanism can cooperate with the defective sorting mechanism to sort defective semiconductor devices.

3. A semiconductor appearance damaged finished product rejection device according to claim 1, characterized in that: The second adjustment cavity is located behind the first adjustment cavity, and there is a shaft hole communicating between the second adjustment cavity and the first adjustment cavity.

4. A defective semiconductor finished product rejection device according to claim 1, characterized in that: The gear linkage mechanism includes: A first gear, which is arranged in the first adjustment cavity and meshes with a first rack fixed on the side wall of the downward pressing rod; A second gear, which is arranged in the second adjustment cavity and meshes with a second rack fixed on the side wall of the push rod; A linkage shaft, one end of the linkage shaft is fixedly connected to the first gear, the other end of the linkage shaft passes through the shaft hole and extends into the second adjustment cavity, and then is fixedly connected to the second gear.

5. A semiconductor appearance damaged finished product rejection device according to claim 1, characterized in that: The inner diameter of the large housing is slightly larger than the diameter of the carrier seat, so that under the drive of the first electric cylinder, the large housing can be adaptively pressed with the carrier seat.

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