High-infrared-reflection black barrier encapsulation adhesive film, preparation method thereof and photovoltaic module

Abstract

The application belongs to the technical field of packaging adhesive film, and particularly relates to high-infrared-reflection black barrier packaging adhesive film, a preparation method thereof and a photovoltaic module, which comprise a black barrier layer and a high-reflection white film layer which are stacked in sequence; the black barrier layer comprises a first base resin and black master batches; the high-reflection white film layer comprises a second base resin and white master batches; the first base resin has a melt index of 2-10 g / 10 min and a surface tension of 29-31 dyn / cm; the second base resin has a melt index of 3-25 g / 10 min and a surface tension of 35-40 dyn / cm; the high-infrared-reflection black barrier packaging adhesive film, the preparation method thereof and the photovoltaic module improve the dispersion of the resin to the pigment and the migration resistance by setting the black barrier layer with low melt index and low surface tension and utilizing the difference in surface tension between the black barrier layer and the high-reflection white film layer, and the first base resin is a non-EVA system, so that no acidic substances are generated, and the PID resistance of the photovoltaic module is effectively improved.

Description

Technical Field

[0001] This invention belongs to the field of encapsulation film technology, specifically relating to a high infrared reflectance black barrier encapsulation film, its preparation method, and photovoltaic modules. Background Technology

[0002] Currently, high-reflectivity black modules employ a two-layer structure consisting of a high-infrared transmission layer and a high-reflectivity white film layer. EB irradiation is used to reduce the leakage of titanium dioxide or black pigments onto the front of the cells during the module lamination process, thereby lowering module power and reducing hot spots. However, black organic pigments have poor compatibility with resins, leading to aggregation and migration. Furthermore, the base resin of colored films is ethylene-vinyl acetate, which generates acidic substances during damp-heat aging, corroding the cells and reducing module reliability.

[0003] Therefore, there is an urgent need for a high-reflectivity encapsulating film that can improve the dispersibility and migration resistance of black organic pigments in resin, thereby enhancing the reliability of components. Summary of the Invention

[0004] This invention provides a high infrared reflectance black barrier encapsulating film and its preparation method, as well as a photovoltaic module, to solve the problem of poor dispersion and migration resistance of black pigments in resin.

[0005] To address the aforementioned technical problems, this invention provides a high infrared reflectance black barrier encapsulating film, comprising: a black barrier layer and a high reflectance white film layer stacked sequentially; the black barrier layer comprising a first matrix resin and a black masterbatch; the high reflectance white film layer comprising a second matrix resin and a white masterbatch; wherein the first matrix resin has a melt index of 2–10 g / 10 min and a surface tension of 29–31 dyn / cm; the second matrix resin has a melt index of 3–25 g / 10 min and a surface tension of 35–40 dyn / cm.

[0006] In another aspect, the present invention also provides a method for preparing the high infrared reflectance black barrier encapsulating film as described above, comprising: step S1, preparing the black masterbatch and white masterbatch respectively; step S2, uniformly mixing the black masterbatch and white masterbatch with other raw materials and then adding them to an extruder to prepare the black barrier layer and the high reflectance white film layer; step S3, hot-pressing the black barrier layer and the high reflectance white film layer together with a steel roller and the film surface, cooling and winding them up, and then irradiating them to obtain the high infrared reflectance black barrier encapsulating film.

[0007] Thirdly, the present invention also provides a photovoltaic module, comprising: a high infrared reflectance black barrier encapsulating film as described above.

[0008] The beneficial effects of the present invention are that the high infrared reflectance black barrier encapsulating film and its preparation method, and the photovoltaic module of the present invention, by setting a black barrier layer with low melt index and low surface tension, effectively improve the dispersion and migration resistance of the resin to pigment by utilizing the difference in surface tension between the black barrier layer and the high reflectance white film layer. At the same time, the first matrix resin is a non-EVA system and will not produce acidic substances, thereby effectively improving the anti-PID effect of the photovoltaic module.

[0009] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention.

[0010] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0011] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0012] Figure 1 These are migration resistance effect diagrams of Example 1 and Comparative Example 1 of the high infrared reflectance black barrier encapsulating film of the present invention.

[0013] Figure 2 These are EL images of corrosion resistance tests of Example 3 and Comparative Example 1 of the high infrared reflectance black barrier encapsulating film of the present invention. Detailed Implementation

[0014] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0015] This invention provides a high infrared reflectance black barrier encapsulating film, comprising: a black barrier layer and a high reflectance white film layer stacked sequentially; the black barrier layer comprising a first matrix resin and a black masterbatch; the high reflectance white film layer comprising a second matrix resin and a white masterbatch; wherein the first matrix resin has a melt index of 2-10 g / 10 min and a surface tension of 29-31 dyn / cm; the second matrix resin has a melt index of 3-25 g / 10 min and a surface tension of 35-40 dyn / cm.

[0016] In this embodiment, specifically, the thickness of the black barrier layer is 80-120 μm; the thickness of the high-reflectivity white film layer is 280-420 μm. Optionally, the ratio of the black barrier layer to the high-reflectivity white film layer is 20-30:70-80.

[0017] In this embodiment, specifically, the first matrix resin is any one of a saturated polymer and an unsaturated polymer; wherein the saturated polymer is one or more of polyurethane, polyethylene (one or more of LDPE, LLDPE, or HDPE; with a melting point of 85-135°C and a melt index of 0.5-15 g / 10 min, optionally Sinopec DGDA3091, Yangzi Petrochemical 3300F, or Yanshan Petrochemical LD615), and polypropylene; the unsaturated polymer has a Mooney viscosity ML 1+4 At 125℃, the iodine content is 5-80, and the unsaturation degree is 2.0-30.0±0.2g iodine / 100g rubber. It is one or more of the following: butadiene rubber (BR9000 Yanshan Petrochemical), butyl rubber (1675N, Yanshan Petrochemical 1751), isoprene rubber (IR2200 Japan Zeon, IR80 Dushanzi), and ethylene propylene diene monomer (EPDM) (Sinopec Mitsui grades: 2032PM, 3092PM, 3112PM, etc., Dow NORDEL™ 3720P, 3745P, 3760P and 4770P).

[0018] In this embodiment, specifically, the black barrier layer comprises, by weight, 58-78 parts of the first matrix resin; 20-40 parts of the black masterbatch; 0.4-1.0 parts of the initiator; 0.5-1.0 parts of the silane coupling agent; and 0.5-1.0 parts of the co-crosslinking agent. The initiator is one or more of TBEC and TAEC; the silane coupling agent is one or more of vinylsilane, methacryloxysilane, silane oligomers, and hydrolysates; and the co-crosslinking agent is one or more of triallyl isocyanurate (TAIC) and trimethylolpropane triacrylate (TMPTA).

[0019] In this embodiment, the preparation process of the black barrier layer specifically includes irradiation crosslinking; wherein the irradiation parameters are set to 0.1-0.6 MeV, the dose is 10-60 kGy, and the linear velocity is 10-60 m / min; irradiation crosslinking reduces appearance defects such as whitening and wrinkles in the black and white film.

[0020] In this embodiment, specifically, the black masterbatch comprises, by weight, 80-92 parts polyethylene resin; 5-10 parts infrared high-transmittance pigment; 1-5 parts carbon black oxide; 1-5 parts nano titanium dioxide; 0.5-1 part dispersant; and 0.1-0.5 parts antioxidant. The carbon black oxide has a particle size of 20-50 nm. Compared to ordinary carbon black, Mitsubishi's MA100 has superior dispersibility and better blackness. The nano titanium dioxide has a particle size of 10-50 nm. Because the surface of the inorganic pigment contains a large number of hydroxyl groups, its surface is treated with a silane coupling agent to increase the dispersion of the inorganic pigment and improve the reflectivity in the near-infrared region without affecting the hue. The infrared high-transmittance pigment is perylene black pigment, anthraquinone, phthalocyanine, indigo, thiocyanate, quinacridone, etc. One or more of dioxazine, isoindoline, indolinone ring, and nitrogen-based compounds have poor pigment dispersibility due to their structure. Silane coupling agents are ineffective in dispersing these pigments because they lack hydroxyl groups on their surface and cannot react with the silane coupling agent. One or more phthaloyl (aluminum, zirconium, and boron) esters are used, treated at 70-120℃ under the dual action of surfactants to reduce the aggregation of organic pigments. The antioxidant is one or more of aromatic amines BHT and 264, hindered phenols 1010 and 1076, and auxiliary antioxidant 168. The dispersant is one or more of PE dispersants Clariant 3620, Honeywell AC-295A, and A-C573A. The polyethylene resin uses one or more of EVA wax, BASF Luwax EVA3, and Honeywell AC-400A.

[0021] In this embodiment, specifically, the black masterbatch is granulated by a twin-screw extruder, and the preparation process of the black masterbatch is as follows: 90-100℃ in the rear section, 120-140℃ in the middle section, 140-160℃ in the front section, and 140-160℃ at the die head.

[0022] In this embodiment, specifically, the high-reflectivity white film layer comprises, by weight, the following components: 75.4–88.7 parts of the second matrix resin; 0.4–1.0 parts of the initiator; 0.5–1.0 parts of the co-crosslinking agent; 0.2–1.0 parts of the silane coupling agent; 0.1–0.6 parts of the ultraviolet light stabilizer; and 10–20 parts of the white masterbatch. The second matrix resin is one or more of EVA, vinyl-butene / octene copolymer, ethylene-acrylate, and PTW ternary oligomer. The white masterbatch includes titanium dioxide and fillers. The fillers are one or more of talc, wollastonite, kaolin, mica, barium sulfate, aluminum hydroxide, magnesium hydroxide, and hollow glass microspheres.

[0023] Secondly, the present invention also provides a method for preparing the high infrared reflectance black barrier encapsulating film as described above, comprising: step S1, preparing the black masterbatch and white masterbatch respectively; step S2, uniformly mixing the black masterbatch and white masterbatch with other raw materials and adding them to an extruder to prepare the black barrier layer and the high reflectance white film layer; step S3, hot-pressing the black barrier layer and the high reflectance white film layer together with a steel roller and the film surface, cooling and winding them up, and then irradiating them to obtain the high infrared reflectance black barrier encapsulating film.

[0024] Thirdly, the present invention also provides a photovoltaic module, comprising: a high infrared reflectance black barrier encapsulating film as described above.

[0025] The high-reflectivity white film layer in Examples 1-3 and Comparative Example 1 has the same composition and a surface tension of 37 dyn / cm. The high-reflectivity white film layer, by mass parts, consists of: 74.5 parts ethylene-vinyl acetate, 0.6 parts initiator, 0.4 parts co-crosslinking agent TAIC, 0.4 parts silane coupling agent KH570, 0.1 parts UV stabilizer, 20 parts white masterbatch, and 4 parts filler talc.

[0026] Example 1

[0027] Example 1 provides a high infrared reflectance black barrier encapsulation film and its preparation method, the only difference being that the components and amounts in the black barrier layer are different, and it is paired with a high reflectance white film layer, i.e., a conventional photovoltaic encapsulation white film.

[0028] Preparation of the black masterbatch in this embodiment: 91 parts of polyethylene resin - Yangzi Petrochemical 3300F, 1 part of carbon black oxide - Mitsubishi MA100, 8 parts of infrared transmission pigment perylene violet - BASF K0087, 1 part of nano titanium dioxide - 20nm, 0.2 parts of antioxidant - 1010, and 0.8 parts of dispersant PE wax - Honeywell AC-295A.

[0029] The twin-screw granulation process is as follows: rear section 90-100℃, middle section 120-140℃, front section 140-160℃, and die head 140-160℃.

[0030] The preparation of the black barrier layer and the combination with the white film in this embodiment to obtain a high infrared reflectance black barrier encapsulating film: 30 parts of black masterbatch of polyethylene resin carrier, 68.5 parts of ethylene propylene rubber - Sinopec Mitsui 2032PM, 0.6 parts of crosslinking agent TBEC, 0.3 parts of silane coupling agent KH570, and 0.6 parts of co-crosslinking agent trimethylolpropane triacrylate. The mixture was mixed at 45-55℃ for 4-6 hours, added to an extruder for casting to obtain a 100-micron black barrier layer, which was then hot-pressed with the cast high reflectance white film layer using a steel roller and the film surface. After cooling and winding, the high infrared reflectance black barrier encapsulating film was obtained by irradiation.

[0031] Example 2

[0032] Example 2 provides a high infrared reflectance black barrier encapsulation film and its preparation method, the only difference being that the components and amounts in the black barrier layer are different, and it is paired with a high reflectance white film layer, i.e., a conventional photovoltaic encapsulation white film.

[0033] Preparation of the black masterbatch in this embodiment: 85 parts of polyethylene resin - Yanshan Petrochemical LD615, 1 part of carbon black oxide - Mitsubishi MA100, 9 parts of infrared transmission pigment perylene black 32 - BASF L0086 + 3 parts of perylene violet - BASF K0087, 1 part of nano titanium dioxide (20nm), 0.2 parts of antioxidant 1010, and 0.8 parts of dispersant PE wax - Honeywell A-C573A.

[0034] The twin-screw extrusion process is as follows: rear section 90-100℃, middle section 120-140℃, front section 140-160℃, and die head 140-160℃.

[0035] The black barrier layer in this embodiment consists of 35 parts of black masterbatch from a polyethylene resin carrier, 63.5 parts of ethylene propylene rubber (Sinopec Mitsui 3092PM), 0.6 parts of crosslinking agent TBEC, 0.3 parts of silane coupling agent KH570, and 0.6 parts of co-crosslinking agent trimethylolpropane triacrylate. The mixture is stirred at 45-55°C for 4-6 hours, then extruded and cast to obtain a 100-micron black barrier layer. This layer is then hot-pressed onto a high-reflectivity white film layer obtained from the extrusion process using steel rollers and the film surface. After cooling and winding, it is irradiated to obtain the high infrared reflectivity black barrier encapsulating film.

[0036] Example 3

[0037] Example 3 provides a high infrared reflectance black barrier encapsulation film and its preparation method, the only difference being that the components and amounts in the black barrier layer are different, and it is paired with a high reflectance white film layer, i.e., a conventional photovoltaic encapsulation white film.

[0038] Preparation of the black masterbatch in this embodiment: 87 parts of polyethylene resin - Sinopec DGDA3091, 1 part of carbon black oxide - Mitsubishi MA100; 10 parts of infrared transmission pigment perylene black 32 - BASF L0086; 1 part of nano titanium dioxide (20nm); 0.2 parts of antioxidant 1010; 0.8 parts of dispersant PE wax - Clariant 3620.

[0039] The twin-screw extrusion process is as follows: rear section 90-100℃, middle section 120-140℃, front section 140-160℃, and die head 140-160℃.

[0040] The black barrier layer in this embodiment consists of 30 parts of black masterbatch from a polyethylene resin carrier, 68.5 parts of ethylene propylene rubber (brand name), 0.6 parts of crosslinking agent TBEC, 0.3 parts of silane coupling agent KH570, and 0.6 parts of co-crosslinking agent trimethylolpropane triacrylate. The mixture is prepared at 45-55°C and then extruded to obtain a 100-micron black barrier layer. This layer is then hot-pressed onto a high-reflectivity white film layer obtained from the extrusion process using a steel roller and the film surface. After cooling and winding, the film is irradiated to obtain the high infrared reflectivity black barrier encapsulating film.

[0041] Comparative Example 1: A high infrared reflectance black barrier encapsulating film and its preparation method are provided, the only difference being that the black barrier layer is made of EVA resin granulation and casting.

[0042] Preparation of the black masterbatch for Comparative Example 1: 87 parts of EVA resin (Sirbon V2825 melt index 25, VA content 28%), 1 part of carbon black oxide - Mitsubishi MA100; 10 parts of infrared transmission pigment perylene black 32 - BASF L0086; 1 part of nano titanium dioxide (20-50nm); 0.2 parts of antioxidant 1010; 0.8 parts of dispersant EVA wax - BASF Luwax EVA3.

[0043] The twin-screw extrusion process is as follows: rear section 90-100℃, middle section 120-140℃, front section 140-160℃, and die head 140-160℃.

[0044] The black barrier layer in this embodiment consists of 30 parts of black masterbatch for the EVA resin carrier, 68.5 parts of EVA resin (Silbon V2825), 0.6 parts of crosslinking agent TBEC, 0.3 parts of silane coupling agent KH570, and 0.6 parts of co-crosslinking agent trimethylolpropane triacrylate. The mixture is stirred at 45-55°C for 4 hours, then extruded and cast to obtain a 100-micron black barrier layer. This layer is then hot-pressed onto a high-reflectivity white film layer obtained from the extrusion process using a steel roller and the film surface. After cooling and winding, it is irradiated to obtain the high infrared reflectivity black barrier encapsulating film.

[0045] Migration Resistance: Sample Preparation. The encapsulation film samples prepared in Example 1 and Comparative Example 1 were placed in a laminator according to the following format: "Patterned Glass / Transparent EVA / Battery Cell / High Infrared Reflective Black Barrier Film / Release Film". Lamination parameters were 145℃ for 5 minutes and 11 minutes for lamination. After lamination, dry heat (150℃ / 48h) and damp heat (PCT 121℃ 100RH 48h) aging were performed. Appearance comparison was conducted, primarily examining the color change of the white film surface and whether black pigment migrated into the white film.

[0046] Surface tension testing: Sample preparation: Take the encapsulating film samples prepared in Examples 1-3 and Comparative Example 1, and place them in a laminator according to the order "release film / black and white film / release film". Lamination parameters: 145℃, vacuum for 5 minutes, and laminate for 11 minutes. Hold the dyne test pen perpendicular to the film surface, apply appropriate pressure, and draw a line on the film surface for testing. The liquid mark left by the dyne pen is uniform, without breaks, and does not shrink; if shrinkage occurs, it indicates that the dyne value is insufficient, and a larger dyne pen needs to be used.

[0047] Pre-crosslinking degree and reflectivity test: Sample preparation: Take the encapsulating film samples prepared in Examples 1-3 and Comparative Example 1, and test them according to the test methods of GB / T 29848-2018. Irradiation parameters: 0.5MeV - dose 13kGy.

[0048] Corrosion resistance test: Sample preparation: The encapsulation film samples prepared in Example 3 and Comparative Example 1 were placed in a laminator according to the following format: "patterned glass / transparent EVA / battery cell / high infrared reflective black barrier film / backsheet". The lamination parameters were 145℃ for 5 minutes and lamination for 11 minutes. After lamination, the samples were subjected to damp heat aging (PCT 121℃ 100RH 96h) and EL test.

[0049] Table 1. Test results of encapsulating films in Examples 1-3 and Comparative Example 1

[0050]

[0051] like Figure 1 As shown, specifically, in Example 1, the white film layer of the backing film remained essentially unchanged, and the black pigment did not migrate to the white film layer under both dry heat and humid heat aging conditions, indicating that the low surface tension resin can inhibit the migration of organic pigments; in Comparative Example 1, the white film layer turned red under both dry heat and humid heat conditions, indicating that the black organic pigment in the black layer migrated.

[0052] like Figure 2 As shown, specifically, in Example 3, the black layer is a barrier layer with good anti-corrosion effect; in Comparative Example 1, the black layer in contact with the battery surface is a conventional EVA layer, and after damp heat aging, the edge of the battery cell turns black.

[0053] In summary, the high infrared reflectance black barrier encapsulating film and its preparation method of the present invention, as well as the photovoltaic module, effectively improve the dispersion and migration resistance of the resin for pigments by setting a black barrier layer with low melt index and low surface tension, utilizing the difference in surface tension between the black barrier layer and the high reflectance white film layer. At the same time, the first matrix resin is a non-EVA system, which will not produce acidic substances, thus effectively improving the anti-PID effect of the photovoltaic module.

[0054] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A high infrared reflectance black barrier encapsulating film, characterized in that, include: A black barrier layer and a highly reflective white film layer are stacked sequentially; The black barrier layer comprises a first matrix resin and a black masterbatch; The high-reflectivity white film layer comprises a second matrix resin and white masterbatch; in The melt index of the first matrix resin is 2-10 g / 10 min, and the surface tension is 29-31 dyn / cm; The melt index of the second matrix resin is 3-25 g / 10 min, and the surface tension is 35-40 dyn / cm; The first matrix resin is any one of a saturated polymer and an unsaturated polymer; wherein The saturated polymer is one or more of polyurethane, polyethylene, and polypropylene; The Mooney viscosity ML of the unsaturated polymer 1+4 At 125℃, the iodine content is 5-80, and the unsaturation degree is 2.0-30.0±0.2g iodine / 100g rubber. It is one or more of cis-butadiene rubber, butyl rubber, isoprene rubber, and ethylene-propylene rubber. The second matrix resin is one or more of EVA, vinyl-butene / octene copolymer, ethylene-acrylate, and PTW ternary oligomer.

2. The high infrared reflectance black barrier encapsulating film as described in claim 1, characterized in that, The thickness of the black barrier layer is 80–120 μm; The thickness of the high-reflectivity white film layer is 280–420 μm.

3. The high infrared reflectance black barrier encapsulating film as described in claim 1, characterized in that, The black barrier layer is present in parts by weight as follows: 58-78 parts of the first matrix resin; 20-40 parts of black masterbatch; Initiator 0.4–1.0 parts; 0.5–1.0 parts of silane coupling agent; Crosslinking agent 0.5-1.0 parts; wherein The initiator is one or more of TBEC and TAEC; The silane coupling agent is one or more of vinylsilane, methacryloxysilane, silane oligomers and hydrolysates; The co-crosslinking agent is one or more of triallyl isocyanurate (TAIC) and trimethylolpropane triacrylate (TMPTA).

4. The high infrared reflectance black barrier encapsulating film as described in claim 3, characterized in that, The preparation process of the black barrier layer includes irradiation crosslinking; wherein The irradiation parameters were set to 0.1–0.6 MeV, the dose to 10–60 kGy, and the linear velocity to 10–60 m / min.

5. The high infrared reflectance black barrier encapsulating film as described in claim 1, characterized in that, The black masterbatch is expressed in parts by weight as follows: 80-92 parts of polyethylene resin; 5-10 parts of infrared high-transmittance pigment; 1-5 parts of carbon black oxide; 1-5 parts of nano-titanium dioxide; Dispersant 0.5 to 1 part; Antioxidant 0.1-0.5 parts; of which The particle size of the carbon black oxide is 20–50 nm; The particle size of the nano-titanium dioxide is 10–50 nm; The infrared high-transmittance pigment is one or more of perylene black pigment, anthraquinone, phthalocyanine, indigo, thiocyanate, quinacridone, dioxazine, isoindoline, indolinone ring and nitrogen-based pigments, and is modified with phthalate esters and surfactants at 70-120°C. The antioxidant is one or more of aromatic amines, hindered phenols, and auxiliary antioxidants; The dispersant is a PE-based dispersant.

6. The high infrared reflectance black barrier encapsulating film as described in claim 5, characterized in that, The black masterbatch is granulated using a twin-screw extruder. The preparation process of the black masterbatch is as follows: The temperature ranges as follows: rear section 90-100℃, middle section 120-140℃, front section 140-160℃, and machine head 140-160℃.

7. The high infrared reflectance black barrier encapsulating film as described in claim 1, characterized in that, The high-reflectivity white film layer is in the following proportions by weight: 75.4–88.7 parts of the second matrix resin; Initiator 0.4–1.0 parts; 0.5–1.0 parts of crosslinking agent; 0.2–1.0 parts of silane coupling agent; 0.1 to 0.6 parts of ultraviolet light stabilizer; 10-20 parts of white masterbatch; of which The white masterbatch includes titanium dioxide and fillers; The filler is one or more of the following: talc, wollastonite, kaolin, mica, barium sulfate, aluminum hydroxide, magnesium hydroxide, and hollow glass microspheres.

8. The method for preparing the high infrared reflectance black barrier encapsulating film according to any one of claims 1-7, characterized in that, include: Step S1: Prepare the black masterbatch and the white masterbatch respectively; Step S2: The black masterbatch and white masterbatch are uniformly mixed with other raw materials and then fed into an extruder to prepare the black barrier layer and the high-reflection white film layer. Step S3: The black barrier layer and the high-reflectivity white film layer are hot-pressed together by steel rollers and adhesive film surface, cooled and rolled up, and then irradiated to obtain the high infrared reflectivity black barrier encapsulation film.

9. A photovoltaic module, characterized in that, include: The high infrared reflectance black barrier encapsulating film as described in any one of claims 1-7.

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