A method for finding intersection points of sapphire dicing lanes

Abstract

The application provides a method for finding a sapphire cutting track intersection point, which comprises the following steps: S1, drawing a cutting track center, extracting a contour, and creating a template; S2, finding a cutting intersection, and calculating and screening a template center position; S3, extracting a region circle at the template center position, generating a region circle image, segmenting the region circle image, calculating all connected domains of an input region, and screening a maximum area region; S4, forming a minimum circumscribed circle of the maximum area region, generating two concentric circles according to the center coordinates of the minimum circumscribed circle, finding an intersection of the two concentric circles, obtaining a ring, and finding an intersection of the ring and the maximum area region to obtain four intersection regions; S5, using the four intersection regions to find a minimum circumscribed rectangle, and obtaining the centers of the four minimum circumscribed rectangles; judging the centers of the four minimum circumscribed rectangles, connecting two points on the same cutting line with a straight line to obtain the intersection points of the two straight lines, and the intersection points are the cutting track intersection points.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of sapphire cutting, in particular, the present application relates to a method for finding the intersection of sapphire cutting paths. BACKGROUND

[0002] Due to the different shapes of sapphire products, the imaging effect under the point light source is general, which causes difficulty in visual recognition and positioning. It is very difficult to identify and position sapphire under the conventional visual edge finding tool, which leads to low efficiency of laser cutting sapphire.

[0003] Therefore, a solution is needed to well identify and position the cutting path position of sapphire even if the sapphire products are not uniform, so as to improve the efficiency of laser cutting sapphire. SUMMARY

[0004] In order to overcome the shortcomings of the prior art, the present application provides a method for finding the intersection of sapphire cutting paths to solve the above technical problems.

[0005] The technical method adopted by the present application to solve its technical problems is: a method for finding the intersection of sapphire cutting paths, wherein the improvement lies in: S1, sketching the center of the cutting path, extracting the contour, and creating a template; S2, finding the cutting intersection by template matching coarse positioning, calculating and screening out the template center position closest to the image center; S3, extracting a region circle at the template center position, generating a region circle image, segmenting the region circle image by global binaryzation, calculating all connected domains of the input region, and screening out the largest area region according to the area feature; S4, forming the minimum circumscribed circle of the largest area region, generating two concentric circles according to the center coordinates of the minimum circumscribed circle, finding the intersection of the two concentric circles, and obtaining a ring; finding the intersection of the ring and the largest area region to obtain four intersection regions; S5, using the four intersection regions to find the minimum circumscribed rectangle and obtaining the centers of the four minimum circumscribed rectangles.

[0006] Determine the centers of the four minimum circumscribed rectangles, connect two points on the cutting line with a straight line to obtain the intersection of the two straight lines, and the intersection point is the intersection point of the cutting path.

[0007] In the above method, in step S2, the template center position is calculated by the following way:

[0008] Let the image width be Width and the image height be Height, then the image center row and column coordinates (Row, Column) = (Height / 2, Width / 2),

[0009] The image center pixel coordinates are (x1, y1), the profile center matched by the template is (x2, y2), AB is the distance between the two points, and the distance between the field center and the nearest center matched by the template is calculated by using a two-point distance formula

[0010]

[0011] In the above method, in step S3, the maximum area region is screened out by the following method:

[0012] All area arrays Areas are set to the maximum value Areamax=0, the bubble method is used to traverse and compare Areamax and each element of Areas, the final maximum value is obtained, and the final maximum value is assigned to Areamax.

[0013] In the above method, in step S4, the radius of the two concentric circles can be selected.

[0014] In the above method, in step S5, the two points on the same cutting line are determined by the centers of the four minimum circumscribed rectangles in the following way:

[0015] The two-point distance formula is used to compare the distance between any one point and the other three points among the centers of the four minimum circumscribed rectangles, and the two points with the largest distance are the centers of the two minimum circumscribed rectangles on the same cutting line.

[0016] The beneficial effects of the present application are: by finding the intersection point of the cutting path, the position of the cutting path of the sapphire is identified, and the efficiency of laser cutting sapphire is improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] The Figure 1 It is an example diagram of sapphire product under a one-time telecentric lens.

[0018] The Figure 2 It is an example diagram of sapphire under a 50x microscope.

[0019] The Figure 3 It is a flowchart of a method for finding the intersection point of the sapphire cutting path.

[0020] The Figure 4 It is a schematic diagram of the principle of creating a template in the present application.

[0021] The Figure 5 It is a schematic diagram of the principle of screening the center position of the template in the present application.

[0022] The Figure 6 It is a schematic diagram of the principle of screening the maximum area region in the present application.

[0023] Appendix Figure 7 This is a schematic diagram illustrating the principle of the smallest circumscribed circle forming the largest area region in this invention.

[0024] Appendix Figure 8 and attached Figure 9 This is a schematic diagram illustrating the principle of obtaining four intersecting regions in this invention.

[0025] Appendix Figure 10 This is a schematic diagram illustrating the principle of obtaining the centers of the four smallest bounding rectangles in this invention.

[0026] Appendix Figure 11 and attached Figure 12 This is a schematic diagram illustrating the principle of obtaining the intersection point of the cutting paths in this invention. Detailed Implementation

[0027] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0028] The following will clearly and completely describe the concept, specific structure, and technical effects of the present invention in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are all within the scope of protection of the present invention. Furthermore, all connections / linkages involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. The various technical features in this invention can be combined interactively without contradicting each other.

[0029] When sapphire wafers are cut, the vision device needs to provide the motion control system with the start and end points of each cutting trajectory and take a picture every certain number of rows to correct the cutting trajectory of the motion control laser. Figure 1 Example image of a sapphire product under a 1x telecentric microscope. Figure 2 This is an example image of sapphire under a 50x microscope.

[0030] Reference Figure 3 As shown, a method for finding the intersection of sapphire cut channels includes the following steps S1-S5:

[0031] S1. Draw the center of the cutting path, extract the outline, create a template, and refer to... Figure 4 As shown.

[0032] S2, Reference Figure 5 As shown, the cutting intersection is found through coarse localization using template matching, and the template center position closest to the image center is calculated and selected.

[0033] Specifically, the template center position is calculated by the following way:

[0034] Supposing the image width is Width and the image height is Height, the image center coordinates (Row, Column) = (Height / 2, Width / 2),

[0035] The image center pixel coordinates are (x1, y1), the template matching contour center is (x2, y2), and AB is the distance between the two points. The distance between the field center and the nearest template matching center is calculated by the two-point distance formula

[0036]

[0037] S3, refer to Figure 6 As shown in the figure, a region circle is extracted at the template center position to generate a region circle image. The region circle image is segmented by a global binary method, all connected domains of the input region are calculated, and the largest area region A is selected according to the area characteristics.

[0038] Specifically, the largest area region A is selected by the following way:

[0039] All area arrays Areas, set the maximum value as Areamax = 0, use the bubble method to traverse and compare Areamax and each element of Areas, get the final maximum value and assign the final maximum value to Areamax.

[0040] S4, refer to Figure 7 As shown, the minimum circumscribed circle of the largest area region A is formed, combined with Figure 8 As shown, two concentric circles are generated according to the center coordinates of the minimum circumscribed circle, the intersection of the two concentric circles is obtained, and a ring B is obtained. Combined with Figure 9 As shown, the intersection of the ring B and the largest area region A is obtained, and four intersection regions M Figure 9 The blue region) are obtained. Further, the radius of the two concentric circles can be selected.

[0041] S5, refer to Figure 10 As shown, the minimum circumscribed rectangle is obtained by using the four intersection regions M, and the centers O, P, Q, and U of the four minimum circumscribed rectangles are obtained.

[0042] Combined with Figure 11 And Figure 12As shown, the centers of the four minimum circumscribed rectangles are determined, two points on the same tangent line are connected by a straight line, the intersection of the two straight lines is the tangent intersection point. Further, the two points on the same tangent line are determined by the following method: using the two-point distance formula, comparing the distances between any point and the other three points in the centers of the four minimum circumscribed rectangles, and the two points with the largest distance are the centers of the two minimum circumscribed rectangles on the same tangent line. Similarly, the other two centers of the minimum circumscribed rectangles on the same tangent line can be determined in the same way.

[0043] The present application realizes the identification and positioning of the cutting path position of the sapphire by finding the tangent intersection point, and improves the efficiency of laser cutting of sapphire.

[0044] The above is a specific description of the preferred embodiment of the present application, but the present application is not limited to the above-mentioned embodiments. Those skilled in the art can make various equivalent modifications or replacements without departing from the spirit of the present application, and these equivalent modifications or replacements are all included in the scope defined by the claims of the present application.

Claims

1. A method for finding the intersection of sapphire cutting tracks, characterized in that: S1, sketch the cutting track center, extract the contour, and create a template; S2, find the cutting intersection by template matching coarse positioning, calculate and screen the template center position closest to the image center; S3, extract a region circle at the template center position, generate a region circle image, use global binary method to segment the region circle image, calculate all connected domains of the input region, and screen the maximum area region according to the area feature; S4, form the minimum circumscribed circle of the maximum area region, generate two concentric circles according to the center coordinates of the minimum circumscribed circle, find the intersection of the two concentric circles, and obtain a ring; find the intersection of the ring and the maximum area region to obtain four intersection regions; S5, use the four intersection regions to find the minimum circumscribed rectangle and obtain the centers of the four minimum circumscribed rectangles; judge the centers of the four minimum circumscribed rectangles, connect the two points on the same cutting line with a straight line to obtain the intersection of the two straight lines, and the intersection point is the intersection point of the cutting track. In the step S2, the template center position is calculated by the following method: assuming that the image width is Width and the image height is Height, the image center row and column coordinates (Row, Column) = (Height / 2, Width / 2), the image center pixel coordinates are (x1, y1), the template matching contour center is (x2, y2), AB is the distance between the two points, and the distance between the field center and the nearest template matching center is calculated using the two-point distance formula. In the step S3, the maximum area region is screened by the following method: all area arrays Areas, assuming that the maximum value is Areamax = 0, the bubble method is used to traverse and compare Areamax and each element of Areas to obtain the final maximum value and assign the final maximum value to Areamax. In the step S4, the radius of the two concentric circles can be selected. In the step S5, the centers of the four minimum circumscribed rectangles are judged to be on the same cutting line by the following method: using the two-point distance formula, comparing the distance between any one point and the other three points among the centers of the four minimum circumscribed rectangles, and the two points with the largest distance are the centers of the two minimum circumscribed rectangles on the same cutting line. ​ ​ ​ 2. A method of finding the intersection of sapphire cut paths as claimed in claim 1, characterized in that: ​ ​ ​ 3. A method of finding the intersection of sapphire cut paths as claimed in claim 1, wherein: ​ ​ 4. A method of finding the intersection of sapphire cut paths as claimed in claim 1, characterized by: ​ 5. A method of finding the intersection of sapphire cut paths as recited in claim 1, wherein: ​ ​

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