A high repetition rate femtosecond fiber laser protection device

By combining the thermally softened support mechanism and the heat dissipation mechanism, the heat dissipation and buffer protection problems of high repetition frequency femtosecond fiber lasers are solved, improving the operational accuracy and lifespan of the equipment.

CN116505353BActive Publication Date: 2026-05-19GWEIKE TECH CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
GWEIKE TECH CO LTD
Filing Date
2023-03-30
Publication Date
2026-05-19

AI Technical Summary

Technical Problem

Existing high-repetition-rate femtosecond fiber lasers have shortcomings in heat dissipation and buffer protection, which leads to accelerated component aging and severe impact from external vibrations.

Method used

A thermo-softening support mechanism is used to buffer and support the fiber laser, and it is equipped with a protective cover and a heat dissipation mechanism. The heat dissipation mechanism is triggered by a temperature sensor to cool down the laser, and the support height is adjusted by the thermo-softening support mechanism to improve the heat dissipation effect.

Benefits of technology

It achieves buffer protection for femtosecond fiber lasers, preventing accidental impact and vibration, while effectively dissipating heat, extending the service life and operational accuracy of the equipment.

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Abstract

The application discloses a kind of high repetition rate femtosecond fiber laser protection device, including base and femtosecond fiber laser body, the top of the base is equipped with mounting groove, the inside of the mounting groove is equipped with heat-softened support mechanism.The beneficial effects of the present application are: the present application can play the effect of buffering shock by heat-softened support mechanism to soft support femtosecond fiber laser body, and the femtosecond fiber laser body can be protected from accidental impact and dust protection by protective cover, and the top of the protective cover is equipped with heat dissipation mechanism, when the temperature of femtosecond fiber laser body is higher, heat dissipation mechanism can be triggered to start, and then femtosecond fiber laser body is cooled and blown, and heat-softened support mechanism can absorb heat from femtosecond fiber laser body, and the support height of heat-softened support mechanism can be changed by heat absorption, so that it is closer to the heat dissipation mechanism, and the heat dissipation effect of heat dissipation mechanism is improved.
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Description

Technical Field

[0001] This invention relates to the field of protective device technology, specifically a protective device for a high repetition rate femtosecond fiber laser. Background Technology

[0002] High repetition rate femtosecond fiber lasers are a type of fiber laser that uses rare-earth-doped glass fiber as the gain medium to achieve the effect of high repetition rate femtosecond laser emission. Fiber lasers have a wide range of applications, including laser fiber communication, laser-based long-distance space communication, industrial shipbuilding, automobile manufacturing, laser engraving, laser marking, laser cutting, printing roller manufacturing, metal and non-metal drilling / cutting / welding, military and defense security, medical devices and equipment, large-scale infrastructure construction, and serving as a pump source for other lasers, among others.

[0003] A search revealed a Chinese patent (authorization announcement number CN208423446U) disclosing a protective device for a high-power fiber laser. This device includes a horizontally mounted plate with an inverted U-shaped protective cover above it. Vertically mounted baffles are fixed to both sides of the bottom of the protective cover, engaging with the mounting plate. Horizontally positioned fixing grooves are formed on both sides of the top of the mounting plate, and the bottom of the protective cover engages within these grooves. This patented technology facilitates the installation and removal of the protective device, eliminating the need to tighten and loosen multiple screws. However, due to the sealed nature of the protective cover, the high-repetition-rate femtosecond fiber laser lacks heat dissipation protection during internal operation. This leads to accelerated aging of internal components as the temperature rises with use, and the device fails to provide buffering protection against external vibrations. Therefore, those skilled in the art have developed a protective device for high-repetition-rate femtosecond fiber lasers to address the problems described in the background. Summary of the Invention

[0004] The purpose of this invention is to provide a protection device for high repetition rate femtosecond fiber lasers to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a protective device for a high repetition rate femtosecond fiber laser, comprising a base and a femtosecond fiber laser body. The top of the base has a mounting groove, and a thermo-softening support mechanism is provided inside the mounting groove. The femtosecond fiber laser body is placed on top of the thermo-softening support mechanism, which provides buffer support for the femtosecond fiber laser body. A protective cover is provided on the top of the base, and locking mechanisms are symmetrically provided at both ends of the top of the base. The base is movably connected to the protective cover via the locking mechanisms. A heat dissipation mechanism is also provided on the top of the protective cover for dissipating heat from the femtosecond fiber laser body.

[0006] The thermo-softening support mechanism includes a heat-conducting support plate. The interior of the mounting groove is equipped with a liftable heat-conducting support plate. The femtosecond fiber laser body is fixedly installed on the top of the thermo-softening support mechanism. An airbag is fixedly installed at the center of the bottom of the inner wall of the mounting groove. The top of the airbag is in contact with the bottom of the heat-conducting support plate.

[0007] Preferably, an air guide groove is provided inside the base and at the bottom of the mounting groove. The air guide groove has an inverted T-shaped structure, and the top of the air guide groove is connected to the inside of the airbag. The base also has symmetrical first sliding grooves inside. The two ends of the air guide groove are respectively connected to two first sliding grooves. Piston plates are slidably connected inside the two first sliding grooves. The top of the two piston plates is fixedly connected to the support feet. The top of the two support feet is fixedly connected to the bottom ends of the heat-conducting support plate. The bottom of the piston plate is also fixedly connected to a first spring.

[0008] Preferably, the airbag is filled with helium or hydrogen.

[0009] Preferably, the engaging mechanism includes insertion holes. Insertion holes are symmetrically provided at both ends of the top of the base. Pin blocks are symmetrically fixedly connected to both ends of the bottom of the protective cover, positioned directly above the insertion holes. Insert blocks are slidably connected to the inner wall of the insertion holes on the side away from the mounting groove. A second sliding groove is provided inside the base on the side of the insertion holes away from the mounting groove. A sliding block is slidably connected inside the second sliding groove. One end of the insert block extends into the second sliding groove and is fixedly connected to one side of the sliding block. A second spring is fixedly connected to the side of the sliding block away from the insert block. A connecting rod is also fixedly connected to the middle of the side of the sliding block away from the insert block. The end of the connecting rod away from the sliding block extends to the outer side of the base and is fixedly connected to a pull ring.

[0010] Preferably, the pin has a locking groove in the middle for inserting and limiting the insertion of the insert block, and both the bottom end of the pin and the top end of the insert block have bevels.

[0011] Preferably, a third spring is fixedly installed at the bottom of the inner wall of the socket, and a top block is fixedly connected to the top of the third spring.

[0012] Preferably, the heat dissipation mechanism includes a mounting box, the top of the protective cover is fixedly connected to the mounting box, a fan is fixedly installed on the top of the protective cover and inside the mounting box, a top box is fixedly connected to the top of the inner wall of the protective cover, the top box is a hollow structure, and semiconductor cooling chips are symmetrically fixedly installed at both ends of the inner wall of the top box, a guide block is rotatably connected to the center of the inside of the top box, a first vent is provided on the top of the protective cover and the top of the top box, a second vent is provided on the bottom of the top box, the mounting box is connected to the inside of the base after passing through the top box, return grooves are symmetrically provided on both sides of the top box, a third vent is symmetrically provided on the top of the top box and above the return groove, and a fourth vent is symmetrically provided on the top of the protective cover and above the third vent.

[0013] Preferably, the flow guide block has a rhomboid structure, and a motor is fixedly installed on one side of the outer wall of the top box. The output shaft of the motor passes through the interior of the top box and is coaxially connected with the flow guide block.

[0014] Preferably, a dust cover is symmetrically fixedly installed on the top of the protective cover and on top of the fourth vent, and a filter screen is installed on the top of the mounting box.

[0015] Preferably, temperature sensors are installed on both sides of the inner wall of the protective cover, at both ends of the bottom of the heat-conducting support plate, and on the top of the femtosecond fiber laser body. A control panel is fixedly installed on one side of the base, and the control panel is electrically connected to the fan, the thermoelectric cooler, the motor, and the temperature sensors respectively.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: The present invention provides soft support for the femtosecond fiber laser body through a thermo-flexible support mechanism, which can achieve a buffering and shock absorption effect. The protective cover can protect the femtosecond fiber laser body from accidental contact and dust. Furthermore, the top of the protective cover is equipped with a heat dissipation mechanism. When the temperature of the femtosecond fiber laser body is high, the heat dissipation mechanism can be triggered to start, thereby cooling the femtosecond fiber laser body by blowing air. In addition, the thermo-flexible support mechanism can absorb heat from the femtosecond fiber laser body and change the support height of the thermo-flexible support mechanism by absorbing heat, so that it is closer to the heat dissipation mechanism, thereby improving the heat dissipation effect of the heat dissipation mechanism. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the present invention;

[0018] Figure 2 This is a schematic diagram of the internal structure of the present invention;

[0019] Figure 3 This is a schematic diagram of the internal structure of the present invention during heat dissipation;

[0020] Figure 4 For the present invention Figure 2 Enlarged view of point A in the image;

[0021] Figure 5 For the present invention Figure 2 Enlarged view of point B in the image;

[0022] Figure 6 This is a schematic diagram of the heat dissipation mechanism of the present invention.

[0023] In the diagram: 1. Base; 2. Mounting slot; 3. Femtosecond fiber laser body; 4. Thermally flexible support mechanism; 41. Heat-conducting support plate; 42. Airbag; 43. Air guide groove; 44. First slide groove; 45. Piston plate; 46. Support leg; 47. First spring; 5. Protective cover; 6. Engaging mechanism; 61. Insertion hole; 62. Pin block; 63. Insertion block; 64. Second slide groove; 65. Sliding block; 66. Second spring; 67. Connecting rod 68. Pull ring; 69. Third spring; 610. Top block; 7. Heat dissipation mechanism; 71. Mounting box; 72. Fan; 73. Top box; 74. Semiconductor cooling chip; 75. Guide block; 76. Motor; 77. First vent; 78. Second vent; 79. Return channel; 710. Third vent; 711. Fourth vent; 712. Dust cover; 713. Filter screen; 8. Temperature sensor; 9. Control panel. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0026] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0027] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0028] In the description of this application, it should be noted that the terms "upper", "lower", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product of this application is usually placed in. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0029] In the description of this application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0030] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the various embodiments and features described below are interchangeable.

[0031] Please refer to Figure 1-6 This invention provides a protective device for a high repetition rate femtosecond fiber laser, including a base 1 and a femtosecond fiber laser body 3. The top of the base 1 is provided with a mounting groove 2, and the inside of the mounting groove 2 is provided with a thermo-softening support mechanism 4. The femtosecond fiber laser body 3 is placed on top of the thermo-softening support mechanism 4, which is used to provide buffer support for the femtosecond fiber laser body 3. The top of the base 1 is provided with a protective cover 5, and the top two ends of the top of the base 1 are symmetrically provided with locking mechanisms 6. The base 1 is movably connected to the protective cover 5 through the locking mechanisms 6. The top of the protective cover 5 is also provided with a heat dissipation mechanism 7, which is used to dissipate heat from the femtosecond fiber laser body 3.

[0032] The thermo-softening support mechanism 4 includes a heat-conducting support plate 41. The interior of the mounting groove 2 is equipped with a liftable heat-conducting support plate 41. The femtosecond fiber laser body 3 is fixedly installed on the top of the thermo-softening support mechanism 4. An airbag 42 is fixedly installed at the center of the bottom of the inner wall of the mounting groove 2. The top of the airbag 42 is in contact with the bottom of the heat-conducting support plate 41.

[0033] Specifically, the femtosecond fiber laser body 3 is mounted on the thermo-flexible support mechanism 4, which provides soft support and cushions the laser. The protective cover 5 protects the femtosecond fiber laser body 3 from accidental contact and dust. The top of the protective cover 5 is equipped with a heat dissipation mechanism 7. When the temperature of the femtosecond fiber laser body 3 is high, the heat dissipation mechanism 7 is activated to cool the femtosecond fiber laser body 3. The thermo-flexible support mechanism 4 can absorb heat from the femtosecond fiber laser body 3 and change its support height by absorbing heat, thus bringing it closer to the heat dissipation mechanism 7 and improving the heat dissipation effect of the heat dissipation mechanism 7.

[0034] Furthermore, an air guide groove 43 is provided inside the base 1 and at the bottom of the mounting groove 2. The air guide groove 43 has an inverted T-shaped structure, and the top of the air guide groove 43 is connected to the inside of the airbag 42. The base 1 also has symmetrically provided first sliding grooves 44. The two ends of the air guide groove 43 are respectively connected to the two first sliding grooves 44. The piston plates 45 are slidably connected inside the two first sliding grooves 44. The tops of the two piston plates 45 are fixedly connected to the legs 46. The tops of the two legs 46 are respectively fixedly connected to the bottom ends of the heat-conducting support plate 41. The bottom of the piston plates 45 is also fixedly connected to the first spring 47. The airbag 42 is filled with helium or hydrogen.

[0035] The femtosecond fiber laser body 3 is mounted on a heat-conducting support plate 41, which is connected to a support leg 46 and supported by a first spring 47. This provides soft support for the femtosecond fiber laser body 3, buffering and absorbing shocks to prevent external vibrations from affecting it and improving its operational accuracy. Simultaneously, an airbag 42 is attached to the bottom of the heat-conducting support plate 41. Heat generated by the femtosecond fiber laser body 3 is conducted to the airbag 42 through the heat-conducting support plate 41, causing the gas inside the airbag 42 to be... Thermal expansion causes the airbag 42 to expand. Since the heat-conducting support plate 41 presses against the top of the airbag 42, the gas inside the airbag 42 expands and flows from the air guide groove 43 into the first sliding groove 44, pushing the piston plate 45 upward. This further raises the position of the heat-conducting support plate 41. After the position of the heat-conducting support plate 41 is raised, the contact area between the airbag 42 and the heat-conducting support plate 41 becomes smaller, which leads to an increase in the contact area between the bottom of the heat-conducting support plate 41 and the air. This also brings the femtosecond fiber laser body 3 closer to the heat dissipation mechanism 7, thereby further improving the heat dissipation efficiency of the femtosecond fiber laser body 3.

[0036] Furthermore, the engaging mechanism 6 includes insertion holes 61. Insertion holes 61 are symmetrically provided at both ends of the top of the base 1. Pins 62 are symmetrically fixedly connected to both ends of the bottom of the protective cover 5, directly above the insertion holes 61. Insertion blocks 63 are slidably connected to the inner wall of the insertion holes 61 on the side away from the mounting groove 2. A second sliding groove 64 is provided inside the base 1 on the side of the insertion holes 61 away from the mounting groove 2. A sliding block 65 is slidably connected inside the second sliding groove 64. One end of the insertion block 63 extends into the second sliding groove 64 and is fixedly connected to one side of the sliding block 65. A second spring 66 is fixedly connected to the side of the sliding block 65 away from the insertion block 63. A connecting rod 67 is also fixedly connected to the middle of the side of the sliding block 65 away from the insertion block 63. The end of the connecting rod 67 away from the sliding block 65 extends to the outside of the base 1 and is fixedly connected to a pull ring 68. The pin block 62 has a locking groove in the middle for the insertion and limiting of the insertion block 63. The bottom end of the pin block 62 and the top end of the insertion block 63 are both provided with bevels. A third spring 69 is also fixedly installed on the bottom of the inner wall of the insertion hole 61, and a top block 610 is fixedly connected to the top of the third spring 69.

[0037] When the protective cover 5 is closed, the pin 62 is inserted into the insertion hole 61. At this time, the insertion block 63 pushes the sliding block 65 through the second spring 66 and then inserts it into the engagement groove on one side of the pin 62, limiting the pin 62 and connecting the protective cover 5 to the base 1. When the protective cover 5 is opened, the two pull rings 68 are pulled outward, and the sliding block 65 is pulled through the connecting rod 67, causing the insertion block 63 to slide and separate from the pin 62. At this time, the pin 62 loses its limit and is pushed out by the top block 610 through the third spring 69, so that the protective cover 5 can be opened quickly.

[0038] Furthermore, the heat dissipation mechanism 7 includes a mounting box 71. The mounting box 71 is fixedly connected to the top of the protective cover 5. A fan 72 is fixedly installed on the top of the protective cover 5 and inside the mounting box 71. A top box 73 is fixedly connected to the top of the inner wall of the protective cover 5. The top box 73 is a hollow structure, and semiconductor cooling chips 74 are symmetrically fixedly installed at both ends of the inner wall of the top box 73. A guide block 75 is rotatably connected to the center of the interior of the top box 73. A first vent 77 is provided on the top of the protective cover 5 and the top of the top box 73. A second vent 78 is provided on the bottom of the top box 73. The mounting box 71 passes through the top box 73 and then connects to the base 1. The internal parts are interconnected. The top box 73 is symmetrically provided with return grooves 79 on both sides. The top of the top box 73 and the top of the return grooves 79 are symmetrically provided with third vent holes 710. The top of the protective cover 5 and the top of the third vent hole 710 are symmetrically provided with fourth vent holes 711. The guide block 75 has a rhomboid structure. A motor 76 is fixedly installed on one side of the outer wall of the top box 73. The output shaft of the motor 76 passes through the interior of the top box 73 and is coaxially connected with the guide block 75. A dust cover 712 is symmetrically fixedly installed on the top of the protective cover 5 and the top of the fourth vent hole 711. A filter screen 713 is installed on the top of the mounting box 71.

[0039] When the temperature of the femtosecond fiber laser body 3 is high, the fan 72 can be turned on. At the same time as the fan 72 is turned on, the semiconductor cooler 74 and the motor 76 are also turned on simultaneously. The motor 76 drives the flow guide block 75 to rotate 90 degrees, so that its two sides form a flow guide channel between the semiconductor cooler 74 and the two sides of the flow guide block 75. The side of the semiconductor cooler 74 closest to the flow guide block 75 is the cooling surface. When the fan 72 blows the air downward, the airflow slides down from both sides of the flow guide block 75 and makes full contact with the cooling surface of the semiconductor cooler 74. Then the cold air flows out from below the second vent 78, cooling the internal space of the femtosecond fiber laser body 3 and the protective cover 5. When the air absorbs heat on the outside of the femtosecond fiber laser body 3, the hot air rises and flows upward along the inner wall of the protective cover 5, enters the return groove 79, and flows out of the outside of the protective cover 5 through the third vent 710 and the fourth vent 711 in sequence, forming a heat dissipation cycle.

[0040] Furthermore, temperature sensors 8 are installed on both sides of the inner wall of the protective cover 5, at both ends of the bottom of the heat-conducting support plate 41, and on the top of the femtosecond fiber laser body 3. A control panel 9 is fixedly installed on one side of the base 1. The control panel 9 is electrically connected to the fan 72, the semiconductor cooling chip 74, the motor 76, and the temperature sensors 8, respectively.

[0041] The temperature of the femtosecond fiber laser body 3, the bottom of the heat-conducting support plate 41, and the air inside the protective cover 5 can be determined by the temperature sensor 8. When at least one of the temperature sensors 8 detects a high temperature, the temperature sensor 8 triggers the fan 72, the semiconductor cooling chip 74, and the motor 76 to start through the control panel 9, thereby automatically dissipating heat from the femtosecond fiber laser body 3.

[0042] Specifically, when using this invention, the femtosecond fiber laser body 3 is mounted on the thermo-flexible support mechanism 4, and is softly supported by the thermo-flexible support mechanism 4, which can buffer and absorb shock. The protective cover 5 can protect the femtosecond fiber laser body 3 from accidental contact and dust. The top of the protective cover 5 is equipped with a heat dissipation mechanism 7. When the temperature of the femtosecond fiber laser body 3 is high, the heat dissipation mechanism 7 can be triggered to start, thereby cooling the femtosecond fiber laser body 3 by blowing air. The thermo-flexible support mechanism 4 can absorb heat from the femtosecond fiber laser body 3 and change the support height of the thermo-flexible support mechanism 4 by absorbing heat, so that it is closer to the heat dissipation mechanism 7, thereby improving the heat dissipation effect of the heat dissipation mechanism 7.

[0043] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A protective device for a high repetition rate femtosecond fiber laser, characterized in that, The system includes a base (1) and a femtosecond fiber laser body (3). The base (1) has a mounting groove (2) on its top. A thermo-softening support mechanism (4) is located inside the mounting groove (2). The femtosecond fiber laser body (3) is placed on top of the thermo-softening support mechanism (4), which provides buffer support for the femtosecond fiber laser body (3). A protective cover (5) is located on the top of the base (1). A locking mechanism (6) is symmetrically located at both ends of the top of the base (1). The base (1) is movably connected to the protective cover (5) via the locking mechanism (6). A heat dissipation mechanism (7) is also located on the top of the protective cover (5). The mechanism (7) is used to dissipate heat from the femtosecond fiber laser body (3); the thermo-softening support mechanism (4) includes a heat-conducting support plate (41), and the mounting groove (2) is provided with a liftable heat-conducting support plate (41). The femtosecond fiber laser body (3) is fixedly installed on the top of the thermo-softening support mechanism (4). An airbag (42) is fixedly installed at the center of the bottom of the inner wall of the mounting groove (2), and the top of the airbag (42) is in contact with the bottom of the heat-conducting support plate (41); the heat dissipation mechanism (7) includes a mounting box (71), and the top of the protective cover (5) is fixedly connected to the mounting box (71). The top of the protective cover (5) is located inside the mounting box (71). A fan (72) is fixedly installed on the top of the inner wall of the protective cover (5). A top box (73) is fixedly connected to the top of the inner wall of the top box (73). The top box (73) is hollow and semiconductor cooling chips (74) are symmetrically fixedly installed at both ends of the inner wall of the top box (73). A guide block (75) is rotatably connected to the middle of the inside of the top box (73). A first vent hole (77) is opened on the top of the protective cover (5) and the top of the top box (73). A second vent hole (78) is opened on the bottom of the top box (73). The mounting box (71) is connected to the inside of the base (1) after passing through the top box (73). A return groove (79) is symmetrically opened on both sides of the top box (73). A third vent (710) is symmetrically provided on the top of the top box (73) and on the top of the return channel (79). A fourth vent (711) is symmetrically provided on the top of the protective cover (5) and on the top of the third vent (710). The guide block (75) has a rhomboid structure. A motor (76) is fixedly installed on one side of the outer wall of the top box (73). The output shaft of the motor (76) passes through the interior of the top box (73) and is coaxially connected with the guide block (75). A dust cover (712) is symmetrically fixedly installed on the top of the protective cover (5) and on the top of the fourth vent (711). A filter screen (713) is installed on the top of the mounting box (71).

2. The protective device for a high repetition rate femtosecond fiber laser according to claim 1, characterized in that: An air guide groove (43) is provided inside the base (1) and at the bottom of the mounting groove (2). The air guide groove (43) is an inverted T-shaped structure, and the top of the air guide groove (43) is connected to the inside of the airbag (42). The base (1) is also symmetrically provided with first sliding grooves (44). The two ends of the air guide groove (43) are respectively connected to the two first sliding grooves (44). Piston plates (45) are slidably connected inside the two first sliding grooves (44). Support legs (46) are fixedly connected to the top of the two piston plates (45). The top of the two support legs (46) are respectively fixedly connected to the bottom ends of the heat-conducting support plate (41). A first spring (47) is also fixedly connected to the bottom of the piston plate (45).

3. The protective device for a high repetition rate femtosecond fiber laser according to claim 2, characterized in that: The airbag (42) is filled with helium or hydrogen.

4. The protective device for a high repetition rate femtosecond fiber laser according to claim 1, characterized in that: The engaging mechanism (6) includes a socket (61). The top two ends of the base (1) are symmetrically provided with sockets (61). The bottom two ends of the protective cover (5) are symmetrically fixedly connected with pins (62) directly above the sockets (61). A plug (63) is slidably connected to the inner wall of the socket (61) on the side away from the mounting groove (2). A second sliding groove (64) is provided inside the base (1) on the side of the socket (61) away from the mounting groove (2). 4) has an internal sliding connection of a sliding block (65). One end of the insert (63) extends into the second slide groove (64) and is fixedly connected to one side of the sliding block (65). A second spring (66) is fixedly connected to the side of the sliding block (65) away from the insert (63). A connecting rod (67) is also fixedly connected to the middle of the side of the sliding block (65) away from the insert (63). One end of the connecting rod (67) away from the sliding block (65) extends to the outside of the base (1) and is fixedly connected to a pull ring (68).

5. A protective device for a high repetition rate femtosecond fiber laser according to claim 4, characterized in that: The pin (62) has a locking groove in the middle for inserting and limiting the insertion of the plug (63), and both the bottom end of the pin (62) and the top end of the plug (63) have beveled edges.

6. A protective device for a high repetition rate femtosecond fiber laser according to claim 5, characterized in that: A third spring (69) is also fixedly installed at the bottom of the inner wall of the socket (61), and a top block (610) is fixedly connected to the top of the third spring (69).

7. A protective device for a high repetition rate femtosecond fiber laser according to claim 6, characterized in that: Temperature sensors (8) are installed on both sides of the inner wall of the protective cover (5), at both ends of the bottom of the heat-conducting support plate (41), and on the top of the femtosecond fiber laser body (3). A control panel (9) is fixedly installed on one side of the base (1). The control panel (9) is electrically connected to the fan (72), the semiconductor cooling chip (74), the motor (76), and the temperature sensor (8).