Test device for testing a mobile AP

Abstract

A test device for testing a mobile AP having an AP package and a memory package according to the present application includes a lower test socket mounted on a tester and coupled with the AP package placed on an upper side, an upper test socket mounted on the memory package and coupled with the AP package placed on a lower side, an upper device accommodating the memory package and installed with the upper test socket, and a heat dissipation device disposed in the upper device.

Description

TECHNICAL FIELD

[0001] The present application relates to a test of a mobile AP (Application Processor), and more particularly, to a test device for detecting whether a mobile AP, in which an AP package and a memory package are stacked, is normally operated. BACKGROUND

[0002] Recently, a smart phone, which is used by the most people, is built with a mobile AP (Mobile Application Processor) having the same role as a central processor (CPU) of a general computer. The mobile AP, which is a memory chip for a mobile device, is a core semiconductor responsible for various application operations and graphic processing.

[0003] The mobile AP has an AP package (package) and a memory package (package), in which the AP package is a SoC (System on Chip) including a function of a central processor (CPU) of a computer and a function of a chipset for controlling connection of other equipment such as a graphic card.

[0004] As a smart phone becomes lighter, thinner, shorter, and smaller, an area of a main board for mounting the mobile AP is insufficient, and thus, as a package platform of the mobile AP, a PoP (Package on Package) structure in which the memory package is vertically stacked on the AP package is mostly used.

[0005] In a state in which the AP package and the memory package are stacked, a reliability test such as electrical die sorting (EDS) and a function test of the mobile AP is generally performed using a test device illustrated in FIG. 1. Figure 1

[0006] As illustrated in FIG. 1, an existing test device 1 for testing the mobile AP performs a test in a state in which a memory package 20 is mounted on an AP package 10, and includes a test socket 40 for transferring an electrical signal, an upper device 50, and a heat dissipation device 70. Figure 1

[0007] ​​The test socket 40 is provided in the tester 30 as a rubber type socket having a structure in which the conductive portions 41 are arranged to be insulated from each other inside an insulating portion 42 formed of a material having elasticity such as silicone, and the conductive portions 41 are in a form in which a plurality of conductive particles are contained inside a material having elasticity such as silicone, so as to be electrically connected to the lower terminals 11 of the AP package 10 with the terminals 21 of the memory package 20 coupled to the upper terminals 12 of the AP package 10.

[0008] The upper device 50 is provided with a housing portion 53 that houses the main body portion 51 and the memory package 20, a pressing portion 54 that presses the memory package 20, and a contact portion 52 that contacts the AP package, so as to be formed in a manner in which the memory package 20 is housed in the housing portion 53 and the contact portion 52 contacts the upper side of the AP package 10. In the upper device 50 such as a propeller or a handler, a heat dissipation device 70 such as a heat sink 71 and a cooling fan 72 is provided.

[0009] In such a test device, the upper side of the memory package 20 is pressed by the pressing portion 54 of the upper device 50 being lowered, and the conductive portions 41 of the test socket 40 are coupled to the lower terminals 11 of the AP package 10, whereby the tester 30 and the test socket 40, the AP package 10, and the memory package 20 are electrically connected to perform electrical testing. That is, the existing test device tests only the mobile AP with one test socket 40.

[0010] During testing, a large amount of heat from about 15 mm in size to more than 3 Watt is generated in the AP package 10, and if an appropriate heat dissipation means is not provided, the AP package 10 deteriorates and cannot normally perform testing. Therefore, in the existing test device 1, in order to transfer the heat generated from the AP package 10 to the heat dissipation device 70 through the upper device 50 that contacts the AP package 10, a structure in which testing is performed is adopted in a state in which the memory package 20 is attached to the upper side of the AP package 10.

[0011] However, in a state in which the memory package 20 is attached to the upper side of the AP package 10, if testing is performed and it is determined that the product is not qualified, since it cannot be determined whether both the memory package 20 and the AP package 10 are not qualified or which one of the memory package 20 and the AP package 10 has a defect, there is a problem in that the memory package 20 and the AP package 10 need to be all discarded.

[0012] Prior Art Documents

[0013] Patent Documents

[0014] (Patent Document 1) Publication of Unexamined Patent Application No. 2015-0003955 (January 12, 2015) SUMMARY

[0015] PROBLEMS TO BE SOLVED BY THE INVENTION

[0016] The present invention has been made in view of the above, and aims to provide a test device for testing a mobile AP, which can precisely test whether a mobile AP normally operates even in a state where a memory package and an AP package of the mobile AP are not laminated.

[0017] Further, the present invention aims to provide a test device for testing a mobile AP, which can effectively remove heat generated from an AP package.

[0018] MEANS FOR SOLVING PROBLEMS

[0019] To solve the above-described problems, a test device for testing a mobile AP according to the present invention, the mobile AP having an AP package and a memory package, includes a lower test seat mounted on a tester and coupled with the AP package placed on an upper side, an upper test seat mounted with the memory package and coupled with the AP package placed on a lower side, an upper device accommodating the memory package and installed with the upper test seat, and a heat dissipation device disposed in the upper device, the upper test seat including a non-elastic conductive housing having a plurality of housing holes formed through a thickness direction, an insulating coating layer coated on edges of the plurality of housing holes, and a conductive portion configured in the housing holes in a form in which a plurality of conductive particles are contained in an elastic insulating substance, and insulated from the non-elastic conductive housing by the insulating coating layer.

[0020] The non-elastic conductive housing can be formed of a material having a thermal conductivity of 10 W / mK or more.

[0021] The non-elastic conductive housing can be formed of a metal material.

[0022] The memory package can be a gold device as a qualified product package.

[0023] The insulating coating layer can be coated on the entire non-elastic conductive housing.

[0024] The insulating coating layer can be formed by a coating method selected from polytetrafluoroethylene coating, DLC coating, parylene coating, anodizing treatment, and liquid silicon coating.

[0025] The heat dissipation device can include a heat sink or a cooling fan.

[0026] The upper device can be a pusher or a handler.

[0027] The conductive part can include a conductive part main body disposed in the housing hole, and at least one of a conductive part lower protrusion protruding from a lower surface of the non-elastic conductive housing and a conductive part upper protrusion protruding from an upper surface of the non-elastic conductive housing.

[0028] Inventive Effects

[0029] According to the test device for testing a mobile AP of the present application, a frame of an upper test seat is formed of a non-elastic conductive housing of a metal material having high thermal conductivity, and heat generated from an AP package is transferred to a heat dissipation device provided in the upper device through the upper test seat to be cooled, so that performance testing can be performed in a step prior to mounting a memory package on the AP package, which was impossible due to heat generation of the AP package, thereby reducing the number of process steps of overall testing to reduce costs.

[0030] Further, according to the test device for testing a mobile AP of the present application, the packages are stacked after reliability testing of the memory package and the AP package is completed, so that yield can be improved.

[0031] Further, according to the test device for testing a mobile AP of the present application, a frame of a metal material is used as a frame of an upper test seat, so that a critical point of a load applied to the upper test seat can be improved, thereby increasing durability of the test seat to improve a service life.

[0032] Further, according to the test device for testing a mobile AP of the present application, the upper test seat has a coaxial cable structure, so that high frequency signal transmission characteristics are excellent, high frequency signal interference between conductive parts is small to minimize signal transmission loss.

[0033] Further, according to the test device for testing a mobile AP of the present application, a memory package can be formed of a qualified product package pre-selected as a qualified product, and detection of whether an AP package normally operates or not is performed, so that it has an advantage that whether the AP package is unqualified or not can be directly known. BRIEF DESCRIPTION OF DRAWINGS

[0034] Figure 1 An existing test device for testing a mobile AP is schematically shown.

[0035] Figure 2 A test device for testing a mobile AP according to an embodiment of the present application is schematically shown.

[0036] Figure 3FIG. 1 is a front sectional view showing an upper test socket provided in a test apparatus according to an embodiment of the present application.

[0037] Figure 4 FIG. 2 is a plan sectional view showing a part of the upper test socket provided in the test apparatus according to the embodiment of the present application.

[0038] Figure 5 FIG. 3 is a flowchart for explaining an operation of the test apparatus according to the embodiment of the present application.

[0039] Figure 6 FIG. 4 is a front sectional view showing an upper test socket provided in a test apparatus according to another embodiment of the present application.

[0040] Figure 7 FIG. 5 shows a manufacturing process of the upper test socket shown in Figure 3

[0041] BRIEF DESCRIPTION OF DRAWINGS

[0042] 100: test apparatus 110: AP package

[0043] 111: lower terminal 112: upper terminal

[0044] 120: memory package 121: memory package terminal

[0045] 130: tester 140: lower test socket

[0046] 141: first conductive portion 142: insulating portion

[0047] 150: upper device 151: main body portion

[0048] 152: contact portion 153: housing portion

[0049] 154: pressure applying portion 160, 260: upper test socket

[0050] 161: second conductive portion 162: non-elastic conductive shell

[0051] 163: shell hole 164: insulating coating

[0052] 170: heat dissipating device 171: heat dissipating plate

[0053] 172: cooling fan 240: frame member

[0054] 250: conductive particle mixture DETAILED DESCRIPTION

[0055] Hereinafter, a test apparatus for testing a mobile AP according to the present application will be described in detail with reference to the accompanying drawings. ​

[0056] Figure 2 FIG. 1 is a perspective view showing a test device for testing a mobile AP according to an embodiment of the present application; Figure 3 FIG. 2 is a front sectional view showing an upper test socket provided in the test device according to an embodiment of the present application; Figure 4 FIG. 3 is a plan sectional view showing a part of the upper test socket provided in the test device according to an embodiment of the present application; Figure 5 FIG. 4 is a view for explaining an operation of the test device according to an embodiment of the present application.

[0057] As shown in the drawings, a test device 100 for testing a mobile AP according to an embodiment of the present application includes a lower test socket 140 mounted on a tester 130 and coupled with an AP package 110 placed on an upper side, an upper test socket 160 mounted on a memory package 120 and coupled with the AP package 110 placed on a lower side, an upper device 150 accommodating the memory package 120 and installed with the upper test socket 160, and a heat dissipation device 170 disposed in the upper device 150. That is, the test device of the present application tests the mobile AP using the lower test socket 140 and the upper test socket 160.

[0058] The lower test socket 140 uses a rubber type socket having a structure in which first conductive portions 141, which are in a form in which a plurality of conductive particles are contained in the inside of a material having elasticity such as silicone, are disposed in mutual insulation inside an insulating portion 142 formed of a material having elasticity such as silicone. Since the lower test socket 140 uses the rubber type socket which does not use mechanical means such as soldering or a spring, it has the advantage that durability is excellent and damage to the AP package can be minimized.

[0059] The lower test socket 140 is mounted on the tester 130, the first conductive portions 141 are coupled with signal electrodes (not shown) of the tester 130 placed on the lower side at a lower end portion, and can be coupled with lower terminals 111 of the AP package 110 placed on the upper side at an upper end portion.

[0060] The upper device 150 is provided with a main body portion 151, a contact portion 152 surrounding an outer side of a lower end of the main body portion 151, an accommodation portion 153 in which the memory package 120 is accommodated in an accommodation space inside the contact portion 152, a pressurizing portion 154 pressurizing the memory package 120, and the contact portion 152 is formed in a manner to contact the upper test socket 160. Also, the heat dissipation device 170 such as a heat sink 171 and a cooling fan 172 is disposed in the upper device 150.

[0061] The upper test socket 160 mounts the memory package 120, and the upper surface of the upper test socket 160 is attached to the contact portion 152 of the upper device to seal the accommodation portion 153 of the upper device. The lower surface of the upper test socket 160 is configured to contact the upper surface of the AP package 110.

[0062] The upper test socket 160 includes a non-elastic conductive housing 162 having a plurality of housing holes 163, an insulating coating 164 coated on the non-elastic conductive housing 162, and a second conductive portion 161 disposed in the plurality of housing holes 163 to pass through the non-elastic conductive housing 162 in the thickness direction.

[0063] The non-elastic conductive housing 162 is formed of a metal material having excellent thermal conductivity. As the metal material forming the non-elastic conductive housing 162, a substance having a thermal conductivity of 10 W / mK or more is preferably used. As such a metal material, a conductive metal such as aluminum, copper, brass, SUS, iron, nickel, or various materials having conductivity and excellent thermal conductivity can be used. The plurality of housing holes 163 provided in the non-elastic conductive housing 162 are formed to pass through the non-elastic conductive housing 162 in the thickness direction.

[0064] The insulating coating 164 is coated on the non-elastic conductive housing 162 in the form of a thin film having a uniform thickness. The insulating coating 164 is coated on at least the edges of the plurality of housing holes 163 of the non-elastic conductive housing 162. The insulating coating 164 coated on the edges of the housing holes 163 insulates the second conductive portion 161 disposed in the housing holes 163 from the non-elastic conductive housing 162.

[0065] Preferably, the insulating coating 164 is also coated on the upper surface and the lower surface of the non-elastic conductive housing 162. The insulating coating 164 coated on the upper surface of the non-elastic conductive housing 162 can form insulation between the non-elastic conductive housing 162 and the memory package 120 placed thereon, and the insulating coating 164 coated on the lower surface of the non-elastic conductive housing 162 can form insulation between the non-elastic conductive housing 162 and the AP package 110 placed thereunder.

[0066] Furthermore, the insulating coating 164 can be coated on the entire non-elastic conductive housing 162. Coating the insulating coating 164 on the entire non-elastic conductive housing 162 thus simplifies the coating process and can shorten the coating time.

[0067] The insulating coating 164 can be coated on the non-elastic conductive housing 162 by a coating method selected from polytetrafluoroethylene coating, DLC (Diamond-Like-Carbon) coating, parylene coating, anodization, and liquid silicon coating.

[0068] The polytetrafluoroethylene coating is a method of coating a fluorocarbon resin as a paint on a material such as metal, and the polytetrafluoroethylene coating can form the insulating coating layer 164 on the non-elastic conductive housing 162.

[0069] The DLC coating uses a carbon component gas as a main component of diamond to generate plasma in a vacuum state and deposit a coating film on a desired surface, and the DLC coating can form the insulating coating layer 164 on the non-elastic conductive housing 162.

[0070] The parylene coating is a method of forming an insulating film in a polymer form using a dimer in a powder state by a chemical vapor deposition (CVD) method, and the parylene coating can form the insulating coating layer 164 on the non-elastic conductive housing 162. The parylene coating method can include a process in which the dimer in a powder state is evaporated by heat, the evaporated dimer is converted into a gas state by a thermal decomposition unit, the dimer in a gas state is cooled before being diffused into the inside of a vacuum chamber, and the cooled gas particles are polymerized in the vacuum chamber to be coated in a thin film form on the surface of an object to be processed. The polymerization reaction of the parylene coating is induced at a very low pressure and at a temperature of an ordinary temperature state, and thus thermal stress does not occur on the surface of the object to be processed. The parylene coating is different from a wet coating method in that it can be coated even in a fine gap and can form a uniform insulating film regardless of the shape of a fine needle portion, a hole, an edge, a corner, a small hole, etc.

[0071] The hard anodizing method, which is an anodizing method, is a method of converting an aluminum metal surface into an aluminum oxide ceramic using an electrochemical method, and the hard anodizing method can form the insulating coating layer 164 on the non-elastic conductive housing 162. If the hard anodizing process is performed on the aluminum metal, the aluminum metal itself is oxidized and converted into the aluminum oxide ceramic. The aluminum oxide ceramic has excellent wear resistance, does not have a problem of peeling like plating or painting, and has excellent electrical insulation.

[0072] In the case of using the liquid silicon coating method, the non-elastic conductive housing 162 is immersed in a liquid silicon gel, and thus the insulating coating layer 164 formed of a silicon gel film can be formed on the non-elastic conductive housing 162.

[0073] In addition, various methods can be used to form the insulating coating layer 164 on the non-elastic conductive housing 162.

[0074] The second conductive part 161 can be formed in a form in which a plurality of conductive particles are contained in an elastic insulating substance so that the upper end part can be coupled with the terminal 121 of the memory package 120 and the lower end part can be coupled with the upper terminal 112 of the AP package 110. The second conductive part 161 is in contact with the insulating coating layer 164 disposed at the edge of the housing hole 163, and is insulated from the inelastic conductive housing 162 by the insulating coating layer 164.

[0075] In the past, the frame of the upper test socket was formed of an insulating material having elasticity such as silicone, and the heat generated from the AP package was blocked from being transferred to the heat dissipation device due to the excessively high heat insulation, and the AP package was deteriorated to be unable to perform normal testing.

[0076] Therefore, the upper test socket 160 of the present application is formed of a structure different from the conventional rubber type socket, and is used to solve such problems. The conductive part of the upper test socket 160 has a form in which a plurality of conductive particles are contained in a material having elasticity such as silicone, but instead of the material having elasticity such as silicone, a metal material having high thermal conductivity is used for the frame supporting the conductive part, and has a structure in which the conductive part is insulated by the insulating coating layer.

[0077] Since the lower surface of the upper test socket 160 is in contact with the upper surface of the AP package 110, and the upper surface of the upper test socket 160 is in contact with the lower surface of the upper device 150, the upper test socket 160 transfers the heat generated from the AP package 110 placed on the lower side to the upper device 150 through the inelastic conductive housing 162 formed of a material having high thermal conductivity, and can be cooled in the heat dissipation device 170, and thus the heat generation problem of the AP package can be solved to perform testing. Therefore, in the step of mounting the memory package 120 on the AP package 110, performance testing can be performed, and thus the process steps of testing are reduced to be able to reduce costs.

[0078] Furthermore, as shown in FIG. 1, the upper test socket 160 according to an embodiment of the present application is formed of a structure in which the second conductive part 161 transmitting a signal is wrapped by the insulating coating layer 164, and the edge of the insulating coating layer 164 is wrapped by the inelastic conductive housing 162, so that a coaxial cable structure is adopted. Figure 4 Therefore, the high frequency signal transmission characteristics are excellent, the high frequency signal interference between the second conductive parts 161 is small, and the signal transmission loss can be minimized.

[0079] Furthermore, the upper test socket 160 according to an embodiment of the present application can adjust the characteristic impedance by matching the diameter of the second conductive part 161 or the distance between the second conductive part 161 and the inelastic conductive housing 162, and is advantageous for high speed signal transmission.

[0080] As shown in FIG. 1, the upper test socket 160 according to an embodiment of the present application is formed of a structure in which the second conductive part 161 transmitting a signal is wrapped by the insulating coating layer 164, and the edge of the insulating coating layer 164 is wrapped by the inelastic conductive housing 162, so that a coaxial cable structure is adopted. Figure 5As shown, when the memory package 120 is pressed toward the upper test socket 160 by the pressing portion 154 provided in the upper device 150, the terminal 121 of the memory package 120 is compressed toward the upper end portion of the second conductive portion 161, and the lower end portion of the second conductive portion 161 is compressed toward the upper terminal 112 of the AP package 110. When the terminal 121 of the memory package 120 is compressed toward the upper end portion of the second conductive portion 161, and the lower end portion of the second conductive portion 161 is compressed toward the upper terminal 112 of the AP package 110, the memory package terminal 121 and the upper terminal 112 of the AP package can enter the inside of the housing hole 163 while elastically deforming the second conductive portion 161 due to the elastic force of the second conductive portion 161.

[0081] The pressing force of the pressing portion 154 provided in the upper device 150 is transmitted to the AP package 110 through the upper test socket 160, and thus, when the AP package 110 presses the lower test socket 140, the tester 130, the lower test socket 140, the AP package 110, the upper test socket 160, and the memory package 120 are electrically connected. In this state, a test signal generated from the tester 130 is transmitted to the AP package 110 and the memory package 120, and thus, an electrical test for whether the AP package 110 normally operates and whether the AP package 110 is well matched with the memory package 120 can be performed.

[0082] In the test device 100 of the present application, the memory package 120 is configured as a qualified product package that is pre-selected as a qualified product, and thus, a so-called golden device that can be used to test whether the AP package 110 normally operates can be used. If the memory package 120 is configured as a golden device, it is not only advantageous to test whether the AP package 110 normally operates, but also advantageous to test whether it is well matched with the memory package 120 when it is stacked in a stacked package manner. Furthermore, if the memory package 120 is configured as a golden device, it has an advantage that, if a failure occurs when a test is performed, it can be directly known that the AP package 110 is a non-qualified product. Of course, when the AP package 110 is not configured as a golden device, the memory package 120 can also be a test target, and the memory package 120 and the AP package 110 can be simultaneously tested.

[0083] Also, in the test device 100 of the present application, the memory package 120 and the AP package 110 are stacked after the reliability test of each is completed, so that the yield can be improved. That is, when the memory package and the AP package are prepared as one package, if one of them is replaced, the test program and the test board need to be changed, which has the problem of requiring much time and cost. In contrast, the test device of the present application stacks the packages after testing the memory package 120 and the AP package 110 separately, so that when a change occurs, only the test tool of the corresponding package needs to be changed, thus having the advantage of being able to greatly reduce the time and cost.

[0084] In the test device 100 of the present application, the frame of the upper test socket 160 uses a frame of a metal material, not an existing elastomer, and is designed in a manner that can sufficiently withstand the load applied to the upper test socket, so that the durability of the test socket can be increased and the service life can be improved. That is, in a mobile AP, the lower terminals of the AP package are generally formed to be about 1,000 to 1,600, and the terminals of the memory package are formed to be about 500, and only when the pressing force of the pressing part is applied to the extent that the lower terminals of the AP package can be compressed to the conductive part of the lower test socket, the test can be performed, so that much load is applied to the upper test socket. In the present application, the frame of the upper test socket uses a frame of a metal material, so that the critical point of the load applied from the pressing part can be improved, the durability of the upper test socket is increased, and the service life can be improved.

[0085] Figure 6 FIG. 1 is a front sectional view showing the upper test socket provided in the test device according to the present application.

[0086] The upper test socket 260 includes a non-elastic conductive housing 162 having a plurality of housing holes 163, an insulating coating layer 164 coated on the non-elastic conductive housing 162, and a second conductive part 161 disposed in the plurality of housing holes 163 to pass through the non-elastic conductive housing 162 in the thickness direction, which is the same as the upper test socket of the embodiment of the present application.

[0087] However, the second conductive part 161 of the upper test socket 260 according to the other embodiment of the present application is different in that it includes a conductive part body 261 located in the housing hole 163, and a conductive part upper protrusion 262 and a conductive part lower protrusion 263 connected to the conductive part body 261, the conductive part upper protrusion 262 protruding from the upper surface of the non-elastic conductive housing 162, and the conductive part lower protrusion 263 protruding from the lower surface of the non-elastic conductive housing 162. Either one of the conductive part upper protrusion 262 and the conductive part lower protrusion 263 can be formed alone.

[0088] In the case of the upper test socket 260, the plurality of conductive portions that support the electrical connection of the terminals of the memory package and the upper terminals of the AP package are supported by the non-elastic conductive housing. When the tester side is pressed by the pressing portion, the upper bumps of the conductive portions or the lower bumps of the conductive portions are elastically deformed, and thus the terminals of the memory package and the upper terminals of the AP package can be more stably contacted.

[0089] Figure 3 The upper test socket 160 shown in FIG. 1 can be manufactured in the same manner as the upper test socket 260 shown in FIG. 2. Figure 7

[0090] First, as shown in (a) of FIG. 2, a frame member 240 formed of a metal material having high thermal conductivity is prepared. Figure 7

[0091] Then, as shown in (b) of FIG. 2, a plurality of housing holes 163 that pass through the frame member 240 in the thickness direction are formed in the frame member 240, thereby forming a non-elastic conductive housing 162. Figure 7

[0092] Then, as shown in (c) of FIG. 2, an insulating coating layer 164 is coated on the non-elastic conductive housing 162. The insulating coating layer 164 can be formed only on the edges of the housing holes 163, or can be formed on the edges and the upper or lower surfaces of the housing holes 163, or can be coated on the entire non-elastic conductive housing 162. As a method of coating the insulating coating layer 164 on the non-elastic conductive housing 162, a coating method selected from the polytetrafluoroethylene coating, the DLC coating, the parylene coating, the anodization treatment, and the liquid silicon coating described in the foregoing can be used. Figure 7

[0093] Then, as shown in (d) of FIG. 2, a conductive particle mixture 250 in which conductive particles are contained in an elastic insulating material is filled in the plurality of housing holes 163. The conductive particle mixture 250 can be pressed into the housing holes 163 in a slurry state having fluidity. Figure 7

[0094] Further, a curing process of the conductive particle mixture 250 disposed in the housing holes 163 is performed. The method of curing the conductive particle mixture 250 can use various methods according to the characteristics of the conductive particle mixture 250, such as a method of cooling at room temperature after heating at a certain temperature. The conductive particle mixture 250 is cured through the curing process, thereby forming a second conductive portion 161 disposed in the housing holes 163.

[0095] ​​​​​In the manufacturing method of such an upper test socket 160, a process of applying a magnetic field to the conductive particle mixture 250 can be performed before the conductive particle mixture 250 is cured. If a magnetic field is applied to the conductive particle mixture 250, the conductive particles dispersed in the elastic insulating substance are oriented in the thickness direction of the non-elastic conductive shell 162 due to the influence of the magnetic field, thereby enabling the formation of an electrical passage.

[0096] The above has been described with respect to preferred embodiments of the present application, but the scope of the present application is not limited to the above-described and illustrated configurations.

[0097] For example, the pressure transmission structure of the pressurizing portion to the lower test socket 140 is not limited to the illustrated one and can be variously changed.

[0098] Further, the heat dissipation device can be configured only with a heat sink, or can be configured with another cooling means other than the heat sink and the cooling fan.

[0099] The above has been described with respect to preferred embodiments for illustrating the principles of the present application, but the present application is not limited to the configurations and effects illustrated and described above. It will be readily understood by those skilled in the art that various changes and modifications can be made thereto without departing from the spirit and scope of the appended claims.

Claims

1. A testing apparatus for testing a mobile access point (AP), the mobile AP having an AP package and a memory package, characterized in that, include: The lower test socket is mounted on the tester and connected to the AP package placed on the upper side; The upper test socket, which mounts the memory package, is connected to the AP package placed on the lower side; Upper device, the upper device accommodating the memory package and mounting the upper test socket; and A heat dissipation device is configured on the upper part of the equipment. The upper test stand includes: A non-elastic conductive shell has a plurality of shell holes extending along its thickness direction; an insulating coating is applied to the edges of the plurality of shell holes; and a conductive portion is configured to contain a plurality of conductive particles within an elastic insulating material and is disposed within the shell holes, forming an insulation between the conductive portion and the non-elastic conductive shell through the insulating coating. The heat generated from the AP package is transferred to the heat dissipation device through the upper test socket, and The conductive part includes a conductive part body and a lower conductive part protrusion and an upper conductive part protrusion connected to the conductive part body. The conductive part body is placed inside the housing hole. The lower conductive part protrudes from the bottom of the non-elastic conductive housing and contacts the AP package. The upper conductive part protrudes from the top of the non-elastic conductive housing and contacts the memory package.

2. The testing device for testing a mobile AP according to claim 1, wherein, The inelastic conductive shell is formed of a material with a thermal conductivity of 10 W / mK or higher.

3. The testing device for testing a mobile AP according to claim 1, wherein, The inelastic conductive outer shell is formed of a metallic material.

4. The testing device for testing a mobile AP according to claim 1, wherein, The memory package is a gold-plated device used for packaging qualified products.

5. The testing device for testing a mobile AP according to claim 1, wherein, The insulating coating is applied to the entire inelastic conductive shell.

6. The testing device for testing a mobile AP according to claim 1, wherein, The insulating coating is formed by a coating method selected from polytetrafluoroethylene coating, DLC coating, parylene coating, anodizing treatment, and liquid silicon coating.

7. The testing device for testing a mobile AP according to claim 1, wherein, The heat dissipation device includes a heat sink or a cooling fan.

8. The testing device for testing a mobile AP according to claim 1, wherein, The upper device is a thruster or a processing machine.

Images