A double-sided hot water cooling plate

Abstract

This invention belongs to the field of water-cooled plate technology, specifically a double-sided water-cooling plate. It addresses the problem of uneven temperature distribution between IGBTs, which affects their operational stability and reliability. The existing liquid-cooled plate has a low water temperature at the inlet, resulting in a low temperature for the corresponding IGBT chips. However, at the outlet, the coolant temperature is higher after preheating, leading to a higher temperature for the IGBT chips as well. The proposed solution includes a frame and two IGBT modules symmetrically arranged on both sides of the frame. In this invention, the device uses partitions and bypass channels to maintain a good cooling effect for each group of heat dissipation fins, reducing the temperature difference between different IGBTs, improving the temperature uniformity of the IGBT modules, and ensuring the stability and reliability of the IGBT chip operation.

Description

Technical Field

[0001] This invention relates to the field of water-cooled plate technology, and more particularly to a double-sided water-cooled plate with heat exchange function. Background Technology

[0002] A double-sided water-cooled plate is a water-cooled plate device capable of achieving double-sided heat exchange. With the development of new energy vehicles, on-board power inverters are playing an increasingly important role. The power consumption of IGBT chips, which are core components, is constantly increasing, making heat dissipation of IGBTs increasingly difficult. Currently, liquid cooling has become the main method for dissipating heat from IGBT chips. Since several or even a dozen IGBTs are usually used side by side during operation, multiple IGBT chips are often cooled on a single liquid cooling plate, resulting in a particularly significant thermal cascading phenomenon between different IGBT chips.

[0003] However, existing liquid cooling plates have the following drawbacks during operation:

[0004] 1. The water temperature at the inlet of the liquid cooling plate is low, and the corresponding IGBT chip temperature is also low. However, at the outlet of the liquid cooling plate, the water temperature is higher than at the inlet after being heated earlier, which causes the IGBT chip temperature to rise as well. This results in uneven temperature between different IGBTs, affecting the working stability and reliability of the IGBT chips.

[0005] To address the aforementioned problems, this invention proposes a double-sided hot water cooling plate. Summary of the Invention

[0006] This invention provides a double-sided hot water cooling plate, which solves the problem in the prior art where the water temperature at the inlet of the liquid cooling plate is low, resulting in a low temperature for the corresponding IGBT chip. However, at the outlet of the liquid cooling plate, the water temperature is higher after being heated earlier, causing the IGBT chip temperature to also rise. This results in uneven temperature between different IGBTs, affecting the working stability and reliability of the IGBT chips.

[0007] This invention provides the following technical solution:

[0008] A double-sided hot water heat exchange cooling plate, comprising:

[0009] The frame and two IGBT modules are symmetrically arranged on both sides of the frame;

[0010] The first conductive tube is fixedly connected to the top of the frame, and an inlet is provided at the top of the first conductive tube.

[0011] The second conductive tube is fixedly connected to the top of the frame and is located on one side of the first conductive tube. The top of the second conductive tube has a liquid outlet.

[0012] A partition is fixedly connected between the top and bottom inner walls of the frame, and multiple square holes are provided on both sides of the partition;

[0013] A bypass channel, wherein the bypass channel is formed inside the partition;

[0014] A heat dissipation component is provided, which is located on one side of the two IGBT modules that are close to each other and is used to dissipate heat.

[0015] In one possible design, the heat dissipation assembly includes multiple sets of heat dissipation components disposed on one side of the two IGBT modules close to each other, each set of heat dissipation components containing multiple heat dissipation fins that mate with square holes.

[0016] In one possible design, multiple guide plates arranged symmetrically are fixedly connected to both sides of the partition, and the guide plates are matched with square holes.

[0017] In one possible design, the width of the bypass channel is 0.1-0.2 mm.

[0018] In one possible design, the angle between the deflector and the baffle is 18°.

[0019] In one possible design, the IGBT module contains multiple IGBT chips.

[0020] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit the invention.

[0021] In this invention, a partition is provided in the middle of the frame, and the partition has a coolant bypass channel and multiple square holes. Multiple heat dissipation fins are provided on one side of the IGBT module. Unheated coolant flows into the frame from the inlet, and then the coolant is divided into three branches by the partition.

[0022] In this invention, when the coolant reaches the next set of IGBTs, some of the bypass coolant flows into the heat dissipation fins through the square holes and guide plates on the bypass channel, and merges with the heated main fluid. The mixing of hot and cold fluids reduces the temperature of the coolant flowing through the second set of heat dissipation fins. Similarly, the guide plates allow the tributaries in the bypass channel to mix with the main fluid, while the mixed fluid is less likely to enter the bypass channel. This ensures that the temperature of the tributaries in the bypass channel is not affected by the temperature of the main fluid, and the temperature is always kept at a low level, thus reducing the temperature difference between the IGBTs corresponding to the first and last sets of heat dissipation fins.

[0023] In this invention, the device uses partitions and bypass channels to ensure that the cooling effect of each group of heat dissipation fins is maintained at a good level, reducing the temperature difference between different IGBTs, improving the temperature uniformity of the IGBT module, and ensuring the stability and reliability of the IGBT chip operation. Attached Figure Description

[0024] Figure 1 This is a three-dimensional structural schematic diagram of a double-sided hot water exchange cooling plate provided in an embodiment of the present invention;

[0025] Figure 2 This is a three-dimensional structural diagram of the inner frame of a double-sided heat exchange cooling plate provided in an embodiment of the present invention;

[0026] Figure 3 This is a cross-sectional structural diagram of the frame of a double-sided heat exchange cooling plate provided in an embodiment of the present invention;

[0027] Figure 4 This is a top view of the partition structure of a double-sided heat exchange cooling plate provided in an embodiment of the present invention;

[0028] Figure 5 This is a top view of a heat dissipation assembly in a double-sided hot water exchange cooling plate according to an embodiment of the present invention.

[0029] Figure 6 This is a three-dimensional structural schematic diagram of a heat dissipation component in a double-sided hot water exchange cooling plate provided in an embodiment of the present invention;

[0030] Figure 7 This is a schematic diagram of liquid flow in a double-sided heat exchange cooling plate provided in an embodiment of the present invention.

[0031] Figure label:

[0032] 1. Frame; 2. IGBT module; 3. First conduit; 4. Second conduit; 5. Liquid inlet; 6. Liquid outlet; 7. Partition; 701. Bypass channel; 702. Square hole; 8. Guide plate; 9. Heat dissipation fins; 10. Main fluid. Detailed Implementation

[0033] The embodiments of the present invention will now be described with reference to the accompanying drawings.

[0034] In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connection" and "installation" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. Furthermore, "connection" can be a direct connection or an indirect connection through an intermediate medium. "Fixed" means that the devices are connected to each other and their relative positional relationship remains unchanged after the connection. The directional terms mentioned in the embodiments of the present invention, such as "inner," "outer," "top," and "bottom," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present invention, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention.

[0035] In this embodiment of the invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature. Example 1

[0036] Reference Figure 1-6 A double-sided hot water cooling plate, comprising:

[0037] The frame 1 and two IGBT modules 2 are symmetrically arranged on both sides of the frame 1.

[0038] The first guide tube 3 is fixedly connected to the top of the frame 1, and the top of the first guide tube 3 is provided with a liquid inlet 5.

[0039] The second guide tube 4 is fixedly connected to the top of the frame 1. The second guide tube 4 is located on one side of the first guide tube 3. The top of the second guide tube 4 is provided with a liquid outlet 6.

[0040] Partition 7 is fixedly connected between the top and bottom inner walls of the frame 1, and multiple square holes 702 are provided on both sides of partition 7.

[0041] Bypass waterway 701 is located inside partition 7;

[0042] The heat dissipation component is located on one side of the two IGBT modules 2 that are close to each other and is used to dissipate heat.

[0043] The above technical solution can achieve the technical effect that the device can maintain a good cooling effect of each group of heat dissipation fins 9 through the partition 7 and bypass water channel 701, reduce the temperature difference between different IGBTs, improve the temperature uniformity of IGBT module 2, and ensure the stability and reliability of IGBT chip operation.

[0044] Reference Figure 5-6 The heat dissipation assembly includes multiple heat dissipation components disposed on one side of the two IGBT modules 2 that are close to each other. Each heat dissipation component contains multiple heat dissipation fins 9, which cooperate with the square holes 702.

[0045] The above technical solution can achieve the effect of multiple heat dissipation fins working together to make the whole device heat up evenly and reduce the temperature difference between IGBT chips. Example 2

[0046] Reference Figure 1-6 A double-sided hot water cooling plate, comprising:

[0047] The frame 1 and two IGBT modules 2 are symmetrically arranged on both sides of the frame 1.

[0048] The first guide tube 3 is fixedly connected to the top of the frame 1, and the top of the first guide tube 3 is provided with a liquid inlet 5.

[0049] The second guide tube 4 is fixedly connected to the top of the frame 1. The second guide tube 4 is located on one side of the first guide tube 3. The top of the second guide tube 4 is provided with a liquid outlet 6.

[0050] Partition 7 is fixedly connected between the top and bottom inner walls of the frame 1, and multiple square holes 702 are provided on both sides of partition 7.

[0051] Bypass waterway 701 is located inside partition 7;

[0052] The heat dissipation component is located on one side of the two IGBT modules 2 that are close to each other and is used to dissipate heat.

[0053] The above technical solution can achieve the technical effect that the device can maintain a good cooling effect of each group of heat dissipation fins 9 through the partition 7 and bypass water channel 701, reduce the temperature difference between different IGBTs, improve the temperature uniformity of IGBT module 2, and ensure the stability and reliability of IGBT chip operation.

[0054] Reference Figure 5-6 The heat dissipation assembly includes multiple heat dissipation components disposed on one side of the two IGBT modules 2 that are close to each other. Each heat dissipation component contains multiple heat dissipation fins 9, which cooperate with the square holes 702.

[0055] The above technical solution can achieve the effect of multiple heat dissipation fins working together to make the whole device heat up evenly and reduce the temperature difference between IGBT chips.

[0056] Reference Figure 3-5 Multiple guide plates 8 are fixedly connected to both sides of the partition 7 in a symmetrical arrangement, and the guide plates 8 cooperate with the square holes 702.

[0057] The above technical solution can achieve the effect that the guide plate 8 can make the tributary in the bypass channel 701 mix with the main fluid 10, while the mixed fluid is not easy to enter the bypass channel 701, ensuring that the temperature of the tributary in the bypass channel 701 is not affected by the temperature of the main fluid, and always keeping the temperature at a low level.

[0058] Reference Figure 4 The width of the bypass channel 701 is 0.15mm.

[0059] The above technical solution can achieve the technical effect of allowing the water volume of the three tributaries to be divided according to actual needs.

[0060] Reference Figure 4-5 The angle between the guide plate 8 and the baffle 7 is 18°.

[0061] The above technical solution can ensure that the mixed fluid does not easily enter the bypass channel 701, while not affecting the technical effect of the heat dissipation fins 9.

[0062] Reference Figure 1 IGBT module 2 contains multiple IGBT chips.

[0063] The above technical solution can achieve the technical effect of enabling IGBT module 2 to perform its function.

[0064] However, as is well known to those skilled in the art, the working principle and wiring method of IGBT module 2 are commonplace and are all conventional methods or common knowledge. They will not be elaborated here. Those skilled in the art can make any selections according to their needs or convenience.

[0065] The working principle and usage process of this technical solution are as follows: A partition 7 is provided in the middle of the frame 1. The partition 7 has a coolant bypass channel 701 and multiple square holes 702. Multiple sets of heat dissipation fins 9 are provided on one side of the IGBT module 2. Unheated coolant flows into the frame 1 from the inlet 5. Then, through the partition 7, the coolant is divided into three branches (e.g., Figure 7 (Two main fluids 10 and one bypass main fluid 11).

[0066] When the coolant reaches the next group of IGBTs, some of the bypass coolant flows into the heat dissipation fins 9 through the square hole 702 on the bypass channel 701 and the guide plate 8, and merges with the heated main fluid. The mixing of hot and cold fluids reduces the temperature of the coolant flowing through the second group of heat dissipation fins 9. Similarly, the guide plate 8 allows the tributary in the bypass channel 701 to mix with the main fluid, while the mixed fluid is less likely to enter the bypass channel 701. This ensures that the temperature of the tributary in the bypass channel 701 is not affected by the temperature of the main fluid, and keeps the temperature at a low level. Finally, it reduces the temperature difference between the IGBTs corresponding to the first and last groups of heat dissipation fins 9.

[0067] The device, through the partition 7 and the bypass water channel 701, ensures that the cooling effect of each group of heat dissipation fins 9 is maintained at a good level, reduces the temperature difference between different IGBTs, improves the temperature uniformity of the IGBT module 2, and ensures the stability and reliability of the IGBT chip operation.

[0068] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. In the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A double-sided hot water exchange cooling plate, characterized in that, include: The frame (1) and two IGBT modules (2) are arranged symmetrically on both sides of the frame (1); The first guide tube (3) is fixedly connected to the top of the frame (1), and the top of the first guide tube (3) is provided with a liquid inlet (5). The second guide tube (4) is fixedly connected to the top of the frame (1). The second guide tube (4) is located on one side of the first guide tube (3). The top of the second guide tube (4) is provided with a liquid outlet (6). The partition (7) is fixedly connected between the top and bottom inner walls of the frame (1). Multiple square holes (702) are provided on both sides of the partition (7). Multiple guide plates (8) are fixedly connected on both sides of the partition (7) in a symmetrical arrangement. A bypass channel (701) is provided inside the partition (7); A heat dissipation component is provided on one side of the two IGBT modules (2) that are close to each other and is used to dissipate heat. The heat dissipation assembly includes multiple sets of heat dissipation components disposed on one side of the two IGBT modules (2) close to each other. Each set of heat dissipation components includes multiple heat dissipation fins (9). The heat dissipation fins (9) are matched with square holes (702). The guide plate (8) is matched with square holes (702). Unheated coolant flows into the frame (1) from the inlet (5). Then, through the partition (7), the coolant is divided into three branches. Part of the bypass coolant flows into the heat dissipation fins (9) through the square holes (702) and guide plate (8) on the bypass channel (701) and merges with the heated main fluid.

2. The double-sided hot water exchange cooling plate according to claim 1, characterized in that, The width of the bypass channel (701) is 0.1-0.2 mm.

3. A double-sided hot water exchange cooling plate according to claim 1, characterized in that, The angle between the guide plate (8) and the partition plate (7) is 18°.

4. A double-sided hot water exchange cooling plate according to claim 1, characterized in that, The IGBT module (2) contains multiple IGBT chips.

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