spring member

Abstract

The spring member (1, 2, 3) has a conduction plate (11) formed of a material having at least one of electrical conductivity and thermal conductivity higher than a material forming a support plate (12), the support plate being formed of a material having a Young's modulus higher than a material forming the conduction plate, in the conduction plate, a first abutting portion (13) abutting against a first push body (W1) is formed at both ends in a second direction (X), and a second abutting portion (14) abutting against a second push body (W2) is formed at a middle portion in the second direction, in the support plate, both ends in the second direction of the conduction plate are respectively clamped at both ends in the second direction, and a third abutting portion (15) abutting against the second abutting portion and sandwiching the second abutting portion between the second push body in a first direction (Z) is formed at a middle portion in the second direction.

Description

Technical Field

[0001] This invention relates to spring components.

[0002] In this application, priority is claimed based on Japanese Patent Application No. 2020-180435, filed on October 28, 2020, the contents of which are incorporated herein by reference. Background Technology

[0003] Conventionally, for example, as shown in Patent Document 1 below, a spring component is known, which is disposed between a first push body and a second push body that are opposite to each other in a first direction, and is configured to push the first push body and the second push body in a direction that is opposite to each other in the first direction.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2014-11936 Summary of the Invention

[0007] The problem the invention aims to solve

[0008] However, in the conventional spring components, if it is intended to conduct current or transfer heat from either the first or second pressed body to the other, it may be difficult to stably utilize the characteristics of the spring components, such as conductivity and heat transfer, as designed, when prioritizing the load characteristics of the spring components.

[0009] This invention was made with the above considerations in mind, and its purpose is to provide a spring component that can stably perform properties such as electrical conductivity and thermal conductivity as designed.

[0010] Solution for solving the problem

[0011] To address the aforementioned problems and achieve this objective, one embodiment of the present invention provides a spring component disposed between a first and a second pressed body opposed to each other in a first direction, and disposed in a state whereby the spring component pushes the first and second pressed bodies in a direction opposite to each other along the first direction. The spring component includes a conductive plate and a support plate. The conductive plate is formed of a material whose electrical conductivity and thermal conductivity are at least higher than those of the material forming the support plate. The support plate is formed of a material whose Young's modulus is higher than that of the material forming the conductive plate. The conductive plate and the support plate are respectively positioned relative to the first direction. The guide plate bends or flexes in a manner that protrudes toward the second pushed body from the middle portion of the orthogonal second direction. In the guide plate, a first abutting portion that abuts against the first pushed body is formed at both ends of the second direction, and a second abutting portion that abuts against the second pushed body is formed at the middle portion of the second direction. In the support plate, the two ends of the guide plate in the second direction are respectively locked at both ends of the second direction, and a third abutting portion that abuts against the second abutting portion and is sandwiched between the second pushed body and the second abutting body along the first direction is formed at the middle portion of the second direction.

[0012] According to the invention, since the spring component has a conductive plate and a support plate, the spring component is disposed between the first and second objects being pushed, and the support plate and the conductive plate are elastically deformed together in the first direction, thereby enabling the first and second abutting portions of the conductive plate to abut against the first and second objects being pushed more strongly, respectively, and enabling the conductive plate to stably perform its main characteristics, such as electrical conductivity and thermal conductivity, as designed.

[0013] Since the support plate forms a third abutting portion that abuts against the second abutting portion of the transmission plate and is sandwiched between the support plate and the second pressed body along the first direction, the second abutting portion can reliably and strongly abut against the second pressed body, and the contact state of the transmission plate relative to the first pressed body and the second pressed body can be reliable and stable.

[0014] Because the spring component has a conductive plate and the surface of the support plate is not electroplated with the same material as the conductive plate, it is easy to ensure that at least one of the electrical conductivity and thermal conductivity is high, and there is no plating peeling, so that the above-mentioned characteristics can be performed for a long time.

[0015] In one embodiment, the two ends of the conductive plate in the second direction may be movably locked to the two ends of the support plate in the second direction.

[0016] Since the two ends of the conduction plate in the second direction are respectively movably locked to the two ends of the support plate in the second direction, they can follow the elastic deformation of the spring component and move relative to each other in the second direction. For example, compared with the case where the two ends of the support plate and the conduction plate in the second direction are respectively fixed, the durability can be improved.

[0017] In one embodiment, a through hole may be formed at at least both ends of the conductive plate and the support plate in the second direction, and both ends of the other plate in the second direction may be movably inserted into the through hole.

[0018] Since, in this case, the two ends of the second direction of either the conductive plate or the support plate are movably inserted into the through holes formed at least at the two ends of the second direction of either one, the two ends of the second direction of the conductive plate can be easily and movably locked to the two ends of the second direction of the support plate respectively.

[0019] In one embodiment, the size of the third direction of the through hole, which is orthogonal to both the first and second directions, decreases as it approaches the middle portion of the second direction.

[0020] In this case, since the size of the third direction of the through hole decreases as it moves toward the middle part of the second direction, the area of ​​the second abutment or the third abutment that receives the pushing force from the first direction on the second pushed body can be ensured more widely in either the conductive plate or the support plate, and durability can be improved.

[0021] In one embodiment, the conductive plate may also be elastically deformable, and the first abutting portion and the second abutting portion may be pressed against the support plate along the first direction.

[0022] In this case, due to the elastic deformation of the conduction plate and the pressing of the first abutment and the second abutment with the support plate along the first direction, for example, even if the conduction plate and the support plate are set to be non-engaged with each other throughout the entire area, the conduction plate and the support plate can be made to be less likely to separate from each other in the spring component unit, the spring component can be easily placed between the first pushed body and the second pushed body, and the rigidity of the first abutment and the second abutment subjected to the pushing force in the first direction can be improved.

[0023] Invention Effects

[0024] According to the invention, the characteristics of spring components, such as electrical conductivity and thermal conductivity, can be stably utilized as designed. Attached Figure Description

[0025] Figure 1 This is a top view of the spring component shown as an embodiment, viewed from one side in one direction.

[0026] Figure 2 yes Figure 1 Sectional view along line II-II.

[0027] Figure 3 Viewed from one side of the first direction. Figure 1 Top view of the conduction plate.

[0028] Figure 4 Viewed from one side of the first direction. Figure 1 Top view of the support plate.

[0029] Figure 5 It means Figure 1 The figure shows a first variation of the use of the spring component.

[0030] Figure 6 It means Figure 1 The figure shows a second variation of the use of the spring component.

[0031] Figure 7 This is a cross-sectional view of the spring component along the first and second directions, as a first variation of the described embodiment.

[0032] Figure 8 This is a cross-sectional view of the spring component along the first and second directions, as a second variation of the described embodiment.

[0033] Figure 9 This is a top view of the spring component shown as a third variation of the described embodiment, viewed from one side in one direction.

[0034] Figure 10 This is a front view of the connection terminal structure of Embodiment 1.

[0035] Figure 11 yes Figure 10 Sectional view along line XI-XI.

[0036] Figure 12 yes Figure 10 Sectional view along line XII-XII.

[0037] Figure 13 It is a front view of the connection terminal structure and a diagram showing the state of the inserted terminal.

[0038] Figure 14 yes Figure 13 Sectional view along line XIV-XIV.

[0039] Figure 15 This is a front view of the heat dissipation structure of Embodiment 2. Detailed Implementation

[0040] Hereinafter, an embodiment of the spring component of the present invention will be described with reference to the accompanying drawings.

[0041] like Figure 1 as well as Figure 2 As shown, the spring component 1 of this embodiment is disposed between a first pushed body W1 and a second pushed body W2 that are opposite to each other in the first direction Z, and is disposed in a state that pushes the first pushed body W1 and the second pushed body W2 in a direction that is opposite to each other in the first direction Z.

[0042] The spring component 1 includes a conductive plate 11 and a support plate 12. The conductive plate 11 and the support plate 12 are configured to be non-engaged with each other throughout the entire area.

[0043] The conductive plate 11 and the support plate 12 are bent or buckled in such a way that the middle part of the second direction X, which is orthogonal to the first direction Z, protrudes toward the second pushed body W2.

[0044] Hereinafter, the first pushed body W1 side along the first direction Z will be referred to as one side, and the second pushed body W2 side along the first direction Z will be referred to as the other side.

[0045] Along the second direction X, the side away from the center and towards the end is called the outer side, and the side away from the end and towards the center is called the inner side.

[0046] The direction orthogonal to the first direction Z and the second direction X is called the third direction Y.

[0047] In the illustrated example, the conductive plate 11 and the support plate 12 extend outward from the center along a second direction X towards one side. The conductive plate 11 and the support plate 12 are each bent in a convex curved shape towards the other side. In other words, the conductive plate 11 and the support plate 12 are bent about an axis extending along a third direction Y, and are convex curved towards the other side.

[0048] In addition, the conductive plate 11 and the support plate 12 can also be buckled, for example, in a manner that tapers toward the other side.

[0049] The conductive plate 11 is formed of a material whose electrical conductivity and thermal conductivity are at least higher than those of the material forming the support plate 12. The conductive plate 11 is formed of, for example, copper or aluminum. The thickness of the conductive plate 11 is, for example, about 50 μm to 100 μm.

[0050] The support plate 12 is made of a material with a higher Young's modulus than the material forming the conductive plate 11. The support plate 12 is made of, for example, carbon steel or stainless steel.

[0051] In the conductive plate 11, a first abutting portion 13 is formed at both ends of the second direction X to abut against the first pushed body W1, and a second abutting portion 14 is formed at the middle part of the second direction X to abut against the second pushed body W2.

[0052] The size of the third-direction Y of the second abutment portion 14 is greater than the size of the third-direction Y of the first abutment portion 13. The area of ​​the second abutment portion 14 is wider than the area of ​​the first abutment portion 13. Alternatively, the area of ​​the second abutment portion 14 may be less than the area of ​​the first abutment portion 13.

[0053] The first abutment portion 13 extends along the second direction X such that the open end edge 11c of the conductive plate 11 in the second direction X is directed outward in the second direction X. The first abutment portion 13 is bent in a manner that forms a convex curved surface towards said side. In other words, the first abutment portion 13 is bent about an axis extending along a third direction Y and forms a convex curved surface towards said side. Figure 1 as well as Figure 3 As shown, the size of the third direction Y of the first abutment portion 13 is equal throughout the entire region of the second direction X.

[0054] The second contact portion 14 is formed as a flat plate with its front and back sides facing the first direction Z.

[0055] In the conductive plate 11, the connecting portion 11a located between the first abutting portion 13 and the second abutting portion 14, and the second abutting portion 14, decrease in size in the third direction Y as they move outward toward the second direction X.

[0056] Viewed from the first direction Z, the conductive plate 11 has a symmetrical shape with respect to the straight line (the straight line extending along the third direction Y) passing through the center portion of the conductive plate 11 in the second direction X. Viewed from the first direction Z, the conductive plate 11 has a symmetrical shape with respect to the straight line (the straight line extending along the second direction X) passing through the center portion of the conductive plate 11 in the third direction Y.

[0057] like Figure 2 As shown, in the support plate 12, the two ends of the conduction plate 11 in the second direction X are respectively locked at the two ends of the second direction X, and a third abutment portion 15 is formed in the middle part of the second direction X. The third abutment portion 15 abuts against the second abutment portion 14 and is sandwiched between the second pushed body W2 along the first direction Z.

[0058] The third abutment portion 15 is located at the center of the support plate 12 in the second direction X, and is formed as a flat plate with its front and back sides facing the first direction Z. The side of the third abutment portion 15 facing the other side is covered by the second abutment portion 14 of the conductive plate 11. The third abutment portion 15 and the second abutment portion 14 abut against each other in a non-engaged state.

[0059] Furthermore, the third abutment portion 15 and the second abutment portion 14 can engage with each other. In addition, before the spring member 1 is placed between the first pushed body W1 and the second pushed body W2, the third abutment portion 15 and the second abutment portion 14 can be separated from each other in the first direction Z.

[0060] The two ends of the conductive plate 11 in the second direction X are respectively movably locked to the two ends of the support plate 12 in the second direction X. In the illustrated example, a through hole 16 is formed at least at both ends of the second direction X of either the conductive plate 11 or the support plate 12, and the two ends of the other plate in the second direction X are movably inserted into the through hole 16.

[0061] In other words, the through holes 16 are formed on both sides of the central part of the second direction X in either the conductive plate 11 or the support plate 12 in the second direction X.

[0062] In the illustrated example, a through hole 16 is formed in the support plate 12. The first abutment portion 13 and the connecting portion 11a of the conductive plate 11, moving from the inside to the outside in the second direction X, are inserted into the through hole 16 from the other side to the first side. Figure 1 as well as Figure 4 As shown, the size of the through hole 16 in the third direction Y decreases as it moves inward toward the second direction X. The through hole 16 appears trapezoidal when viewed from the first direction Z.

[0063] like Figure 2 as well as Figure 4 As shown, in the support plate 12, the through hole 16 is integrally formed in the entire region of the portion located between the outer end edge 12a and the central portion in the second direction X, and the outer end edge 12a is connected to the open end edge 12b in the second direction X. Alternatively, the through hole 16 may be formed only at both ends of the support plate 12 in the second direction X, for example, a slit extending along the third direction Y.

[0064] In the support plate 12, the outer edge 12a, located further outward in the second direction X than the through hole 16 and connected to the open edge 12b in the second direction X, extends along the second direction X such that the open edge 12b of the support plate 12 faces outward in the second direction X. The outer edge 12a of the support plate 12 is bent into a convex curved surface facing said side. In other words, the outer edge 12a is bent about an axis extending in the third direction Y and becomes a convex curved surface facing said side. The surface of the outer edge 12a of the support plate 12 facing said side is covered by the first abutting portion 13 of the conductive plate 11. The outer edge 12a of the support plate 12 and the first abutting portion 13 abut against each other in a non-engaged state. Alternatively, the outer edge 12a of the support plate 12 and the first abutting portion 13 can also engage with each other.

[0065] Viewed from the first direction Z, the support plate 12 is symmetrical with respect to the straight line (extending along the third direction Y) passing through the center portion of the support plate 12 in the second direction X.

[0066] In the illustrated example, the conductive plate 11 elastically deforms, and the first abutting portion 13 and the second abutting portion 14 are pressed against the support plate 12 along the first direction Z. Before the conductive plate 11 and the support plate 12 are assembled together, the size of the first direction Z of the support plate 12 is greater than the size of the first direction Z of the conductive plate 11.

[0067] In both the conductive plate 11 and the support plate 12, except for the through hole 16, the parts that are opposite each other in the first direction Z can also abut against each other throughout the entire area.

[0068] like Figure 3 as well as Figure 4 As shown, multiple conductive plates 11 and support plates 12 are connected in a third direction. The number of conductive plates 11 and support plates 12 may also be varied appropriately, not limited to the example shown.

[0069] like Figure 3 As shown, the conductive plates 11 that are adjacent to each other in the third direction Y are connected to each other only at their central portions in the second direction X via a connecting piece 11b. The size of the connecting piece 11b in the second direction X is smaller than the size of the second abutment portion 14 in the second direction X. The size of the second abutment portion 14 in the third direction Y decreases as it moves away from the connecting piece 11b in the second direction X.

[0070] In contrast to the structure in which multiple conductive plates 11 are integrally formed, a spring component can also be used, in which multiple support plates 12 that are separately mounted on each other can be used. In addition, multiple connecting pieces 11b can be provided at intervals in the second direction X, or they can be provided at the center of the second direction X away from the conductive plates 11.

[0071] like Figure 4 As shown, the support plates 12 that are adjacent to each other in the third direction Y are interconnected along the entire length of the second direction X.

[0072] Furthermore, the support plates 12 that are adjacent to each other in the third direction Y can also be connected to each other only in a part or multiple parts in the second direction X.

[0073] In contrast to the structure in which multiple support plates 12 are integrally formed, a spring component can also be used, which has multiple conductive plates 11 that are separately installed.

[0074] As explained above, the spring component 1 according to this embodiment has a conductive plate 11 and a support plate 12. Therefore, the spring component 1 is disposed between the first pushed body W1 and the second pushed body W2, and the support plate 12 and the conductive plate 11 are elastically deformed together in the first direction Z. This allows the first abutting portion 13 and the second abutting portion 14 of the conductive plate 11 to strongly abut against the first pushed body W1 and the second pushed body W2, respectively, and allows the conductive plate 11 to stably perform its main characteristics, such as electrical conductivity and heat transfer, as designed.

[0075] Since a third abutting portion 15 is formed on the support plate 12, the third abutting portion 15 abuts against the second abutting portion 14 of the conduction plate 11 and is sandwiched between the second abutting portion 14 and the second pushed body W2 along the first direction Z, the second abutting portion 14 can reliably and strongly abut against the second pushed body W2, and the contact state of the conduction plate 11 relative to the first pushed body W1 and the second pushed body W2 can be reliable and stable.

[0076] Since the spring component 1 has a conductive plate 11, and the surface of the support plate 12 is not plated with the same material as the conductive plate 11 (or, it is not necessary to plate with the same material as the conductive plate 11), it is easy to ensure that at least one of the electrical conductivity and thermal conductivity is high, and there is no plating peeling, so that the above-mentioned characteristics as designed can be performed for a long time.

[0077] Since the two ends of the conduction plate 11 in the second direction X are movably locked to the two ends of the support plate 12 in the second direction X respectively, they can follow the elastic deformation of the spring member 1 and move the two ends of the support plate 12 in the second direction X and the two ends of the conduction plate 11 in the second direction X relative to each other. For example, compared with the case where the two ends of the support plate 12 and the conduction plate 11 in the second direction X are respectively fixed to each other, the durability can be improved.

[0078] Since the two ends of the second direction X of either the conductive plate 11 or the support plate 12 are movably inserted into the through holes 16 formed at least at both ends of the second direction X of either one, the two ends of the second direction X of the conductive plate 11 can be easily and movably locked to the two ends of the second direction X of the support plate 12.

[0079] Since the size of the third direction Y of the through hole 16 decreases as it moves toward the middle portion of the second direction X, in either the conductive plate 11 or the support plate 12, it is possible to ensure that the area of ​​the second abutment portion 14 or the third abutment portion 15, which is subjected to the pushing force of the first direction Z from the second pushed body W2, is wider, and thus improves durability.

[0080] Because the conductive plate 11 is elastically deformed, and the first abutting part 13 and the second abutting part 14 are pressed against the support plate 12 along the first direction Z, even if the conductive plate 11 and the support plate 12 are set to be non-engaged with each other throughout the entire area, the conductive plate 11 and the support plate 12 can be made to be less likely to separate from each other in the spring component 1 unit, and the spring component 1 can be easily placed between the first pushed body W1 and the second pushed body W2, and the rigidity of the first abutting part 13 and the second abutting part 14 subjected to the pushing force in the first direction Z can be improved.

[0081] Furthermore, the scope of the present invention is not limited to the described embodiments, and various modifications can be made without departing from the purpose of the present invention.

[0082] For example, such as Figure 5 As shown, the two spring components 1 can also be positioned between the first pushed body W1 and the second pushed body W2 with the first direction Z in opposite directions and the first abutting portions 13 of the two spring components 1 abutting each other along the first direction Z.

[0083] In this case, the first abutting portion 13 of one spring component 1 abuts against the first pushed body W1 via the conductive plate 11 of the other spring component 1. In addition, when the two spring components 1 elastically deform along the first direction Z, the first abutting portions 13 of the two spring components 1 that abut against each other in the first direction Z displace integrally along the second direction X without friction with each other, and can ensure that the elastic deformation in the first direction Z is large.

[0084] In addition, such as Figure 6 As shown, the two spring components 1 can also be positioned between the first pushed body W1 and the second pushed body W2 with the first direction Z in opposite directions and the second abutting portions 14 of the two spring components 1 abutting each other along the first direction Z.

[0085] In this case, the second abutting part 14 of one spring component 1 abuts against the second pushed body W2 via the conduction plate 11 of another spring component 1, and in addition, it can ensure that the elastic deformation in the first direction Z is large.

[0086] Alternatively, three or more spring components 1 may be disposed between the first pushed body W1 and the second pushed body W2, and the directions of the first direction Z of the spring components 1 that are adjacent in the first direction Z are opposite to each other, so that the first abutting portions 13 of the spring components 1 that are adjacent in the first direction Z abut each other, or the second abutting portions 14 of the spring components 1 that are adjacent in the first direction Z abut each other in the first direction Z.

[0087] Alternatively, spring component 2 can be used: interchangeable in... Figure 3 as well as Figure 4 The shapes of the conductive plate 11 and the support plate 12 shown are shown.

[0088] That is, in Figure 3 A support plate 22 with a third abutment portion 15 is shown in place of the first abutment portion 13 and the second abutment portion 14. Figure 4 In the case where a conductive plate 21 having a first abutting portion 13 and a second abutting portion 14 is used instead of a third abutting portion 15, as shown... Figure 7 As shown, with the middle part of the conductive plate 21 in the second direction X located closer to the other side than the middle part of the support plate 22 in the second direction X, both ends of the support plate 22 in the second direction X are inserted from the inside to the outside of the through hole 26 of the conductive plate 21.

[0089] As spring components 1 and 2, structures without through holes 16 and 26 can also be adopted.

[0090] For example, such as Figure 8As shown, spring component 3 can also be used: the size of the second direction X of the conductive plate 31 is larger than the size of the second direction X of the support plate 32, and the conductive plate 31 covers the surface facing the other side of the support plate 32 along the entire length of the second direction X, and the open end edge 12b of the second direction X of the support plate 32 crosses the first side from the other side, and the two ends of the second direction X of the conductive plate 31 are wrapped around the two ends of the second direction X of the support plate 32.

[0091] In this spring component 3, the two ends of the conductive plate 31 in the second direction X clamp the two ends of the support plate 32 in the second direction X along the first direction Z, and respectively fix the two ends of the support plate 32 and the conductive plate 31 in the second direction X to each other. In addition, in this spring component 3, in the first abutting part 13, the open end edge 31c of the conductive plate 31 in the second direction X extends along the second direction X in a manner toward the inside of the second direction X.

[0092] Furthermore, in this spring component 3, the following structure can be adopted: a plurality of conductive plates 31 with a size smaller than the support plate 32 in the third direction Y are provided at intervals in the third direction Y relative to a support plate 32. Alternatively, the following structure can be adopted: a component is provided in which a plurality of conductive plates 31 with a size smaller than the support plate 32 in the third direction Y are connected by a connecting piece 11b in the third direction Y relative to a support plate 32. Alternatively, the following structure can be adopted: a conductive plate 31 with a size smaller than or equal to the support plate 32 in the third direction Y relative to a support plate 32 is provided.

[0093] The two ends of the support plates 12, 22, 32 and the conductive plates 11, 21, 31 in the second direction X can also be fixed to each other by means of, for example, brazing.

[0094] Although the spring components 1, 2, and 3 are shown as having multiple conductive plates 11, 21, and 31 and support plates 12, 22, and 32 connected in a third direction Y, a structure could also be used, for example... Figure 9 As shown in the spring component 1, it has a structure with one each of the conduction plates 11, 21, 31 and the support plates 12, 22, 32, or it can have a structure with multiple of each.

[0095] As spring components 1, 2, and 3, for example, the following structure can be adopted: relative to the component formed by connecting multiple support plates 12, 22, and 32 in the third direction Y, a number of conduction plates 11, 21, and 31 less than the number of support plates 12, 22, and 32 can be provided. Alternatively, the following structure can be adopted: relative to the component formed by connecting multiple support plates 12, 22, and 32 in the third direction Y, a combination of multiple conduction plates 11, 21, and 31 connected via connecting piece 11b and a single conduction plate 11, 21, and 31 can be provided.

[0096] Alternatively, the following structure can be adopted: relative to the component formed by connecting multiple conductive plates 11, 21, 31 in the third direction Y, a number of support plates 12, 22, 32 less than the number of conductive plates 11, 21, 31 can be provided. Alternatively, the following structure can be adopted: relative to the component formed by connecting multiple conductive plates 11, 21, 31 in the third direction Y, a combination of multiple support plates 12, 22, 32 connected in the third direction Y and a single support plate 12, 22, 32 can be provided.

[0097] The following describes embodiments in which spring components 1, 2, and 3 of the described embodiments are applied to other structures. For convenience, it will be referred to as "spring component 1" below, but any one of spring components 1, 2, and 3 can also be applied to the following embodiments. The second direction X, the third direction Y, and the first direction Z described in the described embodiments are also used in the following embodiments, and the relationship between the second direction X, the third direction Y, and the first direction Z and spring component 1 is the same as in the described embodiments.

[0098] (Example 1)

[0099] Reference Figures 10-14 This describes Embodiment 1, which applies the spring component 1 of the described embodiment to the connection terminal structure 40.

[0100] The connection terminal structure 40 is configured as a female terminal that can be electrically connected (conducted) to the terminal 45 described later, and includes a frame 41 and two spring components 1 in the embodiment described above.

[0101] The frame 41 includes a first frame member 42 and a second frame member 43 that form a U-shape in either direction when viewed along the second direction X. The first frame member 42 and the second frame member 43 have identical structures. The first frame member 42 includes a flat bottom wall portion 42a and side wall portions 42b, which are respectively connected to the two ends of the bottom wall portion 42a in the third direction Y and protrude along the first direction Z. Similarly, the second frame member 43 includes a flat bottom wall portion 43a and side wall portions 43b, which are respectively connected to the two ends of the bottom wall portion 43a in the third direction Y and protrude along the first direction Z. The first frame member 42 and the second frame member 43 are connected to each other in an orientation where their internal spaces face each other. That is, the two side wall portions 42b of the first frame member 42 contact the two side wall portions 43b of the second frame member 43, and a space is provided inside the frame 41. At least one of the two ends of the first frame member 42 and the second frame member 43 in the second direction X is open in the second direction X, and on this side, the internal space of the frame 41 communicates with the outside. The other end of the two ends of the first frame member 42 and the second frame member 43 in the second direction X may be open in the second direction X, or a wall portion (not shown) may be provided on this other side. Both the first frame member 42 and the second frame member 43 are formed of a conductive material. The material forming the first frame member 42 and the second frame member 43 is not particularly limited if it is a material that can conduct electricity, for example, metals such as copper and aluminum. The opposing side walls are in contact, thereby electrically connecting the first frame member 42 and the second frame member 43 of Embodiment 1.

[0102] Two spring components 1 are arranged inside the frame 41. In each spring component 1 of Embodiment 1, four conductive plates 11 are arranged side by side along the third direction Y, but the number of conductive plates 11 may be more than four. In addition, four support plates 12 are arranged side by side along the third direction Y, but the number of support plates 12 may be more than four. The two spring components 1 are arranged in the internal space of the frame 41 such that they are opposite to each other in the first direction Z, and their respective second abutment portions 14 are opposite to each other and in contact. When viewed along the first direction Z, the two spring components 1 are arranged overlapping each other (see reference). Figure 12 One of the two spring components 1 is housed within the internal space (inner side of the U-shape) of the first frame component 42, and its first abutting portion 13 is electrically connected to the inner surface (the surface opposite to the internal space) of the bottom wall portion 42a. The other spring component 1 is housed within the internal space (inner side of the U-shape) of the second frame component 43, and its first abutting portion 13 is electrically connected to the inner surface (the surface opposite to the internal space) of the bottom wall portion 43a. Figure 10 as well as Figure 11As shown, when the terminal 45 described later is not electrically connected to the connecting terminal structure 40, it can be a structure in which the second abutting portions 14 of the two spring components 1 are in contact with each other, or it can be a structure in which the second abutting portions 14 of the two spring components 1 are separated from each other.

[0103] like Figure 13 as well as Figure 14 As shown, the connection terminal structure 40 of Embodiment 1 is configured to allow a plate-shaped terminal 45 to be disposed between two spring members 1. The terminal 45 is configured as an external terminal that can be inserted between the two spring members 1, and is formed into a rectangular plate shape using a conductive material such as copper or aluminum. Furthermore, the shape of the terminal 45 is not limited to a rectangular plate shape, but may also be a comb-shaped component consisting of multiple columnar or rod-shaped components arranged along a third direction Y or extending along a second direction X. The terminal 45 may also have a structure in which a conductive layer is provided on the outer surface of a component formed of an insulating material, for example, by electroplating. The structure of the terminal 45 in Embodiment 1 is as follows: one side of the terminal in the first direction Z is electrically connected to the other side of the terminal.

[0104] The sum of the thicknesses of the two spring members 1 in the first direction Z and the thickness of the terminal 45 in the first direction Z when no load is applied is greater than the size of the internal space of the frame 41 in the first direction Z (i.e., the distance in the first direction Z between the inner surfaces of the bottom wall portion 42a and the bottom wall portion 43a). Therefore, with the terminal 45 positioned between the two spring members 1, the two spring members 1 are compressed and deformed, and a pushing force based on this compression is applied to the terminal 45 and the frame 41 (the first frame member 42 and the second frame member 43).

[0105] Reference Figures 10-14 The order in which terminal 45 is electrically connected to connection terminal structure 40 will be explained.

[0106] Make terminal 45 relative to the uninserted Figures 10-12 The terminal structure 40 of the terminal 45 shown moves along the second direction X toward the second abutment portion 14 of the two spring members 1. Since the two spring members 1 are bent or flexed in a manner that protrudes relative to each other, if the moving terminal 45 abuts against the curved or inclined surfaces of the two spring members 1 and moves along the second direction X, the two spring members 1 are subjected to forces in mutually distancing directions from the terminal 45, and the two contacting second abutment portions 14 separate. If the distance between the two second abutment portions 14 in the first direction Z is greater than or equal to the thickness of the terminal 45 in the first direction Z, the terminal 45 is inserted between the two spring members 1, and the two second abutment portions 14 abut against the front and back sides of the middle portion of the terminal 45 in the second direction X (the portion of the terminal 45 other than the two ends in the second direction X), respectively.

[0107] As described above, since the first abutting portion 13 of one of the two spring components 1 is electrically connected to the inner surface of the bottom wall portion 42a, and the first abutting portion 13 of the other spring component 1 is electrically connected to the inner surface of the bottom wall portion 43a, the first frame component 42, the conductive plate 11 of one spring component 1, and one side of the terminal 45 are electrically connected, and the second frame component 43, the conductive plate 11 of the other spring component 1, and the other side of the terminal 45 are electrically connected. Furthermore, since the first frame component 42 and the second frame component 43 of Embodiment 1 are electrically connected to each other, and the terminal 45 is structured such that one side of the terminal in the first direction Z is electrically connected to the other side, when the terminal 45 is inserted into the connecting terminal structure 40, the first frame component 42, the second frame component 43, the two spring components 1, and the terminal 45 are electrically connected. Thus, the electrical connection between the connecting terminal structure 40 and the terminal 45 is completed.

[0108] As described in the above embodiment, in invention 1, since the conductive plate 11 and the support plate 12 are separately constructed, the conductive plate 11 can ensure the required electrical conductivity (or the required electrical conductivity and thermal conductivity), and the support plate 12 can achieve appropriate elastic force and pushing force. Therefore, the support plate 12 can provide appropriate elastic force and pushing force adapted to the mechanical strength of the terminal 45. Even if vibration is applied while the terminal structure 40 and the terminal 45 are connected, and the relative position or orientation of the terminal 45 relative to the terminal structure 40 is slightly changed, excessive force can be prevented on the terminal 45, and damage to the terminal 45 can be suppressed. Furthermore, even when the electrical connection between the terminal structure 40 and the terminal 45 is maintained, a structure that, for example, changes the relative position of the two in the second direction X (e.g., in the case of a robot joint) can similarly prevent excessive force from being applied to the terminal 45 and suppress damage to the terminal 45.

[0109] To disengage the electrical connection between the connecting terminal structure 40 and the terminal 45, the terminal 45 is moved along the second direction X to separate from the connecting terminal structure 40 and to disengage the terminal 45 from between the two spring members 1. As a result, the second abutment portion 14 separates from the terminal 45, and the electrical connection between the connecting terminal structure 40 and the terminal 45 is disengaged.

[0110] In addition, the following structure can also be applied to Embodiment 1.

[0111] In the first embodiment, the first frame component 42 and the second frame component 43 of the frame 41 are separately constructed, but the first frame component 42 and the second frame component 43 can also be integrally constructed.

[0112] In the first embodiment, the structure may also be as follows: one of the first frame member 42 and the second frame member 43 does not have a side wall portion, and the bottom wall portion of the first frame member 42 and the second frame member 43 is connected to the other side wall portion of the first frame member 42 and the second frame member 43.

[0113] In the first embodiment, it can also be configured as a connection terminal mechanism having a connection terminal structure 40 and a terminal 45.

[0114] In Embodiment 1, certain fixing structures for fixing the spring component 1 to the frame 41 can also be used. Examples of fixing structures include brazing, welding, bonding, screws, and other fastening structures.

[0115] In embodiment 1, two spring components 1 are provided inside the frame 41, but only one spring component 1 may be provided inside the frame 41. Alternatively, the structure could be as follows: for example, if one spring component 1 contacts the inner surface of the bottom wall portion 42a with its first abutment portion 13, and is housed inside the first frame component 42 without being located on the side of the second frame component 43, and the terminal 45 is inserted into the connecting terminal structure 40, then the first frame component 42, the conductive plate 11 of the spring component 1, and one side of the terminal 45 are electrically connected, and the second frame component 43 and the other side of the terminal 45 are electrically connected. That is, the structure could also be as follows: the inner surface of the bottom wall portion 43a is electrically connected to the other side of the terminal 45.

[0116] In the case where only one spring component 1 is provided inside the frame 41, that is, disposed inside the first frame component 42, the second frame component 43 that directly contacts the terminal 45 can also be formed by an electrically insulating material such as resin (hereinafter referred to as insulating material only).

[0117] In Embodiment 1, the purpose is to establish an electrical connection between the connecting terminal structure 40 and the terminal 45. However, along with or instead of this purpose, it could also be to ensure thermal conductivity between the connecting terminal structure 40 and the terminal 45, for example, to dissipate heat from one of the connecting terminal structure 40 and the terminal 45 through the other. As a structure that simultaneously achieves conductivity and thermal conductivity, for example, one side of the terminal 45 in the first direction Z is formed of a conductive material, and the other side is formed of an insulating material. When the terminal 45 is inserted into the connecting terminal structure 40, the first frame member 42, the conductive plate 11 of one of the spring members 1, and one side of the terminal 45 are electrically connected. However, it could also be a structure where the second frame member 43, the conductive plate 11 of the other spring member 1, and the other side of the terminal 45 are not necessarily electrically connected, but connected in a way that ensures thermal conductivity, and the heat from the terminal 45 is dissipated to the second frame member 43 side through the other spring member 1. Sometimes heat is generated through the conductivity of the first frame member 42, the conductive plate 11 of one of the spring members 1, and one side of the terminal 45. However, it is also possible to dissipate this heat to the side of the second frame member 43. Furthermore, in this case, the second frame member 43 and the conductive plate 11 of the other spring member 1 can be formed of insulating material, or the first frame member 42 and the second frame member 43 can be electrically insulated. To electrically insulate the first frame member 42 and the second frame member 43, insulating material can be sandwiched between them, or they can be separated. When the second frame member 43 is used as the heat dissipation side, a cooling structure can be provided on the second frame member 43, for example. Examples of cooling structures include radiators and structures utilizing cooling pipes for circulating cooling fluid.

[0118] In Embodiment 1, the structure is such that one side of the terminal 45 in the first direction Z is electrically connected to the other side. However, although one side of the terminal 45 in the first direction Z and the other side are each formed of a conductive material, it is also possible for their surfaces to be insulated from each other, and for the first frame member 42 and the second frame member 43 to be insulated from each other. To make one side of the terminal 45 insulated from the other side, a structure in which two conductive materials are sandwiched with an insulating material can be used, for example, formed by electroplating. In this case, if the terminal 45 is inserted into the connecting terminal structure 40, the first frame member 42, the conductive plate 11 of one of the spring members 1, and one side of the terminal 45, which constitute the first system, are electrically connected, and the second frame member 43, the conductive plate 11 of the other spring member 1, and the other side of the terminal 45, which constitute the second system, are electrically connected, but the first and second systems are insulated from each other, and the electrical connection between the two systems can be ensured.

[0119] In embodiment 1, terminal 45 is moved along the second direction X and inserted between the two spring members 1 of the connecting terminal structure 40. However, it is also possible to move terminal 45 along the third direction Y and insert it between the two spring members 1. In this case, the positions of sidewall portions 42b and 43b can be appropriately changed to allow insertion of terminal 45. Furthermore, the second abutment portions 14 of the two spring members 1 are in contact with each other before insertion of terminal 45, but a structure suitable for inserting terminal 45 along the third direction Y can also be used. For example, it is also possible to have a protrusion (not shown) provided on the end face of terminal 45, which allows insertion into... Figure 11 In the space S adjacent to the second contact portion 14 in the second direction X, if the terminal 45 is moved toward the connecting terminal structure 40 in the third direction Y, the protrusion is first inserted into the space S, and the terminal 45 is moved so that the two spring members 1 can be pushed apart by the protrusion, and the terminal 45 is inserted between the two spring members 1. Alternatively, a plate-shaped member (hereinafter referred to as an insulating plate) of insulating material having the same thickness as the terminal 45 in the first direction Z can be pre-positioned between the two spring members 1, and the terminal 45 is moved toward the connecting terminal structure 40 in the third direction Y and the insulating plate is pressed to move it, and the terminal 45 is positioned in place of the insulating plate, and the connecting terminal structure 40 is electrically connected to the terminal 45. When using the insulating plate, when the terminal 45 is disengaged from the connecting terminal structure 40, a mechanism can be provided to return the insulating plate between the two spring members 1.

[0120] (A variation of Example 1)

[0121] The following describes a variation of Embodiment 1.

[0122] In embodiment 1, the aim is to ensure electrical connection (or electrical connection and heat transfer) between the connection terminal structure 40 and the terminal 45, but it is also possible to utilize... Figures 10-14 Following a similar structure, the connection terminal structure 40 will be utilized, for example, like a switch.

[0123] In this case, the first frame member 42 and the second frame member 43 are electrically insulated from each other. For example, an insulating material can be provided between the first frame member 42 and the second frame member 43, or the first frame member 42 and the second frame member 43 can be separated from each other. The sum of the thicknesses of the two spring members 1 in the first direction Z when no load is applied is greater than the size of the internal space of the frame 41 in the first direction Z. Therefore, even if the terminal 45 is not arranged between the two spring members 1, the two spring members 1 are compressed and deformed, and the pushing force based on this compression is applied to the first frame member 42 and the second frame member 43. In addition, the second abutment portions 14 of the two spring members 1 are in contact with each other. Since the first frame member 42, the second frame member 43, and the conductive plates 11 of the two spring members 1 are formed of conductive material, the first frame member 42, the conductive plate 11 of one spring member 1, the conductive plate 11 of the other spring member 1, and the second frame member 43 are electrically connected when the terminal 45 is arranged between the two spring members 1.

[0124] In this modified example, the terminal 45 is structured such that at least one side of the terminal in the first direction Z is electrically insulated from the other side. To achieve this structure, the entire terminal 45 can be formed of an insulating material, or the insulating material can be placed in between, thereby electrically insulating the surface of the terminal 45 in the first direction Z from the other side. In the latter case, at least one surface of the terminal 45 in the first direction Z can also be formed of a conductive material.

[0125] In this structure, with terminal 45 not inserted into the connecting terminal structure 40, as described above, the first frame member 42, the conductive plate 11 of one spring member 1, the conductive plate 11 of the other spring member 1, and the second frame member 43 are electrically connected. That is, it is in the "on" state as a switch.

[0126] On the other hand, if terminal 45 is inserted between the two spring members 1 of the connecting terminal structure 40, the surface of terminal 45 on one side in the first direction Z is electrically insulated from the surface on the other side. Therefore, the second contact portion 14 between the two spring members 1 is electrically disconnected, and the electrical connection from the first frame member 42 to the second frame member 43 via the two spring members 1 is released. That is, it becomes "off" as a switch. In this way, the connecting terminal structure 40 can function like a switch using terminal 45.

[0127] (Example 2)

[0128] Reference Figure 15 This illustrates Embodiment 2, which applies the spring component 1 of the described embodiment to the heat dissipation structure 50.

[0129] The heat dissipation structure 50 is a structure for dissipating heat from the semiconductor device D, and includes the spring member 1 of the embodiment described above, and a heat sink 51 connected to the spring member 1.

[0130] Semiconductor device D is a structure in which a semiconductor element is encapsulated in an insulating material such as resin. For example, it has a power semiconductor and can generate heat together with the operation of the power module.

[0131] The heat sink 51 is a component used to effectively dissipate heat from the semiconductor device D, and has, for example, a comb-like shape. The material constituting the heat sink 51 is not particularly limited as long as it can effectively dissipate heat, and examples include metals such as aluminum and copper.

[0132] Spring component 1 is positioned between semiconductor device D and heat sink 51. For example... Figure 15 As shown, the spring member 1 is arranged to protrude toward the heat sink 51, and the first abutment portion 13 contacts the semiconductor device D, while the second abutment portion 14 contacts the heat sink 51. Alternatively, the spring member 1 may also be arranged to protrude toward the semiconductor device D. In Embodiment 2, the conductive plate 11 of the spring member 1 only needs to have a thermal conductivity suitable for heat dissipation. Multiple spring members 1 may also be arranged between the semiconductor device D and the heat sink 51.

[0133] Alternatively, the structure could be as follows: The connection between the semiconductor device D and the heat sink 51 via the spring member 1 is not particularly limited. The weight of the semiconductor device D (or heat sink 51) compresses the spring member 1, applying repulsive force to both the semiconductor device D and the heat sink 51, thus ensuring the connection between the semiconductor device D and the first abutment portion 13, and the connection between the second abutment portion 14 and the heat sink 51. Furthermore, to maintain the compression spring member 1 between the semiconductor device D and the heat sink 51 in a compressed state, fastening members such as screws can be used to fasten the semiconductor device D and the heat sink 51 together. When using a screw, the screw can be screwed into the heat sink 51 and can be relatively movable through a through hole provided in the semiconductor device D, with the head of the screw located on the opposite side of the heat sink 51 across the semiconductor device D. Alternatively, a through hole extending along the first direction Z can be provided in the spring member 1, and the screw can be inserted through this through hole. Furthermore, only one screw member can be used, or multiple screw members can be used. Alternatively, instead of directly connecting the screw component to the semiconductor device D, the semiconductor device D can be placed on, for example, a plate-shaped retaining component, and the screw component can be used to fasten the retaining component to the heat sink 51. In order to hold the spring component 1 in a compressed state between the semiconductor device D and the heat sink 51, in addition to the screw component, a U-shaped component, a clamping component, or the like that can hold the semiconductor device D and the heat sink 51 together can also be used.

[0134] The surface of the heat sink 51 on the spring member 1 side is formed as a plane, so that the heat sink 51 can be connected to the second abutment portion 14 (or the first abutment portion 13) in a manner that allows heat transfer even at any position on this surface, in the second direction X and the third direction Y. The comb-like shape of the heat sink 51 is provided on the side opposite to the spring member 1. On the other hand, in order to efficiently release heat from the semiconductor element (e.g., a power semiconductor) that generates a large amount of heat in the semiconductor device D, the first abutment portion 13 (or the second abutment portion 14) of the spring member 1 can also be arranged to be in close contact with the semiconductor element in the semiconductor device D.

[0135] As described above, since the conductive plate 11 and the support plate 12 are separately constructed in the spring component 1 of the above embodiment, after ensuring appropriate elastic force and pushing force with the support plate 12, the required thermal conductivity can be easily and appropriately ensured with the conductive plate 11. Therefore, according to this modified example 2, heat dissipation of the semiconductor device D can be performed more effectively and appropriately than before.

[0136] Furthermore, without departing from the purpose of this invention, the structural elements of the embodiments can be appropriately converted into known structural elements. In addition, the embodiments, examples and variations described can be appropriately combined.

[0137] Explanation of reference numerals in the attached figures:

[0138] 1, 2, 3: Spring components

[0139] 11, 21, 31: Conducting plate

[0140] 12, 22, 32: Support plates

[0141] 13: First contact point

[0142] 14: Second contact section

[0143] 15: Third landing section

[0144] 16, 26: Through holes

[0145] W1: First pushed body

[0146] W2: Second pushed body

[0147] X: Second direction

[0148] Y: Third-party direction

[0149] Z: First direction

Claims

1. A spring member disposed between first and second bodies to be urged in opposition to each other in a first direction and in a state of urging the first and second bodies to be urged in a direction away from each other in the first direction, characterized by: the spring member having a conductor plate and a support plate, the conductor plate being formed of a material having at least one of electrical and thermal conductivity higher than a material forming the support plate, the support plate being formed of a material having a Young's modulus higher than a material forming the conductor plate, the conductor plate and the support plate being respectively curved or bent with a middle portion in a second direction orthogonal to the first direction projecting toward the second body to be urged, the conductor plate having first abutting portions abutting against the first body to be urged formed at both end portions in the second direction and having a second abutting portion abutting against the second body to be urged formed at the middle portion in the second direction, the support plate having both end portions in the second direction of the conductor plate respectively clamped and having a third abutting portion abutting against the second abutting portion and sandwiching the second abutting portion between the second body to be urged in the first direction formed at the middle portion in the second direction, and at least both end portions in the second direction of either one of the conductor plate and the support plate having a through hole formed therein and both end portions in the second direction of the other one being movably inserted through the through hole.

2. The spring member according to claim 1, characterized in that: a size of the through hole in a third direction orthogonal to the first and second directions decreases toward the middle portion in the second direction.

3. The spring member according to claim 1 or 2, characterized in that: the conductor plate is elastically deformed, and the first and second abutting portions are pressed against the support plate in the first direction.

4. The spring member according to claim 1, characterized in that: the conductor plate is provided in plurality connected to each other in a third direction orthogonal to the first and second directions, and the conductor plates are integrally formed. provided with: the spring member according to any one of claims 1 to 4; and first and second bodies to be urged sandwiching the spring member, either one of the first and second bodies to be urged generating heat, the conductor plate abutting against at least a portion of each of the first and second bodies to be urged, and the spring member transferring the heat from one of the first and second bodies to be urged to the other via the conductor plate.

6. The heat dissipating structure according to claim 5, characterized in that: either one of the first and second bodies to be urged is a semiconductor device generating heat, and the other one is a heat sink. provided with: the spring member according to any one of claims 1 to 4; and a frame having an internal space in which the spring member is disposed, the conductor plate being capable of abutting against at least a portion of each of the first and second bodies to be urged. ​ ​ ​ ​ ​ ​ ​ 5. A heat dissipating structure characterized by comprising: ​ ​ ​ ​ ​ ​ ​ ​ 7. A connection terminal structure characterized by comprising: ​ ​ ​ ​ Either the first pushed body or the second pushed body is the inner side of the frame, and the other is disposed in the internal space.

8. The connection terminal structure according to claim 7, characterized in that, Two spring components are arranged in the internal space of the frame. Two spring components are arranged in the interior space of the frame such that they are opposite to each other in a first direction, the middle portions of their respective conductive plates in the second direction are opposite to each other, and the two ends of the conductive plates in the second direction abut against the inner surfaces of the frame that are opposite to each other in the first direction, forming the interior space. The internal space is configured such that at least one of its two ends in the second direction is open, and a terminal can be inserted through this open portion between the middle portions of the conductive plates of the two spring components in the second direction. One of the two pushed-down bodies is the inner side of the frame, and the other is the inserted terminal.

9. The connection terminal structure according to claim 7 or 8, characterized in that, The frame has two frame components that form a U-shape in either direction when viewed along the second direction. A cooling structure is provided on either side of the frame component.

Images