Chip scheduling and allocation system and method

Abstract

The present invention belongs to the field of wafer processing technology, and specifically relates to a wafer scheduling and distribution system and method. In the present invention, a glue sprayer performs glue spraying on wafers and submits wafer fixture demand information to a dispenser. The dispenser control center controls a robotic arm to locate a fixture basket containing a wafer fixture corresponding to the fixture ID within the operating range based on the demand information sent by the glue sprayer. Based on the previously known layer position of the wafer fixture in the fixture basket, the robotic arm is controlled to find the corresponding fixture basket, remove the wafer fixture from the fixture basket, and transfer it to a transportation system. The robotic arm is equipped with an identification device capable of recognizing the unique identification code of the fixture basket. The transportation system transports the wafer fixture to the glue sprayer that provided the demand information. Thus, the dispenser, glue sprayer, server, transportation system, and storage machine are combined to realize an automated and flexible production line, which can automatically achieve multi-task simultaneous production.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic product processing, and in particular relates to a chip scheduling and distribution system and method. Background Art

[0002] With the development of technology, today's electronic components are very small. When processing electronic components, the efficiency of component distribution determines the production cost of the product.

[0003] The crystal oscillator is one of the core key components of electronic products. It provides the benchmark operating frequency for electronic products. The components of the crystal oscillator mainly include the ceramic base, the chip and the cover. The production process is simply to place the chip on the ceramic substrate and then cover it with a cover. The specific production process involves the following steps: spraying glue - loading the chip - testing - covering - sealing.

[0004] For example, a glue spraying workshop houses several glue sprayers, each capable of producing products of different specifications. In this case, the efficiency with which wafer materials are allocated to each glue sprayer determines the final production cost. Traditionally, wafers of the same specification have been manually collected and stored in a wafer storage library, and the glue sprayer operating parameters have been manually set. This method relies on manual wafer allocation and glue sprayer parameter settings, which are inherently error-prone and inefficient.

[0005] To this end, the present invention proposes a wafer scheduling and distribution system and method, which can automatically select corresponding specification wafers according to the needs of the glue spraying machine and automatically distribute them to the corresponding glue spraying machine, greatly improving work efficiency. Summary of the Invention

[0006] In order to overcome the problems in the prior art, the present invention provides a wafer scheduling and allocation system, method, device and storage medium.

[0007] In a first aspect, the present invention provides a wafer scheduling and distribution system, comprising a distribution machine, a server, a transportation system, and a plurality of glue sprayers;

[0008] The server stores process IDs and task IDs, each process ID corresponds to a set of working parameters of the glue spraying machine, and each task ID is bound to a corresponding process ID and fixture ID;

[0009] The glue sprayer is used to perform specific processing on the wafer. After obtaining the task ID from the outside, the glue sprayer reads the fixture ID bound to the task ID from the server and submits the demand information to the dispenser, wherein the demand information includes the fixture ID.

[0010] The dispenser includes a plurality of fixture baskets, a robotic arm, and a control center. The fixture basket is located within the operating range of the robotic arm and is provided with a unique basket identification code. The fixture basket is used to store wafer fixtures in layers, and the wafer fixtures are used to store a plurality of wafers. The robotic arm is provided with a gripping mechanism and an identification device, the identification device is used to identify the basket identification code, and the gripping mechanism is used to grip the wafer fixtures. The wafer fixtures are pre-bound to the fixture basket. The control center controls the movement of the robotic arm, searches for the corresponding wafer fixture, and uses the gripping mechanism to remove the required wafer fixture from the corresponding fixture basket and transfer it to the transportation system.

[0011] The transport system is used to transport the wafer fixture to the glue sprayer that provides the required information. The transport system includes a receiving mechanism arranged next to the glue sprayer and a conveying track connecting the dispenser and the glue sprayer. The receiving mechanism is used to identify the fixture ID of the wafer fixture and grab the wafer fixture from the conveying track and hand it over to the corresponding glue sprayer.

[0012] The server is communicatively connected to the dispensing machine, the transportation system, and the glue spraying machine, and the glue spraying machine is communicatively connected to the dispensing machine.

[0013] A plurality of horizontal support plates are arranged from top to bottom in the fixture basket, and a slot is formed between two adjacent horizontal support plates, and the slot is used to store the wafer fixture.

[0014] Furthermore, a plurality of horizontal support plates are arranged from top to bottom in the fixture basket, and a slot is formed between two adjacent horizontal support plates for storing wafers.

[0015] Furthermore, the system also includes a storage machine, which is arranged at the end of the transportation system and is used to detect whether a chip fixture is transported to the end of the transportation system; identify the fixture ID of the chip fixture and grab and collect the chip fixture transported to the end of the transportation system into a specific fixture basket, and bind the association relationship between the chip fixture and the fixture basket, and transmit the association relationship to the server for recording.

[0016] In a second aspect, the present invention further provides a wafer scheduling and allocation method, comprising the following steps:

[0017] Step 1. The server pre-stores process IDs and task IDs. Each process ID corresponds to a set of working parameters of the glue sprayer. Each task ID is bound to a corresponding process ID and fixture ID. The server also pre-binds the relationship between the wafer fixture and the fixture basket. Each fixture basket has a unique basket identification code.

[0018] Step 2. The glue dispenser obtains a task ID from the outside world and the process ID and fixture ID corresponding to the task ID from the server. The glue dispenser searches the server for the corresponding process parameters based on the process ID, adjusts its own processing parameters, and submits the wafer fixture request information, including the fixture ID, to the dispenser control center via communication technology.

[0019] Step 3. Based on the fixture ID and the association between the wafer fixture and fixture basket stored in the server, the dispatcher control center controls the robot arm to locate the corresponding fixture basket and locate the layer where the wafer fixture is located. The robot then uses the gripper mechanism to grab the wafer fixture from the corresponding layer in the fixture basket, transfer it to the transport system, and send a "dispatch" signal to the server.

[0020] Step 4. During transportation in the transportation system, the chip fixture passes through glue sprayer No. 1, glue sprayer No. 2, and glue sprayer No. n in sequence. When passing the loading position of the glue sprayer, the receiving mechanism reads the fixture ID on the chip fixture and determines whether it is the same as the fixture ID in the chip fixture demand information it has sent. If they are not the same, it is not what it needs, and the receiving mechanism does not perform the grasping action; if they are the same, it is the chip fixture it needs, and the receiving mechanism takes out the chip fixture from the transportation system and sends a "wafer fixture received" message to the server. The server marks the corresponding demand information as processed.

[0021] Furthermore, step 4 also includes the following steps: step 4 also includes the following steps: the storage machine detects that a chip fixture is transported to the end of the transportation system, that is, a chip fixture has passed through all the glue sprayers without being grabbed, then the storage machine sends a "chip fixture that has not been received" message to the server, and the server sends a "delivery failure" message to the outside world.

[0022] Furthermore, the method also includes step 5. The storage machine identifies the fixture ID of the chip fixture transported to the end of the transportation system, grabs and collects it into a specific fixture basket, and sends binding information of the chip fixture and the fixture basket to the server, wherein the binding information includes the basket identification code, the fixture ID and the specific layer position where the chip fixture is stored in the fixture basket.

[0023] Furthermore, the step 3 also includes: when there are multiple wafer fixtures that meet the task in a single fixture basket, based on the principle of shipping from bottom to top, the wafer fixtures on the lower layer are taken first.

[0024] Furthermore, the step 3 also includes: when the required wafer fixtures are present in multiple fixture baskets, based on the principle of emptying the fixture baskets first, taking the wafer fixtures from the fixture basket that stores the least wafer fixtures.

[0025] In a third aspect, the present invention also provides a chip scheduling and allocation device, which includes: a processor, a memory, and a program; the program is stored in the memory, and the processor calls the program stored in the memory to execute a chip scheduling and allocation method described in any scheme in the second aspect.

[0026] In a fourth aspect, the present invention further provides a computer-readable storage medium, which includes a stored computer program, wherein when the computer program is executed by a processor, the device where the storage medium is located is controlled to execute the chip scheduling allocation method described in any one of the schemes in the second aspect.

[0027] Compared with the prior art, the present invention has the following technical effects:

[0028] In the present invention, the glue sprayer performs specific glue spraying on the wafer, and the glue sprayer reads the task ID that needs to be processed next from the outside world, which can be manually entered into the task ID to be processed next, or automatically assigned by the server, etc. In the server, the task ID is bound to the required fixture ID, and the glue sprayer submits the wafer fixture demand information to the dispenser, and this demand information includes the fixture ID; the dispenser control center controls the robot arm to find the fixture basket where the wafer fixture corresponding to the fixture ID is located within the operating range according to the demand information sent by the glue sprayer, and based on the layer position of the wafer fixture in the fixture basket known in advance, controls the robot arm to find the corresponding fixture basket, and takes the wafer fixture out of the fixture basket and hands it over to the transportation system, and at the same time releases the binding relationship between the fixture ID and the fixture basket in the server; the robot arm has a function that can identify the fixture ID The unique basket identification device, such as a camera, knows the height of each layer of the fixture basket, so the robot arm can be positioned at the corresponding layer by controlling its lifting height. The transport system transports the wafer fixture to the glue dispenser that provides the requested information. The transport system also includes a material receiving mechanism that identifies the fixture ID of the wafer fixture and grabs the wafer fixture from the conveyor track and transfers it to the corresponding glue dispenser. The storage machine detects whether a wafer fixture has passed through all the glue dispensers and is transported to the end of the transport system, indicating that the delivery has failed. It then identifies the fixture ID of the wafer fixture and grabs the wafer fixture that has been transported to the end of the transport system and collects it into a specific fixture basket. The fixture ID of the wafer fixture and its layer position within the fixture basket are recorded, and the fixture ID, basket identification code, and layer position are transmitted to the server for recording and binding. Thus, the distribution machine, glue dispenser, server, transport system, and storage machine are combined to form an automated and flexible production line, which can automatically achieve multi-tasking and simultaneous production. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions and advantages of the embodiments of the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the prior art descriptions. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0030] Figure 1 Schematic diagram of the structure of the system of the present invention;

[0031] Figure 2 It is a structural schematic diagram of the clamp basket of the present invention;

[0032] Figure 3 It is a structural schematic diagram of the positioning base of the present invention;

[0033] Figure 4 Schematic diagram of the wafer scheduling process of the present invention.

[0034] In the accompanying drawings, the component names represented by the reference numerals are listed as follows:

[0035] 1. Box body; 101. Left side panel; 102. Right side panel; 103. Back panel; 104. Top panel; 105. Bottom panel; 201. Oblong positioning hole; 202. Circular positioning hole; 3. Positioning base; 301. First positioning pin; 302. Second positioning pin; 4. Basket identification code; 5. Handle; 6. Robotic arm; 7. Horizontal support plate. DETAILED DESCRIPTION

[0036] To further illustrate the technical means and effects employed by the present invention to achieve its intended purpose, the following, in conjunction with the accompanying drawings and preferred embodiments, describes in detail the specific implementations, structures, features, and effects of the technical solutions proposed by the present invention. Specific features, structures, or characteristics in one or more embodiments may be combined in any suitable manner. Unless otherwise defined, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present invention pertains.

[0037] In one embodiment of the present invention, a wafer scheduling and distribution system is provided, including a distribution machine, a server, a transportation system and several glue sprayers; the server is communicatively connected to the distribution machine, the transportation system and the glue sprayers, and the glue sprayers are communicatively connected to the distribution machine.

[0038] The server stores process IDs and task IDs. Each process ID corresponds to a set of operating parameters for the glue dispenser, which in turn corresponds to the processing parameters for a specific product specification. Each task ID is associated with a corresponding process ID and fixture ID. For example, Task A corresponds to Process A and Fixture A, meaning the glue dispenser adjusts its operating parameters (number of glue points, spacing between adjacent points, quantity of glue sprayed, size of glue sprayed, etc.) according to the processing parameters recorded in Process A. Wafer Fixture A stores the wafers of the specifications required for Task A. The fixture basket in which Fixture A is stored and its location within the fixture basket are pre-assigned and stored on the server.

[0039] The staff enters a new processing task into the glue sprayer, that is, specifies the task ID of the next task to be done. In the system, the task ID is bound to the corresponding process ID and fixture ID. Based on the process ID, the glue sprayer goes to the server to query the specific process parameters, that is, the configuration parameters, adjusts its own working parameters, and submits the chip fixture demand information to the distribution machine at the same time. The chip fixture demand information includes the fixture ID bound to the task ID.

[0040] Indicative, such as Figure 1 As shown, the dispenser includes nine fixture baskets, a robotic arm 6 and a control center (not shown in the figure). The fixture basket is set within the operating range of the robotic arm 6. The fixture basket is provided with a unique basket identification code for the robotic arm 6 to identify. The basket identification code can be a graphic code, a QR code or a bar code. The fixture basket is arranged in layers, each layer can store a wafer fixture, and each wafer fixture stores a number of wafers. Since the fixture ID and the fixture basket have been bound and stored in the server in advance, the robotic arm is provided with a camera for identifying the basket identification code. Therefore, the control center can know in which fixture basket this wafer fixture is located based on the fixture ID, and then control The robotic arm searches for the corresponding fixture basket by identifying the basket identification code, and the layer position where the chip fixture is placed in the fixture basket is also known in advance and stored in the server, and the height of each layer of the fixture basket is fixed and known. Therefore, after finding the fixture basket, the control center can move the robotic arm to a specific height from the reference plane, locate the layer height where the required chip fixture is located, and then take the required chip fixture out of the fixture basket and hand it over to the transportation system. At this time, since the chip fixture has been taken out of the fixture basket, the server releases the binding relationship between the chip fixture and the fixture basket, and the storage status of this fixture basket can be updated in real time.

[0041] The transportation system is used to transport the chip fixture to the glue sprayer that provides the demand information; the transportation system includes a conveyor track connecting the dispenser and the glue sprayer and a material receiving mechanism. The material receiving mechanism is located next to each glue sprayer. The material receiving mechanism can identify the fixture ID of the chip fixture and can grab the chip fixture from the conveyor track and hand it over to the corresponding glue sprayer.

[0042] More specifically, the fixture basket is arranged in layers, with each layer being used to store a wafer fixture; a number of horizontal support plates are arranged from top to bottom in the fixture basket, with slots formed between two adjacent horizontal support plates for storing wafer fixtures. Figure 2 In a specific embodiment, the fixture basket includes a housing 1, which is surrounded by a left side panel 101, a right side panel 102, a back panel 103, a top panel 104, and a bottom panel 105. The front of the housing 1 is open, and the bottom panel 105 of the housing 1 is provided with a positioning structure comprising an oblong positioning hole 201 and a circular positioning hole 202. A plurality of horizontal support plates 7 are symmetrically provided on the inner sidewalls of the left and right panels 101 and 102, and are arranged from top to bottom, with slots formed between adjacent horizontal support plates 7. The housing 1 is also provided with a basket identification code 4. In this embodiment, the basket identification code 4 is provided on the front of both the left and right panels 101 and 102, facilitating identification of the fixture basket by the robot arm 6 from both sides.

[0043] The dispensing machine includes a frame, which is arranged around the circumference of the robot arm. A positioning base is provided on the frame, and the positioning structure on the fixture basket is adapted to the positioning base on the frame. Figure 3 In this embodiment, the frame is provided with a positioning base 3, which is provided with a limiting structure adapted to the positioning structure. The limiting structure includes a first positioning pin 301 and a second positioning pin 302. The first positioning pin 301 is adapted to the shape of the oblong positioning hole 201, and the second positioning pin 302 is adapted to the size of the circular positioning hole 202. This allows the fixture basket to be assembled on the positioning base 3 in only one orientation.

[0044] In a specific embodiment, an induction switch is further provided on the positioning base 3, which can sense the signal that the clamp basket is placed in place. The induction switch can be a photoelectric switch, a micro switch, a magnetic induction switch, etc.

[0045] Reference Figure 2 In a specific embodiment, the basket identification code 4 is set in the middle position of the front side of the left side plate 101 and / or the right side plate 102. A handle 5 is provided on the top of the box body 1 to facilitate the movement of the clamp basket.

[0046] In this embodiment, the system also includes a storage machine, which is located at the end of the transportation system and is used to detect whether a chip fixture is transported to the end of the transportation system. The storage machine can identify the fixture ID of the chip fixture, and can grab and collect the chip fixture transported to the end of the transportation system into a specific fixture basket, record the layer position of the chip fixture in the fixture basket, and transmit the fixture ID, basket identification code, and layer position of the collected chip fixture in the fixture basket to the server for recording. The server binds the fixture ID, basket identification code, and layer position, and the storage information in the fixture basket is updated. When the fixture basket at the end of the transportation system is full, the fixture basket can be moved to the dispenser and become a fixture basket in the dispenser.

[0047] Based on the same inventive concept, embodiments of the present invention also provide a wafer scheduling and allocation method for implementing the aforementioned wafer scheduling and allocation system. The solution provided by this method is similar to the solution described in the aforementioned system. Therefore, the specific limitations of one or more system embodiments provided below can be found in the above-mentioned limitations of the wafer scheduling and allocation system and will not be further elaborated here.

[0048] Reference Figure 4 In another embodiment of the present invention, a wafer scheduling and allocation method is provided, comprising the following steps:

[0049] Step 1. The server pre-stores process IDs and task IDs. Each process ID corresponds to a set of working parameters of the glue sprayer. Each task ID is bound to a corresponding process ID and fixture ID. The server also pre-binds the relationship between the wafer fixture and the fixture basket. Each fixture basket has a unique fixture ID.

[0050] Step 2. The glue dispenser obtains the task ID from the server, and also obtains the process ID and fixture ID corresponding to the task ID from the server. The glue dispenser searches for process parameters based on the process ID, adjusts its own processing parameters, and submits wafer fixture request information, including the fixture ID, to the dispenser control center via communication technology.

[0051] Step 3. Based on the fixture ID and the association between the wafer fixture and fixture basket stored in the server, the dispatcher control center controls the robot arm to locate the fixture basket that stores the corresponding wafer fixture, locate the layer where the required wafer fixture is stored, and use the gripper mechanism to grab the wafer fixture from the corresponding layer in the fixture basket. It then transfers the wafer fixture to the transport system and sends a "dispatch" signal to the server.

[0052] When multiple wafers that meet the requirements are stored in a single fixture basket, the lower wafers are prioritized based on the bottom-up principle. Since wafers may rub against the fixture basket during removal, friction can generate contaminants that fall downward and easily contaminate the wafers stored below. Therefore, the bottom-up principle minimizes contamination.

[0053] When multiple holder baskets contain the required wafer holders, the holder basket with the fewest wafer holders is cleared first, allowing the holder basket to be cleared quickly and returned to the storage machine for a new storage job.

[0054] Step 4. During transportation in the transportation system, the chip fixture passes through glue sprayer No. 1, glue sprayer No. 2, and glue sprayer No. n in sequence. When passing the loading position of the glue sprayer, the receiving mechanism reads the fixture ID on the chip fixture to determine whether it is the same as the fixture ID in the chip fixture demand information it has sent. If they are not the same, it is not what it needs, and the receiving mechanism does not grab it. If they are the same, it is the chip fixture it needs, and the receiving mechanism takes out the chip fixture from the transportation system and sends a "wafer fixture received" message to the server. The server marks the corresponding demand information as processed. If the storage machine detects that a chip fixture has been transported to the end of the transportation system, that is, a chip fixture has passed through all the glue sprayers without being grabbed, the storage machine sends a "wafer fixture that has not been received" message to the server, and the server sends a "delivery failure" message to the outside world.

[0055] Step 5. The storage machine grabs the chip fixture transported to the end of the transportation system and collects it into a specific fixture basket, and sends the binding information of the chip fixture and the fixture basket to the server. The binding information includes the basket identification code, fixture ID and the specific layer position where the chip fixture is stored in the fixture basket.

[0056] In this way, the dispensing machine, glue sprayer, server, transportation system and storage machine are combined to realize an automated and flexible production line, which can automatically realize multi-task production at the same time, and can automatically carry out the distribution and binding of the chip fixture and the fixture basket.

[0057] It should be understood that, although the steps in the flowcharts of the above embodiments are shown in sequence as indicated by the arrows, these steps are not necessarily performed in the order indicated by the arrows. Unless otherwise specified in the present invention, there is no strict order restriction on the execution of these steps, and these steps can be performed in other orders. Moreover, at least a portion of the steps in the flowcharts of the above embodiments may include multiple steps or multiple stages, and these steps or stages are not necessarily performed at the same time, but can be performed at different times. The execution order of these steps or stages is not necessarily to be performed in sequence, but can be performed in turn or alternately with other steps or at least a portion of steps or stages in other steps.

[0058] In an embodiment of the present invention, a chip scheduling allocation device is also provided, which includes: a processor, a memory and a program; the program is stored in the memory, and the processor calls the program stored in the memory to execute the above-mentioned chip scheduling allocation method.

[0059] In the aforementioned implementation of the wafer scheduling and allocation device, the memory and processor are directly or indirectly electrically connected to enable data transmission or interaction. For example, these components may be electrically connected via one or more communication buses or signal lines, such as a bus connection. The memory stores computer-executable instructions for implementing the data access control method, including at least one software functional module that may be stored in the memory in the form of software or firmware. The processor executes various functional applications and data processing by running the software programs and modules stored in the memory.

[0060] The memory may be, but is not limited to, a random access memory (RAM), a read-only memory (ROM), a programmable read-only memory (PROM), an erasable read-only memory (PROM), or a programmable read-only memory (PROM).

[0061] Programmable Read-Only Memory (EPROM), Electrically Erasable Programmable Read-Only Memory (EEPROM), etc. The memory is used to store programs, and the processor executes the programs after receiving the execution instructions.

[0062] The processor can be an integrated circuit chip with signal processing capabilities. The processor can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc. It can implement or execute the methods, steps, and logic diagrams disclosed in the embodiments of the present invention. The general-purpose processor can be a microprocessor or any conventional processor.

[0063] In an embodiment of the present invention, a computer-readable storage medium is further provided. The computer-readable storage medium includes a stored computer program, wherein when the computer program is executed by a processor, the device where the storage medium is located is controlled to execute the above-mentioned chip scheduling allocation method.

[0064] Those skilled in the art will appreciate that embodiments of the present invention may be provided as methods, apparatus, or computer program products. Thus, embodiments of the present invention may take the form of entirely software embodiments or embodiments combining software and hardware aspects. Furthermore, embodiments of the present invention may take the form of a computer program product implemented on one or more computer-usable storage media containing computer-usable program code.

[0065] The embodiments of the present invention are described with reference to flowcharts and / or block diagrams of methods, systems, and computer program products according to the embodiments of the present invention. These computer program instructions may be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing terminal device to produce a machine, such that execution of the instructions by the processor of the computer or other programmable data processing terminal device produces means for implementing the functions specified in the flowcharts.

[0066] These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing terminal device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce a manufactured product including an instruction device that implements the functions specified in the flowchart.

[0067] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal device so that a series of operating steps are executed on the computer or other programmable terminal device to produce computer-implemented processing, whereby the instructions executed on the computer or other programmable terminal device provide steps for implementing the functions specified in the flowchart.

[0068] The above is a detailed introduction to the application of a chip scheduling and allocation system, a chip scheduling and allocation method, a chip scheduling and allocation device and a computer-readable storage medium provided by the present invention. Specific examples are used in the present invention to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; at the same time, for general technical personnel in this field, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present invention.

[0069] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention, and should all be included in the scope of protection of the present invention.

Claims

1. A wafer scheduling and allocation system, characterized in that: Including dispensing machines, servers, transportation systems and several glue spraying machines; The server stores process IDs and task IDs, each process ID corresponds to a set of working parameters of the glue spraying machine, and each task ID is bound to a corresponding process ID and fixture ID; The glue sprayer is used to perform specific processing on the wafer. The glue sprayer obtains the task ID, reads the fixture ID corresponding to the task ID from the server, and submits the demand information to the dispenser, wherein the demand information includes the fixture ID; The dispenser includes a plurality of fixture baskets, a robotic arm, and a control center. The fixture basket is located within the operating range of the robotic arm and is provided with a unique basket identification code. The fixture basket is used to store wafer fixtures in layers, and the wafer fixtures are used to store a plurality of wafers. The robotic arm is provided with a gripping mechanism and an identification device, the identification device is used to identify the basket identification code, and the gripping mechanism is used to grip the wafer fixtures. The wafer fixtures are pre-bound to the fixture basket. The control center controls the movement of the robotic arm, searches for the corresponding wafer fixture, and uses the gripping mechanism to remove the required wafer fixture from the corresponding fixture basket and transfer it to the transportation system. The transport system is used to transport the wafer fixture to the glue sprayer that provides the required information. The transport system includes a receiving mechanism arranged next to the glue sprayer and a conveying track connecting the dispenser and the glue sprayer. The receiving mechanism is used to identify the fixture ID of the wafer fixture and grab the wafer fixture from the conveying track and hand it over to the corresponding glue sprayer. The server is communicatively connected to the dispensing machine, the transportation system, and the glue spraying machine, and the glue spraying machine is communicatively connected to the dispensing machine.

2. The wafer scheduling and allocation system according to claim 1, characterized in that: A plurality of horizontal support plates are arranged from top to bottom in the fixture basket, and a slot is formed between two adjacent horizontal support plates, and the slot is used to store the wafer fixture.

3. The wafer scheduling and allocation system according to claim 1, wherein: The system also includes a storage machine, which is located at the end of the transportation system and is used to detect whether a chip fixture is transported to the end of the transportation system; identify the fixture ID of the chip fixture and grab the chip fixture transported to the end of the transportation system and collect it into a specific fixture basket, and bind the association relationship between the chip fixture and the fixture basket, and transmit the association relationship to the server for recording.

4. A wafer scheduling and allocation method according to any one of claims 1 to 3, characterized in that: The following steps are involved: Step 1. The server pre-stores process IDs and task IDs, each of which corresponds to a set of working parameters of the glue spraying machine, and each of which is bound to a corresponding process ID and fixture ID; The relationship between the wafer fixture and the fixture basket is pre-bound, and each fixture basket has a unique basket identification code; Step 2. The glue dispenser obtains a task ID from the outside world and the process ID and fixture ID corresponding to the task ID from the server. The glue dispenser searches the server for the corresponding process parameters based on the process ID, adjusts its own processing parameters, and submits the wafer fixture request information, including the fixture ID, to the dispenser control center via communication technology. Step 3. Based on the fixture ID and the association between the wafer fixture and fixture basket stored in the server, the dispatcher control center controls the robot arm to locate the corresponding fixture basket and locate the wafer fixture on the layer. The robot then uses the gripper mechanism to remove the wafer fixture from the corresponding layer in the fixture basket, transfers it to the transport system, and sends a "dispatch" signal to the server. Step 4. During transportation in the transportation system, the chip fixture passes through glue sprayer No. 1, glue sprayer No. 2, and finally glue sprayer No. n. When passing the loading position of the glue sprayer, the receiving mechanism reads the fixture ID on the chip fixture and determines whether it is the same as the fixture ID in the chip fixture demand information it has sent. If they are not the same, it is not what it needs, and the receiving mechanism does not perform the grasping action; if they are the same, it is the chip fixture it needs, and the receiving mechanism takes out the chip fixture from the transportation system and sends a "wafer fixture received" message to the server. The server marks the corresponding demand information as processed.

5. The wafer scheduling and allocation method according to claim 4, characterized in that: The step 4 also includes the following steps: when the storage machine detects that a wafer fixture has been delivered to the end of the transportation system, that is, the wafer fixture has not been grabbed by all the glue sprayers, the storage machine sends a "wafer fixture that has not been received" message to the server, and the server sends a "delivery failure" message to the outside world.

6. The wafer scheduling and allocation method according to claim 5, characterized in that: The method also includes step 5. The storage machine identifies the fixture ID of the chip fixture transported to the end of the transportation system, grabs and collects it into a specific fixture basket, and sends binding information of the chip fixture and the fixture basket to the server. The binding information includes the basket identification code, the fixture ID and the specific layer position where the chip fixture is stored in the fixture basket.

7. The wafer scheduling and allocation method according to claim 4, wherein: The step 3 also includes: when there are multiple wafer fixtures that meet the task in a single fixture basket, based on the principle of shipping from bottom to top, the wafer fixtures on the lower layer are taken first.

8. The wafer scheduling and allocation method according to claim 4, wherein: The step 3 further includes: when the required wafer fixtures are present in multiple fixture baskets, based on the principle of clearing the fixture baskets first, picking up the wafer fixtures from the fixture basket that stores the least wafer fixtures.

9. A wafer scheduling and allocation device, characterized in that: It includes: A processor, a memory, and a program; the program is stored in the memory, and the processor calls the program stored in the memory to execute the method according to any one of claims 4 to 8.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium includes a stored computer program, wherein when the computer program is executed by a processor, the device where the storage medium is located is controlled to execute the method according to any one of claims 4 to 8.

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