Waveform improvement method and ultrasonic transducer

Abstract

The present invention provides a waveform improvement method comprising providing a piezoelectric material connected to a matching material; creating a plurality of first grooves in one of at least one matching layer; filling the plurality of first grooves with an isolation material; and applying an input voltage to the piezoelectric material to cause the piezoelectric material to generate an ultrasonic signal. The piezoelectric material comprises at least one piezoelectric layer. The matching material comprises at least one matching layer. The matching material is configured to match the acoustic impedance of the piezoelectric material. The plurality of first grooves in the matching layer are configured to optimize the acoustic impedance and seismic isolation effect.

Description

Technical Field

[0001] The present invention relates to the field of ultrasonic transducer technology, and more particularly to a waveform improvement method and an ultrasonic transducer for optimizing acoustic impedance and vibration isolation effects by utilizing multiple grooves on a matching layer. Background Art

[0002] With the rapid advancement of medical technology, ultrasound detection technology is also becoming increasingly sophisticated. Generally speaking, ultrasound detection uses a probe that transmits ultrasound signals below the skin. Furthermore, the probe uses the reflected ultrasound signals to determine the shape and position of objects below the skin that are invisible to the naked eye, enabling various medical applications.

[0003] Traditional ultrasonic transducers transmit ultrasonic signals by using multiple piezoelectric devices to emit multiple beams of ultrasonic signals, each of which corresponds to a scan line. Furthermore, the ultrasonic transducer can receive the ultrasonic reflection signal corresponding to the scan line to perform image recognition and object detection. Generally speaking, in traditional ultrasonic transducers, the matching layer is made of a stack of corresponding materials. The acoustic impedance of the matching layer depends on its material properties. However, the acoustic impedance of traditional ultrasonic transducers is not optimized, and the vibration isolation effect is poor, so the ultrasonic signal will generate a high-energy ring-down pulse. Therefore, the ultrasonic waveform emitted by traditional ultrasonic transducers is not optimized, which also leads to a decrease in the resolution of ultrasonic images. Summary of the Invention

[0004] The purpose of the present invention is to provide a waveform improvement method and an ultrasonic transducer, which can improve the vibration isolation effect and enhance the resolution.

[0005] Based on the above objectives, the present invention proposes a waveform improvement method, which is characterized by comprising: providing a piezoelectric material connected to a matching material, wherein the piezoelectric material includes at least one piezoelectric layer, and the matching material includes at least one matching layer; generating a plurality of first grooves in one of the at least one matching layer; filling the plurality of first grooves with an isolation material; and providing an input voltage to the piezoelectric material to cause the piezoelectric material to generate an ultrasonic signal; wherein the matching material is used to match the acoustic impedance of the piezoelectric material, and the plurality of first grooves of the matching layer are used to optimize the acoustic impedance and seismic isolation effect.

[0006] Preferably, the method further comprises: generating a plurality of second grooves in the at least one piezoelectric layer; wherein the plurality of second grooves in the piezoelectric layer are arranged along one direction or two directions of two directions orthogonal to each other on the surface of the piezoelectric layer.

[0007] Preferably, the at least one matching layer includes a first matching layer and a second matching layer, the first matching layer is between the piezoelectric layer and the second matching layer, the second matching layer has the multiple first grooves, and the multiple first grooves of the second matching layer correspond to the multiple second grooves of the piezoelectric layer; or, the at least one matching layer includes a first matching layer and a second matching layer, the first matching layer is between the piezoelectric layer and the second matching layer, the first matching layer and the second matching layer have the multiple first grooves, and the multiple first grooves of the first matching layer and the second matching layer correspond to the multiple second grooves of the piezoelectric layer.

[0008] Preferably, the piezoelectric material is a piezoelectric ceramic material. When the piezoelectric material receives the ultrasonic signal, multiple charges with opposite polarities are generated on both sides of the piezoelectric ceramic material, and the multiple charges with opposite polarities pass through two conductive materials to generate an electrical signal.

[0009] Preferably, if voltages of opposite polarities are input to both sides of the piezoelectric ceramic material through the two conductive materials, the piezoelectric ceramic material performs acoustic impedance matching using the matching layer having the plurality of first grooves and generates the ultrasonic signal in a resonance manner.

[0010] Preferably, the depth of the plurality of first trenches of the matching layer does not exceed the thickness of the matching layer.

[0011] Preferably, when the piezoelectric material performs acoustic impedance matching using the matching layer having the plurality of first grooves and generates the ultrasonic signal in a resonance manner, the ringing pulse of the ultrasonic signal is reduced.

[0012] Preferably, the at least one matching layer is a linear matching layer, an arc-shaped matching layer, a circular matching layer, a multi-curvature matching layer, a spherical matching layer or a non-spherical matching layer.

[0013] Based on the above objectives, the present invention further provides an ultrasonic transducer comprising:

[0014] A housing for providing a storage space;

[0015] A piezoelectric material is placed in the accommodating space, and the piezoelectric material is used to generate and receive ultrasonic signals;

[0016] a matching material disposed in the accommodating space, the matching material being used to match the acoustic impedance of the piezoelectric material; and

[0017] Two conductive materials are coupled to the piezoelectric material, and the two conductive materials are used to output and input electrical signals;

[0018] The piezoelectric material includes at least one piezoelectric layer, and the matching material includes at least one matching layer. One of the at least one matching layer has a plurality of first grooves, and the plurality of first grooves are filled with an isolation material. When a voltage is input between the two conductive materials, the piezoelectric material generates the ultrasonic signal. The plurality of first grooves of the matching layer are used to optimize the acoustic impedance and the vibration isolation effect.

[0019] Preferably, the at least one matching layer includes a first matching layer and a second matching layer, the first matching layer is between the piezoelectric layer and the second matching layer, the second matching layer has a first surface and a second surface, wherein the first surface is connected to the first matching layer, and the plurality of first grooves are formed by cutting from the second surface in a direction perpendicular to the second surface.

[0020] Preferably, the cutting process does not cut through the second matching layer; or, the cutting process cuts through the second matching layer but does not cut through the first matching layer; or, the cutting process cuts through the second matching layer while cutting the first matching layer but does not cut through the first matching layer.

[0021] Preferably, the piezoelectric material includes a plurality of second grooves, and the plurality of first grooves are orthogonal to the plurality of second grooves; or, the piezoelectric material includes a plurality of second grooves, and the plurality of first grooves are aligned one by one with the plurality of second grooves.

[0022] The ultrasonic transducer and waveform improvement method proposed in the present invention include a piezoelectric material and a matching material. At least one matching layer in the matching material has multiple grooves. These grooves can match and optimize the acoustic impedance of the piezoelectric material. These grooves can also enhance the seismic isolation effect of each array element in the ultrasonic transducer. Furthermore, after the acoustic impedance is optimized, the amplitude of most ringing pulses and harmonics in the ultrasonic signal generated by the ultrasonic transducer can be reduced, thereby optimizing the generated ultrasonic signal waveform and improving imaging resolution. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 FIG. 4 is a structural diagram of an embodiment of an ultrasonic transducer of the present invention.

[0024] Figure 2 for Figure 1 Schematic diagram of a first structure of piezoelectric material and matching material in an ultrasonic transducer.

[0025] Figure 3 for Figure 1 Schematic diagram of the second structure of the piezoelectric material and the matching material in the ultrasonic transducer.

[0026] Figure 4 for Figure 1Schematic diagram of the third structure of piezoelectric material and matching material in the ultrasonic transducer.

[0027] Figure 5 for Figure 1 Schematic diagram of the ringing pulse of the ultrasonic signal in the ultrasonic transducer that improves the spectrum.

[0028] Figure 6 for Figure 1 Flowchart of a waveform improvement method for an ultrasonic transducer. DETAILED DESCRIPTION

[0029] In order to provide a further understanding of the purpose, structure, features, and functions of the present invention, the present invention is described in detail below with reference to the embodiments.

[0030] Figure 1 FIG1 is a structural diagram of an embodiment of the ultrasonic transducer 100 of the present invention. It is explained here that the ultrasonic transducer 100 can be a linear ultrasonic transducer, an arc-shaped ultrasonic transducer, a circular ultrasonic transducer, a multi-curvature ultrasonic transducer, a spherical ultrasonic transducer or a non-spherical ultrasonic transducer. The structure of the ultrasonic transducer 100 is not limited to Figure 1The ultrasonic transducer 100 may include a shell 10, a piezoelectric material 11, a matching material 12, a first conductive material 13, and a second conductive material 14. The shell 10 is used to provide a storage space and is not limited by a specific shape. The piezoelectric material 11 is placed in the shell 10 to receive and generate ultrasonic signals. The piezoelectric material 11 may be a piezoelectric crystal with a ceramic structure. In addition, the piezoelectric material 11 has a predetermined acoustic impedance, such as 40M Rate (density (g / cm3) / speed (m / s)). The first conductive material 13 and the second conductive material 14 are coupled to the piezoelectric material 11 to output / input electrical signals. In addition, the ultrasonic transducer 100 may further include a protective material 17 and a lens layer (not shown). The protective material 17 may be exposed, that is, the shell 10 may not cover the protective material 17. Any reasonable hardware changes to the ultrasonic transducer 100 fall within the scope disclosed by the present invention. In the ultrasonic transducer 100, the piezoelectric material may include at least one piezoelectric layer. The matching material 12 may include at least one matching layer. Furthermore, one of the at least one matching layer has a plurality of first grooves. Isolation material may be filled in the plurality of first grooves. The material of the isolation material is not limited; any liquid or solid material that provides a seismic isolation effect falls within the scope of application of the isolation material of the present invention. Filling may involve pressing an isolation material layer stacked above the matching layer into the plurality of first grooves using a thin tool, such as a cutter, or pouring the isolation material into the plurality of first grooves. The first conductive material 13 and the second conductive material 14 may be a flexible printed circuit (FPC), a flexible cable, or any other conductive device. When voltage is applied to the first conductive material 13 and the second conductive material 14, the piezoelectric material 11 undergoes elastic vibration, thereby generating an ultrasonic signal. In the ultrasonic transducer 100, the piezoelectric material 11 is adjacent to the matching material 12. The matching material 12 can be used to match the acoustic impedance of the piezoelectric material 11. In addition, the multiple first grooves of the matching layer can be used to optimize the acoustic impedance and enhance the seismic isolation effect. For example, as mentioned above, the piezoelectric material 11 may have an original acoustic impedance of 40M Rate. The matching material 12 may be a two-layer matching layer, having acoustic impedances of 7M Rate and 2M Rate respectively. However, after the first grooves are generated on the matching material 12, the acoustic impedance of the piezoelectric material 11 can be matched, such as changing the acoustic impedance of the piezoelectric material 11 from 40M Rate to 16M Rate. In addition, since the first grooves are generated on the matching material 12, the harmonic noise outside the receiving point of the ultrasonic signal can be isolated through the grooves, so the ringing pulse (Ring Down Pulse) of the ultrasonic signal in the spectrum can be reduced.

[0031] Figure 2FIG. 1 is a schematic diagram of a first structure of the piezoelectric material 11 and the matching material 12 in the ultrasonic transducer 100. Figure 2 As shown, the piezoelectric material 11 can generate a plurality of second grooves G11. The second grooves G11 of the piezoelectric layer of the piezoelectric material 11 can be arranged in one or both directions along the surface of the piezoelectric layer. Taking an ultrasonic transducer with a linear matching layer as an example, the second grooves G11 of the piezoelectric material 11 can be arranged along the surface of the piezoelectric layer and perpendicular to the long side, so as to divide the piezoelectric material 11 into a plurality of array elements. Figure 2 In the embodiment, the matching material 12 may include a first matching layer M1 and a second matching layer M2. The first matching layer M1 is between the piezoelectric material 11 and the second matching layer M2. The first matching layer M1 or the second matching layer M2 has a plurality of first grooves, and the plurality of first grooves of the first matching layer M1 or the second matching layer M2 correspond to the plurality of second grooves of the piezoelectric material 11. For example, Figure 2 As shown, the second matching layer M2 has a plurality of first grooves GM20. Furthermore, when the piezoelectric material 11 is divided into different array elements by vertically arranged second grooves G11, the plurality of first grooves GM20 of the second matching layer M2 can be orthogonal to the second grooves G11. In other words, the plurality of first grooves GM20 are arranged along the surface of the piezoelectric layer and parallel to the relatively long sides. The plurality of parallel first grooves GM20 allow the matching material 12 to be evenly spaced relative to each array element on the piezoelectric material 11, thereby enhancing the seismic isolation effect. In other words, each array element of the piezoelectric material 11 corresponds to the plurality of first grooves of the second matching layer M2, so the number and size of the first grooves corresponding to the array elements of the piezoelectric material 11 are consistent. Furthermore, the size, width, and depth of the plurality of first grooves of the matching material 12 mentioned above can be customized. The maximum depth of the first grooves of the matching material 12 cannot exceed the thickness of the matching material 12. In other words, the plurality of first grooves of the matching material 12 cannot physically cut the matching material 12 into at least two parts.

[0032] Figure 3 FIG. 1 is a schematic diagram of a second structure of the piezoelectric material 11 and the matching material 12 in the ultrasonic transducer 100. Figure 3 As shown, the piezoelectric material 11 can generate a plurality of second grooves G11. The second grooves G11 of the piezoelectric layer of the piezoelectric material 11 can be arranged in one or both directions along the surface of the piezoelectric layer. For example, the second grooves G11 of the piezoelectric material 11 can be arranged along the surface of the piezoelectric layer and perpendicular to the long side, so as to divide the piezoelectric material 11 into a plurality of array elements. Figure 3In the embodiment, the matching material 12 may include a first matching layer M1 and a second matching layer M2. The first matching layer M1 is between the piezoelectric material 11 and the second matching layer M2. The first matching layer M1 or the second matching layer M2 has a plurality of first grooves. For example, Figure 3 As shown, the second matching layer M2 has a plurality of first grooves GM21. The plurality of first grooves GM21 of the second matching layer M2 can be arranged in a checkerboard grid pattern. Moreover, the depth limit and function of the plurality of first grooves GM21 of the second matching layer M2 have been described above, so they will not be repeated here. Moreover, although Figure 2 as well as Figure 3 In the figure, the second matching layer M2 has first grooves GM20 and first grooves GM21. However, the ultrasonic transducer 100 of the present invention is not limited to this. For example, in other embodiments, only the first matching layer M1 of the ultrasonic transducer 100 may have first grooves. The first matching layer M1 and the second matching layer M2 of the ultrasonic transducer 100 may also have first grooves. Details are described below.

[0033] Figure 4 FIG. 1 is a schematic diagram of a third structure of the piezoelectric material 11 and the matching material 12 in the ultrasonic transducer 100. Similar to the aforementioned features. Figure 4 As shown, the piezoelectric material 11 can generate a plurality of second grooves G11. The second grooves G11 of the piezoelectric layer of the piezoelectric material 11 can be arranged in one or both of two directions orthogonal to each other on the surface of the piezoelectric layer. For example, the second grooves G11 of the piezoelectric material 11 can be arranged along the surface of the piezoelectric layer and perpendicular to the long side, so as to divide the piezoelectric material 11 into a plurality of array elements. Figure 4 In the embodiment, the matching material 12 may include a first matching layer M1 and a second matching layer M2. The first matching layer M1 is between the piezoelectric material 11 and the second matching layer M2. The first matching layer M1 and the second matching layer M2 have a plurality of first grooves. Figure 4As shown, the first matching layer M1 has a plurality of first grooves GM1. The second matching layer M2 has a plurality of first grooves GM22. The first grooves GM1 of the first matching layer M1 and the first grooves GM22 of the second matching layer M2 can be arranged along the surface of the piezoelectric layer, perpendicular to or parallel to the long sides. Furthermore, the size, width, and depth of the first grooves GM1 of the first matching layer M1 and the first grooves GM22 of the second matching layer M2 can be customized. However, the maximum depth of the first grooves GM1 of the first matching layer M1 and the first grooves GM22 of the second matching layer M2 cannot exceed the thickness of the matching material 12. In other words, the first grooves of the matching material 12 cannot physically divide the piezoelectric material 11 or the matching material 12 into at least two parts. Furthermore, the grooves of the first matching layer M1 and the second matching layer M2 can correspond to the second grooves of the piezoelectric layer. For example, when the piezoelectric material 11 is divided into different array elements by second grooves G11 arranged along the surface of the piezoelectric layer and perpendicular to the long sides, the multiple first grooves GM1 of the first matching layer M1 can be arranged along the surface of the piezoelectric layer and parallel to the long sides. The multiple first grooves GM22 of the second matching layer M2 can also be arranged along the surface of the piezoelectric layer and parallel to the long sides. The multiple first grooves GM1 and GM22 arranged in parallel can make each array element on the piezoelectric material 11 equidistant and evenly divided, thereby achieving a better seismic isolation effect. In other words, each array element of the piezoelectric material 11 can correspond to the multiple first grooves (such as GM1 and GM22) of the first matching layer M1 and the second matching layer M2, so the number and size of the grooves corresponding to the array elements of the piezoelectric material 11 are consistent.

[0034] The ultrasonic transducer 100 also supports ultrasonic transmission and reception, as described below. As mentioned above, the piezoelectric material 11 of the ultrasonic transducer 100 can be a piezoelectric ceramic material. In the ultrasonic transducer 100, when the piezoelectric material 11 receives an ultrasonic signal, it undergoes elastic vibration. Consequently, multiple charges of opposite polarity are generated on both sides of the piezoelectric material 11. These charges can generate an electrical signal through the first conductive material 13 and the second conductive material 14. The electrical signal is then transmitted to an external system via the first wire 15 and the second wire 16. Furthermore, if voltages of opposite polarity are input to the piezoelectric material 11 through the first conductive material 13 and the second conductive material 14, the piezoelectric material 11 can achieve acoustic impedance matching using at least one matching layer having grooves. Furthermore, because the piezoelectric material 11 can be a piezoelectric ceramic material, the piezoelectric ceramic material can generate ultrasonic signals through resonance.

[0035] Furthermore, as mentioned above, the ultrasonic transducer 100 can be a linear ultrasonic transducer, an arc-shaped ultrasonic transducer, a circular ultrasonic transducer, a multi-curvature ultrasonic transducer, a spherical ultrasonic transducer, or a non-spherical ultrasonic transducer. In other words, at least one matching layer in the ultrasonic transducer 100 can be a linear matching layer, an arc-shaped matching layer, a circular matching layer, a multi-curvature matching layer, a spherical matching layer, or a non-spherical matching layer. Furthermore, if the piezoelectric material 11 is a single array element, the grooves of the matching material 12 can be a checkerboard-like grid of grooves. If the piezoelectric material 11 is divided into multiple array element regions, the grooves of the matching material 12 can be arranged to correspond to the array element regions of the piezoelectric material 11, so that each array element has a good seismic isolation effect.

[0036] Figure 5 The figure is a schematic diagram showing the improvement of the ring-down pulse (Ring Down Pulse) of the ultrasonic signal in the spectrum of the ultrasonic transducer 100. It should be understood that the ideal value of the ring-down pulses generated by a general ultrasonic transducer is 2 to 3. In addition, the smaller the amplitude of the ring-down pulse, or the fewer harmonics of the ring-down pulse, the better the waveform of the ultrasonic signal. Figure 5 In FIG, the solid line is the pulse echo waveform (Pulse Echo Waveform) of the ultrasonic signal generated by the ultrasonic transducer without the matching material 12 introduced into the first groove. The X-axis is the wave value. The Y-axis is time. RD1 is one of the ringing pulses of the waveform. The dotted line is the pulse echo waveform of the ultrasonic signal generated by the ultrasonic transducer 100 with the matching material 12 introduced into the first groove. The X-axis is the wave value. The Y-axis is time. RD2 is one of the ringing pulses of the waveform. Figure 5 In the ultrasonic transducer 100, the ringing pulse RD2 is smaller than the ringing pulse RD1. Furthermore, in the ultrasonic signal generated by the ultrasonic transducer 100 incorporating the first grooves, most of the ringing pulses and harmonic amplitudes are smaller than those of the ultrasonic signal generated by a conventional ultrasonic transducer. In other words, in the ultrasonic transducer 100, when the piezoelectric material 11 performs acoustic impedance matching using at least one matching layer having the plurality of first grooves and generates an ultrasonic signal in a resonant manner, the ringing pulse of the ultrasonic signal can be reduced. Therefore, because the waveform of the ultrasonic signal generated by the ultrasonic transducer 100 can be optimized, the energy of the ultrasonic signal in the spectrum is more concentrated, resulting in better imaging resolution.

[0037] Furthermore, in the ultrasonic transducer 100, at least one matching layer may include a first matching layer and a second matching layer. The first matching layer is between the piezoelectric layer and the second matching layer. The second matching layer may have a first surface and a second surface, the first surface being connected to the first matching layer. Furthermore, the plurality of first grooves may be formed by a cutting process performed in a direction perpendicular to the second surface. The cutting process may selectively cut through or not cut through the second matching layer. After the second matching layer is cut through, portions of the first matching layer may be selectively cut away without cutting through the first matching layer. Furthermore, the piezoelectric material may include a plurality of second grooves. The plurality of first grooves may be orthogonal to the plurality of second grooves. Alternatively, the plurality of first grooves may be aligned one by one with the plurality of second grooves.

[0038] Figure 6 Flowchart of a waveform improvement method for ultrasonic transducer 100. The waveform improvement method comprises steps S601 to S604. Any reasonable technical changes or step replacements fall within the scope of the present invention. Steps S601 to S604 are described as follows:

[0039] Step S601: providing a piezoelectric material 11 connected to a matching material 12, wherein the piezoelectric material 11 includes at least one piezoelectric layer, and the matching material 12 includes at least one matching layer;

[0040] Step S602: generating a plurality of first grooves in one of the at least one matching layer;

[0041] Step S603: filling the plurality of trenches with an isolation material;

[0042] Step S604: providing an input voltage to the piezoelectric material 11, so that the piezoelectric material 11 generates an ultrasonic signal.

[0043] The details of steps S601 to S604 have been described above and will not be repeated here. In the ultrasonic transducer 100, since the matching material 12 introduces multiple first grooves to optimize the acoustic impedance, the waveform of the ultrasonic signal generated by the ultrasonic transducer 100 can be improved, thereby increasing image quality and resolution.

[0044] In summary, the present invention describes an ultrasonic transducer and a waveform improvement method. The ultrasonic transducer includes a piezoelectric material and a matching material. At least one matching layer in the matching material has a plurality of grooves. The plurality of grooves can match and optimize the acoustic impedance of the piezoelectric material. The plurality of grooves can also enhance the seismic isolation effect of each array element in the ultrasonic transducer. Moreover, after the acoustic impedance is optimized, most of the ringing pulses and harmonic amplitudes of the ultrasonic signal generated by the ultrasonic transducer can be reduced. In other words, since the waveform of the ultrasonic signal generated by the ultrasonic transducer can be optimized, the energy of the ultrasonic signal in the spectrum will be more concentrated, so that the imaging resolution will be better.

[0045] The present invention has been described with reference to the above embodiments. However, the above embodiments are merely exemplary embodiments of the present invention. It should be noted that the disclosed embodiments do not limit the scope of the present invention. On the contrary, modifications and improvements that do not depart from the spirit and scope of the present invention are intended to be protected by the present invention.

Claims

1. A waveform improvement method, characterized in that: Include: Providing a piezoelectric material connected to a matching material, wherein the piezoelectric material comprises at least one piezoelectric layer, and the matching material comprises at least one matching layer; Generating a plurality of first trenches in one of the at least one matching layer; Filling the plurality of first grooves with an isolation material having a seismic isolation effect; and Providing an input voltage to the piezoelectric material to cause the piezoelectric material to generate an ultrasonic signal; The matching material is used to match the acoustic impedance of the piezoelectric material, and the plurality of first grooves of the matching layer are used to optimize the acoustic impedance and the vibration isolation effect. The depth of the plurality of first grooves does not exceed the thickness of the matching material.

2. The method according to claim 1, wherein Also includes: Generating a plurality of second grooves in the at least one piezoelectric layer; The plurality of second grooves of the piezoelectric layer are arranged along one direction or two directions of two directions orthogonal to each other on the surface of the piezoelectric layer.

3. The method according to claim 2, wherein The at least one matching layer includes a first matching layer and a second matching layer, the first matching layer is between the piezoelectric layer and the second matching layer, the second matching layer has the plurality of first grooves, and the plurality of first grooves of the second matching layer correspond to the plurality of second grooves of the piezoelectric layer; Alternatively, the at least one matching layer includes a first matching layer and a second matching layer, the first matching layer is between the piezoelectric layer and the second matching layer, the first matching layer and the second matching layer have the plurality of first grooves, and the plurality of first grooves of the first matching layer and the second matching layer correspond to the plurality of second grooves of the piezoelectric layer.

4. The method according to claim 1, wherein The piezoelectric material is a piezoelectric ceramic material. When the piezoelectric material receives the ultrasonic signal, multiple charges with opposite polarities are generated on both sides of the piezoelectric ceramic material. The multiple charges with opposite polarities pass through two conductive materials to generate an electrical signal.

5. The method according to claim 4, wherein If voltages of opposite polarities are input to both sides of the piezoelectric ceramic material through the two conductive materials, the piezoelectric ceramic material performs acoustic impedance matching using the matching layer having the plurality of first grooves and generates the ultrasonic signal in a resonance manner.

6. The method according to claim 1, wherein When the piezoelectric material performs acoustic impedance matching using the matching layer having the plurality of first grooves and generates the ultrasonic signal in a resonance manner, the ringing pulse of the ultrasonic signal is reduced.

7. The method according to claim 1, wherein The at least one matching layer is a linear matching layer, an arc-shaped matching layer, a circular matching layer, a multi-curvature matching layer, a spherical matching layer or a non-spherical matching layer.

8. An ultrasonic transducer, characterized in that: Include: A housing for providing a storage space; A piezoelectric material is placed in the accommodating space, and the piezoelectric material is used to generate and receive ultrasonic signals; A matching material is placed in the accommodating space, and the matching material is used to match the acoustic impedance of the piezoelectric material; and Two conductive materials are coupled to the piezoelectric material, and the two conductive materials are used to output and input electrical signals; The piezoelectric material includes at least one piezoelectric layer, and the matching material includes at least one matching layer. One of the at least one matching layer has a plurality of first grooves, and an isolation material with a vibration isolation effect is filled in the plurality of first grooves. When a voltage is input to the two conductive materials, the piezoelectric material generates the ultrasonic signal. The plurality of first grooves of the matching layer are used to optimize the acoustic impedance and vibration isolation effect. The depth of the plurality of first grooves does not exceed the thickness of the matching material.

9. The ultrasonic transducer according to claim 8, wherein: The at least one matching layer includes a first matching layer and a second matching layer. The first matching layer is between the piezoelectric layer and the second matching layer. The second matching layer has a first surface and a second surface. The first surface is connected to the first matching layer. The plurality of first grooves are formed by cutting from the second surface in a direction perpendicular to the second surface.

10. The ultrasonic transducer according to claim 9, wherein: The cutting process does not cut through the second matching layer; or, The cutting process cuts through the second matching layer without cutting the first matching layer; or The cutting process cuts through the second matching layer while cutting the first matching layer without cutting through the first matching layer.

11. The ultrasonic transducer according to claim 8, wherein The piezoelectric material includes a plurality of second grooves, and the plurality of first grooves and the plurality of second grooves are orthogonal to each other; or, The piezoelectric material includes a plurality of second grooves, and the plurality of first grooves are aligned with the plurality of second grooves one by one.

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