Baffle, splash guard, cmp table, and method for preventing splash of polishing waste liquid

Abstract

The application discloses a baffle, a splash-proof device, a chemical mechanical polishing machine table and a polishing waste liquid splash-proof method. The splash-proof device comprises a baffle, a cleaning stand and a driving assembly. The baffle is arranged around the outer periphery of a polishing table. The baffle can be independently lifted under the driving of the driving assembly. The cleaning stand is arranged outside the baffle, and a cleaning spray pipe of the cleaning stand can be rotated to the inside of the baffle and spray liquid to clean the baffle. According to the technical scheme of the application, the polishing waste liquid splash-proof baffle is arranged in a split mode. The working state of a polishing pad organizer in a process can be used to adjust the lifting of the baffle, so that the splashing of waste liquid is maximally blocked. A hydrophilic area and a hydrophobic area are arranged on the surface of the baffle. The surface tension difference of liquid drops on different surfaces is used to realize the adhesion of the liquid drops on the hydrophilic area to prevent splashing, the quick detachment of the liquid drops on the hydrophobic area to prevent secondary splashing and the precipitation of crystals on the surface of the baffle, so that the self-cleaning effect of the surface of the baffle is achieved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a baffle, a splash-proof device, a chemical mechanical polishing machine, and a method for preventing splashing of polishing waste liquid. Background Technology

[0002] With the rapid development of semiconductor technology, semiconductor device sizes are constantly shrinking and integration is continuously increasing, leading to increasingly stringent requirements for the flatness of each layer's surface. Chemical Mechanical Polishing (CMP), as a global planarization technology, is widely used. CMP primarily utilizes the chemical reaction between chemicals and the wafer surface material, along with the physical friction of abrasive particles on the wafer surface, to achieve wafer surface planarization. During the wafer polishing process, the wafer is pressed against the polishing pad by the polishing head and rotates in the same direction as the polishing pad under the drive of the polishing head. Simultaneously, polishing slurry needs to be supplied so that the wafer completes surface polishing under the combined action of chemicals and machinery. However, due to the rotation of moving parts such as the polishing head and polishing pad, polishing waste (polishing slurry and polishing products) is thrown off the polishing pad surface under centrifugal force. The random splashing of polishing waste can cause contamination of the polishing chamber and corrosion of metal components, affecting the service life of the machine. In addition, after drying, the splashed grinding waste liquid will precipitate a large amount of crystals in the grinding chamber. These crystals will not only become a source of particulate pollution in the workspace, causing scratches on the wafer surface, but also hinder the smooth operation of the machine parts, resulting in a decrease in product yield.

[0003] In existing technologies, splash guards are often installed on the outside of the grinding table to prevent the random splashing of grinding waste liquid. For example, methods such as adding spacer grooves to the baffle surface and preparing a hydrophilic coating are used to prevent splashing. While these methods effectively prevent splashing by increasing the adsorption of liquid on the baffle surface, the hydrophilic surface has a high adhesion force, which leads to the accumulation of waste liquid on the baffle surface and difficulty in removal, resulting in secondary splashing and the precipitation of crystals. Furthermore, polymer coatings have low hardness, making them easily damaged during machine maintenance to remove crystals adhering to the baffle surface, thus degrading the baffle's splash-proof performance. Summary of the Invention

[0004] Based on the shortcomings and defects of the existing equipment, the present invention provides a baffle, a splash-proof device, a chemical mechanical polishing (CMP) machine, and a method for preventing splashing of polishing waste liquid. In one aspect, the present invention provides a baffle for preventing liquid splashing during wafer polishing, characterized in that the baffle is disposed around the outer periphery of the polishing table, the upper part of the baffle is a hydrophilic region, and the lower part of the baffle is a hydrophobic region.

[0005] Optionally, the baffle includes a first baffle and a second baffle; the first baffle can be independently raised and lowered as the grinding pad arranger moves under the drive of the drive component; the second baffle does not move independently as the grinding pad arranger moves; when both the first baffle and the second baffle are in the raised state, they can rotate in the circumferential direction under the action of the drive component.

[0006] Optionally, the contact angle of static water on the upper surface of the baffle is less than 30 degrees; the contact angle of static water on the lower surface of the baffle is greater than 120 degrees and the roll-off angle is less than 20 degrees; the ratio of the area of ​​the upper hydrophilic region to the area of ​​the lower hydrophobic region is 0.25 to 1.

[0007] Optionally, the central angle of the first baffle is between 5 and 60 degrees; the first baffle and the second baffle are concentrically arranged and the inner sidewalls of the baffles are located on the same circumference; the arrangement position of the first baffle ensures the normal operation of the grinding pad arranger.

[0008] Optionally, the main material of the baffle is either stainless steel or an acid and alkali resistant polymer.

[0009] Optionally, the hydrophilic region of the baffle is one of an isotropic microstructure surface or an anisotropic microstructure array surface; the preparation method of the hydrophilic region surface is one or more of laser etching, chemical etching, nanoimprinting, 3D printing or nanoparticle composite hydrophilic coating; the hydrophilic region surface has one or more of hydroxyl, sulfonic acid, carboxylic acid, phosphate or amino groups.

[0010] Optionally, the hydrophobic region of the baffle is one of an isotropic microstructure surface or an anisotropic microstructure array surface; the hydrophobic surface is prepared by one or more of laser etching, chemical etching, nanoimprinting, 3D printing or nanoparticle composite hydrophobic coating; the surface of the hydrophobic region contains one or more of carbon-fluorine groups, hydrocarbon groups with more than 5 carbon atoms or nitro groups.

[0011] On the other hand, the present invention provides a self-cleaning grinding waste liquid splash prevention device, including: a baffle, a cleaning column, and a driving assembly; the baffle is arranged around the outer periphery of the grinding table; the baffle can be independently raised and lowered under the drive of the driving assembly; the cleaning column is arranged outside the baffle, and the cleaning nozzle of the cleaning column can be rotated to the inner side of the baffle and spray liquid to clean the baffle.

[0012] Optionally, the upper part of the baffle is a hydrophilic area; the lower part of the baffle is a hydrophobic area.

[0013] Optionally, the baffle includes a first baffle and a second baffle; the driving assembly includes a lifting driving unit and a rotating driving unit; the first baffle can be independently raised and lowered as the grinding pad arranger moves under the drive of the driving assembly; the second baffle does not move independently as the grinding pad arranger moves; when both the first baffle and the second baffle are in the raised state, they can rotate in the circumferential direction under the action of the driving assembly.

[0014] Optionally, the static water contact angle of the upper part of the baffle is less than 30 degrees; the static water contact angle of the lower part of the baffle is greater than 120 degrees and the roll-off angle is less than 20 degrees; the ratio of the area of ​​the upper hydrophilic area to the area of ​​the lower hydrophobic area is 0.25 to 1.

[0015] Optionally, the central angle of the first baffle is between 5 and 60 degrees; the first baffle and the second baffle are concentrically arranged and the inner sidewalls of the baffles are located on the same circumference; the arrangement position of the first baffle ensures the normal operation of the grinding pad arranger.

[0016] Optionally, the nozzle of the cleaning column moves to the inside of the baffle when the baffle rotates and sprays liquid to clean the baffle; the cleaning column has one or more of the following: deionized water pipeline, acidic solution pipeline, or alkaline solution pipeline; the outlet pressure, angle, and flow rate of the cleaning column nozzle can be adjusted.

[0017] Optionally, the spray cleaning process may use one or more of deionized water, acidic diluent, or alkaline diluent; the baffle may rotate at least once during the spray cleaning process; after the spray cleaning, the first baffle remains in its initial position.

[0018] Optionally, the main material of the baffle is either stainless steel or an acid and alkali resistant polymer.

[0019] Optionally, the hydrophilic region of the baffle is one of an isotropic microstructure surface or an anisotropic microstructure array surface; the preparation method of the hydrophilic region surface is one or more of laser etching, chemical etching, nanoimprinting, 3D printing or nanoparticle composite hydrophilic coating; the hydrophilic region surface has one or more of hydroxyl, sulfonic acid, carboxylic acid, phosphate or amino groups.

[0020] Optionally, the hydrophobic region of the baffle is one of an isotropic microstructure surface or an anisotropic microstructure array surface; the hydrophobic surface is prepared by one or more of laser etching, chemical etching, nanoimprinting, 3D printing or nanoparticle composite hydrophobic coating; the surface of the hydrophobic region contains one or more of carbon-fluorine groups, hydrocarbon groups with more than 5 carbon atoms or nitro groups.

[0021] On the other hand, the present invention also provides a chemical mechanical grinding machine, including the self-cleaning grinding waste splash prevention device.

[0022] On the other hand, the present invention also provides a method for preventing the splashing of grinding waste liquid, characterized in that it is achieved by a self-cleaning grinding waste liquid splash prevention device; wherein, the self-cleaning grinding waste liquid splash prevention device includes a baffle; the baffle can be arranged around the outer periphery of the grinding table, the upper part of the baffle is a hydrophilic area; the lower part of the baffle is a hydrophobic area; wherein, the upper part of the baffle is used to prevent the splashing of grinding waste liquid; the lower part of the baffle is used for the rapid desorption of grinding waste liquid.

[0023] Optionally, the self-cleaning grinding waste splash prevention device further includes a cleaning column and a drive assembly; the baffle can be independently raised and lowered under the drive of the drive assembly; the cleaning column is located on the outside of the baffle, and the cleaning nozzle of the cleaning column can rotate to the inside of the baffle to spray liquid for cleaning; the baffle includes a first baffle and a second baffle; the first baffle can be independently raised and lowered under the drive of the drive assembly as it moves with the grinding pad arranger; the second baffle does not move with the grinding pad arranger and is independently raised and lowered; when both the first baffle and the second baffle are in the raised state, they can rotate in a circumferential direction under the action of the drive assembly; when the first baffle descends below the grinding table, the grinding pad modulator can enter the grinding table area through the notch and adjust the grinding pad.

[0024] Optionally, the baffle is cleaned at least once every 25 wafers are ground.

[0025] Optionally, during the cleaning process, the first baffle and the second baffle are enclosed and their tops are flush; during the cleaning process, the drive assembly drives the baffle to rotate around the central axis; during the cleaning process, the nozzle of the cleaning column rotates to the inside of the baffle; during the cleaning process, the cleaning column provides at least one of deionized water, acidic solution or alkaline solution to clean the inner surface of the baffle.

[0026] Compared with the prior art, the technical solution of the embodiments of the present invention has the following beneficial effects:

[0027] (1) By setting up separate grinding waste liquid splash baffles, the baffles can be adjusted according to the working status of the grinding pad cleaner during the process, thereby maximizing the blocking of waste liquid splash.

[0028] (2) A hydrophilic area and a hydrophobic area are set on the surface of the baffle. By utilizing the difference in surface tension of droplets on different surfaces, the droplets can adhere to the hydrophilic area to prevent splashing, desorb quickly in the hydrophobic area to prevent secondary splashing, and crystals can precipitate on the surface of the baffle, thereby achieving the self-cleaning effect of the baffle surface.

[0029] (3) By equipping the cleaning column, the waste liquid residue on the surface of the baffle can be removed in time, reducing the precipitation of crystals on the baffle surface and extending the maintenance cycle of the baffle. At the same time, high-pressure water or chemicals can be used to clean the crystals attached to the surface, reducing the damage to the surface structure and materials during baffle maintenance. Attached Figure Description

[0030] The accompanying drawings, which form part of this specification, are used to further understand the invention. The drawings illustrate embodiments of the invention and, together with the specification, serve to explain the principles of the invention.

[0031] Figure 1 This is a schematic diagram of a self-cleaning grinding waste liquid splash prevention device;

[0032] Figure 2 This is a partial schematic diagram of the baffle in a self-cleaning grinding waste liquid anti-splash device;

[0033] Figure 3 It refers to the water droplet wetting state of the hydrophilic area of ​​the baffle of the self-cleaning grinding waste liquid splash prevention device;

[0034] Figure 4 It refers to the water droplet wetting state of the hydrophobic area of ​​the baffle of the self-cleaning grinding waste liquid splash prevention device;

[0035] Wherein: 10-baffle, 11-first baffle, 12-second baffle, 13-central shaft, 101-hydrophilic area at the top of the baffle, 102-hydrophobic area at the bottom of the baffle, 20-drive assembly, 30-cleaning column, 31-support component, 32-cleaning nozzle, 40-deionized water. Detailed Implementation

[0036] The following detailed description is illustrative and intended to provide further explanation of the invention. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains.

[0037] As mentioned above, existing technologies often employ splash guards on the outside of the grinding table to prevent the random splashing of grinding waste liquid. For example, methods such as creating spacer-like grooves on the baffle surface and preparing a hydrophilic coating are used to prevent splashing. While these methods effectively prevent splashing by increasing the adsorption of liquid on the baffle surface, the hydrophilic surface has a high adhesion force, leading to the accumulation of waste liquid on the baffle surface, which is difficult to remove, resulting in secondary splashing and the precipitation of crystals. Furthermore, polymer coatings have low hardness, making them easily damaged during machine maintenance to remove crystals adhering to the baffle surface, thus degrading the baffle's splash-proof performance.

[0038] To address the aforementioned problems, this invention employs a separate grinding waste liquid splash-proof baffle. The height of the first baffle can be adjusted according to the working state of the grinding pad conditioner during the process, thereby maximizing the prevention of waste liquid splashing. This invention features hydrophilic and hydrophobic zones on the baffle surface. Utilizing the surface tension difference between the droplets on different surfaces, droplets adhere to the hydrophilic zone to prevent splashing, and rapidly desorb in the hydrophobic zone to prevent secondary splashing and crystal precipitation on the baffle surface, achieving a self-cleaning effect. This invention also includes a cleaning column to promptly remove waste liquid residue from the baffle surface, reducing crystal precipitation and extending the baffle's maintenance cycle. Simultaneously, high-pressure water or chemicals can be used to clean surface-adhered crystals, minimizing damage to the surface structure and materials during baffle maintenance.

[0039] To make the above-mentioned objectives, features and beneficial effects of the embodiments of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0040] refer to Figure 1 , Figure 1 This is a schematic diagram of a self-cleaning grinding waste liquid anti-splash device according to an embodiment of the present invention.

[0041] like Figure 1 As shown, the self-cleaning grinding waste liquid splash prevention device includes: a baffle 10, a cleaning column 30, and a drive assembly 20. The baffle 10 is arranged around the outer periphery of the grinding table (not shown). The baffle 10 can be independently raised and lowered under the drive of the drive assembly 20. The cleaning column 30 is disposed outside the baffle 10. The cleaning column 30 may include a support member 31 and a cleaning nozzle 32 connected to one end of the support member 31. The cleaning nozzle 32 of the cleaning column 30 can rotate to the inside of the baffle 10 and spray liquid to clean the baffle 10.

[0042] In one specific implementation, reference is made to Figure 2 The upper part 101 of the baffle 10 is the hydrophilic area; the lower part 102 of the baffle 10 is the hydrophobic area.

[0043] In one specific embodiment, the baffle 10 may include a first baffle 11 and a second baffle 12. The drive assembly 20 may include a lifting drive unit (not shown) and a rotation drive unit (not shown). Specifically, the first baffle 11 can move independently up and down with the polishing pad arranger (not shown) under the drive of the drive assembly 20. The second baffle 12 does not move independently up and down with the polishing pad arranger. When both the first baffle 11 and the second baffle 12 are in the raised state, they can rotate in the circumferential direction under the action of the drive assembly 20.

[0044] In one specific embodiment, the contact angle of static water (e.g., deionized water 40) on the upper part 101 surface of the baffle 10 is less than 30 degrees (reference). Figure 3 Static water (e.g., deionized water 40) has a contact angle greater than 120 degrees and a roll-off angle less than 20 degrees on the lower part 102 surface of the baffle 10 (reference). Figure 4 The ratio of the area of ​​the upper 101 hydrophilic zone to the area of ​​the lower 102 hydrophobic zone is 0.25 to 1.

[0045] In one specific embodiment, the central angle of the first baffle 11 is between 5 and 60 degrees; the first baffle 11 and the second baffle 12 are concentrically arranged and the inner sidewalls of the baffle 10 are located on the same circumference; the arrangement position of the first baffle 11 ensures the normal operation of the grinding pad arranger.

[0046] In one specific embodiment, the nozzle of the cleaning column 30 moves to the inside of the baffle 10 when the baffle 10 rotates and sprays liquid to clean the baffle 10; the cleaning column 30 has one or more of the following: deionized water pipeline, acidic solution pipeline or alkaline solution pipeline; the outlet pressure, angle and flow rate of the cleaning column 30 nozzle can be adjusted.

[0047] In one specific embodiment, the liquid spraying cleaning process uses one or more of deionized water, acidic diluent, or alkaline diluent; the baffle 10 rotates at least once during the liquid spraying cleaning process; after the liquid spraying cleaning, the first baffle 11 remains in its initial position.

[0048] In one specific embodiment, the main material of the baffle 10 is either stainless steel or an acid and alkali resistant polymer.

[0049] In one specific embodiment, the hydrophilic region of the baffle 10 is one of an isotropic microstructure surface or an anisotropic microstructure array surface; the preparation method of the hydrophilic region surface is one or more of laser etching, chemical etching, nanoimprinting, 3D printing or nanoparticle composite hydrophilic coating; the hydrophilic region surface has one or more of hydroxyl, sulfonic acid, carboxylic acid, phosphate or amino groups.

[0050] In one specific embodiment, the hydrophobic region of the baffle 10 is one of an isotropic microstructure surface or an anisotropic microstructure array surface; the hydrophobic surface is prepared by one or more of laser etching, chemical etching, nanoimprinting, 3D printing or nanoparticle composite hydrophobic coating; the surface of the hydrophobic region contains one or more of carbon fluorine group, hydrocarbon group with more than 5 carbon atoms or nitro group.

[0051] The present invention also provides a chemical mechanical grinding machine, including as follows: Figures 1 to 4 The self-cleaning grinding waste liquid splash prevention device.

[0052] The present invention also provides a method for preventing the splashing of grinding waste liquid, by means of, for example Figures 1 to 4The self-cleaning grinding waste liquid splash prevention device is implemented; wherein, the upper part 101 of the baffle 10 is used to prevent the grinding waste liquid from splashing; the lower part 102 of the baffle 10 is used for the rapid desorption of the grinding waste liquid. When the first baffle 10 descends below the grinding table, the grinding pad modulator can enter the grinding table area through the notch and adjust the grinding pad.

[0053] In one specific embodiment, the baffle 10 is cleaned at least once for every 25 wafers polished.

[0054] In one specific embodiment, during the cleaning process, the first baffle 101 and the second baffle 102 surround each other and are flush at the top; during the cleaning process, the drive assembly 20 drives the baffle 10 to rotate around the central axis 13; during the cleaning process, the nozzle of the cleaning column 30 rotates to the inside of the baffle 10; during the cleaning process, the cleaning column 30 provides at least one of deionized water, acidic solution or alkaline solution to clean the inner surface of the baffle 10.

[0055] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A baffle for preventing liquid splashing during wafer grinding, characterized in that, The baffle can be arranged around the outer periphery of the grinding table, with the upper part of the baffle being a hydrophilic area and the lower part of the baffle being a hydrophobic area.

2. The baffle as described in claim 1, characterized in that, Including the first baffle and the second baffle; The first baffle can move independently up and down with the grinding pad arranger under the drive of the drive component; the second baffle does not move independently up and down with the grinding pad arranger; when both the first baffle and the second baffle are in the raised state, they can rotate in the circumferential direction under the action of the drive component.

3. The baffle as described in claim 1, characterized in that, The contact angle of static water on the upper surface of the baffle is less than 30 degrees; the contact angle of static water on the lower surface of the baffle is greater than 120 degrees and the roll-off angle is less than 20 degrees; the ratio of the hydrophilic area to the hydrophobic area is 0.25 to 1.

4. The baffle as described in claim 2, characterized in that, The central angle of the first baffle is between 5 and 60 degrees; the first baffle and the second baffle are concentrically arranged and the inner sidewalls of the baffles are on the same circumference; the position of the first baffle ensures the normal operation of the grinding pad arranger.

5. The baffle as described in claim 1, characterized in that, The main material of the baffle is either stainless steel or an acid and alkali resistant polymer.

6. The baffle as described in claim 1, characterized in that, The hydrophilic region of the baffle is either an isotropic microstructure surface or an anisotropic microstructure array surface. The preparation method of the hydrophilic region surface is one or more of the following: laser etching, chemical etching, nanoimprinting, 3D printing, or nanoparticle composite hydrophilic coating. The surface of the hydrophilic region contains one or more of the following groups: hydroxyl, sulfonic acid, carboxylic acid, phosphate, or amino groups.

7. The baffle as described in claim 1, characterized in that, The hydrophobic region of the baffle is either an isotropic microstructure surface or an anisotropic microstructure array surface. The hydrophobic surface is prepared by one or more of the following methods: laser etching, chemical etching, nanoimprinting, 3D printing, or nanoparticle composite hydrophobic coating. The surface of the hydrophobic region contains one or more of the following: fluorocarbon group, hydrocarbon group with more than 5 carbon atoms, or nitro group.

8. A self-cleaning grinding waste liquid splash prevention device, characterized in that, include: Baffle, cleaning column, drive assembly; The baffle is arranged around the outer periphery of the grinding table; The baffle can be raised and lowered independently under the drive of the drive component; The cleaning column is located on the outside of the baffle, and the cleaning nozzle of the cleaning column can be rotated to the inside of the baffle to spray liquid and clean the baffle. The upper part of the baffle is a hydrophilic area; the lower part of the baffle is a hydrophobic area.

9. The self-cleaning grinding waste liquid anti-splash device as described in claim 8, characterized in that, The baffle includes a first baffle and a second baffle; The drive assembly includes a lifting drive unit and a rotating drive unit; The first baffle can be independently raised and lowered as it moves with the grinding pad conditioner under the drive of the drive component; The second baffle does not move independently with the grinding pad conditioner; When both the first baffle and the second baffle are in the raised state, they can rotate in the circumferential direction under the action of the drive component.

10. The self-cleaning grinding waste liquid splash prevention device as described in claim 9, characterized in that, The static water contact angle of the upper part of the baffle is less than 30 degrees; the static water contact angle of the lower part of the baffle is greater than 120 degrees and the roll-off angle is less than 20 degrees; the ratio of the hydrophilic area to the hydrophobic area is 0.25 to 1.

11. The self-cleaning grinding waste liquid anti-splash device as described in claim 10, characterized in that, The central angle of the first baffle is between 5 and 60 degrees; the first baffle and the second baffle are concentrically arranged and the inner sidewalls of the baffles are on the same circumference; the position of the first baffle ensures the normal operation of the grinding pad arranger.

12. The self-cleaning grinding waste liquid anti-splash device as described in claim 11, characterized in that, The nozzle of the cleaning column moves to the inside of the baffle when the baffle rotates and sprays liquid to clean the baffle; the cleaning column has one or more of the following: deionized water pipeline, acidic solution pipeline, or alkaline solution pipeline; the outlet pressure, angle, and flow rate of the cleaning column nozzle can be adjusted.

13. The self-cleaning grinding waste liquid splash prevention device as described in claim 12, characterized in that, The spray cleaning process may use one or more of deionized water, acidic diluent, or alkaline diluent. During the liquid spraying cleaning process, the baffle rotates at least one revolution; after the liquid spraying cleaning, the first baffle remains in its initial position.

14. The self-cleaning grinding waste liquid splash prevention device as described in claim 13, characterized in that, The main material of the baffle is either stainless steel or an acid and alkali resistant polymer.

15. The self-cleaning grinding waste liquid anti-splash device as described in claim 14, characterized in that, The hydrophilic region of the baffle is either an isotropic microstructure surface or an anisotropic microstructure array surface; the hydrophilic region surface is prepared by one or more of laser etching, chemical etching, nanoimprinting, 3D printing or nanoparticle composite hydrophilic coating; the hydrophilic region surface contains one or more of hydroxyl, sulfonic acid, carboxylic acid, phosphate or amino groups.

16. The self-cleaning grinding waste liquid splash prevention device as described in claim 15, characterized in that, The hydrophobic region of the baffle is one of an isotropic microstructure surface or an anisotropic microstructure array surface; the hydrophobic surface is prepared by one or more of laser etching, chemical etching, nanoimprinting, 3D printing or nanoparticle composite hydrophobic coating; the surface of the hydrophobic region contains one or more of carbon fluorine groups, hydrocarbon groups with more than 5 carbon atoms or nitro groups.

17. A chemical mechanical grinding machine, comprising a self-cleaning grinding waste splash prevention device as described in any one of claims 8 to 16.

18. A method for preventing splashing of grinding waste liquid, characterized in that, This is achieved through a self-cleaning grinding waste liquid splash prevention device; The self-cleaning grinding waste liquid anti-splash device includes a baffle. The baffle can be arranged around the outer periphery of the grinding table, with the upper part of the baffle being a hydrophilic area and the lower part of the baffle being a hydrophobic area. The upper part of the baffle is used to prevent the grinding waste liquid from splashing; the lower part of the baffle is used for the rapid desorption of the grinding waste liquid.

19. The method as described in claim 18, characterized in that, The self-cleaning grinding waste splash prevention device also includes a cleaning column and a drive assembly; The baffle can be raised and lowered independently under the drive of the drive component; The cleaning column is located on the outside of the baffle, and the cleaning nozzle of the cleaning column can be rotated to the inside of the baffle to spray liquid and clean the baffle. The baffle includes a first baffle and a second baffle; The first baffle can move independently up and down with the grinding pad arranger under the drive of the drive component; the second baffle does not move independently up and down with the grinding pad arranger; when both the first baffle and the second baffle are in the raised state, they can rotate in the circumferential direction under the action of the drive component. When the first baffle descends below the grinding table, the grinding pad modulator can enter the grinding table area through the notch and adjust the grinding pad.

20. The method as described in claim 19, characterized in that, The baffle must be cleaned at least once for every 25 wafers ground.

21. The method as described in claim 20, characterized in that, During the cleaning process, the first baffle and the second baffle are enclosed and their tops are flush; during the cleaning process, the drive assembly drives the baffle to rotate around the central axis; during the cleaning process, the nozzle of the cleaning column rotates to the inside of the baffle; during the cleaning process, the cleaning column provides at least one of deionized water, acidic solution or alkaline solution to clean the inner surface of the baffle.

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