An active heat dissipation control device for micro-nano satellite body-mounted wings

Abstract

The present invention discloses an active heat dissipation control device for a micro-nano satellite wing, comprising a heat sink, a heater, a thermal insulation pad, a thermistor, and an integrated electronic unit. The heater, thermal insulation pad, and the thermistor are all disposed on the heat sink, with the heater positioned on the heat sink and a plurality of thermal insulation pads positioned around the heat sink. The integrated electronic unit is connected to the thermistor and heater, respectively. This device effectively reduces the wing's temperature without significantly increasing weight or cost, achieving heat dissipation from the wing.

Description

Technical Field

[0001] The present invention belongs to the technical field of satellite temperature control, and in particular relates to a micro-nano satellite body-mounted wing active heat dissipation control device. Background Art

[0002] Solar arrays are power generation systems that utilize a combination of photoelectric converters. Currently, the proportion of spacecraft using various power generation devices internationally is approximately 90% solar arrays, 5% chemical batteries, and 3-4% nuclear power. This indicates that the majority of spacecraft in orbit utilize a combined solar array / battery power system. Therefore, for satellites with longer lifespans, solar arrays are an integral component of their energy systems.

[0003] Most satellites currently use a deployable solar array. When the spacecraft is in orbit, the front of the solar array absorbs sunlight while the back of the array, coated with a high-emissivity coating, dissipates heat to cold space. This keeps the temperature of these deployable solar arrays low while in orbit, with current in-orbit data analysis showing a maximum temperature of no more than 110°C. In recent years, with the development of micro- and nanosatellites, many have opted for body-mounted solar arrays due to various limitations. These body-mounted wings are mounted on a satellite deck via thermal pads. Compared to deployable solar wings, their heat radiation background is the celestial body, which is much hotter than cold space. This results in higher temperatures for the wings. Analysis of in-orbit data indicates that during shunting, the maximum temperature reaches nearly 140°C, posing a safety hazard to their normal operation. Summary of the Invention

[0004] The technology of the present invention solves the problem: to overcome the shortcomings of the existing technology and provide an active heat dissipation control device for the body-mounted wing of a micro-nano satellite, which aims to effectively reduce the temperature of the body-mounted wing and realize heat dissipation of the body-mounted wing without increasing the weight cost.

[0005] In order to solve the above technical problems, the present invention discloses an active heat dissipation control device for a micro-nano satellite body-mounted wing, comprising: a heat dissipation plate, a heater, a thermal insulation pad, a thermistor and an integrated electronic unit; wherein the heater, the thermal insulation pad and the thermistor are all arranged on the heat dissipation plate; wherein the heater is located on the heat dissipation plate, and a plurality of thermal insulation pads are located around the heat dissipation plate; the integrated electronic unit is respectively connected to the thermistor and the heater.

[0006] In the above-mentioned micro-nano satellite body-mounted wing active heat dissipation control device, the heat dissipation plate is installed on the back of the satellite's body-mounted wing through a heat insulation pad.

[0007] In the above-mentioned micro-nano satellite body-mounted wing active heat dissipation control device, the body-mounted wing includes three sub-array layouts: PG1 sub-array, PG2 sub-array and PG3 sub-array; among them, the PG1 sub-array is located at the center of the body-mounted wing, the PG3 sub-array is located at the edge of the body-mounted wing, and the PG2 sub-array is located between the PG1 sub-array and the PG3 sub-array.

[0008] In the above-mentioned micro-nano satellite wing-mounted active heat dissipation control device, the heater includes: a main heater HL1 and a backup heater HL2; wherein, when the entire satellite is diverted, the main heater HL1 and the backup heater HL2 are turned on at the same time; in situations other than the entire satellite diversion, the main heater HL1 is turned on first, and when the heating power does not meet the demand, the backup heater HL2 is turned on.

[0009] In the above-mentioned micro-nano satellite body-mounted wing active heat dissipation control device, the integrated electronic unit is used to:

[0010] Get the active dissipation circuit control enable flag of the body-mounted wing;

[0011] When the active dissipation circuit control enable flag of the body-mounted wing is "allowed", the following conditions are true:

[0012] If the following conditions are met for 30 consecutive seconds: the current of the PG1 sub-array is greater than 4A, the discharge current is less than 0.5A, and the current on / off state is 0; and the on / off state of the PG2 sub-array is 0 for 10 consecutive times; then, the main heater HL1 is turned on first, and after an interval of 1 second, the backup heater HL2 is turned on, and the HL1 and HL2 dual-range temperature control flags are set to "disabled";

[0013] If the discharge current of the PG1 array is greater than 0.8A for 30 consecutive seconds, the main heater HL1 is disconnected first, and then the backup heater HL2 is disconnected after an interval of 1 second, and the HL1 and HL2 dual-interval temperature control flags are set to "allowed".

[0014] In the above-mentioned micro-nano satellite body-mounted wing active heat dissipation control device, the body-mounted wing active dissipation loop control enable flag is set through the integrated electronic stand-alone unit, and the default setting is "prohibited"; the HL1 and HL2 dual-interval temperature control flags are set through the integrated electronic stand-alone unit, and the default setting is "allowed".

[0015] In the above-mentioned micro-nano satellite wing-mounted active heat dissipation control device, the thermistor includes: a main thermistor TR1 and a backup thermistor TR2; wherein the main thermistor TR1 and the backup thermistor TR2 both serve as temperature control thermistors for the main heater HL1 and the backup heater HL2; when an abnormality occurs in the main thermistor TR1, the temperature is switched to the backup thermistor TR2.

[0016] In the above-mentioned micro-nano satellite wing-mounted active heat dissipation control device, the heat dissipation plate is a heat dissipation aluminum plate; the dimensions of the heat dissipation aluminum plate are: L1×D1×H1; wherein L1, D1 and H1 represent the length, width and height of the heat dissipation aluminum plate, respectively; the value of L1 is 100-270 mm, the value of D1 is 80-160 mm, and the value of H1 is 2-5 mm; a heater is attached to one side of the heat dissipation aluminum plate, and the side of the heat dissipation aluminum plate to which the heater is not attached is sprayed with SR107_ZK white paint.

[0017] In the above-mentioned micro-nano satellite wing-mounted active heat dissipation control device, the heater is a double-layer dual-circuit heater; the single-circuit heating power of the double-layer dual-circuit heater is 15W, and the dual-interval temperature control threshold is [-35°C, -32°C], [-37°C, -34°C]; the size of the heater is: L2×D2; where L2 and D2 represent the length and width of the heater, respectively; the value of L2 is 50 to 150 mm, and the value of D2 is 40 to 80 mm.

[0018] In the above-mentioned micro-nano satellite body-mounted wing active heat dissipation control device, the thickness of the thermal insulation pad is 10 mm.

[0019] The present invention has the following advantages:

[0020] This invention discloses an active heat dissipation control device for micro-nano satellite fins. This device effectively reduces fin temperature without significantly increasing weight or cost, ensuring safe on-orbit satellite operation. Compared with other isothermal heat dissipation methods using heat pipes, it can reduce the development cost of micro-nano satellites. It can be used as a reference for general small satellites. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the composition of a micro-nano satellite body-mounted wing active heat dissipation control device according to an embodiment of the present invention;

[0022] Figure 2 This is a diagram of the sub-array layout of a body-mounted wing in an embodiment of the present invention;

[0023] Figure 3 This is a schematic diagram of an active heat dissipation control process in an embodiment of the present invention. DETAILED DESCRIPTION

[0024] In order to make the objectives, technical solutions and advantages of the present invention more clear, the embodiments disclosed in the present invention will be described in further detail below with reference to the accompanying drawings.

[0025] One of the core ideas of the present invention is: in view of the current application background of body-mounted wings, in order to reduce the on-orbit operating temperature of the body-mounted wings, a micro-nano satellite wing active heat dissipation control device is proposed, which can effectively reduce the temperature of the body-mounted wings without increasing a lot of weight costs.

[0026] like Figure 1 In this embodiment, the micro-nano satellite wing-mounted active heat dissipation control device comprises: a heat sink 1, a heater 2, a thermal insulation pad 3, a thermistor 4, and an integrated electronic unit. The heater 2, thermal insulation pad 3, and thermistor 4 are all mounted on the heat sink 1; the heater 2 is located on the heat sink 1, and a plurality of thermal insulation pads 3 are located around the heat sink 1; the integrated electronic unit is connected to the thermistor 4 and heater 2, respectively; and the heat sink 1 is mounted on the back of the satellite wing-mounted body via the thermal insulation pad 3.

[0027] In this embodiment, the heat sink 1 refers to a heat dissipation panel and can be made of aluminum. The dimensions of the aluminum plate are: L1 × D1 × H1, where L1, D1, and H1 represent the length, width, and height of the aluminum plate, respectively. L1 ranges from 100 to 270 mm, D1 ranges from 80 to 160 mm, and H1 ranges from 2 to 5 mm. The heater 2 is attached to one side of the aluminum plate, while the side not attached is painted with SR107_ZK white paint.

[0028] In this embodiment, the heater 2 refers to a device for achieving heating, which is installed on one side of the heat sink 1. The heater 2 dissipates the shunt on the body-mounted wing, reduces the shunt on the body-mounted wing, and thus reduces the temperature of the body-mounted wing.

[0029] Preferably, heater 2 can be a double-layer, dual-circuit heater. The single-circuit heating power of the double-layer, dual-circuit heater is 15W, and the dual-range temperature control thresholds are [-35°C, -32°C] and [-37°C, -34°C]. The dimensions of heater 2 are: L2 × D2, where L2 and D2 represent the length and width of heater 2, respectively. L2 is 50-150mm, and D2 is 40-80mm.

[0030] Preferably, heater 2 has both a primary and a backup circuit, comprising a primary heater HL1 and a backup heater HL2. During full satellite power diversion, both primary and backup heaters HL1 and HL2 are activated simultaneously. Generally (except in full satellite diversion), primary heater HL1 is activated first. When heating power is insufficient, backup heater HL2 is activated.

[0031] In this embodiment, the thermal insulation pad 3 is mainly used to reduce the influence of the heat sink on the temperature of the entire satellite. Preferably, the thickness of the thermal insulation pad 3 is generally 10 mm.

[0032] In this embodiment, thermistor 4 is a device used to measure the temperature of heat sink 1. When the integrated electronic unit is not executing control logic, thermistor 4 serves as the input for the temperature sensor of heater 2, turning heater 2 on and off to control the temperature of heat sink 1. The control logic, which is embedded in the integrated electronic unit, refers to the logic used to turn the heater on and off.

[0033] Preferably, the thermistor 4 has a primary and a backup thermistor, including a primary thermistor TR1 and a backup thermistor TR2. Both the primary thermistor TR1 and the backup thermistor TR2 serve as temperature control thermistors for the primary heater HL1 and the backup heater HL2. When the primary thermistor TR1 experiences an abnormality, the backup thermistor TR2 is switched to the temperature control thermistor.

[0034] In this embodiment, if Figure 2 As shown in the figure, the wing of the body suit includes three sub-array layouts: PG1 sub-array, PG2 sub-array and PG3 sub-array. Generally, the PG1 sub-array is located in the center of the wing of the body suit, the PG3 sub-array is located at the edge of the wing of the body suit, and the PG2 sub-array is located between the PG1 sub-array and the PG3 sub-array. It should be noted that in Figure 2 In the figure, the part blocked by the satellite cabin panel is represented by a dotted line.

[0035] In this embodiment, if Figure 3 As shown in the figure, the control logic executed by the integrated electronic stand-alone unit is as follows:

[0036] Get the flag bit of the active dissipation circuit control enable of the body-mounted wing.

[0037] When the active dissipation circuit control enable flag of the body-mounted wing is "allowed", the following conditions are true:

[0038] If the following conditions are met for 30 consecutive seconds: the current of the PG1 sub-array is greater than 4A, the discharge current is less than 0.5A, and the current on-off state is 0; and the on-off state of the PG2 sub-array is 0 for 10 consecutive times (indicating that the battery pack is basically fully charged in the sun-oriented mode in the illuminated area, and the PG2 sub-array is close to full current diversion); then, the main heater HL1 is turned on first, and after an interval of 1 second, the backup heater HL2 is turned on, and the HL1 and HL2 dual-range temperature control flags are set to "disabled".

[0039] If the discharge current of the PG1 array is greater than 0.8A for 30 consecutive seconds (indicating that the satellite enters the shadow area, or the attitude maneuvers and the payload works for a short period of time), the main heater HL1 is disconnected first, and then the backup heater HL2 is disconnected after an interval of 1 second, and the HL1 and HL2 dual-range temperature control flags are set to "allowed".

[0040] Among them, the active dissipation circuit control enable flag of the body-mounted wing is set through the integrated electronic stand-alone unit, and the default is "prohibited"; the HL1 and HL2 dual-interval temperature control flags are set through the integrated electronic stand-alone unit, and the default is "allowed".

[0041] Although the present invention has been disclosed above in terms of preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art may make possible changes and modifications to the technical solutions of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solutions of the present invention shall fall within the scope of protection of the technical solutions of the present invention.

[0042] The contents not described in detail in the specification of the present invention belong to the common knowledge of professionals in this field.

Claims

1. A micro-nano satellite wing-mounted active heat dissipation control device, characterized in that: include: A heat sink (1), a heater (2), a heat insulating pad (3), a thermistor (4) and an integrated electronic stand-alone unit; The heater (2), the heat insulating pad (3), and the thermistor (4) are all arranged on the heat dissipation plate (1); wherein the heater (2) is located on the heat dissipation plate (1), and a plurality of heat insulating pads (3) are located around the heat dissipation plate (1); the integrated electronic stand-alone unit is respectively connected to the thermistor (4) and the heater (2); The heater (2) comprises a main heater HL1 and a backup heater HL2; wherein, when the whole star is split, the main heater HL1 and the backup heater HL2 are turned on at the same time; in cases other than the whole star is split, the main heater HL1 is turned on first, and when the heating power does not meet the demand, the backup heater HL2 is turned on.

2. The micro-nano satellite wing-mounted active heat dissipation control device according to claim 1, characterized in that: The heat dissipation plate (1) is installed on the back of the satellite's body wing via a heat insulation pad (3).

3. The micro-nano satellite wing-mounted active heat dissipation control device according to claim 2, characterized in that: The body-mounted wing includes three sub-array layouts: PG1 sub-array, PG2 sub-array and PG3 sub-array; among them, PG1 sub-array is located in the center of the body-mounted wing, PG3 sub-array is located at the edge of the body-mounted wing, and PG2 sub-array is located between PG1 sub-array and PG3 sub-array.

4. The micro-nano satellite wing-mounted active heat dissipation control device according to claim 3, characterized in that: Comprehensive electronic stand-alone machine for: Get the active dissipation circuit control enable flag of the body-mounted wing; When the active dissipation circuit control enable flag of the body-mounted wing is "allowed", there are: If the following conditions are met for 30 consecutive seconds: the current of PG1 is greater than 4A, the discharge current is less than 0.5A, and the current on / off state is 0; and the on / off state of PG2 is 0 for 10 consecutive times, then the main heater HL1 is turned on first, and after a 1-second interval, the backup heater HL2 is turned on, and the HL1 and HL2 dual-range temperature control flags are set to "disabled". If the discharge current of the PG1 array is greater than 0.8A for 30 consecutive seconds, the main heater HL1 is disconnected first, and then the backup heater HL2 is disconnected after an interval of 1 second, and the HL1 and HL2 dual-range temperature control flags are set to "allowed".

5. The micro-nano satellite wing-mounted active heat dissipation control device according to claim 4, characterized in that: The active dissipation circuit control enable flag of the body-mounted wing is set through the integrated electronic stand-alone unit and is "disabled" by default; the HL1 and HL2 dual-range temperature control flags are set through the integrated electronic stand-alone unit and are "allowed" by default.

6. The micro-nano satellite wing-mounted active heat dissipation control device according to claim 1, characterized in that: The thermistor (4) comprises a main thermistor TR1 and a backup thermistor TR2; wherein the main thermistor TR1 and the backup thermistor TR2 both serve as temperature control thermistors for the main heater HL1 and the backup heater HL2; when an abnormality occurs in the main thermistor TR1, the temperature is switched to the backup thermistor TR2.

7. The micro-nano satellite wing-mounted active heat dissipation control device according to claim 1, characterized in that: The heat dissipation plate (1) is a heat dissipation aluminum plate; the dimensions of the heat dissipation aluminum plate are: L1×D1×H1; wherein L1, D1 and H1 represent the length, width and height of the heat dissipation aluminum plate respectively; the value of L1 is 100-270 mm, the value of D1 is 80-160 mm, and the value of H1 is 2-5 mm; the heater (2) is attached to one side of the heat dissipation aluminum plate, and the side of the heat dissipation aluminum plate not attached to the heater (2) is sprayed with SR107_ZK white paint.

8. The micro-nano satellite wing-mounted active heat dissipation control device according to claim 1, characterized in that: The heater (2) is a double-layer double-circuit heater; the single-circuit heating power of the double-layer double-circuit heater is 15W, and the dual-interval temperature control threshold is [-35°C, -32°C], [-37°C, -34°C]; the size of the heater (2) is: L2×D2; wherein L2 and D2 represent the length and width of the heater (2) respectively; the value of L2 is 50 to 150 mm, and the value of D2 is 40 to 80 mm.

9. The micro-nano satellite wing-mounted active heat dissipation control device according to claim 1, characterized in that: The thickness of the heat insulation pad (3) is 10 mm.

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