Calibration method, device, computing device, and storage medium for temperature sensor

Abstract

The application provides a temperature sensor calibration method, device, computing equipment and storage medium. The temperature sensor is arranged in a chip. The temperature sensor calibration method comprises the following steps: arranging the chip in multiple working modes respectively; acquiring an external reference temperature, a power consumption value of the chip and a temperature measurement value of the temperature sensor in each working mode; calculating a temperature error between the temperature measurement value of the temperature sensor and the external reference temperature; performing fitting processing on the temperature error and the power consumption value, and obtaining a fitting curve; and calibrating the temperature sensor according to the fitting curve. Through the calibration method, the influence of the power consumption of the chip on the calibration accuracy of the temperature sensor can be eliminated, and accurate calibration results can be obtained.

Description

TECHNICAL FIELD

[0001] The present application relates to a temperature sensor calibration method, and in particular to a calibration method, device, computing device and storage medium for improving the calibration accuracy of an in-chip temperature sensor. BACKGROUND

[0002] In existing large-scale integrated circuits, such as processors (CPU, GPU, RISC-V), a temperature sensor is usually integrated to detect the performance parameters of the processor, such as heat generation and heat dissipation.

[0003] The evaluation of the performance of the temperature sensor must put the processor into an ultra-low power consumption mode, otherwise the self-heating will affect the temperature calibration result. The existing processor contains a large number of digital circuits, and after the processor chip is powered on, even if it enters a low power consumption mode, there is still a certain power consumption, which causes serious internal heating, and the real performance of the temperature sensor cannot be evaluated, resulting in a certain error in calibration and affecting the test / calibration result.

[0004] Moreover, in the design and production process of the existing chip, a multi-project wafer (MPW) mode is usually adopted. The multi-project wafer is usually applied to the experiment and test of the integrated circuit kernel (IP), module or unit in the design stage, which can reduce the cost and reduce the development risk. Therefore, it is difficult to achieve ultra-low power consumption (within 50mW) of the chip in the MPW stage, which leads to the fact that the real performance of the temperature sensor cannot be evaluated in the MPW stage.

[0005] Therefore, how to provide a method capable of eliminating the influence of self-power consumption and improving the calibration accuracy of the temperature sensor is one of the problems to be solved. SUMMARY

[0006] The embodiments of the present application provide a temperature sensor calibration method, device, computing device and storage medium, which can eliminate the influence of self-power consumption and improve the calibration accuracy of the temperature sensor.

[0007] The temperature sensor calibration method of an embodiment of the present application, wherein the temperature sensor is arranged in a chip, comprises the following steps: arranging the chip in a plurality of working modes; obtaining an external reference temperature, a power consumption value of the chip and a temperature measurement value of the temperature sensor in each working mode; calculating a temperature error between the temperature measurement value of the temperature sensor and the external reference temperature; fitting the temperature error and the power consumption value to obtain a fitting curve; and calibrating the temperature sensor according to the fitting curve.

[0008] The calibration method, wherein the fitting curve is a linear relationship, and the linear relationship is: Terr=a*P+b, wherein Terr is the temperature error, P is the power consumption value of the chip, and a and b are constants.

[0009] The calibration method, wherein the step of calibrating the temperature sensor further comprises:

[0010] The temperature sensor is calibrated according to the constant b.

[0011] The calibration method, wherein the calibration method further comprises:

[0012] The temperature measurement value of the temperature sensor is compensated according to the fitting curve.

[0013] The calibration method, wherein the external reference temperature is a constant temperature provided by setting the chip in a temperature box or an oil tank.

[0014] The calibration method, wherein the plurality of working modes comprises a plurality of power consumption modes, and each power consumption mode is a set power consumption of the chip.

[0015] The calibration device of the temperature sensor in an embodiment of the present application, the temperature sensor is arranged in a chip, comprising: a mode setting unit, used for setting the chip to be in a plurality of working modes respectively; a data acquisition unit, used for acquiring an external reference temperature, a power consumption value of the chip and a temperature measurement value of the temperature sensor in each working mode; a calculation unit, used for calculating a temperature error between the temperature measurement value of the temperature sensor and the external reference temperature; a fitting unit, used for fitting the temperature error and the power consumption value, and obtaining a fitting curve; and a calibration unit, used for calibrating the temperature sensor according to the fitting curve.

[0016] The calibration device, wherein the fitting curve is a linear relationship, and the linear relationship is: Terr=a*P+b, wherein Terr is the temperature error, P is the power consumption value of the chip, and a and b are constants.

[0017] The calibration device, wherein the step of calibrating the temperature sensor further comprises:

[0018] The temperature sensor is calibrated according to the constant b.

[0019] The calibration device, wherein the calibration device further comprises:

[0020] A compensation unit, used for compensating the temperature measurement value of the temperature sensor according to the fitting curve.

[0021] The calibration device, wherein the external reference temperature is a constant temperature provided by setting the chip in a temperature box or an oil tank.

[0022] The calibration device, wherein the multiple working modes include multiple power consumption modes, each of the power consumption modes is a set power consumption of the chip.

[0023] The computing device of the embodiment of the present application comprises at least one calibration device of any of the temperature sensors.

[0024] The storage medium of the embodiment of the present application is used for storing a computer program for executing the calibration method of any of the temperature sensors.

[0025] The present application is described in detail below in combination with the drawings and specific embodiments, but is not limited to the present application. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1A is a structural schematic diagram of a multi-project wafer of an embodiment of the present application.

[0027] Figure 1B is a structural schematic diagram of a chip of an embodiment of the present application.

[0028] Figure 2 is a flowchart of a calibration method of a temperature sensor of an embodiment of the present application.

[0029] Figure 3 is a schematic diagram of a fitting curve of an embodiment of the present application.

[0030] Figure 4 is a flowchart of a calibration method of a temperature sensor of another embodiment of the present application.

[0031] Figure 5 is a structural schematic diagram of a calibration device of a temperature sensor of an embodiment of the present application.

[0032] Figure 6 is a structural schematic diagram of a calibration device of a temperature sensor of another embodiment of the present application.

[0033] In the drawings, reference numerals:

[0034] 10: multi-project wafer

[0035] A-E: chip

[0036] A1-A5: module

[0037] 100: calibration method

[0038] S101-S105: Steps

[0039] 200: Calibration device

[0040] 201: Mode setting unit

[0041] 202: Data acquisition unit

[0042] 203: Operation unit

[0043] 204: Fitting unit

[0044] 205: Calibration unit

[0045] 300: Calibration device

[0046] 301: Mode setting unit

[0047] 302: Data acquisition unit

[0048] 303: Operation unit

[0049] 304: Fitting unit

[0050] 305: Calibration unit

[0051] 306: Compensation unit DETAILED DESCRIPTION

[0052] The structural principle and working principle of the present application will be described in detail below in combination with the drawings:

[0053] In order to better understand the present application, some terms used in the present application are explained as follows.

[0054] The chip can be a processor chip, such as a microprocessor, a computing processing unit, a digital signal processing unit, a complex instruction set computing (CISC) microprocessor, a reduced instruction set (RISC) microprocessor, a graphics processing unit (GPU), a neural network processing unit (NPU), a dedicated data processing unit (DPU), or any other type of processor or processing circuit that can be implemented by an integrated circuit, etc., or other types of chips integrated with temperature sensors.

[0055] Multi-project wafer (MPW) refers to the manufacture of chips of different designs, different processes, and / or different sizes in the same wafer.

[0056] The temperature sensor refers to a sensor that can convert the temperature of the environment in which the sensor is located into a usable output signal, which can be a thermal resistance temperature sensor or a thermocouple temperature sensor.

[0057] The external reference temperature refers to the reference temperature for calibration of the temperature sensor, which is generally a stable temperature environment provided by a temperature chamber or an oil tank.

[0058] Figure 1A is a structural schematic diagram of a multi-project wafer according to an embodiment of the present application, Figure 1B is a structural schematic diagram of a chip according to an embodiment of the present application. As shown in Figure 1A , Figure 1B , different chips, such as chip A, chip B, chip C, chip D and chip E, can be manufactured on a wafer in the multi-project wafer 10. Of course, there can be other different chips on the multi-project wafer 10, or the same chips as chip A, chip B, chip C, chip D or chip E. Taking chip A as an example, a plurality of modules, such as module A-1, module A-2, module A-3, module A-4 and module A-5, are arranged in chip A. Among them, module A-1 can be a temperature sensor, and module A-2, module A-3, module A-4 and module A-5 can be any module that implements a certain function, and the present application is not limited thereto. Since module A-1, module A-2, module A-3, module A-4 and module A-5 are designed in the same chip, they share the same power supply and ground. Therefore, when testing chip A, power supply needs to be provided to module A-1, module A-2, module A-3, module A-4 and module A-5 at the same time, and chip A is difficult to work in ultra-low power consumption (within 50mW), which leads to the inability to evaluate the real performance of the temperature sensor.

[0059] Figure 2 is a flowchart of a calibration method of a temperature sensor according to an embodiment of the present application. As shown in Figure 2 , the calibration method 100 of the temperature sensor according to the present application includes the following steps:

[0060] Step S101, setting a working mode, for setting a chip integrated with a temperature sensor to work in a plurality of different power consumption working modes. For example, the chip is configured to enter working modes M1, M2, M3, M4, M5...Mn, i.e. n different working modes, and the power consumption of the chip is different in each working mode, and preferably, the power consumption of the chip is configured in a gradually increasing trend. The power consumption of the chip can also be configured in other trends, such as decreasing, uneven distribution, etc., and the present application is not limited thereto.

[0061] Step S102, obtaining external reference temperature, power consumption value and temperature measurement value. Specifically, according to the different power consumption working modes set in step S101, the external reference temperature values Tref1, Tref2, Tref3, Tref4, Tref5,... Trefn of the chip under each working mode M1, M2, M3, M4, M5... Mn, the power consumption values P1, P2, P3, P4, P5... Pn of the chip under each working mode, and the temperature measurement values Ts1, Ts2, Ts3, Ts4, Ts5... Tsn of the temperature sensor under each working mode are obtained.

[0062] Of course, according to the working modes set in step S101, only the external reference temperature values, power consumption values and temperature measurement values of the temperature sensor of the chip under part of the working modes can be obtained, and the present application is not limited thereto.

[0063] Among them, the external reference temperature value Tref is the reference temperature for the calibration of the temperature sensor, which is usually the stable environmental temperature of the chip, and the temperature value is a constant value, which can be provided by setting the chip in a temperature box or an oil tank, and the present application is not limited thereto, as long as a stable working environmental temperature can be provided. The power consumption value P is the actual power consumption value of the chip under each working mode, which is usually the same as the power consumption value set in step S101, and there can be a certain deviation, and in the following steps, the power consumption value obtained in step S102 is used as the reference. The temperature measurement value Ts is the actual value read by the temperature sensor.

[0064] Step S103, calculating temperature error. According to the data obtained in step S102, the temperature error Terr of the temperature sensor of the chip under each working mode is calculated. The temperature error Terr is the difference between the temperature measurement value Ts and the external reference temperature value Tref, i.e. Terr = Ts-Tref, and thus the temperature error Terr1, Terr2, Terr3, Terr4, Terr5... Terrn of the temperature sensor under each working mode can be obtained.

[0065] Step S104, fitting processing. According to the actual power consumption value P of the chip obtained in step S102 and the temperature error Terr calculated in step S103, the temperature error Terr and the power consumption value P are fitted, which can be fitted by linear regression method, or other fitting processing method. Moreover, in the present application, only the temperature error and the power consumption value are fitted, and other parameters can also be fitted together, and the present application is not limited thereto.

[0066] The following is described with specific measurement data. Table 1 is the data obtained under 5 power consumption modes, which is as follows:

[0067] Table 1

[0068]

[0069] Figure 3 This is a schematic diagram of a fitting curve according to an embodiment of the present invention. Figure 3 As shown in Table 1, the temperature error Terr and chip power consumption values ​​were fitted to obtain the following results: Figure 3 The fitted curve shown in this embodiment is a straight line, which conforms to the following formula: Terr=a*P+b, where a and b are constants, a=20.96 and b=0.3499.

[0070] Therefore, it can be seen that before the fitting process, calibration can only be performed under a certain low power consumption condition, such as mode M1, where the chip power consumption P1 is 0.152W, based on a temperature error of 3.56℃. Through the fitting process of this embodiment, the temperature error of the chip under zero power consumption conditions can be obtained from the fitting curve or the formula Terr = a*P + b, i.e., the temperature error value Terr = 0.3499 calculated when P = 0. By comparison, it can be concluded that according to the calibration method of this invention, the calibration accuracy can be improved from approximately 3.5 to approximately 0.35, greatly improving the calibration accuracy of the temperature sensor.

[0071] Step S105, Calibration. The temperature sensor is calibrated based on the fitting curve obtained in step S104. The specific calibration method is well known to those skilled in the art and will not be described in detail here.

[0072] Figure 4 This is a schematic flowchart of a temperature sensor calibration method according to another embodiment of the present invention. Figure 4 As shown, the temperature sensor calibration method 100 of the present invention may further include a compensation step. After calibrating the temperature sensor as in step S105, the temperature measurement value of the temperature sensor is compensated according to the fitting curve obtained in step S104, so as to obtain a more accurate temperature measurement value of the temperature sensor in any power consumption mode.

[0073] Figure 5 This is a schematic diagram of the structure of a temperature sensor calibration device according to an embodiment of the present invention. Figure 5 As shown, the temperature sensor calibration device 200 of the present invention includes a mode setting unit 201, a data acquisition unit 202, a calculation unit 203, a fitting unit 204, and a calibration unit 205.

[0074] Specifically, the mode setting unit 201 is configured to set the chip integrated with the temperature sensor to work in a plurality of different power consumption modes. For example, the chip is configured to enter modes M1, M2, M3, M4, M5...Mn, i.e. n different working modes, and the power consumption of the chip is different in each working mode. Preferably, the power consumption of the chip is configured to gradually increase. The power consumption of the chip can also be configured according to other trends, such as decreasing, uneven distribution, etc., and the present application is not limited in this regard.

[0075] The data acquisition unit 202 is configured to acquire external reference temperature, power consumption value and temperature measurement value. Specifically, according to the different power consumption modes set by the mode setting unit 201, the external reference temperature values Tref1, Tref2, Tref3, Tref4, Tref5...Trefn of the chip in each working mode M1, M2, M3, M4, M5...Mn, the power consumption values P1, P2, P3, P4, P5...Pn of the chip in each working mode, and the temperature measurement values Ts1, Ts2, Ts3, Ts4, Ts5...Tsn of the temperature sensor of the chip in each working mode are acquired.

[0076] The external reference temperature value Tref is used as the reference temperature for temperature sensor calibration, and is usually the stable environmental temperature at which the chip works. The temperature value is a constant value, which can be provided by setting the chip in a temperature box or an oil tank, and the present application is not limited in this regard as long as a stable working environmental temperature can be provided. The power consumption value P is the actual power consumption value of the chip in each working mode, which is usually the same as the power consumption value set by the mode setting unit 201, and can also have a certain deviation, and the power consumption value acquired by the data acquisition unit is used as the reference. The temperature measurement value Ts is the actual reading value of the temperature sensor.

[0077] The operation unit 203 is configured to calculate the temperature error. According to the data acquired by the data acquisition unit 202, the temperature error Terr of the temperature sensor of the chip in each working mode is calculated. The temperature error Terr is the difference between the temperature measurement value Ts and the external reference temperature value Tref, i.e. Terr=Ts-Tref, and thus the temperature error Terr1, Terr2, Terr3, Terr4, Terr5...Term of the temperature sensor in each working mode can be obtained.

[0078] The fitting unit 204 is configured to perform fitting processing. According to the actual power consumption value P of the chip obtained by the data acquisition unit 202 and the temperature error Terr calculated by the calculation unit 203, the fitting processing is performed on the temperature error Terr and the power consumption value P. The fitting processing can be performed by using a linear regression method, or other fitting processing methods. Moreover, in the present application, only the fitting processing is performed on the temperature error and the power consumption value. The fitting processing can also be performed on other parameters. The present application is not limited in this regard.

[0079] The calibration unit 205 is configured to calibrate the temperature sensor. According to the fitting curve obtained by the fitting unit 204, the calibration is performed on the temperature sensor. The specific calibration method is known to those skilled in the art, and will not be described here.

[0080] Figure 6 FIG. 3 is a structural schematic diagram of a calibration device of a temperature sensor according to another embodiment of the present application. As shown in FIG. 3, the calibration device 300 of the temperature sensor of the present application further comprises a compensation unit 306 in addition to the mode setting unit 301, the data acquisition unit 302, the calculation unit 303, the fitting unit 304 and the calibration unit 205. After the calibration is performed on the temperature sensor, according to the fitting curve obtained by the fitting unit 304, the temperature measurement value of the temperature sensor is compensated to obtain a more accurate temperature measurement value of the temperature sensor under any power consumption mode. Figure 6

[0081] Of course, the above-mentioned units are taken as examples for description in the present application. According to the needs, other units can be further included in the calibration device of the temperature sensor, or some of the units can be omitted. The present application will not be described here. Moreover, the calibration method and the calibration device of the temperature sensor in the present application can be applied not only to the multi-project wafer stage, but also to other production, testing and use stages of the chip.

[0082] The present application further provides a computing device comprising at least one calibration device of a temperature sensor according to any one of the above-mentioned embodiments.

[0083] The present application further provides a storage medium for storing a computer program, wherein the computer program is configured to execute the calibration method of a temperature sensor according to any one of the above-mentioned embodiments.

[0084] In summary, according to the embodiments of the present application, the reading data of the temperature sensor at zero power consumption of the chip can be calculated by power consumption fitting, and the influence of the power consumption of the chip on the calibration of the temperature sensor is eliminated. Moreover, the calibration method of the present application does not require the chip to enter very low power consumption. Only the chip needs to enter multiple power consumption modes, so that the low power consumption design of the chip is relatively easy.

[0085] ​Of course, the present application can have other various embodiments, and those skilled in the art can make various corresponding changes and modifications according to the present application without departing from the spirit and essence of the present application, and these corresponding changes and modifications shall all belong to the protection scope of the claims of the present application.

Claims

1. A calibration method for a temperature sensor, wherein the temperature sensor is disposed within a chip, characterized in that, Includes the following steps: The chip is configured to operate in multiple modes. Acquire the external reference temperature, the power consumption value of the chip, and the temperature measurement value of the temperature sensor in at least two of the operating modes; Calculate the temperature error between the temperature measurement value of the temperature sensor and the external reference temperature; The temperature error and the power consumption value are fitted to obtain a fitting curve; The temperature sensor is calibrated according to the fitted curve. The fitted curve exhibits a linear relationship, which is: Terr = a * P + b, where Terr is the temperature error, P is the power consumption of the chip, and a and b are constants. The step of calibrating the temperature sensor further includes: calibrating the temperature sensor according to the constant b.

2. The calibration method as described in claim 1, characterized in that, The calibration method further includes: The temperature measurement value of the temperature sensor is compensated based on the fitted curve.

3. The calibration method as described in claim 1, characterized in that, The external reference temperature is a constant temperature, which is provided by placing the chip in a temperature chamber or oil tank.

4. The calibration method as described in claim 1, characterized in that, The multiple operating modes include multiple power consumption modes, each of which is the power consumption at which the chip operates.

5. A calibration device for a temperature sensor, wherein the temperature sensor is disposed within a chip, characterized in that, include: A mode setting unit is used to set the chip to be in multiple operating modes respectively; The data acquisition unit is used to acquire the external reference temperature, the power consumption value of the chip, and the temperature measurement value of the temperature sensor in at least two of the operating modes. The arithmetic unit is used to calculate the temperature error between the temperature measurement value of the temperature sensor and the external reference temperature; A fitting unit is used to perform fitting processing on the temperature error and the power consumption value, and obtain a fitting curve; A calibration unit is used to calibrate the temperature sensor according to the fitted curve. The fitted curve exhibits a linear relationship, which is: Terr = a * P + b, where Terr is the temperature error, P is the power consumption of the chip, and a and b are constants. The step of calibrating the temperature sensor further includes: calibrating the temperature sensor according to the constant b.

6. The calibration apparatus as described in claim 5, characterized in that, The calibration device further includes: The compensation unit is used to compensate the temperature measurement value of the temperature sensor according to the fitting curve.

7. The calibration apparatus as described in claim 5, characterized in that, The external reference temperature is a constant temperature, which is provided by placing the chip in a temperature chamber or oil tank.

8. The calibration apparatus as described in claim 5, characterized in that, The multiple operating modes include multiple power consumption modes, each of which is the power consumption at which the chip operates.

9. A computing device, characterized in that: It includes at least one of the calibration devices as described in any of claims 5-8.

10. A storage medium for storing computer programs, characterized in that: The computer program is used to perform any one of the calibration methods as described in claims 1-4.

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