Partition plate, total heat exchange element and total heat exchanger using the partition plate, and manufacturing method of the partition plate

Abstract

A separator for a ventilation device that supplies and exhausts air simultaneously. The separator has: a first layer composed of a first porous substrate formed with a plurality of first holes, and first pinholes are formed through at least a part of the first holes; a second layer laminated on the first layer, composed of a second porous substrate formed with a plurality of second holes, and second pinholes are formed through at least a part of the second holes and are arranged at positions different from the positions facing the first pinholes; and a third layer laminated on the second layer, which is a water-insoluble moisture-permeable resin.

Description

Technical Field

[0001] The present disclosure relates to a partition plate used in a ventilation device that simultaneously supplies air from the outside to the inside and exhausts air from the inside to the outside, a total heat exchange element and a total heat exchanger using the partition plate, and a method for manufacturing the partition plate. Background Art

[0002] As a method of ventilating without impairing the cooling and heating effects of the room, there is a method of ventilating while performing heat exchange between the air supply from the outside to the inside and the air exhaust from the inside to the outside. In addition, in order to improve the efficiency of heat exchange, it is effective to perform exchange of temperature as latent heat and humidity as sensible heat, that is, total heat exchange, between the air supply and the air exhaust.

[0003] A total heat exchanger that performs total heat exchange generally has a structure in which flat partition plates and corrugated spacer plates are alternately stacked. When the partition plates and the spacer plates are stacked, the direction of the waves of the spacer plates becomes orthogonal every other layer, and through this structure, a flow path for air supply and a flow path for air exhaust are formed.

[0004] For example, in winter, in each flow path separated by the spacer plate, outdoor air as the air supply and indoor air as the air exhaust pass through. At this time, the air supply and the air exhaust exchange temperature and humidity via the partition plate. The partition plate that performs heat exchange has moisture permeability that allows water vapor to pass through but does not allow air to pass through. In addition, the partition plate has ventilation and gas shielding properties due to the isolation of the air supply and the air exhaust. As a result, the air supply is heated and humidified and then supplied to the room, and the air exhaust is cooled and dehumidified and then discharged to the outside. By having both moisture permeability and gas shielding properties, the partition plate realizes ventilation based on total heat exchange.

[0005] With the popularization of total heat exchangers, in order to be able to arrange the total heat exchanger in an environment where the temperature difference between the air supply and the air exhaust is large and condensation is likely to occur, the partition plate material is required to be moisture-resistant. An environment where condensation is likely to occur is, for example, a cold region, a bathroom, or a hot water pool. In the conventional total heat exchanger, by adding a hygroscopic salt such as lithium chloride or calcium chloride to the partition plate, the moisture permeability of the partition plate is improved, and the total heat exchange efficiency is improved.

[0006] If a partition plate containing a hygroscopic salt is used in an environment where condensation is likely to occur, it will absorb moisture to an extent that the partition plate cannot hold, and the hygroscopic salt will dissolve out, so the performance cannot be maintained. In addition, in order to improve the moisture permeability of the partition plate without adding a hygroscopic salt, it is effective to reduce the moisture permeation resistance by a thin moisture permeable membrane. However, for a paper partition plate commonly used for partition plates, it is difficult to thin the moisture permeable membrane to a thickness below that of pulp fibers. Therefore, a resin-made partition plate has been proposed.

[0007] As a resin separator, for example, there is known a total heat exchanger that uses a separator having a structure in which polytetrafluoroethylene (PTFE), which is a porous resin film, is sandwiched between a nonwoven fabric and a cured moisture-permeable resin, and performs sensible heat and latent heat total heat exchange between air supply and exhaust. When the resin separator is, for example, a polyurethane-based moisture-permeable resin, it is manufactured by the following method: A coating liquid mixed with two components, a polyol and a polyisocyanate, is applied in a fluid state before the curing reaction ends, and then heat-cured.

[0008] In addition, as a resin separator, there is also known a separator obtained by applying a polyurethane resin dispersed in water as a polar proton solvent to one side of a porous substrate.

[0009] In addition, Patent Document 1 discloses a moisture-permeable waterproof sheet having a solvent-based polyurethane resin applied to one side of a porous substrate and a reinforcing fabric on the other side. The moisture-permeable waterproof sheet described in Patent Document 1 is not for total heat exchanger use, but is manufactured by a method of applying a polyurethane resin composition having a viscosity of 1000 mPa·s to 30000 mPa·s to at least one side of a continuous porous substrate and drying it.

[0010] Prior Art Documents

[0011] Patent Documents

[0012] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2010-215918 Summary of the Invention

[0013] Problems to be Solved by the Invention

[0014] If the separator is manufactured by the method described in Patent Document 1, a coating film with a film thickness of 10 μm can be produced, but there is a tendency for the moisture permeability to decrease due to the increase in thickness. When the coating film is thinned to obtain high moisture permeability, it is difficult to stably form a film because the viscosity of the polyurethane resin composition is high.

[0015] In addition, the porous substrate is a substrate formed with fine communication pores having a pore diameter of 0.1 μm or less. On a part of the porous substrate, there are parts with a pore diameter greater than 0.1 μm scattered as defects, and many pinholes formed by the connection of these defects are generated. In order to reduce the viscosity of the coating film and achieve thinning, it is necessary to suppress the penetration of the coating liquid caused by the pinholes of the porous substrate. If resin penetration occurs, when the separator is formed into a roll during the manufacture of the separator, the resin on the coating surface comes into contact with the penetrated resin, and adhesion due to the stickiness of the surface occurs. If adhesion occurs, when the separator is fed out, the resin peels off from the substrate, and the gas barrier property decreases.

[0016] The present disclosure is completed to solve the above problems, and an object thereof is to obtain a partition plate capable of suppressing the occurrence of resin penetration during manufacturing, a total heat exchange element using the partition plate, a total heat exchanger, and a method for manufacturing the partition plate.

[0017] Solution to the problems

[0018] The partition plate of the present disclosure includes: a first layer composed of a first porous substrate formed with a plurality of first holes, and first pinholes are formed through at least a part of the first holes; a second layer laminated on the first layer, composed of a second porous substrate formed with a plurality of second holes, and second pinholes are formed through at least a part of the second holes, and the second pinholes are arranged at positions different from the positions facing the first pinholes; and a third layer laminated on the second layer, which is a water-insoluble moisture-permeable resin.

[0019] Effects of the invention

[0020] According to the partition plate of the present disclosure, since the first pinholes of the first layer and the second pinholes of the second layer are arranged at different positions and are not continuous, the water-insoluble moisture-permeable resin that becomes the third layer laminated on the first layer and the second layer does not pass through the first pinholes and the second pinholes. Therefore, a partition plate in which resin penetration in the first layer and the second layer is suppressed can be obtained. Description of the drawings

[0021] Figure 1 It is a cross-sectional view of the partition plate of Embodiment 1.

[0022] Figure 2 It is a schematic diagram for explaining the manufacturing process of the partition plate of Embodiment 1.

[0023] Figure 3 It is a perspective view of the total heat exchange element of Embodiment 2.

[0024] Figure 4 It is a schematic diagram of the total heat exchanger of Embodiment 3. Detailed description of the invention

[0025] Embodiment 1

[0026] [Structure of partition plate 4]

[0027] Hereinafter, the partition plate 4 of the present disclosure will be described. In addition, in the following drawings, the size relationships of the respective constituent members may sometimes be different from the actual ones. In addition, in the following drawings, members denoted by the same reference numerals are the same or corresponding members, which is common throughout the specification. Furthermore, the forms of the constituent elements shown throughout the specification are merely examples and are not limited to these descriptions.

[0028] Figure 1This is a cross-sectional view of the separator 4 of Embodiment 1. As Figure 1 shown, the separator 4 has a three-layer structure formed by laminating a first layer 11, a second layer 12, and a third layer 13.

[0029] The first layer 11 is a first porous substrate 111 in which a plurality of first holes 111a are formed. The first holes 111a are, for example, air bubbles. A first pinhole 21 formed by at least a part of the first holes 111a is formed on the first porous substrate 111 of the first layer 11. The first pinhole 21 is a through-hole formed by connecting a plurality of first holes 111a.

[0030] The second layer 12 is a second porous substrate 121 in which a plurality of second holes 121a are formed. The second holes 121a are, for example, air bubbles. A second pinhole 22 formed by at least a part of the second holes 121a is formed on the second porous substrate 121 of the second layer 12. The second pinhole 22 is formed at a position different from the first pinhole 21 formed in the first layer 11 on which the second layer 12 is laminated. That is, the second pinhole 22 is arranged at a position different from the position facing the first pinhole 21. The second pinhole 22 is formed at a position deviated from the first pinhole 21, and the first pinhole 21 is formed in the first layer 11 on which the second layer 12 is laminated. The second pinhole 22 is a through-hole formed by connecting a plurality of second holes 121a. Since the first pinhole 21 and the second pinhole 22 are arranged at non-overlapping positions, the first pinhole 21 and the second pinhole 22 formed in the separator 4 are not continuous.

[0031] The third layer 13 is laminated on the laminate formed by laminating the first layer 11 and the second layer 12. The third layer 13 is a water-insoluble moisture-permeable resin.

[0032] As the third layer 13, when a coating liquid mixed with two components of polyol and polyisocyanate is used instead of the water-insoluble moisture-permeable resin, there is a problem in terms of the stability during the storage of the coating liquid. In addition, if this coating liquid is used for the separator, it can also be considered that the fluidity of the resin will be lost during the film-forming process. In Embodiment 1, since the water-insoluble moisture-permeable resin is used as the third layer 13, the fluidity is not lost during the film-forming process, and the manufacturing stability can be maintained.

[0033] As the third layer 13, when a water-dispersed polyurethane resin is used instead of the water-insoluble moisture-permeable resin, the water-dispersed polyurethane resin has a structure having polyethylene oxide in the side chain. When the water-dispersed polyurethane resin is placed in a high-temperature and high-humidity environment at 50 to 70°C or higher, which is the melting point of polyethylene oxide, deformation due to moisture absorption and swelling occurs. In Embodiment 1, since the water-insoluble moisture-permeable resin is used as the third layer 13, the moisture permeability can be maintained, deformation due to swelling is not likely to occur, and long-term stability can be maintained.

[0034] [Method for manufacturing the separator 4]

[0035] Figure 2 This is a schematic diagram showing the manufacturing process of the separator 4 of Embodiment 1. As Figure 2 shown, the manufacturing process of the separator 4 includes: a lamination process of laminating the first layer 11 and the second layer 12; and a coating process of coating a water-insoluble moisture-permeable resin solution on the laminated first layer 11 and second layer 12. In Figure 2 , the illustration of the first hole 111a and the second hole 121a is omitted.

[0036] First, as Figure 2 (a) shows, in the preparation process, the first layer 11 and the second layer 12 are prepared. Then, as Figure 2 (b) shows, in the lamination process, the prepared first layer 11 and second layer 12 are laminated to produce a porous substrate with a two-layer structure. The first layer 11 is a first porous substrate 111 formed with first pinholes 21. The second layer 12 is a second porous substrate 121 formed with second pinholes 22. Through the lamination process, a porous substrate with a two-layer structure in which the first pinholes 21 and the second pinholes 22 are arranged at different positions can be obtained.

[0037] Next, as Figure 2 (c) shows, in the coating process, a water-insoluble moisture-permeable resin is coated on the surface of the second porous substrate 121 of the second layer 12, thereby completing the third layer 13. The coating process may also include a drying process. The drying process is a process of drying the water-insoluble moisture-permeable resin coated on the surface of the second porous substrate 121 of the second layer 12.

[0038] Through the above processes, the separator 4 formed by laminating the first layer 11, the second layer 12, and the third layer 13 is manufactured.

[0039] In addition, a porous substrate with a two-layer structure formed by laminating the first porous substrate 111 and the second porous substrate 121 is prepared in advance. Even if the coating process shown in Figure 4 (c) is performed on the prepared porous substrate with a two-layer structure, the same laminate can be manufactured.

[0040] [Properties of the first porous substrate 111 of the first layer 11]

[0041] · Material of the first porous substrate 111

[0042] The material of the first porous substrate 111 is, for example, polyamides such as aramid or nylon (registered trademark), polyester, polyethylene, polypropylene, polycarbonate, polyimide, polyethylene terephthalate, cellulose, rayon, etc. resins, glass, etc. Among them, polyolefin resins such as polyethylene or polypropylene are preferred because of their low hygroscopicity.

[0043] ·Shape of the first porous substrate 111

[0044] The shape of the first porous substrate 111 is preferably processed into a film or sheet form.

[0045] ·Method for making the first porous substrate 111 porous

[0046] The first porous substrate 111 can be fabricated using porous-making methods such as the stretching method, phase separation method, cracking method, self-assembly method, track etching method, etc. Among them, from the perspective of productivity, it is preferred to make it porous by the stretching method. On the other hand, non-woven fabrics, knitted fabrics, or woven fabrics made by randomly stacking fibers are not preferred as porous substrates because of the poor uniformity of voids and surface smoothness, making it difficult to obtain uniform coating accuracy.

[0047] ·Porosity of the first porous substrate 111

[0048] The porosity of the first porous substrate 111 is preferably 30% or more and 80% or less, more preferably 35% or more and 65% or less. By making the porosity of the first porous substrate 111 30% or more, the effective moisture permeability area can be maintained, and sufficient moisture permeability performance can be obtained. By making the porosity of the first porous substrate 111 80% or less, the strength of the first porous substrate 111 can be maintained, preventing a decrease in processability.

[0049] ·Calculation method for the porosity of the first porous substrate 111

[0050] When calculating the porosity of the first porous substrate 111, first, cut the material of the first porous substrate 111 in the form of a film into a square with a side length of 10 cm, and measure the weight: W (g) and thickness: D (cm). Then, calculate the weight of the material in the sample of the first porous substrate 111. Divide the weight of each material: W i (g) by the true specific gravity to calculate the volume of each material, and obtain the porosity (volume %) through the following formula.

[0051] [Mathematical formula 1]

[0052] Porosity (volume %) = 100 - [{(W1 / true specific gravity 1) + (W2 / true specific gravity 2) + ······ + (W n / true specific gravity n )} / (10 × 10 × D)] × 100

[0053] ·Average pore diameter of the first pore 111a

[0054] The average pore diameter of the first pores 111a is preferably 0.01 μm or more and 0.1 μm or less. By setting the average pore diameter of the first pores 111a to 0.01 μm or more, an increase in the adsorption of moisture to the first porous substrate 111 due to an increase in the specific surface area of the first porous substrate 111 can be prevented. By setting the average pore diameter of the first pores 111a to 0.1 μm or less, penetration of the coating liquid into the first porous substrate 111 during coating of the coating liquid that becomes the third layer 13 can be suppressed. Here, the measurement method of the average pore diameter can be carried out by using both the gas adsorption method using nitrogen and the mercury intrusion method.

[0055] · Air permeability of the first porous substrate 111

[0056] The air permeability of the first porous substrate 111 is preferably 400 seconds or less. By setting the air permeability of the first porous substrate 111 to 400 seconds or less, a reduction in the effective moisture permeation area can be suppressed, and sufficient moisture permeation performance can be obtained. "Air permeability" refers to the air permeability measured according to JIS P8117. Specifically, the air permeability of the water-insoluble porous substrate layer can be obtained by measuring the time (seconds) for air with a volume of 100 cm 3 (100 mL) to pass through a substrate with an area of 645 mm 2 .

[0057] · Ratio of the average pore diameter to the porosity of the first pores 111a

[0058] The ratio of the average pore diameter to the porosity of the first pores 111a (average pore diameter (μm) / porosity) is preferably 0.0001 to 0.0033. By setting it within such a range, the moisture permeability of the first porous substrate 111 alone is ensured, and penetration of the coating liquid is suppressed.

[0059] · Thickness of the first porous substrate 111

[0060] The thickness of the first porous substrate 111 is preferably 2 μm or more and 25 μm or less, more preferably 5 μm or more and 15 μm or less. If the thickness of the first porous substrate 111 is 2 μm or more, the strength required for the separator 4 can be obtained. If the thickness of the first porous substrate 111 is less than 25 μm, moisture permeability can be ensured.

[0061] [Properties of the second porous substrate 121 of the second layer 12]

[0062] · Material of the second porous substrate 121

[0063] The material of the second porous substrate 121 is, for example, polyamides such as aramid or nylon (registered trademark), polyester, polyethylene, polypropylene, polycarbonate, polyimide, polyethylene terephthalate, cellulose, rayon and other resins, glass, etc. Polyolefin resins such as polyethylene or polypropylene have low hygroscopicity, so they are preferred. The materials that can be used for the second porous substrate 121 are the same as those that can be used for the first porous substrate 111.

[0064] It is preferable to use the same material for the first porous substrate 111 and the second porous substrate 121. By making the materials of the first porous substrate 111 and the second porous substrate 121 the same, the possibility of peeling due to different thermal expansion rates or moisture absorption rates can be suppressed.

[0065] · Shape of the second porous substrate 121

[0066] The shape of the second porous substrate 121 is the same as that of the first porous substrate 111, and it can be processed into a film or sheet.

[0067] · Method for making the second porous substrate 121 porous

[0068] The method for making the second porous substrate 121 porous is the same as that of the first porous substrate 111, and the second porous substrate 121 can be formed by a stretching treatment method, a phase separation method, a cracking method, a self-assembly method, a track etching method, etc. Among them, from the viewpoint of productivity, it is preferable to make it porous by the stretching treatment method. On the other hand, non-woven fabrics made by laminating fibers, etc., are not preferred because the uniformity of the voids is low and the surface smoothness is also poor, so it is difficult to obtain uniform coating accuracy.

[0069] · Surface of the second porous substrate 121

[0070] In order to improve the film-forming property of the third layer 13, it is preferable to improve the wettability of the surface of the second porous substrate 121 by surface modification. Specifically, surface modification can be carried out using corona treatment, plasma treatment, ozone treatment, or ultraviolet treatment, etc. Among them, surface modification using corona treatment is preferred. These surface modification methods can be appropriately adjusted according to the type of the second porous substrate 121.

[0071] · Porosity of the second porous substrate 121

[0072] The porosity of the second porous substrate 121 is the same as that of the first porous substrate 111, preferably 30% or more and 80% or less, more preferably 35% or more and 65% or less. By setting the porosity of the second porous substrate 121 to 30% or more, the effective moisture permeable area can be maintained and sufficient moisture permeation performance can be obtained. By setting the porosity of the second porous substrate 121 to 80% or less, the strength of the second porous substrate 121 can be maintained and a reduction in processability can be prevented. In addition, the method for calculating the porosity of the second porous substrate 121 can be the same as the method for calculating the porosity of the first porous substrate 111.

[0073] · Average pore diameter of the second pores 121a

[0074] The average pore diameter of the second pores 121a is the same as that of the first pores 111a of the first porous substrate 111, preferably 0.01 μm or more and 0.1 μm or less. By setting the average pore diameter of the second pores 121a to 0.01 μm or more, an increase in the adsorption of moisture to the second porous substrate 121 due to an increase in the specific surface area of the second porous substrate 121 can be prevented. By setting the average pore diameter of the second pores 121a to 0.1 μm or less, the penetration of the coating liquid into the second porous substrate 121 during the coating of the coating liquid that becomes the third layer 13 can be suppressed. In addition, the method for measuring the average pore diameter of the second pores 121a can be the same as the method for measuring the average pore diameter of the first pores 111a of the first porous substrate 111.

[0075] · Air permeability of the second porous substrate 121

[0076] The air permeability of the second porous substrate 121 is the same as that of the first porous substrate 111, preferably 400 seconds or less. By setting the air permeability of the second porous substrate 121 to 400 seconds or less, a reduction in the effective moisture permeable area can be suppressed and sufficient moisture permeation performance can be obtained. In addition, the definition of the air permeability of the second porous substrate 121 is the same as that of the first porous substrate 111.

[0077] · Ratio of the average pore diameter of the second pores 121a to the porosity

[0078] The ratio of the average pore diameter of the second pores 121a to the porosity is the same as the ratio of the average pore diameter of the first pores 111a of the first porous substrate 111 to the porosity, preferably 0.0001 to 0.0033. The ratio of the average pore diameter of the second pores 121a to the porosity is calculated by average pore diameter (μm) / porosity. By setting it within such a range, the moisture permeability of the second porous substrate 121 alone can be ensured and the penetration of the coating liquid can be easily suppressed.

[0079] · Thickness of the second porous substrate 121

[0080] The thickness of the second porous substrate 121 is the same as that of the first porous substrate 111, preferably 2 μm or more and 25 μm or less, more preferably 5 μm or more and 15 μm or less. When the thickness of the second porous substrate 121 is 2 μm or more, the strength required for the separator 4 can be obtained. If the thickness of the second porous substrate 121 is less than 25 μm, moisture permeability can be ensured.

[0081] [Laminating method of the first layer 11 and the second layer 12]

[0082] The laminating method of the first layer 11 and the second layer 12 can use the following method: laminate the first porous substrate 111 and the second porous substrate 121 before porous formation, and perform stretching treatment in a crimped state to make them porous. The first pinholes 21 and the second pinholes 22 are randomly generated in the first layer 11 and the second layer 12 respectively. That is, the first pinholes 21 are formed at positions deviated from the positions facing the second pinholes 22. The positions of the first pinholes 21 and the second pinholes 22 are difficult to coincide when the first layer 11 and the second layer 12 are laminated. Thereby, the probability of the penetration of the water-insoluble moisture-permeable resin that becomes the third layer 13 can be significantly reduced. In the state where the first layer 11 and the second layer 12 are laminated, an interface is formed on the surface where the first porous substrate 111 and the second porous substrate 121 are in contact. Due to the presence of the interface, the first pinholes 21 and the second pinholes 22 become discontinuous states, thereby reducing penetration.

[0083] [Thickness of the laminate of the first layer 11 and the second layer 12]

[0084] The thickness of the laminate of the first layer 11 and the second layer 12 is preferably 10 μm or more and 50 μm or less. By setting the thickness of the laminate of the first layer 11 and the second layer 12 to 10 μm or more, the tensile strength of the laminate formed by laminating the first layer 11 and the second layer 12 is maintained, and elongation due to stretching during coating is not likely to occur. By setting the thickness of the laminate of the first layer 11 and the second layer 12 to 50 μm or less, moisture permeability can be ensured.

[0085] [Thermal shrinkage rate of the laminate of the first layer 11 and the second layer 12]

[0086] The thermal shrinkage rate of the laminate of the first layer 11 and the second layer 12 in the MD direction is 3% or less. The MD direction refers to the longitudinal direction indicating the flow direction of the materials of the first layer 11 and the second layer 12. By setting the thermal shrinkage rate in the MD direction to 3% or less, wrinkles caused by shrinkage during heating and drying are not likely to occur. In addition, the thermal shrinkage rate of the laminate of the first layer 11 and the second layer 12 in the TD direction is 3% or less. The TD direction refers to the transverse direction indicating the vertical direction. By setting the thermal shrinkage rate in the TD direction to 3% or less, wrinkles caused by shrinkage during heating and drying are not likely to occur.

[0087] [Properties of the Third Layer 13]

[0088] · Material of the Third Layer 13

[0089] As the material of the water-insoluble moisture-permeable resin that forms the third layer 13, an ether-based polyurethane resin, an ester-based polyurethane resin, a polyester resin, or a polyamide resin can be used. As the material of the water-insoluble moisture-permeable resin that forms the third layer 13, it is preferably an ether-based polyurethane resin with high hydrolysis resistance, a long expected lifespan as the separator 4, and high moisture permeability. Among the ether-based polyurethane resins, a polyurethane resin having polyethylene oxide in the main chain is preferably used. The material of the water-insoluble moisture-permeable resin of the third layer 13 is not limited to the above resins, and any resin with high hydrolysis resistance, a long expected lifespan, and high moisture permeability can be used. Among the water-insoluble moisture-permeable resins, a solvent-soluble water-insoluble moisture-permeable resin is particularly preferred. Among them, a water-insoluble moisture-permeable resin soluble in an aprotic polar solvent such as dimethylformamide or dimethylacetamide is preferred. On the other hand, a water-dispersed moisture-permeable resin or a water-soluble moisture-permeable resin has a higher affinity for water than a water-insoluble moisture-permeable resin and poor water resistance, so it is not preferred.

[0090] · Film Thickness of the Third Layer 13

[0091] The film thickness of the third layer 13 is preferably 0.1 to 5 μm. By making the film thickness 0.1 μm or more, sufficient gas barrier properties can be ensured. By making the film thickness thinner than 5 μm, sufficient moisture permeability can be ensured and the occurrence of caking can be suppressed.

[0092] · Coating Method of the Solution Containing the Water-insoluble Moisture-permeable Resin for the Third Layer 13

[0093] The solution containing the water-insoluble moisture-permeable resin of the third layer 13 is coated on the laminate of the first layer 11 and the second layer 12. As a method of coating the solution containing the water-insoluble moisture-permeable resin, i.e., the coating liquid, various coating machines such as a gravure coater, a kiss coater, a roll coater, a comma roll coater, a bar coater, a reverse roll coater, and an extrusion coater can be used. Among the coating machines, a gravure coater is preferred because of its excellent film coating properties.

[0094] · Solid Content of the Water-insoluble Moisture-permeable Resin Solution Used for the Third Layer 13

[0095] The solid content of the water-insoluble moisture-permeable resin solution used for the third layer 13 is preferably 1 to 10%. By setting the solid content to 1% or more, the coating thickness required to obtain the desired film thickness after drying will not increase, so the load during drying can be suppressed. By making the solid content less than 10%, the viscosity of the solution will not increase, and the film-forming property can be prevented from deteriorating.

[0096] · Viscosity of the water-insoluble moisture-permeable resin solution used in the third layer 13

[0097] The viscosity of the water-insoluble moisture-permeable resin solution used in the third layer 13 is preferably less than 1000 mPa·sec. When the viscosity of the solution is 1000 mPa·sec or more, the expansion of the solution toward the coating part is slow and the coatability is reduced, so it is not preferred.

[0098] · Temperature during drying of the third layer 13

[0099] The temperature for drying the water-insoluble moisture-permeable resin solution coated as the third layer 13 may be appropriately adjusted according to the types of the first porous substrate 111 and the second porous substrate 121, or the type of the solvent used in the water-insoluble moisture-permeable resin solution.

[0100] · Additives to the third layer 13

[0101] Within the range not impairing the moisture permeability and gas barrier property, additives such as a flame retardant, a heat stabilizer, an antioxidant, an ultraviolet ray blocking agent, a plasticizer, a crystal nucleating agent, a foaming agent, an antibacterial and antifungal agent, a filler, an antistatic agent, or an antifoaming agent may be added to the water-insoluble moisture-permeable resin of the third layer 13. These additives can be used alone or in combination of two or more. In addition, the content of each of these additives can be appropriately adjusted according to the type.

[0102] By laminating the first layer 11 and the second layer 12, the first pinhole 21 and the second pinhole 22 do not penetrate in the lamination direction, and thus, the occurrence of caking caused by the penetration of the water-insoluble moisture-permeable resin that becomes the third layer 13 in the lamination direction can be suppressed.

[0103] According to the separator 4 according to the first embodiment described above, the first layer 11 formed with the first pinhole 21, the second layer 12 formed with the second pinhole 22 at a position deviated from the first pinhole 21, and the third layer 13 that becomes a water-insoluble moisture-permeable resin are laminated. Therefore, the water-insoluble moisture-permeable resin that becomes the third layer 13 does not penetrate in the lamination direction through the first pinhole 21 and the second pinhole 22. If resin penetration occurs, when the separator 4 is made into a roll shape, the resin on the coating surface comes into contact with the penetrated resin, and adhesion such as caking caused by the surface stickiness occurs. In contrast, in the separator 4 in which the first pinhole 21 and the second pinhole 22 are arranged at different positions, since the penetration of the resin during the manufacture of the separator 4 is suppressed, a separator 4 that prevents the occurrence of caking can be obtained.

[0104] In addition, by making the first porous substrate 111 of the first layer 11 and the second porous substrate 121 of the second layer 12 into stretched porous substrates made porous by the stretching process, compared with non-woven fabrics and the like, the deviation of pores can be reduced, and stable characteristics can be obtained. In addition, compared with non-woven fabrics and the like, the smoothness is excellent, and it is easy to suppress the deviation of the film thickness when applying a water-insoluble moisture-permeable resin.

[0105] In addition, when the porosity of the first porous substrate 111 is 30% to 80%, moisture permeability and processing strength can be balanced. Specifically, by making the porosity of the porous substrate 30% or more, it is possible to prevent insufficient moisture permeability due to the reduction of the effective moisture-permeable area. In addition, by making the porosity of the porous substrate 80% or less, it is possible to prevent a decrease in strength and deterioration of processability.

[0106] In addition, when the average pore diameter of the first porous substrate 111 is 0.01 μm or more, the specific surface area of the first porous substrate 111 increases, and an increase in the adsorption of moisture to the first porous substrate 111 can be prevented. In addition, if the average pore diameter of the first porous substrate 111 is less than 0.1 μm, a state in which penetration hardly occurs can be maintained when applying the coating liquid.

[0107] In addition, if the air permeability of the first porous substrate 111 is 400 seconds or less, it is possible to prevent insufficient moisture permeability of the separator 4 due to the reduction of the effective moisture-permeable area.

[0108] In addition, when the porosity of the second porous substrate 121 is 30% to 80%, moisture permeability and processing strength can be balanced. By making the porosity of the second porous substrate 121 30% or more, it is possible to prevent insufficient moisture permeability due to the reduction of the effective moisture-permeable area. In addition, by making the porosity of the second porous substrate 121 80% or less, it is possible to prevent a decrease in strength and deterioration of processability.

[0109] In addition, when the average pore diameter of the second porous substrate 121 is 0.01 μm or more, the specific surface area of the second porous substrate 121 increases, and an increase in the adsorption of moisture to the second porous substrate 121 can be prevented. In addition, if the average pore diameter of the second porous substrate 121 is less than 0.1 μm, a state in which penetration hardly occurs can be maintained when applying the coating liquid.

[0110] In addition, if the air permeability of the second porous substrate 121 is 400 seconds or less, it is possible to prevent insufficient moisture permeability due to the reduction of the effective moisture-permeable area.

[0111] In addition, when the water-insoluble moisture-permeable resin is a polyurethane resin having polyethylene oxide, the polyethylene oxide contributes to the improvement of the moisture permeability of the separator 4.

[0112] In addition, according to the manufacturing method of the partition plate 4 according to the above-described Embodiment 1, a porous base material having a two-layer structure in which the first pinholes 21 and the second pinholes 22 are arranged at different positions can be obtained through the lamination process. In addition, through the coating process, a water-insoluble moisture-permeable resin solution that becomes the third layer 13 is coated. Therefore, it is possible to prevent the water-insoluble moisture-permeable resin solution from penetrating through the first layer 11 and the second layer 12.

[0113] In addition, according to the manufacturing method of the partition plate 4 of Embodiment 1 described above, through the coating process, a water-insoluble moisture-permeable resin solution is coated on a base material on which the first layer 11 and the second layer 12 are laminated. In the base material on which the first layer 11 and the second layer 12 are laminated, the first pinholes 21 and the second pinholes 22 are arranged at different positions, and therefore, it is possible to prevent the water-insoluble moisture-permeable resin solution from penetrating through the first layer 11 and the second layer 12.

[0114] In addition, the coating process includes a drying process, whereby the third layer 13 can be formed.

[0115] In addition, the solvent used in the water-insoluble moisture-permeable resin is an aprotic polar solvent. A resin soluble in an aprotic polar solvent has excellent water resistance compared to a resin soluble in a protic polar solvent, and a partition plate 4 with excellent water resistance can be obtained.

[0116] In addition, by controlling the viscosity of the water-insoluble moisture-permeable resin solution to be less than 1000 mPa·sec, the resin followability to the coating member during coating is improved, and the coatability is improved.

[0117] Embodiment 2

[0118] Figure 3 is a perspective view of the total heat exchange element 1 of Embodiment 2. The total heat exchange element 1 of Embodiment 2 is a total heat exchange element 1 having the partition plate 4 of Embodiment 1. Therefore, the structure of the partition plate 4 is the same as that of Embodiment 1, and thus the description is omitted, and the same or corresponding parts are denoted by the same reference numerals.

[0119] [Structure of the total heat exchange element 1]

[0120] As Figure 3 shown, the total heat exchange element 1 is a laminate in which a supply air layer 2 through which supply air flows and an exhaust air layer 3 through which exhaust air flows are alternately laminated with a partition plate 4 interposed therebetween. The supply air layer 2 is an example of a first gas layer. The exhaust air layer 3 is an example of a second gas layer. The total heat exchange element 1 includes a plurality of partition plates 4 and a plurality of spacer plates 7 alternately provided between the plurality of partition plates 4 and respectively separated from the plurality of partition plates 4. The spacer plate 7 has, for example, a corrugated shape. The plurality of partition plates 4 are respectively held at intervals by the plurality of spacer plates 7.

[0121] In the air supply layer 2, an air supply passage 5 is formed to guide the air supply flow along the partition plate 4. In the exhaust layer 3, an exhaust passage 6 is formed to guide the exhaust flow along the partition plate 4. The air supply passage 5 and the exhaust passage 6 are respectively formed by the corrugated spacer 7 that maintains the intervals of the respective partition plates 4. The direction in which the air supply is guided by the air supply passage 5 and the direction in which the exhaust is guided by the exhaust passage 6 are perpendicular to each other.

[0122] [Structure of the spacer 7]

[0123] The spacer 7 is in the shape of a corrugated sheet. The spacer 7 only needs to be able to maintain the intervals between the partition plates 4 at a specified interval and be able to form a flow path. For example, the spacer 7 can also be a sheet bent into a short-wave shape or a triangular-wave shape, or a structure formed by combining multiple sheet plates, etc. The material used for the spacer 7 only needs to have an air permeability of 10 seconds or more, and various materials such as paper, resin, metal, and ceramics can be used. Among them, materials that are lightweight and have excellent water resistance are preferred, resin-made components are preferred, and polypropylene, polyethylene, ABS, polystyrene, polyamide, polyethylene terephthalate, polybutylene terephthalate, etc. are preferred. In addition, when using these spacers, in order to prevent position deviation, it is preferred to use an adhesive on the surface in contact with the partition plate.

[0124] [Operation of the total heat exchange element 1]

[0125] The operation of the total heat exchange element 1 will be described. For example, in the air supply layer 2 of the total heat exchange element 1, cold and dry outside air flows as the air supply, and in the exhaust layer 3 of the total heat exchange element 1, hot and humid indoor air flows as the exhaust. At this time, the water vapor contained in the indoor air passes through the partition plate 4 and moves from the exhaust layer 3 to the air supply layer 2, and sensible heat is exchanged between the exhaust layer 3 and the air supply layer 2. In addition, the thermal energy possessed by the indoor air moves to the outside air that is colder than the indoor air, and latent heat is exchanged between the exhaust layer 3 and the air supply layer 2. Thus, the gas in the air supply layer 2 is heated and humidified and then supplied to the room, and the gas in the exhaust chamber 3 is cooled and dehumidified or dehumidified and then discharged to the outside.

[0126] According to the total heat exchange element 1 of the embodiment 2 described above, it has a partition plate 4 composed of a water-insoluble moisture-permeable resin and a porous substrate. An air supply layer 2 is formed on one surface of the partition plate 4, and an exhaust layer 3 is formed on the other surface of the partition plate 4. Therefore, sensible heat and latent heat can be exchanged between the air supply layer 2 and the exhaust layer 3. In addition, by using the partition plate 4, a total heat exchange element 1 with excellent water resistance can be obtained.

[0127] Embodiment 3

[0128] Figure 4This is a schematic diagram of the total heat exchanger 30 of Embodiment 3. The total heat exchanger 30 according to Embodiment 3 is a total heat exchanger 30 having the partition plate 4 according to Embodiment 1. In addition, the total heat exchanger 30 of Embodiment 3 is a total heat exchanger 30 having the total heat exchange element 1 of Embodiment 2. Therefore, the structure of the partition plate 4 is the same as that of Embodiment 1, so the description thereof is omitted, and the same or corresponding parts are denoted by the same reference numerals. In addition, the structure of the total heat exchange element 1 is the same as that of Embodiment 2, so the description thereof is omitted, and the same or corresponding parts are denoted by the same reference numerals.

[0129] [Structure of Total Heat Exchanger 30]

[0130] As Figure 4 shown, the total heat exchanger 30 of Embodiment 3 includes a total heat exchange element 1. In the total heat exchanger 30, an air supply flow path 31 for supplying outdoor air to the indoor and an exhaust flow path 32 for discharging indoor air to the outdoor are formed. The total heat exchanger 30 is provided in a house or the like and is used as a heat exchange type ventilation device for heat exchange between indoor air and outdoor air.

[0131] A part of the air supply flow path 31 is constituted by the air supply passage 5 of the total heat exchange element 1. A part of the exhaust flow path 32 is constituted by the exhaust passage 6 of the total heat exchange element 1. An air supply blower 33 for generating a flow of air from the outdoor to the indoor is provided on the air supply flow path 31. By driving the air supply blower 33, gas flows into the air supply layer 2 of the total heat exchange element 1. An exhaust blower 34 for generating a flow of air from the indoor to the outdoor is provided on the exhaust flow path 32. By driving the exhaust blower 34, gas flows into the exhaust layer 3 of the total heat exchange element 1. The air supply blower 33 is an example of the first blower. The exhaust blower 34 is an example of the second blower.

[0132] When the total heat exchanger 30 starts operating, the air supply blower 33 and the exhaust blower 34 operate. When the air supply blower 33 and the exhaust blower 34 operate, for example, in the case of assuming winter, the air flow from the cold and dry outdoor passes through the air supply passage 5 as the air supply flow, and the air flow from the hot and high-humidity indoor passes through the exhaust passage 6 as the exhaust flow. The two air flows of the air supply flow and the exhaust flow flow separately across the partition plate 4.

[0133] At this time, heat transfer occurs between the air flows across the partition plate 4, and water vapor permeates the partition plate 4 and moves from one air flow to the other air flow, and sensible heat and latent heat exchange are performed between the air supply flow and the exhaust flow. As a result, the air supply flow is heated and humidified and then supplied to the indoor, and the exhaust flow is cooled and dehumidified and then discharged to the outdoor.

[0134] Therefore, by using the total heat exchanger 30, it is possible to suppress changes in the indoor air temperature or humidity and ventilate the air between the outdoors and indoors.

[0135] According to the total heat exchanger 30 related to the third embodiment described above, by using the partition plate 4 composed of the first porous substrate 111, the second porous substrate 121, and the water-insoluble moisture-permeable resin, it is possible to obtain the total heat exchange element 1 with excellent water resistance. In addition, the reliability of the total heat exchanger 30 can be improved.

[0136] [Performance evaluation of partition plate 4]

[0137] Samples of the partition plate 4 were produced by the methods shown in Examples 1 to 5 and Comparative Examples 1 to 5, and performance evaluations were respectively conducted on the obtained samples of the partition plate 4. As the performance evaluation of the partition plate 4, gas barrier properties and water resistance were evaluated.

[0138] First, the method for producing the samples of the partition plate 4 will be described.

[0139] [Example 1]

[0140] In Example 1, as the first layer 11, a first porous substrate 111 with a thickness of 10 μm, a porosity of 46%, an air permeability of 180 seconds, and a material of polypropylene was used. The first porous substrate 111 has first holes 111a. The first holes 111a form first pinholes 21. As the second layer 12, a second porous substrate 121 with a thickness of 10 μm, a porosity of 46%, an air permeability of 180 seconds, and a material of polypropylene was used. The second porous substrate 121 has second holes 121a. The second holes 121a form second pinholes 22. The first layer 11 and the second layer 12 were laminated to produce a laminate in which the first pinholes 21 of the first porous substrate 111 and the second pinholes 22 of the second porous substrate 121 are arranged at different positions. The laminate of the first layer 11 and the second layer 12 was subjected to corona treatment to improve the surface wettability.

[0141] Next, on the laminate of the first layer 11 and the second layer 12, a 5% polyurethane resin solution was applied as the coating liquid using a gravure coater, and the coating thickness was 25 μm. As the polyurethane resin solution, dimethylformamide, which is a solvent of SANPRENE H-600 manufactured by Sanyo Chemical Industries, Ltd., was used. Then, it was heated at 80°C to dry the coating liquid.

[0142] Through the above operations, a partition plate 4 having a three-layer structure composed of the first layer 11 in which the first pinholes 21 are formed, the second layer 12 in which the second pinholes 22 are formed at positions different from the first pinholes 21, and the third layer 13 formed of a water-insoluble moisture-permeable resin was produced as the sample of Example 1.

[0143] [Example 2]

[0144] In Example 2, as the first layer 11, a first porous substrate 111 with a thickness of 12 μm, a porosity of 46%, an air permeability of 190 seconds, and a material of polypropylene is used. The first porous substrate 111 has first holes 111a. The first holes 111a form first pinholes 21. As the second layer 12, a second porous substrate 121 with a thickness of 12 μm, a porosity of 46%, an air permeability of 190 seconds, and a material of polypropylene is used. The second porous substrate 121 has second holes 121a. The second holes 121a form second pinholes 22. The first layer 11 and the second layer 12 are laminated, whereby a laminate is produced in which the first pinholes 21 of the first porous substrate 111 and the second pinholes 22 of the second porous substrate 121 are arranged at different positions. The laminate of the first layer 11 and the second layer 12 is subjected to a corona treatment to improve the surface wettability.

[0145] Next, on the laminate of the first layer 11 and the second layer 12, a 5% polyurethane resin solution is coated as a coating liquid using a gravure coater, and the coating thickness is 25 μm. As the polyurethane resin solution, dimethylformamide, which is a solvent of SANPRENE H-600 manufactured by Sanyo Chemical Industries, Ltd., is used. Then, it is heated at 80°C to dry the coating liquid.

[0146] Through the above operations, a separator 4 having a three-layer structure composed of a first layer 11 in which first pinholes 21 are formed, a second layer 12 in which second pinholes 22 are formed at positions different from the first pinholes 21, and a third layer 13 formed of a water-insoluble moisture-permeable resin is produced as a sample of Example 2.

[0147] [Example 3]

[0148] In Example 3, as the first layer 11, a first porous substrate 111 with a thickness of 5 μm, a porosity of 46%, an air permeability of 120 seconds, and a material of polypropylene is used. The first porous substrate 111 has first holes 111a. The first holes 111a form first pinholes 21. As the third layer 13, a second porous substrate 121 with a thickness of 15 μm, a porosity of 46%, an air permeability of 200 seconds, and a material of polypropylene is used. The second porous substrate 121 has second holes 121a. The second holes 121a form second pinholes 22. The first layer 11 and the second layer 12 are laminated, whereby a laminate is produced in which the first pinholes 21 of the first porous substrate 111 and the second pinholes 22 of the second porous substrate 121 are arranged at different positions. The laminate of the first layer 11 and the second layer 12 is subjected to a corona treatment to improve the surface wettability.

[0149] Next, on the laminate obtained by laminating the first layer 11 and the second layer 12, a 5% polyurethane resin solution was applied as a coating liquid using a gravure coater, and the coating thickness was made 25 μm. As the polyurethane resin solution, dimethylformamide, which is a solvent of SANPRENE H-600 manufactured by Sanyo Chemical Industries, Ltd., was used. Then, it was heated at 80°C to dry the coating liquid.

[0150] Through the above operations, a separator 4 having a three-layer structure composed of a first layer 11 in which the first pinholes 21 are formed, a second layer 12 in which the second pinholes 22 are formed at positions different from the first pinholes 21, and a third layer 13 formed of a water-insoluble moisture-permeable resin was produced as a sample of Example 3.

[0151] [Example 4]

[0152] In Example 4, as the first layer 11, a first porous substrate 111 made of polypropylene with a thickness of 10 μm, a porosity of 40%, an air permeability of 190 seconds was used. The first porous substrate 111 has first holes 111a. The first holes 111a form the first pinholes 21. As the second layer 12, a second porous substrate 121 made of polypropylene with a thickness of 10 μm, a porosity of 46%, an air permeability of 180 seconds was used. The second porous substrate 121 has second holes 121a. The second holes 121a form the second pinholes 22. The first layer 11 and the second layer 12 were laminated, whereby a laminate in which the first pinholes 21 of the first porous substrate 111 and the second pinholes 22 of the second porous substrate 121 are arranged at different positions was produced. The laminate obtained by laminating the first layer 11 and the second layer 12 was subjected to a corona treatment to improve the surface wettability.

[0153] Next, on the laminate obtained by laminating the first layer 11 and the second layer 12, a 5% polyurethane resin solution was applied as a coating liquid using a gravure coater, and the coating thickness was made 25 μm. As the polyurethane resin solution, dimethylformamide, which is a solvent of SANPRENE H-600 manufactured by Sanyo Chemical Industries, Ltd., was used. Then, it was heated at 80°C to dry the coating liquid.

[0154] Through the above operations, a separator 4 having a three-layer structure composed of a first layer 11 in which the first pinholes 21 are formed, a second layer 12 in which the second pinholes 22 are formed at positions different from the first pinholes 21, and a third layer 13 formed of a water-insoluble moisture-permeable resin was produced as a sample of Example 4.

[0155] [Example 5]

[0156] In Example 5, as the first layer 11, a first porous substrate 111 made of polypropylene with a thickness of 10 μm, a porosity of 46%, an air permeability of 180 seconds was used. The first porous substrate 111 has first holes 111a. The first holes 111a form first pinholes 21. As the second layer 12, a second porous substrate 121 made of polypropylene with a thickness of 10 μm, a porosity of 54%, an air permeability of 150 seconds was used. The second porous substrate 121 has second holes 121a. The second holes 121a form second pinholes 22. The first layer 11 and the second layer 12 are laminated, whereby a laminate is formed in which the first pinholes 21 of the first porous substrate 111 and the second pinholes 22 of the second porous substrate 121 are arranged at different positions. The laminate of the first layer 11 and the second layer 12 is subjected to a corona treatment to improve the surface wettability.

[0157] Next, on the laminate of the first layer 11 and the second layer 12, a 5% polyurethane resin solution is applied as a coating liquid using a gravure coater so that the coating thickness is 25 μm. As the polyurethane resin solution, dimethylformamide, which is a solvent of SANPRENE H-600 manufactured by Sanyo Chemical Industries, Ltd., is used. Then, it is heated at 80 °C to dry the coating liquid.

[0158] Through the above operations, a separator 4 having a three-layer structure composed of a first layer 11 in which first pinholes 21 are formed, a second layer 12 in which second pinholes 22 are formed at positions different from the first pinholes 21, and a third layer 13 formed of a water-insoluble moisture-permeable resin is produced as a sample of Example 5.

[0159] [Comparative Example 1]

[0160] In Comparative Example 1, as the first layer 11, a first porous substrate 111 made of polypropylene with a thickness of 10 μm, a porosity of 46%, an air permeability of 180 seconds was used. The first porous substrate 111 has first holes 111a. The first holes 111a form first pinholes 21. As the second layer 12, a second porous substrate 121 made of polypropylene with a thickness of 10 μm, a porosity of 46%, an air permeability of 180 seconds was used. The second porous substrate 121 has second holes 121a. The second holes 121a form second pinholes 22. The first layer 11 and the second layer 12 are laminated, whereby a laminate is formed in which the first pinholes 21 of the first porous substrate 111 and the second pinholes 22 of the second porous substrate 121 are arranged at different positions. The laminate of the first layer 11 and the second layer 12 is subjected to a corona treatment to improve the surface wettability.

[0161] Next, on the laminate obtained by laminating the first layer 11 and the second layer 12, a 5% polyurethane resin aqueous dispersion was applied as a coating liquid using a gravure coater so that the coating thickness was 25 μm. As the polyurethane resin aqueous dispersion, Superflex E-2000 manufactured by Daiichi Kogyo Seiyaku Co., Ltd. was used. Then, it was heated at 80°C to dry the coating liquid.

[0162] Through the above operations, a separator 4 having a three-layer structure composed of the first layer 11 in which the first pinhole 21 is formed, the second layer 12 in which the second pinhole 22 is formed at a position different from the first pinhole 21, and the third layer 13 formed of a water-dispersible moisture-permeable resin was produced as a sample of Comparative Example 1.

[0163] [Comparative Example 2]

[0164] In Comparative Example 2, as the first layer 11, a first porous substrate 111 having a thickness of 10 μm, a porosity of 46%, an air permeability of 180 seconds, and a material of polypropylene was used. The first porous substrate 111 has a first hole 111a. The first hole 111a forms the first pinhole 21. As the second layer 12, a second porous substrate 121 having a thickness of 10 μm, a porosity of 46%, an air permeability of 180 seconds, and a material of polypropylene was used. The second porous substrate 121 has a second hole 121a. The second hole 121a forms the second pinhole 22. The first layer 11 and the second layer 12 were laminated, whereby a laminate in which the first pinhole 21 of the first porous substrate 111 and the second pinhole 22 of the second porous substrate 121 are arranged at different positions was formed. The laminate obtained by laminating the first layer 11 and the second layer 12 was subjected to a corona treatment to improve the surface wettability.

[0165] Next, on the laminate obtained by laminating the first layer 11 and the second layer 12, a 10% polyurethane resin aqueous dispersion was applied as a coating liquid using a gravure coater so that the coating thickness was 80 μm. As the polyurethane resin aqueous dispersion, Superflex E-2000 manufactured by Daiichi Kogyo Seiyaku Co., Ltd. was used. Then, it was heated at 80°C to dry the coating liquid.

[0166] Through the above operations, a separator 4 having a three-layer structure composed of the first layer 11 in which the first pinhole 21 is formed, the second layer 12 in which the second pinhole 22 is formed at a position different from the first pinhole 21, and the third layer 13 formed of a water-dispersible moisture-permeable resin was produced as a sample of Comparative Example 2.

[0167] [Comparative Example 3]

[0168] In Comparative Example 3, as the first layer 11, a first porous substrate 111 with a thickness of 10 μm, a porosity of 46%, an air permeability of 180 seconds, and a material of polypropylene was used. The first porous substrate 111 has first holes 111a. The first holes 111a form first pinholes 21. As the second layer 12, a second porous substrate 121 with a thickness of 10 μm, a porosity of 46%, an air permeability of 180 seconds, and a material of polypropylene was used. The second porous substrate 121 has second holes 121a. The second holes 121a form second pinholes 22. The first layer 11 and the second layer 12 are laminated, whereby a laminate is formed in which the first pinholes 21 of the first porous substrate 111 and the second pinholes 22 of the second porous substrate 121 are arranged at different positions. The laminate of the first layer 11 and the second layer 12 is subjected to a corona treatment to improve the surface wettability.

[0169] Next, on the laminate of the first layer 11 and the second layer 12, a 10% polyurethane resin solution is coated as a coating liquid using a gravure coater so that the coating thickness is 80 μm. As the polyurethane resin solution, dimethylformamide, which is a solvent of SANPRENE H-600 manufactured by Sanyo Chemical Industries, Ltd., is used. Then, it is heated at 80°C to dry the coating liquid.

[0170] Through the above operations, a separator 4 having a three-layer structure composed of a first layer 11 in which first pinholes 21 are formed, a second layer 12 in which second pinholes 22 are formed at positions different from the first pinholes 21, and a third layer 13 formed of a water-insoluble moisture-permeable resin is produced as a sample of Example 3.

[0171] [Comparative Example 4]

[0172] In Comparative Example 4, as the first layer 11, a first porous substrate 111 with a thickness of 10 μm, a porosity of 46%, an air permeability of 180 seconds, and a material of polypropylene was used. The first porous substrate 111 has first holes 111a. The first holes 111a form first pinholes 21. As the second layer 12, a second porous substrate 121 with a thickness of 10 μm, a porosity of 46%, an air permeability of 180 seconds, and a material of polypropylene was used. The second porous substrate 121 has second holes 121a. The second holes 121a form second pinholes 22. The first layer 11 and the second layer 12 are laminated, whereby a laminate is formed in which the first pinholes 21 of the first porous substrate 111 and the second pinholes 22 of the second porous substrate 121 are arranged at different positions. The laminate of the first layer 11 and the second layer 12 is subjected to a corona treatment to improve the surface wettability.

[0173] Next, on the laminate obtained by laminating the first layer 11 and the second layer 12, a 5% polyurethane resin solution was applied as a coating liquid using a gravure coater, and the coating thickness was made 1 μm. As the polyurethane resin solution, dimethylformamide, a solvent of SANPRENE H-600 manufactured by Sanyo Chemical Industries, Ltd., was used. Then, it was heated at 80°C to dry the coating liquid.

[0174] Through the above operations, a separator 4 having a three-layer structure composed of a first layer 11 formed with a first pinhole 21, a second layer 12 formed with a second pinhole 22 at a position different from the first pinhole 21, and a third layer 13 formed of a water-insoluble moisture-permeable resin was produced as a sample of Comparative Example 4.

[0175] [Comparative Example 5]

[0176] In Comparative Example 5, as the first layer 11, a first porous substrate 111 having a thickness of 20 μm, a porosity of 46%, an air permeability of 230 seconds, and a material of polypropylene was used. The first porous substrate 111 has first holes 111a, and first pinholes 21 formed by the first holes 111a are formed. The first layer 11 was subjected to a corona treatment to improve the surface wettability.

[0177] Next, a 5% polyurethane resin solution was applied as a coating liquid on the first layer 11 using a gravure coater, and the coating thickness was made 25 μm. As the polyurethane resin solution, dimethylformamide, a solvent of SANPRENE H-600 manufactured by Sanyo Chemical Industries, Ltd., was used. Then, it was heated at 80°C to dry the coating liquid.

[0178] Through the above operations, a separator 4 having a two-layer structure composed of a first layer 11 formed with a first pinhole 21 and a third layer 13 formed of a water-insoluble moisture-permeable resin was produced as a sample of Comparative Example 5.

[0179] Next, the evaluation method for the samples of the separators 4 obtained in Examples 1 to 5 and Comparative Examples 1 to 5 will be described.

[0180] [Gas barrier property of separator 4]

[0181] The gas barrier property of the separator 4 was evaluated by measuring the air permeability of the separator 4 according to JIS P8117. That is, by measuring the time (seconds) for air with a volume of 100 cm 3 (100 mL) to pass through a portion having an area of 645 mm 2 in the sample of the separator 4. In addition, the air permeability of the separator 4 was measured at five arbitrary positions in the sample of the separator 4.

[0182] In this evaluation, if the air permeability of any 5 parts of the partition plate 4 is 5000 seconds or more, it is determined that the gas shielding property is good (〇), and if any one of the air permeabilities of any 5 parts of the partition plate 4 is less than 5000 seconds, it is determined that the gas shielding property is poor (×).

[0183] [Moisture permeability of partition plate 4]

[0184] The moisture permeability of the partition plate 4 is measured by using an infrared sensor method (Mocon method) under the conditions of a relative humidity of 100% and a temperature of 30°C in accordance with JIS K7129. That is, the amount of water vapor passing through the test piece is detected by an infrared sensor, and the moisture permeability (water vapor transmission rate) is calculated by comparison with a standard test piece.

[0185] The moisture permeability of the partition plate 4 is measured at any 5 parts of the sample of the partition plate 4, and the average value of the moisture permeabilities measured at these 5 parts is taken as the moisture permeability of the partition plate 4. If the moisture permeability is 12 kg / (m 2 ·day) or more, it is determined that the moisture permeability is good (〇), and if the moisture permeability is less than 12 kg / (m 2 ·day), it is determined that the moisture permeability is poor (×). In addition, for the moisture permeability evaluation, only samples with good gas shielding properties are implemented, and samples with poor gas shielding properties are not implemented.

[0186] [Water resistance of partition plate 4]

[0187] The water resistance of the partition plate 4 is determined by immersing the sample of the partition plate 4 in warm water at 40°C for 24 hours, drying it at 60°C for 1 hour, repeating this 3 times, and visually observing whether there is peeling. In addition, for samples where no peeling is confirmed, the gas shielding property is evaluated.

[0188] In this evaluation, if the air permeability of any 5 parts of the sample of the partition plate 4 is 5000 seconds or more, it is determined that the water resistance is good (〇), and if any one of the air permeabilities of any 5 parts of the partition plate 4 is less than 5000 seconds, it is determined that the water resistance is poor (×). In addition, for the water resistance evaluation, only samples with good initial gas shielding properties are implemented, and samples where peeling can be confirmed during the water resistance evaluation are determined to have poor water resistance (×).

[0189] [Caking property of partition plate 4]

[0190] The caking property of the partition plate 4 is a sample made by laminating 2 pieces of 10 cm × 10 cm partition plates 4 in such a way that the water-insoluble moisture-permeable resin surface of the third layer 13 overlaps with the porous substrate surface of the first layer 11. Then, under the conditions of a temperature of 20°C and a relative humidity of 65%, a load of 2 kg / 100 cm 2After 24 hours of the load, the separator plates were peeled from each other, and the adhesiveness and peelability were evaluated.

[0191] In this evaluation, when there was no adhesion and it was easy to peel, it was judged that the caking property was good (〇), and when it was difficult to peel due to adhesion, it was judged that the caking property was poor (×). In addition, for the caking property evaluation, only the samples with good gas barrier properties were implemented, and the samples with poor gas barrier properties were not implemented.

[0192] Next, the evaluation results of the samples of the separator plate 4 produced by the methods of Examples 1 to 5 and Comparative Examples 1 to 5 are shown in Table 1.

[0193] Table 1

[0194] Gas barrier property Moisture permeability Water resistance Caking property Example 1 〇 〇 〇 〇 Example 2 〇 〇 〇 〇 Example 3 〇 〇 〇 〇 Example 4 〇 〇 〇 〇 Example 5 〇 〇 〇 〇 Comparative Example 1 〇 × × 〇 Comparative Example 2 〇 × × × Comparative Example 3 〇 × 〇 × Comparative Example 4 × - - - Comparative Example 5 〇 〇 〇 ×

[0195] As shown in Table 1, in Examples 1 to 5, Comparative Examples 1 to 3, and Comparative Example 5 where the coating liquid was coated with a certain coating thickness or more, the gas barrier property was good. On the other hand, in Comparative Example 4 with a thin coating thickness, the gas barrier property was poor.

[0196] Examples 1 to 5 have a third layer 13 formed of a water-insoluble moisture-permeable resin in the first layer 11 formed with the first pinhole 21 and the second layer 12 formed with the second pinhole 22. Compared with Comparative Examples 1 and 2 using a water-dispersible moisture-permeable resin in the third layer 13, Examples 1 to 5 using a water-insoluble moisture-permeable resin in the third layer 13 have a good tendency in the moisture permeability and water resistance of the separator plate 4.

[0197] In Comparative Examples 2 and 3, since the coating thickness of the coating liquid was thick, sufficient gas barrier property was obtained, but there was a tendency of poor moisture permeability. In addition, Comparative Example 3 using a water-insoluble moisture-permeable resin in the coating liquid obtained good water resistance, but Comparative Example 2 using a water-dispersible moisture-permeable resin in the coating liquid had poor water resistance. In addition, the coating thicknesses of the coating liquids in Comparative Examples 2 and 3 were both thicker than those in Examples 1 to 5, so the caking property was poorer than that in Examples 1 to 5.

[0198] In Comparative Example 4, the coating thickness of the coating liquid was thin, and sufficient gas barrier property could not be obtained, which was not suitable for the separator plate 4.

[0199] In Comparative Example 5, by implementing the same coating thickness of the coating liquid as in Example 1, sufficient gas barrier property and moisture permeability could be obtained, and the water resistance was also good. However, in the evaluation of the caking property, the samples of the separator plate 4 adhered to each other, and the caking property was poor. In Comparative Example 5, since the first layer 11 formed with the first pinhole 21 was used, it was generally considered that there was a tendency of poor caking property due to the penetration of the water-insoluble moisture-permeable resin.

[0200] As described above, compared with Comparative Examples 1 to 5, the partition plate 4 in Examples 1 to 5 has excellent effects of good gas shielding property, moisture permeability, water resistance, and anti-caking property. That is, the partition plate 4 in Examples 1 to 5 has a structure in which a first layer 11 formed with first pinholes 21, a second layer 12 formed with second pinholes 22 at positions different from the first pinholes 21, and a third layer 13 made of a water-insoluble moisture-permeable resin are laminated. With such a structure, the above effects can be achieved.

[0201] Explanation of reference numerals

[0202] 1 Total heat exchange element, 2 Air supply layer, 3 Exhaust layer, 4 Partition plate, 5 Air supply passage, 6 Exhaust passage, 7 Spacer, 11 First layer, 12 Second layer, 13 Third layer, 21 First pinhole, 22 Second pinhole, 30 Total heat exchanger, 31 Air supply flow path, 32 Exhaust flow path, 33 Air supply blower, 34 Exhaust blower, 111 First porous substrate, 111a First hole, 121 Second porous substrate, 121a Second hole.

Claims

1. A partition board, wherein, the partition board has: a first layer, which is composed of a first porous substrate formed with a plurality of first holes, and first pinholes are formed through at least a part of the first holes; a second layer, laminated on the first layer, which is composed of a second porous substrate formed with a plurality of second holes, and second pinholes are formed through at least a part of the second holes, and the second pinholes are arranged at positions different from the positions facing the first pinholes; and a third layer, laminated on the second layer, which is a water-insoluble moisture-permeable resin, the first porous substrate and the second porous substrate are of the same material, the material of the third layer is different from the materials of the first porous substrate and the second porous substrate.

2. The partition board according to claim 1, wherein, the pore diameters of the first pinholes and the second pinholes are greater than 0.1 μm.

3. The partition board according to claim 1 or 2, wherein, the first porous substrate of the first layer and the second porous substrate of the second layer are stretched porous substrates made porous by a stretching treatment method.

4. The partition board according to claim 1 or 2, wherein, the porosity of the first porous substrate is 30 to 80%.

5. The partition board according to claim 1 or 2, wherein, the average pore diameter of the first porous substrate is 0.01 to 0.1 μm.

6. The partition board according to claim 1 or 2, wherein, the air permeability of the first porous substrate is 400 seconds or less.

7. The partition board according to claim 1 or 2, wherein, the porosity of the second porous substrate is 30 to 80%.

8. The partition board according to claim 1 or 2, wherein, the average pore diameter of the second porous substrate is 0.01 to 0.1 μm.

9. The partition board according to claim 1 or 2, wherein, the air permeability of the second porous substrate is 400 seconds or less.

10. The partition board according to claim 1 or 2, wherein, the water-insoluble moisture-permeable resin is a polyurethane resin having polyethylene oxide.

11. A total heat exchange element, wherein, the total heat exchange element has the partition board according to any one of claims 1 to 10, a first gas layer is formed on one surface of the partition board, a second gas layer is formed on the other surface of the partition board.

12. A total heat exchanger, wherein, the total heat exchanger includes: the total heat exchange element according to claim 11; a first blower for allowing gas to flow into the first gas layer; and a second blower for allowing gas to flow into the second gas layer.

13. A manufacturing method of a partition board, which is the manufacturing method of the partition board according to any one of claims 1 to 10, wherein, the manufacturing method of the partition board has: a lamination process of laminating the first layer and the second layer; and a coating process of coating a solution of a water-insoluble moisture-permeable resin that becomes the third layer on the laminated first layer and second layer.

14. A manufacturing method of a partition board, which is the manufacturing method of the partition board according to any one of claims 1 to 10, wherein, The manufacturing method of the separator has a coating step of coating a solution of a water-insoluble moisture-permeable resin on a substrate on which the first layer and the second layer are laminated.

15. The manufacturing method of the separator according to claim 13 or 14, wherein, The manufacturing method of the separator further includes a drying step of drying the solution of the water-insoluble moisture-permeable resin.

16. The manufacturing method of the separator according to claim 13 or 14, wherein, The solvent used in the water-insoluble moisture-permeable resin is an aprotic polar solvent.

17. The manufacturing method of the separator according to claim 13 or 14, wherein, The viscosity of the solution of the water-insoluble moisture-permeable resin is less than 1000 mPa·sec.

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