Electronic device comprising a display

Abstract

An electronic device is provided. The electronic device may include: a housing; a display disposed within the housing and disposed along a first direction such that the screen of the display is exposed outside the housing; a first printed circuit board (PCB) disposed within the housing; a flexible printed circuit board (FPCB) disposed within the housing and including a first portion adjacent to the display, a third portion extending from the first portion, and a second portion extending from the third portion and electrically connected to the first PCB; a first guide member disposed within the housing; and a second guide member disposed within the housing, wherein at least a portion of the third portion is configured to pass between the first guide member and the second guide member, and the at least a portion of the third portion can be provided with a force along a second direction opposite to the first direction by the first guide member.

Description

Technical Field

[0001] This disclosure relates to an electronic device including a display. More specifically, this disclosure relates to an electronic device for reducing deformation of a backlight unit (BLU) of a display by suppressing deformation of a flexible printed circuit board (FPCB) or changing the magnitude or direction of stress on the FPCB. Background Technology

[0002] Advances in information and communication technologies and semiconductor technology have accelerated the spread and use of various electronic devices. Electronic devices are being developed to perform communication while being carried.

[0003] The term "electronic device" can refer to a device that performs a specific function according to its equipped programs, such as home appliances, electronic calendars, portable multimedia players, mobile communication terminals, tablet PCs, video / audio devices, desktop PCs or laptops, and navigation devices for automobiles. For example, an electronic device can output stored information as voice or images. With the increasing integration of electronic devices and the prevalence of high-speed, high-capacity wireless communication, electronic devices such as mobile communication terminals are being equipped with a variety of functions. For example, electronic devices have integrated functions including entertainment functions such as playing video games, multimedia functions such as playing music / videos, communication and security functions for mobile banking, and calendar or e-wallet functions. Such electronic devices are becoming compact enough for users to carry conveniently.

[0004] Due to recent demands for more compact and thinner high-integration and performance, as well as the application of state-of-the-art technologies related to antennas in portable electronic devices (e.g., smartphones), the space available for circuit boards inside electronic devices has shrunk. Consequently, smaller circuit boards are placed separately and spaced apart. Furthermore, the display driver integrated circuit (DDI) used to drive the display is placed separately from the circuit board. Therefore, flexible printed circuit boards (FPCBs) are used to connect the spaced-apart DDIs and the circuit board.

[0005] The above information is presented as background information only to aid in understanding this disclosure. No determination or assertion is made regarding whether any of the above content can be used as prior art in relation to this disclosure. Detailed Implementation

[0006] Technical issues

[0007] A display can be mounted on the front surface of an electronic device. A display driver IC (DDI), serving as the circuitry for driving the display, can be located inside the electronic device. When the printed circuit board (PCB) on which the DDI is mounted and the PCB on which the processor is mounted are separated and spaced apart, the DDI and the processor can be electrically connected via the FPCB. Due to the flexibility of the FPCB, the electrical connection between the DDI and the processor is possible even when the internal structure of the electronic device is somewhat complex. Stress may occur in the FPCB due to deformation (such as warping caused by the internal structure of the electronic device).

[0008] As stress develops within the FPCB, the FPCB may come into contact with other components of the electronic device located on adjacent FPCBs. When the FPCB comes into contact with other components of the electronic device, the FPCB can transfer forces to those components. For example, other components of the electronic device could be the backlight unit (BLU) of a display.

[0009] As the FPCB transfers force to the BLU, the BLU may undergo slight deformation. Due to this slight deformation within the BLU, the light generated by the BLU may refract instead of traveling as designed. Therefore, localized color variations may occur in the display.

[0010] The present disclosure addresses at least the aforementioned problems and / or disadvantages, and provides at least the advantages described below. Therefore, one aspect of the present disclosure provides an electronic device for reducing BLU deformation by suppressing deformation of the FPCB or changing the magnitude or direction of stress on the FPCB.

[0011] Other aspects will be set forth in part in the description which follows, and in part will be apparent from the description, or may be learned by practicing the embodiments presented.

[0012] Technical solution

[0013] According to one aspect of this disclosure, an electronic device is provided. The electronic device includes: a housing; a display disposed within the housing, wherein the display is disposed along a first direction such that the screen of the display is exposed outside the housing; a first PCB disposed within the housing; an FPCB disposed within the housing and including a first portion adjacent to the display, a third portion extending from the first portion, and a second portion extending from the third portion and electrically connected to the first PCB; a first guide member disposed within the housing; and a second guide member disposed within the housing. At least a portion of the third portion may be configured to pass between the first guide member and the second guide member. A second stress acting in a second direction opposite to the first direction may be generated in the at least a portion of the third portion by the first guide member.

[0014] According to another aspect of this disclosure, an electronic device is provided. The electronic device includes: a housing; a display disposed within the housing, wherein the display is disposed along a first direction such that the screen of the display is exposed to the outside of the housing; a first PCB disposed within the housing; an FPCB disposed within the housing and including a first portion adjacent to the display, a third portion extending from the first portion, and a second portion extending from the third portion and electrically connected to the first PCB; and a first guide member disposed within the housing. At least a portion of the third portion is contactable with the first guide member. A second stress acting in a second direction opposite to the first direction can be generated in the at least a portion of the third portion by the first guide member.

[0015] Beneficial effects

[0016] According to various embodiments of this disclosure, in an electronic device, the force transmitted from the FPCB to the display can be reduced or released. Therefore, deformation may not occur or may be minimal in the display. When the deformation of the display is reduced or does not occur, the display can output the screen normally according to the electrical signals.

[0017] Other aspects, advantages, and salient features of this disclosure will become apparent to those skilled in the art from the following detailed description of various embodiments disclosed in conjunction with the accompanying drawings. Attached Figure Description

[0018] The above and other aspects, features, and advantages of certain embodiments of this disclosure will become clearer from the following description taken in conjunction with the accompanying drawings, in which:

[0019] Figure 1 This is a block diagram illustrating an electronic device in a network environment according to an embodiment of the present disclosure;

[0020] Figure 2 This is a front perspective view showing an electronic device according to an embodiment of the present disclosure;

[0021] Figure 3 This is a rear perspective view showing an electronic device according to an embodiment of the present disclosure;

[0022] Figure 4 This is an exploded perspective view illustrating an electronic device according to an embodiment of the present disclosure;

[0023] Figure 5 This is a rear perspective view showing an electronic device other than the back panel according to an embodiment of the present disclosure;

[0024] Figure 6 It is according to the embodiments of this disclosure along Figure 3A cross-sectional view of surface A of the electronic device;

[0025] Figure 7 This is a side view of the display and FPCB of an electronic device according to an embodiment of the present disclosure;

[0026] Figure 8 This is an exploded perspective view showing a display according to an embodiment of the present disclosure;

[0027] Figure 9a According to embodiments of this disclosure Figure 6 An enlarged cross-sectional view of part B;

[0028] Figure 9b According to embodiments of this disclosure Figure 6 An enlarged perspective cross-sectional view of part B;

[0029] Figure 10a According to embodiments of this disclosure Figure 6 An enlarged cross-sectional view of part B;

[0030] Figure 10b According to embodiments of this disclosure Figure 6 An enlarged perspective cross-sectional view of part B;

[0031] Figure 11a According to embodiments of this disclosure Figure 6 An enlarged cross-sectional view of part B; and

[0032] Figure 11b According to embodiments of this disclosure Figure 6 An enlarged perspective cross-sectional view of part B.

[0033] Throughout the accompanying drawings, it should be noted that the same reference numerals are used to depict the same or similar elements, features, and structures. Detailed Implementation

[0035] The following description, provided with reference to the accompanying drawings, is intended to aid in a comprehensive understanding of the various embodiments of this disclosure as defined by the claims and their equivalents. It includes various specific details to aid understanding, but these details should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the various embodiments described herein without departing from the scope and spirit of this disclosure. Additionally, descriptions of well-known functions and structures may be omitted for clarity and conciseness.

[0036] The terms and words used in the following description and claims are not limited to their literal meaning, but are used by the inventors only to enable a clear and consistent understanding of this disclosure. Therefore, it will be apparent to those skilled in the art that the following description providing various embodiments of this disclosure is for illustrative purposes only and is not intended to limit the purpose of this disclosure as defined by the appended claims and their equivalents.

[0037] It should be understood that the singular forms “a,” “an,” and “the” include plural indicators unless the context clearly indicates otherwise. Thus, for example, a reference to “component surface” includes a reference to one or more such surfaces.

[0038] Figure 1 This is a block diagram illustrating an electronic device in a network environment according to an embodiment of the present disclosure.

[0039] Reference Figure 1 In network environment 100, electronic device 101 can communicate with at least one of external electronic devices 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of external electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to embodiments of this disclosure, electronic device 101 can communicate with external electronic device 104 via server 108. According to embodiments of this disclosure, electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a Subscriber Identity Module (SIM) 196, or an antenna module 197. In some embodiments of this disclosure, at least one of the aforementioned components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. According to embodiments of this disclosure, some of the aforementioned components (e.g., sensor module 176, camera module 180, or antenna module 197) may be integrated into a single component (e.g., display module 160).

[0040] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment of this disclosure, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to embodiments of this disclosure, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0041] When the main processor 121 is inactive (e.g., in sleep) state, the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments of this disclosure, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 at the point where artificial intelligence is executed, or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0042] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0043] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0044] The input module 150 can receive commands or data from outside the electronic device 101 (e.g., a user) that will be used by other components of the electronic device 101 (e.g., processor 120). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0045] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0046] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0047] The audio module 170 can convert sound into electrical signals and vice versa. According to embodiments of this disclosure, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0048] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments of this disclosure, sensor module 176 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0049] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic device (e.g., electronic device 102). According to embodiments of this disclosure, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0050] Connection end 178 may include a connector, via which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments of this disclosure, connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0051] The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or motion) or electrical stimulation that can be recognized by a user through his touch or kinesthesia. According to embodiments of this disclosure, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0052] Camera module 180 can capture still or moving images. According to embodiments of this disclosure, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0053] The power management module 188 manages the power supply to the electronic device 101. According to one embodiment of this disclosure, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0054] Battery 189 may power at least one component of electronic device 101. According to embodiments of this disclosure, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0055] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments of this disclosure, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0056] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to embodiments of this disclosure, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0057] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to embodiments of this disclosure, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to embodiments of this disclosure, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190. Signals or power can then be transmitted or received between communication module 190 and external electronic device via the selected at least one antenna. According to embodiments of this disclosure, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0058] According to various embodiments of this disclosure, antenna module 197 can form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0059] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0060] According to embodiments of this disclosure, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of external electronic device 102 or external electronic device 104 may be a device of the same type as electronic device 101 or a device of a different type. According to embodiments of this disclosure, all or some operations that would be performed on electronic device 101 may be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, the one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment of this disclosure, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0061] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0062] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish the respective component from another component and do not limit the component in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “attached to another element (e.g., a second element)”, it means that the first element can be directly (e.g., wiredly) connected to the second element, wirelessly connected to the second element, or connected to the second element via a third element.

[0063] As used herein, the term "module" can include a unit implemented in hardware, software, or firmware, and is used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module can be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to an embodiment, a module can be implemented in the form of an application-specific integrated circuit (ASIC).

[0064] The various embodiments set forth herein can be implemented as software (e.g., program 140) containing one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" means only that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0065] According to embodiments of this disclosure, methods according to various embodiments of this disclosure can be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product can be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0066] According to various embodiments of this disclosure, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities. Some of the multiple entities may be separately disposed in different components. According to various embodiments of this disclosure, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments of this disclosure, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0067] Figure 2 This is a front perspective view showing an electronic device according to an embodiment of the present disclosure. Figure 3 This is a rear perspective view showing an electronic device according to an embodiment of the present disclosure.

[0068] Reference Figure 2 and Figure 3 According to embodiments of the present disclosure, the electronic device 101 may include a housing 310 having a front side 310A, a back side 310B, and a side side 310C surrounding the space between the front side 310A and the back side 310B. According to another embodiment (not shown), the housing 310 may represent a structure formed... Figure 2 The front of 310A and the side of 310C and Figure 3 The structure of a portion of the back panel 310B. According to embodiments of the present disclosure, at least a portion of the front panel 310A may have a substantially transparent front panel 302 (e.g., a glass plate or a polymer plate including various coatings). The back panel 310B may be formed of a back panel 311. The back panel 311 may be formed of, for example, glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium) or a combination of at least two of glass, ceramic, polymer, and metal (e.g., aluminum, stainless steel (STS), or magnesium). The side panel 310C may be formed of a side frame structure (or “side member”) 318 that is combined with the front panel 302 and the back panel 311 and includes metal and / or polymer. According to embodiments of the present disclosure, the back panel 311 and the side frame structure 318 may be integrally formed together and include the same material (e.g., glass, metal (such as aluminum), or ceramic).

[0069] In the illustrated embodiment, the front panel 302 may include two first edge regions 310D extending seamlessly and curvedly from the front face 310A to the back panel 311 on both long edges of the front panel 302. In the illustrated embodiment of this disclosure (see...) Figure 3 In this embodiment, the back panel 311 may include two second edge regions 310E extending seamlessly and curvedly from the back panel 310B to the front panel. According to embodiments of this disclosure, the front panel 302 (or back panel 311) may include only one of the first edge regions 310D (or the second edge region 310E). Optionally, either the first edge region 310D or the second edge region 310E may be partially excluded. According to embodiments of this disclosure, in a side view of the electronic device 101, the side frame structure 318 may have a first thickness (or width) on the side without the first edge region 310D or the second edge region 310E, and a second thickness less than the first thickness on the side with the first edge region 310D or the second edge region 310E.

[0070] According to embodiments of this disclosure, electronic device 101 may include display 301, audio modules 303, 307, and 314 (e.g., Figure 1 The audio module 170), sensor module (e.g., Figure 1 Sensor module 176), camera modules 305 and 312 (e.g., Figure 1 The camera module 180), key input device 317 (e.g., Figure 1 The input module 150) and connector holes 308 and 309 (e.g., Figure 1 At least one of the above components (e.g., connector hole 309). According to embodiments of this disclosure, electronic device 101 may exclude at least one of the above components (e.g., connector hole 309) or may add other components.

[0071] According to embodiments of the present disclosure, display 301 may be visually exposed through, for example, a large portion of front panel 302. According to embodiments of the present disclosure, at least a portion of display 301 may be exposed through front panel 302 forming front surface 310A and first edge region 310D. According to embodiments of the present disclosure, the edges of display 301 may be formed to be substantially the same shape as the adjacent outer edges of front panel 302. According to embodiments of the present disclosure (not shown), the spacing between the outer edges of display 301 and the outer edges of front panel 302 may remain substantially the same to provide a larger area for exposing display 301.

[0072] According to embodiments of this disclosure, the surface of the housing 310 (or the front panel 302) may include a screen display area formed when the display 301 is visually exposed. For example, the screen display area may include a front surface 310A and a first edge region 310D.

[0073] According to an embodiment of the present disclosure, the first side 310F may be disposed along the +X axis direction of the housing 310, and the second side 310G may be disposed along the -X axis direction.

[0074] According to embodiments of the present disclosure, a recess or opening may be formed in a portion of the screen display area of ​​the display 301 (e.g., the front surface 310A or the first edge region 310D), and at least one or more of the audio module 314, sensor module (not shown), light-emitting device (not shown), and camera module 305 may be aligned with the recess or opening. According to another embodiment of the present disclosure (not shown), at least one or more of the audio module 314, sensor module (not shown), camera module 305, fingerprint sensor (not shown), and light-emitting device (not shown) may be included on the back surface of the screen display area of ​​the display 301. According to embodiments of the present disclosure (not shown), the display 301 may be configured to be coupled to or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digital converter for detecting a magnetic field type stylus. According to embodiments of the present disclosure, at least a portion of the key input device 317 may be disposed in the first edge region 310D and / or the second edge region 310E.

[0075] According to various embodiments of the present disclosure, the first camera module 305 and / or sensor module in camera modules 305 and 312 may be disposed within the internal space of the electronic device 101 to contact the external environment through a transmissive area of ​​the display 301. According to embodiments of the present disclosure, as part of the area for displaying content, the area of ​​the display 301 facing the first camera module 305 may be formed as a transmissive area with a specified transmittance. According to embodiments of the present disclosure, the transmissive area may be formed to have a transmittance in the range of about 5% to about 20%. The transmissive area may include a region overlapping with the effective area (e.g., viewing angle area) of the first camera module 305, through which light passes and incident on an image sensor to generate an image. For example, the transmissive area of ​​the display 301 may include a region having a lower pixel density and / or wiring density than the surrounding area. For example, the transmissive area may replace a recess or opening.

[0076] According to embodiments of this disclosure, audio modules 303, 307, and 314 may include, for example, a microphone hole 303 and speaker holes 307 and 314. The microphone hole 303 may have an internal microphone to receive external sound. According to embodiments of this disclosure, multiple microphones may be present to detect the direction of sound. Speaker holes 307 and 314 may include an external speaker hole 307 and a telephone receiver hole 314. According to embodiments of this disclosure, speaker holes 307 and 314 and the microphone hole 303 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be placed without speaker holes 307 and 314. Audio modules 303, 307, and 314 are not limited to the structures described above. Various design changes may be made depending on the structure of the electronic device 101; for example, only some of the above-described audio modules may be installed, or new audio modules may be added.

[0077] According to embodiments of this disclosure, a sensor module (not shown) can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of the electronic device 101. The sensor module (not shown) may include a first sensor module (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on the front side 310A of the housing 310 and / or a third sensor module (e.g., a heart rate monitor (HRM) sensor) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on the back side 310B of the housing 310. In an embodiment (not shown), the fingerprint sensor may be disposed on both the back side 310B and the front side 310A (e.g., the display 301) of the housing 310. The electronic device 101 may include sensor modules (e.g., at least one of a gesture sensor, gyroscope sensor, barometric pressure sensor, magnetic sensor, accelerometer, grip sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor). The sensor module is not limited to the structures described above. Depending on the structure of the electronic device 101, various design changes can be made. For example, only some of the aforementioned sensor modules can be installed, or new sensor modules can be added.

[0078] According to embodiments of this disclosure, camera modules 305 and 312 may include a first camera module 305 disposed on the front side 310A of the electronic device 101 and a second camera module 312 disposed on the rear side 310B, and / or a flash (not shown). Camera modules 305 and 312 may include one or more lenses, an image sensor, and / or an image signal processor. The flash (not shown) may include, for example, a light-emitting diode (LED) or a xenon lamp. According to embodiments of this disclosure, two or more lenses (infrared (IR) cameras, wide-angle lenses, and telephoto lenses) and an image sensor may be disposed on one surface of the electronic device 101. Camera modules 305 and 312 are not limited to the above-described structures. Various design changes may be made depending on the structure of the electronic device 101; for example, only some of the above-described camera modules may be installed, or new camera modules may be added.

[0079] According to embodiments of this disclosure, electronic device 101 may include multiple camera modules (e.g., dual-camera or triple-camera) with different attributes (e.g., viewing angles) or functions. For example, multiple camera modules 305 and 312 may be configured to include lenses with different viewing angles, and electronic device 101 may control, based on user selection, to change the viewing angles of camera modules 305 and 312 performed by electronic device 101. At least one of camera modules 305 and 312 may form, for example, a wide-angle camera, and at least another of the multiple camera modules may form a telephoto camera. Similarly, at least one of camera modules 305 and 312 may form, for example, a front-facing camera, and at least another of the multiple camera modules may form a rear-facing camera. Furthermore, camera modules 305 and 312 may include at least one of a wide-angle camera, a telephoto camera, and an infrared (IR) camera (e.g., a time-of-flight (TOF) camera, a structured light camera). According to embodiments of this disclosure, an IR camera may be operated as at least part of a sensor module. For example, a TOF camera may be operated as at least part of a sensor module (not shown) for detecting the distance to an object.

[0080] According to embodiments of the present disclosure, the key input device 317 may be disposed on the side 310C of the housing 310. According to embodiments of the present disclosure, the electronic device 101 may exclude all or some of the aforementioned key input devices 317, and the excluded key input devices 317 may be implemented on the display 301 in other forms (e.g., as soft keys). According to embodiments of the present disclosure, the key input device may include a sensor module (not shown) disposed on the back 310B of the housing 310.

[0081] According to embodiments of this disclosure, a light-emitting device (not shown) may be disposed, for example, on the front surface 310A of housing 310. The light-emitting device (not shown) may provide, for example, information about the state of electronic device 101 in the form of light. According to another embodiment of this disclosure, the light-emitting device (not shown) may provide a light source for interaction with, for example, a front-facing camera module 305. The light-emitting device (not shown) may include, for example, light-emitting diodes (LEDs), infrared (IR) LEDs, and / or xenon lamps.

[0082] According to embodiments of this disclosure, connector holes 308 and 309 may include, for example, a first connector hole 308 (e.g., a Universal Serial Bus (USB) connector) and / or a second connector hole 309 (e.g., a headphone jack), wherein the first connector hole 308 is used to accommodate a connector for transmitting power and / or data to or receiving power and / or data from an external electronic device, and the second connector hole 309 is used to accommodate a connector for transmitting audio signals to or receiving audio signals from an external electronic device.

[0083] According to embodiments of the present disclosure, some of the first camera module 305 and / or sensor modules (not shown) in camera modules 305 and 312 may be configured to be exposed to the outside through at least a portion of the display 301. For example, camera module 305 may include a punch-hole camera disposed within a hole or recess formed in the back of the display 301. According to embodiments of the present disclosure, second camera module 312 may be disposed inside housing 310 such that the lens is exposed on the back 310B of electronic device 101. For example, second camera module 312 may be disposed on a printed circuit board (e.g., Figure 4 On the printed circuit board 340.

[0084] According to embodiments of this disclosure, the first camera module 305 and / or sensor module may be configured to contact the external environment through a transparent area from the internal space of the electronic device 101 to the front panel 302 of the display 301. Furthermore, some sensor modules (not shown) may be disposed within the internal space of the electronic device to perform their functions without being visually exposed through the front panel 302.

[0085] Figure 4 This is an exploded perspective view showing an electronic device according to an embodiment of the present disclosure.

[0086] Reference Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9a , Figure 9b , Figure 10a , Figure 10b , Figure 11a and Figure 11b The direction from the back panel 380 to the front panel 320 can be considered as the +Z axis direction, the direction from the front panel 320 to the back panel 380 can be considered as the -Z axis direction, the direction from the second PCB 342 to the first PCB 341 can be considered as the +X axis direction, and the direction from the first PCB 341 to the second PCB 342 can be considered as the -X axis direction.

[0087] Reference Figure 4 According to various embodiments of this disclosure, electronic device 101 (e.g., Figures 1 to 3 The electronic device 101 may include a support bracket 370 and a front panel 320 (e.g., Figure 2 Front panel 302), display 330 (e.g., Figure 2 The display 301), printed circuit board 340 (e.g., PCB, flexible PCB (FPCB) or rigid-flex PCB (RFPCB)), battery 350 (e.g., Figure 1 The battery 189), the second support member 360 (e.g., the back cover), and the antenna 390 (e.g., Figure 1 Antenna module 197) and backplane 380 (e.g., Figure 3 The back panel 311). The support bracket 370 of the electronic device 101 according to the embodiment may include a side frame structure 371 (e.g., the back panel 311). Figure 2 The side frame structure 318) and the first support member 372.

[0088] According to embodiments of this disclosure, electronic device 101 may exclude at least one of the aforementioned components (e.g., the first support member 372 or the second support member 360) or may include other components. At least one component of electronic device 101 may be compatible with... Figure 2 or Figure 3 At least one component of the electronic device 101 is the same or similar, and will not be described again below.

[0089] According to various embodiments of this disclosure, a first support member 372 may be disposed inside the electronic device 101 to be connected to or integrated with the side bezel structure 371. The first support member 372 may be formed of, for example, a metallic and / or non-metallic material (e.g., a polymer). A display 330 may be bonded to one surface of the first support member 372, and a printed circuit board 340 may be bonded to the opposite surface of the first support member 372.

[0090] According to various embodiments of this disclosure, a processor, memory, and / or interface may be mounted on a printed circuit board 340. The processor may include one or more of, for example, a central processing unit, an application processor, a graphics processing device, an image signal processor, a sensor hub processor, or a communication processor. According to various embodiments of this disclosure, the printed circuit board 340 may include a flexible printed circuit board type radio frequency cable (FRC). For example, the printed circuit board 340 may be disposed on at least a portion of the first support member 372 and may be connected to an antenna module (e.g., Figure 1 Antenna module 197) and communication module (e.g., Figure 1 The communication module 190 is electrically connected. In one embodiment of this disclosure, the printed circuit board 340 may include a first PCB 341 and / or a second PCB 342. For example, the first PCB 341 may be disposed relative to the battery 350 along the +X-axis direction, and the second PCB 342 may be disposed relative to the battery 350 along the -X-axis direction. The first PCB 341 and / or the second PCB 342 may include all or some of the components included in the printed circuit board 340.

[0091] According to embodiments of this disclosure, the memory may include, for example, volatile memory or non-volatile memory.

[0092] According to embodiments of this disclosure, the interface may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, and / or an audio interface. The interface can electrically or physically connect, for example, electronic device 101 to an external electronic device, and may include a USB connector, an SD card / Multimedia Card (MMC) connector, or an audio connector.

[0093] According to embodiments of this disclosure, battery 350 may be a means for supplying power to at least one component of electronic device 101. Battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable accumulator, or a fuel cell. Battery 350 may be integrally or detachably disposed within electronic device 101.

[0094] According to various embodiments of this disclosure, a second support member 360 (e.g., a rear cover) may be disposed between the printed circuit board 340 and the antenna 390. For example, the second support member 360 may include one surface where at least one of the printed circuit board 340 and the battery 350 is bonded, and another surface where the antenna 390 is bonded.

[0095] According to embodiments of this disclosure, antenna 390 may be disposed between back panel 380 and battery 350. Antenna 390 may include, for example, near field communication (NFC) antenna, wireless charging antenna, and / or magnetically secure transmission (MST) antenna. Antenna 390 may perform short-range communication with, for example, external devices, or may wirelessly transmit or receive power required for charging. According to embodiments of this disclosure, the antenna structure may be formed by a portion of side frame structure 371 and / or first support member 372, or a combination of side frame structure 371 and / or first support member 372.

[0096] According to various embodiments of this disclosure, the backplate 380 may form the back side of the electronic device 101 (e.g., Figure 3 At least a portion of the back side (310B).

[0097] Figure 5 This is a rear perspective view showing an electronic device other than the back panel according to an embodiment of the present disclosure.

[0098] Reference Figure 5 According to various embodiments of the present disclosure, the electronic device 101 may include a front panel 320, a display 330, a printed circuit board 340, a battery 350, a second support member 360, a support bracket 370, a back panel 380, and / or an antenna 390. Figure 5 The printed circuit board 340 and battery 350 of the electronic device 101 shown can be connected to Figure 4 The printed circuit board 340 and battery 350 of the electronic device 101 shown are all or partially identical. Therefore, no description of identical components is given.

[0099] According to various embodiments of this disclosure, electronic device 101 may include printed circuit board 340, battery 350, or flexible printed circuit board (FPCB) 400.

[0100] According to various embodiments of this disclosure, the printed circuit board 340 may include a first PCB 341 and / or a second PCB 342. In one embodiment of this disclosure, the first PCB 341 and the second PCB 342 may be disposed separately from each other. For example, the first PCB 341 may be adjacent to a first side disposed along the +X axis direction (e.g., Figure 4 The first side 310F) is provided, and the second PCB 342 may be adjacent to the second side arranged along the -X axis direction (e.g., Figure 4 The second side 310G) is set. As another example, the first PCB 341 may be adjacent to the camera module ( Figure 2 The second PCB 342 can be configured adjacent to audio modules 303 and 307.

[0101] According to various embodiments of this disclosure, FPCB 400 may be electrically connected to a display driver IC (DDI) (not shown) driving the display 330. As another example, FPCB 400 may be electrically connected to a first PCB 341. As another example, FPCB 400 may be electrically connected to a second PCB 342. For example, the DDI may be electrically connected to the first PCB 341 and / or the second PCB 342 via FPCB 400.

[0102] According to various embodiments of this disclosure, FPCB 400 may include a first FPCB 410 and / or a second FPCB 420. For example, the first FPCB 410 may electrically connect the DDI and the first PCB 341. For example, a processor disposed on the first PCB 341 may be electrically connected to the DDI via the first FPCB 410. The processor may transmit electrical signals to the DDI via the first FPCB 410, and the DDI may drive the display 330 according to the transmitted signals. As another example, the second FPCB 420 may electrically connect the DDI and the second PCB 342.

[0103] According to various embodiments of this disclosure, the first FPCB 410 may include a bent portion.

[0104] In embodiments of this disclosure, the first FPCB 410 can electrically connect two different components that are disposed separately from each other. According to embodiments of this disclosure, the first FPCB 410 can connect a first PCB 341 and a DDI that are disposed separately from each other. Another component may be disposed between the first PCB 341 and the DDI. For example, since the first FPCB 410 may include a bent portion, the first FPCB 410 may be configured to bypass another component disposed between the first PCB 341 and the DDI. According to embodiments of this disclosure, a battery 350 may be disposed between the first PCB 341 and the DDI. The component disposed between the first PCB 341 and the DDI is not limited to the battery 350, and another component may be disposed or additionally disposed. The first FPCB 410 may be configured to bypass the battery 350 disposed between the first PCB 341 and the DDI to electrically connect the first PCB 341 and the DDI. As the first FPCB 410 travels around another component disposed between the first PCB 341 and the DDI, the values ​​of at least a portion of the first FPCB 410 on the X, Y, and / or Z axes can be changed. According to embodiments of this disclosure, when traveling between the first PCB 341 and the battery 350 along the -X axis, the first FPCB 410 can be bent along the -Z axis. As another example, when traveling between the battery 350 and the DDI along the -X axis, the first FPCB 410 can be bent along the +Z axis. Thus, as the first FPCB 410 is bent, it can electrically connect components with different Z-axis values.

[0105] According to various embodiments of this disclosure, the second FPCB 420 may include a bent portion. Therefore, the second FPCB 420 can electrically connect two different components that are not disposed on the same plane. For example, the Z-axis values ​​of the second PCB 342 and the DDI may be different. When traveling between the second PCB 342 and the DDI along the -X-axis direction, the second FPCB 420 may be bent along the -Z-direction. Thus, as the second FPCB 420 is bent, it can electrically connect components with different heights relative to the Z-axis.

[0106] According to various embodiments of this disclosure, since the FPCB 400 includes a bent portion, stress can occur in the FPCB 400. A portion adjacent to the bent portion of the FPCB 400 can contact components disposed within the electronic device 101. Therefore, the stress generated in the FPCB 400 can contact the components disposed within the electronic device 101 and transmit force to the components disposed within the electronic device 101. Due to the force transmitted through contact with the FPCB 400, the structure of the electronic device 101 may deform.

[0107] Figure 6It is according to the embodiments of this disclosure along Figure 3 A cross-sectional view of surface A of the electronic device. Figure 7 This is a side view of the display and FPCB of an electronic device according to an embodiment of the present disclosure.

[0108] Reference Figure 6 According to various embodiments of the present disclosure, the electronic device 101 may include a front panel 320, a display 330, a printed circuit board 340, a battery 350, a second support member 360, a support bracket 370, a back panel 380, and / or an antenna 390. Figure 6 and Figure 7 The display 330, printed circuit board 340, battery 350, and backplane 380 of the electronic device 101 shown can be connected to Figure 4 or Figure 5 The display 330, printed circuit board 340, battery 350, and backplane 380 of the illustrated electronic device 101 are all or partially identical. Therefore, no description of identical components is given.

[0109] Figure 6 It is along Figure 3 A cross-sectional view taken along surface A, including points A1, A2, A3, and A4, as observed in the direction of the arrow in the electronic device 101. Figure 7 yes Figure 3 Side view of the display 330 and FPCB 400 of the electronic device 101.

[0110] Reference Figure 6 and Figure 7 According to various embodiments of this disclosure, the electronic device 101 may include a guide member 500. The guide member 500 may include a first guide member 510 and a second guide member 520. In embodiments of this disclosure, the first guide member 510 may be integrally formed with a first support member 372, or may be disposed on the first support member 372. For example, the first guide member 510 may support a battery 350. In embodiments of this disclosure, the second guide member 520 may be integrally formed with a second support member 360, or may be disposed on the second support member 360.

[0111] According to various embodiments of this disclosure, the battery 350 may be disposed between the first PCB 341 and the second PCB 342. As another example, the battery 350 may be disposed between the display 330 and the back panel 380.

[0112] According to various embodiments of this disclosure, the first guide member 510 may be located between the first PCB 341 and the DDI (not shown). At least a portion of the first guide member 510 may protrude along the -Z axis direction.

[0113] In one embodiment of this disclosure, at least a portion of the first FPCB 410 may be bent along the -Z-axis direction to bypass a component disposed between the first PCB 410 and the DDI (not shown). For example, the first FPCB 410 may be bent along the -Z-axis direction such that at least a portion of the first FPCB 410 is disposed in the space between the first guide member 510 and the backplate 380.

[0114] According to various embodiments of this disclosure, a first guide member 510 may be disposed adjacent to the battery 350, the display 330, and the second PCB 342. The first guide member 510 may contact the FPCB 400. For example, the first guide member 510 may contact the first FPCB 410. In embodiments of this disclosure, at least a portion of the first guide member 510 may be formed of an adhesive material, or an adhesive may be disposed on the surface of the first guide member 510. Therefore, the first FPCB 410 may be adhered to and secured to the first guide member 510. When the first guide member 510 and the first FPCB 410 are in contact, the sides of the first FPCB 410 and the battery 350 may be spaced apart. As another example, when the first FPCB 410 travels along the +X axis, at least a portion of the first FPCB 410 may contact the first guide member 510 and be deformed to bend along the -Z axis. Another portion of the first FPCB 410 may be disposed between the battery 350 and the backplate 380. (The following text is incomplete and requires further context.) Figure 9a Together with the description, a detailed description of the first guide member 510 and the first FPCB 410 is given.

[0115] According to various embodiments of this disclosure, the second guide member 520 may be disposed adjacent to the backplane 380 and the second PCB 342. The second guide member 520 may contact the FPCB 400. For example, the second guide member 520 may contact the first FPCB 410. The second guide member 520 may contact the backplane 380. When the second guide member 520 and the backplane 380 are in contact with each other, the second guide member 520 may protect the second PCB 342 from external impacts. (The following is a continuation of the previous paragraph...) Figure 10a Together with the description, a detailed description of the second guiding member 520 is given.

[0116] Reference Figure 7 This allows for a more detailed examination of the structure of the display 330 and FPCB 400.

[0117] According to various embodiments of this disclosure, one end of the first FPCB 410 may be connected to the DDI (not shown) of the display 330, and the other end may be connected to the first PCB (…). Figure 6(341) Connection. The first FPCB 410 may include a main connection unit 414. The main connection unit 414 may be disposed at the other end of the first FPCB 410 to connect the first FPCB 410 and the first PCB 341. When the first FPCB 410 is disposed, for example, along the X-axis direction from DDI to the first PCB 341, at least a portion of the first FPCB 410 may have different Z-axis values. Therefore, the first FPCB 410 may include a bent portion in the XZ plane. As described above, since the first FPCB 410 includes a bent portion, the first FPCB 410 can bypass components or structures disposed between two other spaced-apart components of the electronic device 101, thereby connecting the other two components of the electronic device 101.

[0118] According to various embodiments of this disclosure, one end of the second FPCB 420 may be connected to the DDI of the display 330, and the other end may be connected to the second PCB 342. The second FPCB 420 may include a sub-connection unit 421. The sub-connection unit 421 may be disposed on the other end of the second FPCB 420 to connect the second FPCB 420 and the second PCB 342. As the second FPCB 420 travels from the DDI to the second PCB 342, the Z-axis value of the second FPCB 420 may change. Therefore, the second FPCB 420 may be arranged in a U-shape in the XZ plane. As described above, when the second FPCB 420 is arranged in a U-shape, the second FPCB 420 may electrically connect two spaced-apart components of the electronic device 101. Optionally, the second FPCB 420 may electrically connect two components of the electronic device 101 with different Z-axis values.

[0119] Figure 8 This is an exploded perspective view showing a display according to an embodiment of the present disclosure.

[0120] According to various embodiments of this disclosure, electronic device 101 may include display 330. Figure 8 The display 330 shown can be connected with Figures 4 to 7 The displays 330 shown are all or partially identical. Therefore, no descriptions of identical components are given.

[0121] Reference Figure 8 According to various embodiments of the present disclosure, the display 330 may include a lamp 331, a lampshade 332, a reflector 333, a light guide plate 334, a diffuser 335, a vertical prism sheet 336, a horizontal prism sheet 337, a protective sheet 338, and a liquid crystal display (LCD) panel 339.

[0122] According to various embodiments of this disclosure, the lamp 331 of the display 330 can generate light. Therefore, the lamp 331 can perform a light-emitting function. The lamp 331 may include a side lamp 331-1 and a back lamp 331-2.

[0123] According to various embodiments of this disclosure, such as Figure 8 As shown, the side lamp 331-1 can be disposed on the side of the light guide plate 334. The lamp cover 332 can be disposed around the side lamp 331-1. The lamp cover 332 can reflect the light generated from the side lamp 331-1 to the light guide plate 334. Therefore, the luminous efficiency of the display 330 can be increased. Although in Figure 8 Only one side lamp 331-1 is shown, but lamp 331 may include one or more side lamps 331-1. For example, side lamp 331-1 may be provided not only on one side of light guide plate 334, but also on the other side of light guide plate 334.

[0124] According to another embodiment of this disclosure, the backlight 331-2 in the components of the display 330 may be disposed on the innermost side of the electronic device 101. For example, as Figure 8 As shown, among the backlight 331-2, reflector 333, light guide plate 334, diffuser 335, vertical prism sheet 336, horizontal prism sheet 337, protective sheet 338 and LCD panel 339, the backlight 331-2 can be set to have the minimum Z-axis value.

[0125] According to various embodiments of this disclosure, the reflector 333 can be disposed along the -Z-axis direction of the light guide plate 334. The reflector 333, which reflects light traveling along the -Z-axis direction in the light incident on the light guide plate 334, can be disposed along the -Z-axis direction of the light guide plate 334. The light reflected by the reflector 333 can travel along the +Z-axis direction. Therefore, the luminous efficiency of the display 330 can be improved. The reflector 333 can be used when using side lamps 331-1.

[0126] According to various embodiments of this disclosure, the light guide plate 334 may be disposed along the +Z axis direction of the reflector 333. Light incident from the side lamp 331-1 or back lamp 331-2 of the lamp 331 is incident on the light guide plate 334. The light guide plate 334 can uniformly distribute the incident light. Therefore, the light incident from the lamp 331 onto the light guide plate 334 can be uniformly distributed over the entire area of ​​the screen of the display 330. The light guide plate 334 may be formed of polymethyl methacrylate (PMMA).

[0127] According to various embodiments of this disclosure, the diffuser 335 may be disposed along the +Z axis direction of the light guide plate 334. The diffuser 335 can scatter light emitted from the light guide plate 334 and diffuse it more uniformly, and propagate the light emitted from the light guide plate 334 forward, thereby increasing the viewing angle of the screen. Furthermore, the diffuser 335 can block a series of optical patterns formed on the light guide plate 334 or strong light from the side lamps 331-1 or the back lamps 331-2. The diffuser 335 may be formed of polyethylene terephthalate (PET) film. When the diffuser 335 is used, the brightness of the display 330 can be increased.

[0128] According to various embodiments of this disclosure, the vertical prism sheet 336 and the horizontal prism sheet 337 may be arranged along the +Z axis direction of the diffuser sheet 335. The horizontal prism sheet 337 may be arranged along the +Z axis direction of the vertical prism sheet 336. The vertical prism sheet 336 may be arranged along the +Z axis direction of the horizontal prism sheet 337. The vertical prism sheet 336 and the horizontal prism sheet 337 can refract and converge light emitted from the diffuser sheet 335. For example, using the vertical prism sheet 336 and the horizontal prism sheet 337, side light can be refracted into front light. Therefore, the brightness of the display 330 can be further increased.

[0129] According to various embodiments of this disclosure, the protective sheet 338 may be disposed along the +Z axis direction of the vertical prism sheet 336 or the horizontal prism sheet 337. The protective sheet 338 can protect the vertical prism sheet 336 or the horizontal prism sheet 337 from external impacts. In addition, the protective sheet 338 can prevent foreign objects from entering.

[0130] According to various embodiments of this disclosure, the LCD panel 339 may be disposed along the +Z axis direction of the protective sheet 338. The LCD panel 339 includes liquid crystal. The liquid crystal may be controlled by electrical signals from the DDI. The liquid crystal may control the brightness and color of the light emitted from the protective sheet 338 via electrical signals. Due to the adjusted brightness and color of the light from the LCD panel 339, a user can perceive visual information from the display 330.

[0131] Figure 9a According to embodiments of this disclosure Figure 6 An enlarged cross-sectional view of part B. Figure 9b According to embodiments of this disclosure Figure 6 An enlarged perspective cross-sectional view of part B.

[0132] According to various embodiments of the present disclosure, electronic device 101 may include display 330, battery 350, backplane 380, first FPCB 410 and / or guide member 500. Figure 9a and Figure 9b The electronic device 101 shown includes a display 330, a battery 350, a backplane 380, a first FPCB 410, and a guide member 500, which can be connected to... Figures 4 to 8The display 330, battery 350, backplane 380, first FPCB 410, and guide member 500 of the illustrated electronic device 101 are all or partially identical. Therefore, no description of identical components is given.

[0133] Reference Figure 9a and Figure 9b According to various embodiments of this disclosure, the guide member 500 may include a first guide member 510 and a second guide member 520. A first FPCB 410 may be disposed between the first guide member 510 and the second guide member 520. For example, the first FPCB 410 may be configured to pass through between the first guide member 510 and the second guide member 520.

[0134] In one embodiment of this disclosure, the first FPCB 410 may include a first portion 411 adjacent to the display 330, a second portion 412 adjacent to the back panel 380, and a third portion 413 disposed between the first portion 411 and the second portion 412. For example, the third portion 413 may be bent while extending from the first portion 411 to the second portion 412. In one embodiment of this disclosure, the second portion 412 may be located between the back panel 380 and the battery 350. When viewed from above the back panel 380, the third portion 413 may overlap with the first guide member 510. In an embodiment of this disclosure, the second guide member 520 may be closer to the back panel 380 than the first guide member 510. In an embodiment of this disclosure, at least a portion of the third portion 413 may be disposed between the first guide member 510 and the second guide member 520.

[0135] According to various embodiments of this disclosure, the first FPCB 410 may include a first portion 411, a second portion 412, and a third portion 413. The first portion 411, the third portion 413, and the second portion 412 may be arranged sequentially along the +X axis direction.

[0136] According to various embodiments of this disclosure, the first portion 411 may be connected to a DDI. The first portion 411 may be disposed adjacent to the display 330. According to another embodiment of this disclosure, the first portion 411 may be in contact with the display 330. The first portion 411 may be disposed parallel to the display 330. The first portion 411 may have a flat surface by having a constant Z-axis value.

[0137] According to various embodiments of the present disclosure, a third portion 413 may extend from a first portion 411. The Z-value of the third portion 413, which is disposed parallel to the X-axis, may be varied. For example, as the third portion 413 (e.g., a portion disposed along the +X-axis direction) gets closer to the first PCB 341, the Z-axis value of at least a portion of the third portion 413 may decrease. In embodiments of the present disclosure, the third portion 413 may contact the first guide member 510 of the guide member 500. At least a portion of the third portion 413 may be fixedly attached to the first guide member 510. The third portion 413 may contact the first guide member 510 to be tilted. According to embodiments of the present disclosure, as a portion of the third portion 413 is disposed further along the X-axis direction, the third portion 413 may be configured to be tilted along the -Z-axis direction by contacting the first guide member 510.

[0138] According to various embodiments of this disclosure, a portion of the first portion 411 and / or a portion of the third portion 413 may contact the display 330. As the third portion 413 moves closer to the first PCB 341 (e.g., a portion positioned more along the +X axis direction), the third portion 413 may be formed to be bent along the -Z axis direction. As the third portion 413 is formed to be bent, a first stress 430 acting along the +Z axis direction may occur in the first portion 411 and / or the third portion 413. When the first portion 411 and / or the third portion 413 contacts the display 330, the first stress 430 generated in the first portion 411 and / or the third portion 413 is transferred to the display 330. For example, the first portion 411 and / or the third portion 413 may contact the reflective sheet 333 of the display 330, such that the first stress 430 can be transferred to the reflective sheet 333.

[0139] According to various embodiments of this disclosure, a first guide member 510 may be disposed adjacent to a display 330. The first guide member 510 may be formed to protrude from the display 330 toward a back panel 380, for example, along the -Z-axis direction. In embodiments of this disclosure, the first guide member 510 may contact a third portion 413. When the first guide member 510 is formed to protrude along the -Z-axis direction and contact the third portion 413, a portion of the third portion 413 may not contact the side of the battery 350. As another example, when the first guide member 510 contacts a portion of the third portion 413 and transmits force along the -Z-axis direction, a second stress 440 acting along the -Z-axis direction may occur in the third portion 413. The second stress 440 generated in the third portion 413 may be transmitted to the first portion 411 and / or the third portion 413. Therefore, the first stress 430 acting along the +Z-axis direction and the second stress 440 acting along the -Z-axis direction are canceled out, such that the magnitude of the first stress 430 from the first portion 411 and / or the third portion 413 to the display 330 can be reduced. Therefore, as the magnitude of the force transmitted to the display 330 is reduced, the deformation of the display 330 can be reduced. As the deformation of the display 330 is reduced, the display 330 can output to the screen normally.

[0140] According to another embodiment of this disclosure, the first stress 430 acting along the +Z axis and the second stress 440 acting along the -Z axis are canceled out, so that there may be no force from the first portion 411 and / or the third portion 413 to the display 330.

[0141] According to another embodiment of this disclosure, the second stress 440 acting along the -Z axis direction may be greater than the first stress 430 acting along the +Z axis direction, such that the second stress 440 can act on the first portion 411 and / or the third portion 413 of the first FPCB along the -Z axis direction.

[0142] Thus, as the initial stress 430 transmitted to the display 330 is reduced or eliminated, the display 330 does not deform. Therefore, the display 330 can output data normally.

[0143] According to various embodiments of the present disclosure, the first guide member 510 may be formed of an adhesive material, or an adhesive may be applied to the surface of the first guide member 510. Therefore, the third portion 413 may contact the adhesive material of the first guide member 510 or the adhesive applied to the first guide member 510. When the third portion 413 contacts the adhesive material or adhesive, it may be adhered or secured to the first guide member 510, and a second stress 440 acting in the -Z-axis direction may occur in the first portion 411 and / or the third portion 413. Because the second stress 440 is generated in the first portion 411 and / or the third portion 413 in the -Z-axis direction, the magnitude of the first stress 430 transmitted from the first portion 411 and / or the third portion 413 to the display 330 may be reduced. According to another embodiment of the present disclosure, the first stress 430 transmitted from the first portion 411 and / or the third portion 413 to the display 330 may not exist. According to another embodiment of the present disclosure, the second stress 440 may act in the first portion 411 and / or the third portion 413 in the -Z-axis direction. In this way, as the first stress 430 transmitted to the display 330 is reduced or eliminated, the deformation occurring in the display 330 can be reduced or relieved. Therefore, the display 330 can output the screen normally.

[0144] Figure 10a According to embodiments of this disclosure Figure 6 An enlarged cross-sectional view of part B. Figure 10b According to embodiments of this disclosure Figure 6 An enlarged perspective cross-sectional view of part B.

[0145] According to various embodiments of the present disclosure, electronic device 101 may include display 330, battery 350, backplane 380, first FPCB 410 and / or guide member 500. Figure 10a and Figure 10b The electronic device 101 shown includes a display 330, a battery 350, a backplane 380, a first FPCB 410, and a guide member 500, which can be connected to... Figures 4 to 8 , Figure 9a and Figure 9b The display 330, battery 350, backplane 380, first FPCB 410, and guide member 500 of the illustrated electronic device 101 are all or partially identical. Therefore, no description of identical components is given.

[0146] Reference Figure 10a and Figure 10b According to various embodiments of this disclosure, the guide member 500 may include a first guide member 510 and a second guide member 520. At least a portion of the first FPCB 410 may be disposed between the first guide member 510 and the second guide member 520.

[0147] According to various embodiments of the present disclosure, the first guide member 510 may include a concave recess 511. The second guide member 520 may include a protrusion 521 formed to project along the +Z axis and / or +X axis direction. In embodiments of the present disclosure, the shape of at least a portion of the recess 511 may correspond to the shape of at least a portion of the protrusion 521. The recess 511 and the protrusion 521 may be disposed adjacent to each other. For example, the protrusion 521 may press against a third portion 413 located between the recess 511 and the protrusion 521, such that at least a portion of the third portion 413 may be bent or positioned.

[0148] According to various embodiments of this disclosure, a third portion 413 may be disposed between the recess 511 and the protrusion 521. For example, the third portion 413 may be configured to pass through between the recess 511 and the protrusion 521. The third portion 413 may contact the protrusion 521 and / or the recess 511. For example, the third portion 413 may contact the protrusion 521 of the second guide member 520 at at least one point. The third portion 413 may contact the first guide member 510 at at least two points. The third portion 413 may deform by contacting the protrusion 521 and the recess 511. For example, the portion of the third portion 413 that contacts the protrusion 521 and / or the recess 511, as well as the periphery of that portion, may maintain or reduce the Z-axis value of the third portion 413. For example, a portion of the third portion 413 may be formed to be inclined or may be formed to be substantially parallel to the display 330. Therefore, a second stress 440 acting on the first portion 411 and / or the third portion 413 along the -Z-axis direction may occur. Because the second stress 440 acting along the -Z-axis direction generated on the first portion 411 and / or the third portion 413 by the protrusion 521 and the groove 511 can reduce the first stress 430 transmitted from the first portion 411 and / or the third portion 413 to the display 330. According to another embodiment of the present disclosure, the first stress 430 transmitted from the first portion 411 and / or the third portion 413 to the display 330 may not exist. According to another embodiment of the present disclosure, the second stress 440 may act along the -Z-axis direction in the first portion 411 and / or the third portion 413. Thus, as the first stress 430 transmitted from the first portion 411 and / or the third portion 413 to the display 330 is reduced or eliminated, deformation may not occur in the display 330. Therefore, the display 330 can output the screen normally.

[0149] Figure 11a According to embodiments of this disclosure Figure 6 An enlarged cross-sectional view of part B. Figure 11b According to embodiments of this disclosure Figure 6 An enlarged perspective cross-sectional view of part B.

[0150] According to various embodiments of the present disclosure, electronic device 101 may include display 330, battery 350, backplane 380, first FPCB 410 and / or guide member 500. Figure 11a and Figure 11b The electronic device 101 shown includes a display 330, a battery 350, a backplane 380, a first FPCB 410, and a guide member 500, which can be connected to... Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9a , Figure 9b , Figure 10a and Figure 10b The display 330, battery 350, backplane 380, first FPCB 410, and guide member 500 of the illustrated electronic device 101 are all or partially identical. Therefore, no description of identical components is given.

[0151] Reference Figure 11a and Figure 11b According to various embodiments of this disclosure, the guide member 500 may include a first guide member 510 and a second guide member 520. At least a portion of the first FPCB 410 may be disposed between the first guide member 510 and the second guide member 520.

[0152] The first guide member 510 may include a concave recess 511. The second guide member 520 may include a protrusion 521 formed to project from the back side to the front side, for example, along the +Z axis and / or +X axis direction. In embodiments of this disclosure, the shape of the recess 511 may correspond to the shape of the protrusion 521. The recess 511 and the protrusion 521 may be disposed adjacent to each other. In embodiments of this disclosure, the recess 511 may be formed to become more inclined along the Z axis direction as the recess 511 travels along the X axis direction. For example, the protrusion 521 may press against a third portion 413 located between the recess 511 and the protrusion 521, such that at least a portion of the third portion 413 may be bent or positioned.

[0153] According to various embodiments of this disclosure, a third portion 413 may be disposed between the recess 511 and the protrusion 521. For example, the third portion 413 may be configured to pass through the recess 511 and the protrusion 521. The third portion 413 may be deformable through the protrusion 521 and the recess 511. For example, the portion of the third portion 413 that contacts the protrusion 521 and the recess 511, as well as the periphery of that portion, may have an increased Z-axis value. For example, the third portion 413 may be formed to be further inclined in the Z-axis direction as it gets closer to the first PCB 341. Therefore, a second stress 440 acting on the third portion 413 in the -Z-axis direction may occur. Due to the second stress 440 acting in the -Z-axis direction generated on the third portion 413 through the protrusion 521 and the recess 511, the first stress 430 transmitted from the first portion 411 and / or the third portion 413 may be reduced. According to another embodiment of this disclosure, since the first stress 430 and the second stress 440 can cancel each other out, the first stress 430 transmitted from the first portion 411 and / or the third portion 413 to the display 330 may not occur. According to another embodiment of this disclosure, the resultant force of the first stress 430 and the second stress 440 acting on the first portion 411 and / or the third portion 413 can act along the -Z-axis direction. Thus, as the first stress 430 transmitted from the first portion 411 and / or the third portion 413 to the display 330 is reduced or eliminated, deformation may not occur in the display 330. Therefore, the display 330 can output the screen normally.

[0154] According to various embodiments of this disclosure, electronic devices ( Figure 4 The electronic device 101 may include: a housing ( Figure 2 Housing 310); Display ( Figure 4 The display 330 is disposed inside the housing, wherein the display is along a first direction ( Figure 9a The +Z) is set such that the screen of the display is exposed to the outside of the display; the first PCB ( Figure 5 The first PCB 341 is disposed inside the housing; FPCB ( Figure 5 The FPCB 410 is disposed inside the housing and includes a first portion adjacent to the display. Figure 9a Part 1 (411), Part 3 extending from Part 1 ( Figure 9a The third part 413), and the second part extending from the third part and electrically connected to the first PCB. Figure 9a Part 2 (412); First guide member ( Figure 4 A first guide member 510 is disposed inside the housing; and a second guide member ( Figure 9aThe second guide member 520 is disposed inside the housing. At least a portion of the third part may be configured to pass between the first guide member and the second guide member. A second direction opposite to the first direction may be generated in said at least a portion of the third part by the first guide member. Figure 9a The second stress (of -Z) acting Figure 9a -Z direction arrow 440).

[0155] According to various embodiments of this disclosure, the first guide member may be disposed adjacent to the display.

[0156] According to various embodiments of this disclosure, the housing may include a back plate ( Figure 9a (Back panel 380). The second guide member may be disposed adjacent to the back panel.

[0157] According to various embodiments of the present disclosure, the shape of at least a portion of the first guide member may correspond to the shape of at least a portion of the second guide member.

[0158] According to various embodiments of this disclosure, the third portion may contact the first guide member at at least two points, including the first point and the second point. The third portion may contact the second guide member at at least one point, including a third point disposed between the first point and the second point.

[0159] According to various embodiments of this disclosure, a force along a first direction can be provided to at least a portion of the third portion via a second guiding member.

[0160] According to various embodiments of this disclosure, the first guide member may include a recess ( Figure 10a The recess 511), and the second guide member includes a protrusion ( Figure 10b convex portion 521).

[0161] According to various embodiments of this disclosure, the shape of the recess may correspond to the shape of the convex portion.

[0162] According to various embodiments of this disclosure, at least a portion of the third part may be positioned parallel to the display.

[0163] According to various embodiments of this disclosure, from the first part to the third part, at least a portion of the third part may be configured to face the first direction.

[0164] According to various embodiments of this disclosure, a force in a second direction can be provided to a portion of the FPCB between a first portion and a third portion via a first guide member and a second guide member.

[0165] According to various embodiments of this disclosure, the direction of the resultant force acting on a portion of the FPCB between the first and third portions can be a second direction.

[0166] According to various embodiments of this disclosure, electronic devices ( Figure 4 The electronic device 101 may include: a housing ( Figure 2 Housing 310); Display ( Figure 4 The display 330 is disposed inside the housing, wherein the display is along a first direction ( Figure 9a The +Z setting exposes the screen of the display to the outside of the housing; the first PCB ( Figure 5 The first PCB 341 is disposed inside the housing; FPCB ( Figure 5 The FPCB 410 is disposed inside the housing and includes a first portion adjacent to the display. Figure 9a The first part 411), the third part extending from the first part, and the second part extending from the third part and electrically connected to the first PCB. Figure 9a Part 2 (412); First guide member ( Figure 9a A first guide member 510 is disposed inside the housing. At least a portion of the third part contacts the first guide member. A second direction opposite to the first direction is generated in at least a portion of the third part by the first guide member. Figure 9a The second stress (of -Z) acting Figure 9a -Z direction arrow 440).

[0167] According to various embodiments of this disclosure, an adhesive material may be applied to the first guide member.

[0168] According to various embodiments of this disclosure, at least a portion of the third part may be adhered to the first guide member.

[0169] According to various embodiments of this disclosure, the first guide member may be disposed adjacent to the display.

[0170] According to various embodiments of this disclosure, a force in a second direction can be provided to a portion of the FPCB between a first portion and a third portion via a first guiding member.

[0171] According to various embodiments of this disclosure, the direction of the resultant force acting on a portion of the FPCB between the first and third portions can be a second direction.

[0172] According to various embodiments of this disclosure, the first guide member may include a recess ( Figure 10a (recess 511). At least a portion of the third part may be adhered to the recess.

[0173] According to various embodiments of this disclosure, at least a portion of the third part may be adhered to the recess and may be provided with a force along the first direction.

[0174] Although this disclosure has been shown and described with reference to various embodiments thereof, it will be apparent to those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of this disclosure as defined by the appended claims and their equivalents.

Claims

1. An electronic device comprising: The housing includes a back plate forming at least a portion of the back of the electronic device; The display is housed inside the housing; The first printed circuit board (PCB) is disposed inside the housing; A flexible printed circuit board (FPCB) is disposed inside the housing and includes a first portion, a second portion, and a third portion bent between the first portion and the second portion; A first guide member is disposed inside the housing and contacts at least a portion of the third part to guide the at least a portion of the third part in a direction away from the back of the display and toward the back panel; as well as A second guide member is disposed inside the housing and contacts at least a portion of the third part to provide force in a direction from the back plate toward the back of the display. The first part is disposed below the back of the display and closer to the display than the second part, and the second part is electrically connected to the first PCB, wherein the FPCB and the first guide member are disposed between the display and the back panel. 2.The electronic device of claim 1, wherein, The first guide member is positioned adjacent to the display. 3.The electronic device of claim 1, wherein, The third part is bent away from the first part in a direction away from the display.

4. The electronic device as claimed in claim 1, in, The shape of at least a portion of the first guide member corresponds to the shape of at least a portion of the second guide member.

5. The electronic device as claimed in claim 4, wherein The third part contacts the first guide member at at least two points, including the first point and the second point, and The third part contacts the second guide member at at least one point, including a third point located between the first point and the second point.

6. The electronic device as claimed in claim 1, wherein The first guide member includes a recess, and The second guide member includes a protrusion. 7.The electronic device of claim 6, wherein, The shape of the concave portion corresponds to the shape of the convex portion. 8.The electronic device of claim 1, wherein, A portion of the third part is set parallel to the display.

9. The electronic device as claimed in claim 1, wherein, From the first part to the third part, at least a portion of the third part is configured to face the first direction in which the screen of the display faces. 10.The electronic device of claim 1, wherein, The second guide member is disposed adjacent to the back plate. 11.The electronic device of claim 1, wherein, The direction of the resultant force acting on a portion of the FPCB between the first and third portions is away from the display. 12.The electronic device of claim 1, wherein, An adhesive material is applied to the first guide member.

13. The electronic device as claimed in claim 1, wherein, At least a portion of the third part is adhered to the first guide member.

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