Cutter inverse mold pressure heating device

Abstract

The application provides a cutting inverse mold pressure heating device, which comprises a rack, the side of the rack is provided with an adjusting mechanism, the adjusting mechanism is provided with a transfer mechanism, the front end of the rack is provided with a cutting table, the cutting table is connected with a cutting machine through a driving mechanism, the rear of the cutting table is provided with a fixing table, and the fixing table is provided with an inverse mold mechanism; the wafer cutting and inverse mold processes are integrated in the same device, the area occupied by the device is effectively reduced, manual operation is reduced, the problem of wafer damage caused by manual operation is avoided, and manpower is saved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and in particular to a cutting mold pressure heating device. Background Technology

[0002] Wafer dicing and die casting are two important steps in semiconductor processing, but currently both steps are operated using separate equipment, which takes up a lot of space, and the wafers need to be handled manually during the transfer process, which can easily damage the wafers.

[0003] Therefore, there is an urgent need for a cutting and casting pressure heating device that can solve the problem that wafer cutting and casting cannot be completed on the same equipment in the existing wafer processing process. Summary of the Invention

[0004] The purpose of this invention is to provide a cutting and molding pressure heating device to solve the problem that wafer cutting and molding cannot be completed on the same equipment in the existing wafer processing.

[0005] To achieve the above objectives, the present invention provides the following solution:

[0006] The present invention provides a cutting and molding pressure heating device, including a frame, an adjustment mechanism on the side of the frame, a transfer mechanism on the adjustment mechanism, a cutting table at the front end of the frame, a cutting machine connected above the cutting table via a drive mechanism, a fixed platform behind the cutting table, and a molding mechanism above the fixed platform.

[0007] Preferably, the adjustment mechanism includes a first electric slide rail, the power end of which is connected to a robotic arm, and the end of the robotic arm is provided with the transfer mechanism.

[0008] Preferably, the transfer mechanism includes a suction cup, which is connected to a first negative pressure generator.

[0009] Preferably, a vacuum cleaner is provided on the side of the cutting table.

[0010] Preferably, the driving mechanism includes a second electric slide rail, which is disposed on both sides of the cutting table. A gantry frame is fixed to the power end of the second electric slide rail. A third electric slide rail is provided on the gantry frame. A rotating telescopic frame is fixed to the power end of the third electric slide rail. The cutting machine is provided on the rotating telescopic frame.

[0011] Preferably, the upper surface of the fixed platform is provided with adsorption holes, which are connected to the second negative pressure generator.

[0012] Preferably, the molding mechanism includes an electric telescopic rod, a pressure rod is connected to the top of the electric telescopic rod, a pressure plate is connected to the end of the pressure rod, and a semiconductor heating element is provided inside the pressure plate.

[0013] Preferably, it further includes a film-removing mechanism, which includes a fourth electric slide rail, on which an adhesive roller is rotatably mounted via a support frame.

[0014] Preferably, the support frame is provided with a height adjustment mechanism, the height adjustment mechanism includes a support rod, the support rod is slidably limited within the sleeve, the side of the support rod is provided with a limiting hole, and the side of the sleeve is provided with a limiting screw that cooperates with the limiting hole.

[0015] The present invention achieves the following beneficial technical effects compared to the prior art:

[0016] This invention provides a wafer cutting and casting pressure heating device, comprising a frame, an adjustment mechanism on the side of the frame, a transfer mechanism on the adjustment mechanism, a cutting table at the front end of the frame, a cutting machine connected above the cutting table via a drive mechanism, a fixed platform behind the cutting table, and a casting mechanism above the fixed platform. Integrating wafer cutting and casting processes into the same device effectively reduces the device's footprint and also reduces manual operation, saving manpower and avoiding wafer damage caused by human error. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic diagram of a cutting and molding pressure heating device provided by the present invention;

[0019] Figure 2 This invention provides a schematic diagram of the drive mechanism of a cutting and molding pressure heating device.

[0020] Figure 3 This is a schematic diagram of the fixed platform structure of a cutting and molding pressure heating device provided by the present invention;

[0021] Figure 4 A schematic diagram of the molding mechanism of a cutting and molding pressure heating device provided by the present invention;

[0022] Figure 5This is a schematic diagram of the film-removing mechanism of a cutting and molding pressure heating device provided by the present invention. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] The purpose of this invention is to provide a cutting mold pressure heating device to solve the problems existing in the prior art.

[0025] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0026] Example 1:

[0027] This embodiment provides a cutting mold pressure heating device, such as... Figure 1 As shown, the machine includes a frame 1, an adjustment mechanism 2 on the side of the frame 1, a transfer mechanism 3 on the adjustment mechanism 2, a cutting table 4 at the front end of the frame 1, a cutting machine 6 connected above the cutting table 4 via a drive mechanism 5, a fixed table 7 at the rear of the cutting table 4, and a molding mechanism 8 above the fixed table 7.

[0028] Specifically, such as Figure 1 As shown, the adjustment mechanism 2 includes a first electric slide rail 21, the power end of the first electric slide rail 21 is connected to a robotic arm 22, and the end of the robotic arm 22 is provided with a transfer mechanism 3. The adjustment mechanism 2 can adjust the position of the transfer mechanism 3, thereby moving the wafer to different workstations.

[0029] Furthermore, such as Figure 1 As shown, the transfer mechanism 3 includes a suction cup 31, which is connected to a first negative pressure generator 32. The first negative pressure generator 32 generates negative pressure, and the suction cup 31 can pick up the wafer to achieve transfer.

[0030] Furthermore, such as Figure 1 As shown, a vacuum cleaner 9 is provided on the side of the cutting table 4, which can remove the dust generated during the cutting process.

[0031] Furthermore, such as Figure 2As shown, the drive mechanism 5 includes a second electric slide rail 51, which is disposed on both sides of the cutting table 4. A gantry frame 52 is fixed to its power end. A third electric slide rail 53 is provided on the gantry frame 52. A rotating telescopic frame 54 is fixed to the power end of the third electric slide rail 53. A cutting machine 6 is provided on the rotating telescopic frame 54. By setting the drive mechanism, the multi-dimensional movement of the cutting machine 6 can be realized, thereby facilitating cutting.

[0032] Furthermore, such as Figure 3 As shown, the upper surface of the fixed platform 7 is provided with an adsorption hole 71, which is connected to the second negative pressure generator 72.

[0033] Furthermore, such as Figure 4 As shown, the molding mechanism 8 includes an electric telescopic rod 81, a pressure rod 82 connected to the top of the electric telescopic rod 81, a pressure plate 83 connected to the end of the pressure rod 82, and a semiconductor heating element 84 disposed inside the pressure plate 83.

[0034] Furthermore, such as Figure 5 As shown, it also includes a film peeling mechanism 10, which includes a fourth electric slide rail 101, on which an adhesive roller 103 is rotatably provided via a support frame 102.

[0035] In order to accommodate different wafers, the support frame 102 is provided with a height adjustment mechanism 104. The height adjustment mechanism 104 includes a support rod 1041, which is slidably limited within the sleeve 1042. The side of the support rod 1041 is provided with a limiting hole 1043, and the side of the sleeve 1042 is provided with a limiting screw 1044 that cooperates with the limiting hole 1043.

[0036] The present invention provides a cutting and casting pressure heating device, the method of use and working principle of which are as follows: a wafer with a first blue film is placed on a cutting table 4, and a cutting machine 6 cuts it. After cutting, an adjusting mechanism 2 drives a transfer mechanism 3 to transfer the wafer to a fixed table 7. A second blue film is placed on the fixed table 4. A casting mechanism 8 generates pressure and heats the wafer. Under the action of the casting mechanism 8 and the second negative pressure generator 72, the wafer is cast. After casting, the first blue film is loosened by heat, and a film peeling mechanism 10 peels it off. Then the second negative pressure generator 72 stops working, and the transfer mechanism 3 transfers the cast wafer to another position.

[0037] This invention has illustrated its principles and implementation methods using specific examples. The descriptions of these embodiments are merely illustrative of the method and its core ideas; furthermore, those skilled in the art will recognize that modifications may be made to the specific implementation methods and application scope based on the principles of this invention. Therefore, the content of this specification should not be construed as limiting the invention.

Claims

1. A cut-retropressing pressure heating device, characterized by: Including rack, the side of rack is equipped with adjusting mechanism, adjusting mechanism is equipped with transfer mechanism, the front end of rack is equipped with cutting table, the upper side of cutting table is connected with cutting machine through driving mechanism, the rear side of cutting table is equipped with fixed table, the upper side of fixed table is equipped with reverse mold mechanism; The adjusting mechanism includes a first electric slide rail, the power end of the first electric slide rail is connected with a mechanical arm, the end of the mechanical arm is provided with the transfer mechanism; The transfer mechanism includes a suction cup, the suction cup is connected with a first negative pressure generator; The driving mechanism includes a second electric slide rail, the second electric slide rail is arranged on both sides of the cutting table, the power end of the second electric slide rail is fixed with a gantry, the gantry is provided with a third electric slide rail, the power end of the third electric slide rail is fixed with a rotary telescopic frame, the rotary telescopic frame is provided with the cutting machine; The reverse mold mechanism includes an electric telescopic rod, the top of the electric telescopic rod is connected with a pressing rod, the end of the pressing rod is connected with a pressing plate, the pressing plate is provided with a semiconductor heating sheet; It also includes a film uncovering mechanism, the film uncovering mechanism includes a fourth electric slide rail, the fourth electric slide rail is rotatably provided with a sticky roller through a support frame; The support frame is provided with a height adjusting mechanism, the height adjusting mechanism includes a support rod, the support rod is slidably limited in a sleeve, the side of the support rod is provided with a limiting hole, the side of the sleeve is provided with a limiting screw matched with the limiting hole.

2. The cut-replica pressure heating apparatus of claim 1, wherein: The side of the cutting table is provided with a dust collector.

3. The cut-reverse-die pressure heating apparatus of claim 1, wherein: The upper surface of the fixed table is provided with an adsorption hole, the adsorption hole is connected with a second negative pressure generator.

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