A method for preventing ITO circuit damage during manual splitting of LCDs

Abstract

The present invention belongs to the technical field of liquid crystal display screens, and particularly relates to a method for preventing damage to ITO circuits during manual splitting of LCDs. First, the integrated large LCD glass is cut with a cutting pressure that allows for automatic detachment, separating it into multiple LCD single-piece glasses. Then, when cutting the ITO waste material of the LCD single-piece glass, by reducing the cutting pressure, the glass waste material does not automatically fall off and remains in a semi-cut state. Next, the LCD single-piece glass is placed vertically, and when separating, the waste material moves away from the ITO conductive wire side due to the weight of the glass itself, effectively avoiding damage and scratches to the conductive wire, greatly reducing the production of products with poor display functions, and ensuring the product quality of the LCD single-piece glass.

Description

Technical Field

[0001] The present invention belongs to the technical field of liquid crystal display screens, and particularly relates to a method for preventing ITO line damage during manual separation of LCDs. Background Art

[0002] An LCD single glass is one of the main components of the entire liquid crystal display screen. Its main function is to make an electric field reaction occur between the electrodes in the LCD display area through conduction. The liquid crystal molecules are twisted to generate an electromagnetic effect phenomenon, thereby controlling the projection and shielding of light sources. Then, by giving different voltages through the control buttons of the power supply, a light and dark phenomenon is generated, enabling the display screen to show an image effect.

[0003] An LCD single glass is mainly composed of a TFT front glass, a CF front glass, a frame adhesive, liquid crystal, etc. A mesh conductive wire is arranged inside the TFT front glass, a long-strip grid is arranged inside the CF front glass, liquid crystal is filled in the grid, and finally the TFT and CF front glasses are bonded together with the frame adhesive to complete the combination of the LCD single glass.

[0004] When manufacturing LCDs in the industry, they are all large-size integrated large boards. After manufacturing, they need to be separated into single glasses through cutting and separation to be used for processing modules such as ICs, FPCs, backlights, and covers, and finally become liquid crystal display screens. After the cutting process is completed, the separation process is required. The purpose of separation is to apply a certain pressure to the cutting line of the glass substrate to make the Median crack formed in the thickness direction of the glass after cutting extend to the bottom of the glass to achieve the purpose of separating the glass. The existing separation methods are divided into automatic equipment separation and manual separation due to different equipment. The cost of automatic equipment is relatively high, and manual separation is still commonly used, resulting in the following problems:

[0005] Since the LCD is made as an integrated large board during manufacturing, the ITO electrode area of the single LCD is covered by the CF front glass and needs to be cut open to expose the ITO electrode for subsequent assembly of the IC electrode. During manual separation, it is very easy to cause the ITO electrode to be scratched or extruded, resulting in a scratched line. The corresponding display area of the scratched line is not powered on, causing abnormal display and leading to product scrapping; or the line is not completely cut off, and when the customer uses it and repeatedly powers on, it may suddenly short circuit, causing a safety accident.

[0006] At present, the thickness of LCD glass is mainly 0.15T - 0.2T (0.3 - 0.4mm) and 0.4T - 0.5T (0.8 - 1.0mm). When splitting ITO waste materials, there are mainly two methods: the waste materials fall off naturally and the waste materials are adsorbed on the Pin end and manually split off. For products with a thickness of 0.15T - 0.2T, since the material is lighter after glass thinning, the phenomenon of ITO line scratching is not likely to occur; when operating products with a thickness of 0.4T - 0.5T, due to the relatively thick and heavy glass material, the phenomenon of ITO line scratching is more serious, the product rejection rate is high, and the potential safety hazard is large.

[0007] In order to prevent ITO line damage, a Chinese invention patent with the publication number CN112573814A discloses a process method for preventing ITO scratching during the cutting process, including the following steps: Step 1: Place the whole large piece of glass on the cutting platform and fix the large piece of glass; Step 2: Three cutting devices A, B, and C cut the A line (1), B line (2), and C line (3) of the large piece of glass in Step 1 according to a preset program, and the cutting pressure of the C cutting device is less than that of the A cutting device and the B cutting device; Step 3: Take out the glass cut in Step 2 to complete the cutting. In this patent document, only the cutting of the large piece of glass with cutting devices of different pressures along the predetermined cutting lines during the cutting process is given, and the specific cutting pressure and how to split the ITO electrode area are not described in detail. Summary of the Invention

[0008] In view of this, the purpose of the present invention is to provide a method for preventing ITO line damage during LCD manual splitting, aiming to solve the problem that the ITO electrode area is easily scratched.

[0009] To achieve the above purpose, the present invention provides the following technical solutions:

[0010] The present invention provides a method for preventing ITO line damage during LCD manual splitting, including the following steps:

[0011] Step S1: Place the LCD integrated board on the cutting platform and fix the LCD integrated board; [[ID=I8]]

[0012] Step S2: The cutting machine cuts the LCD integrated board according to a preset program. The cutting process first cuts the LCD integrated board at a cutting pressure of 0.07 - 0.08MPa for natural shedding to obtain LCD single-piece glass. Then, when cutting the ITO area waste materials of the LCD single-piece glass, the cutting pressure is reduced to 0.05 - 0.06MPa to generate cutting lines on the ITO waste materials, but they will not fall off automatically;

[0013] Step S3: The operator horizontally picks up the LCD single glass. The long side of the LCD single glass is inclined 15 - 30° towards the ITO waste side, and the short side of the LCD single glass is inclined 10 - 20° towards the ITO waste side. The bottom corner of the ITO waste is separately contacted with a flat workbench, and then a downward force is applied to the LCD single glass. The bottom corner of the ITO waste is forced to separate and fall off upwards.

[0014] The beneficial effects of the present invention are as follows:

[0015] Since the glass with a thickness of 0.4T - 0.5T (0.8 - 1.0 mm) is relatively heavy itself, when using the automatic shedding cutting method for the glass with a thickness of 0.15T - 0.2T (0.3 - 0.4 mm), the glass waste will press on the ITO conductive circuit. When picking up the waste, the conductive wire will be bruised and scratched, resulting in poor display function. The present invention first cuts the integrated large LCD glass with the cutting pressure of automatic shedding, separating it into multiple LCD single glasses. Then, when cutting the ITO waste of the LCD single glass, by reducing the cutting pressure, the glass waste does not automatically fall off and is in a semi-cut state. Then, the LCD single glass is placed vertically. When separating, the waste moves away from the ITO conductive wire side due to the weight of the glass itself, effectively avoiding bruising and scratching of the conductive wire, greatly reducing the generation of products with poor display function, and ensuring the product quality of the LCD single glass.

[0016] Other advantages, objectives and features of the present invention will be described to some extent in the subsequent specification, and to some extent, will be obvious to those skilled in the art based on the study of the following text, or can be taught from the practice of the present invention. The objectives and other advantages of the present invention can be achieved and obtained through the following specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be described in preferred detail below in conjunction with the drawings, where:

[0018] Figure 1 is a schematic diagram of separating the LCD integrated board of the present invention into LCD single glasses;

[0019] Figure 2 is a schematic diagram of the LCD single glass of the present invention placed vertically on the workbench;

[0020] Figure 3 is a schematic diagram of manually splitting the waste of the ITO area of the LCD single glass of the present invention.

[0021] Reference numerals: 1 is an LCD integrated board, 10 is an LCD single glass, 101 is a TFT surface glass, 102 is a CF surface glass, 103 is ITO waste material, and 20 is a workbench. Detailed implementation mode

[0022] The following uses specific specific examples to illustrate the implementation modes of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes. The details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the drawings provided in the following embodiments only illustrate the basic concept of the present invention in a schematic manner. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0023] Among them, the drawings are only for illustrative purposes, showing only schematic diagrams, not physical diagrams, and cannot be understood as a limitation to this patent; in order to better illustrate the embodiments of the present invention, some components in the drawings will be omitted, enlarged or reduced, which do not represent the dimensions of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted. In addition, the present invention may repeat reference numerals and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0024] As Figure 3 shown, the LCD single glass 10 of the present invention is bonded by a TFT surface glass 101 and a CF surface glass 102. Among them, the ITO electrode area is covered by the CF surface glass 102. It is necessary to first perform local cutting on the CF surface glass 102, and then separate the ITO waste material 103 by chipping to expose the ITO electrode.

[0025] Example 1

[0026] The thickness of the LCD single glass 10 is 0.4T (0.8 mm). The specific cutting process steps are as follows:

[0027] Step 1: As Figure 1 shown, the produced LCD integrated board 1 is separated into multiple LCD single glasses 10 by an automatic shedding cutting method. The specific process is to first place the LCD integrated board 1 on the cutting platform, and then use structures such as suction cups on the cutting platform to fix the LCD integrated board 1; then start the cutting machine, and the cutting machine cuts the LCD integrated board 1 according to a preset program. The cutting pressure of the cutting machine is 0.07 MPa;

[0028] Step 2: After the cutting in Step 1 is completed, the LCD integrated board 1 is automatically separated into multiple LCD single glass panels 10, and the LCD single glass panels 10 remain fixed. Then, the cutting pressure of the cutting machine is adjusted to 0.05 MPa, and the ITO area of the LCD single glass panel 10 is cut to generate cutting lines in the ITO area, but the ITO waste material 103 does not automatically fall off;

[0029] Step 3: As Figure 2 and 3 shown, loosen the fixing device on the cutting platform, and the operator horizontally picks up the LCD single glass panel 10. The long side of the LCD single glass panel 10 is inclined 15° towards the ITO waste material 103 side, and the short side of the LCD single glass panel 10 is inclined 10° towards the ITO waste material 103 side. The bottom corner of the ITO waste material 103 is brought into contact with the flat workbench 20 alone, and then a vertically downward force is applied manually to the LCD single glass panel 10, so that the bottom corner of the ITO waste material 103 is forced to separate upward. Affected by gravity and the separation angle, the ITO waste material 103 naturally falls towards the side away from the ITO circuit, achieving the effect of avoiding scratching the ITO circuit.

[0030] Example 2

[0031] The thickness of the LCD single glass panel 10 is 0.5T (1.0 mm), and the specific cutting process steps are as follows:

[0032] Step 1: As Figure 1 shown, the manufactured LCD integrated board 1 is separated into multiple LCD single glass panels 10 by an automatic - shedding cutting method. The specific process is to first place the LCD integrated board 1 on the cutting platform, and then fix the LCD integrated board 1 using structures such as suction cups on the cutting platform; then start the cutting machine, and the cutting machine cuts the LCD integrated board 1 according to a preset program, and the cutting pressure of the cutting machine is 0.08 MPa;

[0033] Step 2: After the cutting in Step 1 is completed, the LCD integrated board 1 is automatically separated into multiple LCD single glass panels 10, and the LCD single glass panels 10 remain fixed. Then, the cutting pressure of the cutting machine is adjusted to 0.06 MPa, and the ITO area of the LCD single glass panel 10 is cut to generate cutting lines in the ITO area, but the ITO waste material 103 does not automatically fall off;

[0034] Step 3: As Figure 2 and 3As shown, loosen the fixing device on the cutting platform. The operator horizontally picks up the LCD single glass 10. The long side of the LCD single glass 10 is inclined 30° towards the ITO waste 103 side, and the short side of the LCD single glass 10 is inclined 20° towards the ITO waste 103 side. The bottom corner of the ITO waste 103 is brought into contact with the flat working table 20 alone. Then, a vertically downward force is applied manually to the LCD single glass 10, so that the bottom corner of the ITO waste 103 is forced to separate upward. Affected by gravity and the separation angle, the ITO waste 103 naturally falls to the side away from the ITO circuit, achieving the effect of avoiding scratching the ITO circuit.

[0035] The present invention first uses the cutting pressure of automatic shedding to cut the integrated large LCD glass, separating it into multiple LCD single glasses 10. Then, when cutting the ITO waste 103 of the LCD single glass 10, by reducing the cutting pressure, the glass waste does not automatically fall off and is in a semi-cut state. Then, the LCD single glass 10 is placed vertically. When separating, the waste moves to the side away from the ITO conductive wire due to the weight of the glass itself, effectively avoiding pressing and scratching of the conductive wire, greatly reducing the generation of products with poor display functions, and ensuring the product quality of the LCD single glass.

[0036] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the purpose and scope of the present technical solution, and they should all be covered by the scope of the claims of the present invention.

Claims

1. A method for preventing ITO circuit damage during LCD artificial cracking, characterized in that: The method includes the following steps: Step S1: Place the LCD integrated board on the cutting platform and fix the LCD integrated board; Step S2: The cutting machine cuts the LCD integrated board according to a preset program. In the cutting process, first cut the LCD integrated board at a cutting pressure of 0.07 - 0.08 MPa for natural shedding to obtain the LCD single glass. Then, when cutting the waste material in the ITO area of the LCD single glass, reduce the cutting pressure to 0.05 - 0.06 MPa to generate a cutting line on the ITO waste material, but it will not fall off automatically; Step S3: The operator horizontally picks up the LCD single glass. The long side of the LCD single glass is inclined 15 - 30° towards the ITO waste material side, and the short side of the LCD single glass is inclined 10 - 20° towards the ITO waste material side. Make the bottom corner of the ITO waste material contact the flat workbench alone, and then apply a downward force to the LCD single glass, and the bottom corner of the ITO waste material is forced to separate and fall off upward.

2. The method for preventing ITO circuit damage in LCD artificial splitting according to claim 1, characterized in that, The thickness of the LCD single glass is greater than 0.8 mm.

3. The method for preventing ITO circuit damage during LCD artificial cracking according to claim 2, wherein: The thickness of the LCD single glass is 0.8 - 1.0 mm.

4. The method for preventing ITO circuit damage during LCD artificial cracking according to claim 1, wherein: The long side of the LCD single glass is inclined 20° towards the ITO waste material side, and the short side of the LCD single glass is inclined 15° towards the ITO waste material side.

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