A system for differential temperature control of gas pressure and transmission
By combining a heat pump device, a temperature control device, and a pressure-stabilized gas delivery device, and utilizing the heat flow effect and a pressure-stabilizing tank, precise temperature difference control and pressure regulation of the gas delivery system are achieved. This solves the problem of gas flow in the gas delivery unit in microfabrication technology and improves the system's reliability and applicability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HUAZHONG UNIV OF SCI & TECH
- Filing Date
- 2023-05-08
- Publication Date
- 2026-04-21
AI Technical Summary
How to design a heat pump to precisely control the temperature difference and pressure of the gas transport system and solve the flow problem of gas transport units in microfabrication technology.
By employing a combination of heat pump, temperature control, and pressure-stabilizing gas delivery devices, the gas achieves temperature difference control and pressure regulation between multiple parallel microchannels and larger channels through the heat flow effect. This includes temperature control of the semiconductor refrigerator and heating diaphragm, and pressure stabilization of the pressure tank, ensuring precise gas flow along different channels.
It achieves precise temperature difference control and pressure regulation of the gas transmission system, improves the reliability and applicability of gas transportation, reduces heat loss, and meets the actual needs of engineering.
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Figure CN116540794B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of gas transport technology, and more specifically, to a system for controlling gas pressure and transport based on temperature difference. Background Technology
[0002] With the rapid development of microfabrication technology, gas transport systems based on this technology have been widely used in energy, chemical, biomedical, and aerospace fields. Gas transport systems provide precise and controllable gas delivery for various applications, such as sensors, gas separation, gas chromatographs, and vacuum systems. Furthermore, gas transport systems can also be used as control engines to drive gas flow, such as in burners and fuel cells.
[0003] In gas transport systems based on microfabrication technology, the flow within the gas transport unit is typically microscale flow and micro-heat transfer, often accompanied by a heat runoff effect. The heat runoff effect is defined as the flow of rarefied gas along the tangential temperature gradient of the microchannel wall. Gas transport systems based on this effect offer advantages such as no moving parts, long service life, and high reliability. By controlling the temperature difference within the gas transport system, precise gas transport can be provided for various applications. Therefore, gas transport systems based on microfabrication technology have promising application prospects. How to design heat pumps to precisely control gas transport systems remains a pressing technical challenge. Summary of the Invention
[0004] This invention provides a system for controlling gas pressure and transmission based on temperature difference, comprising:
[0005] A heat pump device includes a heat pump body, a heat pump gas inlet pipe and a heat pump gas outlet pipe. Gas enters the heat pump body from the heat pump gas inlet pipe and then exits from the heat pump gas outlet pipe.
[0006] The temperature control device is used to cool the cold end of the heat pump body and heat the hot end of the heat pump body. When the gas flows through multiple sets of parallel microchannels in the horizontal direction, the gas flows from the cold end to the hot end along the multiple sets of parallel microchannels through the heat flow escape effect. When the gas flows through a larger channel in the horizontal direction, the gas satisfies macroscopic flow and the gas flows from the hot end to the cold end along the larger channel.
[0007] A pressure-stabilizing gas delivery device is used to regulate the pressure and flow rate of the gas flowing out of the heat pump gas outlet pipe.
[0008] Preferably, the heat pump body device is composed of multiple sets of microchannels and larger channels connected in series to form a loop-shaped channel. The gas flows from the heat pump gas inlet pipe through the microchannels and larger channels in sequence, and then flows through the microchannels into the center of the loop-shaped channel. It then flows through the microchannels and larger channels in sequence, and then flows out through the microchannels and is discharged through the heat pump gas outlet pipe.
[0009] Preferably, the microchannel is composed of multiple parallel small channels, the diameter of which is smaller than that of the larger channel.
[0010] Preferably, the temperature control device includes an adjustable DC power supply A, a semiconductor refrigerator, an adjustable DC power supply B, and a heating diaphragm;
[0011] The adjustable DC power supply A is used to provide the required power to the semiconductor refrigerator. The cold surface temperature of the semiconductor refrigerator is controlled by controlling the current or voltage of the adjustable DC power supply A. The semiconductor refrigerator is located on the left side of the heat pump body (near the inlet pipe) and is used to maintain the low temperature on the left side of the heat pump body to ensure that the gas at the left end of the heat pump body is low temperature gas.
[0012] The adjustable DC power supply B is used to provide the required power to the heating film. The temperature of the heating film's hot surface is controlled by controlling the current or voltage of the adjustable DC power supply B. The heating film is located on the right side of the heat pump body (near the outlet pipe) and is used to maintain the high temperature on the right side of the heat pump body to ensure that the gas on the right side of the heat pump body is high temperature gas.
[0013] Preferably, the temperature control device further includes a low-temperature temperature sensor and a high-temperature temperature sensor. The low-temperature temperature sensor is used for real-time monitoring of the cold end temperature of the semiconductor refrigerator to provide feedback and adjust the temperature of the semiconductor refrigerator. The high-temperature temperature sensor is used for real-time monitoring of the heating diaphragm temperature to provide feedback and adjust the temperature of the heating diaphragm.
[0014] Preferably, the pressure-stabilizing gas supply device includes a pressure-stabilizing tank, a pressure-stabilizing tank inlet non-return regulating valve, a pressure-stabilizing tank outlet non-return regulating valve, and a pressure sensor for the pressure-stabilizing tank.
[0015] In the transportation of pressurized gas, the gas discharged from the heat pump gas outlet pipe enters the pressure stabilizing tank through the inlet check valve and then flows out through the outlet check valve.
[0016] Preferably, the pressure stabilizing gas transmission device further includes a pressure sensor for the pressure stabilizing tank to monitor the pressure of the pressure stabilizing tank in real time. When the gas pressure reaches the engineering gas demand, the pressure stabilizing tank inlet check valve and pressure stabilizing tank outlet check valve are adjusted in real time to ensure the accurate transmission of pressurized gas.
[0017] Preferably, an outlet flow regulating valve is provided between the pressure tank inlet check valve and the pressure tank outlet check valve. The outlet flow regulating valve is used for the precise transport of unpressurized gas. It is in the open state when unpressurized gas transport is required, and in the closed state when precise transport of pressurized gas is required.
[0018] Preferably, the outlet pressure sensor is provided on the outlet pipe of the pressure stabilizing tank outlet check valve, and the inlet pressure sensor is provided at the front end of the heat pump gas inlet pipe. In the absence of pressurized gas transportation, it is sufficient to ensure that the values of the inlet pressure sensor and the outlet pressure sensor are equal.
[0019] Preferably, the heat pump device has an insulation layer on its outer side.
[0020] Beneficial Effects: This invention provides a system for controlling gas pressure and transmission based on temperature difference, comprising: a heat pump device, including a heat pump body, a heat pump gas inlet pipe, and a heat pump gas outlet pipe; gas enters the heat pump body through the heat pump gas inlet pipe and then exits through the heat pump gas outlet pipe; a temperature control device, used to maintain the cold end and hot end temperatures of the heat pump body; when the gas flows through multiple sets of parallel microchannels in the horizontal direction, the gas flows from the cold end to the hot end along the multiple sets of parallel microchannels through the heat flow escape effect; when the gas flows through a larger horizontal channel, the gas satisfies macroscopic flow, and the gas flows from the hot end to the cold end along the larger channel; and a pressure-stabilizing gas transmission device, used to regulate the gas pressure and flow rate out of the heat pump gas outlet pipe. Through the coordinated action of the heat pump device, temperature difference control device, and pressure-stabilizing gas transmission device with various valves, precise transmission of pressurized and unpressurized gas is achieved. Each module is detachable, and the heat pump device can be modified and replaced according to actual engineering needs, and assembled with existing modules, thereby improving the range of engineering applications. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the system for controlling gas pressure and transmission based on temperature difference according to the present invention.
[0022] Figure 2 This is a schematic diagram of the structure of a heat pump device according to the present invention.
[0023] Explanation of key figure labels:
[0024] 1-Inlet pressure sensor, 2-Mass flow meter, 3-Inlet flow regulating valve, 4-Adjustable DC power supply A, 5-Semiconductor refrigerator, 6-Low temperature sensor, 7-Heat pump device, 8-Adjustable DC power supply B, 9-Heating diaphragm, 10-High temperature sensor, 11-Outlet flow regulating valve without pressurization, 12-Pressure tank inlet check valve, 13-Pressure tank, 14-Pressure tank pressure sensor, 15-Pressure tank outlet check valve, 16-Outlet pressure sensor, 17-Insulation layer, 18-Heat pump gas inlet pipe, 19-Heat pump gas outlet pipe. Detailed Implementation
[0025] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.
[0026] refer to Figure 1 The working gas originates from the inlet gas source and enters the system for temperature difference control of gas pressure and transmission. Inlet pressure sensor 1 is used to monitor the inlet gas source pressure in real time. Mass flow meter 2 monitors the gas flow rate in real time throughout the entire working process. Inlet flow regulating valve 3 serves as the input control device for gas flow in the entire temperature difference control of gas pressure and transmission system.
[0027] refer to Figure 1 The temperature control device includes an adjustable DC power supply A4, a semiconductor refrigerator 5, a low-temperature temperature sensor 6, an adjustable DC power supply B8, a heating diaphragm 9, and a high-temperature temperature sensor 10. The adjustable DC power supply A4 powers the semiconductor refrigerator 5 and can be adjusted according to gas flow and pressurization requirements to regulate the cold-end temperature of the semiconductor refrigerator. The semiconductor refrigerator 5 is located on one side of the heat pump gas inlet pipe 18 and maintains a low temperature on the left side of the heat pump body to ensure the gas at the cold end (left side) is low-temperature gas. The heating diaphragm 9 is located on one side of the heat pump gas outlet pipe 19 and maintains a high temperature on the right side of the heat pump body to ensure the gas at the hot end (right side) is high-temperature gas. This creates a temperature difference between the left and right sides of the heat pump body, facilitating internal gas transport.
[0028] Low-temperature sensor 6 is used for real-time monitoring of the cold end temperature of the semiconductor refrigerator. Adjustable DC power supply B8 powers the heating diaphragm 9; the DC power supply can be adjusted according to gas flow and pressurization requirements to regulate the heating diaphragm temperature. High-temperature sensor 10 is used for real-time monitoring of the heating diaphragm temperature. Through the linkage of the temperature control device and monitoring equipment, real-time temperature difference adjustment can be achieved to meet the precise temperature control requirements of the system controlling gas pressure and transmission based on temperature difference.
[0029] refer to Figure 2 The heat pump device 7 includes a heat pump body, an insulation layer 17, a heat pump gas inlet pipe 18, and a heat pump gas outlet pipe 19. The heat pump body is a loop-shaped channel formed by multiple sets of parallel microchannels and larger channels connected in series.
[0030] Within the heat pump body, when gas flows through multiple sets of parallel microchannels in the horizontal direction, the gas flows from the cold end to the hot end along these microchannels through the heat escape effect (i.e., Figure 2 (The arrows a, c, e, and g indicate the flow direction); when the gas flows through a larger horizontal channel, the gas follows macroscopic flow, flowing from the hot end to the cold end along the larger channel (i.e., Figure 2(The flow directions are indicated by arrows b, d, and f in the diagram). Therefore, after the gas enters the heat pump body through the heat pump gas inlet pipe 18, it flows sequentially along the directions of arrows a, b, c, d, e, f, and g, and finally flows out through the heat pump gas outlet pipe 19. The loop-shaped structure design simplifies temperature control, and the insulation layers at the upper and lower ends of the heat pump body reduce heat loss from the heat pump device. The insulation layer 17 serves as the insulation layer.
[0031] It should be noted that increasing the number of series connections of multiple parallel microchannels can improve the pressurization performance of the heat pump unit; increasing the number of parallel connections of multiple parallel microchannels can improve the transmission performance of the heat pump unit; increasing the temperature difference can simultaneously improve both the pressurization and transmission performance of the heat pump unit. Gas enters the heat pump through the heat pump gas inlet pipe 18, flows sequentially along the flow channel under the drive of the heat flow escape effect, and finally exits the heat pump unit through the heat pump gas outlet pipe 19. For details, see [link to details]. Figure 2 The arrow points in the direction of flow.
[0032] Continue to refer to Figure 1 The pressure-stabilized gas transmission device includes a pressure-stabilizing tank inlet check valve 12, a pressure-stabilizing tank 13, a pressure-stabilizing tank pressure sensor 14, and a pressure-stabilizing tank outlet check valve 15. During the transmission of pressurized gas, the gas enters the pressure-stabilizing tank 13 through the pressure-stabilizing tank inlet check valve 12 and then flows out through the pressure-stabilizing tank outlet check valve 15. The function of the pressure-stabilizing tank is to stabilize the pressure disturbances caused by the gas flow. The pressure-stabilizing tank pressure sensor 14 is used to monitor the pressure of the pressure-stabilizing tank in real time. When the gas pressure reaches the engineering requirements, it performs real-time linkage adjustment of the pressure-stabilizing tank inlet check valve 12 and the pressure-stabilizing tank outlet check valve 15.
[0033] Continue to refer to Figure 1 An outlet flow regulating valve 11 is also provided between the pressure tank inlet check valve 12 and the pressure tank outlet check valve 15. The outlet flow regulating valve 11 is used for precise transport of unpressurized gas. When unpressurized gas transport is required, the outlet flow regulating valve 11 is in the open state, and the pressure tank inlet check valve 12 and the pressure tank outlet check valve 15 are in the closed state. When precise transport of pressurized gas is required, the outlet flow regulating valve 11 is in the closed state, and the pressure tank inlet check valve 12 and the pressure tank outlet check valve 15 are in the open state.
[0034] The outlet pressure sensor 16 monitors the final output pressure of the gas in real time. It should be noted that when there is no pressurized gas transport, the values of the inlet pressure sensor 1 and the outlet pressure sensor 16 are equal. Each monitoring value provides core feedback adjustment data for each device of the present invention to meet actual engineering needs.
[0035] The main workflow of this invention is divided into precise transportation of unpressurized gas and pressurized gas. The main workflow of precise transportation of unpressurized gas in this invention is as follows: First, close the inlet check valve 12 and outlet check valve 15 of the pressure stabilizing tank, and open the inlet flow regulating valve 3 and outlet flow regulating valve 11 to isolate the pressure stabilizing tank 13, keeping the unpressurized gas pipeline connected to the heat pump, and turn on the temperature control device. After a period of time, when the low temperature sensor 6 and the high temperature sensor 10 maintain the set temperature, the values of the inlet pressure sensor 1, mass flow meter 2, and outlet pressure sensor 16 remain stable. The data from mass flow meter 2 is the mass flow rate of the unpressurized gas under the current temperature difference.
[0036] It should be noted that if the mass flow rate of the unpressurized gas needs to be changed, the temperature difference output by the temperature control device needs to be adjusted according to the engineering requirements, and the inlet flow regulating valve 3 and the outlet flow regulating valve 11 need to be adjusted in conjunction. When the precise transport of the unpressurized gas in this invention stops, the temperature control device is stopped first, and the regulating valves on each pipeline are closed after the temperature returns to room temperature.
[0037] The main working process of the precise transport of pressurized gas according to the present invention is as follows: First, close the outlet flow regulating valve 11, and open the inlet flow regulating valve 3, the pressure stabilizing tank inlet check valve 12, and the pressure stabilizing tank outlet check valve 15 to connect the gas pipeline, heat pump device 7, and pressure stabilizing tank 13, and turn on the temperature control device. After the low temperature sensor 6 and the high temperature sensor 10 maintain the set temperature, adjust the valve openings of the inlet flow regulating valve 3, the pressure stabilizing tank inlet check valve 12, and the pressure stabilizing tank outlet check valve 15 according to the gas output pressure requirements to meet the pressure and flow requirements of the output gas.
[0038] It should be noted that if the pressure or flow rate of the output gas needs to be changed, the valve openings of the inlet flow regulating valve 3, the pressure stabilizing tank inlet check valve 12, and the pressure stabilizing tank outlet check valve 15 must be readjusted according to the output gas requirements. If a larger pressure or flow rate of the output gas is required, the temperature difference of the temperature control device can be adjusted, and the valve adjustment process can be repeated. When the precise transport of the pressurized gas in this invention stops, the temperature control device is stopped first, and the regulating valves on each pipeline are closed after the temperature returns to room temperature.
[0039] In summary, compared with existing technical solutions, the present invention has the following beneficial effects:
[0040] 1. The temperature difference control gas pressure and transmission system of the present invention are all modularly designed. Each module can be disassembled, and the heat pump device can be modified and replaced according to the actual needs of the project, and assembled with existing modules, thereby improving the range of engineering applications.
[0041] 2. The heat pump system of the present invention is a completely new design. The U-shaped structure design simplifies temperature control and solves the problem of interstage temperature control in multi-stage heat pumps. The insulation layers at the upper and lower ends of the heat pump body can reduce heat loss of the heat pump device.
[0042] 3. This invention includes a pressure-stabilizing gas delivery device. The function of the pressure-stabilizing tank is to stabilize the pressure disturbances caused by gas flow. According to engineering needs, when the gas pressure reaches the required level, the inlet and outlet check valves of the pressure-stabilizing tank can be adjusted in real time to ensure accurate delivery of pressurized gas. If accurate delivery of non-pressurized gas is required, only some of the regulating valves need to be switched.
[0043] 4. The intake air of the present invention can be a single gas or a mixture of gases. During operation, the intake air temperature may be inconsistent, but the intake air temperature cannot exceed the maximum temperature that the heating diaphragm can provide.
[0044] It should be noted that the descriptions of each embodiment in the above embodiments have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.
[0045] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.
[0046] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.
Claims
1. A system for controlling gas pressure and transmission based on temperature difference, characterized in that, include: A heat pump device includes a heat pump body, a heat pump gas inlet pipe and a heat pump gas outlet pipe. Gas enters the heat pump body from the heat pump gas inlet pipe and then exits from the heat pump gas outlet pipe. The temperature control device is used to cool the cold end of the heat pump body and heat the hot end of the heat pump body. When the gas flows through multiple sets of parallel microchannels in the horizontal direction, the gas flows from the cold end to the hot end along the multiple sets of parallel microchannels through the heat flow escape effect. When the gas flows through a larger channel in the horizontal direction, the gas satisfies macroscopic flow and the gas flows from the hot end to the cold end along the larger channel. A pressure-stabilizing gas delivery device is used to regulate the gas pressure and flow rate flowing out of the heat pump gas outlet pipe; The heat pump body device consists of multiple sets of microchannels and larger channels connected in series to form a loop-shaped channel. Gas flows from the heat pump gas inlet pipe through the microchannels and larger channels in sequence, then flows through the microchannels into the center of the loop-shaped channel, then flows through the microchannels and larger channels in sequence, then flows out through the microchannels, and is discharged through the heat pump gas outlet pipe.
2. The system for controlling gas pressure and transmission based on temperature difference according to claim 1, characterized in that, The microchannel is composed of multiple parallel small channels, the diameter of which is smaller than that of the larger channel.
3. The system for controlling gas pressure and transmission based on temperature difference according to claim 1, characterized in that, The temperature control device includes an adjustable DC power supply A, a semiconductor refrigerator, an adjustable DC power supply B, and a heating diaphragm; The adjustable DC power supply A is used to provide the required power to the semiconductor refrigerator. The cold surface temperature of the semiconductor refrigerator is controlled by controlling the current or voltage of the adjustable DC power supply A. The semiconductor refrigerator is located at the cold end of the heat pump body near the inlet pipe and is used to maintain the low temperature of the cold end of the heat pump body to ensure that the gas at the cold end of the heat pump body is a low temperature gas. The adjustable DC power supply B is used to provide the required power to the heating diaphragm. The temperature of the heating diaphragm is controlled by controlling the current or voltage of the adjustable DC power supply B. The heating diaphragm is located at the hot end of the heat pump body near the outlet pipe and is used to maintain the high temperature on the right side of the heat pump body to ensure that the gas at the hot end of the heat pump body is high temperature gas.
4. The system for controlling gas pressure and transmission based on temperature difference according to claim 3, characterized in that, The temperature control device also includes a low-temperature sensor and a high-temperature sensor. The low-temperature sensor is used for real-time monitoring of the cold end temperature of the semiconductor refrigerator to provide feedback and adjust the temperature of the semiconductor refrigerator. The high-temperature sensor is used for real-time monitoring of the heating diaphragm temperature to provide feedback and adjust the temperature of the heating diaphragm.
5. The system for controlling gas pressure and transmission based on temperature difference according to claim 1, characterized in that, The pressure-stabilizing gas transmission device includes a pressure-stabilizing tank, a pressure-stabilizing tank inlet non-return regulating valve, a pressure-stabilizing tank outlet non-return regulating valve, a pressure-stabilizing tank pressure sensor, and an outlet flow regulating valve without pressure boosting. In the pressurized gas operation mode, the non-pressurized gas outlet flow regulating valve is closed. The gas discharged from the heat pump gas outlet pipe enters the pressure stabilizing tank through the pressure stabilizing tank inlet check valve and then flows out through the pressure stabilizing tank outlet check valve. In the unpressurized gas operation mode, the gas discharged from the heat pump gas outlet pipe flows directly out through the unpressurized gas outlet flow regulating valve.
6. The system for controlling gas pressure and transmission based on temperature difference according to claim 5, characterized in that, The pressure-stabilizing gas transmission device also includes a pressure sensor for the pressure stabilizing tank to monitor the pressure of the pressure stabilizing tank in real time. When the gas pressure reaches the engineering gas demand, the pressure stabilizing tank inlet check valve and pressure stabilizing tank outlet check valve are adjusted in real time to ensure the accurate transmission of pressurized gas.
7. The system for controlling gas pressure and transmission based on temperature difference according to claim 5, characterized in that, The outlet pressure sensor is installed on the outlet pipe of the pressure stabilizing tank outlet check valve, and the inlet pressure sensor is installed at the front end of the heat pump gas inlet pipe. In the working mode without pressurized gas, it is sufficient to ensure that the values of the inlet pressure sensor and the outlet pressure sensor are equal.
8. The system for controlling gas pressure and transmission based on temperature difference according to claim 1, characterized in that, The heat pump device is provided with a heat insulation layer on the outside.
Citation Information
Patent Citations
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CN112629073A
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CN112815562A